JP7641893B2 - 伸縮性が向上した導電性トレースを含むフレキシブルデバイス - Google Patents

伸縮性が向上した導電性トレースを含むフレキシブルデバイス Download PDF

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JP7641893B2
JP7641893B2 JP2021514577A JP2021514577A JP7641893B2 JP 7641893 B2 JP7641893 B2 JP 7641893B2 JP 2021514577 A JP2021514577 A JP 2021514577A JP 2021514577 A JP2021514577 A JP 2021514577A JP 7641893 B2 JP7641893 B2 JP 7641893B2
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channel
circuit die
channels
solid
conductive
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JP2022500874A (ja
JP2022500874A5 (cg-RX-API-DMAC7.html
Inventor
エー． シャー，セーガー
エル． ペクロフスキー，ミカイル
マハジャン，アンキット
エー． ペクロフスキー，リュドミラ
チウ，ジェシカ
ケー． ラーセン，ジェレミー
エー． メイヤー，カラ
エム． ゲデール，テレサ
ジェイ． メッツラー，トーマス
ダブリュ． ケムリング，ジョナサン
ジェイ． ポコルニー，リチャード
アール． クーンス，ベンジャミン
マーティン アンビー，チャド
ピー． クラン，トーマス
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2021514577A 2018-09-17 2019-09-12 伸縮性が向上した導電性トレースを含むフレキシブルデバイス Active JP7641893B2 (ja)

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PCT/IB2019/057719 WO2020058815A1 (en) 2018-09-17 2019-09-12 Flexible device including conductive traces with enhanced stretchability

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WO2024010060A1 (ja) * 2022-07-08 2024-01-11 積水化学工業株式会社 導電ペースト、ｒｆｉｄインレイ、ｒｆｉｄインレイの製造方法、チップを接着するための導電ペーストの使用、及びｒｆｉｄインレイを得るための導電ペーストの使用
CN116011494A (zh) * 2022-09-06 2023-04-25 中国科学院软件研究所 一种基于微流控技术的多芯片rfid传感装置
CN115665994B (zh) * 2022-10-28 2024-12-31 哈尔滨工业大学 一种柔性多层电路板的制备方法

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US20210212216A1 (en) 2021-07-08
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