JP7650780B2 - パッケージおよびその製造方法 - Google Patents
パッケージおよびその製造方法 Download PDFInfo
- Publication number
- JP7650780B2 JP7650780B2 JP2021174728A JP2021174728A JP7650780B2 JP 7650780 B2 JP7650780 B2 JP 7650780B2 JP 2021174728 A JP2021174728 A JP 2021174728A JP 2021174728 A JP2021174728 A JP 2021174728A JP 7650780 B2 JP7650780 B2 JP 7650780B2
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- JP
- Japan
- Prior art keywords
- layer
- ceramic
- metallization layer
- package
- metallized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims description 59
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 238000001465 metallisation Methods 0.000 claims description 143
- 239000000919 ceramic Substances 0.000 claims description 89
- 239000000463 material Substances 0.000 claims description 70
- 238000007747 plating Methods 0.000 claims description 63
- 238000005219 brazing Methods 0.000 claims description 53
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 238000007789 sealing Methods 0.000 claims description 17
- 238000010304 firing Methods 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 description 15
- 239000000956 alloy Substances 0.000 description 15
- 239000004020 conductor Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229910015363 Au—Sn Inorganic materials 0.000 description 3
- 229910017709 Ni Co Inorganic materials 0.000 description 3
- 229910003267 Ni-Co Inorganic materials 0.000 description 3
- 229910003262 Ni‐Co Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111360843.9A CN114696777B (zh) | 2020-12-25 | 2021-11-17 | 封装体及其制造方法 |
| TW110144799A TWI806265B (zh) | 2020-12-25 | 2021-12-01 | 封裝體及其製造方法 |
| TW112117441A TW202335195A (zh) | 2020-12-25 | 2021-12-01 | 封裝體及其製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020217028 | 2020-12-25 | ||
| JP2020217028 | 2020-12-25 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022103057A JP2022103057A (ja) | 2022-07-07 |
| JP2022103057A5 JP2022103057A5 (https=) | 2024-07-03 |
| JP7650780B2 true JP7650780B2 (ja) | 2025-03-25 |
Family
ID=82273383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021174728A Active JP7650780B2 (ja) | 2020-12-25 | 2021-10-26 | パッケージおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7650780B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7518951B2 (ja) | 2022-08-09 | 2024-07-18 | Ｎｇｋエレクトロデバイス株式会社 | パッケージ |
| JP7562767B2 (ja) | 2022-08-09 | 2024-10-07 | Ｎｇｋエレクトロデバイス株式会社 | パッケージ |
| WO2025177846A1 (ja) * | 2024-02-22 | 2025-08-28 | 京セラ株式会社 | 配線基板、パッケージおよび電子デバイス |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004289470A (ja) | 2003-03-20 | 2004-10-14 | Kyocera Corp | 圧電振動子収納用パッケージ |
| JP2005268334A (ja) | 2004-03-16 | 2005-09-29 | Mitsubishi Electric Corp | 電子部品収容パッケージ、及び電子部品収容パッケージの製造方法 |
| JP2008198809A (ja) | 2007-02-14 | 2008-08-28 | Sumitomo Metal Electronics Devices Inc | 電子部品収納用パッケージの製造方法 |
| JP2015159204A (ja) | 2014-02-25 | 2015-09-03 | 日本特殊陶業株式会社 | セラミックパッケージ |
-
2021
- 2021-10-26 JP JP2021174728A patent/JP7650780B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004289470A (ja) | 2003-03-20 | 2004-10-14 | Kyocera Corp | 圧電振動子収納用パッケージ |
| JP2005268334A (ja) | 2004-03-16 | 2005-09-29 | Mitsubishi Electric Corp | 電子部品収容パッケージ、及び電子部品収容パッケージの製造方法 |
| JP2008198809A (ja) | 2007-02-14 | 2008-08-28 | Sumitomo Metal Electronics Devices Inc | 電子部品収納用パッケージの製造方法 |
| JP2015159204A (ja) | 2014-02-25 | 2015-09-03 | 日本特殊陶業株式会社 | セラミックパッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022103057A (ja) | 2022-07-07 |
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