JP7552503B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7552503B2
JP7552503B2 JP2021088993A JP2021088993A JP7552503B2 JP 7552503 B2 JP7552503 B2 JP 7552503B2 JP 2021088993 A JP2021088993 A JP 2021088993A JP 2021088993 A JP2021088993 A JP 2021088993A JP 7552503 B2 JP7552503 B2 JP 7552503B2
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JP
Japan
Prior art keywords
substrate
metal body
wiring
semiconductor element
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021088993A
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English (en)
Japanese (ja)
Other versions
JP2022181822A (ja
JP2022181822A5 (cg-RX-API-DMAC10.html
Inventor
翔一朗 大前
知巳 奥村
崇功 川島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2021088993A priority Critical patent/JP7552503B2/ja
Priority to CN202280028950.8A priority patent/CN117157759A/zh
Priority to PCT/JP2022/018373 priority patent/WO2022249813A1/ja
Publication of JP2022181822A publication Critical patent/JP2022181822A/ja
Publication of JP2022181822A5 publication Critical patent/JP2022181822A5/ja
Priority to US18/504,307 priority patent/US12635589B2/en
Priority to JP2024150726A priority patent/JP7711822B2/ja
Application granted granted Critical
Publication of JP7552503B2 publication Critical patent/JP7552503B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021088993A 2021-05-27 2021-05-27 半導体装置 Active JP7552503B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021088993A JP7552503B2 (ja) 2021-05-27 2021-05-27 半導体装置
CN202280028950.8A CN117157759A (zh) 2021-05-27 2022-04-21 半导体装置
PCT/JP2022/018373 WO2022249813A1 (ja) 2021-05-27 2022-04-21 半導体装置
US18/504,307 US12635589B2 (en) 2021-05-27 2023-11-08 Semiconductor device
JP2024150726A JP7711822B2 (ja) 2021-05-27 2024-09-02 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021088993A JP7552503B2 (ja) 2021-05-27 2021-05-27 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024150726A Division JP7711822B2 (ja) 2021-05-27 2024-09-02 半導体装置

Publications (3)

Publication Number Publication Date
JP2022181822A JP2022181822A (ja) 2022-12-08
JP2022181822A5 JP2022181822A5 (cg-RX-API-DMAC10.html) 2023-06-13
JP7552503B2 true JP7552503B2 (ja) 2024-09-18

Family

ID=84228690

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021088993A Active JP7552503B2 (ja) 2021-05-27 2021-05-27 半導体装置
JP2024150726A Active JP7711822B2 (ja) 2021-05-27 2024-09-02 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024150726A Active JP7711822B2 (ja) 2021-05-27 2024-09-02 半導体装置

Country Status (4)

Country Link
US (1) US12635589B2 (cg-RX-API-DMAC10.html)
JP (2) JP7552503B2 (cg-RX-API-DMAC10.html)
CN (1) CN117157759A (cg-RX-API-DMAC10.html)
WO (1) WO2022249813A1 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
WO2022248068A1 (en) * 2021-05-28 2022-12-01 Dynex Semiconductor Limited Semiconductor device
IT202200006563A1 (it) * 2022-04-01 2023-10-01 St Microelectronics Srl Dispositivo elettronico incapsulato comprendente una pluralita' di transistori di potenza
JP2024024288A (ja) * 2022-08-09 2024-02-22 富士電機株式会社 半導体モジュールの製造方法
KR20240028223A (ko) * 2022-08-24 2024-03-05 현대자동차주식회사 차량용 파워 모듈
US12122251B2 (en) 2022-09-28 2024-10-22 BorgWarner US Technologies LLC Systems and methods for bidirectional message architecture for inverter for electric vehicle
US12696774B2 (en) * 2023-04-26 2026-07-28 Renesas Electronics Corporation Semiconductor device and control system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114176A (ja) 2009-11-27 2011-06-09 Mitsubishi Electric Corp パワー半導体装置
JP2019067951A (ja) 2017-10-02 2019-04-25 トヨタ自動車株式会社 半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021254A (ja) 2011-07-14 2013-01-31 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP5661052B2 (ja) 2012-01-18 2015-01-28 三菱電機株式会社 パワー半導体モジュールおよびその製造方法
JP6252293B2 (ja) 2014-03-26 2017-12-27 株式会社デンソー 半導体装置
DE102016121801B4 (de) 2016-11-14 2022-03-17 Infineon Technologies Ag Baugruppe mit Verbindungen, die verschiedene Schmelztemperaturen aufweisen, Fahrzeug mit der Baugruppe und Verfahren zum Herstellen derselben und Verwendung der Baugruppe für eine Automobilanwendung
JP7040032B2 (ja) 2018-01-17 2022-03-23 株式会社デンソー 半導体装置
JP7248133B2 (ja) 2019-09-13 2023-03-29 株式会社デンソー 半導体装置
JP7563295B2 (ja) 2021-05-27 2024-10-08 株式会社デンソー 半導体装置
JP7472852B2 (ja) 2021-05-27 2024-04-23 株式会社デンソー 半導体装置
JP7512953B2 (ja) 2021-05-27 2024-07-09 株式会社デンソー 半導体装置
JP7585969B2 (ja) 2021-05-27 2024-11-19 株式会社デンソー 半導体装置
JP7563296B2 (ja) 2021-05-27 2024-10-08 株式会社デンソー 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114176A (ja) 2009-11-27 2011-06-09 Mitsubishi Electric Corp パワー半導体装置
JP2019067951A (ja) 2017-10-02 2019-04-25 トヨタ自動車株式会社 半導体装置

Also Published As

Publication number Publication date
JP2022181822A (ja) 2022-12-08
US20240079372A1 (en) 2024-03-07
WO2022249813A1 (ja) 2022-12-01
US12635589B2 (en) 2026-05-19
JP2024163192A (ja) 2024-11-21
CN117157759A (zh) 2023-12-01
JP7711822B2 (ja) 2025-07-23

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