CN112500702B - 树脂组合物 - Google Patents

树脂组合物 Download PDF

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Publication number
CN112500702B
CN112500702B CN202010946752.2A CN202010946752A CN112500702B CN 112500702 B CN112500702 B CN 112500702B CN 202010946752 A CN202010946752 A CN 202010946752A CN 112500702 B CN112500702 B CN 112500702B
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China
Prior art keywords
resin composition
mass
component
composition according
less
Prior art date
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Active
Application number
CN202010946752.2A
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English (en)
Chinese (zh)
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CN112500702A (zh
Inventor
鹤井一彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
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Ajinomoto Co Inc
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Publication of CN112500702A publication Critical patent/CN112500702A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN202010946752.2A 2019-09-13 2020-09-10 树脂组合物 Active CN112500702B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019167177A JP7676106B2 (ja) 2019-09-13 2019-09-13 樹脂組成物
JP2019-167177 2019-09-13

Publications (2)

Publication Number Publication Date
CN112500702A CN112500702A (zh) 2021-03-16
CN112500702B true CN112500702B (zh) 2025-03-04

Family

ID=74861527

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010946752.2A Active CN112500702B (zh) 2019-09-13 2020-09-10 树脂组合物

Country Status (4)

Country Link
JP (2) JP7676106B2 (enExample)
KR (1) KR20210031837A (enExample)
CN (1) CN112500702B (enExample)
TW (1) TWI867037B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023000843A (ja) * 2021-06-18 2023-01-04 パナソニックＩｐマネジメント株式会社 アクリル樹脂組成物、及び成形体
JP7196275B1 (ja) * 2021-12-27 2022-12-26 東洋インキＳｃホールディングス株式会社 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器
CN115637013B (zh) * 2022-10-31 2024-04-30 深圳伊帕思新材料科技有限公司 双马来酰亚胺组合物、半固化胶片以及铜箔基板
CN115975569A (zh) * 2023-02-23 2023-04-18 深圳市汉思新材料科技有限公司 系统级封装用封装胶及其制备方法
CN116867174B (zh) * 2023-07-06 2024-11-12 宁波科浩达电子有限公司 一种pcb印制线路板的制作方法及pcb印制线路板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104656311A (zh) * 2013-11-15 2015-05-27 Jsr株式会社 液晶取向膜的制造方法、液晶显示元件用基板及其制造方法、以及液晶显示元件
CN107709456A (zh) * 2015-07-06 2018-02-16 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、覆金属箔层叠板及印刷电路板
JP2018184595A (ja) * 2017-04-24 2018-11-22 味の素株式会社 樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01215818A (ja) * 1988-02-23 1989-08-29 Hitachi Chem Co Ltd 耐熱性樹脂組成物
JPH03103424A (ja) * 1989-09-18 1991-04-30 Fujitsu Ltd マレイミド樹脂組成物
JP3645604B2 (ja) * 1995-02-16 2005-05-11 住友ベークライト株式会社 樹脂組成物
JP4028672B2 (ja) * 1999-07-15 2007-12-26 荒川化学工業株式会社 反応生成物の製造方法
CN104619498B (zh) * 2012-08-16 2016-08-24 三菱瓦斯化学株式会社 树脂片、带树脂层的支承体、层叠板和覆金属箔层叠板
JP6123243B2 (ja) 2012-11-12 2017-05-10 味の素株式会社 絶縁樹脂材料
KR102287542B1 (ko) * 2016-08-08 2021-08-11 도레이 카부시키가이샤 수지 조성물, 그것을 사용한 시트, 적층체, 파워 반도체 장치, 플라스마 처리 장치 및 반도체의 제조 방법
JP6217832B2 (ja) * 2016-11-21 2017-10-25 味の素株式会社 樹脂組成物
WO2020176898A1 (en) 2019-02-28 2020-09-03 Juul Labs, Inc. Wireless device pairing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104656311A (zh) * 2013-11-15 2015-05-27 Jsr株式会社 液晶取向膜的制造方法、液晶显示元件用基板及其制造方法、以及液晶显示元件
CN107709456A (zh) * 2015-07-06 2018-02-16 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、覆金属箔层叠板及印刷电路板
JP2018184595A (ja) * 2017-04-24 2018-11-22 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
JP2023138760A (ja) 2023-10-02
JP2021042340A (ja) 2021-03-18
TW202116912A (zh) 2021-05-01
JP7676106B2 (ja) 2025-05-14
KR20210031837A (ko) 2021-03-23
CN112500702A (zh) 2021-03-16
TWI867037B (zh) 2024-12-21

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