JP7412251B2 - Element mounting body, mounting equipment and mounting method - Google Patents

Description

The present invention relates to an element mounting body in which an element substrate provided with an electronic component element such as a sensor element or a semiconductor element is mounted on the surface of the mounting base by soldering, a mounting apparatus for the same, and a mounting device using the same. Regarding the method.

When an electronic component element such as a sensor element or a semiconductor element is soldered onto an element substrate, a solder sheet is melted by induction heating, and the electronic component element is soldered onto the element substrate.

Specifically, first, electronic component elements are placed on the element substrate via a solder sheet, then these are placed in a spiral induction heating coil, and then the induction heating coil is energized and soldered. The sheet is melted and the electronic component element is soldered and mounted on the element substrate (as a prior art document similar to this, there is, for example, Patent Document 1 below).

Further, an electronic component element is placed on the element substrate via a solder sheet, and then these are placed in a microwave irradiation space, and induction heating is performed in a magnetic field region to melt the solder sheet, and the electronic component element is There is also a device that is mounted on the element substrate by soldering (a prior art document similar to this includes, for example, the following Patent Document 2).

Japanese Patent Application Publication No. 8-55865 Japanese Patent Application Publication No. 2019-136771

The problem with the above conventional examples is that a large amount of magnetic flux also passes through the electronic component elements such as the sensor element or semiconductor element, and as a result, a large amount of magnetic flux is generated in the electronic component element such as the sensor element or semiconductor element. This results in a thermal shock.
That is, in the above two conventional examples in which the solder sheet is melted by induction heating, electronic component elements such as sensor elements or semiconductor elements also generate heat due to magnetic flux, and as a result, there is a risk that their performance will be adversely affected.

The present invention was made in order to solve the above-mentioned problems, and an object of the present invention is to provide an element mounting body in which thermal influence on electronic component elements is suppressed.

The element mounting body according to the present invention includes a mounting base whose mounting surface portion is made of a metal capable of high-frequency induction heating, and a mounting base that is smaller than the mounting base and mounted on the mounting surface of the mounting base by soldering. The mounting substrate has a heating head facing area in which the magnetic gap side end of the high frequency induction heating head is disposed to face each other on the outer side of the mounting surface facing each other across the mounting surface. The element substrate includes an element substrate formed of glass or ceramic, an electronic component element provided on the surface of the element substrate opposite to the mounting substrate, and an electronic component element provided on the surface of the element substrate on the mounting substrate side. It is characterized by having a first metal film for facilitating soldering.

According to the present invention, with the above-described configuration, it is possible to obtain an element mounting body in which thermal influence on electronic component elements is suppressed.

FIG. 2 is a front view of the element mounting body according to the first embodiment. FIG. 2 is a plan view of the element mounting body according to the first embodiment. FIG. 2 is a side view of the element mounting body according to the first embodiment. FIG. 2 is a partially enlarged side view of the element mounting body according to the first embodiment. 1 is a perspective view illustrating a method of manufacturing an element mounting body according to a first embodiment; FIG. 1 is a perspective view illustrating a method of manufacturing an element mounting body according to a first embodiment; FIG. 1 is a perspective view illustrating a method of manufacturing an element mounting body according to a first embodiment; FIG. 1 is a perspective view illustrating a method of manufacturing an element mounting body according to a first embodiment; FIG. 1 is a perspective view illustrating a method of manufacturing an element mounting body according to a first embodiment; FIG. 1 is a perspective view illustrating a method of manufacturing an element mounting body according to a first embodiment; FIG. FIG. 3 is a side view illustrating a method for manufacturing an element mounting body according to the first embodiment. FIG. 2 is a front view illustrating a method of manufacturing an element mounting body according to the first embodiment. FIG. 2 is a plan view illustrating a method for manufacturing an element mounting body according to the first embodiment. FIG. 2 is a partially enlarged front view illustrating the method for manufacturing the element mounting body according to the first embodiment. FIG. 3 is a partially enlarged bottom view illustrating the method for manufacturing the element package according to the first embodiment. FIG. 2 is a partially enlarged side view illustrating the method for manufacturing the element mounting body according to the first embodiment. FIG. 2 is a partially enlarged front view illustrating the method for manufacturing the element mounting body according to the first embodiment. FIG. 2 is a partially enlarged side view illustrating the method for manufacturing the element mounting body according to the first embodiment.

Embodiments of the present invention will be described in detail below with reference to the drawings.
Embodiment 1.
Hereinafter, one embodiment of the present invention will be described using the accompanying drawings.
1 to 3 show an element mounting body 1. This element mounting body 1 is made of conductive (metal that can be heated by high frequency induction) and magnetic stainless steel (a typical example is SUS430). There is a mounting base 2 made of SUS301, SUS304, etc., which are also magnetic materials), and the mounting surface 2a on the front side of this mounting base 2 is soldered (solder sheet shown in Fig. 4). 7).

Note that it is sufficient that at least the mounting surface 2a of the mounting base 2 is formed of a metal that can be heated by high-frequency induction.

As shown in FIG. 4, the element substrate 3 includes an element substrate 4 made of glass or ceramic material, and an electronic component such as a sensor element or a semiconductor element provided on the surface of the element substrate 4 opposite to the mounting substrate 2. It has an element 5.

Note that this FIG. 4 also shows a protective substrate 6 used when mounting the element substrate 3 on the front surface side of the mounting substrate 2. It is detachably placed on the side, and is removed from above the electronic component element 5 after the soldering process.
Further, this protective substrate 6 is made of glass, ceramic material, or the like.

As understood from FIGS. 1 to 3, the element substrate 3 and the protection substrate 6 are thin plate-shaped and rectangular in plan view.

Further, as understood from FIGS. 1 to 3, the mounting base 2 is also plate-shaped and rectangular in plan view.

Furthermore, the mounting surface 2a of the mounting substrate 2 is also rectangular in plan view, and the size of this mounting surface 2a is approximately the same as the element substrate 3 in plan view.

What should be noted here is that, as shown in FIG. 2, in the first embodiment, the element substrate 3 is smaller than the mounting substrate 2 in plan view.

Furthermore, based on this difference in size, by arranging the mounting surface 2a of the mounting substrate 2 inward from the outer periphery of the mounting substrate 2, as shown in FIG. At least one pair of heating head facing areas 2A can be set on each outer portion of the mounting surface 2a.

In other words, the flat surface of the outer part of the mounting surface 2a that faces the mounting surface 2a of the mounting substrate 2 across the mounting surface 2a is the heating head facing area 2A, and as will be described later, the high frequency induction heating heads 16, 17 ( A major feature of the first embodiment is that the ends of the magnetic path forming bodies 16a, 16b, 17a, and 17b (see FIGS. 10 to 18) forming the magnetic path forming bodies (see FIGS. 10 to 18) are arranged to face each other on the magnetic gap side. It has become.

A gold metal film (not shown because it is extremely thin) made of a vapor-deposited film or a sputtered film is provided on the lower surface side (mounting substrate 2 side) of the element substrate 4 to facilitate soldering. .

The element substrate 3 having such a configuration is soldered onto the mounting surface 2a on the front side of the mounting substrate 2 using a molten tin-gold solder sheet 7.

Note that a gold metal film (not shown because it is extremely thin) made of a vapor-deposited film or a sputtered film is provided on the entire surface of the mounting substrate 2, or at least on the mounting surface 2a portion, to facilitate soldering. It is being

With the above configuration, the element substrate 3 is soldered and mounted on the mounting surface 2a portion on the front side of the mounting substrate 2.

The element mounting body 1 according to the first embodiment uses a sensor element as the electronic component element 5, and detects the amount of change transmitted via the mounting base 2 with the electronic component element 5, and controls the control unit (not shown). (2).

For example, if the sensor element is a strain gauge, the amount of mechanical strain detected via the mounting base 2 will be transmitted to the electronic component element 5 of the element base 3.

The amount of strain detected by the electronic component element 5 is transmitted to the outside via wire or wirelessly, and various controls are performed.

As can be understood from FIGS. 1 to 5, the mounting base 2 is plate-shaped and rectangular, and has a through hole 8 formed at one end thereof. (not shown) to the measuring location.

By integrating the element base 3 with the mounting base 2 by soldering, the amount of strain applied to the mounting base 2 can be detected by the electronic component element 5 of the element base 3.

A method for mounting the element substrate 3 onto the mounting substrate 2 will be described below.
First, as understood from FIGS. 5 and 6, the upper surface side of the mounting base 2 is covered with a positioning cover 10 made of resin and having an opening 9 on the mounting surface 2a of the mounting base 2.

Note that the positioning cover 10 is firmly attached to the metal mounting base 2 using resin elasticity. Of course, it can be removed using the elasticity of the resin, but it is in a state where it cannot be accidentally removed.

Next, as understood from FIG. 7, the solder sheet 7, the element substrate 3, and the protective substrate 6 are sequentially mounted in the opening 9 of the positioning cover 10 from the mounting substrate 2 side.

In this state, the upper part of the protective substrate 6 slightly protrudes above the opening 9.

In this state, next, as shown in FIG. 8, a resin holding jig 11 is mounted on the positioning cover 10 so as to cover the opening 9 of the positioning cover 10. This holding jig 11 has an elongated plate shape, and through holes 12 are formed at both ends.

Further, as shown in FIG. 7, a screw hole 13 is formed on the upper surface of the positioning cover 10 corresponding to the through hole 12 of the holding jig 11.

Therefore, as shown in FIG. 9, if the resin screw 14 is passed through the through hole 12 of the holding jig 11 and screwed into the screw hole 13 of the positioning cover 10, the holding jig 11 will hold the protective board 6. , the element substrate 3 and the solder sheet 7 are pressed against the mounting surface 2a of the mounting substrate 2.

Although not shown, the mounting substrate 2 shown in FIG. 9 is placed on an XY table and transported to the soldering mounting apparatus 15 shown in FIGS. 10 to 18.

Note that, in FIGS. 11 to 18, the positioning cover 10 is removed so that the relationship between the mounting device 15 and the element substrate 3 can be easily understood.

The mounting apparatus 15 of the first embodiment has two (plural) high-frequency induction heating heads 16 and 17 arranged at a predetermined interval.

In addition, these high frequency induction heating heads 16 and 17 are used to flow magnetic flux through magnetic path forming bodies 16a, 16b, 17a, and 17b that form the magnetic gap 20, and these magnetic path forming bodies 16a, 16b, 17a, and 17b. , and a magnetic coil 18.

The magnetic coil 18 is a loop-shaped pipe through which cooling water is circulated, and is supplied with a current of 1 MHz and 100 A, for example.

The magnetic path forming bodies 16a, 16b, 17a, and 17b that constitute the high-frequency induction heating heads 16 and 17 are made of a soft magnetic material such as ferrite, for example.

Furthermore, as can be understood from FIGS. 10 to 13, these high-frequency induction heating heads 16 and 17 have left and right C-shaped magnetic path forming bodies 16a and 17a, and an inverted C-shaped magnetic path forming body, respectively. It is constructed by combining 16b and 17b.

Specifically, since through holes 19 are provided in the upper portions of the left and right C-shaped magnetic path forming bodies 16a and the inverted C-shaped magnetic path forming bodies 16b, the through holes 19 are aligned with each other. In this state, the upper parts of the left and right magnetic path forming bodies 16a and the magnetic path forming bodies 16b are overlapped.

By overlapping the upper portions of the left and right magnetic path forming bodies 16a and 16b over a large area, a magnetic path can be formed with low magnetic resistance.

Further, the lower portions of the C-shaped magnetic path forming body 16a and the inverted C-shaped magnetic path forming body 16b are separated by a predetermined distance to form a magnetic gap 20 there. The distance between the magnetic gaps 20 of the high-frequency induction heating head 16 can be adjusted by rotating the C-shaped magnetic path forming body 16a and the inverted C-shaped magnetic path forming body 16b around the through hole 19. can.

In addition, through holes 19 are provided in the upper portions of the left and right C-shaped magnetic path forming bodies 17a and the inverted C-shaped magnetic path forming bodies 17b, so when the through holes 19 are aligned, , the upper parts of the left and right magnetic path forming bodies 17a and the magnetic path forming bodies 17b are overlapped.

By overlapping the upper portions of the left and right magnetic path forming bodies 17a and the magnetic path forming bodies 17b over a large area, a magnetic path can be formed with small magnetic resistance.

Further, the lower portions of the C-shaped magnetic path forming body 17a and the inverted C-shaped magnetic path forming body 17b are separated by a predetermined distance to form a magnetic gap 20 there. The interval of the magnetic gap 20 of the high-frequency induction heating head 17 can be adjusted by rotating the C-shaped magnetic path forming body 17a and the inverted C-shaped magnetic path forming body 17b around the through hole 19. can.

In the first embodiment, two high-frequency induction heating heads 16 and 17 are used, and as shown in FIGS. 12, 14, and 15, the high-frequency induction heating heads 16 and 17 They are arranged at predetermined intervals on both sides.

The arrangement of the high-frequency induction heating heads 16 and 17 will be explained in more detail.
The high-frequency induction heating head 16 includes left and right magnetic path forming bodies 16a and 16b, and is configured to form a magnetic gap 20 between the lower tips thereof.

The high-frequency induction heating head 17 also includes left and right magnetic path forming bodies 17a and 17b, and is configured to form a magnetic gap 20 between their lower tips.

In the first embodiment, the tips of the lower magnetic gap 20 side of the left and right magnetic path forming bodies 16a and 16b constituting the high-frequency induction heating head 16 are placed on the heating head facing area 2A of the mounting substrate 2 shown in FIG. , as shown in FIGS. 11 and 12, they are placed in a non-contact state but facing each other, and then magnetic flux is applied.

That is, when the lower tip of the magnetic path forming body 16a of the high-frequency induction heating head 16 is placed opposite to the lower part of the heating head facing area 2A shown in FIG. 2 in a non-contact state, The lower tip of the magnetic path forming body 16b is placed opposite to the upper part of the heating head facing area 2A shown in FIG. 2 in a non-contact state.

Similarly, when the lower tip of the magnetic path forming body 17a of the high-frequency induction heating head 17 is placed opposite to the lower part of the heating head facing area 2A shown in FIG. 2 in a non-contact state. The lower tip of the magnetic path forming body 17b is placed opposite to the upper part of the heating head facing area 2A shown in FIG. 2 in a non-contact manner.

Note that the lower tip of the magnetic path forming body 16a of the high-frequency induction heating head 16 is placed opposite to the lower part of the heating head facing area 2A shown in FIG. 2 in a non-contact state. This is because the resin positioning cover 10 shown in FIG. 6 is interposed between the lower tip of the magnetic path forming body 16a of the high-frequency induction heating head 16 and the heating head facing area 2A of the mounting base 2. This is because

Similarly, the lower tip of the magnetic path forming body 16b of the high-frequency induction heating head 16 is placed opposite to the upper part of the heating head facing area 2A shown in FIG. 2 in a non-contact state. This is because the positioning cover 10 made of resin shown in FIG. This is because they are doing so.

In addition, the lower tip of the magnetic path forming body 17a of the high-frequency induction heating head 17 is arranged to face the lower part of the heating head facing area 2A shown in FIG. 2 in a non-contact state. This is because the resin positioning cover 10 shown in FIG. 6 is interposed between the lower tip of the magnetic path forming body 17a of the high-frequency induction heating head 17 and the heating head facing area 2A of the mounting base 2. This is because

Furthermore, the lower tip of the magnetic path forming body 17b of the high-frequency induction heating head 17 is arranged to face the upper part of FIG. 2 of the heating head facing area 2A shown in FIG. 2 in a non-contact state. This is because the positioning cover 10 made of resin shown in FIG. This is because

In addition, FIG. 15 is a diagram in which the relationship between the element substrate 3 and the two high-frequency induction heating heads 16 and 17 is made easier to understand, excluding the mounting substrate 2.

In the first embodiment, as described above, since the element substrate 3 has an elongated rectangular shape, by heating from both sides in the longitudinal direction, the solder sheet 7, which is also rectangular, can be melted uniformly. We devised some ideas.

16 to 18 show a state in which a current of 1 MHz and 100 A is supplied to the magnetic coil 18.
In this state, as shown in FIG. 16, in the magnetic gap 20 portion of the high frequency induction heating heads 16, 17, magnetic flux 21 flows between the magnetic path forming bodies 16a, 16b and between the magnetic path forming bodies 17a, 17b.

Specifically, the magnetic flux 21 is directed to the magnetic path forming body 17a (16a), both sides of the mounting surface 2a of the mounting substrate 2, the mounting surface 2a of the mounting substrate 2, the portion immediately below the mounting surface 2a, and the magnetic path forming body 17b (16b). flows, and in the next state, the magnetic flux 21 flows in the opposite direction, causing rapid heat generation due to induction heating at the mounting surface 2a of the mounting substrate 2, melting the solder sheet 7, and as a result. , the element substrate 3 is soldered to the mounting surface 2a portion of the mounting substrate 2.

In Embodiment 1, in order to make it easier for the magnetic flux 21 to flow to the vicinity of both sides of the mounting surface 2a of the element substrate 3, mounting is provided at the tips of the magnetic path forming bodies 16a, 16b and the magnetic path forming bodies 17a, 17b. An inclined surface 22 is provided which is inclined toward the mounting surface 2a side of the base body 2.

Furthermore, in order to uniformly heat the mounting surface 2a portion of the mounting substrate 2, two high-frequency induction heating heads 16 and 17 are arranged on both sides of the elongated element substrate 3.

As a result, as can be understood from FIGS. 17 and 18, solder is present not only on the lower surface of the element substrate 4 but also on the lower outer periphery (fillet portion 23) of the element substrate 4, and the solder is transferred to the mounting substrate 2. The soldering of the element substrate 3 becomes highly reliable.

Furthermore, as can be understood from FIG. 16, when the element substrate 3 is soldered to the mounting substrate 2, the magnetic flux 21 from the high frequency induction heating heads 16 and 17 is more magnetic than the element substrate 4 of the element substrate 3. Since the flow flows toward the mounting substrate 2 side, which has a lower resistance, and is less likely to flow to the electronic component element 5 portion, the electronic component element 5 is rarely subjected to induction heating by the magnetic flux 21, and as a result, thermal deterioration of the electronic component element 5 is reduced. It becomes difficult to wake up.

Additionally, the first embodiment is characterized in that stress is less likely to be applied to the element substrate 3 during soldering, and as a result, the element substrate 3 and the electronic component elements 5 mounted thereon are less likely to be damaged. It is.

That is, in the first embodiment, the element substrate 4 made of glass or ceramic material is soldered to the mounting substrate 2 made of stainless steel material, and when the solder sheet 7 is heated to melt, the mounting substrate 2 is 2 and the element substrate 4 expand, and when the heat cools down, they contract. At this time, the thermal expansion coefficients of the mounting base 2 and the element substrate 4 are greatly different due to the difference in the constituent materials, so when the mounting base 2 is cooled down after soldering, for example, the mounting base 2 shrinks greatly, and the resulting stress is transferred to the element board. 4, and as a result, the element substrate 4 or the electronic component element 5 may be damaged.

As an example, when the mounting base 2 is made of stainless steel, its thermal expansion coefficient is as follows.
・SUS430...11.0 (x10^-6/℃)
・SUS301...17.1 (x10^-6/℃)
・SUS304...17.8 (x10^-6/℃)

On the other hand, when the element substrate 4 is made of glass or ceramic material, its thermal expansion coefficient is as follows.
・Pyrex (registered trademark) glass...3.3 (x10^-6/℃)
・Alumina Al2O3...7.2 (x10^-6/℃)
・Zirconia ZrO2...10.5 (x10^-6/℃)
・Silicon carbide SiC...4.4 (x10^-6/℃)

In this way, when the mounting base 2 is formed of stainless steel material and the element substrate 4 is formed of glass or ceramic material, for example, when the mounting base 2 is cooled down after soldering, the mounting base 2 shrinks significantly, and the stress caused by this shrinks. is added to the element substrate 4, and as a result, there is a possibility that the element substrate 4 or the electronic component element 5 may be damaged.

On the other hand, in the first embodiment, even if the mounting base 2 is made of stainless steel material and the element substrate 4 is made of glass or ceramic material, the element substrate 4 and the electronic component elements 5 are not damaged. , This point is also a major feature of the first embodiment.

To explain this point in detail, in the first embodiment, as described above, as shown in FIG. Magnetic flux 21 is intensively applied to the mounting surface 2a of the base 2, and the mounting surface 2a of the base 2 is rapidly heated (for example, in about 1 second) to melt the solder sheet 7.

In this way, in the state where the heating is carried out locally for a short time (the mounting surface 2a portion of the mounting substrate 2), the temperature of the outer peripheral area of the mounting surface 2a portion of the mounting substrate 2 does not rise significantly. The state of thermal expansion of the part is negligible. In other words, the temperature of the mounting surface 2a of the mounting substrate 2 rises rapidly even when heated for 1 second, and the temperature expands significantly as a result, but the outer peripheral region of the mounting surface 2a of the mounting substrate 2 rapidly Since no temperature rise occurs and the amount of thermal expansion is small, as a result, the mounting surface 2a of the element substrate 3 cannot expand greatly toward the outer circumference due to thermal expansion, and has an extremely small Stays in a stretched state.

In this way, the mounting surface 2a of the mounting base 2 cannot expand significantly during soldering heat, so even when the temperature subsequently drops to room temperature, only a very small shrinkage occurs, which causes the upper soldering This leads to the fact that no large stress is applied to the element substrate 3 which has been exposed, and as a result, damage to the element substrate 4 and the electronic component element 5 does not occur.

In the first embodiment, the mounting base 2 is made of stainless steel, but stainless steel has a lower thermal conductivity than iron or the like. It is possible to create a temperature rising state and a state in which the temperature rise is slow in the outer peripheral region.

In other words, the thermal conductivity of stainless steel material is extremely lower than that of iron material, as described below.
・Iron...83.5 (W/m・K)
・SUS301, SUS304...16.3 (W/m・K)
・SUS430...26.4 (W/m・K)

The fact that the thermal conductivity is low means that when the temperature of the mounting surface 2a of the mounting substrate 2 increases rapidly due to induction heating, heat conduction from that part to the outer circumferential direction does not proceed. This makes it possible to rapidly increase the temperature of the mounting surface 2a portion.

In other words, the soldering time can be shortened, which not only improves productivity, but also reduces the likelihood of deterioration and damage to the element board 4 and electronic component elements 5 due to thermal and mechanical reasons. It is also connected and is highly evaluated.

In addition, in the conventional thinking, in order to relieve stress caused by thermal expansion and contraction from the mounting substrate 2 to the element substrate 3, an expensive Kovar (stress buffer) is used between the mounting substrate 2 and the element substrate 3. However, in the first embodiment, as described above, since large stress due to thermal expansion and contraction from the mounting substrate 2 to the element substrate 3 is not generated, it is not necessary to use such a stress buffer. There is no need to do this, and it can be extremely effective in terms of manufacturing costs and other aspects.

In addition, in Embodiment 1, it was confirmed that the spread of the solder to the outer periphery of the mounting surface 2a of the mounting substrate 2 did not spread beyond the heating head facing area 2A due to the heating as described above. In other words, the solder sheet 7 is melted by heating and spreads outward, but in the first embodiment, the magnetic flux does not substantially spread outside the heating head facing area 2A. The outer portion of the head facing area 2A is not heated by induction (reason 1). Furthermore, by forming the mounting base 2 from a stainless steel material that has a lower heat conduction than iron or the like, the heat conduction toward the outside of the heating head facing area 2A is also reduced (reason 2).

For the above two reasons, as mentioned above, the temperature of the surface of the mounting substrate 2 outside the heating head facing area 2A is kept low, thereby preventing the melted solder from spreading outward any further. be.

Incidentally, the short side dimension of the heating head facing area 2A is the same as or smaller than the short side dimension of the mounting surface 2a.
Therefore, on the mounting surface 2a of the mounting substrate 2, the spread dimension of the solder (the distance from the outer periphery of the mounting surface 2a to the outer periphery of the solder that has spread outward) is smaller than the short side dimension of the mounting surface 2a. It becomes. This is also a feature of manufacturing using the manufacturing method of Embodiment 1, and by visually observing this, it can be seen that the element mount 1 is manufactured using the manufacturing method of Embodiment 1. You can check it.

Furthermore, since the solder does not spread outward more than necessary, it is also advantageous when there are electronic components placed nearby.

In the first embodiment, the element mounting body 1, the mounting substrate 2, the element substrate 3, and the element substrate 4 are plate-shaped and rectangular in plan view, but they may be square or other polygons. It may be circular or oval.

As described above, the element mounting body 1 according to the first embodiment includes the mounting base 2 in which at least the mounting surface 2a portion is formed of metal capable of high-frequency induction heating, and the mounting base 2 which is smaller than the mounting base 2 and The mounting base 2 includes an element base 3 mounted on the mounting surface 2a by soldering, and the mounting base 2 has high-frequency induction heating heads on the outer portions of the mounting surface 2a facing each other across the mounting surface 2a. The element substrate 3 has a heating head facing area 2A in which the magnetic gap side ends of the elements 16 and 17 are arranged to face each other, and the element substrate 3 has an element substrate 4 made of glass or ceramic, and an element substrate 4 opposite to the mounting substrate 2 of the element substrate 4. This configuration has an electronic component element 5 provided on the side surface, and a first metal film for facilitating soldering provided on the surface of the element substrate 4 on the mounting base 2 side.

Therefore, in the element mounting body 1 according to the first embodiment, when the element base 3 is soldered and mounted on the mounting surface 2a of the mounting base 2, the high-frequency induction heating head is placed opposite to the heating head facing area 2A of the mounting base 2. Magnetic flux is supplied from the ends of the magnetic gaps 16 and 17 to the mounting surface 2a of the mounting substrate 2, causing the mounting surface 2a to generate heat and melting the solder. The base body 3 can be soldered.

That is, in the element mounting body 1 according to the first embodiment, the magnetic flux from the high-frequency induction heating heads 16 and 17 hardly flows into the electronic component element 5 of the element base 3, and as a result, the heat to the electronic component element 5 is reduced. It is possible to suppress the negative impact.

Furthermore, the mounting apparatus 15 for the element mounting body 1 according to the first embodiment includes high frequency induction heating heads 16 and 17 for melting solder, and the high frequency induction heating heads 16 and 17 are connected to a magnetic path forming body having a magnetic gap 20. 16a, 16b, 17a, 17b, and a magnetic coil 18 that allows magnetic flux to flow through the magnetic path forming bodies 16a, 16b, 17a, 17b. , the element substrate 3 is arranged on the mounting surface 2a of the mounting substrate 2, and is arranged facing each other in the heating head facing area 2A.

Therefore, in the mounting apparatus 15 for the element mounting body 1 according to the first embodiment, the magnetic flux from the high-frequency induction heating heads 16 and 17 hardly flows into the electronic component element 5 of the element substrate 3, and as a result, the electronic component The thermal influence on the element 5 can be suppressed.

Furthermore, the mounting method using this mounting apparatus 15 involves first placing the element substrate 3 on the mounting surface 2a of the mounting substrate 2 via the solder sheet 7, and then placing the element substrate 3 on the mounting surface 2a of the mounting substrate 2. Magnetic flux is supplied to the mounting surface 2a portion of the mounting base 2 from the magnetic gap side ends of the path forming bodies 16a, 16b, 17a, and 17b.

Therefore, in this mounting method, the magnetic flux from the high-frequency induction heating heads 16 and 17 hardly flows into the electronic component element 5 of the element substrate 3, and as a result, the thermal influence on the electronic component element 5 can be suppressed. This is possible.

Note that within the scope of the present invention, any constituent elements of the embodiments may be modified or any constituent elements of the embodiments may be omitted.

1 Element mounting body 2 Mounting base 2a Mounting surface 2A Heating head opposing area 3 Element base 4 Element board 5 Electronic component element 6 Protective board 7 Solder sheet 8 Through hole 9 Opening 10 Positioning cover 11 Holding jig 12 Through hole 13 Screw hole 14 Screw 15 Mounting device 16 High frequency induction heating head 16a Magnetic path forming body 16b Magnetic path forming body
17 High frequency induction heating head 17a Magnetic path forming body 17b Magnetic path forming body 18 Magnetic coil 19 Through hole 20 Magnetic gap 21 Magnetic flux 22 Inclined surface 23 Fillet portion

Claims (14)

a mounting base at least a mounting surface portion of which is formed of a metal capable of high-frequency induction heating;
an element base smaller than the mounting base and mounted on the mounting surface of the mounting base by soldering;
The mounting base has a heating head facing area in which a magnetic gap side end of the high frequency induction heating head is arranged to face each other on the outer side of the mounting surface facing each other with the mounting surface in between,
The element substrate is
An element substrate made of glass or ceramic,
an electronic component element provided on a surface of the element substrate opposite to the mounting base;
An element mounting body comprising: a first metal film for facilitating soldering provided on a surface of the element substrate on the mounting base side. The device mounting body according to claim 1, wherein the first metal film is formed of a vapor deposited film or a sputtered film. The element mounting body according to claim 1 or 2, wherein a second metal film for facilitating soldering is provided on the mounting surface of the mounting base. 4. The device mounting body according to claim 3, wherein the second metal film is composed of a vapor deposited film or a sputtered film. The element mounting body according to any one of claims 1 to 4, wherein the mounting base is made of stainless steel. The element mounting body according to claim 5, wherein the mounting base is made of a stainless steel material selected from SUS430, SUS301, or SUS304. A mounting device for an element mounting body according to any one of claims 1 to 6,
comprising a high frequency induction heating head for melting the solder,
The high frequency induction heating head includes:
a magnetic path forming body having a magnetic gap;
and a magnetic coil that causes magnetic flux to flow through the magnetic path forming body,
A mounting apparatus characterized in that the magnetic gap side end portions of the magnetic path forming body are respectively arranged to face the heating head facing area in a state where the element substrate is arranged on the mounting surface of the mounting substrate. 8. The mounting apparatus according to claim 7, wherein each end of the magnetic path forming body on the magnetic gap side is provided with an inclined surface that slopes toward the mounting surface of the mounting base. a resin positioning cover disposed on the mounting base and having an opening on the mounting surface of the mounting base;
The mounting apparatus according to claim 7 or 8, further comprising a resin holding jig that covers the opening of the positioning cover. The mounting apparatus according to any one of claims 7 to 9, wherein a plurality of the high-frequency induction heating heads are arranged at predetermined intervals. The high-frequency induction heating head includes a first magnetic path forming body and a second magnetic path forming body that change the distance of the magnetic gap by freely opening and closing an end on the side of the magnetic gap. The mounting device according to any one of item 10. A mounting method using the mounting apparatus according to any one of claims 7 to 11,
First, the element substrate is placed on the mounting surface of the mounting substrate via a solder sheet,
Next, magnetic flux is supplied to the mounting surface portion of the mounting substrate from the magnetic gap side end of the magnetic path forming body constituting the high frequency induction heating head. A mounting method using the mounting apparatus according to claim 9,
First, the positioning cover is placed on the mounting substrate, and the solder sheet and the element substrate are placed in this order from the mounting substrate side within the opening of the positioning cover,
Next, the element substrate is pressed against the mounting surface side of the mounting substrate by the pressing jig,
A mounting method characterized in that, after that, magnetic flux is supplied from an end on the magnetic gap side of a magnetic path forming body constituting the high-frequency induction heating head to a mounting surface portion of the mounting substrate. A mounting method using the mounting apparatus according to claim 9,
First, with the positioning cover placed on the mounting base, a solder sheet, the element base, and a protective board are placed in the opening of the positioning cover in this order from the mounting base side, and the protective board is The side opposite to the element substrate is in a state of protruding from the opening,
Next, the protection board is pressed against the mounting surface side of the mounting base by the holding jig,
A mounting method characterized in that, after that, magnetic flux is supplied from an end on the magnetic gap side of a magnetic path forming body constituting the high-frequency induction heating head to a mounting surface portion of the mounting substrate.

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