TWI867037B - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TWI867037B
TWI867037B TW109129978A TW109129978A TWI867037B TW I867037 B TWI867037 B TW I867037B TW 109129978 A TW109129978 A TW 109129978A TW 109129978 A TW109129978 A TW 109129978A TW I867037 B TWI867037 B TW I867037B
Authority
TW
Taiwan
Prior art keywords
resin composition
mass
resin
component
less
Prior art date
Application number
TW109129978A
Other languages
English (en)
Chinese (zh)
Other versions
TW202116912A (zh
Inventor
鶴井一彥
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202116912A publication Critical patent/TW202116912A/zh
Application granted granted Critical
Publication of TWI867037B publication Critical patent/TWI867037B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW109129978A 2019-09-13 2020-09-02 樹脂組成物 TWI867037B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019167177A JP7676106B2 (ja) 2019-09-13 2019-09-13 樹脂組成物
JP2019-167177 2019-09-13

Publications (2)

Publication Number Publication Date
TW202116912A TW202116912A (zh) 2021-05-01
TWI867037B true TWI867037B (zh) 2024-12-21

Family

ID=74861527

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109129978A TWI867037B (zh) 2019-09-13 2020-09-02 樹脂組成物

Country Status (4)

Country Link
JP (2) JP7676106B2 (enExample)
KR (1) KR20210031837A (enExample)
CN (1) CN112500702B (enExample)
TW (1) TWI867037B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023000843A (ja) * 2021-06-18 2023-01-04 パナソニックＩｐマネジメント株式会社 アクリル樹脂組成物、及び成形体
JP7196275B1 (ja) * 2021-12-27 2022-12-26 東洋インキＳｃホールディングス株式会社 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器
CN115637013B (zh) * 2022-10-31 2024-04-30 深圳伊帕思新材料科技有限公司 双马来酰亚胺组合物、半固化胶片以及铜箔基板
CN115975569A (zh) * 2023-02-23 2023-04-18 深圳市汉思新材料科技有限公司 系统级封装用封装胶及其制备方法
CN116867174B (zh) * 2023-07-06 2024-11-12 宁波科浩达电子有限公司 一种pcb印制线路板的制作方法及pcb印制线路板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201518354A (zh) * 2013-11-15 2015-05-16 Jsr Corp 液晶配向膜的製造方法、液晶顯示元件用基板及其製造方法、以及液晶顯示元件
TW201708345A (zh) * 2015-07-06 2017-03-01 三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、樹脂片、覆金屬箔疊層板及印刷電路板
TW201819535A (zh) * 2016-08-08 2018-06-01 東麗股份有限公司 樹脂組成物、使用其之薄片、積層體、功率半導體裝置、電漿處理裝置及半導體之製造方法
TW201900768A (zh) * 2017-04-24 2019-01-01 日商味之素股份有限公司 樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01215818A (ja) * 1988-02-23 1989-08-29 Hitachi Chem Co Ltd 耐熱性樹脂組成物
JPH03103424A (ja) * 1989-09-18 1991-04-30 Fujitsu Ltd マレイミド樹脂組成物
JP3645604B2 (ja) * 1995-02-16 2005-05-11 住友ベークライト株式会社 樹脂組成物
JP4028672B2 (ja) * 1999-07-15 2007-12-26 荒川化学工業株式会社 反応生成物の製造方法
CN104619498B (zh) * 2012-08-16 2016-08-24 三菱瓦斯化学株式会社 树脂片、带树脂层的支承体、层叠板和覆金属箔层叠板
JP6123243B2 (ja) 2012-11-12 2017-05-10 味の素株式会社 絶縁樹脂材料
JP6217832B2 (ja) * 2016-11-21 2017-10-25 味の素株式会社 樹脂組成物
WO2020176898A1 (en) 2019-02-28 2020-09-03 Juul Labs, Inc. Wireless device pairing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201518354A (zh) * 2013-11-15 2015-05-16 Jsr Corp 液晶配向膜的製造方法、液晶顯示元件用基板及其製造方法、以及液晶顯示元件
TW201708345A (zh) * 2015-07-06 2017-03-01 三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、樹脂片、覆金屬箔疊層板及印刷電路板
TW201819535A (zh) * 2016-08-08 2018-06-01 東麗股份有限公司 樹脂組成物、使用其之薄片、積層體、功率半導體裝置、電漿處理裝置及半導體之製造方法
TW201900768A (zh) * 2017-04-24 2019-01-01 日商味之素股份有限公司 樹脂組成物

Also Published As

Publication number Publication date
CN112500702B (zh) 2025-03-04
JP2023138760A (ja) 2023-10-02
JP2021042340A (ja) 2021-03-18
TW202116912A (zh) 2021-05-01
JP7676106B2 (ja) 2025-05-14
KR20210031837A (ko) 2021-03-23
CN112500702A (zh) 2021-03-16

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