JP7439039B2 - シリカ部材及びｌｅｄ装置 - Google Patents
シリカ部材及びｌｅｄ装置 Download PDFInfo
- Publication number
- JP7439039B2 JP7439039B2 JP2021206469A JP2021206469A JP7439039B2 JP 7439039 B2 JP7439039 B2 JP 7439039B2 JP 2021206469 A JP2021206469 A JP 2021206469A JP 2021206469 A JP2021206469 A JP 2021206469A JP 7439039 B2 JP7439039 B2 JP 7439039B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- led
- base layer
- intermediate layer
- silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims description 96
- 239000000377 silicon dioxide Substances 0.000 title claims description 38
- 239000010410 layer Substances 0.000 claims description 299
- 239000002344 surface layer Substances 0.000 claims description 67
- 229910000679 solder Inorganic materials 0.000 claims description 32
- 239000002245 particle Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 17
- 230000035882 stress Effects 0.000 description 26
- 239000010931 gold Substances 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 239000010936 titanium Substances 0.000 description 15
- 239000011651 chromium Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 10
- 238000005304 joining Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000010897 surface acoustic wave method Methods 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910017750 AgSn Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Images
Landscapes
- Surface Treatment Of Glass (AREA)
- Led Device Packages (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Glass Compositions (AREA)
- Luminescent Compositions (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18/011,774 US20230335692A1 (en) | 2020-12-25 | 2021-12-23 | Silica member and led device |
| KR1020227044032A KR20230012024A (ko) | 2020-12-25 | 2021-12-23 | 실리카 부재 및 led 장치 |
| CN202180044067.3A CN115702504A (zh) | 2020-12-25 | 2021-12-23 | 二氧化硅部件以及led装置 |
| EP21910983.2A EP4270499A1 (en) | 2020-12-25 | 2021-12-23 | Silica member and led device |
| PCT/JP2021/047953 WO2022138844A1 (ja) | 2020-12-25 | 2021-12-23 | シリカ部材及びｌｅｄ装置 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020217879 | 2020-12-25 | ||
| JP2020217879 | 2020-12-25 | ||
| JP2021172818 | 2021-10-22 | ||
| JP2021172818 | 2021-10-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022103102A JP2022103102A (ja) | 2022-07-07 |
| JP7439039B2 true JP7439039B2 (ja) | 2024-02-27 |
Family
ID=82272683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021206469A Active JP7439039B2 (ja) | 2020-12-25 | 2021-12-20 | シリカ部材及びｌｅｄ装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7439039B2 (zh) |
| TW (1) | TWI799019B (zh) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243550A (ja) | 2001-12-04 | 2003-08-29 | Samsung Electronics Co Ltd | 低温の酸化防止ハーメチックシーリング方法 |
| JP2010153556A (ja) | 2008-12-25 | 2010-07-08 | Kyocera Corp | 発光装置及びこれを用いた照明装置 |
| JP2018125379A (ja) | 2017-01-31 | 2018-08-09 | 信越化学工業株式会社 | 合成石英ガラスリッド用基材及び合成石英ガラスリッド並びにそれらの製造方法 |
-
2021
- 2021-12-20 TW TW110147656A patent/TWI799019B/zh active
- 2021-12-20 JP JP2021206469A patent/JP7439039B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243550A (ja) | 2001-12-04 | 2003-08-29 | Samsung Electronics Co Ltd | 低温の酸化防止ハーメチックシーリング方法 |
| JP2010153556A (ja) | 2008-12-25 | 2010-07-08 | Kyocera Corp | 発光装置及びこれを用いた照明装置 |
| JP2018125379A (ja) | 2017-01-31 | 2018-08-09 | 信越化学工業株式会社 | 合成石英ガラスリッド用基材及び合成石英ガラスリッド並びにそれらの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202240940A (zh) | 2022-10-16 |
| JP2022103102A (ja) | 2022-07-07 |
| TWI799019B (zh) | 2023-04-11 |
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