JP7414218B2 - 自己治癒セラミック基複合材料成分の形成方法、およびセラミック基複合材料成分 - Google Patents
自己治癒セラミック基複合材料成分の形成方法、およびセラミック基複合材料成分 Download PDFInfo
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Description
以下は、本発明の可能な実施形態の非排他的な説明である。
Claims (20)
- 自己治癒セラミック基複合材料(CMC)成分の形成方法であって、
セラミック基複合材料(CMC)成分が、複数の繊維と、セラミックマトリックスと、を備え、前記複数の繊維が、前記セラミックマトリックス中に埋め込まれており、
前記セラミックマトリックス中の割れをシールすることが可能な第一自己治癒微粒子材料を前記CMC成分のCMCプリフォームの第一領域中に沈着させ、
環境バリアコーティング(EBC)を再生することが可能な第二自己治癒微粒子材料を前記CMCプリフォームの第二領域中に沈着させる、
ことを備え、
前記第二自己治癒微粒子材料は前記第一領域になく、
前記第一自己治癒微粒子材料及び前記第二自己治癒微粒子材料は異なる化学組成物を含む、
方法。 - 前記第一自己治癒微粒子材料は、ホウ化ケイ素、炭化ホウ素、シリコンボロカーバイド、シリコンボロニトロカーバイド、窒化アルミニウム、及びそれらの混合物からなる群から選択され、前記第二自己治癒微粒子材料は、希土類元素のホウ化物類、ホウ化ハフニウム、ホウ化ジルコニウム、ホウ化チタン、ホウ化タンタル、希土類元素のケイ化物類、ケイ化ハフニウム、ケイ化ジルコニウム、ケイ化チタン、ケイ化タンタル、二ケイ化モリブデン、酸化アルミニウム、アルカリ金属酸化物類、希土類元素の酸化物、酸化ハフニウム、及び酸化ジルコニウム、ならびにそれらの混合物からなる群から選択される、請求項1に記載の方法。
- 前記第一領域は、前記CMCプリフォームの内側コアを含み、前記第二領域は、前記CMCプリフォームの外面を含む前記CMCプリフォームの外側領域を有する、請求項2に記載の方法。
- 前記第一自己治癒微粒子材料を前記第二領域中に沈着させることをさらに備える、請求項3に記載の方法。
- 前記第一領域は、前記CMCプリフォームの第一側面上に位置しており、前記第二領域は、前記CMCプリフォームの前記第一側面に対向する第二側面上に位置しており、前記CMCプリフォームの前記第二側面は、高温環境における使用のために構成され、前記CMCプリフォームの前記第一側面は、より低い温度環境における使用のために構成される、請求項2に記載の方法。
- 前記第一自己治癒微粒子材料及び前記第二自己治癒微粒子材料を、前記CMCプリフォームの前記第一領域と前記第二領域との間に位置している前記CMCプリフォームの第三領域中に沈着させることをさらに備える、請求項2に記載の方法。
- 前記CMCプリフォームは、前記第一領域及び前記第二領域を含む繊維構造体であり、
前記第一自己治癒微粒子材料及び前記第二自己治癒微粒子材料を前記CMCプリフォーム中に沈着させることは、
前記第一自己治癒微粒子材料を含む第一スラリーに前記繊維構造体を含浸させること、及び
前記第二自己治癒微粒子材料を含む第二スラリーに前記繊維構造体を含浸させること、
を備える、請求項2に記載の方法。 - 前記繊維構造体全体は、前記第一スラリーによって含浸され、前記方法は、前記繊維構造体を前記第二スラリーに含浸させる前に、前記第一スラリーを前記第二領域から除去することをさらに備える、請求項7に記載の方法。
- 前記繊維構造体全体は、前記第一スラリーによって含浸され、前記繊維構造体を前記第二スラリーに含浸させる前に乾燥させる、請求項7に記載の方法。
- 前記第二自己治癒微粒子材料のサイズは、前記第一自己治癒微粒子材料のサイズより大きい、請求項9に記載の方法。
- 前記CMCプリフォームの前記第一領域を含む前記繊維構造体の第一部分は、前記第一スラリーによって含浸され、前記CMCプリフォームの前記第二領域を含む前記繊維構造体の第二部分は、前記第二スラリーによって含浸され、前記繊維構造体の前記第一部分及び前記第二部分は、前記第一自己治癒微粒子材料及び前記第二自己治癒微粒子材料の両方を含む前記CMCプリフォームの第三領域を形成するように重なる、請求項7に記載の方法。
- 前記第一スラリー及び前記第二スラリーは、それぞれ、炭化ケイ素微粒子及び前記第一自己治癒微粒子材料及び前記第二自己治癒微粒子材料の混合物を含み、前記第一スラリーの容積で2~30パーセントの間の合計微粒子材料は、前記第一自己治癒微粒子材料であり、前記第二スラリーの容積で5~30パーセントの間の合計微粒子材料は、前記第二自己治癒微粒子材料である、請求項7に記載の方法。
- 前記第一スラリーの容積で5~15パーセントの間の合計微粒子材料は、前記第一自己治癒微粒子材料であり、前記第二スラリーの容積で10~20パーセントの間の合計微粒子材料は、前記第二自己治癒微粒子材料である、請求項7に記載の方法。
- 化学気相含浸を通して前記CMCプリフォームを緻密化することをさらに備える、請求項12に記載の方法。
- 前記第一微粒子材料及び前記第二微粒子材料を前記CMCプリフォーム中に沈着させることは、
前記第一微粒子材料を含む第一スラリーに第一繊維布を含浸させること、
前記第二微粒子材料を含む第二スラリーに第二繊維布を含浸させること、
前記CMCプリフォームの前記第一領域の少なくとも一部を形成するように前記第一繊維布を置くこと、及び
前記CMCプリフォームの前記第二領域の少なくとも一部を形成するように前記第二繊維布を置くこと、
を備える、請求項2に記載の方法。 - 複数の繊維と、セラミックマトリックスと、を備え、前記複数の繊維が、前記セラミックマトリックス中に埋め込まれた、セラミック基複合材料(CMC)成分であって、
前記セラミックマトリックスが、
前記セラミックマトリックス中の割れをシールすることが可能な第一自己治癒微粒子材料の沈着物を含む第一領域、及び
前記第一領域と異なり、環境バリアコーティング(EBC)を再生することが可能な第二自己治癒微粒子材料の沈着物を含む第二領域、
を備え、
前記第二自己治癒微粒子材料は前記第一領域になく、
前記第一自己治癒微粒子材料及び前記第二自己治癒微粒子材料は異なる化学組成物を含む、
セラミック基複合材料(CMC)成分。 - 前記第一自己治癒微粒子材料は、ホウ化ケイ素、炭化ホウ素、シリコンボロカーバイド、シリコンボロニトロカーバイド、及びそれらの混合物からなる群から選択され、前記第二自己治癒微粒子材料は、希土類元素のホウ化物類、ホウ化ハフニウム、ホウ化ジルコニウム、ホウ化チタン、ホウ化タンタル、希土類元素のケイ化物類、ケイ化ハフニウム、ケイ化ジルコニウム、ケイ化チタン、ケイ化タンタル、二ケイ化モリブデン、酸化アルミニウム、アルカリ金属酸化物類、希土類元素の酸化物、及びそれらの混合物からなる群から選択される、請求項16に記載の成分。
- 前記第一領域は、前記CMC成分のCMCプリフォームの内側コアを含み、前記第二領域は、前記CMCプリフォームの外面を含む前記CMCプリフォームの外側領域を有する、請求項17に記載の成分。
- 前記第一領域は、前記CMC成分の第一側面上に位置しており、前記第二領域は、前記CMC成分の前記第一側面に対向する第二側面上に位置している、請求項18に記載の成分。
- 前記第一自己治癒微粒子材料及び前記第二自己治癒微粒子材料の前記沈着物は、前記CMC成分のマトリックス全体に分散され、容積で前記マトリックスの0.5~25パーセントを占める、請求項19に記載の成分。
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