JP7441175B2 - 半導体装置、及び電子機器 - Google Patents
半導体装置、及び電子機器 Download PDFInfo
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- JP7441175B2 JP7441175B2 JP2020556355A JP2020556355A JP7441175B2 JP 7441175 B2 JP7441175 B2 JP 7441175B2 JP 2020556355 A JP2020556355 A JP 2020556355A JP 2020556355 A JP2020556355 A JP 2020556355A JP 7441175 B2 JP7441175 B2 JP 7441175B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/54—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using elements simulating biological cells, e.g. neuron
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/06—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons
- G06N3/063—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons using electronic means
- G06N3/065—Analogue means
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/08—Manufacture or treatment characterised by using material-based technologies using combinations of technologies, e.g. using both Si and SiC technologies or using both Si and Group III-V technologies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biomedical Technology (AREA)
- Theoretical Computer Science (AREA)
- Biophysics (AREA)
- Neurology (AREA)
- Computer Hardware Design (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- Software Systems (AREA)
- Artificial Intelligence (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Evolutionary Computation (AREA)
- Data Mining & Analysis (AREA)
- Computational Linguistics (AREA)
- Thin Film Transistor (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024021696A JP2024055903A (ja) | 2018-11-08 | 2024-02-16 | 半導体装置 |
| JP2025094375A JP7854547B2 (ja) | 2018-11-08 | 2025-06-05 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018210628 | 2018-11-08 | ||
| JP2018210628 | 2018-11-08 | ||
| PCT/IB2019/059204 WO2020095140A1 (ja) | 2018-11-08 | 2019-10-28 | 半導体装置、及び電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024021696A Division JP2024055903A (ja) | 2018-11-08 | 2024-02-16 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020095140A1 JPWO2020095140A1 (ja) | 2021-12-23 |
| JPWO2020095140A5 JPWO2020095140A5 (https=) | 2022-10-14 |
| JP7441175B2 true JP7441175B2 (ja) | 2024-02-29 |
Family
ID=70610839
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020556355A Active JP7441175B2 (ja) | 2018-11-08 | 2019-10-28 | 半導体装置、及び電子機器 |
| JP2024021696A Withdrawn JP2024055903A (ja) | 2018-11-08 | 2024-02-16 | 半導体装置 |
| JP2025094375A Active JP7854547B2 (ja) | 2018-11-08 | 2025-06-05 | 半導体装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024021696A Withdrawn JP2024055903A (ja) | 2018-11-08 | 2024-02-16 | 半導体装置 |
| JP2025094375A Active JP7854547B2 (ja) | 2018-11-08 | 2025-06-05 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US12453072B2 (https=) |
| JP (3) | JP7441175B2 (https=) |
| WO (1) | WO2020095140A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020126426A (ja) * | 2019-02-04 | 2020-08-20 | ソニー株式会社 | 演算装置、及び積和演算システム |
| TWI906891B (zh) | 2019-02-15 | 2025-12-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及電子裝置 |
| JP7480133B2 (ja) | 2019-05-17 | 2024-05-09 | 株式会社半導体エネルギー研究所 | 半導体装置、及び電子機器 |
| JP7123860B2 (ja) * | 2019-06-17 | 2022-08-23 | 株式会社東芝 | 演算装置 |
| US20210125049A1 (en) * | 2019-10-29 | 2021-04-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | System for executing neural network |
| WO2021084717A1 (ja) * | 2019-10-31 | 2021-05-06 | 日本電気株式会社 | 情報処理回路および情報処理回路の設計方法 |
| JP7356393B2 (ja) * | 2020-04-10 | 2023-10-04 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| CN115836293A (zh) * | 2020-07-17 | 2023-03-21 | 株式会社半导体能源研究所 | 半导体装置及电子设备 |
| KR20230039668A (ko) | 2020-07-17 | 2023-03-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 전자 기기 |
| JP7800930B2 (ja) * | 2020-07-27 | 2026-01-16 | ニックスラブ・インコーポレイテッド | 電気信号を生成及び測定するためのシステム及び方法 |
| US20230411386A1 (en) * | 2022-06-20 | 2023-12-21 | International Business Machines Corporation | Method and structure of forming contacts and gates for staggered fet |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017108397A (ja) | 2015-11-30 | 2017-06-15 | 株式会社半導体エネルギー研究所 | 信号処理回路、及び該信号処理回路を有する半導体装置 |
| WO2017221584A1 (ja) | 2016-06-20 | 2017-12-28 | ソニー株式会社 | 表示装置及び電子機器 |
| WO2018150295A1 (ja) | 2017-02-15 | 2018-08-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7365713B2 (en) * | 2001-10-24 | 2008-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
| JP6392603B2 (ja) * | 2013-09-27 | 2018-09-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102344782B1 (ko) * | 2014-06-13 | 2021-12-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 입력 장치 및 입출력 장치 |
| US9312280B2 (en) * | 2014-07-25 | 2016-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2017010000A (ja) | 2015-04-13 | 2017-01-12 | 株式会社半導体エネルギー研究所 | 表示装置 |
| US20170221899A1 (en) * | 2016-01-29 | 2017-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Microcontroller System |
| US11055607B2 (en) * | 2016-06-20 | 2021-07-06 | International Business Machines Corporation | Neural network using floating gate transistor |
| KR20210134066A (ko) | 2016-08-03 | 2021-11-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치, 촬상 모듈, 전자 기기, 및 촬상 시스템 |
| CN109643514B (zh) | 2016-08-26 | 2023-04-04 | 株式会社半导体能源研究所 | 显示装置及电子设备 |
| WO2018069785A1 (en) * | 2016-10-12 | 2018-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and system using the same |
| JP7073090B2 (ja) | 2016-12-28 | 2022-05-23 | 株式会社半導体エネルギー研究所 | ニューラルネットワークを利用したデータ処理装置、電子部品、および電子機器 |
| US11515873B2 (en) * | 2018-06-29 | 2022-11-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
-
2019
- 2019-10-28 WO PCT/IB2019/059204 patent/WO2020095140A1/ja not_active Ceased
- 2019-10-28 JP JP2020556355A patent/JP7441175B2/ja active Active
- 2019-10-28 US US17/289,357 patent/US12453072B2/en active Active
-
2024
- 2024-02-16 JP JP2024021696A patent/JP2024055903A/ja not_active Withdrawn
-
2025
- 2025-06-05 JP JP2025094375A patent/JP7854547B2/ja active Active
- 2025-09-24 US US19/338,408 patent/US20260020215A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017108397A (ja) | 2015-11-30 | 2017-06-15 | 株式会社半導体エネルギー研究所 | 信号処理回路、及び該信号処理回路を有する半導体装置 |
| WO2017221584A1 (ja) | 2016-06-20 | 2017-12-28 | ソニー株式会社 | 表示装置及び電子機器 |
| WO2018150295A1 (ja) | 2017-02-15 | 2018-08-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2024055903A (ja) | 2024-04-19 |
| JP2025131754A (ja) | 2025-09-09 |
| US20260020215A1 (en) | 2026-01-15 |
| US20210384193A1 (en) | 2021-12-09 |
| US12453072B2 (en) | 2025-10-21 |
| JP7854547B2 (ja) | 2026-05-01 |
| WO2020095140A1 (ja) | 2020-05-14 |
| JPWO2020095140A1 (ja) | 2021-12-23 |
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