JP7720924B2 - 情報処理方法、情報処理装置及び記憶媒体 - Google Patents

情報処理方法、情報処理装置及び記憶媒体

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Publication number
JP7720924B2
JP7720924B2 JP2023569285A JP2023569285A JP7720924B2 JP 7720924 B2 JP7720924 B2 JP 7720924B2 JP 2023569285 A JP2023569285 A JP 2023569285A JP 2023569285 A JP2023569285 A JP 2023569285A JP 7720924 B2 JP7720924 B2 JP 7720924B2
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Japan
Prior art keywords
distribution
unevenness
wafer
information processing
specific
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JP2023569285A
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English (en)
Japanese (ja)
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JPWO2023120189A5 (https=
JPWO2023120189A1 (https=
Inventor
修児 岩永
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of JPWO2023120189A1 publication Critical patent/JPWO2023120189A1/ja
Publication of JPWO2023120189A5 publication Critical patent/JPWO2023120189A5/ja
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/40—Image enhancement or restoration using histogram techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/60—Extraction of image or video features relating to illumination properties, e.g. using a reflectance or lighting model
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Quality & Reliability (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Software Systems (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2023569285A 2021-12-21 2022-12-07 情報処理方法、情報処理装置及び記憶媒体 Active JP7720924B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021206997 2021-12-21
JP2021206997 2021-12-21
PCT/JP2022/045083 WO2023120189A1 (ja) 2021-12-21 2022-12-07 情報処理方法、情報処理装置及び記憶媒体

Publications (3)

Publication Number Publication Date
JPWO2023120189A1 JPWO2023120189A1 (https=) 2023-06-29
JPWO2023120189A5 JPWO2023120189A5 (https=) 2024-08-23
JP7720924B2 true JP7720924B2 (ja) 2025-08-08

Family

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JP2023569285A Active JP7720924B2 (ja) 2021-12-21 2022-12-07 情報処理方法、情報処理装置及び記憶媒体

Country Status (5)

Country Link
US (1) US20250045906A1 (https=)
JP (1) JP7720924B2 (https=)
KR (1) KR20240125648A (https=)
CN (1) CN118382918A (https=)
WO (1) WO2023120189A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012194059A (ja) 2011-03-16 2012-10-11 Tokyo Electron Ltd 画像作成方法、基板検査方法、その画像作成方法又はその基板検査方法を実行させるためのプログラムを記録した記録媒体及び基板検査装置
WO2019244696A1 (ja) 2018-06-21 2019-12-26 東京エレクトロン株式会社 基板の欠陥検査方法、記憶媒体及び基板の欠陥検査装置
WO2020246366A1 (ja) 2019-06-06 2020-12-10 東京エレクトロン株式会社 基板検査装置、基板検査システム及び基板検査方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100909733B1 (ko) * 2002-01-28 2009-07-29 니치아 카가쿠 고교 가부시키가이샤 지지기판을 갖는 질화물 반도체소자 및 그 제조방법
JP4538845B2 (ja) * 2004-04-21 2010-09-08 富士ゼロックス株式会社 故障診断方法および故障診断装置、画像形成装置、並びにプログラムおよび記憶媒体
CN102449163A (zh) * 2009-04-03 2012-05-09 加利福尼亚大学董事会 分选细胞和其它生物微粒的方法和装置
JP6002112B2 (ja) 2013-11-07 2016-10-05 東京エレクトロン株式会社 基板の欠陥分析装置、基板処理システム、基板の欠陥分析方法、プログラム及びコンピュータ記憶媒体
WO2023277219A1 (ko) * 2021-06-30 2023-01-05 한국전자기술연구원 환경 변화 적응형 특징 생성기를 적용한 차량용 경량 딥러닝 처리 장치 및 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012194059A (ja) 2011-03-16 2012-10-11 Tokyo Electron Ltd 画像作成方法、基板検査方法、その画像作成方法又はその基板検査方法を実行させるためのプログラムを記録した記録媒体及び基板検査装置
WO2019244696A1 (ja) 2018-06-21 2019-12-26 東京エレクトロン株式会社 基板の欠陥検査方法、記憶媒体及び基板の欠陥検査装置
WO2020246366A1 (ja) 2019-06-06 2020-12-10 東京エレクトロン株式会社 基板検査装置、基板検査システム及び基板検査方法

Also Published As

Publication number Publication date
CN118382918A (zh) 2024-07-23
KR20240125648A (ko) 2024-08-19
US20250045906A1 (en) 2025-02-06
WO2023120189A1 (ja) 2023-06-29
TW202345210A (zh) 2023-11-16
JPWO2023120189A1 (https=) 2023-06-29

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