JP7416581B2 - Cutting method and cutting device - Google Patents

Description

The present invention relates to a cutting method and a cutting device for cutting a workpiece with a cutting device.

A cutting apparatus is used that cuts a wafer made of silicon or the like with a cutting blade along streets to divide it into individual devices (for example, see Patent Document 1).

The above-mentioned cutting blade also cuts a wafer to form a cutting groove before being shipped from the factory, and the width of the cutting groove is measured. For cutting blades, the value of the width of the cutting groove obtained by measurement is stored as the kerf width in an identification code such as a two-dimensional code or bar code, and the identification code is attached to the cutting blade or the storage case that houses the cutting blade. It is shipped with a claim that it has a predetermined kerf width.

Japanese Patent Application Publication No. 2018-129329

On the other hand, when the cutting blade is attached to the tip of the spindle, it may be attached in a slightly inclined state with respect to the axis of the spindle. When cutting a workpiece while the cutting blade is attached at a slight inclination to the axis of the spindle, the width of the cutting groove formed by cutting the workpiece is measured and identified before shipping. It becomes wider than the kerf width stored in the cord.

In addition, if the cutting blade is slightly damaged when attached to the tip of the spindle and is attached to the spindle without noticing the damage, the cutting groove formed by cutting the workpiece may be damaged. The difference between the width and the kerf width measured before shipping and stored in the identification code becomes large. If the cutting blade is damaged, if the cutting edge of the cutting blade snakes during cutting, the width of the cutting groove will be wider than the kerf width, and if the cutting blade is cracked or chipped, the width of the cutting groove will be wider than the kerf width. It becomes narrower and cannot be cut properly.

For example, when a cutting blade cuts a wafer, if the width of the cut groove actually formed by cutting becomes wider than the expected kerf width, the cut groove or chipping protrudes from the street, causing the device to become damaged. Improvements were desperately needed as this could damage the active area of the device.

The present invention has been made in view of such problems, and its purpose is to reduce the difference between the width of the cut groove actually formed by cutting the workpiece and the kerf width measured before shipping to a tolerance value. It is an object of the present invention to provide a cutting method and a cutting device capable of detecting the above.

In order to solve the above-mentioned problems and achieve the objects, the cutting method of the present invention is a cutting method in which a workpiece is cut with a cutting device having a cutting blade attached to the tip of a spindle, the cutting blade comprising: , the cutting device has an identification code including at least information on the width of the cutting groove cut into the workpiece before shipping, and the cutting device is equipped with a reading means for the identification code, and the cutting device is provided with a reading means for reading the identification code. reading the identification code of the cutting blade to obtain information on the width of the cutting groove before shipping; and after performing the identification code reading step, mounting the cutting blade on the tip of the spindle. a blade mounting step; a cutting step of cutting a workpiece after performing the blade mounting step to form a number of cutting grooves on the workpiece determined by the processing content information; a width detection step of imaging the cut groove and detecting the width of the cut groove; the width of the cut groove detected in the width detection step; and the identification of the cut groove before shipping obtained in the identification code reading step; A comparison step of comparing the width of the cut groove, and a tolerance range between the width of the cut groove detected in the width detection step compared in the comparison step and the width of the cut groove before shipping obtained in the identification code reading step. After carrying out the warning issuing step of issuing a warning when there is a deviation above, the cutting step, the width detecting step, and the comparing step, in the warning issuing step, the width of the cut groove and the width of the pre-shipment The present invention is characterized by comprising a product cutting step of cutting all streets of the product workpiece when it is determined that there is no deviation from the width of the cutting groove by more than an allowable range .

In the cutting method , a dummy workpiece different from the product workpiece may be cut in the cutting step.

In the cutting method, in the cutting step, a plurality of cutting grooves may be formed, and in the width detection step, the width of the cutting groove formed last among the plurality of cutting grooves may be detected.

The cutting device of the present invention includes a holding means for holding a workpiece, and an identification code including at least information on the width of a cutting groove cut into the workpiece before shipping, and the workpiece held by the holding means. a cutting means having a cutting blade for cutting the blade; a spindle on which the cutting blade is replaceably mounted; a moving means for moving the cutting means relative to the holding means; The apparatus includes a reading means, an imaging means for taking an image of the workpiece held by the holding means, and a control means for controlling at least the moving means, and the control means is attached to the spindle by the reading means. A storage unit that stores the information on the width of the cutting groove before shipping obtained by reading the identification code of the previous cutting blade, and an image of the cutting groove formed in the number determined by the processing content information on the workpiece. A width detection unit detects the width of the cut groove from the captured image, and the width of the cut groove detected by the width detection unit is compared with the width of the cut groove before shipping stored in the storage unit. a comparison section, a tolerance storage section that stores the tolerance range of the groove width set for the width of the cut groove before shipping, and a width of the cut groove detected by the width detection section compared with the comparison section. and a warning transmitting unit that issues a warning when the width of the cut groove before shipping stored in the storage unit deviates by more than the tolerance range stored in the tolerance range storage unit , When the warning transmitter determines that there is no deviation beyond a permissible range between the width of the cutting groove and the width of the cutting groove before shipping, all streets of the product workpiece are cut. shall be.

The present invention has the effect that it is possible to detect that the difference between the width of the cutting groove actually formed by cutting the workpiece and the kerf width measured before shipping is equal to or greater than a tolerance value.

FIG. 1 is a perspective view showing a configuration example of a cutting device according to a first embodiment. FIG. 2 is an exploded perspective view of the cutting unit according to the first embodiment. 3 is a perspective view of the cutting blade of the cutting unit shown in FIG. 2. FIG. FIG. 4 is a plan view of a storage case in which the cutting blade shown in FIG. 3 is accommodated. FIG. 5 is a flowchart showing the flow of the cutting method according to the first embodiment. FIG. 6 is a side view schematically showing a cutting step of the cutting method shown in FIG. 5, partially in cross section. FIG. 7 is a side view schematically showing, partially in section, the width detection step of the cutting method shown in FIG. FIG. 8 is a diagram schematically showing a captured image obtained by imaging by the imaging unit in the width detection step of the cutting method shown in FIG. FIG. 9 is a perspective view of a mirror wafer in which cutting grooves are formed in the cutting step of the cutting method according to the second embodiment. FIG. 10 is a perspective view of a dress board in which cutting grooves are formed in the cutting step of the cutting method according to the second embodiment. FIG. 11 is an exploded perspective view showing a cutting unit of a cutting device according to a modification of Embodiment 1 and Embodiment 2.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Further, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A cutting method and a cutting device according to Embodiment 1 of the present invention will be explained based on the drawings. FIG. 1 is a perspective view showing a configuration example of a cutting device according to a first embodiment. FIG. 2 is an exploded perspective view of the cutting unit according to the first embodiment. 3 is a perspective view of the cutting blade of the cutting unit shown in FIG. 2. FIG. FIG. 4 is a plan view of a storage case in which the cutting blade shown in FIG. 3 is accommodated.

The cutting device 1 shown in FIG. 1 according to the first embodiment is a device that cuts (processes) a workpiece 200. The cutting device 1 shown in FIG. In the first embodiment, the workpiece 200 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer that uses silicon, sapphire, gallium, or the like as a base material. Devices 203 are formed on the workpiece 200 in areas partitioned into a grid pattern by a plurality of streets 202 formed in a grid pattern on the surface 201 .

The workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer having a thinner central portion and a thicker portion on the outer periphery. A rectangular package substrate, a ceramic plate, a glass plate, etc. may also be used. The workpiece 200 has a disc-shaped adhesive tape 206 attached to its back surface 204, and an annular frame 205 whose inner diameter is larger than the outer diameter of the workpiece 200 is attached to the outer periphery of the adhesive tape 206. , is supported by an opening inside the annular frame 205. In this way, the workpiece 200 according to the first embodiment is also a product workpiece that is divided into individual devices 203. That is, the product workpiece refers to the workpiece 200 that is divided into devices 203 used in various electronic devices.

The cutting device 1 shown in FIG. 1 is a device that holds a workpiece 200 on a holding table 10 and cuts it along a street 202 with a cutting blade 21. As shown in FIG. 1, the cutting device 1 includes a holding table 10, which is a holding means for suctioning and holding a workpiece 200 on a holding surface 11, and a cutting blade 21, which cuts the workpiece 200 held by the holding table 10. and a spindle 22 on which a cutting blade 21 is replaceably mounted; an imaging unit 30 that is an imaging means for photographing the workpiece 200 held on the holding table 10; and a control unit 100 which is a means.

The cutting device 1 also includes a moving unit 40 that is a moving means for moving the cutting unit 20 relative to the holding table 10, as shown in FIG. The moving unit 40 includes an X-axis moving unit 41 that processes and feeds the holding table 10 horizontally and in an The Y-axis moving unit 42 indexes and feeds in the Y-axis direction that is parallel and orthogonal to the X-axis direction, and the cutting unit 20 cuts in the Z-axis direction that is parallel to the vertical direction that is orthogonal to both the X-axis direction and the Y-axis direction. A Z-axis moving unit 43 for feeding, and a rotary moving unit 44 that rotates the holding table 10 around an axis parallel to the Z-axis direction and is processed and fed in the X-axis direction together with the holding table 10 by the X-axis moving unit 41. Be prepared.

The holding table 10 has a disk shape, and a holding surface 11 for holding the workpiece 200 is made of a porous material such as porous ceramic. Further, the holding table 10 is provided so as to be movable along the X-axis direction by an X-axis movement unit 41 and rotatable around the axis by a rotation movement unit 44. The holding table 10 is connected to a vacuum suction source (not shown), and suctions and holds the workpiece 200 placed on the holding surface 11 by suction from the vacuum suction source. Further, a plurality of clamp parts 12 for clamping the annular frame 205 are provided around the holding table 10.

The cutting unit 20 is a cutting means to which a cutting blade 21 for cutting the workpiece 200 held on the holding table 10 is detachably attached. The cutting unit 20 is provided to be movable in the Y-axis direction by a Y-axis movement unit 42 with respect to a workpiece 200 held on the holding table 10, and is movable in the Z-axis direction by a Z-axis movement unit 43. It is set in.

As shown in FIG. 1, the cutting unit 20 is provided on a support frame 3 that stands up from the apparatus main body 2 via a Y-axis moving unit 42, a Z-axis moving unit 43, and the like. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 by the Y-axis movement unit 42 and the Z-axis movement unit 43.

As shown in FIG. 2, the cutting unit 20 includes a cutting blade 21, a spindle 22 with the cutting blade 21 attached to the tip, and a Y-axis movement unit 42 and a Z-axis movement unit 43 to move the cutting blade 21 in the Y-axis direction and the Z-axis direction. A spindle housing 23 that is moved to a position and rotatably accommodates the spindle 22 around its axis; a spindle motor (not shown) that is housed in the spindle housing 23 and rotates the spindle 22 around its axis; The blade 21 is provided with a flange mechanism 24 to which the blade 21 is detachably attached.

The cutting blade 21 is an extremely thin cutting whetstone having a substantially ring shape. In the first embodiment, the cutting blade 21 includes an annular base 212 having a mounting hole 211 in the center, an annular cutting blade 213 provided on the outer peripheral edge of the base 212, and cutting the workpiece 200. It has an identification code 214. The identification code 214 includes at least information on the kerf width, which is the width of the cutting groove 207 (indicated by a dotted line in FIG. 1) formed by cutting the workpiece 200 before shipping from the factory that manufactures the cutting blade 21. include. That is, the kerf width is the width of the cutting groove 207 before shipping.

In the first embodiment, the identification code 214 is provided on the end surface of the base 212 shown in FIGS. 2 and 3, but in the present invention, the identification code 214 is provided on the end surface of the base 212 shown in FIGS. It may be provided on the surface of. The identification code 214 is composed of, for example, a two-dimensional code, a bar code, or a spec notation composed of at least one of letters and numbers, which indicates at least the above-mentioned information on the kerf width.

The flange mechanism 24 includes a mount 26 fixed to the tip of the spindle 22 by a bolt 25 screwed into a screw hole 221 provided at the tip of the spindle 22, and a male thread 262 provided on the outer peripheral surface of a boss portion 261 of the mount 26. and a nut 27 that is screwed into the.

The mount 26 includes a cylindrical boss portion 261 through which the tip of the spindle 22 passes inside, and a ring-shaped flange portion 263 protruding toward the outer circumference from one end of the boss portion 261 near the spindle housing 23. The boss portion 261 has a male thread 262 formed on its outer peripheral surface, and is inserted into the mounting hole 211 of the base 212 of the cutting blade 21 . The nut 27 is screwed into the male thread 262 of the boss portion 261 inserted into the mounting hole 211 of the cutting blade 21 .

In the flange mechanism 24, the boss portion 261 of the mount 26 fixed to the tip of the spindle 22 is passed through the mounting hole 211, and the nut 27 is screwed into the male screw 262, so that a gap is formed between the flange portion 263 and the nut 27. The cutting blade 21 is attached to the tip of the spindle 22 with the base 212 sandwiched therebetween. Further, in the flange mechanism 24, the cutting blade 21 can be freely attached to and detached from the spindle 22 via the mount 26 by removing the nut 27 from the male thread 262.

The axes of the spindle 22 and the cutting blade 21 of the cutting unit 20 are set parallel to the Y-axis direction.

The X-axis moving unit 41 moves the holding table 10 in the X-axis direction, which is the processing feed direction, to relatively feed the holding table 10 and the cutting unit 20 along the X-axis direction. The Y-axis moving unit 42 moves the cutting unit 20 in the Y-axis direction, which is the indexing and feeding direction, to relatively index and feed the holding table 10 and the cutting unit 20 along the Y-axis direction. The Z-axis moving unit 43 moves the cutting unit 20 in the Z-axis direction, which is the cutting-feeding direction, thereby relatively feeding the holding table 10 and the cutting unit 20 along the Z-axis direction.

The X-axis movement unit 41, the Y-axis movement unit 42, and the Z-axis movement unit 43 include a well-known ball screw rotatably provided around the axis, a well-known pulse motor that rotates the ball screw around the axis, and a holding table. 10 or the cutting unit 20 is provided with a known guide rail that supports the cutting unit 20 movably in the X-axis direction, Y-axis direction, or Z-axis direction.

The cutting device 1 also includes an X-axis position detection unit (not shown) for detecting the position of the holding table 10 in the X-axis direction, and a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction. It includes a detection unit and a Z-axis position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis direction position detection unit and the Y-axis direction position detection unit can be configured by a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis position detection unit detects the position of the cutting unit 20 in the Z-axis direction using pulses from the pulse motor. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the holding table 10 in the X-axis direction and the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100. . Note that in the first embodiment, each position is determined by the distance in the X-axis direction, Y-axis direction, and Z-axis direction from a predetermined reference position.

The cutting device 1 also includes a cassette elevator 50 on which a cassette 51 containing workpieces 200 before and after cutting is placed and for moving the cassette 51 in the Z-axis direction, and a cleaning unit for cleaning the workpiece 200 after cutting. 60, and a transport unit (not shown) that takes the workpiece 200 into and out of the cassette 51 and transports the workpiece 200.

The imaging unit 30 is fixed so as to move integrally with the cutting unit 20. The imaging unit 30 includes an imaging element that photographs the region to be divided of the workpiece 200 held on the holding table 10 before cutting. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The imaging unit 30 photographs the workpiece 200 held on the holding table 10, obtains an image for performing alignment for aligning the workpiece 200 and the cutting blade 21, and uses the obtained image. Output to control unit 100.

Further, the imaging unit 30 includes epi-illumination (also referred to as coaxial illumination) that irradiates illumination light onto the workpiece 200 held on the holding table 10 and oblique illumination. Epi-illumination irradiates the workpiece 200 held on the holding table 10 with illumination light coaxially with the optical axis of the image sensor. Oblique illumination irradiates the workpiece 200 held on the holding table 10 with illumination light along a direction intersecting the optical axis of the image sensor. The amount of light of epi-illumination and oblique illumination of the imaging unit 30 is set in advance.

The control unit 100 controls each of the above-described components of the cutting device 1 to cause the cutting device 1 to perform a machining operation on the workpiece 200. That is, the control unit 100 controls at least the mobile unit 40. Note that the control unit 100 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input/output unit. A computer having an interface device. The arithmetic processing device of the control unit 100 executes arithmetic processing according to a computer program stored in a storage device, and sends control signals for controlling the cutting device 1 to the cutting device via an input/output interface device. 1 to the above-mentioned components.

In addition, the control unit 100 is connected to a display unit (not shown) configured with a liquid crystal display device that displays the status of machining operations, images, etc., and an input unit used by an operator to register machining content information. There is. The input unit includes at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

Further, as shown in FIG. 1, the cutting device 1 includes a notification unit 110 and a reading unit 120 that is a reading means. The notification unit 110 notifies the operator by emitting at least one of sound and light.

The reading unit 120 reads the identification code 214 and outputs information on the kerf width indicated by the identification code 214 to the control unit 100. When the identification code 214 is a two-dimensional code or a barcode, the reading unit 120 is a barcode reader. When the identification code 214 is a spec notation, the reading unit 120 is configured by an OCR (Optical Character Recognition/Reader).

The control unit 100 also includes a storage section 101, a width detection section 102, a comparison section 103, an allowable range storage section 104, and a warning transmission section 105, as shown in FIG.

The storage unit 101 stores information on the kerf width obtained by reading the identification code 214 of the cutting blade 21 with the reading unit 120. The width detection unit 102 generates a captured image 300 ( which is obtained by capturing a cutting groove 207 formed in the workpiece 200 by the cutting unit 20 with the cutting blade 213 of the cutting blade 21 into the workpiece 200 by the imaging unit 30 ). An example is shown in FIG. 8) to detect the width of the cutting groove 207.

The comparison unit 103 compares the width of the cutting groove 207 detected by the width detection unit 102 and the kerf width stored in the storage unit 101. The permissible range storage unit 104 stores a permissible value that is a permissible range of the width of the cutting groove 207 in machining content information registered by the operator. Note that the tolerance value of the width of the cutting groove 207 is a value indicating the tolerance range of the width of the cutting groove 207 set with respect to the kerf width. It is also a value for determining whether the width is acceptable or not. The width of the cut groove 207 can be determined to be defective if the difference between the width of the cut groove 207 and the kerf width is greater than the allowable value; If it is less than this, the width of the cut groove 207 can be determined to be good.

The warning transmitting unit 105 determines that the width of the cut groove 207 detected by the width detecting unit 102 and the kerf width stored in the storage unit 101 compared by the comparison unit 103 are greater than or equal to the tolerance value stored in the tolerance range storage unit 104. If there is a deviation, the notification unit 110 is operated to issue a warning.

The functions of the storage unit 101 described above are realized by the storage device storing information on the kerf width. The mechanisms of the comparison unit 103 and the warning transmission unit 105 are realized by a processing unit executing a computer program stored in a storage device. The function of the tolerance storage unit 104 is realized by a storage device storing tolerance values.

Next, the processing operation of the cutting device 1 described above, that is, the cutting method according to the first embodiment will be explained based on the drawings. FIG. 5 is a flowchart showing the flow of the cutting method according to the first embodiment.

The cutting method according to the first embodiment is a processing operation of the cutting device 1 in which a cutting blade 21 is mounted on a spindle 22 and the cutting blade 21 mounted on the spindle 22 cuts into a workpiece 200 for cutting. That is, the cutting method according to the first embodiment is a method in which a cutting blade 21 is attached to a spindle 22, and a workpiece 200 is cut by the cutting device 1 in which the cutting blade 21 is attached to the tip of the spindle 22.

As shown in FIG. 5, the cutting method includes an identification code reading step ST1, a blade mounting step ST2, a cutting step ST3, a width detection step ST4, a comparison step ST5, an alarm issuing step ST6, and a product cutting step ST7. Equipped with.

In the cutting method according to the first embodiment, that is, before the machining operation of the cutting device 1 starts, the control unit 100 receives and registers the machining content information input by the operator by operating the input unit. Note that the machining content information includes the allowable width of the cutting groove 207, the number of cutting grooves 207 formed in the cutting step ST3, and the like. For this purpose, the tolerance storage unit 104 stores the tolerance value of the width of the cutting groove 207. In the cutting method according to the first embodiment, that is, the processing operation of the cutting device 1, the operator places the cassette 51 containing the workpiece 200 to be cut on the cassette elevator 50, and inputs data by operating the input unit. When the control unit 100 receives an instruction to start the machining operation, the machining operation is started.

(Identification code reading step)
The identification code reading step ST1 is a step in which the reading unit 120 reads the identification code 214 of the cutting blade 21 attached to the spindle 22 and obtains information on the kerf width indicated by the identification code 214. When the machining operation is started, the process proceeds to an identification code reading step ST1. In the identification code reading step ST1, the cutting device 1 reads the identification code 214 of the cutting blade 21 by the reading unit 120, and selects the kerf indicated by the identification code 214 obtained by reading. The width information is output to the control unit 100. In the identification code reading step ST1, the storage section 101 of the control unit 100 stores the information on the kerf width input from the reading unit 120, and the process proceeds to the blade mounting step ST2.

(Blade installation step)
The blade mounting step ST2 is a step of mounting the cutting blade 21 on the tip of the spindle 22 of the cutting unit 20 after implementing the identification code reading step ST1. In the first embodiment, in the blade attachment step ST2, the operator attaches the cutting blade 21 whose identification code 214 was read in the identification code reading step ST1 to the tip of the spindle 22, and proceeds to the cutting step ST3.

(Cutting step)
FIG. 6 is a side view schematically showing a cutting step of the cutting method shown in FIG. 5, partially in cross section. The cutting step ST3 is a step of cutting the workpiece 200 and forming the cutting groove 207 after performing the blade mounting step ST2.

In the first embodiment, in the cutting step ST3, the cutting device 1 takes out the workpiece 200 from the cassette 51 using the transport unit, places it on the holding surface 11 of the holding table 10, and inserts the workpiece 200 through the adhesive tape 206. 200 is held on the holding surface 11 by suction, and the annular frame 205 is clamped by the clamp part 12. In the cutting step ST3, the cutting device 1 uses the moving unit 40 to move the holding table 10 to below the imaging unit 30, and uses the imaging unit 30 to image the workpiece 200 held by suction on the holding table 10, thereby performing alignment. do.

In the cutting step ST3, the cutting device 1 causes the moving unit 40 to relatively move the cutting blade 21 and the workpiece 200 along the street 202, based on the processing content information, so that the cutting device 1 moves the cutting blade 21 and the workpiece 200 relatively along the street 202. 202 is cut to form the number of cutting grooves 207 determined by the processing content information, and the process proceeds to width detection step ST4. Note that the number of cutting grooves 207 formed in the cutting step ST3 determined by the processing content information may be one or more.

(width detection step)
FIG. 7 is a side view schematically showing, partially in section, the width detection step of the cutting method shown in FIG. FIG. 8 is a diagram schematically showing a captured image obtained by imaging by the imaging unit in the width detection step of the cutting method shown in FIG. Width detection step ST4 is a step in which the cutting groove 207 formed in cutting step ST3 is imaged by the imaging unit 30 to detect the width of the cutting groove 207.

In the first embodiment, in the width detection step ST4, the cutting device 1 uses the moving unit 40 to position the predetermined position of the cutting groove 207 below the imaging unit 30, as shown in FIG. A captured image 300 illustrated in FIG. 8 is obtained. In the first embodiment, when a plurality of cutting grooves 207 are formed in the cutting step ST3, a predetermined position of the cutting groove 207 formed last among the plurality of cutting grooves 207 is imaged in the width detection step ST4. , acquires a captured image 300.

In the first embodiment, in the captured image 300, the amount of light received from the surface 201 of the workpiece 200 is large, so in FIG. Therefore, in FIG. 8, the cutting grooves 207 are shown by hatching. In the width detection step ST4, the width detection unit 102 performs well-known image processing on the captured image 300, detects the cut groove 207 from the captured image 300, detects the width of the cut groove 207, and proceeds to comparison step ST5. . In this manner, in the first embodiment, when a plurality of cutting grooves 207 are formed in the cutting step ST3, the width of the cutting groove 207 formed last among the plurality of cutting grooves 207 is detected in the width detection step ST4.

(Comparison step)
The comparison step ST5 is a step of comparing the width of the cut groove 207 detected in the width detection step ST4 and the kerf width input in the identification code reading step ST1. In the comparison step ST5, the comparison section 103 compares the width of the cut groove 207 detected by the width detection section 102 in the width detection step ST4, the kerf width read in the identification code 214 in the identification code reading step ST1, and the kerf width stored in the storage section 101. The width of the cut groove 207 and the kerf width are compared, and the process proceeds to warning issuing step ST6.

(Warning sending step)
The warning sending step ST6 issues a warning when there is a deviation of more than a tolerance between the width of the cut groove 207 detected in the width detection step ST4 compared in the comparison step ST5 and the kerf width obtained in the identification code reading step ST1. This is the step of transmitting information. In the warning transmission step ST6, the warning transmission unit 105 determines that the difference between the width of the cutting groove 207 detected by the width detection unit 102 and the kerf width stored in the storage unit 101 is stored in the tolerance storage unit 104. It is determined whether the value is greater than or equal to the allowable value (step ST61).

In the warning transmission step ST6, when the warning transmission unit 105 determines that the difference between the width of the cutting groove 207 and the kerf width is greater than or equal to the allowable value (step ST61: Yes), it operates the notification unit 110 to prevent cutting. If there is a difference between the width of the groove 207 and the kerf width by more than an allowable value, a warning is issued (step ST62), and if there is a problem with the cutting blade 21, a warning is issued to the operator etc., and the cutting method, that is, the cutting device 1 is Finish the machining operation. In the warning transmission step ST6, when the warning transmission unit 105 determines that the difference between the width of the cutting groove 207 and the kerf width is not greater than the allowable value (step ST61: No), the process proceeds to the product cutting step ST7.

(Product cutting step)
The product cutting step ST7 is a step of cutting the workpiece 200, which is a product workpiece, after performing the cutting step ST3, the width detection step ST4, and the comparison step ST5. In the first embodiment, in the product cutting step ST7, the cutting device 1 performs cutting by cutting the cutting blade 21 into all streets 202 of the workpiece 200 to form the cutting grooves 207, similarly to the cutting step ST3. Thereafter, the workpiece 200 is transported to the cleaning unit 60 by the transport unit, cleaned by the cleaning unit 60, and then transported into the cassette 51 by the transport unit (step ST71).

In the product cutting step ST7, the control unit 100 determines whether all the workpieces 200 in the cassette 51 have been cut (step ST72). In the product cutting step ST7, when the control unit 100 determines that all the workpieces 200 in the cassette 51 have not been cut (step ST72: No), the process returns to step ST71, and as in the cutting step ST3, the cassette After taking out the uncut workpiece 200 from 51, it is cut. In the product cutting step ST7, when the control unit 100 determines that all the workpieces 200 in the cassette 51 have been cut (step ST72: Yes), the cutting method, that is, the processing operation of the cutting device 1 is ended.

As described above, the cutting method and cutting apparatus 1 according to the first embodiment obtain information on the kerf width from the identification code 214 in the identification code reading step ST1. The cutting method and the cutting device 1 install a cutting blade on the spindle 22 of the cutting device 1 that actually cuts the workpiece 200 in the blade installation step ST2, and then form a cutting groove 207 in the workpiece 200 in the cutting step ST3. Form. The cutting method and cutting device 1 compare the width of the cutting groove 207 and the kerf width in a comparison step ST5. As a result, the cutting method and cutting device 1 have the effect of being able to detect that the difference between the width of the cutting groove 207 actually formed by cutting the workpiece 200 and the kerf width is greater than or equal to the allowable value. play.

In addition, the cutting method and cutting device 1 can detect that the difference between the width of the cutting groove 207 and the kerf width is greater than the allowable value, so when processing the workpiece 200, which is a product workpiece, from the street. It is possible to suppress the possibility that the cutting groove 207 will protrude and damage the device.

In addition, in the cutting method and cutting device 1, when a plurality of cutting grooves 207 are formed in the cutting step ST3, the width of the cutting groove 207 formed last is detected in the width detection step ST4. You can report that there is a problem.

[Embodiment 2]
A cutting method and a cutting device according to Embodiment 2 of the present invention will be explained based on the drawings. FIG. 9 is a perspective view of a mirror wafer in which cutting grooves are formed in the cutting step of the cutting method according to the second embodiment. FIG. 10 is a perspective view of a dress board in which cutting grooves are formed in the cutting step of the cutting method according to the second embodiment. In addition, in FIGS. 9 and 10, the same parts as in Embodiment 1 are denoted by the same reference numerals, and the description thereof will be omitted.

In the cutting method and cutting apparatus 1 according to the second embodiment, in the cutting step ST3, the mirror wafer 200-1 shown in FIG. 9, which is a dummy workpiece different from the workpiece 200, or the dress shown in FIG. This embodiment is the same as the first embodiment except that the board 200-2 is cut to form the cutting grooves 207. The mirror wafer 200-1 shown in FIG. 9 is a wafer whose base material is the same as the workpiece 200, and the device 203 is not formed on the surface 201, and is composed only of the base material.

The dress board 200-2 is formed into a plate shape with a rectangular planar shape, and has abrasive grains such as WA (white alundum, alumina type) or GC (green carbonite, silicon carbide type) in a resin or ceramic bond material. It is composed of a mixture of In the second embodiment, the dress board 200-2 is cut by the cutting blade 21 in order to align the center of the outer edge of the cutting blade 213 of the cutting blade 21 with the axis of the spindle 22. used to wear out.

The cutting method and cutting apparatus 1 according to the second embodiment include a mirror wafer 200-1 or a dress board 200-2, which is a dummy workpiece, supported by an annular frame 205 in the same way as the workpiece 200, and placed in a cassette 51. In the cutting step ST3, the mirror wafer 200-1 or the dress board 200-2 is taken out from the cassette 51 and the cutting groove 207 is formed, and then the captured image 300 is acquired in the width detection step ST4. A wafer 200-1 or a dress board 200-2 is housed in a cassette 51.

In the cutting method and cutting apparatus 1 according to the second embodiment, in the product cutting step ST7, similarly to the cutting step ST3 of the first embodiment, after taking out the uncut workpiece 200 from the cassette 51, the product of the first embodiment is removed. As in the cutting step ST7, all the streets 202 are cut and cleaned, and then stored in the cassette 51.

The cutting method and cutting apparatus 1 according to the second embodiment compare the width of the cutting groove 207 and the kerf width, so as in the first embodiment, it is possible to actually cut the mirror wafer 200-1 or the dress board 200-2. This has the effect of being able to detect that the difference between the width of the cut groove 207 and the kerf width is equal to or larger than the allowable value.

Further, in the cutting method and cutting apparatus 1 according to the second embodiment, in the cutting step ST3, the mirror wafer 200-1 or the dress board 200-2, which is a dummy workpiece, is cut to form the cutting groove 207, so , the workpiece 200 is not cut when the difference between the width of the cutting groove 207 and the kerf width is greater than or equal to the allowable value.

[Modified example]
A cutting method and a cutting device according to Embodiments 1 and 2 of the present invention will be explained based on the drawings. FIG. 11 is an exploded perspective view showing a cutting unit of a cutting device according to a modification of Embodiment 1 and Embodiment 2. In addition, in FIG. 11, the same parts as in Embodiment 1 are given the same reference numerals, and the description thereof will be omitted.

In the cutting device 1 according to the modified example, as shown in FIG. 11, the cutting blade 21-1 is a washer blade composed of only the cutting blade 213, and the flange mechanism 24-1 is mounted by passing a boss portion 261 through the center. This embodiment is the same as the first and second embodiments except that it includes an annular holding flange 28 having a hole 281 and that the cutting blade 21 is sandwiched and fixed between the mount 26 and the holding flange 28.

Since the cutting method and cutting device 1 according to the modification compare the width of the cutting groove 207 and the kerf width, similarly to the first and second embodiments, the width of the cutting groove 207 and the kerf width that are actually formed are compared. This has the effect that it is possible to detect that the difference between the

Note that the present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the gist of the invention.

1 Cutting device 10 Holding table (holding means)
20 Cutting unit (cutting means)
21, 21-1 Cutting blade 22 Spindle 30 Imaging unit (imaging means)
40 Mobile unit (transportation means)
100 Control unit (control means)
101 Storage section 102 Width detection section 103 Comparison section 104 Tolerance range storage section 105 Warning transmission section 120 Reading unit (reading means)
200 Workpiece (product workpiece)
200-1 Mirror wafer (dummy workpiece)
200-2 Dress board (dummy workpiece)
207 Cutting groove 214 Identification code ST1 Identification code reading step ST2 Blade attachment step ST3 Cutting step ST4 Width detection step ST5 Comparison step ST6 Warning transmission step ST7 Product cutting step

Claims (4)

A cutting method in which a workpiece is cut with a cutting device in which a cutting blade is attached to the tip of a spindle,
The cutting blade has an identification code that includes at least information on the width of the cutting groove cut into the workpiece before shipping,
The cutting device includes means for reading the identification code,
an identification code reading step of reading the identification code of the cutting blade before it is mounted on the spindle with the reading means and obtaining the information on the width of the cutting groove before shipping;
After performing the identification code reading step, a blade mounting step of mounting the cutting blade on the tip of the spindle;
After performing the blade mounting step, a cutting step of cutting the workpiece to form a number of cutting grooves in the workpiece determined by the processing content information ;
a width detection step of imaging the cutting groove formed in the cutting step and detecting the width of the cutting groove;
a comparison step of comparing the width of the cut groove detected in the width detection step with the width of the cut groove before shipping obtained in the identification code reading step;
A warning is issued if the width of the cut groove detected in the width detection step compared in the comparison step and the width of the cut groove before shipping obtained in the identification code reading step are different from each other by more than an allowable range. a step for sending a warning;
After performing the cutting step, the width detection step, and the comparison step, it is determined in the warning issuing step that there is no deviation beyond an allowable range between the width of the cut groove and the width of the cut groove before shipping. a product cutting step of cutting all streets of the product workpiece when
Cutting method with. The cutting method according to claim 1, wherein in the cutting step, a dummy workpiece different from the product workpiece is cut. In the cutting step, forming a plurality of cutting grooves,
3. The cutting method according to claim 1, wherein in the width detection step, the width of the last cut groove formed among the plurality of cut grooves is detected. A cutting device,
holding means for holding the workpiece;
A cutting blade that cuts the workpiece held by the holding means and has an identification code that includes at least information on the width of a cutting groove cut into the workpiece before shipping, and the cutting blade is replaceably attached. a cutting means having a spindle;
moving means for moving the cutting means relative to the holding means;
means for reading the identification code;
an imaging means for taking an image of the workpiece held by the holding means;
At least a control means for controlling the moving means,
The control means includes:
a storage unit that reads the identification code of the cutting blade before being attached to the spindle with the reading means and stores the obtained information on the width of the cutting groove before shipping;
a width detection unit that detects the width of the cutting groove from a captured image of a number of cutting grooves formed on the workpiece according to the processing content information ;
a comparison unit that compares the width of the cut groove detected by the width detection unit and the width of the cut groove before shipping stored in the storage unit;
a tolerance storage unit that stores a groove width tolerance set for the width of the cut groove before shipping;
The width of the cut groove detected by the width detection unit compared with the comparison unit and the width of the cut groove before shipping stored in the storage unit are greater than or equal to the tolerance range stored in the tolerance range storage unit. a warning transmitter that transmits a warning when there is a deviation ;
A cutting device that cuts all streets of a product workpiece when the warning transmitter determines that there is no deviation beyond a permissible range between the width of the cutting groove and the width of the cutting groove before shipping.

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