JP7553752B1 - 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 - Google Patents

熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 Download PDF

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JP7553752B1
JP7553752B1 JP2024543036A JP2024543036A JP7553752B1 JP 7553752 B1 JP7553752 B1 JP 7553752B1 JP 2024543036 A JP2024543036 A JP 2024543036A JP 2024543036 A JP2024543036 A JP 2024543036A JP 7553752 B1 JP7553752 B1 JP 7553752B1
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thermally conductive
component
mass
conductive composition
parts
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JPWO2025052715A5 (https=
JPWO2025052715A1 (https=
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優希 神谷
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Fuji Polymer Industries Co Ltd
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Fuji Polymer Industries Co Ltd
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Priority claimed from PCT/JP2024/015823 external-priority patent/WO2025052715A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2024543036A 2023-09-06 2024-04-23 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 Active JP7553752B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023144286 2023-09-06
JP2023144286 2023-09-06
PCT/JP2024/015823 WO2025052715A1 (ja) 2023-09-06 2024-04-23 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法

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JP7553752B1 true JP7553752B1 (ja) 2024-09-18
JPWO2025052715A1 JPWO2025052715A1 (https=) 2025-03-13
JPWO2025052715A5 JPWO2025052715A5 (https=) 2025-08-14

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CN (1) CN121532463A (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002322372A (ja) * 2001-04-26 2002-11-08 Denki Kagaku Kogyo Kk 樹脂組成物およびそれを用いた金属ベース回路基板
JP2005054099A (ja) * 2003-08-06 2005-03-03 Denki Kagaku Kogyo Kk 熱伝導性グリース
WO2017203924A1 (ja) * 2016-05-24 2017-11-30 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2020137086A1 (ja) * 2018-12-25 2020-07-02 富士高分子工業株式会社 熱伝導組成物及びこれを用いた熱伝導性シート
WO2023119903A1 (ja) * 2021-12-23 2023-06-29 株式会社レゾナック 熱伝導組成物及びその硬化物
WO2023135857A1 (ja) * 2022-01-14 2023-07-20 富士高分子工業株式会社 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002322372A (ja) * 2001-04-26 2002-11-08 Denki Kagaku Kogyo Kk 樹脂組成物およびそれを用いた金属ベース回路基板
JP2005054099A (ja) * 2003-08-06 2005-03-03 Denki Kagaku Kogyo Kk 熱伝導性グリース
WO2017203924A1 (ja) * 2016-05-24 2017-11-30 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2020137086A1 (ja) * 2018-12-25 2020-07-02 富士高分子工業株式会社 熱伝導組成物及びこれを用いた熱伝導性シート
WO2023119903A1 (ja) * 2021-12-23 2023-06-29 株式会社レゾナック 熱伝導組成物及びその硬化物
WO2023135857A1 (ja) * 2022-01-14 2023-07-20 富士高分子工業株式会社 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法

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CN121532463A (zh) 2026-02-13
JPWO2025052715A1 (https=) 2025-03-13

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