JP2020095771A5 - - Google Patents
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- Publication number
- JP2020095771A5 JP2020095771A5 JP2019224967A JP2019224967A JP2020095771A5 JP 2020095771 A5 JP2020095771 A5 JP 2020095771A5 JP 2019224967 A JP2019224967 A JP 2019224967A JP 2019224967 A JP2019224967 A JP 2019224967A JP 2020095771 A5 JP2020095771 A5 JP 2020095771A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive component
- trace
- epoxy
- connection structure
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004593 Epoxy Substances 0.000 claims 8
- 238000007373 indentation Methods 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862779378P | 2018-12-13 | 2018-12-13 | |
| US62/779,378 | 2018-12-13 | ||
| US16/701,059 | 2019-12-02 | ||
| US16/701,059 US11121647B2 (en) | 2018-12-13 | 2019-12-02 | Contact pad features |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020095771A JP2020095771A (ja) | 2020-06-18 |
| JP2020095771A5 true JP2020095771A5 (enExample) | 2022-12-15 |
| JP7436195B2 JP7436195B2 (ja) | 2024-02-21 |
Family
ID=71071250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019224967A Active JP7436195B2 (ja) | 2018-12-13 | 2019-12-13 | コンタクトパッド部 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US11121647B2 (enExample) |
| JP (1) | JP7436195B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11121647B2 (en) | 2018-12-13 | 2021-09-14 | Magnecomp Corporation | Contact pad features |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR9709998B1 (pt) * | 1996-06-26 | 2010-04-20 | elemento de construção semicondutor, irradiador de luz, com elemento de conversão de luminescência | |
| US6323435B1 (en) | 1998-07-31 | 2001-11-27 | Kulicke & Soffa Holdings, Inc. | Low-impedance high-density deposited-on-laminate structures having reduced stress |
| US6856075B1 (en) * | 2001-06-22 | 2005-02-15 | Hutchinson Technology Incorporated | Enhancements for adhesive attachment of piezoelectric motor elements to a disk drive suspension |
| US7105988B2 (en) * | 2003-04-30 | 2006-09-12 | Vibration-X Di Bianchini Emanulee E C. Sas | Piezoelectric device and method to manufacture a piezoelectric device |
| US7129567B2 (en) * | 2004-08-31 | 2006-10-31 | Micron Technology, Inc. | Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements |
| JP2007179727A (ja) | 2005-12-26 | 2007-07-12 | Shinka Jitsugyo Kk | 回転式マイクロアクチュエータ及びその製造方法 |
| JP4205135B2 (ja) * | 2007-03-13 | 2009-01-07 | シャープ株式会社 | 半導体発光装置、半導体発光装置用多連リードフレーム |
| JP5361474B2 (ja) | 2009-03-17 | 2013-12-04 | エイチジーエスティーネザーランドビーブイ | ヘッド・ジンバル・アセンブリ及びディスク・ドライブ |
| US8303093B2 (en) * | 2009-12-15 | 2012-11-06 | Xerox Corporation | Print head having a polymer layer to facilitate assembly of the print head |
| JP5478331B2 (ja) | 2010-03-31 | 2014-04-23 | 日本発條株式会社 | 電子機器と、ディスク装置用サスペンション |
| JP5875216B2 (ja) | 2010-05-12 | 2016-03-02 | 日本発條株式会社 | 圧電素子の電気的接続構造の製造方法 |
| US8378557B2 (en) * | 2010-07-09 | 2013-02-19 | General Electric Company | Thermal transfer and acoustic matching layers for ultrasound transducer |
| JP6054593B2 (ja) | 2011-03-03 | 2016-12-27 | 日本発條株式会社 | 圧電素子の電気的接続構造 |
| US9241410B2 (en) | 2011-05-31 | 2016-01-19 | Nitto Denko Corporation | Wired circuit board and producing method thereof |
| US9361915B1 (en) | 2011-12-02 | 2016-06-07 | Hutchinson Technology Incorporated | Method for making a disk drive head suspension component having a microstructured surface region |
| JP5943658B2 (ja) | 2012-03-15 | 2016-07-05 | 日本発條株式会社 | 端子部構造、フレキシャ、及びヘッド・サスペンション |
| US9406314B1 (en) * | 2012-10-04 | 2016-08-02 | Magnecomp Corporation | Assembly of DSA suspensions using microactuators with partially cured adhesive, and DSA suspensions having PZTs with wrap-around electrodes |
| US8699186B1 (en) * | 2013-02-22 | 2014-04-15 | Magnecomp Corporation | DSA suspension with mid-load beam mounted dual actuators |
| US9311938B1 (en) * | 2013-05-30 | 2016-04-12 | Magnecomp Corporation | Dual stage actuated suspension having adhesive overflow control channels |
| US8792214B1 (en) | 2013-07-23 | 2014-07-29 | Hutchinson Technology Incorporated | Electrical contacts to motors in dual stage actuated suspensions |
| US10193209B2 (en) * | 2015-04-06 | 2019-01-29 | Covidien Lp | Mat based antenna and heater system, for use during medical procedures |
| JP7051322B2 (ja) | 2016-08-03 | 2022-04-11 | マグネコンプ コーポレーション | 分極されるが不活性であるｐｚｔ抑制層を有する多層ｐｚｔマイクロアクチュエータ |
| US11121647B2 (en) | 2018-12-13 | 2021-09-14 | Magnecomp Corporation | Contact pad features |
-
2019
- 2019-12-02 US US16/701,059 patent/US11121647B2/en active Active
- 2019-12-13 JP JP2019224967A patent/JP7436195B2/ja active Active
-
2021
- 2021-09-01 US US17/464,248 patent/US11811335B2/en active Active
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