JPWO2022054374A1 - - Google Patents

Info

Publication number
JPWO2022054374A1
JPWO2022054374A1 JP2022547409A JP2022547409A JPWO2022054374A1 JP WO2022054374 A1 JPWO2022054374 A1 JP WO2022054374A1 JP 2022547409 A JP2022547409 A JP 2022547409A JP 2022547409 A JP2022547409 A JP 2022547409A JP WO2022054374 A1 JPWO2022054374 A1 JP WO2022054374A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022547409A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022054374A1 publication Critical patent/JPWO2022054374A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/023Optical properties
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Materials For Photolithography (AREA)
JP2022547409A 2020-09-14 2021-06-25 Pending JPWO2022054374A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020153896 2020-09-14
JP2020207814 2020-12-15
PCT/JP2021/024174 WO2022054374A1 (ja) 2020-09-14 2021-06-25 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及び電子機器の製造方法

Publications (1)

Publication Number Publication Date
JPWO2022054374A1 true JPWO2022054374A1 (https=) 2022-03-17

Family

ID=80632257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022547409A Pending JPWO2022054374A1 (https=) 2020-09-14 2021-06-25

Country Status (3)

Country Link
JP (1) JPWO2022054374A1 (https=)
CN (1) CN116249939A (https=)
WO (1) WO2022054374A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008239743A (ja) * 2007-03-27 2008-10-09 Toray Ind Inc ドライフィルムレジスト支持体用ポリエステルフィルム
JP2009073022A (ja) * 2007-09-20 2009-04-09 Fujifilm Corp 転写用積層材料及び画像形成方法
JP2009083482A (ja) * 2007-09-13 2009-04-23 Asahi Kasei Electronics Co Ltd 感光性樹脂積層体
JP2017177546A (ja) * 2016-03-30 2017-10-05 富士フイルム株式会社 転写フィルム、静電容量型入力装置の電極保護膜、積層体および静電容量型入力装置
WO2020054660A1 (ja) * 2018-09-12 2020-03-19 富士フイルム株式会社 感光性転写材料、回路配線の製造方法、タッチパネルの製造方法、樹脂パターンの製造方法、及びフィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4422562B2 (ja) * 2004-06-15 2010-02-24 富士フイルム株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007264483A (ja) * 2006-03-29 2007-10-11 Fujifilm Corp パターン形成材料及びパターン形成方法
JP2010032609A (ja) * 2008-07-25 2010-02-12 Teijin Dupont Films Japan Ltd ドライフィルムフォトレジスト用ポリエステルフィルム
WO2021033451A1 (ja) * 2019-08-22 2021-02-25 富士フイルム株式会社 感光性転写部材、回路配線の製造方法、タッチパネルの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008239743A (ja) * 2007-03-27 2008-10-09 Toray Ind Inc ドライフィルムレジスト支持体用ポリエステルフィルム
JP2009083482A (ja) * 2007-09-13 2009-04-23 Asahi Kasei Electronics Co Ltd 感光性樹脂積層体
JP2009073022A (ja) * 2007-09-20 2009-04-09 Fujifilm Corp 転写用積層材料及び画像形成方法
JP2017177546A (ja) * 2016-03-30 2017-10-05 富士フイルム株式会社 転写フィルム、静電容量型入力装置の電極保護膜、積層体および静電容量型入力装置
WO2020054660A1 (ja) * 2018-09-12 2020-03-19 富士フイルム株式会社 感光性転写材料、回路配線の製造方法、タッチパネルの製造方法、樹脂パターンの製造方法、及びフィルム

Also Published As

Publication number Publication date
CN116249939A (zh) 2023-06-09
WO2022054374A1 (ja) 2022-03-17

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