JP7548743B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP7548743B2
JP7548743B2 JP2020124231A JP2020124231A JP7548743B2 JP 7548743 B2 JP7548743 B2 JP 7548743B2 JP 2020124231 A JP2020124231 A JP 2020124231A JP 2020124231 A JP2020124231 A JP 2020124231A JP 7548743 B2 JP7548743 B2 JP 7548743B2
Authority
JP
Japan
Prior art keywords
substrate
layer
sealing resin
wiring
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020124231A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022020941A5 (https=
JP2022020941A (ja
Inventor
啓 村山
光浩 相澤
周 金子
淳 大井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2020124231A priority Critical patent/JP7548743B2/ja
Priority to US17/376,478 priority patent/US11817381B2/en
Priority to EP21186343.6A priority patent/EP3944310A1/en
Publication of JP2022020941A publication Critical patent/JP2022020941A/ja
Publication of JP2022020941A5 publication Critical patent/JP2022020941A5/ja
Application granted granted Critical
Publication of JP7548743B2 publication Critical patent/JP7548743B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2020124231A 2020-07-21 2020-07-21 半導体装置 Active JP7548743B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020124231A JP7548743B2 (ja) 2020-07-21 2020-07-21 半導体装置
US17/376,478 US11817381B2 (en) 2020-07-21 2021-07-15 Semiconductor device
EP21186343.6A EP3944310A1 (en) 2020-07-21 2021-07-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020124231A JP7548743B2 (ja) 2020-07-21 2020-07-21 半導体装置

Publications (3)

Publication Number Publication Date
JP2022020941A JP2022020941A (ja) 2022-02-02
JP2022020941A5 JP2022020941A5 (https=) 2023-06-08
JP7548743B2 true JP7548743B2 (ja) 2024-09-10

Family

ID=77358057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020124231A Active JP7548743B2 (ja) 2020-07-21 2020-07-21 半導体装置

Country Status (3)

Country Link
US (1) US11817381B2 (https=)
EP (1) EP3944310A1 (https=)
JP (1) JP7548743B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7760360B2 (ja) * 2021-12-23 2025-10-27 新光電気工業株式会社 半導体装置
US20240096725A1 (en) * 2022-09-17 2024-03-21 Amkor Technology Singapore Holding Pte. Ltd. Electronic devices and methods of manufacturing electronic devices
DE102022128625A1 (de) * 2022-10-28 2024-05-08 Rolls-Royce Deutschland Ltd & Co Kg Elektrisches Modul und Verfahren zur Herstellung eines elektrischen Moduls
US20240164008A1 (en) * 2022-11-11 2024-05-16 Industrial Technology Research Institute Molded electronic assembly
DE102023210595A1 (de) * 2023-10-26 2025-04-30 Robert Bosch Gesellschaft mit beschränkter Haftung Leistungsmodul mit einem Schaltungsträger
JP2025087205A (ja) * 2023-11-29 2025-06-10 新光電気工業株式会社 半導体装置
DE102024201721A1 (de) 2024-02-26 2025-08-28 Robert Bosch Gesellschaft mit beschränkter Haftung Leistungsmodul mit einem Trägersubstrat und einer elektrischen Isolationsschicht

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103231A (ja) 2008-10-22 2010-05-06 Denso Corp 電子装置
JP2012191010A (ja) 2011-03-10 2012-10-04 Fuji Electric Co Ltd 半導体装置およびその製造方法
US20170064808A1 (en) 2015-09-02 2017-03-02 Stmicroelectronics S.R.L. Electronic power module with enhanced thermal dissipation and manufacturing method thereof
JP2018181959A (ja) 2017-04-06 2018-11-15 三菱電機株式会社 電力用半導体装置およびその製造方法、ならびに電力変換装置
JP2019083234A (ja) 2017-10-27 2019-05-30 新光電気工業株式会社 半導体装置及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5527330B2 (ja) 2010-01-05 2014-06-18 富士電機株式会社 半導体装置用ユニットおよび半導体装置
JP5387620B2 (ja) 2011-05-31 2014-01-15 株式会社安川電機 電力変換装置、半導体装置および電力変換装置の製造方法
KR101926854B1 (ko) 2012-02-09 2018-12-07 후지 덴키 가부시키가이샤 반도체 장치
WO2014115561A1 (ja) 2013-01-25 2014-07-31 富士電機株式会社 半導体装置
JP6369228B2 (ja) 2014-08-29 2018-08-08 富士電機株式会社 半導体装置
JP7021854B2 (ja) 2017-01-24 2022-02-17 ゼネラル・エレクトリック・カンパニイ 電力用電子回路パッケージおよびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103231A (ja) 2008-10-22 2010-05-06 Denso Corp 電子装置
JP2012191010A (ja) 2011-03-10 2012-10-04 Fuji Electric Co Ltd 半導体装置およびその製造方法
US20170064808A1 (en) 2015-09-02 2017-03-02 Stmicroelectronics S.R.L. Electronic power module with enhanced thermal dissipation and manufacturing method thereof
JP2018181959A (ja) 2017-04-06 2018-11-15 三菱電機株式会社 電力用半導体装置およびその製造方法、ならびに電力変換装置
JP2019083234A (ja) 2017-10-27 2019-05-30 新光電気工業株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
EP3944310A1 (en) 2022-01-26
US20220028774A1 (en) 2022-01-27
US11817381B2 (en) 2023-11-14
JP2022020941A (ja) 2022-02-02

Similar Documents

Publication Publication Date Title
JP7548743B2 (ja) 半導体装置
KR100533673B1 (ko) 반도체 장치 및 그 제조 방법, 회로 기판 및 전자 기기
JP3994262B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP4614586B2 (ja) 混成集積回路装置の製造方法
JP2004235310A (ja) 半導体装置およびその製造方法
CN100562999C (zh) 电路模块
JP7123688B2 (ja) 半導体装置及びその製造方法
JP4614584B2 (ja) 混成集積回路装置およびその製造方法
CN101026110B (zh) 电路装置的制造方法
CN100426496C (zh) 半导体器件及其制造方法
WO2019111873A1 (ja) モジュール
US20150235937A1 (en) Method For Manufacturing Semiconductor Device Using Mold Having Resin Dam And Semiconductor Device
JP7760360B2 (ja) 半導体装置
JP2006134912A (ja) 半導体モジュールおよびその製造方法、ならびにフィルムインターポーザ
JP2009135391A (ja) 電子装置およびその製造方法
US12519047B2 (en) Semiconductor device
JP2005044989A (ja) 半導体パッケージ及びその製造方法
US11450623B2 (en) Semiconductor device
JP2677242B2 (ja) 半導体装置及びその製造方法
JP7310161B2 (ja) 半導体装置及びその製造方法
WO2017043480A1 (ja) 半導体パッケージ
JP4942452B2 (ja) 回路装置
JP2001127245A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
US20250105197A1 (en) Semiconductor device and method for manufacturing semiconductor device
JP2008270511A (ja) 電子装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230531

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230531

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240326

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240328

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240522

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240806

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240829

R150 Certificate of patent or registration of utility model

Ref document number: 7548743

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150