JPWO2022024560A1 - - Google Patents

Info

Publication number
JPWO2022024560A1
JPWO2022024560A1 JP2022540049A JP2022540049A JPWO2022024560A1 JP WO2022024560 A1 JPWO2022024560 A1 JP WO2022024560A1 JP 2022540049 A JP2022540049 A JP 2022540049A JP 2022540049 A JP2022540049 A JP 2022540049A JP WO2022024560 A1 JPWO2022024560 A1 JP WO2022024560A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022540049A
Other languages
Japanese (ja)
Other versions
JP7414147B2 (ja
JPWO2022024560A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022024560A1 publication Critical patent/JPWO2022024560A1/ja
Publication of JPWO2022024560A5 publication Critical patent/JPWO2022024560A5/ja
Application granted granted Critical
Publication of JP7414147B2 publication Critical patent/JP7414147B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022540049A 2020-07-29 2021-06-10 回路基板及び電子機器 Active JP7414147B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020128597 2020-07-29
JP2020128597 2020-07-29
PCT/JP2021/022052 WO2022024560A1 (ja) 2020-07-29 2021-06-10 回路基板及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2022024560A1 true JPWO2022024560A1 (https=) 2022-02-03
JPWO2022024560A5 JPWO2022024560A5 (https=) 2023-03-13
JP7414147B2 JP7414147B2 (ja) 2024-01-16

Family

ID=80035355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022540049A Active JP7414147B2 (ja) 2020-07-29 2021-06-10 回路基板及び電子機器

Country Status (4)

Country Link
US (1) US12342452B2 (https=)
JP (1) JP7414147B2 (https=)
CN (1) CN219393669U (https=)
WO (1) WO2022024560A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7508259B2 (ja) * 2020-04-10 2024-07-01 日立Astemo株式会社 信号伝送装置および信号伝送回路
WO2026058656A1 (ja) * 2024-09-11 2026-03-19 ソニーセミコンダクタソリューションズ株式会社 多層基板及びアンテナモジュール

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120996A (ja) * 2004-10-25 2006-05-11 Murata Mfg Co Ltd 回路モジュール
JP2006324444A (ja) * 2005-05-18 2006-11-30 Murata Mfg Co Ltd 多層回路基板
JP2007329282A (ja) * 2006-06-07 2007-12-20 Murata Mfg Co Ltd 多層配線基板
JP2008016470A (ja) * 2006-07-03 2008-01-24 Nec Corp プリント回路基板
JP2009100440A (ja) * 2007-09-25 2009-05-07 Hitachi Metals Ltd 高周波部品及び通信装置
WO2012147803A1 (ja) * 2011-04-28 2012-11-01 日本電気株式会社 ノイズ抑制構造を有する回路基板
WO2014050238A1 (ja) * 2012-09-28 2014-04-03 株式会社村田製作所 信号線路モジュールおよび通信端末装置
WO2015118791A1 (ja) * 2014-02-04 2015-08-13 株式会社村田製作所 高周波信号伝送線路及び電子機器
WO2016163436A1 (ja) * 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535083B1 (en) * 2000-09-05 2003-03-18 Northrop Grumman Corporation Embedded ridge waveguide filters
WO2011018934A1 (ja) * 2009-08-11 2011-02-17 株式会社村田製作所 信号線路
KR101454720B1 (ko) * 2010-12-03 2014-10-27 가부시키가이샤 무라타 세이사쿠쇼 고주파 신호선로 및 전자기기
GB2512982B (en) * 2012-02-03 2018-06-13 Murata Manufacturing Co High-frequency signal transmission line and electronic device
CN103733427B (zh) * 2012-02-03 2015-08-26 株式会社村田制作所 高频信号传输线路及电子设备
JP5842850B2 (ja) * 2012-06-29 2016-01-13 株式会社村田製作所 フラットケーブルおよび電子機器
WO2015182348A1 (ja) * 2014-05-29 2015-12-03 株式会社村田製作所 高周波信号線路及びこれを備えた電子機器
KR102562793B1 (ko) * 2017-12-06 2023-08-03 삼성전자주식회사 회로 기판 및 이를 포함하는 전자 장치
US11412611B2 (en) * 2020-07-27 2022-08-09 Samsung Display Co., Ltd. Display apparatus
CN220570713U (zh) * 2021-02-16 2024-03-08 株式会社村田制作所 电路基板以及带电子部件的电路基板

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120996A (ja) * 2004-10-25 2006-05-11 Murata Mfg Co Ltd 回路モジュール
JP2006324444A (ja) * 2005-05-18 2006-11-30 Murata Mfg Co Ltd 多層回路基板
JP2007329282A (ja) * 2006-06-07 2007-12-20 Murata Mfg Co Ltd 多層配線基板
JP2008016470A (ja) * 2006-07-03 2008-01-24 Nec Corp プリント回路基板
JP2009100440A (ja) * 2007-09-25 2009-05-07 Hitachi Metals Ltd 高周波部品及び通信装置
WO2012147803A1 (ja) * 2011-04-28 2012-11-01 日本電気株式会社 ノイズ抑制構造を有する回路基板
WO2014050238A1 (ja) * 2012-09-28 2014-04-03 株式会社村田製作所 信号線路モジュールおよび通信端末装置
WO2015118791A1 (ja) * 2014-02-04 2015-08-13 株式会社村田製作所 高周波信号伝送線路及び電子機器
WO2016163436A1 (ja) * 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器

Also Published As

Publication number Publication date
CN219393669U (zh) 2023-07-21
JP7414147B2 (ja) 2024-01-16
US12342452B2 (en) 2025-06-24
US20230156910A1 (en) 2023-05-18
WO2022024560A1 (ja) 2022-02-03

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