JP7710350B2 - インプリント方法、インプリント装置、および物品の製造方法 - Google Patents

インプリント方法、インプリント装置、および物品の製造方法

Info

Publication number
JP7710350B2
JP7710350B2 JP2021158395A JP2021158395A JP7710350B2 JP 7710350 B2 JP7710350 B2 JP 7710350B2 JP 2021158395 A JP2021158395 A JP 2021158395A JP 2021158395 A JP2021158395 A JP 2021158395A JP 7710350 B2 JP7710350 B2 JP 7710350B2
Authority
JP
Japan
Prior art keywords
substrate
holding
plate
mold
substrate stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021158395A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023048850A (ja
JP2023048850A5 (https=
Inventor
直亮 西邑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021158395A priority Critical patent/JP7710350B2/ja
Priority to US17/949,296 priority patent/US12292681B2/en
Priority to KR1020220121319A priority patent/KR102880604B1/ko
Publication of JP2023048850A publication Critical patent/JP2023048850A/ja
Publication of JP2023048850A5 publication Critical patent/JP2023048850A5/ja
Application granted granted Critical
Publication of JP7710350B2 publication Critical patent/JP7710350B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2021158395A 2021-09-28 2021-09-28 インプリント方法、インプリント装置、および物品の製造方法 Active JP7710350B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021158395A JP7710350B2 (ja) 2021-09-28 2021-09-28 インプリント方法、インプリント装置、および物品の製造方法
US17/949,296 US12292681B2 (en) 2021-09-28 2022-09-21 Imprint method, imprint apparatus, and method of manufacturing article
KR1020220121319A KR102880604B1 (ko) 2021-09-28 2022-09-26 임프린트 방법, 임프린트 장치, 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021158395A JP7710350B2 (ja) 2021-09-28 2021-09-28 インプリント方法、インプリント装置、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2023048850A JP2023048850A (ja) 2023-04-07
JP2023048850A5 JP2023048850A5 (https=) 2024-09-26
JP7710350B2 true JP7710350B2 (ja) 2025-07-18

Family

ID=85718246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021158395A Active JP7710350B2 (ja) 2021-09-28 2021-09-28 インプリント方法、インプリント装置、および物品の製造方法

Country Status (3)

Country Link
US (1) US12292681B2 (https=)
JP (1) JP7710350B2 (https=)
KR (1) KR102880604B1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008529826A (ja) 2005-01-31 2008-08-07 モレキュラー・インプリンツ・インコーポレーテッド ナノ加工のためのチャッキング・システム
JP2011097043A (ja) 2009-09-30 2011-05-12 Kyocera Corp 吸着用部材およびこれを用いた吸着装置、並びに光照射装置および荷電粒子線装置
JP2020202269A (ja) 2019-06-07 2020-12-17 キヤノン株式会社 成形装置、および物品製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006083519A2 (en) 2005-01-31 2006-08-10 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
JP3958344B2 (ja) * 2005-06-07 2007-08-15 キヤノン株式会社 インプリント装置、インプリント方法及びチップの製造方法
KR20090004910A (ko) 2006-04-03 2009-01-12 몰레큘러 임프린츠 인코퍼레이티드 유체 챔버의 어레이를 포함하는 처킹 시스템
EP2210732B1 (en) * 2007-09-28 2020-01-22 Toray Industries, Inc. Method and device for manufacturing sheet having fine shape transferred thereon
JP2010067796A (ja) * 2008-09-11 2010-03-25 Canon Inc インプリント装置
JP5824379B2 (ja) * 2012-02-07 2015-11-25 キヤノン株式会社 インプリント装置、インプリント方法、及び物品の製造方法
EP3640975B1 (de) 2017-09-21 2024-11-20 EV Group E. Thallner GmbH Vorrichtung und verfahren zum bonden von substraten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008529826A (ja) 2005-01-31 2008-08-07 モレキュラー・インプリンツ・インコーポレーテッド ナノ加工のためのチャッキング・システム
JP2011097043A (ja) 2009-09-30 2011-05-12 Kyocera Corp 吸着用部材およびこれを用いた吸着装置、並びに光照射装置および荷電粒子線装置
JP2020202269A (ja) 2019-06-07 2020-12-17 キヤノン株式会社 成形装置、および物品製造方法

Also Published As

Publication number Publication date
KR20230045567A (ko) 2023-04-04
KR102880604B1 (ko) 2025-11-05
JP2023048850A (ja) 2023-04-07
US12292681B2 (en) 2025-05-06
US20230097588A1 (en) 2023-03-30

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