KR20240125648A - 정보 처리 방법, 정보 처리 장치 및 기억 매체 - Google Patents

정보 처리 방법, 정보 처리 장치 및 기억 매체 Download PDF

Info

Publication number
KR20240125648A
KR20240125648A KR1020247024477A KR20247024477A KR20240125648A KR 20240125648 A KR20240125648 A KR 20240125648A KR 1020247024477 A KR1020247024477 A KR 1020247024477A KR 20247024477 A KR20247024477 A KR 20247024477A KR 20240125648 A KR20240125648 A KR 20240125648A
Authority
KR
South Korea
Prior art keywords
uniform distribution
wafer
information processing
specific non
luminance value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247024477A
Other languages
English (en)
Korean (ko)
Inventor
슈지 이와나가
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20240125648A publication Critical patent/KR20240125648A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/40—Image enhancement or restoration using histogram techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/60—Extraction of image or video features relating to illumination properties, e.g. using a reflectance or lighting model
    • H01L22/12—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Quality & Reliability (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Software Systems (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020247024477A 2021-12-21 2022-12-07 정보 처리 방법, 정보 처리 장치 및 기억 매체 Pending KR20240125648A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021206997 2021-12-21
JPJP-P-2021-206997 2021-12-21
PCT/JP2022/045083 WO2023120189A1 (ja) 2021-12-21 2022-12-07 情報処理方法、情報処理装置及び記憶媒体

Publications (1)

Publication Number Publication Date
KR20240125648A true KR20240125648A (ko) 2024-08-19

Family

ID=86902276

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247024477A Pending KR20240125648A (ko) 2021-12-21 2022-12-07 정보 처리 방법, 정보 처리 장치 및 기억 매체

Country Status (5)

Country Link
US (1) US20250045906A1 (https=)
JP (1) JP7720924B2 (https=)
KR (1) KR20240125648A (https=)
CN (1) CN118382918A (https=)
WO (1) WO2023120189A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015090964A (ja) 2013-11-07 2015-05-11 東京エレクトロン株式会社 基板の欠陥分析装置、基板処理システム、基板の欠陥分析方法、プログラム及びコンピュータ記憶媒体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100909733B1 (ko) * 2002-01-28 2009-07-29 니치아 카가쿠 고교 가부시키가이샤 지지기판을 갖는 질화물 반도체소자 및 그 제조방법
JP4538845B2 (ja) * 2004-04-21 2010-09-08 富士ゼロックス株式会社 故障診断方法および故障診断装置、画像形成装置、並びにプログラムおよび記憶媒体
CN102449163A (zh) * 2009-04-03 2012-05-09 加利福尼亚大学董事会 分选细胞和其它生物微粒的方法和装置
JP5409677B2 (ja) * 2011-03-16 2014-02-05 東京エレクトロン株式会社 画像作成方法、基板検査方法、その画像作成方法又はその基板検査方法を実行させるためのプログラムを記録した記録媒体及び基板検査装置
KR102854094B1 (ko) * 2018-06-21 2025-09-03 도쿄엘렉트론가부시키가이샤 기판의 결함 검사 방법, 기억 매체 및 기판의 결함 검사 장치
TWI845690B (zh) * 2019-06-06 2024-06-21 日商東京威力科創股份有限公司 基板檢查裝置、基板檢查系統、基板檢查方法及電腦程式產品
WO2023277219A1 (ko) * 2021-06-30 2023-01-05 한국전자기술연구원 환경 변화 적응형 특징 생성기를 적용한 차량용 경량 딥러닝 처리 장치 및 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015090964A (ja) 2013-11-07 2015-05-11 東京エレクトロン株式会社 基板の欠陥分析装置、基板処理システム、基板の欠陥分析方法、プログラム及びコンピュータ記憶媒体

Also Published As

Publication number Publication date
CN118382918A (zh) 2024-07-23
US20250045906A1 (en) 2025-02-06
JP7720924B2 (ja) 2025-08-08
WO2023120189A1 (ja) 2023-06-29
TW202345210A (zh) 2023-11-16
JPWO2023120189A1 (https=) 2023-06-29

Similar Documents

Publication Publication Date Title
KR102562020B1 (ko) 기판의 검사 방법, 기판 처리 시스템 및 컴퓨터 기억 매체
US20230197480A1 (en) Substrate inspection apparatus, substrate processing apparatus, substrate inspection method, and computer-readable recording medium
US20250045903A1 (en) Substrate inspection device, substrate inspection system, and substrate inspection method
CN112635346B (zh) 晶圆检测方法、半导体检测设备及存储介质
KR102766828B1 (ko) 기판 검사 방법 및 기판 검사 장치
US9146479B2 (en) Substrate reference image creation method, substrate defect inspection method, substrate reference image creation apparatus, substrate defect inspection unit and non-transitory computer storage medium
CN113888510A (zh) 检测方法、检测装置、检测设备及计算机可读存储介质
CN111009460B (zh) 基板处理装置和检查方法
US20140152807A1 (en) Substrate defect inspection method, substrate defect inspection apparatus and non-transitory computer-readable storage medium
JP4914854B2 (ja) 欠陥検査方法、プログラム及びコンピュータ記憶媒体
KR102749664B1 (ko) 기판 처리 장치 및 검사 방법
CN114695156B (zh) 晶圆检查方法
KR20240125648A (ko) 정보 처리 방법, 정보 처리 장치 및 기억 매체
JP3808320B2 (ja) パターン検査装置およびパターン検査方法
US12148147B2 (en) Substrate inspection device, substrate inspection method, and storage medium
JP2009014409A (ja) 基板の欠陥検査方法及び欠陥検査プログラム

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000