JP7561842B2 - Ledディスプレイ装置 - Google Patents
Ledディスプレイ装置 Download PDFInfo
- Publication number
- JP7561842B2 JP7561842B2 JP2022524054A JP2022524054A JP7561842B2 JP 7561842 B2 JP7561842 B2 JP 7561842B2 JP 2022524054 A JP2022524054 A JP 2022524054A JP 2022524054 A JP2022524054 A JP 2022524054A JP 7561842 B2 JP7561842 B2 JP 7561842B2
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- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting
- led subunit
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/30—Active-matrix LED displays
- H10H29/34—Active-matrix LED displays characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/80—Constructional details
- H10H29/85—Packages
- H10H29/852—Encapsulations
- H10H29/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/80—Constructional details
- H10H29/962—Stacked configurations of light-emitting semiconductor components or devices, the components or devices emitting at different wavelengths
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024163598A JP2024180402A (ja) | 2019-10-23 | 2024-09-20 | Ledディスプレイ装置 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962924737P | 2019-10-23 | 2019-10-23 | |
| US62/924,737 | 2019-10-23 | ||
| US17/075,636 | 2020-10-20 | ||
| US17/075,636 US11810944B2 (en) | 2019-10-23 | 2020-10-20 | LED display apparatus |
| PCT/KR2020/014397 WO2021080311A1 (ko) | 2019-10-23 | 2020-10-21 | Led 디스플레이 장치 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024163598A Division JP2024180402A (ja) | 2019-10-23 | 2024-09-20 | Ledディスプレイ装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022553986A JP2022553986A (ja) | 2022-12-27 |
| JP2022553986A5 JP2022553986A5 (https=) | 2023-10-19 |
| JP7561842B2 true JP7561842B2 (ja) | 2024-10-04 |
Family
ID=75311507
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022524054A Active JP7561842B2 (ja) | 2019-10-23 | 2020-10-21 | Ledディスプレイ装置 |
| JP2024163598A Pending JP2024180402A (ja) | 2019-10-23 | 2024-09-20 | Ledディスプレイ装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024163598A Pending JP2024180402A (ja) | 2019-10-23 | 2024-09-20 | Ledディスプレイ装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230369385A1 (https=) |
| EP (1) | EP4024452A4 (https=) |
| JP (2) | JP7561842B2 (https=) |
| KR (1) | KR20220088675A (https=) |
| CN (2) | CN212934611U (https=) |
| BR (1) | BR112022007494A2 (https=) |
| MX (1) | MX2022003387A (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220088675A (ko) * | 2019-10-23 | 2022-06-28 | 서울바이오시스 주식회사 | Led 디스플레이 장치 |
| US12438132B2 (en) | 2021-04-14 | 2025-10-07 | Seoul Viosys Co., Ltd. | Unit pixel for LED display and LED display apparatus having the same |
| CN114725276B (zh) * | 2022-03-14 | 2023-10-03 | 湖南大学 | Micro-LED分立器件 |
| CN114725150B (zh) * | 2022-03-14 | 2023-10-03 | 湖南大学 | Micro-LED器件及微显示屏 |
| EP4597592A4 (en) * | 2023-03-31 | 2026-01-07 | Boe Technology Group Co Ltd | ELECTROLUMINESCENT DEVICE, DISPLAY DEVICE AND BACKLIGHTING DEVICE |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002016312A (ja) | 2000-06-27 | 2002-01-18 | Sanyo Electric Co Ltd | 窒化物系半導体素子およびその製造方法 |
| US20030047742A1 (en) | 2001-09-11 | 2003-03-13 | Hen Chang Hsiu | Package structure of full color LED form by overlap cascaded die bonding |
| JP2006216933A (ja) | 2005-02-03 | 2006-08-17 | Epistar Corp | 発光素子及びその製造方法 |
| JP2007227820A (ja) | 2006-02-27 | 2007-09-06 | Stanley Electric Co Ltd | 半導体装置及びその製造方法 |
| JP2014507804A (ja) | 2011-01-28 | 2014-03-27 | ソウル バイオシス カンパニー リミテッド | ウエハーレベル発光ダイオードパッケージ及びそれを製造する方法 |
| US20170288093A1 (en) | 2016-04-04 | 2017-10-05 | Samsung Electronics Co., Ltd. | Led light source module and display device |
| US20190164944A1 (en) | 2017-11-27 | 2019-05-30 | Seoul Viosys Co., Ltd. | Led unit for display and display apparatus having the same |
| US20190165207A1 (en) | 2017-11-27 | 2019-05-30 | Seoul Viosys Co., Ltd. | Led unit for display and display apparatus having the same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4374913B2 (ja) * | 2003-06-05 | 2009-12-02 | 日亜化学工業株式会社 | 発光装置 |
| US20070170444A1 (en) * | 2004-07-07 | 2007-07-26 | Cao Group, Inc. | Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same |
| KR101100579B1 (ko) * | 2005-01-06 | 2012-01-13 | 엘지이노텍 주식회사 | 반도체 발광 다이오드 및 그의 제조 방법과 반도체 발광다이오드를 이용한 디스플레이의 제조 방법 |
| JP6604786B2 (ja) * | 2015-09-11 | 2019-11-13 | 三星電子株式会社 | 半導体発光装置およびその製造方法 |
| US10886327B2 (en) * | 2017-12-14 | 2021-01-05 | Seoul Viosys Co., Ltd. | Light emitting stacked structure and display device having the same |
| US11552057B2 (en) * | 2017-12-20 | 2023-01-10 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
| KR20220088675A (ko) * | 2019-10-23 | 2022-06-28 | 서울바이오시스 주식회사 | Led 디스플레이 장치 |
-
2020
- 2020-10-21 KR KR1020227004589A patent/KR20220088675A/ko active Pending
- 2020-10-21 EP EP20879476.8A patent/EP4024452A4/en active Pending
- 2020-10-21 MX MX2022003387A patent/MX2022003387A/es unknown
- 2020-10-21 BR BR112022007494A patent/BR112022007494A2/pt unknown
- 2020-10-21 CN CN202022360540.4U patent/CN212934611U/zh active Active
- 2020-10-21 CN CN202080068801.5A patent/CN114467178A/zh active Pending
- 2020-10-21 JP JP2022524054A patent/JP7561842B2/ja active Active
-
2023
- 2023-07-27 US US18/227,269 patent/US20230369385A1/en active Pending
-
2024
- 2024-09-20 JP JP2024163598A patent/JP2024180402A/ja active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002016312A (ja) | 2000-06-27 | 2002-01-18 | Sanyo Electric Co Ltd | 窒化物系半導体素子およびその製造方法 |
| US20030047742A1 (en) | 2001-09-11 | 2003-03-13 | Hen Chang Hsiu | Package structure of full color LED form by overlap cascaded die bonding |
| JP2006216933A (ja) | 2005-02-03 | 2006-08-17 | Epistar Corp | 発光素子及びその製造方法 |
| JP2007227820A (ja) | 2006-02-27 | 2007-09-06 | Stanley Electric Co Ltd | 半導体装置及びその製造方法 |
| JP2014507804A (ja) | 2011-01-28 | 2014-03-27 | ソウル バイオシス カンパニー リミテッド | ウエハーレベル発光ダイオードパッケージ及びそれを製造する方法 |
| US20170288093A1 (en) | 2016-04-04 | 2017-10-05 | Samsung Electronics Co., Ltd. | Led light source module and display device |
| US20190164944A1 (en) | 2017-11-27 | 2019-05-30 | Seoul Viosys Co., Ltd. | Led unit for display and display apparatus having the same |
| US20190165207A1 (en) | 2017-11-27 | 2019-05-30 | Seoul Viosys Co., Ltd. | Led unit for display and display apparatus having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4024452A4 (en) | 2023-10-04 |
| EP4024452A1 (en) | 2022-07-06 |
| CN114467178A (zh) | 2022-05-10 |
| JP2024180402A (ja) | 2024-12-26 |
| CN212934611U (zh) | 2021-04-09 |
| KR20220088675A (ko) | 2022-06-28 |
| JP2022553986A (ja) | 2022-12-27 |
| MX2022003387A (es) | 2022-07-01 |
| BR112022007494A2 (pt) | 2022-07-12 |
| US20230369385A1 (en) | 2023-11-16 |
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| JP7561842B2 (ja) | Ledディスプレイ装置 | |
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| US11810944B2 (en) | LED display apparatus |
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