JP7414147B2 - 回路基板及び電子機器 - Google Patents

回路基板及び電子機器 Download PDF

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Publication number
JP7414147B2
JP7414147B2 JP2022540049A JP2022540049A JP7414147B2 JP 7414147 B2 JP7414147 B2 JP 7414147B2 JP 2022540049 A JP2022540049 A JP 2022540049A JP 2022540049 A JP2022540049 A JP 2022540049A JP 7414147 B2 JP7414147 B2 JP 7414147B2
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JP
Japan
Prior art keywords
conductor
circuit board
power supply
signal
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022540049A
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English (en)
Japanese (ja)
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JPWO2022024560A5 (https=
JPWO2022024560A1 (https=
Inventor
孝介 小野
恒亮 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2022024560A1 publication Critical patent/JPWO2022024560A1/ja
Publication of JPWO2022024560A5 publication Critical patent/JPWO2022024560A5/ja
Application granted granted Critical
Publication of JP7414147B2 publication Critical patent/JP7414147B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022540049A 2020-07-29 2021-06-10 回路基板及び電子機器 Active JP7414147B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020128597 2020-07-29
JP2020128597 2020-07-29
PCT/JP2021/022052 WO2022024560A1 (ja) 2020-07-29 2021-06-10 回路基板及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2022024560A1 JPWO2022024560A1 (https=) 2022-02-03
JPWO2022024560A5 JPWO2022024560A5 (https=) 2023-03-13
JP7414147B2 true JP7414147B2 (ja) 2024-01-16

Family

ID=80035355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022540049A Active JP7414147B2 (ja) 2020-07-29 2021-06-10 回路基板及び電子機器

Country Status (4)

Country Link
US (1) US12342452B2 (https=)
JP (1) JP7414147B2 (https=)
CN (1) CN219393669U (https=)
WO (1) WO2022024560A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7508259B2 (ja) * 2020-04-10 2024-07-01 日立Astemo株式会社 信号伝送装置および信号伝送回路
WO2026058656A1 (ja) * 2024-09-11 2026-03-19 ソニーセミコンダクタソリューションズ株式会社 多層基板及びアンテナモジュール

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120996A (ja) 2004-10-25 2006-05-11 Murata Mfg Co Ltd 回路モジュール
JP2006324444A (ja) 2005-05-18 2006-11-30 Murata Mfg Co Ltd 多層回路基板
JP2007329282A (ja) 2006-06-07 2007-12-20 Murata Mfg Co Ltd 多層配線基板
JP2009100440A (ja) 2007-09-25 2009-05-07 Hitachi Metals Ltd 高周波部品及び通信装置
WO2012147803A1 (ja) 2011-04-28 2012-11-01 日本電気株式会社 ノイズ抑制構造を有する回路基板
WO2014050238A1 (ja) 2012-09-28 2014-04-03 株式会社村田製作所 信号線路モジュールおよび通信端末装置
WO2015118791A1 (ja) 2014-02-04 2015-08-13 株式会社村田製作所 高周波信号伝送線路及び電子機器
WO2016163436A1 (ja) 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535083B1 (en) * 2000-09-05 2003-03-18 Northrop Grumman Corporation Embedded ridge waveguide filters
JP4108717B2 (ja) * 2006-07-03 2008-06-25 日本電気株式会社 プリント回路基板
WO2011018934A1 (ja) * 2009-08-11 2011-02-17 株式会社村田製作所 信号線路
KR101454720B1 (ko) * 2010-12-03 2014-10-27 가부시키가이샤 무라타 세이사쿠쇼 고주파 신호선로 및 전자기기
GB2512982B (en) * 2012-02-03 2018-06-13 Murata Manufacturing Co High-frequency signal transmission line and electronic device
CN103733427B (zh) * 2012-02-03 2015-08-26 株式会社村田制作所 高频信号传输线路及电子设备
JP5842850B2 (ja) * 2012-06-29 2016-01-13 株式会社村田製作所 フラットケーブルおよび電子機器
WO2015182348A1 (ja) * 2014-05-29 2015-12-03 株式会社村田製作所 高周波信号線路及びこれを備えた電子機器
KR102562793B1 (ko) * 2017-12-06 2023-08-03 삼성전자주식회사 회로 기판 및 이를 포함하는 전자 장치
US11412611B2 (en) * 2020-07-27 2022-08-09 Samsung Display Co., Ltd. Display apparatus
CN220570713U (zh) * 2021-02-16 2024-03-08 株式会社村田制作所 电路基板以及带电子部件的电路基板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120996A (ja) 2004-10-25 2006-05-11 Murata Mfg Co Ltd 回路モジュール
JP2006324444A (ja) 2005-05-18 2006-11-30 Murata Mfg Co Ltd 多層回路基板
JP2007329282A (ja) 2006-06-07 2007-12-20 Murata Mfg Co Ltd 多層配線基板
JP2009100440A (ja) 2007-09-25 2009-05-07 Hitachi Metals Ltd 高周波部品及び通信装置
WO2012147803A1 (ja) 2011-04-28 2012-11-01 日本電気株式会社 ノイズ抑制構造を有する回路基板
WO2014050238A1 (ja) 2012-09-28 2014-04-03 株式会社村田製作所 信号線路モジュールおよび通信端末装置
WO2015118791A1 (ja) 2014-02-04 2015-08-13 株式会社村田製作所 高周波信号伝送線路及び電子機器
WO2016163436A1 (ja) 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器

Also Published As

Publication number Publication date
CN219393669U (zh) 2023-07-21
JPWO2022024560A1 (https=) 2022-02-03
US12342452B2 (en) 2025-06-24
US20230156910A1 (en) 2023-05-18
WO2022024560A1 (ja) 2022-02-03

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