JP7676106B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP7676106B2
JP7676106B2 JP2019167177A JP2019167177A JP7676106B2 JP 7676106 B2 JP7676106 B2 JP 7676106B2 JP 2019167177 A JP2019167177 A JP 2019167177A JP 2019167177 A JP2019167177 A JP 2019167177A JP 7676106 B2 JP7676106 B2 JP 7676106B2
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JP
Japan
Prior art keywords
mass
resin composition
resin
component
sheet according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019167177A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021042340A (ja
Inventor
一彦 鶴井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2019167177A priority Critical patent/JP7676106B2/ja
Priority to TW109129978A priority patent/TWI867037B/zh
Priority to CN202010946752.2A priority patent/CN112500702B/zh
Priority to KR1020200115844A priority patent/KR20210031837A/ko
Publication of JP2021042340A publication Critical patent/JP2021042340A/ja
Priority to JP2023130381A priority patent/JP2023138760A/ja
Application granted granted Critical
Publication of JP7676106B2 publication Critical patent/JP7676106B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2019167177A 2019-09-13 2019-09-13 樹脂組成物 Active JP7676106B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019167177A JP7676106B2 (ja) 2019-09-13 2019-09-13 樹脂組成物
TW109129978A TWI867037B (zh) 2019-09-13 2020-09-02 樹脂組成物
CN202010946752.2A CN112500702B (zh) 2019-09-13 2020-09-10 树脂组合物
KR1020200115844A KR20210031837A (ko) 2019-09-13 2020-09-10 수지 조성물
JP2023130381A JP2023138760A (ja) 2019-09-13 2023-08-09 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019167177A JP7676106B2 (ja) 2019-09-13 2019-09-13 樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023130381A Division JP2023138760A (ja) 2019-09-13 2023-08-09 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2021042340A JP2021042340A (ja) 2021-03-18
JP7676106B2 true JP7676106B2 (ja) 2025-05-14

Family

ID=74861527

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019167177A Active JP7676106B2 (ja) 2019-09-13 2019-09-13 樹脂組成物
JP2023130381A Pending JP2023138760A (ja) 2019-09-13 2023-08-09 樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023130381A Pending JP2023138760A (ja) 2019-09-13 2023-08-09 樹脂組成物

Country Status (4)

Country Link
JP (2) JP7676106B2 (enExample)
KR (1) KR20210031837A (enExample)
CN (1) CN112500702B (enExample)
TW (1) TWI867037B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023000843A (ja) * 2021-06-18 2023-01-04 パナソニックＩｐマネジメント株式会社 アクリル樹脂組成物、及び成形体
JP7196275B1 (ja) * 2021-12-27 2022-12-26 東洋インキＳｃホールディングス株式会社 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器
CN115637013B (zh) * 2022-10-31 2024-04-30 深圳伊帕思新材料科技有限公司 双马来酰亚胺组合物、半固化胶片以及铜箔基板
CN115975569A (zh) * 2023-02-23 2023-04-18 深圳市汉思新材料科技有限公司 系统级封装用封装胶及其制备方法
CN116867174B (zh) * 2023-07-06 2024-11-12 宁波科浩达电子有限公司 一种pcb印制线路板的制作方法及pcb印制线路板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015118363A (ja) 2013-11-15 2015-06-25 Jsr株式会社 液晶配向膜の製造方法、液晶表示素子用基板及びその製造方法、並びに液晶表示素子
WO2020176898A1 (en) 2019-02-28 2020-09-03 Juul Labs, Inc. Wireless device pairing

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01215818A (ja) * 1988-02-23 1989-08-29 Hitachi Chem Co Ltd 耐熱性樹脂組成物
JPH03103424A (ja) * 1989-09-18 1991-04-30 Fujitsu Ltd マレイミド樹脂組成物
JP3645604B2 (ja) * 1995-02-16 2005-05-11 住友ベークライト株式会社 樹脂組成物
JP4028672B2 (ja) * 1999-07-15 2007-12-26 荒川化学工業株式会社 反応生成物の製造方法
CN104619498B (zh) * 2012-08-16 2016-08-24 三菱瓦斯化学株式会社 树脂片、带树脂层的支承体、层叠板和覆金属箔层叠板
JP6123243B2 (ja) 2012-11-12 2017-05-10 味の素株式会社 絶縁樹脂材料
US10815349B2 (en) * 2015-07-06 2020-10-27 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
KR102287542B1 (ko) * 2016-08-08 2021-08-11 도레이 카부시키가이샤 수지 조성물, 그것을 사용한 시트, 적층체, 파워 반도체 장치, 플라스마 처리 장치 및 반도체의 제조 방법
JP6217832B2 (ja) * 2016-11-21 2017-10-25 味の素株式会社 樹脂組成物
TWI773745B (zh) * 2017-04-24 2022-08-11 日商味之素股份有限公司 樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015118363A (ja) 2013-11-15 2015-06-25 Jsr株式会社 液晶配向膜の製造方法、液晶表示素子用基板及びその製造方法、並びに液晶表示素子
WO2020176898A1 (en) 2019-02-28 2020-09-03 Juul Labs, Inc. Wireless device pairing

Also Published As

Publication number Publication date
CN112500702B (zh) 2025-03-04
JP2023138760A (ja) 2023-10-02
JP2021042340A (ja) 2021-03-18
TW202116912A (zh) 2021-05-01
KR20210031837A (ko) 2021-03-23
CN112500702A (zh) 2021-03-16
TWI867037B (zh) 2024-12-21

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