CN115668459B - 半导体基板的表面处理方法及表面处理剂组合物 - Google Patents

半导体基板的表面处理方法及表面处理剂组合物

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Publication number
CN115668459B
CN115668459B CN202180036504.7A CN202180036504A CN115668459B CN 115668459 B CN115668459 B CN 115668459B CN 202180036504 A CN202180036504 A CN 202180036504A CN 115668459 B CN115668459 B CN 115668459B
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CN
China
Prior art keywords
group
surface treatment
processing method
fluorine
contact angle
Prior art date
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Active
Application number
CN202180036504.7A
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English (en)
Chinese (zh)
Other versions
CN115668459A (zh
Inventor
奥村雄三
福井由季
盐田彩织
照井贵阳
公文创一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central Glass Co Ltd
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Central Glass Co Ltd
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Publication date
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Publication of CN115668459A publication Critical patent/CN115668459A/zh
Application granted granted Critical
Publication of CN115668459B publication Critical patent/CN115668459B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/08—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN202180036504.7A 2020-05-21 2021-05-19 半导体基板的表面处理方法及表面处理剂组合物 Active CN115668459B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020089194 2020-05-21
JP2020089201 2020-05-21
JP2020-089201 2020-05-21
JP2020-089194 2020-05-21
PCT/JP2021/018945 WO2021235476A1 (ja) 2020-05-21 2021-05-19 半導体基板の表面処理方法、及び表面処理剤組成物

Publications (2)

Publication Number Publication Date
CN115668459A CN115668459A (zh) 2023-01-31
CN115668459B true CN115668459B (zh) 2025-12-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180036504.7A Active CN115668459B (zh) 2020-05-21 2021-05-19 半导体基板的表面处理方法及表面处理剂组合物

Country Status (6)

Country Link
US (1) US20230282473A1 (https=)
EP (1) EP4155376A4 (https=)
JP (1) JP7727202B2 (https=)
KR (1) KR20230015958A (https=)
CN (1) CN115668459B (https=)
WO (1) WO2021235476A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024143097A1 (ja) * 2022-12-28 2024-07-04 セントラル硝子株式会社 基材の処理方法および基材の製造方法
JPWO2024248021A1 (https=) * 2023-05-31 2024-12-05

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110462525A (zh) * 2017-03-24 2019-11-15 富士胶片电子材料美国有限公司 表面处理方法及用于所述方法的组合物

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KR20000027277A (ko) * 1998-10-27 2000-05-15 김영환 반도체 소자의 접합 라인 캐패시턴스 측정용 에지 테스트패턴 및 그 형성 방법
US8772933B2 (en) * 2007-12-12 2014-07-08 International Business Machines Corporation Interconnect structure and method of making same
US7830010B2 (en) * 2008-04-03 2010-11-09 International Business Machines Corporation Surface treatment for selective metal cap applications
US7838425B2 (en) * 2008-06-16 2010-11-23 Kabushiki Kaisha Toshiba Method of treating surface of semiconductor substrate
JP2013118347A (ja) * 2010-12-28 2013-06-13 Central Glass Co Ltd ウェハの洗浄方法
JP5953721B2 (ja) * 2011-10-28 2016-07-20 セントラル硝子株式会社 保護膜形成用薬液の調製方法
US8956465B2 (en) * 2012-03-06 2015-02-17 Tokyo Electron Limited Liquid processing method, liquid processing device, and storage medium
JP6191372B2 (ja) * 2013-10-04 2017-09-06 セントラル硝子株式会社 ウェハの洗浄方法
WO2017030073A1 (ja) * 2015-08-20 2017-02-23 セントラル硝子株式会社 ウェハの洗浄方法及び該洗浄方法に用いる薬液
JP6703256B2 (ja) * 2016-03-15 2020-06-03 セントラル硝子株式会社 撥水性保護膜形成剤、撥水性保護膜形成用薬液、及びウェハの洗浄方法
JP2017168710A (ja) * 2016-03-17 2017-09-21 セントラル硝子株式会社 ウェハの洗浄方法
JP2017174859A (ja) * 2016-03-18 2017-09-28 セントラル硝子株式会社 ウェハの洗浄方法
JP6963166B2 (ja) * 2017-04-17 2021-11-05 セントラル硝子株式会社 ウェハの表面処理方法及び該方法に用いる組成物
US20200035494A1 (en) * 2018-07-30 2020-01-30 Fujifilm Electronic Materials U.S.A., Inc. Surface Treatment Compositions and Methods
JP6810475B2 (ja) 2018-11-29 2021-01-06 東洋システム株式会社 電池パック
JP7081463B2 (ja) 2018-11-30 2022-06-07 株式会社オートネットワーク技術研究所 電気接続箱
KR20230093311A (ko) * 2021-02-26 2023-06-27 샌트랄 글래스 컴퍼니 리미티드 표면 처리 조성물, 및 웨이퍼의 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110462525A (zh) * 2017-03-24 2019-11-15 富士胶片电子材料美国有限公司 表面处理方法及用于所述方法的组合物

Also Published As

Publication number Publication date
KR20230015958A (ko) 2023-01-31
EP4155376A1 (en) 2023-03-29
CN115668459A (zh) 2023-01-31
EP4155376A4 (en) 2024-07-24
JP7727202B2 (ja) 2025-08-21
JPWO2021235476A1 (https=) 2021-11-25
TW202200774A (zh) 2022-01-01
WO2021235476A1 (ja) 2021-11-25
US20230282473A1 (en) 2023-09-07

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