KR102880604B1 - 임프린트 방법, 임프린트 장치, 및 물품 제조 방법 - Google Patents

임프린트 방법, 임프린트 장치, 및 물품 제조 방법

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Publication number
KR102880604B1
KR102880604B1 KR1020220121319A KR20220121319A KR102880604B1 KR 102880604 B1 KR102880604 B1 KR 102880604B1 KR 1020220121319 A KR1020220121319 A KR 1020220121319A KR 20220121319 A KR20220121319 A KR 20220121319A KR 102880604 B1 KR102880604 B1 KR 102880604B1
Authority
KR
South Korea
Prior art keywords
substrate
plate
holding
support
imprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020220121319A
Other languages
English (en)
Korean (ko)
Other versions
KR20230045567A (ko
Inventor
나오스케 니시무라
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20230045567A publication Critical patent/KR20230045567A/ko
Application granted granted Critical
Publication of KR102880604B1 publication Critical patent/KR102880604B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • H01L21/6838—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020220121319A 2021-09-28 2022-09-26 임프린트 방법, 임프린트 장치, 및 물품 제조 방법 Active KR102880604B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-158395 2021-09-28
JP2021158395A JP7710350B2 (ja) 2021-09-28 2021-09-28 インプリント方法、インプリント装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
KR20230045567A KR20230045567A (ko) 2023-04-04
KR102880604B1 true KR102880604B1 (ko) 2025-11-05

Family

ID=85718246

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220121319A Active KR102880604B1 (ko) 2021-09-28 2022-09-26 임프린트 방법, 임프린트 장치, 및 물품 제조 방법

Country Status (3)

Country Link
US (1) US12292681B2 (https=)
JP (1) JP7710350B2 (https=)
KR (1) KR102880604B1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080042320A1 (en) 2005-06-07 2008-02-21 Canon Kabushiki Kaisha Processing apparatus, processing method, and process for producing chip
JP2008537513A (ja) 2005-01-31 2008-09-18 モレキュラー・インプリンツ・インコーポレーテッド 基板上に配置された固化層からモールドを分離させる方法
JP2010067796A (ja) 2008-09-11 2010-03-25 Canon Inc インプリント装置
US20200168580A1 (en) 2017-09-21 2020-05-28 Ev Group E. Thallner Gmbh Apparatus and method for bonding substrates

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006083519A2 (en) 2005-01-31 2006-08-10 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
KR20090004910A (ko) 2006-04-03 2009-01-12 몰레큘러 임프린츠 인코퍼레이티드 유체 챔버의 어레이를 포함하는 처킹 시스템
EP2210732B1 (en) * 2007-09-28 2020-01-22 Toray Industries, Inc. Method and device for manufacturing sheet having fine shape transferred thereon
JP5606254B2 (ja) * 2009-09-30 2014-10-15 京セラ株式会社 吸着用部材およびこれを用いた吸着装置、並びに光照射装置および荷電粒子線装置
JP5824379B2 (ja) * 2012-02-07 2015-11-25 キヤノン株式会社 インプリント装置、インプリント方法、及び物品の製造方法
JP7284639B2 (ja) * 2019-06-07 2023-05-31 キヤノン株式会社 成形装置、および物品製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008537513A (ja) 2005-01-31 2008-09-18 モレキュラー・インプリンツ・インコーポレーテッド 基板上に配置された固化層からモールドを分離させる方法
US20080042320A1 (en) 2005-06-07 2008-02-21 Canon Kabushiki Kaisha Processing apparatus, processing method, and process for producing chip
JP2010067796A (ja) 2008-09-11 2010-03-25 Canon Inc インプリント装置
US20200168580A1 (en) 2017-09-21 2020-05-28 Ev Group E. Thallner Gmbh Apparatus and method for bonding substrates

Also Published As

Publication number Publication date
JP7710350B2 (ja) 2025-07-18
KR20230045567A (ko) 2023-04-04
JP2023048850A (ja) 2023-04-07
US12292681B2 (en) 2025-05-06
US20230097588A1 (en) 2023-03-30

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