JP7414940B2 - 青色レーザーを使用して銅を溶接するための方法及びシステム - Google Patents
青色レーザーを使用して銅を溶接するための方法及びシステム Download PDFInfo
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- -1 copper metals Chemical class 0.000 description 4
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
- B23K26/125—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases of mixed gases
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/20—Bonding
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- B23K2101/00—Articles made by soldering, welding or cutting
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- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
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- B23K2103/00—Materials to be soldered, welded or cut
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- B23K2103/00—Materials to be soldered, welded or cut
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Description
Claims (14)
- 銅系材料にキーホールモード溶接部を形成する際の、蒸発、スパッター、及び微小爆発を最小限にするための方法であって、
a.波長が400nmから575nmでパワー密度が約50kW/cm2から5MW/cm2であるレーザービームスポットを提供するレーザー源を準備する段階と、
b.相互に接触した第1の材料部片及び第2の材料部片を有する被加工物であって、前記第1の材料部片は銅を有し前記第2の材料部片は金属を有する被加工物を保持器に設置する段階と、
前記レーザービームスポットを前記被加工物に方向決めし、それにより前記第1の材料部片と前記第2の材料部片との間に、HAZ及び再凝固領域を有する溶接部がキーホールモード溶接によって形成されるようにする段階と、
を有し、
前記第1の材料部片と、前記第2の材料部片と、前記HAZと、前記再凝固領域との微細構造が、同様であるようにされた、方法。 - 前記微細構造が、前記溶接部の脆弱さを示唆することになる前記溶接部の判別可能な差異を示さない、請求項1に記載の方法。
- 前記微細構造が、同等サイズの結晶成長領域を備えている、請求項1又は2に記載の方法。
- 銅系材料にキーホールモード溶接部を形成する際の、蒸発、スパッター、及び微小爆発を最小限にするための方法であって、
a.波長が400nmから575nmでパワー密度が約50kW/cm2から5MW/cm2であるレーザービームスポットを提供するレーザー源を備えるレーザーシステムを準備する段階と、
b.相互に接触した第1の材料部片及び第2の材料部片を有する被加工物であって、前記第1の材料部片は銅を有し前記第2の材料部片は金属を有する被加工物を保持器に設置する段階と、
前記レーザービームスポットを前記被加工物に方向決めし、それにより前記第1の材料部片と前記第2の材料部片との間に、HAZ及び再凝固領域を有する溶接部がキーホールモード溶接によって形成されるようにする段階と、
を有し、
前記HAZの硬度の範囲が前記第1の材料部片の硬度の範囲内である、方法。 - 前記第1の材料部片、前記第2の材料部片、前記HAZ、及び前記再凝固領域のそれぞれが微細構造を備え、前記微細構造の全てが前記溶接部の脆弱さを示唆することになる前記溶接部の判別可能な差異を示さない、請求項4に記載の方法。
- 前記第1及び第2の材料部片が約10μmから約500μmの厚さを有する、請求項1乃至5のいずれか一項に記載の方法。
- 前記第1の材料部片が銅箔の複数の層を有する、請求項1乃至6のいずれか一項に記載の方法。
- 前記レーザービームスポットが800kW/cm2より小さいパワー密度を有する、請求項1乃至7のいずれか一項に記載の方法。
- 前記レーザービームスポットが500kW/cm2より小さいパワー密度を有する、請求項1乃至8のいずれか一項に記載の方法。
- 前記レーザービームスポットが約100kW/cm2から800kW/cm2のパワー密度を有する、請求項1乃至7のいずれか一項に記載の方法。
- 前記溶接部はスパッター無しで形成される、請求項1乃至10のいずれか一項に記載の方法。
- 前記溶接部の形成中に、前記レーザービームスポットは前記被加工物を蒸発させない、請求項1乃至11のいずれか一項に記載の方法。
- 前記第1の材料部片が、約10重量パーセントから約95重量パーセントの銅を有する銅合金である、請求項1乃至12のいずれか一項に記載の方法。
- 前記第2の材料部片が、約10重量パーセントから約95重量パーセントの銅を有する銅合金である、請求項1乃至13のいずれか一項に記載の方法。
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