JP7556185B2 - メモリデバイスセルフリフレッシュ中の定期的キャリブレーション - Google Patents

メモリデバイスセルフリフレッシュ中の定期的キャリブレーション Download PDF

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Publication number
JP7556185B2
JP7556185B2 JP2019080457A JP2019080457A JP7556185B2 JP 7556185 B2 JP7556185 B2 JP 7556185B2 JP 2019080457 A JP2019080457 A JP 2019080457A JP 2019080457 A JP2019080457 A JP 2019080457A JP 7556185 B2 JP7556185 B2 JP 7556185B2
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Japan
Prior art keywords
memory device
calibration
self
refresh
driver
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JP2019080457A
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English (en)
Japanese (ja)
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JP2019212294A5 (enExample
JP2019212294A (ja
Inventor
イー. コックス クリストファー
ネイル ビル
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Intel Corp
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Intel Corp
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Publication of JP2019212294A5 publication Critical patent/JP2019212294A5/ja
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Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601Interfaces specially adapted for storage systems
    • G06F3/0628Interfaces specially adapted for storage systems making use of a particular technique
    • G06F3/0655Vertical data movement, i.e. input-output transfer; data movement between one or more hosts and one or more storage devices
    • G06F3/0659Command handling arrangements, e.g. command buffers, queues, command scheduling
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • G11C11/40615Internal triggering or timing of refresh, e.g. hidden refresh, self refresh, pseudo-SRAMs
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • G11C11/4093Input/output [I/O] data interface arrangements, e.g. data buffers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/02Detection or location of defective auxiliary circuits, e.g. defective refresh counters
    • G11C29/021Detection or location of defective auxiliary circuits, e.g. defective refresh counters in voltage or current generators
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/02Detection or location of defective auxiliary circuits, e.g. defective refresh counters
    • G11C29/022Detection or location of defective auxiliary circuits, e.g. defective refresh counters in I/O circuitry
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/02Detection or location of defective auxiliary circuits, e.g. defective refresh counters
    • G11C29/028Detection or location of defective auxiliary circuits, e.g. defective refresh counters with adaption or trimming of parameters
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1051Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
    • G11C7/1057Data output buffers, e.g. comprising level conversion circuits, circuits for adapting load
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2207/00Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
    • G11C2207/22Control and timing of internal memory operations
    • G11C2207/2254Calibration
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/02Detection or location of defective auxiliary circuits, e.g. defective refresh counters
    • G11C29/023Detection or location of defective auxiliary circuits, e.g. defective refresh counters in clock generator or timing circuitry

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Dram (AREA)
  • Memory System (AREA)
JP2019080457A 2018-06-06 2019-04-19 メモリデバイスセルフリフレッシュ中の定期的キャリブレーション Active JP7556185B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/001,869 US10692560B2 (en) 2018-06-06 2018-06-06 Periodic calibrations during memory device self refresh
US16/001,869 2018-06-06

Publications (3)

Publication Number Publication Date
JP2019212294A JP2019212294A (ja) 2019-12-12
JP2019212294A5 JP2019212294A5 (enExample) 2020-12-03
JP7556185B2 true JP7556185B2 (ja) 2024-09-26

Family

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Family Applications (1)

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JP2019080457A Active JP7556185B2 (ja) 2018-06-06 2019-04-19 メモリデバイスセルフリフレッシュ中の定期的キャリブレーション

Country Status (4)

Country Link
US (3) US10692560B2 (enExample)
JP (1) JP7556185B2 (enExample)
CN (1) CN110570886A (enExample)
DE (1) DE102019111632A1 (enExample)

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Publication number Priority date Publication date Assignee Title
US11163487B2 (en) * 2018-06-04 2021-11-02 Micron Technology, Inc. Methods for generating notifications for updated information from mode registers of a memory device to a host and memory devices and systems employing the same
US11217284B2 (en) * 2020-04-03 2022-01-04 Micron Technology, Inc. Memory with per pin input/output termination and driver impedance calibration
JP6890701B1 (ja) * 2020-05-19 2021-06-18 華邦電子股▲ふん▼有限公司Winbond Electronics Corp. コードシフト算出回路およびコードシフト値の算出方法
US11664062B2 (en) 2020-07-24 2023-05-30 Advanced Micro Devices, Inc. Memory calibration system and method
US11914905B1 (en) * 2021-07-15 2024-02-27 Xilinx, Inc. Memory self-refresh re-entry state

Citations (2)

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JP2011187115A (ja) 2010-03-08 2011-09-22 Elpida Memory Inc 半導体装置
JP2018511108A (ja) 2015-03-27 2018-04-19 インテル・コーポレーション センサデータ検出に基づくインピーダンス補償

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US7020818B2 (en) * 2004-03-08 2006-03-28 Intel Corporation Method and apparatus for PVT controller for programmable on die termination
US7454586B2 (en) 2005-03-30 2008-11-18 Intel Corporation Memory device commands
US9171585B2 (en) * 2005-06-24 2015-10-27 Google Inc. Configurable memory circuit system and method
US7432731B2 (en) * 2005-06-30 2008-10-07 Intel Corporation Method and apparatus to calibrate DRAM on resistance (Ron) and on-die termination (ODT) values over process, voltage and temperature (PVT) variations
US7562234B2 (en) 2005-08-25 2009-07-14 Apple Inc. Methods and apparatuses for dynamic power control
JP4916699B2 (ja) * 2005-10-25 2012-04-18 エルピーダメモリ株式会社 Zqキャリブレーション回路及びこれを備えた半導体装置
US7342411B2 (en) 2005-12-07 2008-03-11 Intel Corporation Dynamic on-die termination launch latency reduction
US7372293B2 (en) 2005-12-07 2008-05-13 Intel Corporation Polarity driven dynamic on-die termination
US7414426B2 (en) 2005-12-07 2008-08-19 Intel Corporation Time multiplexed dynamic on-die termination
JP4282713B2 (ja) * 2006-11-28 2009-06-24 エルピーダメモリ株式会社 キャリブレーション回路を有する半導体装置及びキャリブレーション方法
US20080197877A1 (en) 2007-02-16 2008-08-21 Intel Corporation Per byte lane dynamic on-die termination
US8949520B2 (en) * 2009-01-22 2015-02-03 Rambus Inc. Maintenance operations in a DRAM
US8307270B2 (en) * 2009-09-03 2012-11-06 International Business Machines Corporation Advanced memory device having improved performance, reduced power and increased reliability
KR20180077341A (ko) 2012-03-27 2018-07-06 인텔 코포레이션 리프레시 모드들 동안의 메모리 디바이스들에서의 전력 소비의 감소
US9780782B2 (en) 2014-07-23 2017-10-03 Intel Corporation On-die termination control without a dedicated pin in a multi-rank system
US9811420B2 (en) 2015-03-27 2017-11-07 Intel Corporation Extracting selective information from on-die dynamic random access memory (DRAM) error correction code (ECC)
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Publication number Priority date Publication date Assignee Title
JP2011187115A (ja) 2010-03-08 2011-09-22 Elpida Memory Inc 半導体装置
JP2018511108A (ja) 2015-03-27 2018-04-19 インテル・コーポレーション センサデータ検出に基づくインピーダンス補償

Also Published As

Publication number Publication date
DE102019111632A1 (de) 2019-12-12
CN110570886A (zh) 2019-12-13
US20210005245A1 (en) 2021-01-07
US20190043557A1 (en) 2019-02-07
US11276453B2 (en) 2022-03-15
US10692560B2 (en) 2020-06-23
US20220157374A1 (en) 2022-05-19
JP2019212294A (ja) 2019-12-12
US11790976B2 (en) 2023-10-17

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