JP7703397B2 - インプリント装置、物品の製造方法、及びコンピュータプログラム - Google Patents

インプリント装置、物品の製造方法、及びコンピュータプログラム Download PDF

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Publication number
JP7703397B2
JP7703397B2 JP2021137299A JP2021137299A JP7703397B2 JP 7703397 B2 JP7703397 B2 JP 7703397B2 JP 2021137299 A JP2021137299 A JP 2021137299A JP 2021137299 A JP2021137299 A JP 2021137299A JP 7703397 B2 JP7703397 B2 JP 7703397B2
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Japan
Prior art keywords
mold
actuator
displacement
pressure
holding member
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JP2021137299A
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Japanese (ja)
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JP2023031670A (ja
JP2023031670A5 (enExample
Inventor
弘稔 鳥居
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021137299A priority Critical patent/JP7703397B2/ja
Priority to US17/877,283 priority patent/US12449727B2/en
Priority to KR1020220104836A priority patent/KR20230030537A/ko
Publication of JP2023031670A publication Critical patent/JP2023031670A/ja
Publication of JP2023031670A5 publication Critical patent/JP2023031670A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2021137299A 2021-08-25 2021-08-25 インプリント装置、物品の製造方法、及びコンピュータプログラム Active JP7703397B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021137299A JP7703397B2 (ja) 2021-08-25 2021-08-25 インプリント装置、物品の製造方法、及びコンピュータプログラム
US17/877,283 US12449727B2 (en) 2021-08-25 2022-07-29 Imprint apparatus, manufacturing method for article, and computer program
KR1020220104836A KR20230030537A (ko) 2021-08-25 2022-08-22 임프린트 장치, 물품의 제조 방법, 및 컴퓨터 프로그램

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021137299A JP7703397B2 (ja) 2021-08-25 2021-08-25 インプリント装置、物品の製造方法、及びコンピュータプログラム

Publications (3)

Publication Number Publication Date
JP2023031670A JP2023031670A (ja) 2023-03-09
JP2023031670A5 JP2023031670A5 (enExample) 2024-09-02
JP7703397B2 true JP7703397B2 (ja) 2025-07-07

Family

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Family Applications (1)

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JP2021137299A Active JP7703397B2 (ja) 2021-08-25 2021-08-25 インプリント装置、物品の製造方法、及びコンピュータプログラム

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US (1) US12449727B2 (enExample)
JP (1) JP7703397B2 (enExample)
KR (1) KR20230030537A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7712832B2 (ja) * 2021-09-21 2025-07-24 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019079875A (ja) 2017-10-23 2019-05-23 キヤノン株式会社 リソグラフィ装置、および物品の製造方法
JP2020145277A (ja) 2019-03-05 2020-09-10 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08332646A (ja) * 1995-06-06 1996-12-17 Meiki Co Ltd 真空積層装置および真空積層方法
US20050270516A1 (en) * 2004-06-03 2005-12-08 Molecular Imprints, Inc. System for magnification and distortion correction during nano-scale manufacturing
US8025829B2 (en) * 2006-11-28 2011-09-27 Nanonex Corporation Die imprint by double side force-balanced press for step-and-repeat imprint lithography
US8043085B2 (en) * 2008-08-19 2011-10-25 Asml Netherlands B.V. Imprint lithography
JP6304934B2 (ja) * 2012-05-08 2018-04-04 キヤノン株式会社 インプリント装置および物品の製造方法
WO2014127309A1 (en) * 2013-02-15 2014-08-21 Tufts University Silk-based nanoimprinting

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019079875A (ja) 2017-10-23 2019-05-23 キヤノン株式会社 リソグラフィ装置、および物品の製造方法
JP2020145277A (ja) 2019-03-05 2020-09-10 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法

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Publication number Publication date
JP2023031670A (ja) 2023-03-09
US12449727B2 (en) 2025-10-21
US20230066484A1 (en) 2023-03-02
KR20230030537A (ko) 2023-03-06

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