JP7563591B2 - 半導体装置、マッチング回路及びフィルタ回路 - Google Patents

半導体装置、マッチング回路及びフィルタ回路 Download PDF

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Publication number
JP7563591B2
JP7563591B2 JP2023521008A JP2023521008A JP7563591B2 JP 7563591 B2 JP7563591 B2 JP 7563591B2 JP 2023521008 A JP2023521008 A JP 2023521008A JP 2023521008 A JP2023521008 A JP 2023521008A JP 7563591 B2 JP7563591 B2 JP 7563591B2
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Japan
Prior art keywords
dielectric film
electrode layer
layer
electrode
external electrode
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JP2023521008A
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Japanese (ja)
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JPWO2022239722A5 (https=
JPWO2022239722A1 (https=
Inventor
真臣 原田
是清 伊藤
武史 香川
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01Frequency selective two-port networks
    • H03H7/0115Frequency selective two-port networks comprising only inductors and capacitors
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38Impedance-matching networks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00Arrangements for protection of devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00Electrical arrangements for controlling or matching impedance
    • H10W44/601Capacitive arrangements

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Ceramic Capacitors (AREA)
JP2023521008A 2021-05-10 2022-05-09 半導体装置、マッチング回路及びフィルタ回路 Active JP7563591B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021079849 2021-05-10
JP2021079849 2021-05-10
PCT/JP2022/019625 WO2022239722A1 (ja) 2021-05-10 2022-05-09 半導体装置、マッチング回路及びフィルタ回路

Publications (3)

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JPWO2022239722A1 JPWO2022239722A1 (https=) 2022-11-17
JPWO2022239722A5 JPWO2022239722A5 (https=) 2024-02-13
JP7563591B2 true JP7563591B2 (ja) 2024-10-08

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JP2023521008A Active JP7563591B2 (ja) 2021-05-10 2022-05-09 半導体装置、マッチング回路及びフィルタ回路

Country Status (4)

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US (1) US20240072107A1 (https=)
JP (1) JP7563591B2 (https=)
CN (1) CN117242538A (https=)
WO (1) WO2022239722A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024252872A1 (https=) * 2023-06-07 2024-12-12
JPWO2024252871A1 (https=) * 2023-06-07 2024-12-12

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019026771A1 (ja) 2017-07-31 2019-02-07 株式会社村田製作所 キャパシタ
WO2020074534A2 (de) 2018-10-09 2020-04-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Integrierter kondensator und verfahren zur herstellung eines integrierten kondensators

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019026771A1 (ja) 2017-07-31 2019-02-07 株式会社村田製作所 キャパシタ
WO2020074534A2 (de) 2018-10-09 2020-04-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Integrierter kondensator und verfahren zur herstellung eines integrierten kondensators

Also Published As

Publication number Publication date
US20240072107A1 (en) 2024-02-29
CN117242538A (zh) 2023-12-15
WO2022239722A1 (ja) 2022-11-17
JPWO2022239722A1 (https=) 2022-11-17

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