JP7685163B2 - 共振子及び共振装置 - Google Patents

共振子及び共振装置 Download PDF

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Publication number
JP7685163B2
JP7685163B2 JP2023566084A JP2023566084A JP7685163B2 JP 7685163 B2 JP7685163 B2 JP 7685163B2 JP 2023566084 A JP2023566084 A JP 2023566084A JP 2023566084 A JP2023566084 A JP 2023566084A JP 7685163 B2 JP7685163 B2 JP 7685163B2
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Japan
Prior art keywords
vibration
substrate
thickness
support
resonator
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JP2023566084A
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English (en)
Japanese (ja)
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JPWO2023105845A5 (https=
JPWO2023105845A1 (https=
Inventor
敬之 樋口
政和 福光
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02086Means for compensation or elimination of undesirable effects
    • H03H9/02102Means for compensation or elimination of undesirable effects of temperature influence
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02244Details of microelectro-mechanical resonators
    • H03H9/02433Means for compensation or elimination of undesired effects
    • H03H9/02448Means for compensation or elimination of undesired effects of temperature influence
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1057Mounting in enclosures for microelectro-mechanical devices
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H2009/155Constructional features of resonators consisting of piezoelectric or electrostrictive material using MEMS techniques

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2023566084A 2021-12-06 2022-07-28 共振子及び共振装置 Active JP7685163B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021197531 2021-12-06
JP2021197531 2021-12-06
PCT/JP2022/029124 WO2023105845A1 (ja) 2021-12-06 2022-07-28 共振子及び共振装置

Publications (3)

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JPWO2023105845A1 JPWO2023105845A1 (https=) 2023-06-15
JPWO2023105845A5 JPWO2023105845A5 (https=) 2024-08-01
JP7685163B2 true JP7685163B2 (ja) 2025-05-29

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ID=86730070

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JP2023566084A Active JP7685163B2 (ja) 2021-12-06 2022-07-28 共振子及び共振装置

Country Status (4)

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US (1) US20240305266A1 (https=)
JP (1) JP7685163B2 (https=)
CN (1) CN118451653A (https=)
WO (1) WO2023105845A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016063863A1 (ja) 2014-10-22 2016-04-28 株式会社村田製作所 共振子及び共振装置
WO2019008830A1 (ja) 2017-07-05 2019-01-10 株式会社村田製作所 共振子及び共振装置
WO2020213210A1 (ja) 2019-04-19 2020-10-22 株式会社村田製作所 共振子及び共振装置
JP2021513774A (ja) 2018-02-08 2021-05-27 キョーセラ ティキティン オーユーKyocera Tikitin Oy Mems共振器の構成

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016063863A1 (ja) 2014-10-22 2016-04-28 株式会社村田製作所 共振子及び共振装置
WO2019008830A1 (ja) 2017-07-05 2019-01-10 株式会社村田製作所 共振子及び共振装置
JP2021513774A (ja) 2018-02-08 2021-05-27 キョーセラ ティキティン オーユーKyocera Tikitin Oy Mems共振器の構成
WO2020213210A1 (ja) 2019-04-19 2020-10-22 株式会社村田製作所 共振子及び共振装置

Also Published As

Publication number Publication date
US20240305266A1 (en) 2024-09-12
JPWO2023105845A1 (https=) 2023-06-15
WO2023105845A1 (ja) 2023-06-15
CN118451653A (zh) 2024-08-06

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