JP7502162B2 - 接続部品、シールドモジュール、及び電子機器 - Google Patents
接続部品、シールドモジュール、及び電子機器 Download PDFInfo
- Publication number
- JP7502162B2 JP7502162B2 JP2020198996A JP2020198996A JP7502162B2 JP 7502162 B2 JP7502162 B2 JP 7502162B2 JP 2020198996 A JP2020198996 A JP 2020198996A JP 2020198996 A JP2020198996 A JP 2020198996A JP 7502162 B2 JP7502162 B2 JP 7502162B2
- Authority
- JP
- Japan
- Prior art keywords
- connection
- side wall
- mounting portion
- connection part
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003780 insertion Methods 0.000 claims description 52
- 230000037431 insertion Effects 0.000 claims description 52
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 19
- 230000005489 elastic deformation Effects 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 14
- 230000000694 effects Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 238000004891 communication Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/50—Bases; Cases formed as an integral body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
- H01R13/6595—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members with separate members fixing the shield to the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
回路基板に対して接続対象物を接続する接続部品であって、
前記接続対象物が挿入される挿入部と、
前記接続対象物と接触する弾性部と、
前記弾性部と接続され、前記弾性部が弾性変形する第1方向に沿って延在する側壁と、
前記側壁と接続され、前記回路基板に実装される実装部と、
を備える。
上記の接続部品と、
前記挿入部に挿入され、前記接続部品を介して前記回路基板に対し接続されている前記接続対象物と、
を備え、
前記接続対象物はシールドケースを含む。
上記の接続部品又は上記のシールドモジュールを備える。
10 接続部品
11 外周壁
12 天井壁
12a 吸着面
12b 第1天井壁
12c 第2天井壁
13 底壁
14 側壁
14a 第1側壁
14b 第2側壁
15 挿入部
15a 第1スリット
15b 開口
15c テーパ部
15d 支持部
15e 凹部
16 弾性部
16a 折返部
16b 延出部
16c 接触部
17 実装部
17X 第1実装部
17Y 第2実装部
17a 基片
17a1 第1基片
17a2 第2基片
17b 第2スリット
17c 第1屈曲片
17d 第2屈曲片
18 後壁
18a 第1後壁
18b 第2後壁
19 前壁
19a 第1前壁
19b 第2前壁
20 接続対象物
30 マウンター
CB 回路基板
E 端縁
G パターン
Claims (13)
- 回路基板に対して接続対象物を接続する接続部品であって、
前記接続対象物が挿入される挿入部と、
前記接続対象物と接触する弾性部と、
前記弾性部と接続され、前記弾性部が弾性変形する第1方向に沿って延在する側壁と、
前記側壁と接続され、前記回路基板に実装される実装部と、
を備え、
前記実装部は、前記側壁において前記実装部側に形成されている端縁から前記第1方向に直交する第2方向の内側に延出する基片と、前記第2方向に沿った前記基片の端縁から前記第1方向の外側に屈曲する第1屈曲片とを有する、
接続部品。 - 前記側壁において前記実装部と反対側に形成されている端縁から前記第2方向の内側に延出する天井壁を備える、
請求項1に記載の接続部品。 - 前記側壁は、前記第2方向に沿って前記弾性部を間に位置させ互いに対向する第1側壁及び第2側壁を含む、
請求項2に記載の接続部品。 - 前記弾性部と前記側壁とは前記天井壁を介して互いに接続されている、
請求項3に記載の接続部品。 - 前記弾性部は、前記天井壁から折り返して前記挿入部に張り出すように延出する、
請求項4に記載の接続部品。 - 前記挿入部は、前記天井壁から前記第1側壁及び前記第2側壁にわたり、前記第1方向及び前記第2方向に直交する前記接続対象物の挿入方向に沿って形成されている第1スリットを含む、
請求項5に記載の接続部品。 - 前記実装部は、前記接続対象物を前記挿入部に挿入する側から見たときに前記弾性部と重なり、前記弾性部よりも前記回路基板側に位置する、
請求項1乃至6のいずれか1項に記載の接続部品。 - 前記実装部は、前記基片において前記第1方向に延在する第2スリットを有する、
請求項1乃至7のいずれか1項に記載の接続部品。 - 前記実装部は、前記第2スリットを介して離間して互いに対向する、第1側壁と連続する第1実装部と、第2側壁と連続する第2実装部と、を有する、
請求項8に記載の接続部品。 - 前記実装部は、前記第2スリットに沿った前記基片の縁から前記第2方向の内側に屈曲する第2屈曲片を有する、
請求項9に記載の接続部品。 - 請求項1乃至10のいずれか1項に記載の接続部品と、
前記挿入部に挿入され、前記接続部品を介して前記回路基板に対し接続されている前記接続対象物と、
を備え、
前記接続対象物はシールドケースを含む、
シールドモジュール。 - 前記接続部品は、前記回路基板上に形成されたグランド電位となる導体パターンに接続される、
請求項11に記載のシールドモジュール。 - 請求項1乃至10のいずれか1項に記載の接続部品、請求項11又は12に記載のシールドモジュールを備える電子機器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020198996A JP7502162B2 (ja) | 2020-11-30 | 2020-11-30 | 接続部品、シールドモジュール、及び電子機器 |
US18/035,079 US20230402774A1 (en) | 2020-11-30 | 2021-11-10 | Connection component, shield module, and electronic device |
CN202180076622.0A CN116508211A (zh) | 2020-11-30 | 2021-11-10 | 连接部件、屏蔽模块以及电子设备 |
PCT/JP2021/041398 WO2022113743A1 (ja) | 2020-11-30 | 2021-11-10 | 接続部品、シールドモジュール、及び電子機器 |
EP21897717.1A EP4254673A1 (en) | 2020-11-30 | 2021-11-10 | Connection component, shield module, and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020198996A JP7502162B2 (ja) | 2020-11-30 | 2020-11-30 | 接続部品、シールドモジュール、及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022086795A JP2022086795A (ja) | 2022-06-09 |
JP7502162B2 true JP7502162B2 (ja) | 2024-06-18 |
Family
ID=81755916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020198996A Active JP7502162B2 (ja) | 2020-11-30 | 2020-11-30 | 接続部品、シールドモジュール、及び電子機器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230402774A1 (ja) |
EP (1) | EP4254673A1 (ja) |
JP (1) | JP7502162B2 (ja) |
CN (1) | CN116508211A (ja) |
WO (1) | WO2022113743A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010199151A (ja) | 2009-02-23 | 2010-09-09 | Kitagawa Ind Co Ltd | シールドボックス用の固定具 |
WO2012002503A1 (ja) | 2010-06-30 | 2012-01-05 | 北川工業株式会社 | 表面実装クリップ |
WO2012123811A2 (en) | 2011-03-11 | 2012-09-20 | Fci | Emi/esd shield clip |
JP2014072317A (ja) | 2012-09-28 | 2014-04-21 | Kitagawa Ind Co Ltd | 接触部材 |
JP2017183094A (ja) | 2016-03-30 | 2017-10-05 | 北川工業株式会社 | コンタクト |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2717929B2 (ja) * | 1994-03-11 | 1998-02-25 | 日本航空電子工業株式会社 | シールドケース用ソケットコネクタ |
JP7154579B2 (ja) | 2018-11-08 | 2022-10-18 | 北川工業株式会社 | コンタクト |
-
2020
- 2020-11-30 JP JP2020198996A patent/JP7502162B2/ja active Active
-
2021
- 2021-11-10 EP EP21897717.1A patent/EP4254673A1/en active Pending
- 2021-11-10 WO PCT/JP2021/041398 patent/WO2022113743A1/ja active Application Filing
- 2021-11-10 CN CN202180076622.0A patent/CN116508211A/zh active Pending
- 2021-11-10 US US18/035,079 patent/US20230402774A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010199151A (ja) | 2009-02-23 | 2010-09-09 | Kitagawa Ind Co Ltd | シールドボックス用の固定具 |
WO2012002503A1 (ja) | 2010-06-30 | 2012-01-05 | 北川工業株式会社 | 表面実装クリップ |
WO2012123811A2 (en) | 2011-03-11 | 2012-09-20 | Fci | Emi/esd shield clip |
JP2014072317A (ja) | 2012-09-28 | 2014-04-21 | Kitagawa Ind Co Ltd | 接触部材 |
JP2017183094A (ja) | 2016-03-30 | 2017-10-05 | 北川工業株式会社 | コンタクト |
Also Published As
Publication number | Publication date |
---|---|
EP4254673A1 (en) | 2023-10-04 |
JP2022086795A (ja) | 2022-06-09 |
US20230402774A1 (en) | 2023-12-14 |
CN116508211A (zh) | 2023-07-28 |
WO2022113743A1 (ja) | 2022-06-02 |
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