JP7579866B2 - 高電力、高圧プロセス用の分割されたガス分配プレート - Google Patents

高電力、高圧プロセス用の分割されたガス分配プレート Download PDF

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Publication number
JP7579866B2
JP7579866B2 JP2022545782A JP2022545782A JP7579866B2 JP 7579866 B2 JP7579866 B2 JP 7579866B2 JP 2022545782 A JP2022545782 A JP 2022545782A JP 2022545782 A JP2022545782 A JP 2022545782A JP 7579866 B2 JP7579866 B2 JP 7579866B2
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Prior art keywords
gas distribution
distribution plate
arcuate portion
gas
inner rings
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JP2022545782A
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Japanese (ja)
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JP2023512201A (ja
JP2023512201A5 (enExample
Inventor
ペン・ゴードン
シャイク・ムハンマド・ソハイル
ロッスリー・クレイグ
マロール・ダン
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
JP2022545782A 2020-01-28 2021-01-26 高電力、高圧プロセス用の分割されたガス分配プレート Active JP7579866B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024188692A JP7886924B2 (ja) 2020-01-28 2024-10-28 高電力、高圧プロセス用の分割されたガス分配プレート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062966816P 2020-01-28 2020-01-28
US62/966,816 2020-01-28
PCT/US2021/014988 WO2021154673A1 (en) 2020-01-28 2021-01-26 Segmented gas distribution plate for high-power, high-pressure processes

Related Child Applications (1)

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JP2024188692A Division JP7886924B2 (ja) 2020-01-28 2024-10-28 高電力、高圧プロセス用の分割されたガス分配プレート

Publications (3)

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JP2023512201A JP2023512201A (ja) 2023-03-24
JP2023512201A5 JP2023512201A5 (enExample) 2024-01-31
JP7579866B2 true JP7579866B2 (ja) 2024-11-08

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JP2022545782A Active JP7579866B2 (ja) 2020-01-28 2021-01-26 高電力、高圧プロセス用の分割されたガス分配プレート
JP2024188692A Active JP7886924B2 (ja) 2020-01-28 2024-10-28 高電力、高圧プロセス用の分割されたガス分配プレート

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JP2024188692A Active JP7886924B2 (ja) 2020-01-28 2024-10-28 高電力、高圧プロセス用の分割されたガス分配プレート

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Country Link
US (1) US20220375725A1 (enExample)
JP (2) JP7579866B2 (enExample)
KR (2) KR20260028876A (enExample)
CN (1) CN115004332A (enExample)
TW (1) TWI904130B (enExample)
WO (1) WO2021154673A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI899187B (zh) * 2020-03-19 2025-10-01 美商蘭姆研究公司 基板處理系統
CN116334585A (zh) * 2021-12-23 2023-06-27 中微半导体设备(上海)股份有限公司 一种半导体设备喷淋头及等离子体装置
CN115547804B (zh) * 2022-09-29 2026-01-09 西实显示高新材料(沈阳)有限公司 大尺寸icp供气模组与icp设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090159002A1 (en) 2007-12-19 2009-06-25 Kallol Bera Gas distribution plate with annular plenum having a sloped ceiling for uniform distribution
JP2014523635A (ja) 2011-05-31 2014-09-11 ラム リサーチ コーポレーション 誘導結合プラズマエッチングリアクタのためのガス分配シャワーヘッド
JP2019220532A (ja) 2018-06-18 2019-12-26 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法

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US4590042A (en) * 1984-12-24 1986-05-20 Tegal Corporation Plasma reactor having slotted manifold
JP3038524B2 (ja) * 1993-04-19 2000-05-08 コマツ電子金属株式会社 半導体製造装置
US5746875A (en) * 1994-09-16 1998-05-05 Applied Materials, Inc. Gas injection slit nozzle for a plasma process reactor
US6019848A (en) * 1996-11-13 2000-02-01 Applied Materials, Inc. Lid assembly for high temperature processing chamber
US5800621A (en) * 1997-02-10 1998-09-01 Applied Materials, Inc. Plasma source for HDP-CVD chamber
US6245192B1 (en) * 1999-06-30 2001-06-12 Lam Research Corporation Gas distribution apparatus for semiconductor processing
US6237528B1 (en) * 2000-01-24 2001-05-29 M.E.C. Technology, Inc. Showerhead electrode assembly for plasma processing
US20040060514A1 (en) * 2002-01-25 2004-04-01 Applied Materials, Inc. A Delaware Corporation Gas distribution showerhead
US20070084408A1 (en) * 2005-10-13 2007-04-19 Applied Materials, Inc. Batch processing chamber with diffuser plate and injector assembly
US20070084406A1 (en) * 2005-10-13 2007-04-19 Joseph Yudovsky Reaction chamber with opposing pockets for gas injection and exhaust
US20070119370A1 (en) * 2005-11-04 2007-05-31 Paul Ma Apparatus and process for plasma-enhanced atomic layer deposition
US8440049B2 (en) 2006-05-03 2013-05-14 Applied Materials, Inc. Apparatus for etching high aspect ratio features
US7854820B2 (en) * 2006-10-16 2010-12-21 Lam Research Corporation Upper electrode backing member with particle reducing features
JP3160877U (ja) * 2009-10-13 2010-07-15 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ シャワーヘッド電極アセンブリの端部クランプ留めおよび機械固定される内側電極
CN102918180B (zh) 2010-05-21 2014-12-17 应用材料公司 大面积电极上的紧密安装的陶瓷绝缘体
US9793126B2 (en) * 2010-08-04 2017-10-17 Lam Research Corporation Ion to neutral control for wafer processing with dual plasma source reactor
JP2012216744A (ja) 2010-11-10 2012-11-08 Sharp Corp 気相成長装置及び気相成長方法
US9353439B2 (en) * 2013-04-05 2016-05-31 Lam Research Corporation Cascade design showerhead for transient uniformity
US9390910B2 (en) * 2014-10-03 2016-07-12 Applied Materials, Inc. Gas flow profile modulated control of overlay in plasma CVD films
KR20160066340A (ko) * 2014-12-02 2016-06-10 삼성전자주식회사 기판 처리 장치
US10217614B2 (en) * 2015-01-12 2019-02-26 Lam Research Corporation Ceramic gas distribution plate with embedded electrode
TWI727024B (zh) * 2016-04-15 2021-05-11 美商應用材料股份有限公司 微體積沉積腔室
US10622189B2 (en) * 2016-05-11 2020-04-14 Lam Research Corporation Adjustable side gas plenum for edge rate control in a downstream reactor
JP6851188B2 (ja) * 2016-11-28 2021-03-31 東京エレクトロン株式会社 プラズマ処理装置及びシャワーヘッド
JP2019145397A (ja) * 2018-02-22 2019-08-29 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法
US10840066B2 (en) * 2018-06-13 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Adjustable fastening device for plasma gas injectors

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090159002A1 (en) 2007-12-19 2009-06-25 Kallol Bera Gas distribution plate with annular plenum having a sloped ceiling for uniform distribution
JP2014523635A (ja) 2011-05-31 2014-09-11 ラム リサーチ コーポレーション 誘導結合プラズマエッチングリアクタのためのガス分配シャワーヘッド
JP2019220532A (ja) 2018-06-18 2019-12-26 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法

Also Published As

Publication number Publication date
KR20260028876A (ko) 2026-03-04
WO2021154673A1 (en) 2021-08-05
TWI904130B (zh) 2025-11-11
US20220375725A1 (en) 2022-11-24
KR20220131285A (ko) 2022-09-27
JP2025013990A (ja) 2025-01-28
JP7886924B2 (ja) 2026-07-08
KR102925637B1 (ko) 2026-02-09
JP2023512201A (ja) 2023-03-24
CN115004332A (zh) 2022-09-02
TW202147377A (zh) 2021-12-16

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