JP7550018B2 - 処理方法及び処理システム - Google Patents

処理方法及び処理システム Download PDF

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JP7550018B2
JP7550018B2 JP2020180467A JP2020180467A JP7550018B2 JP 7550018 B2 JP7550018 B2 JP 7550018B2 JP 2020180467 A JP2020180467 A JP 2020180467A JP 2020180467 A JP2020180467 A JP 2020180467A JP 7550018 B2 JP7550018 B2 JP 7550018B2
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substrate
cutting
wafer
thickness
laser light
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JP2022071480A (ja
JP2022071480A5 (enrdf_load_stackoverflow
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晋 早川
陽平 山下
康隆 溝本
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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JP2020180467A 2020-10-28 2020-10-28 処理方法及び処理システム Active JP7550018B2 (ja)

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JP2022071480A JP2022071480A (ja) 2022-05-16
JP2022071480A5 JP2022071480A5 (enrdf_load_stackoverflow) 2023-06-06
JP7550018B2 true JP7550018B2 (ja) 2024-09-12

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Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
WO2025158931A1 (ja) * 2024-01-23 2025-07-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001313380A (ja) 2000-04-27 2001-11-09 Mitsubishi Materials Silicon Corp 張り合わせ基板およびその製造方法
JP2011142201A (ja) 2010-01-07 2011-07-21 Okamoto Machine Tool Works Ltd 半導体基板の平坦化加工装置および平坦化加工方法
JP2011523779A (ja) 2008-09-02 2011-08-18 エス． オー． アイ． テック シリコン オン インシュレーター テクノロジーズ 混合トリミング方法
JP2014229650A (ja) 2013-05-20 2014-12-08 株式会社ディスコ ウェーハの加工方法
JP2017204555A (ja) 2016-05-11 2017-11-16 株式会社ディスコ 切削方法
WO2019176589A1 (ja) 2018-03-14 2019-09-19 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3352129B2 (ja) * 1992-12-04 2002-12-03 株式会社東芝 半導体基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001313380A (ja) 2000-04-27 2001-11-09 Mitsubishi Materials Silicon Corp 張り合わせ基板およびその製造方法
JP2011523779A (ja) 2008-09-02 2011-08-18 エス． オー． アイ． テック シリコン オン インシュレーター テクノロジーズ 混合トリミング方法
JP2011142201A (ja) 2010-01-07 2011-07-21 Okamoto Machine Tool Works Ltd 半導体基板の平坦化加工装置および平坦化加工方法
JP2014229650A (ja) 2013-05-20 2014-12-08 株式会社ディスコ ウェーハの加工方法
JP2017204555A (ja) 2016-05-11 2017-11-16 株式会社ディスコ 切削方法
WO2019176589A1 (ja) 2018-03-14 2019-09-19 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体

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