CN112405911A - Cutting method and cutting device - Google Patents
Cutting method and cutting device Download PDFInfo
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- CN112405911A CN112405911A CN202010824912.6A CN202010824912A CN112405911A CN 112405911 A CN112405911 A CN 112405911A CN 202010824912 A CN202010824912 A CN 202010824912A CN 112405911 A CN112405911 A CN 112405911A
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- 238000003384 imaging method Methods 0.000 claims description 32
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0616—Grinders for cutting-off using a tool turning around the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Physics & Mathematics (AREA)
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- Machine Tool Sensing Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a cutting method and a cutting device, which can detect that the difference between the width of a cutting groove formed by actually cutting a workpiece and the width of a notch measured before delivery exceeds an allowable range. The cutting tool has an identification code containing information on a width of a cut made by the cutting tool cutting the workpiece before shipment, and the cutting device has a reading unit for the identification code. The cutting method comprises the following steps: an identification code reading step of reading the identification code of the cutting tool by using a reading unit to obtain information of the width of the cut; a tool mounting step of mounting a cutting tool at the front end of the spindle; a cutting step of cutting a workpiece to form a cutting groove; a width detection step of photographing the cutting groove and detecting the width of the cutting groove; a comparison step of comparing the width of the cutting groove with the width of the cut; and a warning step of giving a warning when the width of the cutting groove compared in the comparison step and the width of the cut deviate beyond an allowable range.
Description
Technical Field
The present invention relates to a cutting method and a cutting apparatus for cutting a workpiece by using a cutting apparatus.
Background
The following cutting device was used: a wafer made of silicon or the like is cut along streets by a cutting tool and divided into individual devices (see, for example, patent document 1).
In the cutting tool, a wafer is cut to form a cutting groove before shipment from a factory, and the width of the cutting groove is measured. The cutting tool is stored with the measured width of the cutting groove as a notch width in an identification code such as a two-dimensional code or a barcode, the identification code is marked on the cutting tool or a storage container for storing the cutting tool, and the cutting tool is shipped with emphasis on the predetermined notch width.
Patent document 1: japanese patent laid-open publication No. 2018-129329
On the other hand, when the cutting tool is attached to the tip of the spindle, the cutting tool may be attached in a state slightly inclined with respect to the axis of the spindle. When the cutting tool is attached in a slightly inclined state with respect to the axial center of the spindle to cut the workpiece, the width of the cutting groove formed by cutting the workpiece is wider than the width of the notch which is measured before shipment and stored in the identification code.
Further, the cutting tool may be slightly damaged when attached to the tip of the spindle, and when attached to the spindle without noticing the damage, the difference between the width of the cutting groove formed by cutting the workpiece and the width of the notch which is measured before shipment and stored in the identification code may be increased. When the cutting tool is damaged, the cutting edge of the cutting tool bends and advances during cutting, and the width of the cutting groove is wider than the width of the notch, and thus normal cutting may not be performed. In addition, when the cutting tool is damaged and the cutting edge is broken or cracked, the width of the cutting groove is narrower than the width of the notch, and thus normal cutting may not be performed.
For example, when a wafer is cut, if the width of a cut groove formed by actual cutting is larger than an assumed notch width, the cut groove or a region generated by a defect called a chipping may protrude from a street, which may damage an active region of a device, and thus improvement is desired.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a cutting method and a cutting apparatus capable of detecting that a difference between a width of a cutting groove formed by actually cutting a workpiece and a width of a notch measured before shipment exceeds an allowable range.
In order to solve the above-described problems, a cutting method according to the present invention is a cutting method for cutting a workpiece by using a cutting apparatus having a cutting tool attached to a tip of a spindle, the cutting tool having an identification code including information on a width of a cutting groove obtained by cutting the workpiece by the cutting tool before shipment, the cutting apparatus having a reading means for the identification code, the cutting method including the steps of: an identification code reading step of reading the identification code of the cutting tool by the reading member to obtain the information of the width of the cutting groove before shipment; a tool mounting step of mounting the cutting tool to the tip of the spindle after the identification code reading step is performed; a cutting step of cutting the workpiece to form a cut groove after the tool mounting step is performed; a width detection step of detecting a width of the cutting groove by imaging the cutting groove formed in the cutting step; a comparison step of comparing the width of the cutting groove detected by the width detection step with the width of the cutting groove before shipment obtained by the identification code reading step; and an alarm step of giving an alarm when the width of the cutting groove detected by the width detection step and the width of the cutting groove before shipment obtained by the identification code reading step deviate beyond an allowable range as a result of comparison by the comparison step.
The cutting method may also have the following product cutting steps: after the cutting step, the width detection step, and the comparison step are performed, a product workpiece is cut, and in the cutting step, a virtual workpiece different from the product workpiece is cut.
In the cutting method, a plurality of the cutting grooves may be formed in the cutting step, and the width of the cutting groove formed last among the plurality of the cutting grooves may be detected in the width detection step.
The cutting device of the present invention is characterized by comprising: a holding member that holds a workpiece; a cutting member having a cutting tool for cutting the workpiece held by the holding member, the cutting tool having an identification code including information on a width of a cutting groove obtained by cutting the workpiece by the cutting tool before shipment, and a spindle to which the cutting tool is replaceably attached; a moving member that relatively moves the cutting member with respect to the holding member; reading means of the identification code; an imaging member that images the workpiece held by the holding member; and a control member that controls the moving member, the control member having: a storage unit that stores the information on the width of the cutting groove before shipment obtained by reading the identification code of the cutting tool by the reading means; a width detection unit that detects a width of a cutting groove formed in a workpiece based on an image obtained by imaging the cutting groove; a comparison unit that compares the width of the cutting groove detected by the width detection unit with the width of the cutting groove before shipment stored in the storage unit; an allowable range storage unit that stores an allowable range of a groove width set with respect to a width of a cutting groove before shipment; and an alarm transmitting unit that issues an alarm when the width of the cutting flute detected by the width detecting unit and the width of the cutting flute before shipment stored in the storage unit deviate from each other by more than the allowable range stored in the allowable range storage unit as a result of comparison by the comparing unit.
The invention of the application has the following effects: it can be detected that the difference between the width of the cutting groove formed by actually cutting the workpiece and the width of the notch measured before shipment exceeds the allowable range.
Drawings
Fig. 1 is a perspective view showing a configuration example of a cutting apparatus according to embodiment 1.
Fig. 2 is a perspective view showing the cutting unit according to embodiment 1 in an exploded manner.
Fig. 3 is a perspective view of a cutting tool of the cutting unit shown in fig. 2.
Fig. 4 is a plan view of a storage container that stores the cutting insert shown in fig. 3.
Fig. 5 is a flowchart showing a flow of the cutting method according to embodiment 1.
Fig. 6 is a side view schematically showing a cutting step of the cutting method shown in fig. 5 in a partial sectional view.
Fig. 7 is a side view schematically showing a width detecting step of the cutting method shown in fig. 5 in a partial sectional view.
Fig. 8 is a view schematically showing a captured image captured by the imaging unit in the width detection step of the cutting method shown in fig. 5.
Fig. 9 is a perspective view of a mirror-surface wafer having a cut groove formed in a cutting step in the cutting method according to embodiment 2.
Fig. 10 is a perspective view of a trimming plate in which a cut groove is formed in a cutting step of the cutting method of embodiment 2.
Fig. 11 is a perspective view showing a cutting unit of the cutting apparatus according to the modification examples of embodiment 1 and embodiment 2 in an exploded manner.
Description of the reference symbols
1: a cutting device; 10: a holding table (holding member); 20: a cutting unit (cutting member); 21. 21-1: a cutting tool; 22: a main shaft; 30: an imaging unit (imaging means); 40: a moving unit (moving member); 100: a control unit (control means); 101: a storage unit; 102: a width detection unit; 103: a comparison unit; 104: an allowable range storage unit; 105: a warning transmitting unit; 120: a reading unit (reading member); 200: a workpiece (product workpiece); 200-1: mirror wafers (virtual workpieces); 200-2: a trimming plate (virtual workpiece); 207: cutting a groove; 214: an identification code; ST 1: reading an identification code; ST 2: a tool mounting step; ST 3: cutting; ST 4: a width detection step; ST 5: a comparison step; ST 6: a warning step; ST 7: and (5) cutting the product.
Detailed Description
A mode (embodiment) for carrying out the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. The components described below include those that can be easily conceived by those skilled in the art, and substantially the same ones. The following structures may be combined as appropriate. Various omissions, substitutions, and changes in the structure may be made without departing from the spirit of the invention.
[ embodiment 1 ]
A cutting method and a cutting apparatus according to embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a cutting apparatus according to embodiment 1. Fig. 2 is a perspective view showing the cutting unit according to embodiment 1 in an exploded manner. Fig. 3 is a perspective view of a cutting tool of the cutting unit shown in fig. 2. Fig. 4 is a plan view of a storage container that stores the cutting insert shown in fig. 3.
A cutting apparatus 1 shown in fig. 1 of embodiment 1 is an apparatus for cutting (machining) a workpiece 200. In embodiment 1, the workpiece 200 is a wafer such as a disc-shaped semiconductor wafer or an optical device wafer having silicon, sapphire, gallium, or the like as a base material. The workpiece 200 has devices 203 formed on the front surface 201 in regions partitioned in a lattice shape by a plurality of streets 202 formed in a lattice shape.
The workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer having a thinned central portion and a thick portion formed on an outer peripheral portion, or may be a rectangular package substrate, a ceramic plate, a glass plate, or the like having a plurality of devices sealed with resin, in addition to a wafer. A disc-shaped adhesive tape 206 is attached to the back surface 204 of the workpiece 200, and an annular frame 205 having an inner diameter larger than the outer diameter of the workpiece 200 is attached to the outer periphery of the adhesive tape 206 and supported by an opening inside the annular frame 205. As described above, the workpiece 200 according to embodiment 1 is also a product workpiece divided into the individual devices 203. That is, the product workpiece refers to the workpiece 200 divided into the devices 203 used in various electronic devices.
The cutting apparatus 1 shown in fig. 1 is an apparatus that holds a workpiece 200 by a holding table 10 and performs cutting along a street 202 by a cutting tool 21. As shown in fig. 1, the cutting apparatus 1 includes: a holding table 10 as a holding member for holding the workpiece 200 on the holding surface 11 by suction; a cutting unit 20 as a cutting member having a cutting tool 21 for cutting the workpiece 200 held by the holding table 10 and a spindle 22 to which the cutting tool 21 is replaceably attached; an imaging unit 30 as imaging means for imaging the workpiece 200 held by the holding table 10; and a control unit 100 as a control means.
As shown in fig. 1, the cutting apparatus 1 includes a moving means 40 as a moving member, and the moving means 40 moves the cutting means 20 relative to the holding table 10. The mobile unit 40 includes: an X-axis moving unit 41 that performs machining feed of the holding table 10 in an X-axis direction parallel to the horizontal direction and the width direction of the apparatus main body 2; a Y-axis moving unit 42 that performs index feed of the cutting unit 20 in a Y-axis direction parallel to the horizontal direction and the longitudinal direction of the apparatus body 2 and perpendicular to the X-axis direction; a Z-axis moving means 43 for performing cutting-in and feeding of the cutting means 20 in a Z-axis direction parallel to a vertical direction perpendicular to both the X-axis direction and the Y-axis direction; and a rotation moving unit 44 that rotates the holding table 10 about an axis parallel to the Z-axis direction and performs machining feed in the X-axis direction together with the holding table 10 by the X-axis moving unit 41.
The holding table 10 has a disk shape, and the holding surface 11 for holding the workpiece 200 is formed of a porous material such as porous ceramic. The holding table 10 is provided to be movable in the X-axis direction by the X-axis moving unit 41 and rotatable about the axis by the rotating unit 44. The holding table 10 is connected to a vacuum suction source, not shown, and sucks and holds the workpiece 200 placed on the holding surface 11 by the vacuum suction source. Further, a plurality of clamping portions 12 for clamping the ring frame 205 are provided around the holding table 10.
The cutting unit 20 is a cutting member to which a cutting tool 21 for cutting the workpiece 200 held by the holding table 10 is detachably attached. The cutting unit 20 is provided to be movable in the Y-axis direction by the Y-axis moving unit 42 and movable in the Z-axis direction by the Z-axis moving unit 43 with respect to the workpiece 200 held by the holding table 10.
As shown in fig. 1, the cutting unit 20 is provided on the support frame 3 erected from the apparatus main body 2 via the Y-axis moving unit 42, the Z-axis moving unit 43, and the like. The cutting unit 20 can position the cutting tool 21 at an arbitrary position on the holding surface 11 of the holding table 10 by the Y-axis moving unit 42 and the Z-axis moving unit 43.
As shown in fig. 2, the cutting unit 20 includes, in addition to a cutting tool 21 and a spindle 22 having the cutting tool 21 attached to a tip thereof: a spindle housing 23 that accommodates the spindle 22 so as to be freely rotatable about the axis thereof while being moved in the Y-axis direction and the Z-axis direction by the Y-axis moving unit 42 and the Z-axis moving unit 43; a spindle motor, not shown, which is housed in the spindle case 23 and rotates the spindle 22 around the axis; and a flange mechanism 24 for detachably attaching the cutting tool 21 to the tip of the spindle 22.
The cutting tool 21 is an extremely thin cutting abrasive having a substantially ring shape. In embodiment 1, the cutting insert 21 includes: an annular base 212 having a mounting hole 211 at the center; an annular cutting edge 213 that is provided on the outer peripheral edge of the base 212 and cuts the workpiece 200; and an identification code 214. The identification code 214 includes at least information on a notch width of the cutting groove 207 (shown by a broken line in fig. 1) formed by cutting the workpiece 200 with the cutting tool 21 before shipment from a factory where the cutting tool 21 is manufactured. That is, the notch width is the width of the cutting groove 207 before shipment.
In embodiment 1, the identification code 214 is provided on the end face of the base 212 shown in fig. 2 and 3, but in the present invention, it may be provided on the front face of the storage container 215 shown in fig. 4 that stores the cutting tool 21 during transportation. The identification code 214 is formed of, for example, a two-dimensional code showing at least the above-described information on the width of the cut, a barcode, a specification mark formed of at least one of characters and numbers, or the like.
The flange mechanism 24 has: a mount 26 fixed to the front end of the main shaft 22 by a bolt 25 screwed into a screw hole 221 provided at the front end of the main shaft 22; and a nut 27 screwed with a male screw 262 provided on the outer peripheral surface of the convex portion 261 of the mount 26.
The mount 26 has: a cylindrical projection 261 into which the tip of the spindle 22 is inserted; and an annular flange portion 263 that protrudes in the outer circumferential direction from one end of the protruding portion 261 that is close to the spindle housing 23. The convex portion 261 has a male screw 262 formed on an outer peripheral surface thereof and is inserted into the mounting hole 211 of the base 212 of the cutting tool 21. The nut 27 is screwed to the external thread 262 of the convex portion 261 inserted into the mounting hole 211 of the cutting tool 21.
The flange mechanism 24 inserts the convex portion 261 of the mount 26 fixed to the tip of the spindle 22 into the mounting hole 211, and screws the nut 27 to the male screw 262, thereby sandwiching the base 212 between the flange portion 263 and the nut 27 and mounting the cutting tool 21 to the tip of the spindle 22. The flange mechanism 24 is configured to be detachable from the spindle 22 via the mount 26 by removing the nut 27 from the male screw 262.
The axial centers of the spindle 22 and the cutting tool 21 of the cutting unit 20 are set parallel to the Y-axis direction.
The X-axis moving unit 41 moves the holding table 10 in the X-axis direction, which is a machining feed direction, and relatively feeds the holding table 10 and the cutting unit 20 in the X-axis direction. The Y-axis moving unit 42 moves the cutting unit 20 in the Y-axis direction, which is an index feeding direction, and indexes the holding table 10 and the cutting unit 20 relatively in the Y-axis direction. The Z-axis moving unit 43 moves the cutting unit 20 in the Z-axis direction, which is the cutting feed direction, and cuts and feeds the holding table 10 and the cutting unit 20 relatively in the Z-axis direction.
The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 have: a known ball screw provided to be rotatable about an axis; a known pulse motor that rotates a ball screw around an axis; and a known guide rail that supports the holding table 10 or the cutting unit 20 to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction.
Further, the cutting device 1 includes: an X-axis direction position detection unit, not shown, for detecting the position of the holding table 10 in the X-axis direction; a Y-axis direction position detection unit, not shown, for detecting the position of the cutting unit 20 in the Y-axis direction; and a Z-axis direction position detection unit for detecting a Z-axis direction position of the cutting unit 20. The X-axis direction position detecting unit and the Y-axis direction position detecting unit may be constituted by a linear scale parallel to the X-axis direction or the Y-axis direction and a readhead. The Z-axis direction position detecting unit detects the Z-axis direction position of the cutting unit 20 by using the pulse of the pulse motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the X-axis direction of the holding table 10, and the Y-axis direction or Z-axis direction position of the cutting unit 20 to the control unit 100. In embodiment 1, each position is determined by the distance in the X-axis direction, the Y-axis direction, and the Z-axis direction from a preset reference position.
Further, the cutting device 1 includes: a cassette lifter 50 for placing a cassette 51 for storing the workpiece 200 before and after cutting and moving the cassette 51 in the Z-axis direction; a cleaning unit 60 for cleaning the cut workpiece 200; and a conveying unit, not shown, that conveys the workpiece 200 while moving the workpiece 200 in and out of the cassette 51.
The imaging unit 30 is fixed so as to move integrally with the cutting unit 20. The imaging unit 30 includes an imaging element for imaging a region to be divided of the workpiece 200 before cutting held by the holding table 10. The imaging Device is, for example, a CCD (Charge-Coupled Device) imaging Device or a CMOS (Complementary metal oxide semiconductor) imaging Device. The imaging unit 30 images the workpiece 200 held by the holding table 10 to obtain an image for performing alignment, that is, positioning of the workpiece 200 and the cutting tool 21, and outputs the obtained image to the control unit 100.
The imaging unit 30 has epi-illumination (also referred to as coaxial illumination) and oblique illumination for irradiating the workpiece 200 held by the holding table 10 with illumination light. The epi-illumination is coaxial with the optical axis of the imaging device and irradiates the workpiece 200 held by the holding table 10 with illumination light. The oblique illumination irradiates the illumination light to the workpiece 200 held by the holding table 10 in a direction intersecting the optical axis of the imaging device. The amounts of the epi-illumination and the oblique illumination of the photographing unit 30 are set in advance.
The control unit 100 controls the above-described components of the cutting apparatus 1, and causes the cutting apparatus 1 to perform a machining operation on the workpiece 200. That is, the control unit 100 controls at least the moving unit 40. Further, the control unit 100 is a computer, and the control unit 100 includes: an arithmetic processing device having a microprocessor such as a Central Processing Unit (CPU); a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory); and an input/output interface device. The arithmetic processing device of the control unit 100 causes the arithmetic processing device to perform arithmetic processing in accordance with a computer program stored in the storage device, and outputs a control signal for controlling the cutting apparatus 1 to the above-described components of the cutting apparatus 1 via the input/output interface device.
The control unit 100 is connected to a display unit, not shown, including a liquid crystal display device or the like for displaying a state of a machining operation, an image, or the like, and an input unit used by an operator for registering machining content information or the like. The input unit is configured by at least one of an external input device such as a touch panel and a keyboard provided in the display unit.
As shown in fig. 1, the cutting apparatus 1 includes a notification unit 110 and a reading unit 120 as a reading means. The notification unit 110 notifies the operator by emitting at least one of sound and light.
The reading unit 120 reads the identification code 214 and outputs information on the slit width indicated by the identification code 214 to the control unit 100. In the case where the identification code 214 is a two-dimensional code or a barcode, the reading unit 120 is a barcode reader. In the case where the identification code 214 is a specification mark, the reading unit 120 is constituted by an OCR (Optical Character Recognition/Reader).
As shown in fig. 1, the control unit 100 includes a storage unit 101, a width detection unit 102, a comparison unit 103, an allowable range storage unit 104, and an alarm transmission unit 105.
The storage unit 101 stores information on the width of the cut obtained by reading the identification code 214 of the cutting tool 21 by the reading unit 120. The width detection unit 102 detects the width of the cutting groove 207 based on a captured image 300 (an example is shown in fig. 8), the captured image 300 being obtained by capturing an image of the cutting groove 207 formed in the workpiece 200 by the imaging unit 30 by causing the cutting edge 213 of the cutting tool 21 of the cutting unit 20 to cut into the workpiece 200.
The comparison unit 103 compares the width of the cut groove 207 detected by the width detection unit 102 with the notch width stored in the storage unit 101. The allowable range storage unit 104 stores an allowable value corresponding to an allowable range of the width of the cutting groove 207 of the processing content information registered by the operator. The allowable value of the width of the cutting flute 207 is a value indicating an allowable range of the width of the cutting flute 207 set with respect to the notch width, and is also a value for determining whether or not the width of the cutting flute 207 formed in the workpiece 200 by the cutting tool 21 is good. The allowable value of the width of the cutting groove 207 is a value that can be determined as a width defect of the cutting groove 207 when the difference between the cutting groove 207 and the notch width exceeds the allowable value, and can be determined as a width defect of the cutting groove 207 when the difference between the cutting groove 207 and the notch width is equal to or less than the allowable value.
The warning transmitter 105 operates the notification unit 110 to issue a warning when there is a deviation between the width of the cutting groove 207 detected by the width detector 102 compared by the comparator 103 and the width of the notch stored in the storage unit 101, which exceeds the allowable value (allowable range) stored in the allowable range storage unit 104.
The function of the storage unit 101 is realized by storing information on the notch width in a storage device. The functions of the comparison unit 103 and the warning transmission unit 105 are realized by the arithmetic processing device executing a computer program stored in the storage device. The function of the allowable range storage unit 104 is realized by storing allowable values (allowable ranges) in a storage device.
Next, the machining operation of the cutting apparatus 1, that is, the cutting method according to embodiment 1 will be described with reference to the drawings. Fig. 5 is a flowchart showing a flow of the cutting method according to embodiment 1.
The cutting method according to embodiment 1 is a machining operation of the cutting apparatus 1 in which the cutting tool 21 is attached to the spindle 22 and the cutting tool 21 attached to the spindle 22 is caused to cut into the workpiece 200. That is, the cutting method according to embodiment 1 is a method in which the cutting tool 21 is attached to the spindle 22 and the workpiece 200 is cut by the cutting apparatus 1 in which the cutting tool 21 is attached to the tip of the spindle 22.
As shown in fig. 5, the cutting method has an identification code reading step ST1, a tool mounting step ST2, a cutting step ST3, a width detection step ST4, a comparison step ST5, an alarm step ST6, and a product cutting step ST 7.
Before starting the machining operation of the cutting apparatus 1, which is the cutting method according to embodiment 1, the control unit 100 receives and registers the machining content information input by the operator operating the input unit. The machining content information includes an allowable value (allowable range) of the width of the cut groove 207, the number of the cut grooves 207 formed in the cutting step ST3, and the like. Therefore, the allowable range storage unit 104 stores an allowable value (allowable range) of the width of the cutting groove 207. When the operator places the cassette 51 containing the workpiece 200 before cutting on the cassette lifter 50 and receives an instruction to start the machining operation input by the operator operating the input means from the control means 100, the machining operation of the cutting apparatus 1, which is the cutting method according to embodiment 1, is started.
(identification code reading step)
The identification code reading step ST1 is a step of reading the identification code 214 of the cutting tool 21 attached to the spindle 22 by the reading means 120 to obtain information on the notch width indicated by the identification code 214. When the machining operation is started, the process proceeds to the identification code reading step ST1, and in the identification code reading step ST1, the reading unit 120 of the cutting apparatus 1 reads the identification code 214 of the cutting tool 21 and outputs information on the notch width indicated by the read identification code 214 to the control unit 100. In the identification code reading step ST1, the storage unit 101 of the control unit 100 stores the information of the notch width input from the reading unit 120. Then, the process proceeds to a tool mounting step ST 2.
(cutter mounting step)
The tool mounting step ST2 is a step of mounting the cutting tool 21 to the tip of the spindle 22 of the cutting unit 20 after the identification code reading step ST1 is performed. In embodiment 1, in the tool mounting step ST2, the operator mounts the cutting tool 21, from which the identification code 214 has been read in the identification code reading step ST1, to the tip of the spindle 22. Then, the process proceeds to cutting step ST 3.
(cutting step)
Fig. 6 is a side view schematically showing a cutting step of the cutting method shown in fig. 5 in a partial sectional view. The cutting step ST3 is a step of cutting the workpiece 200 after the tool attachment step ST2 is performed, to form the cut groove 207.
In embodiment 1, in the cutting step ST3, the cutting apparatus 1 takes out the workpiece 200 from the cassette 51 by the carrying means, places the workpiece on the holding surface 11 of the holding table 10, sucks and holds the workpiece 200 on the holding surface 11 via the adhesive tape 206, and sandwiches the annular frame 205 by the nip portion 12. In the cutting step ST3, the cutting apparatus 1 moves the holding table 10 to the lower side of the imaging unit 30 by the moving unit 40, and performs alignment by imaging the workpiece 200 sucked and held by the holding table 10 by the imaging unit 30.
In the cutting step ST3, the cutting apparatus 1 moves the cutting tool 21 and the workpiece 200 relatively along the streets 202 by the moving means 40 based on the machining content information, and cuts the streets 202 of the workpiece 200 to form the number of cutting grooves 207 set in the machining content information. Then, the process proceeds to a width detection step ST 4. The number of the cutting grooves 207 formed in the cutting step ST3 set in the processing content information may be 1 or more.
(Width detection step)
Fig. 7 is a side view schematically showing a width detecting step of the cutting method shown in fig. 5 in a partial sectional view. Fig. 8 is a view schematically showing a captured image captured by the imaging unit in the width detection step of the cutting method shown in fig. 5. The width detection step ST4 is a step of detecting the width of the cut groove 207 by imaging the cut groove 207 formed in the cutting step ST3 by the imaging unit 30.
In embodiment 1, in the width detection step ST4, the cutting apparatus 1 positions a predetermined position of the cut groove 207 below the imaging unit 30 by the moving unit 40 as shown in fig. 7, and captures the cut groove 207 by the imaging unit 30 to obtain the captured image 300 illustrated in fig. 8. In embodiment 1, when the plurality of cutting grooves 207 are formed in the cutting step ST3, the width detection step ST4 captures a predetermined position of the cutting groove 207 formed last among the plurality of cutting grooves 207, and acquires the captured image 300.
In embodiment 1, the captured image 300 receives a large amount of light from the front surface 201 of the workpiece 200, and therefore the front surface 201 of the workpiece 200 is shown in white in fig. 8, and the cut groove 207 is shown in shaded in fig. 8 because the amount of light received from the cut groove 207 is small. In the width detection step ST4, the width detection unit 102 performs known image processing on the captured image 300, detects the cutting groove 207 from the captured image 300, and detects the width of the cutting groove 207. Then, the process proceeds to a comparison step ST 5. As described above, in embodiment 1, when the plurality of cut grooves 207 are formed in the cutting step ST3, the width of the last formed cut groove 207 among the plurality of cut grooves 207 is detected in the width detection step ST 4.
(comparative step)
The comparison step ST5 is a step of comparing the width of the cut groove 207 detected in the width detection step ST4 with the kerf width obtained through the identification code reading step ST 1. In the comparison step ST5, the comparison unit 103 calculates the difference between the width of the cut groove 207 detected by the width detection unit 102 in the width detection step ST4 and the notch width stored in the storage unit 101 after the identification code 214 is read in the identification code reading step ST1, and compares the width of the cut groove 207 with the notch width. Then, the process proceeds to a warning step ST 6.
(Warning step)
The warning step ST6 is a step of issuing a warning if there is a deviation of the width of the cut groove 207 detected in the width detection step ST4 from the cut width obtained in the identification code reading step ST1 exceeding an allowable value (allowable range) as a result of the comparison in the comparison step ST 5. In the warning step ST6, the warning transmitter 105 determines whether or not the difference between the width of the cutting flute 207 detected by the width detector 102 and the notch width stored in the storage 101 exceeds the allowable value (allowable range) stored in the allowable range storage 104 (step ST 61).
In the warning step ST6, when the warning transmitter 105 determines that the difference between the width of the cutting flute 207 and the kerf width exceeds the allowable value (allowable range) (step ST 61: yes), the notification unit 110 is operated to issue a warning that there is a deviation exceeding the allowable value (allowable range) between the width of the cutting flute 207 and the kerf width (step ST62), and when there is a defect in the cutting tool 21, the warning is issued to an operator or the like. In this case, the cutting method, that is, the machining operation of the cutting apparatus 1 is terminated thereafter. In the warning step ST6, when the warning transmitter 105 determines that the difference between the width of the cut groove 207 and the notch width does not exceed the allowable value (allowable range) (no in step ST61), the process proceeds to a product cutting step ST 7.
(product cutting step)
The product cutting step ST7 is a step of cutting the workpiece 200, which is the product workpiece, after the cutting step ST3, the width detection step ST4, and the comparison step ST5 are performed. In embodiment 1, in the product cutting step ST7, the cutting apparatus 1 cuts the workpiece 200 by cutting the cutting tool 21 into all the streets 202 to form the cut grooves 207, in the same manner as in the cutting step ST3, conveys the workpiece 200 to the cleaning unit 60 by the conveying unit, cleans the workpiece by the cleaning unit 60, and conveys the workpiece to the cassette 51 by the conveying unit (step ST 71).
In the product cutting step ST7, the control unit 100 determines whether or not all the workpieces 200 in the cassette 51 have been cut (step ST 72). When the control unit 100 determines in the product cutting step ST7 that all the workpieces 200 in the cassette 51 have not been cut (no in step ST72), the process returns to step ST71, and the uncut workpieces 200 are taken out of the cassette 51 and cut in the same manner as in the cutting step ST 3. In the product cutting step ST7, when the control unit 100 determines that all the workpieces 200 in the cassette 51 have been cut (step ST 72: yes), the cutting method, that is, the machining operation of the cutting apparatus 1 is ended.
As described above, in the cutting method and the cutting apparatus 1 according to embodiment 1, the information on the kerf width is obtained from the identification code 214 in the identification code reading step ST 1. In the cutting method and the cutting apparatus 1, after the cutting tool is attached to the spindle 22 of the cutting apparatus 1 that actually cuts the workpiece 200 in the tool attachment step ST2, the cutting groove 207 is formed in the workpiece 200 in the cutting step ST 3. In the cutting method and the cutting apparatus 1, the width of the cutting groove 207 is compared with the cut width in the comparison step ST 5. As a result, the cutting method and the cutting apparatus 1 exhibit the following effects: it can be detected that the difference between the width of the cutting groove 207 actually formed by cutting the workpiece 200 and the width of the cut exceeds an allowable value (allowable range).
Further, since the cutting method and the cutting apparatus 1 can detect that the difference between the width of the cutting groove 207 and the width of the notch exceeds the allowable value (allowable range), when the workpiece 200, which is a product workpiece, is machined, it is possible to suppress the possibility that the cutting groove 207 protrudes from the street and damages the device.
In addition, in the cutting method and the cutting apparatus 1, when the plurality of cutting grooves 207 are formed in the cutting step ST3, since the width of the cutting groove 207 formed last is detected in the width detection step ST4, it can be found that there is a defect in the cutting tool 21.
[ 2 nd embodiment ]
A cutting method and a cutting apparatus according to embodiment 2 of the present invention will be described with reference to the drawings. Fig. 9 is a perspective view of a mirror-surface wafer having a cut groove formed in a cutting step in the cutting method according to embodiment 2. Fig. 10 is a perspective view of a trimming plate in which a cut groove is formed in a cutting step of the cutting method of embodiment 2. In fig. 9 and 10, the same portions as those of embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.
The cutting method and the cutting apparatus 1 according to embodiment 2 are similar to embodiment 1 except that the mirror wafer 200-1 shown in fig. 9 or the trimming plate 200-2 shown in fig. 10, which is a virtual workpiece different from the workpiece 200, is cut in the cutting step ST3 to form the cut groove 207. The mirror surface wafer 200-1 shown in fig. 9 is a wafer having the same base material as the workpiece 200, and is composed of only the base material without forming the device 203 on the front surface 201.
The finishing plate 200-2 is formed in a plate shape having a rectangular planar shape, and the finishing plate 200-2 is formed by mixing abrasive grains such as WA (white corundum, alumina-based), GC (green carbonate, silicon carbide-based) into a bonding material of resin or ceramics. In embodiment 2, the dressing plate 200-2 is used to abrade the cutting edge 213 of the cutting tool 21 so that the cutting tool 21 cuts the outer edge of the cutting edge 213 of the cutting tool 21 and the axis of the spindle 22.
The cutting method and the cutting apparatus 1 according to embodiment 2 store the mirror wafer 200-1 or the trimming plate 200-2 as a virtual workpiece in the cassette 51 in a state of being supported by the ring frame 205 in advance in the same manner as the workpiece 200, take out the mirror wafer 200-1 or the trimming plate 200-2 from the cassette 51 in the cutting step ST3, form the cut groove 207, acquire the captured image 300 in the width detection step ST4, and store the mirror wafer 200-1 or the trimming plate 200-2 in the cassette 51.
In the cutting method and the cutting apparatus 1 according to embodiment 2, in the product cutting step ST7, the uncut workpiece 200 is taken out from the cassette 51 in the same manner as in the cutting step ST3 according to embodiment 1, and then all the streets 202 are cut and cleaned in the same manner as in the product cutting step ST7 according to embodiment 1, and then stored in the cassette 51.
Since the cutting method and the cutting apparatus 1 according to embodiment 2 compare the width of the cut groove 207 with the notch width, the following effects are obtained as in embodiment 1: it can be detected that the difference between the width of the cut groove 207 actually cut into the mirror wafer 200-1 or the trimming plate 200-2 and the width of the notch exceeds an allowable value (allowable range).
In addition, since the cutting method and the cutting apparatus 1 according to embodiment 2 cut the mirror wafer 200-1 or the dressing plate 200-2 as the virtual object to be processed to form the cut groove 207 in the cutting step ST3, the following effects are obtained in particular: when the difference between the width of the cutting groove 207 and the width of the notch exceeds an allowable value (allowable range), the workpiece 200 is not cut.
[ modified examples ]
A modification of the cutting method and the cutting apparatus according to embodiment 1 and embodiment 2 of the present invention will be described with reference to the drawings. Fig. 11 is a perspective view showing a cutting unit of the cutting apparatus according to the modification examples of embodiment 1 and embodiment 2 in an exploded manner. In fig. 11, the same portions as those in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.
As shown in fig. 11, the cutting apparatus 1 according to the modification is the same as the first embodiment 1 and the second embodiment 2 except that the cutting insert 21-1 is a washer insert constituted only by the cutting edge 213, the flange mechanism 24-1 has an annular pressing flange 28 having a mounting hole 281 in the center through which the convex portion 261 passes, and the cutting insert 21 is held and fixed between the mounting seat 26 and the pressing flange 28.
Since the cutting method and the cutting apparatus 1 of the modification compare the width of the cut groove 207 with the notch width, the following effects are obtained as in the case of the 1 st and 2 nd embodiments: it can be detected that the difference between the width of the actually formed cutting groove 207 and the width of the notch exceeds an allowable value (allowable range).
The present invention is not limited to the above embodiments. That is, various modifications can be made and implemented without departing from the scope of the present invention.
Claims (4)
1. A cutting method for cutting a workpiece by a cutting device having a cutting tool attached to a tip of a spindle,
the cutting tool has an identification code containing information on the width of a cutting groove obtained by cutting the workpiece with the cutting tool before shipment,
the cutting device has a reading means for the identification code,
the cutting method comprises the following steps:
an identification code reading step of reading the identification code of the cutting tool by the reading member to obtain the information of the width of the cutting groove before shipment;
a tool mounting step of mounting the cutting tool to the tip of the spindle after the identification code reading step is performed;
a cutting step of cutting the workpiece to form a cut groove after the tool mounting step is performed;
a width detection step of detecting a width of the cutting groove by imaging the cutting groove formed in the cutting step;
a comparison step of comparing the width of the cutting groove detected by the width detection step with the width of the cutting groove before shipment obtained by the identification code reading step; and
and a warning step of issuing a warning when the width of the cutting groove detected in the width detection step and the width of the cutting groove before shipment obtained in the identification code reading step deviate beyond an allowable range as a result of comparison in the comparison step.
2. The cutting method according to claim 1,
the cutting method also comprises the following product cutting steps: cutting the product to be processed after the cutting step, the width detecting step and the comparing step are performed,
in the cutting step, a virtual workpiece different from the product workpiece is cut.
3. The cutting method according to claim 1 or 2,
in the cutting step, a plurality of the cutting grooves are formed,
in the width detecting step, a width of the cutting groove formed last among the plurality of cutting grooves is detected.
4. A cutting device, wherein,
the cutting device comprises:
a holding member that holds a workpiece;
a cutting member having a cutting tool for cutting the workpiece held by the holding member, the cutting tool having an identification code including information on a width of a cutting groove obtained by cutting the workpiece by the cutting tool before shipment, and a spindle to which the cutting tool is replaceably attached;
a moving member that relatively moves the cutting member with respect to the holding member;
reading means of the identification code;
an imaging member that images the workpiece held by the holding member; and
a control member that controls the moving member,
the control member has:
a storage unit that stores the information on the width of the cutting groove before shipment obtained by reading the identification code of the cutting tool by the reading means;
a width detection unit that detects a width of a cutting groove formed in a workpiece based on an image obtained by imaging the cutting groove;
a comparison unit that compares the width of the cutting groove detected by the width detection unit with the width of the cutting groove before shipment stored in the storage unit;
an allowable range storage unit that stores an allowable range of a groove width set with respect to a width of a cutting groove before shipment; and
and a warning transmitting unit that issues a warning when the width of the cutting flute detected by the width detecting unit and the width of the cutting flute before shipment stored in the storage unit deviate from each other by more than the allowable range stored in the allowable range storage unit as a result of comparison by the comparing unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-150369 | 2019-08-20 | ||
| JP2019150369A JP7416581B2 (en) | 2019-08-20 | 2019-08-20 | Cutting method and cutting device |
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| CN112405911A true CN112405911A (en) | 2021-02-26 |
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| CN202010824912.6A Pending CN112405911A (en) | 2019-08-20 | 2020-08-17 | Cutting method and cutting device |
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| JP (1) | JP7416581B2 (en) |
| KR (1) | KR20210022488A (en) |
| CN (1) | CN112405911A (en) |
| DE (1) | DE102020210457A1 (en) |
| TW (1) | TW202109639A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113075908A (en) * | 2021-03-23 | 2021-07-06 | 王豪 | Method for processing gem and jade artware through numerical control engraving and milling |
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| JP5757831B2 (en) | 2011-09-14 | 2015-08-05 | 株式会社ディスコ | Cutting blade tip shape detection method |
| KR102033064B1 (en) | 2017-05-26 | 2019-10-16 | 엘티정밀(주) | A Manufacturing Method Of Battery Cooling Apparatus For Electric Behicle |
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- 2019-08-20 JP JP2019150369A patent/JP7416581B2/en active Active
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- 2020-07-14 KR KR1020200086506A patent/KR20210022488A/en not_active Application Discontinuation
- 2020-08-17 TW TW109127946A patent/TW202109639A/en unknown
- 2020-08-17 CN CN202010824912.6A patent/CN112405911A/en active Pending
- 2020-08-18 DE DE102020210457.3A patent/DE102020210457A1/en active Pending
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| JP2015046541A (en) * | 2013-08-29 | 2015-03-12 | 株式会社ディスコ | Method for detecting cut groove |
| JP2016139645A (en) * | 2015-01-26 | 2016-08-04 | 株式会社ディスコ | Cutting device |
| CN107186891A (en) * | 2016-03-15 | 2017-09-22 | 株式会社迪思科 | The cutting process of machined object |
| JP2017204497A (en) * | 2016-05-09 | 2017-11-16 | 株式会社東京精密 | Dicing device and dicing method |
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| CN113075908A (en) * | 2021-03-23 | 2021-07-06 | 王豪 | Method for processing gem and jade artware through numerical control engraving and milling |
| CN113075908B (en) * | 2021-03-23 | 2022-04-19 | 王豪 | Method for processing gem and jade artware through numerical control engraving and milling |
Also Published As
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| JP7416581B2 (en) | 2024-01-17 |
| JP2021030329A (en) | 2021-03-01 |
| DE102020210457A1 (en) | 2021-02-25 |
| TW202109639A (en) | 2021-03-01 |
| KR20210022488A (en) | 2021-03-03 |
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