CN117157759A - 半导体装置 - Google Patents

半导体装置 Download PDF

Info

Publication number
CN117157759A
CN117157759A CN202280028950.8A CN202280028950A CN117157759A CN 117157759 A CN117157759 A CN 117157759A CN 202280028950 A CN202280028950 A CN 202280028950A CN 117157759 A CN117157759 A CN 117157759A
Authority
CN
China
Prior art keywords
substrate
semiconductor element
wiring
metal body
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280028950.8A
Other languages
English (en)
Chinese (zh)
Inventor
大前翔一朗
奥村知巳
川岛崇功
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN117157759A publication Critical patent/CN117157759A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202280028950.8A 2021-05-27 2022-04-21 半导体装置 Pending CN117157759A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-088993 2021-05-27
JP2021088993A JP7552503B2 (ja) 2021-05-27 2021-05-27 半導体装置
PCT/JP2022/018373 WO2022249813A1 (ja) 2021-05-27 2022-04-21 半導体装置

Publications (1)

Publication Number Publication Date
CN117157759A true CN117157759A (zh) 2023-12-01

Family

ID=84228690

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280028950.8A Pending CN117157759A (zh) 2021-05-27 2022-04-21 半导体装置

Country Status (4)

Country Link
US (1) US12635589B2 (cg-RX-API-DMAC10.html)
JP (2) JP7552503B2 (cg-RX-API-DMAC10.html)
CN (1) CN117157759A (cg-RX-API-DMAC10.html)
WO (1) WO2022249813A1 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
WO2022248068A1 (en) * 2021-05-28 2022-12-01 Dynex Semiconductor Limited Semiconductor device
IT202200006563A1 (it) * 2022-04-01 2023-10-01 St Microelectronics Srl Dispositivo elettronico incapsulato comprendente una pluralita' di transistori di potenza
JP2024024288A (ja) * 2022-08-09 2024-02-22 富士電機株式会社 半導体モジュールの製造方法
KR20240028223A (ko) * 2022-08-24 2024-03-05 현대자동차주식회사 차량용 파워 모듈
US12122251B2 (en) 2022-09-28 2024-10-22 BorgWarner US Technologies LLC Systems and methods for bidirectional message architecture for inverter for electric vehicle
US12696774B2 (en) * 2023-04-26 2026-07-28 Renesas Electronics Corporation Semiconductor device and control system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114176A (ja) * 2009-11-27 2011-06-09 Mitsubishi Electric Corp パワー半導体装置
JP2013021254A (ja) 2011-07-14 2013-01-31 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP5661052B2 (ja) 2012-01-18 2015-01-28 三菱電機株式会社 パワー半導体モジュールおよびその製造方法
JP6252293B2 (ja) 2014-03-26 2017-12-27 株式会社デンソー 半導体装置
DE102016121801B4 (de) 2016-11-14 2022-03-17 Infineon Technologies Ag Baugruppe mit Verbindungen, die verschiedene Schmelztemperaturen aufweisen, Fahrzeug mit der Baugruppe und Verfahren zum Herstellen derselben und Verwendung der Baugruppe für eine Automobilanwendung
JP6988345B2 (ja) * 2017-10-02 2022-01-05 株式会社デンソー 半導体装置
JP7040032B2 (ja) 2018-01-17 2022-03-23 株式会社デンソー 半導体装置
JP7248133B2 (ja) 2019-09-13 2023-03-29 株式会社デンソー 半導体装置
JP7563295B2 (ja) 2021-05-27 2024-10-08 株式会社デンソー 半導体装置
JP7472852B2 (ja) 2021-05-27 2024-04-23 株式会社デンソー 半導体装置
JP7512953B2 (ja) 2021-05-27 2024-07-09 株式会社デンソー 半導体装置
JP7585969B2 (ja) 2021-05-27 2024-11-19 株式会社デンソー 半導体装置
JP7563296B2 (ja) 2021-05-27 2024-10-08 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
JP2022181822A (ja) 2022-12-08
US20240079372A1 (en) 2024-03-07
JP7552503B2 (ja) 2024-09-18
WO2022249813A1 (ja) 2022-12-01
US12635589B2 (en) 2026-05-19
JP2024163192A (ja) 2024-11-21
JP7711822B2 (ja) 2025-07-23

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