JP7561130B2 - 電気絶縁及び熱伝導性ポリマー組成物 - Google Patents

電気絶縁及び熱伝導性ポリマー組成物 Download PDF

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JP7561130B2
JP7561130B2 JP2021539981A JP2021539981A JP7561130B2 JP 7561130 B2 JP7561130 B2 JP 7561130B2 JP 2021539981 A JP2021539981 A JP 2021539981A JP 2021539981 A JP2021539981 A JP 2021539981A JP 7561130 B2 JP7561130 B2 JP 7561130B2
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polymer composition
graphite particles
weight percent
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polymer
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JP2022517965A (ja
JPWO2020146747A5 (enExample
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賢志 平原
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デュポン ポリマーズ インコーポレイテッド
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C08K2003/162—Calcium, strontium or barium halides, e.g. calcium, strontium or barium chloride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/267—Magnesium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3009—Sulfides
    • C08K2003/3036—Sulfides of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021539981A 2019-01-11 2020-01-10 電気絶縁及び熱伝導性ポリマー組成物 Active JP7561130B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962791181P 2019-01-11 2019-01-11
US62/791,181 2019-01-11
PCT/US2020/013107 WO2020146747A1 (en) 2019-01-11 2020-01-10 Electrically insulating and thermally conductive polymer compositions

Publications (3)

Publication Number Publication Date
JP2022517965A JP2022517965A (ja) 2022-03-11
JPWO2020146747A5 JPWO2020146747A5 (enExample) 2022-11-09
JP7561130B2 true JP7561130B2 (ja) 2024-10-03

Family

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JP2021539981A Active JP7561130B2 (ja) 2019-01-11 2020-01-10 電気絶縁及び熱伝導性ポリマー組成物

Country Status (5)

Country Link
US (1) US20220098409A1 (enExample)
EP (1) EP3908626A1 (enExample)
JP (1) JP7561130B2 (enExample)
CN (1) CN113574106A (enExample)
WO (1) WO2020146747A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022230970A1 (ja) * 2021-04-28 2022-11-03 パナソニックＩｐマネジメント株式会社 熱伝導性組成物及び熱伝導性材料

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014065769A (ja) 2012-09-25 2014-04-17 Tokai Rubber Ind Ltd エラストマー成形体およびその製造方法
JP2015044953A (ja) 2013-08-29 2015-03-12 デュポン株式会社 電気絶縁性および熱伝導性のポリマー組成物
JP2015178543A (ja) 2014-03-18 2015-10-08 河合石灰工業株式会社 高熱伝導性無機フィラー複合粒子及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090152491A1 (en) * 2007-11-16 2009-06-18 E. I. Du Pont De Nemours And Company Thermally conductive resin compositions
US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
WO2013090344A1 (en) * 2011-12-13 2013-06-20 Ferro Corporation Electrically conductive polymeric compositons, contacts, assemblies, and methods
US9434870B2 (en) * 2012-09-19 2016-09-06 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
EP3004229B1 (en) * 2013-06-04 2019-09-04 SABIC Global Technologies B.V. Polycarbonate based thermally conductive flame retardant polymer compositions
JP2015044718A (ja) * 2013-08-29 2015-03-12 デュポン株式会社 熱伝導性粒子の製造方法
JP6789220B2 (ja) * 2014-12-24 2020-11-25 モーメンティブ・パフォーマンス・マテリアルズ・インク 熱伝導性プラスチック組成物、熱伝導性プラスチックを製造するための押出装置および方法
WO2018130972A1 (en) * 2017-01-11 2018-07-19 Sabic Global Technologies B.V. Composition with thermal conductivity and laser plating performance by core-shell structure lds additive with metal compounds coated on mineral filler surface

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014065769A (ja) 2012-09-25 2014-04-17 Tokai Rubber Ind Ltd エラストマー成形体およびその製造方法
JP2015044953A (ja) 2013-08-29 2015-03-12 デュポン株式会社 電気絶縁性および熱伝導性のポリマー組成物
JP2015178543A (ja) 2014-03-18 2015-10-08 河合石灰工業株式会社 高熱伝導性無機フィラー複合粒子及びその製造方法

Also Published As

Publication number Publication date
CN113574106A (zh) 2021-10-29
WO2020146747A1 (en) 2020-07-16
JP2022517965A (ja) 2022-03-11
US20220098409A1 (en) 2022-03-31
EP3908626A1 (en) 2021-11-17

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