JP7535933B2 - 現像方法及び基板処理システム - Google Patents

現像方法及び基板処理システム Download PDF

Info

Publication number
JP7535933B2
JP7535933B2 JP2020208980A JP2020208980A JP7535933B2 JP 7535933 B2 JP7535933 B2 JP 7535933B2 JP 2020208980 A JP2020208980 A JP 2020208980A JP 2020208980 A JP2020208980 A JP 2020208980A JP 7535933 B2 JP7535933 B2 JP 7535933B2
Authority
JP
Japan
Prior art keywords
substrate
cleaning liquid
wafer
supplying
developer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020208980A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022096081A (ja
Inventor
佑矢 亀井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2020208980A priority Critical patent/JP7535933B2/ja
Priority to TW110145181A priority patent/TW202230042A/zh
Priority to KR1020210172782A priority patent/KR20220088311A/ko
Priority to US17/544,058 priority patent/US12339593B2/en
Priority to CN202111484050.8A priority patent/CN114647159A/zh
Publication of JP2022096081A publication Critical patent/JP2022096081A/ja
Priority to JP2024129764A priority patent/JP7746487B2/ja
Application granted granted Critical
Publication of JP7535933B2 publication Critical patent/JP7535933B2/ja
Priority to US19/221,720 priority patent/US20250291264A1/en
Priority to JP2025153943A priority patent/JP2025172174A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/325—Non-aqueous compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Emergency Medicine (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Plasma & Fusion (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2020208980A 2020-12-17 2020-12-17 現像方法及び基板処理システム Active JP7535933B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2020208980A JP7535933B2 (ja) 2020-12-17 2020-12-17 現像方法及び基板処理システム
TW110145181A TW202230042A (zh) 2020-12-17 2021-12-03 顯像方法及基板處理系統
KR1020210172782A KR20220088311A (ko) 2020-12-17 2021-12-06 현상 방법 및 기판 처리 시스템
CN202111484050.8A CN114647159A (zh) 2020-12-17 2021-12-07 显影方法和基片处理系统
US17/544,058 US12339593B2 (en) 2020-12-17 2021-12-07 Developing method and substrate treatment system
JP2024129764A JP7746487B2 (ja) 2020-12-17 2024-08-06 基板処理方法及び基板処理システム
US19/221,720 US20250291264A1 (en) 2020-12-17 2025-05-29 Developing method and substrate treatment system
JP2025153943A JP2025172174A (ja) 2020-12-17 2025-09-17 基板処理方法及び基板処理システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020208980A JP7535933B2 (ja) 2020-12-17 2020-12-17 現像方法及び基板処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024129764A Division JP7746487B2 (ja) 2020-12-17 2024-08-06 基板処理方法及び基板処理システム

Publications (2)

Publication Number Publication Date
JP2022096081A JP2022096081A (ja) 2022-06-29
JP7535933B2 true JP7535933B2 (ja) 2024-08-19

Family

ID=81991841

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020208980A Active JP7535933B2 (ja) 2020-12-17 2020-12-17 現像方法及び基板処理システム
JP2024129764A Active JP7746487B2 (ja) 2020-12-17 2024-08-06 基板処理方法及び基板処理システム
JP2025153943A Pending JP2025172174A (ja) 2020-12-17 2025-09-17 基板処理方法及び基板処理システム

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024129764A Active JP7746487B2 (ja) 2020-12-17 2024-08-06 基板処理方法及び基板処理システム
JP2025153943A Pending JP2025172174A (ja) 2020-12-17 2025-09-17 基板処理方法及び基板処理システム

Country Status (5)

Country Link
US (2) US12339593B2 (enExample)
JP (3) JP7535933B2 (enExample)
KR (1) KR20220088311A (enExample)
CN (1) CN114647159A (enExample)
TW (1) TW202230042A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7736435B2 (ja) * 2021-03-04 2025-09-09 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、及び電子部品
KR20250116754A (ko) * 2023-01-10 2025-08-01 후지필름 가부시키가이샤 처리액, 처리액 수용체
KR20250111202A (ko) * 2023-01-10 2025-07-22 후지필름 가부시키가이샤 처리액, 처리액 수용체
WO2024150515A1 (ja) * 2023-01-10 2024-07-18 富士フイルム株式会社 薬液、薬液収容体
TW202507412A (zh) 2023-01-23 2025-02-16 日商東京威力科創股份有限公司 基板處理方法、基板處理裝置及電腦記錄媒體
TW202503038A (zh) * 2023-05-25 2025-01-16 日商東京威力科創股份有限公司 顯影方法及基板處理系統
CN119065214A (zh) 2023-06-01 2024-12-03 东京毅力科创株式会社 显影装置、基板处理系统以及显影方法
JP2025161482A (ja) 2024-04-12 2025-10-24 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ記憶媒体

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006059918A (ja) 2004-08-18 2006-03-02 Tokyo Electron Ltd 現像処理方法
WO2014088017A1 (ja) 2012-12-06 2014-06-12 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置
JP2015053459A (ja) 2013-09-09 2015-03-19 Hoya株式会社 レジストパターンの形成方法、及び、モールドの作製方法
WO2017130870A1 (ja) 2016-01-29 2017-08-03 日本ゼオン株式会社 重合体、ポジ型レジスト組成物、およびレジストパターン形成方法
JP2017147328A (ja) 2016-02-17 2017-08-24 株式会社Ｓｃｒｅｅｎホールディングス 現像ユニット、基板処理装置、現像方法および基板処理方法
WO2020210660A1 (en) 2019-04-12 2020-10-15 Inpria Corporation Organometallic photoresist developer compositions and processing methods

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7312085B2 (en) * 2002-04-01 2007-12-25 Fluidigm Corporation Microfluidic particle-analysis systems
JP6627954B2 (ja) 2018-11-20 2020-01-08 東京エレクトロン株式会社 塗布、現像方法、記憶媒体及び塗布、現像装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006059918A (ja) 2004-08-18 2006-03-02 Tokyo Electron Ltd 現像処理方法
WO2014088017A1 (ja) 2012-12-06 2014-06-12 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置
JP2015053459A (ja) 2013-09-09 2015-03-19 Hoya株式会社 レジストパターンの形成方法、及び、モールドの作製方法
WO2017130870A1 (ja) 2016-01-29 2017-08-03 日本ゼオン株式会社 重合体、ポジ型レジスト組成物、およびレジストパターン形成方法
JP2017147328A (ja) 2016-02-17 2017-08-24 株式会社Ｓｃｒｅｅｎホールディングス 現像ユニット、基板処理装置、現像方法および基板処理方法
WO2020210660A1 (en) 2019-04-12 2020-10-15 Inpria Corporation Organometallic photoresist developer compositions and processing methods

Also Published As

Publication number Publication date
US20220197159A1 (en) 2022-06-23
JP2024150767A (ja) 2024-10-23
JP7746487B2 (ja) 2025-09-30
CN114647159A (zh) 2022-06-21
US20250291264A1 (en) 2025-09-18
JP2022096081A (ja) 2022-06-29
TW202230042A (zh) 2022-08-01
KR20220088311A (ko) 2022-06-27
JP2025172174A (ja) 2025-11-20
US12339593B2 (en) 2025-06-24

Similar Documents

Publication Publication Date Title
JP7535933B2 (ja) 現像方法及び基板処理システム
TWI600056B (zh) Substrate cleaning device and substrate cleaning method
US8147153B2 (en) Rinsing method, developing method, developing system and computer-read storage medium
TWI826164B (zh) 光罩圖案形成方法、記憶媒體及基板處理裝置
TW201742112A (zh) 顯影單元、基板處理裝置、顯影方法及基板處理方法
US20090214985A1 (en) Method for reducing surface defects on patterned resist features
WO2017141736A1 (ja) 基板処理装置および基板処理方法
US20220068670A1 (en) Substrate processing method and substrate processing apparatus
KR101109902B1 (ko) 포토마스크의 제조 방법, 패턴 전사 방법, 포토마스크 기판용 처리 장치, 및 박막 패터닝 방법
TWI770046B (zh) 基板處理裝置及基板處理方法
JP2016051727A (ja) 基板処理方法、基板処理装置及び記録媒体
JP2007095888A (ja) リンス処理方法、現像処理方法及び現像装置
JP3320648B2 (ja) レジスト膜の形成方法及びレジスト膜の形成装置
KR20110066081A (ko) 현상 처리 방법 및 컴퓨터 기억 매체
JP2024103435A (ja) 基板処理方法及び基板処理装置
TW202403464A (zh) 基板處理方法、記錄媒體、及基板處理裝置
WO2024241937A1 (ja) 現像方法及び基板処理システム
JP3909028B2 (ja) 現像処理方法及び現像処理装置
CN121195329A (zh) 显影方法和基片处理系统
JP5018690B2 (ja) 塗布、現像方法及び塗布、現像装置。
US6513996B1 (en) Integrated equipment to drain water-hexane developer for pattern collapse
KR102075685B1 (ko) 포토 마스크 세정 장치 및 포토 마스크 세정 방법
US20240248413A1 (en) Substrate treatment method and substrate treatment apparatus
KR20060075861A (ko) 웨이퍼 경사면 세정장치
JP2002280292A (ja) 基板処理方法および現像処理方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230919

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240510

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240521

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240610

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240709

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240806

R150 Certificate of patent or registration of utility model

Ref document number: 7535933

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150