JP7621099B2 - プリント配線板 - Google Patents

プリント配線板 Download PDF

Info

Publication number
JP7621099B2
JP7621099B2 JP2020196177A JP2020196177A JP7621099B2 JP 7621099 B2 JP7621099 B2 JP 7621099B2 JP 2020196177 A JP2020196177 A JP 2020196177A JP 2020196177 A JP2020196177 A JP 2020196177A JP 7621099 B2 JP7621099 B2 JP 7621099B2
Authority
JP
Japan
Prior art keywords
power supply
ground
pads
conductor layer
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020196177A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022084352A (ja
JP2022084352A5 (https=
Inventor
哲朗 田端
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2020196177A priority Critical patent/JP7621099B2/ja
Publication of JP2022084352A publication Critical patent/JP2022084352A/ja
Publication of JP2022084352A5 publication Critical patent/JP2022084352A5/ja
Priority to JP2025004466A priority patent/JP2025061223A/ja
Application granted granted Critical
Publication of JP7621099B2 publication Critical patent/JP7621099B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2020196177A 2020-11-26 2020-11-26 プリント配線板 Active JP7621099B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020196177A JP7621099B2 (ja) 2020-11-26 2020-11-26 プリント配線板
JP2025004466A JP2025061223A (ja) 2020-11-26 2025-01-14 プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020196177A JP7621099B2 (ja) 2020-11-26 2020-11-26 プリント配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025004466A Division JP2025061223A (ja) 2020-11-26 2025-01-14 プリント配線板

Publications (3)

Publication Number Publication Date
JP2022084352A JP2022084352A (ja) 2022-06-07
JP2022084352A5 JP2022084352A5 (https=) 2023-08-03
JP7621099B2 true JP7621099B2 (ja) 2025-01-24

Family

ID=81868199

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020196177A Active JP7621099B2 (ja) 2020-11-26 2020-11-26 プリント配線板
JP2025004466A Pending JP2025061223A (ja) 2020-11-26 2025-01-14 プリント配線板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025004466A Pending JP2025061223A (ja) 2020-11-26 2025-01-14 プリント配線板

Country Status (1)

Country Link
JP (2) JP7621099B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7621099B2 (ja) * 2020-11-26 2025-01-24 三菱電機株式会社 プリント配線板
JP2024174570A (ja) * 2023-06-05 2024-12-17 イビデン株式会社 配線基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165857A (ja) 2005-11-18 2007-06-28 Nec System Technologies Ltd 多層配線基板およびその製造方法
JP2008021969A (ja) 2006-06-16 2008-01-31 Canon Inc プリント回路板および電源供給用回路構造
JP2009032821A (ja) 2007-07-25 2009-02-12 Denso Corp 二端子素子の実装構造
JP2011066344A (ja) 2009-09-18 2011-03-31 Renesas Electronics Corp 半導体装置および電子装置
JP2011211155A (ja) 2010-03-10 2011-10-20 Panasonic Corp 電子回路
JP2015012168A (ja) 2013-06-28 2015-01-19 キヤノン株式会社 プリント回路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9549459B2 (en) * 2012-01-27 2017-01-17 Panasonic Intellectual Property Management Co., Ltd. Multilayer printed circuit board
JP6317855B2 (ja) * 2015-06-26 2018-04-25 ルネサスエレクトロニクス株式会社 電子装置
JP7621099B2 (ja) * 2020-11-26 2025-01-24 三菱電機株式会社 プリント配線板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165857A (ja) 2005-11-18 2007-06-28 Nec System Technologies Ltd 多層配線基板およびその製造方法
JP2008021969A (ja) 2006-06-16 2008-01-31 Canon Inc プリント回路板および電源供給用回路構造
JP2009032821A (ja) 2007-07-25 2009-02-12 Denso Corp 二端子素子の実装構造
JP2011066344A (ja) 2009-09-18 2011-03-31 Renesas Electronics Corp 半導体装置および電子装置
JP2011211155A (ja) 2010-03-10 2011-10-20 Panasonic Corp 電子回路
JP2015012168A (ja) 2013-06-28 2015-01-19 キヤノン株式会社 プリント回路板

Also Published As

Publication number Publication date
JP2025061223A (ja) 2025-04-10
JP2022084352A (ja) 2022-06-07

Similar Documents

Publication Publication Date Title
US9674941B2 (en) Printed circuit board for mobile platforms
JP2025061223A (ja) プリント配線板
US10109576B2 (en) Capacitor mounting structure
CN104205268A (zh) 三维无源多器件结构
JP2022549662A (ja) 配線設計方法、配線構造、およびフリップチップ
JP6671551B1 (ja) 多層プリント基板
JP6128756B2 (ja) 半導体パッケージ、積層型半導体パッケージ及びプリント回路板
US10123426B2 (en) Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated circuit device
CN103889145A (zh) 线路板及电子总成
JPH11260999A (ja) ノイズを低減した積層半導体装置モジュール
US8587117B2 (en) Stacked semiconductor chips having circuit element provided with each of the semiconductor chips
US7875808B2 (en) Embedded capacitor device having a common coupling area
JP4280179B2 (ja) 積層型半導体装置
US20080251286A1 (en) Method For Increasing a Routing Density For a Circuit Board and Such a Circuit Board
JP4243621B2 (ja) 半導体パッケージ
JP2008218444A (ja) プリント配線基板
US7394026B2 (en) Multilayer wiring board
JP2006344787A (ja) 半導体装置
JP6528258B2 (ja) 部品内蔵基板
KR100735838B1 (ko) 집적회로 모듈 형성방법 및 그에 따른 집적회로 모듈
JP2012089541A (ja) 多層回路基板
JP2020013917A (ja) 配線基板
JP2010056121A (ja) 積層型半導体装置
CN120568582A (zh) 一种电路板
JP2015082524A (ja) 配線基板、半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230726

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230726

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240419

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240528

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240710

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240913

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241217

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250114

R150 Certificate of patent or registration of utility model

Ref document number: 7621099

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150