JP7727202B2 - 半導体基板の表面処理方法、及び表面処理剤組成物 - Google Patents

半導体基板の表面処理方法、及び表面処理剤組成物

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Publication number
JP7727202B2
JP7727202B2 JP2022524512A JP2022524512A JP7727202B2 JP 7727202 B2 JP7727202 B2 JP 7727202B2 JP 2022524512 A JP2022524512 A JP 2022524512A JP 2022524512 A JP2022524512 A JP 2022524512A JP 7727202 B2 JP7727202 B2 JP 7727202B2
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JP
Japan
Prior art keywords
group
surface treatment
general formula
pattern
processing method
Prior art date
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Active
Application number
JP2022524512A
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English (en)
Japanese (ja)
Other versions
JPWO2021235476A1 (https=
Inventor
雄三 奥村
由季 福井
彩織 塩田
貴陽 照井
創一 公文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central Glass Co Ltd
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Publication of JPWO2021235476A1 publication Critical patent/JPWO2021235476A1/ja
Application granted granted Critical
Publication of JP7727202B2 publication Critical patent/JP7727202B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/08—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022524512A 2020-05-21 2021-05-19 半導体基板の表面処理方法、及び表面処理剤組成物 Active JP7727202B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020089194 2020-05-21
JP2020089201 2020-05-21
JP2020089201 2020-05-21
JP2020089194 2020-05-21
PCT/JP2021/018945 WO2021235476A1 (ja) 2020-05-21 2021-05-19 半導体基板の表面処理方法、及び表面処理剤組成物

Publications (2)

Publication Number Publication Date
JPWO2021235476A1 JPWO2021235476A1 (https=) 2021-11-25
JP7727202B2 true JP7727202B2 (ja) 2025-08-21

Family

ID=78707848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524512A Active JP7727202B2 (ja) 2020-05-21 2021-05-19 半導体基板の表面処理方法、及び表面処理剤組成物

Country Status (6)

Country Link
US (1) US20230282473A1 (https=)
EP (1) EP4155376A4 (https=)
JP (1) JP7727202B2 (https=)
KR (1) KR20230015958A (https=)
CN (1) CN115668459B (https=)
WO (1) WO2021235476A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024143097A1 (ja) * 2022-12-28 2024-07-04 セントラル硝子株式会社 基材の処理方法および基材の製造方法
JPWO2024248021A1 (https=) * 2023-05-31 2024-12-05

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010114414A (ja) 2008-06-16 2010-05-20 Toshiba Corp 半導体基板の表面処理方法
WO2013080832A1 (ja) 2011-11-29 2013-06-06 セントラル硝子株式会社 保護膜形成用薬液の調製方法
WO2013132881A1 (ja) 2012-03-06 2013-09-12 東京エレクトロン株式会社 液処理方法、液処理装置及び記憶媒体
WO2018193841A1 (ja) 2017-04-17 2018-10-25 セントラル硝子株式会社 ウェハの表面処理方法及び該方法に用いる組成物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000027277A (ko) * 1998-10-27 2000-05-15 김영환 반도체 소자의 접합 라인 캐패시턴스 측정용 에지 테스트패턴 및 그 형성 방법
US8772933B2 (en) * 2007-12-12 2014-07-08 International Business Machines Corporation Interconnect structure and method of making same
US7830010B2 (en) * 2008-04-03 2010-11-09 International Business Machines Corporation Surface treatment for selective metal cap applications
JP2013118347A (ja) * 2010-12-28 2013-06-13 Central Glass Co Ltd ウェハの洗浄方法
JP6191372B2 (ja) * 2013-10-04 2017-09-06 セントラル硝子株式会社 ウェハの洗浄方法
WO2017030073A1 (ja) * 2015-08-20 2017-02-23 セントラル硝子株式会社 ウェハの洗浄方法及び該洗浄方法に用いる薬液
JP6703256B2 (ja) * 2016-03-15 2020-06-03 セントラル硝子株式会社 撥水性保護膜形成剤、撥水性保護膜形成用薬液、及びウェハの洗浄方法
JP2017168710A (ja) * 2016-03-17 2017-09-21 セントラル硝子株式会社 ウェハの洗浄方法
JP2017174859A (ja) * 2016-03-18 2017-09-28 セントラル硝子株式会社 ウェハの洗浄方法
US10593538B2 (en) * 2017-03-24 2020-03-17 Fujifilm Electronic Materials U.S.A., Inc. Surface treatment methods and compositions therefor
US20200035494A1 (en) * 2018-07-30 2020-01-30 Fujifilm Electronic Materials U.S.A., Inc. Surface Treatment Compositions and Methods
JP6810475B2 (ja) 2018-11-29 2021-01-06 東洋システム株式会社 電池パック
JP7081463B2 (ja) 2018-11-30 2022-06-07 株式会社オートネットワーク技術研究所 電気接続箱
KR20230093311A (ko) * 2021-02-26 2023-06-27 샌트랄 글래스 컴퍼니 리미티드 표면 처리 조성물, 및 웨이퍼의 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010114414A (ja) 2008-06-16 2010-05-20 Toshiba Corp 半導体基板の表面処理方法
WO2013080832A1 (ja) 2011-11-29 2013-06-06 セントラル硝子株式会社 保護膜形成用薬液の調製方法
WO2013132881A1 (ja) 2012-03-06 2013-09-12 東京エレクトロン株式会社 液処理方法、液処理装置及び記憶媒体
WO2018193841A1 (ja) 2017-04-17 2018-10-25 セントラル硝子株式会社 ウェハの表面処理方法及び該方法に用いる組成物

Also Published As

Publication number Publication date
KR20230015958A (ko) 2023-01-31
EP4155376A1 (en) 2023-03-29
CN115668459A (zh) 2023-01-31
EP4155376A4 (en) 2024-07-24
JPWO2021235476A1 (https=) 2021-11-25
CN115668459B (zh) 2025-12-16
TW202200774A (zh) 2022-01-01
WO2021235476A1 (ja) 2021-11-25
US20230282473A1 (en) 2023-09-07

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