JP7520056B2 - 学習データ生成装置、不良識別システム - Google Patents

学習データ生成装置、不良識別システム Download PDF

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JP7520056B2
JP7520056B2 JP2021573621A JP2021573621A JP7520056B2 JP 7520056 B2 JP7520056 B2 JP 7520056B2 JP 2021573621 A JP2021573621 A JP 2021573621A JP 2021573621 A JP2021573621 A JP 2021573621A JP 7520056 B2 JP7520056 B2 JP 7520056B2
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JPWO2021152416A1 (https=
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達也 岡野
諒 中里
敦哉 鴇巣
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Semiconductor Energy Laboratory Co Ltd
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    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
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    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
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    • G06T2207/00—Indexing scheme for image analysis or image enhancement
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    • G06T2207/20212—Image combination
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    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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WO2023113773A1 (en) * 2021-12-14 2023-06-22 Hewlett-Packard Development Company, L.P. Manufacturing defect detection augmented training sets
JP2024080093A (ja) * 2022-12-01 2024-06-13 東レエンジニアリング株式会社 欠陥画像処理装置
JP2024080089A (ja) * 2022-12-01 2024-06-13 東レエンジニアリング株式会社 欠陥画像処理装置
JP2024116664A (ja) * 2023-02-16 2024-08-28 日立Astemo株式会社 外観検査装置および外観検査方法
KR102692224B1 (ko) * 2023-08-29 2024-08-06 (주)바질컴퍼니 위치 제어가 가능한 인공 결함 데이터 생성 방법
CN117152687B (zh) * 2023-10-31 2024-01-26 中国通信建设第三工程局有限公司 一种通信线路状态监测系统
WO2025196881A1 (ja) * 2024-03-18 2025-09-25 株式会社日立ハイテク 欠陥分類装置および欠陥分類方法

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US12322084B2 (en) 2025-06-03
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