JP7436195B2 - コンタクトパッド部 - Google Patents

コンタクトパッド部 Download PDF

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Publication number
JP7436195B2
JP7436195B2 JP2019224967A JP2019224967A JP7436195B2 JP 7436195 B2 JP7436195 B2 JP 7436195B2 JP 2019224967 A JP2019224967 A JP 2019224967A JP 2019224967 A JP2019224967 A JP 2019224967A JP 7436195 B2 JP7436195 B2 JP 7436195B2
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JP
Japan
Prior art keywords
conductive component
trace
epoxy
contact pad
actuated assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019224967A
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English (en)
Japanese (ja)
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JP2020095771A5 (enExample
JP2020095771A (ja
Inventor
チー イー クエン
ハーン ピーター
グライス ダビッド
エー． ヴァンデルリー キース
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Magnecomp Corp
Original Assignee
Magnecomp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magnecomp Corp filed Critical Magnecomp Corp
Publication of JP2020095771A publication Critical patent/JP2020095771A/ja
Publication of JP2020095771A5 publication Critical patent/JP2020095771A5/ja
Application granted granted Critical
Publication of JP7436195B2 publication Critical patent/JP7436195B2/ja
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
    • H02N2/0075—Electrical details, e.g. drive or control circuits or methods
    • H02N2/0085—Leads; Wiring arrangements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
    • G11B5/483—Piezoelectric devices between head and arm, e.g. for fine adjustment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
    • H02N2/028—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors along multiple or arbitrary translation directions, e.g. XYZ stages
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
    • H02N2/06—Drive circuits; Control arrangements or methods
    • H02N2/065—Large signal circuits, e.g. final stages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins

Landscapes

  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Moving Of The Head To Find And Align With The Track (AREA)
JP2019224967A 2018-12-13 2019-12-13 コンタクトパッド部 Active JP7436195B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862779378P 2018-12-13 2018-12-13
US62/779,378 2018-12-13
US16/701,059 2019-12-02
US16/701,059 US11121647B2 (en) 2018-12-13 2019-12-02 Contact pad features

Publications (3)

Publication Number Publication Date
JP2020095771A JP2020095771A (ja) 2020-06-18
JP2020095771A5 JP2020095771A5 (enExample) 2022-12-15
JP7436195B2 true JP7436195B2 (ja) 2024-02-21

Family

ID=71071250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019224967A Active JP7436195B2 (ja) 2018-12-13 2019-12-13 コンタクトパッド部

Country Status (2)

Country Link
US (2) US11121647B2 (enExample)
JP (1) JP7436195B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11121647B2 (en) 2018-12-13 2021-09-14 Magnecomp Corporation Contact pad features

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002521850A (ja) 1998-07-31 2002-07-16 キューリック アンド ソファ ホールディングズ インコーポレイテッド 応力を低減した低インピーダンス・高密度の積層上堆積構造体
US20040217674A1 (en) 2003-04-30 2004-11-04 Vibration-X Di Bianchini Emanuele E C. Sas Piezoelectric device and method to manufacture a piezoelectric device
JP2007179727A (ja) 2005-12-26 2007-07-12 Shinka Jitsugyo Kk 回転式マイクロアクチュエータ及びその製造方法
JP2010218626A (ja) 2009-03-17 2010-09-30 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリ及びディスク・ドライブ
JP2012185869A (ja) 2011-03-03 2012-09-27 Nhk Spring Co Ltd 圧電素子の電気的接続構造及びこれを備えたヘッド・サスペンション
JP2018050033A (ja) 2016-08-03 2018-03-29 マグネコンプ コーポレーションＭａｇｎｅｃｏｍｐｃｏｒｐｏｒａｔｉｏｎ 分極されるが不活性であるｐｚｔ抑制層を有する多層ｐｚｔマイクロアクチュエータ

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Publication number Priority date Publication date Assignee Title
BR9709998B1 (pt) * 1996-06-26 2010-04-20 elemento de construção semicondutor, irradiador de luz, com elemento de conversão de luminescência
US6856075B1 (en) * 2001-06-22 2005-02-15 Hutchinson Technology Incorporated Enhancements for adhesive attachment of piezoelectric motor elements to a disk drive suspension
US7129567B2 (en) * 2004-08-31 2006-10-31 Micron Technology, Inc. Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
JP4205135B2 (ja) * 2007-03-13 2009-01-07 シャープ株式会社 半導体発光装置、半導体発光装置用多連リードフレーム
US8303093B2 (en) * 2009-12-15 2012-11-06 Xerox Corporation Print head having a polymer layer to facilitate assembly of the print head
JP5478331B2 (ja) 2010-03-31 2014-04-23 日本発條株式会社 電子機器と、ディスク装置用サスペンション
JP5875216B2 (ja) 2010-05-12 2016-03-02 日本発條株式会社 圧電素子の電気的接続構造の製造方法
US8378557B2 (en) * 2010-07-09 2013-02-19 General Electric Company Thermal transfer and acoustic matching layers for ultrasound transducer
US9241410B2 (en) 2011-05-31 2016-01-19 Nitto Denko Corporation Wired circuit board and producing method thereof
US9361915B1 (en) 2011-12-02 2016-06-07 Hutchinson Technology Incorporated Method for making a disk drive head suspension component having a microstructured surface region
JP5943658B2 (ja) 2012-03-15 2016-07-05 日本発條株式会社 端子部構造、フレキシャ、及びヘッド・サスペンション
US9406314B1 (en) * 2012-10-04 2016-08-02 Magnecomp Corporation Assembly of DSA suspensions using microactuators with partially cured adhesive, and DSA suspensions having PZTs with wrap-around electrodes
US8699186B1 (en) * 2013-02-22 2014-04-15 Magnecomp Corporation DSA suspension with mid-load beam mounted dual actuators
US9311938B1 (en) * 2013-05-30 2016-04-12 Magnecomp Corporation Dual stage actuated suspension having adhesive overflow control channels
US8792214B1 (en) 2013-07-23 2014-07-29 Hutchinson Technology Incorporated Electrical contacts to motors in dual stage actuated suspensions
US10193209B2 (en) * 2015-04-06 2019-01-29 Covidien Lp Mat based antenna and heater system, for use during medical procedures
US11121647B2 (en) 2018-12-13 2021-09-14 Magnecomp Corporation Contact pad features

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002521850A (ja) 1998-07-31 2002-07-16 キューリック アンド ソファ ホールディングズ インコーポレイテッド 応力を低減した低インピーダンス・高密度の積層上堆積構造体
US20040217674A1 (en) 2003-04-30 2004-11-04 Vibration-X Di Bianchini Emanuele E C. Sas Piezoelectric device and method to manufacture a piezoelectric device
JP2007179727A (ja) 2005-12-26 2007-07-12 Shinka Jitsugyo Kk 回転式マイクロアクチュエータ及びその製造方法
JP2010218626A (ja) 2009-03-17 2010-09-30 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリ及びディスク・ドライブ
JP2012185869A (ja) 2011-03-03 2012-09-27 Nhk Spring Co Ltd 圧電素子の電気的接続構造及びこれを備えたヘッド・サスペンション
JP2018050033A (ja) 2016-08-03 2018-03-29 マグネコンプ コーポレーションＭａｇｎｅｃｏｍｐｃｏｒｐｏｒａｔｉｏｎ 分極されるが不活性であるｐｚｔ抑制層を有する多層ｐｚｔマイクロアクチュエータ

Also Published As

Publication number Publication date
US20200195170A1 (en) 2020-06-18
US20210399653A1 (en) 2021-12-23
US11811335B2 (en) 2023-11-07
JP2020095771A (ja) 2020-06-18
US11121647B2 (en) 2021-09-14

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