JP7649746B2 - 感光性転写部材、回路配線の製造方法、タッチパネルの製造方法 - Google Patents

感光性転写部材、回路配線の製造方法、タッチパネルの製造方法 Download PDF

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Publication number
JP7649746B2
JP7649746B2 JP2021540663A JP2021540663A JP7649746B2 JP 7649746 B2 JP7649746 B2 JP 7649746B2 JP 2021540663 A JP2021540663 A JP 2021540663A JP 2021540663 A JP2021540663 A JP 2021540663A JP 7649746 B2 JP7649746 B2 JP 7649746B2
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Prior art keywords
resin layer
photosensitive resin
photosensitive
layer
transfer member
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Japanese (ja)
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JPWO2021033451A1 (https=
JPWO2021033451A5 (https=
Inventor
一真 両角
隆志 有冨
進二 藤本
知樹 松田
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Fujifilm Corp
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2021540663A 2019-08-22 2020-07-09 感光性転写部材、回路配線の製造方法、タッチパネルの製造方法 Active JP7649746B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024023774A JP2024063054A (ja) 2019-08-22 2024-02-20 感光性転写部材、回路配線の製造方法、タッチパネルの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019151736 2019-08-22
JP2019151736 2019-08-22
PCT/JP2020/026806 WO2021033451A1 (ja) 2019-08-22 2020-07-09 感光性転写部材、回路配線の製造方法、タッチパネルの製造方法

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JPWO2021033451A5 JPWO2021033451A5 (https=) 2022-04-25
JP7649746B2 true JP7649746B2 (ja) 2025-03-21

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JP2024023774A Abandoned JP2024063054A (ja) 2019-08-22 2024-02-20 感光性転写部材、回路配線の製造方法、タッチパネルの製造方法

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CN (1) CN114270262A (https=)
WO (1) WO2021033451A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116249939A (zh) * 2020-09-14 2023-06-09 富士胶片株式会社 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及电子设备的制造方法
JP2022154008A (ja) * 2021-03-30 2022-10-13 三菱ケミカル株式会社 電気触覚デバイス及び触覚デバイス用部材
CN119213365A (zh) * 2022-04-28 2024-12-27 富士胶片株式会社 转印膜、层叠体的制造方法、电路配线基板的制造方法、电路配线基板及半导体封装

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016080375A1 (ja) 2014-11-17 2016-05-26 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2017018053A1 (ja) 2015-07-29 2017-02-02 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2018124436A (ja) 2017-02-01 2018-08-09 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007264483A (ja) * 2006-03-29 2007-10-11 Fujifilm Corp パターン形成材料及びパターン形成方法
PH12013500757A1 (en) * 2010-12-16 2013-06-03 Resonac Corp Photosensitive element, method for forming resist pattern, and method for producing printed circuit board
JP2016224161A (ja) * 2015-05-28 2016-12-28 日立化成株式会社 レジストパターンの形成方法、プリント配線板の製造方法及び感光性エレメント
JP2017078852A (ja) * 2015-10-21 2017-04-27 富士フイルム株式会社 ドライフィルムレジスト、回路配線の製造方法、回路配線、入力装置および表示装置
CN109983404B (zh) * 2016-12-08 2022-10-28 富士胶片株式会社 转印薄膜、电极保护膜、层叠体、静电电容型输入装置及触摸面板的制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016080375A1 (ja) 2014-11-17 2016-05-26 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2017018053A1 (ja) 2015-07-29 2017-02-02 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2018124436A (ja) 2017-02-01 2018-08-09 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法

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WO2021033451A1 (ja) 2021-02-25
JP2024063054A (ja) 2024-05-10
CN114270262A (zh) 2022-04-01

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