JP7457533B2 - processing equipment - Google Patents

Description

The present invention relates to a processing device for processing a wafer with a grindstone.

Conventionally, in the semiconductor manufacturing field, in order to form a semiconductor wafer such as a silicon wafer (hereinafter referred to as a "wafer") into a thin film, back grinding is performed to grind the back surface of the wafer (see, for example, Patent Document 1). .

Patent Document 1 discloses a grinding device in which a cup-shaped grindstone is attached to a spindle flange connected to the tip of a spindle. The cup-shaped grindstone is fastened to the spindle flange with about ten bolts (not shown), and is configured to be detachable from the spindle flange.

Japanese Patent Application Publication No. 11-309673

However, in the grinding device described in Patent Document 1, the cup-shaped grinding wheel is attached to the spindle flange by a worker manually tightening about 10 bolts, so attachment and detachment of the cup-shaped grinding wheel tends to be complicated. Met.

Furthermore, water such as slurry easily enters between the cup-shaped grindstone and the spindle flange, which are fastened with bolts. Therefore, conventionally, when replacing a worn grindstone, the cup-shaped grindstone and the spindle flange stick to each other due to the surface tension of water, making it difficult for the cup-shaped grindstone to come off the spindle flange. If you try to forcefully remove the chuck, you may hit the cup-shaped grindstone against the chuck, which may damage the chuck, or the cup-shaped grindstone may bite the spindle flange, making it impossible to remove it. Furthermore, as a result, maintenance time for the grinding device becomes longer, resulting in a problem in that the daily production amount of products decreases.

Therefore, a technical problem arises that must be solved in order to provide a processing device that allows the grindstone to be easily removed when replacing the grindstone, and the present invention aims to solve this problem.

The present invention has been proposed to achieve the above object, and the invention according to claim 1 is a processing apparatus for processing a wafer, which includes a disk-shaped spindle flange, and a surface of the spindle flange. A whetstone comprising: an annular base metal portion removably attached to the spindle flange in substantially close contact; and a whetstone portion installed on one surface of the base metal portion and integrated with the base metal portion; an air outlet that blows air to a place where the spindle flange and the base metal part are in close contact, the air outlet being in close contact with the base metal part in a horizontal direction, and the air outlet is in close contact with the base metal part in the first contact surface of the spindle flange. and a second contact surface of the spindle flange that is in close contact with the base metal portion in the vertical direction. The first air outlet blows out the air substantially perpendicularly to the direction in which the grinding wheel is attached/detached and along the first contact surface, and the first air outlet blows out the air along the first contact surface, and the second air outlet The blower outlet provides a processing device that blows out the air substantially parallel to the direction in which the grindstone is attached and detached and along the second contact surface .

According to this configuration, when the grinding wheel is removed for replacement or the like, air is blown out from the air outlet, and the air is blown to the contact area between the spindle flange and the base metal part. Then, a force that pulls the grinding wheel off from the spindle flange acts on the contact area between the spindle flange and the base metal part, and the grinding wheel can be easily removed from the spindle flange. Furthermore, when the grinding wheel is removed for replacement or the like, air is blown out from the first air outlet, and the air is blown out from the first air outlet, and a force that pulls the grinding wheel off from the spindle flange part acts. Furthermore, when air is blown out from the second air outlet, the blown out air acts on the grinding wheel in a direction that removes it from the spindle flange. Therefore, the force of the air blown out from the first air outlet and the force of the air blown out from the second air outlet allow the grinding wheel to be easily removed from the spindle flange.

A second aspect of the present invention provides the processing apparatus according to the first aspect, wherein an air circuit communicating with the air outlet is formed in the spindle flange.

With this configuration, the air circuit that communicates with the air outlet can be compactly installed inside the spindle flange by utilizing the available space inside the spindle flange. Therefore, the air circuit can be installed inside the processing device without significantly changing the shape of the processing device itself.

A third aspect of the present invention provides a processing apparatus according to the first or second aspect, further comprising an adjusting valve capable of adjusting a flow rate of air blown out from the air blowing port.

With this configuration, the flow rate of air blown out of the air outlet, i.e., the force of the air, can be adjusted using the adjustment valve to easily obtain the optimum force for removing the grinding wheel from the spindle flange.

According to the invention, when removing the grindstone for replacement or the like, the grindstone can be easily removed by blowing air from the air outlet to the place where the spindle flange and the base metal part are in close contact with each other and forcibly peeling off the grindstone from the spindle flange part. As a result, maintenance time for processing equipment can be shortened, and it is expected that the amount of products produced per day can be improved.

1 is a perspective view showing a schematic view of a processing device according to an embodiment of the present invention; FIG. 2 is a vertical cross-sectional side view showing the internal structure of the main unit and transport unit shown in FIG. 1. FIG. FIG. 2 is a perspective view of the grindstone applied to the processing device, as seen diagonally from below, with the grindstone attached to the lower surface of the spindle flange. FIG. 2 is a vertical cross-sectional view illustrating the structure of a spindle flange and a grindstone, showing the grindstone attached to the spindle flange. FIG. 2 is a vertical cross-sectional view illustrating the structure of the spindle flange and the grinding wheel, showing the grinding wheel removed from the spindle flange. 6 is an enlarged cross-sectional view of a part of the spindle flange shown in FIG. 5. FIG.

The present invention provides a processing apparatus for processing wafers in order to achieve the object of providing a processing apparatus in which the grindstone can be easily removed when replacing the grindstone. An annular base metal part that is removably attached to the spindle flange in substantially close contact with one surface of the spindle flange, and a grindstone part that is installed on one surface of the base metal part and is integrated with the base metal part. This was achieved by adopting a configuration that includes a grindstone and an air outlet that blows air to a place where the spindle flange and the base metal part are in close contact with each other.

EMBODIMENT OF THE INVENTION Hereinafter, one Example based on embodiment of this invention is described in detail based on an accompanying drawing. In addition, in the following examples, when referring to the number, numerical value, amount, range, etc. of constituent elements, unless it is specifically specified or it is clearly limited to a specific number in principle, the specific number The number is not limited, and may be more than or less than a certain number.

In addition, when referring to the shape or positional relationship of constituent elements, etc., unless it is specifically specified or it is clearly considered that it is not the case in principle, etc., we refer to things that are substantially similar to or similar to the shape, etc. include.

Further, in the drawings, characteristic parts may be enlarged or exaggerated in order to make the features easier to understand, and the dimensional ratios of the constituent elements are not necessarily the same as in reality. Further, in the cross-sectional views, hatching of some components may be omitted in order to make the cross-sectional structure of the components easier to understand.

In addition, in the following explanation, expressions indicating directions such as up and down and left and right are not absolute, and are appropriate when each part of the processing device of the present invention is depicted in a posture. If there is a change, the interpretation should be changed according to the change in posture. Further, the same elements are given the same reference numerals throughout the description of the embodiments.

1 and 2 show an example of a processing apparatus 10 according to an embodiment of the present invention. Note that FIG. 1 is a perspective view schematically showing the basic configuration of the processing apparatus 10, with the spindle feeding mechanism 11C and the transport unit 12 shown in FIG. 2 omitted. FIG. 2 is a longitudinal sectional side view showing the internal structure of the main unit 11 and the transport unit 12 shown in FIG.

In Figures 1 and 2, the processing device 10 polishes the back surface of a wafer W, specifically, the back surface (the surface opposite to the front surface on which devices are formed) of a substrate made of a hard-to-cut material such as sapphire or silicon carbide. However, the object to be processed by the processing device 10 is not limited to these, and may be, for example, glass or silicon, or a composite substrate attached to a support substrate.

The processing device 10 includes a main unit 11, a transport unit 12, and a control unit 13 that controls the overall operation of the processing device 10.

As shown in FIGS. 1 and 2, the main unit 11 includes an arch-shaped column 11A, a spindle 15 to which a grindstone 14 is attached, and three linear guides 11B that support the spindle 15 slidably in the vertical direction V. and a spindle feeding mechanism 11C that moves the spindle 15 up and down in the vertical direction V.

As shown in FIG. 1, the column 11A has an opening in the front surface 11Aa and a groove 11Ab that is recessed vertically through the vertical direction V.

The spindle 15 is housed in the groove 11Ab of the column 11A via the spindle casing 16 so as to be slidable in the up-down direction (vertical direction V). As shown in FIG. 2, the grinding wheel 14 is detachably attached to the spindle 15 via a spindle flange 17 connected to the lower end. Although not shown, the spindle 15 is rotated by a motor (not shown) and rotates together with the grinding wheel 14. The detailed configuration of the grinding wheel 14 and the spindle flange 17 will be described later.

As shown in FIG. 1, the linear guide 11B includes two left and right front linear guides 11Ba that support the front left and right ends of the spindle casing 16, which are disposed in front of the groove 11Ab in the column 11A, and One rear linear guide 11Bb is arranged at the rear part (rear surface) and supports the rear center of the spindle casing 16. The front linear guide 11Ba and the rear linear guide 11Bb are provided parallel to each other along the axis (vertical direction V) of the spindle 15. Thereby, the front linear guide 11Ba and the rear linear guide 11Bb function as guide rails for the spindle casing 16.

As shown in FIG. 2, the spindle feeding mechanism 11C includes a slider 18 connected to the spindle casing 16, a ball screw 19 that moves the spindle casing 16 up and down (in the vertical direction V), and a spindle motor 20 that rotates the ball screw 19. It is equipped with. When the spindle motor 20 is driven and the ball screw 19 rotates in the positive or negative direction, the slider 18 moves down or up in the vertical direction V together with the spindle casing 16 and the spindle 15, depending on the direction of rotation of the ball screw 19. As a result, the grindstone 14 attached to the lower end of the spindle 15 is also lowered or raised together, and the wafer W is ground by the lowering of the grindstone 14.

Further, the main unit 11 is provided with an in-process gauge (not shown) that measures the thickness of the wafer W. When the thickness of the wafer W measured by the in-process gauge reaches a desired value, the spindle motor 20 is driven to reversely rotate the ball screw 19, and the slider 18 moves up together with the spindle casing 16 and the spindle 15. Further, the grindstone 14 attached to the lower end of the spindle 15 is also separated from the wafer W.

The transport unit 12 includes a chuck table 21 that can hold the wafer W by suction, a slider 22 on which the chuck table 21 is placed, and a slider drive mechanism 23 that drives the slider 22.

The chuck table 21 is connected to a negative pressure source (not shown), and can hold the wafer W on the chuck table 21 by suction. Furthermore, the chuck table 21 is rotatable around the axis of the chuck table 21 by a chuck table motor 24 .

The slider drive mechanism 23 includes a slider 22, a rail 25, a belt/pulley mechanism 26, and a slider motor 27. The drive of the slider motor 27 is transmitted to the slider 22 via the belt/pulley mechanism 26, and the slider 22 can be slid together with the chuck table 21 on the rail 25 in the left-right direction in FIG. There is.

The operation of the processing device 10 is controlled by a control unit 13. The control unit 13 controls the components constituting the processing apparatus 10 according to predetermined procedures. The control unit 13 includes, for example, a CPU, a memory, and the like. Note that the functions of the control unit 13 may be realized by controlling using software, or may be realized by operating using hardware.

The processing apparatus 10 having such a configuration grinds the wafer W according to the following procedure under the control of the control unit 13. First, the wafer W is held on the chuck table 21 by suction.

Next, the wafer W is carried below the grinding wheel 14 by the slider 22, and then the spindle motor 20 is driven. When the spindle motor 20 is driven, the ball screw 19 rotates forward, and the spindle casing 16 connected to the slider 22 moves down together with the spindle 15 and grinding wheel 14, bringing the grinding wheel 14 close to the wafer W. The chuck table motor 24 is also driven in addition to the spindle motor 20, and the grinding wheel 14 and the chuck table 21 are rotated while the grinding wheel 14 is pressed against one surface (back surface) of the wafer W, and the wafer W is ground.

When the wafer W is ground to a desired thickness, the control unit 13 stops driving the spindle motor 20 and the chuck table motor 24, respectively. As a result, the rotation of the grindstone 14 and the chuck table 21 is also stopped.

Next, the spindle motor 20 is driven in the reverse direction, causing the ball screw 19 to rotate in the reverse direction. The reverse rotation of the ball screw 19 causes the spindle casing 16 connected to the spindle feed mechanism 11C to rise together with the spindle 15 and the grindstone 14, thereby separating the grindstone 14 from the wafer W. Next, the slider 22 transports the wafer W together with the chuck table 21 to the rear of the main unit 11 . Thereafter, the suction and holding of the wafer W by the chuck table 21 is released, and the grinding process of the wafer W by the processing apparatus 10 is completed.

Next, a mechanism for attaching and detaching the grindstone 14 to and from the spindle flange 17, particularly a mechanism for smoothly removing the grindstone 14 from the spindle flange 17, will be described in detail using FIGS. 3 to 6.

Figure 3 is a perspective view of the grinding wheel 14 attached to the underside of the spindle flange 17, viewed from below. Figures 4 and 5 are vertical cross-sectional views of Figure 3, with Figure 4 showing the grinding wheel 14 attached to the spindle flange 17 and Figure 5 showing the grinding wheel 14 removed from the spindle flange 17. Figure 6 is an enlarged view of a portion of the spindle flange 17 shown in Figure 5.

In Figures 3 to 6, the spindle flange 17 is connected and fixed to the lower end of the spindle 15 shown in Figure 2, is integral with the spindle 15, and is formed in a substantially circular plate shape.

A small diameter protrusion 17B is provided on the underside of the main body 17A of the spindle flange 17. The small diameter protrusion 17B has a circular shape with an outer diameter smaller than that of the main body 17A. The underside of the small diameter protrusion 17B has an inverted bowl-shaped recess 29 formed on the inner circumferential surface with an inclined surface 28 that gradually slopes upward from the lower opening toward the center. An inner plate 30 is disposed within the recess 29.

The inner plate 30 is a disc-shaped member that can be housed in the recess 29 of the spindle flange 17 in substantially close contact with the inner plate 30, and has an inclined surface 30a corresponding to the inclined surface 28 of the recess 29 on its outer peripheral surface. The inner plate 30 is housed in the recess 29 and attached to the lower side of the spindle flange 17 with bolts 31.

In addition, an air circuit 32 that carries air 100 is formed inside the main body 17A of the spindle flange 17. The air circuit 32 has a first air circuit 32a having an air supply port 33a that takes in air 100 and an air outlet 34a that is a first air outlet that blows the air 100 taken in from the air supply port 33a to the outside, and a second air circuit 32b having an air supply port 33b that also takes in air 100 and an air outlet 34b that is a second air outlet that blows the air 100 taken in from the air supply port 33b to the outside. The opening diameters of the air outlet 34a of the first air circuit 32a and the air outlet 34b of the second air circuit 32b are set smaller than the passage diameters of the circuits 32a and 32b, and are narrowed to increase the force of blowing out the air 100.

The air outlet 34a of the first air circuit 32a is formed at the boundary between the small diameter protrusion 17B and the main body 17A, and the air 100 is blown out from the base of the small diameter protrusion 17B along the outer circumferential bottom surface 17a of the main body 17A in a substantially horizontal direction, i.e., the air 100 is blown out substantially perpendicularly to the direction in which the grindstone 14 is attached and detached. On the other hand, the air outlet 34b of the second air circuit 32b is also formed at the boundary between the small diameter protrusion 17B and the main body 17A, and the air 100 is blown out from the base of the small diameter protrusion 17B along the outer circumferential surface 17b of the small diameter protrusion 17B in a substantially vertical direction, i.e., the air 100 is blown out substantially parallel to the direction in which the grindstone is attached and detached. The air outlets 34a of the first air circuit 32a and the air outlets 34b of the second air circuit 32b are preferably provided in a plurality of units each at substantially equal intervals in the circumferential direction.

Further, the air supply port 33a of the first air circuit 32a and the air supply port 33b of the second air circuit 32b are each connected to the air source 35. Furthermore, flow rate adjustment valves 36a and 36b that can adjust the flow rate of the air 100 are provided between the air source 35 and the air supply port 33a, and between the air source 35 and the air supply port 33b, respectively.

The whetstone 14 includes an annular base metal part 37 and a whetstone part 38 installed on one surface of the base metal part 37.

The base metal portion 37 is formed in an annular shape. Moreover, the cross section of the base metal part 37 has an inclined surface 37a, an inner circumferential surface 37b, an outer circumferential surface 37c, an upper surface 37d, and a lower surface 37e, and has a substantially pentagonal cross section. The inner diameter of the base metal portion 37 is approximately equal to the outer diameter of the small diameter protrusion 17B of the spindle flange 17, and the outer diameter is approximately equal to the outer diameter of the main body portion 17A of the spindle flange 17. The thickness of the base metal portion 37, that is, the height of the outer circumferential surface 37c is the outer circumference of the spindle flange 17 when the inner plate 30 is housed and attached in the recess 29 provided on the lower surface of the spindle flange 17. It is set larger than the amount of protrusion from the bottom surface 17a. The inclined surface 37a has an inclination angle of approximately 30 degrees, and is inclined downward from the inner circumferential surface 37b toward the outer circumferential side.

The grindstone portions 38 are installed on the underside 37e of the base metal portion 37 along the outer periphery of the base metal portion 37 and are integrated with the base metal portion 37.

When the grindstone 14 is attached to the spindle flange 17 and used, as shown in FIGS. It is fixedly attached to the spindle flange 17 using a mounting screw (not shown) in a state in which it is in close contact with the outer peripheral bottom surface 17a. Further, in this attached state, the inner circumferential surface 37b of the base metal portion 37 and the outer circumferential surface 17b of the small diameter protrusion 17B of the spindle flange 17 are also brought into substantially close contact.

In the processing apparatus 10 configured in this way, when water such as slurry is used during grinding, it is difficult to remove water between the outer peripheral bottom surface 17a of the spindle flange 17 and the upper surface 37d of the base metal part 37, and between the small diameter protrusion 17B. Water may enter between the outer circumferential surface 17b and the inner circumferential surface 37b of the base metal part 37. Water can enter between the outer peripheral bottom surface 17a of the spindle flange 17 and the upper surface 37d of the base metal part 37, and between the outer peripheral surface 17b of the small diameter protrusion 17B and the inner peripheral surface 37b of the base metal part 37, respectively. Adsorption force is generated by tension. Therefore, when replacing the grindstone 14 whose grindstone portion 38 has worn out, it may be difficult for the grindstone 14 to come off from the spindle flange 17 .

Therefore, in the processing apparatus 10 of the present embodiment, air 100 is blown out from the air circuit 32 under the control of the control unit 13, and the air 100 is blown out from the air circuit 32 to provide air between the outer peripheral bottom surface 17a of the spindle flange 17 and the upper surface 37d of the base metal part 37, and between the small diameter Air 100 is blown between the outer circumferential surface 17b of the protruding portion 17B and the inner circumferential surface 37b of the base metal portion 37, and the force of the blown air 100 weakens the surface tension etc. between the two and forcibly pulls them. It can be peeled off and removed easily.

More specifically, when removing the grindstone 14 from the spindle flange 17, first remove the mounting screw (not shown) that attaches the grindstone 14 to the spindle flange 17. Next, as shown in FIG. 4, air 100 is fed from the air source 35 into the first air circuit 32a through the air supply port 33a. The amount of air 100 sent is adjusted by the flow rate adjustment valve 36a. Furthermore, the air 100 sent into the first air circuit 32a is compressed within the first air circuit 32a, and flows from the air outlet 34a to the outer peripheral bottom surface 17a of the spindle flange 17 and the upper surface 37d of the base metal part 37. The water is sprayed substantially horizontally toward the space between the outer peripheral bottom surface 17a of the spindle flange 17 and the upper surface 37d of the base metal part 37, while blowing away the water and applying a peeling force. After the air 100 is supplied for a predetermined time, the supply of the air 100 into the first air circuit 32a is stopped.

Subsequently, as shown in FIG. 5, air 100 is fed from the air source 35 into the second air circuit 32b through the air supply port 33b. The amount of air 100 sent here is also adjusted by the flow rate adjustment valve 36b. Furthermore, the air 100 sent into the second air circuit 32b is compressed within the second air circuit 32b, and flows from the air outlet 34b between the outer peripheral surface 17b of the spindle flange 17 and the upper surface 37d of the base metal part 37. The water is sprayed substantially perpendicularly toward the grinding wheel 14 while blowing off the water between the outer circumferential surface 17b of the spindle flange 17 and the upper surface 37d of the base metal part 37, and applies a downward peeling force to the grindstone 14. This downward peeling force allows the grindstone 14 to be smoothly removed from the spindle flange 17. This allows the grindstone 14 to be replaced with another one.

Note that the position where the air outlet 43a communicating with the first air circuit 32a is provided and the position where the air outlet 43b communicating with the second air circuit 32b is provided are shifted by a predetermined interval in the circumferential direction, so that the air 100 blown out is If they do not interfere with each other, air 100 is simultaneously blown out from an air outlet 43a leading to the first air circuit 32a and an air outlet 43b leading to the second air circuit 32b, thereby imparting a peeling force to the grindstone 14. It is also possible to do so.

Therefore, according to the processing apparatus 10 of the present embodiment, when the whetstone 14 is removed for replacement or the like, when the air 100 is blown out from the air outlets 34a and 34b, the air 100 is delivered to the area where the spindle flange 17 and the base metal part 37 are in close contact with each other. The grindstone 14 can be forcibly peeled off from the spindle flange 17 and easily removed. As a result, maintenance time for the processing device 10 can be shortened, and it is expected that the daily production amount of products will be improved.

In addition, since an air circuit 32 having air outlets 34a, 34b is provided within the spindle flange 17, it can be provided compactly within the spindle flange 17, and the air circuit 32 can be provided without changing the size of the processing device 10.

The air circuit 32 also includes an air outlet 34a through which the air 100 is blown out substantially horizontally toward a place where the spindle flange 17 and the base metal part 37 are in close contact with each other, and an air outlet 34a through which the air 100 is blown out substantially horizontally toward the place where the spindle flange 17 and the base metal part 37 are in close contact with each other. Since it has an air outlet 34b, the grinding wheel 14 can be easily removed from the spindle flange 17 by the force of the air 100 blown out from the air outlet 34a and the force of the air 100 blown out from the air outlet 34b. can be removed.

Furthermore, since flow rate adjustment valves 36a and 36b are provided between the air source 35 and the air circuit 32 to adjust the amount of air 100 flowing, the air is blown out from the air outlets 34a and 34b by the flow rate adjustment valves 36a and 36b. By adjusting the flow rate of the air 100, that is, the force of the air 100, the optimum force for removing the grindstone 14 from the spindle flange 17 can be easily obtained.

In the above embodiment, the air circuit 32 is disclosed as having both a first air circuit 32a having an air supply port 33a and an air outlet 34a, and a second air circuit 32b having an air supply port 33b and an air outlet 34b. However, the air circuit 32 may have only one of the first air circuit 32a and the second air circuit 32b.

Further, the present invention can be modified in various ways without departing from the spirit of the invention, and it is natural that the present invention extends to such modifications.

10: Processing device 11: Main unit 11A: Column 11Aa: Front surface 11Ab: Groove 11B: Linear guide 11Ba: Front linear guide 11Bb: Rear linear guide 11C: Spindle feed mechanism 12: Transport unit 13: Control unit 14: Grinding wheel 15: Spindle 16: Spindle casing 17: Spindle flange 17A: Main body 17B: Small diameter protrusion 17a: Outer circumferential bottom surface 17b: Outer circumferential surface 18: Slider 19: Ball screw 20: Spindle motor 21: Chuck table 22: Slider 23: Slider drive mechanism 24: Chuck table motor 25: Rail 26: Pulley mechanism 27: Slider motor 28: Inclined surface 29: Recessed portion 30: Inner plate 30a: Inclined surface 31: Bolt 32: Air circuit 32a: First air circuit 32b: Second Air circuit 33a: Air supply port 33b: Air supply port 34a: Air outlet 34b: Air outlet 35: Air source 36a: Flow rate adjustment valve 36b: Flow rate adjustment valve 37: Base metal portion 37a: Inclined surface 37b: Inner peripheral surface 37c: Outer surface 37d: Upper surface 37e: Lower surface 38: Grinding wheel portion 100: Air V: Vertical direction W: Wafer

Claims (3)

A processing apparatus for processing a wafer, comprising:
A disk-shaped spindle flange;
a grindstone including an annular base metal portion that is detachably attached to the spindle flange in a state of substantially close contact with one surface of the spindle flange, and a grindstone portion that is disposed on one surface of the base metal portion and integrated with the base metal portion;
an air outlet for blowing air onto a contact portion between the spindle flange and the base metal portion;
Equipped with
the air outlet includes a first air outlet and a second air outlet, each of which is provided so as to blow out the air toward the outside from a boundary portion between a first contact surface of the spindle flange that is in close contact with the base metal portion in a horizontal direction and a second contact surface of the spindle flange that is in close contact with the base metal portion in a vertical direction;
The first air outlet blows out the air substantially perpendicular to a direction in which the grindstone is attached or detached and along the first contact surface,
The processing device, characterized in that the second air outlet blows out the air approximately parallel to a direction in which the grinding wheel is attached or detached and along the second contact surface . 2. The processing apparatus according to claim 1, wherein an air circuit communicating with the air outlet is formed in the spindle flange. 3. The processing apparatus according to claim 1 , further comprising an adjusting valve capable of adjusting a flow rate of the air blown out from the air outlet.

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