JP7411947B2 - lighting equipment - Google Patents

lighting equipment Download PDF

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Publication number
JP7411947B2
JP7411947B2 JP2019026511A JP2019026511A JP7411947B2 JP 7411947 B2 JP7411947 B2 JP 7411947B2 JP 2019026511 A JP2019026511 A JP 2019026511A JP 2019026511 A JP2019026511 A JP 2019026511A JP 7411947 B2 JP7411947 B2 JP 7411947B2
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Prior art keywords
circuit components
lighting device
region
light emitting
leaded
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JP2020136022A (en
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範男 伊藤
寿光 車谷
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2019026511A priority Critical patent/JP7411947B2/en
Priority to CN202010084022.6A priority patent/CN111649272A/en
Priority to TW109104432A priority patent/TW202035915A/en
Publication of JP2020136022A publication Critical patent/JP2020136022A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/04—Recessed bases
    • F21V21/047—Mounting arrangements with fastening means engaging the inner surface of a hole in a ceiling or wall, e.g. for solid walls or for blind holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0025—Combination of two or more reflectors for a single light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

本開示は、照明装置に関する。 The present disclosure relates to a lighting device.

従来の照明装置として特許文献１には、電源回路素子を実装した電源基板と、光源を実装した基板と、電源回路素子を実装した電源基板及び光源を実装した基板を収容する矩形状のユニットカバーとを有する天井埋め込み型の照明装置が開示されている。 As a conventional lighting device, Patent Document 1 discloses a power supply board on which a power supply circuit element is mounted, a board on which a light source is mounted, and a rectangular unit cover that accommodates the power supply board on which the power supply circuit element is mounted and the board on which the light source is mounted. A ceiling-embedded lighting device is disclosed.

特開２０１８－１９８１４１号公報Japanese Patent Application Publication No. 2018-198141

従来の照明装置では、電源回路素子であるリード付き回路部品を実装する電源基板と、光源を実装する基板とはそれぞれ異なる基板である。これを１つの基板にそれぞれ実装する場合、光源が発する熱がリード付き回路部品に影響を与えてしまうことがある。また、それぞれが異なる基板であるため、収容空間が大きくなり、ユニットカバーが大型化してしまうことがある。 In a conventional lighting device, a power supply board on which a leaded circuit component, which is a power supply circuit element, is mounted and a board on which a light source is mounted are different boards. When each of these is mounted on a single board, the heat generated by the light source may affect the leaded circuit components. Furthermore, since each board is different, the housing space becomes large, and the unit cover may become large.

そこで、発光モジュールの発する熱がリード付き回路部品に与える影響を抑制することができるとともに、照明装置の大型化を抑制することができる照明装置を提供することを目的とする。 Therefore, it is an object of the present invention to provide a lighting device that can suppress the influence of heat generated by a light emitting module on leaded circuit components, and can also suppress an increase in the size of the lighting device.

上記目的を達成するために、本開示に係る照明装置の一態様は、光を出射する照明装置であって、１以上のリード付き回路部品と、１以上のチップ回路部品と、第１領域に前記１以上のリード付き回路部品が実装され、かつ、前記第１領域と異なる第２領域に前記１以上のチップ回路部品が実装される実装基板と、前記１以上のリード付き回路部品及び前記１以上のチップ回路部品を覆う筐体とを備え、前記第１領域に実装される前記１以上のリード付き回路部品の単位面積当たりの密度は、前記第２領域に実装される前記１以上のリード付き回路部品の単位面積当たりの密度よりも大きく、前記第２領域に実装される前記１以上のチップ回路部品の単位面積当たりの密度は、前記第１領域に実装される前記１以上のチップ回路部品の単位面積当たりの密度よりも大きく、前記筐体は、前記１以上のリード付き回路部品を覆う天板を有し、前記天板は、当該照明装置が出射する光の光軸方向に沿って当該照明装置を平面視した場合に前記第２領域と重なる第１天板部と、前記第１天板部に接続され、当該照明装置が出射する光の出射方向と反対方向に向かって前記１以上のリード付き回路部品を収容する空間を狭める傾斜部と、前記傾斜部に接続され、当該照明装置が出射する光の光軸方向に沿って当該照明装置を平面視した場合に前記第１領域と重なる第２天板部とを有し、前記第１天板部、前記傾斜部、及び、前記第２天板部が段部を構成し、前記１以上のチップ回路部品は、少なくとも発光モジュールと、前記発光モジュールを制御する１以上の制御回路部品とを含み、前記第２領域は、前記発光モジュールを実装する発光領域と、前記制御回路部品を実装する制御領域とに分かれ、前記傾斜部は、当該照明装置が出射する光の光軸方向に沿って当該照明装置を平面視した場合に、前記制御領域及び前記第１領域にのみ重なっている。 In order to achieve the above object, one aspect of the lighting device according to the present disclosure is a lighting device that emits light, the lighting device including one or more leaded circuit components, one or more chip circuit components, and a first region. a mounting board on which the one or more leaded circuit components are mounted and on which the one or more chip circuit components are mounted in a second region different from the first region; the one or more leaded circuit components; and the one or more leaded circuit components; The density per unit area of the one or more lead-equipped circuit components mounted in the first region is the same as that of the one or more leads mounted in the second region. The density per unit area of the one or more chip circuit components mounted in the second region is higher than the density per unit area of the one or more chip circuit components mounted in the first region. the housing has a top plate that covers the one or more leaded circuit components, and the top plate has a top plate that extends along the optical axis direction of the light emitted by the lighting device. a first top plate portion that overlaps the second region when the lighting device is viewed from above; a slope portion that narrows a space for accommodating one or more leaded circuit components; and a slope portion connected to the slope portion, when the lighting device is viewed from above along the optical axis direction of light emitted by the lighting device. a second top plate portion that overlaps with the area, the first top plate portion, the inclined portion, and the second top plate portion constitute a step portion , and the one or more chip circuit components are configured to emit at least light. The second region includes a module and one or more control circuit components for controlling the light emitting module, and the second region is divided into a light emitting region in which the light emitting module is mounted and a control region in which the control circuit component is mounted. The portion overlaps only the control region and the first region when the lighting device is viewed in plan along the optical axis direction of light emitted by the lighting device .

本開示に係る照明装置では、発光モジュールの発する熱がリード付き回路部品に与える影響を抑制することができるとともに、照明装置の大型化を抑制することができる。 In the lighting device according to the present disclosure, it is possible to suppress the influence of the heat generated by the light emitting module on the leaded circuit component, and it is also possible to suppress the increase in size of the lighting device.

図１は、実施の形態に係る照明装置を例示する斜視図である。FIG. 1 is a perspective view illustrating a lighting device according to an embodiment. 図２は、実施の形態に係る照明装置の分解斜視図である。FIG. 2 is an exploded perspective view of the lighting device according to the embodiment. 図３は、図１のＩＩＩ－ＩＩＩ線における、照明装置の断面を見た断面図である。FIG. 3 is a cross-sectional view of the illumination device taken along line III-III in FIG. 図４は、実施の形態に係る照明装置をＸ軸マイナス方向側から平面視した平面図である。FIG. 4 is a plan view of the lighting device according to the embodiment viewed from the X-axis minus direction side. 図５は、照明装置の基板における第１領域及び第２領域を示す模式図である。FIG. 5 is a schematic diagram showing the first region and the second region on the substrate of the lighting device.

以下では、本開示の実施の形態について、図面を用いて詳細に説明する。なお、以下に説明する実施の形態は、いずれも本開示の一具体例を示すものである。したがって、以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置及び接続形態等は、一例であり、本開示を限定する趣旨ではない。よって、以下の実施の形態における構成要素のうち、本開示の最上位概念を示す独立請求項に記載されていない構成要素については、任意の構成要素として説明される。 Below, embodiments of the present disclosure will be described in detail using the drawings. Note that the embodiments described below each represent a specific example of the present disclosure. Therefore, the numerical values, shapes, materials, components, arrangement and connection forms of the components shown in the following embodiments are merely examples, and are not intended to limit the present disclosure. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims representing the most important concept of the present disclosure will be described as arbitrary constituent elements.

また、各図は、模式図であり、必ずしも厳密に図示されたものではない。したがって、例えば、各図において縮尺等は必ずしも一致しない。また、各図において、実質的に同一の構成については同一の符号を付しており、重複する説明は省略又は簡略化する。 Furthermore, each figure is a schematic diagram and is not necessarily strictly illustrated. Therefore, for example, the scale etc. of each figure do not necessarily match. Further, in each figure, substantially the same configurations are denoted by the same reference numerals, and overlapping explanations will be omitted or simplified.

また、以下の実施の形態において、略平行等の表現を用いている。例えば、略平行は、完全に平行であることを意味するだけでなく、実質的に平行である、すなわち、例えば数％程度の誤差を含むことも意味する。また、略平行は、本開示による効果を奏し得る範囲において平行という意味である。他の「略」を用いた表現についても同様である。 Furthermore, in the following embodiments, expressions such as "substantially parallel" are used. For example, "substantially parallel" does not only mean completely parallel, but also means substantially parallel, that is, including an error of, for example, several percent. Further, "substantially parallel" means parallel to the extent that the effects of the present disclosure can be achieved. The same applies to other expressions using "abbreviation".

まず、本実施の形態に係る照明装置について説明する。 First, a lighting device according to this embodiment will be described.

（実施の形態）
［構成］
図１は、実施の形態に係る照明装置１を例示する斜視図である。図１では、照明装置１において、照明装置１（具体的には後述する発光モジュール６２）から出射する光の出射方向をＸ軸プラス方向（例えば、照明装置１の下側）と規定し、器具本体３の一部が光軸と直交する方向に突出する外径方向をＹ軸プラス方向と規定し、Ｘ軸プラス方向及びＹ軸プラス方向と交差する方向をＺ軸プラス方向と規定する。そして、図２以降の各図に示す各方向は、図１に示す各方向に対応させて表示する。 (Embodiment)
[composition]
FIG. 1 is a perspective view illustrating a lighting device 1 according to an embodiment. In FIG. 1, in the lighting device 1, the direction of light emitted from the lighting device 1 (specifically, the light emitting module 62 described later) is defined as the X-axis plus direction (for example, the lower side of the lighting device 1), and The outer diameter direction in which a portion of the main body 3 protrudes in a direction perpendicular to the optical axis is defined as the Y-axis plus direction, and the direction intersecting the X-axis plus direction and the Y-axis plus direction is defined as the Z-axis plus direction. Each direction shown in each figure after FIG. 2 is displayed corresponding to each direction shown in FIG. 1.

［照明装置１］
図１に示すように、照明装置１は、天井等の造営材に取付けられる装置である。例えば、照明装置１は、スポットライト、ダウンライト等である。照明装置１は、所定の方向に向けて光を照射することで所定方向を照明することができる装置である。 [Lighting device 1]
As shown in FIG. 1, a lighting device 1 is a device that is attached to construction materials such as a ceiling. For example, the lighting device 1 is a spotlight, a downlight, or the like. The lighting device 1 is a device that can illuminate a predetermined direction by emitting light in a predetermined direction.

図２は、実施の形態に係る照明装置１の分解斜視図である。図３は、図１のＩＩＩ－ＩＩＩ線における、照明装置１の断面を見た断面図である。図２及び図３に示すように、照明装置１は、器具本体３と、一対の板バネ７０と、実装基板６１と、発光モジュール６２と、照明制御部６９と、電源部６３と、ホルダ５１と、セード部５４と、透光カバー５５とを有する。 FIG. 2 is an exploded perspective view of the lighting device 1 according to the embodiment. FIG. 3 is a cross-sectional view of the illumination device 1 taken along line III-III in FIG. As shown in FIGS. 2 and 3, the lighting device 1 includes a fixture body 3, a pair of leaf springs 70, a mounting board 61, a light emitting module 62, a lighting control section 69, a power supply section 63, and a holder 51. , a shade portion 54 , and a transparent cover 55 .

＜器具本体３＞
器具本体３は、照明装置１の外殻を構成する。器具本体３の一部は、発光モジュール６２が出射する光の光軸方向と交差する方向（Ｙ軸プラス方向）に突出する。つまり、照明装置１を造営材の取付孔に取付けた際に、器具本体３の一部は、天井に沿って延びる。ここでいう光軸とは、発光モジュール６２が出射する光の主たる軸である。光軸方向とは、Ｘ軸方向と略平行である。 <Instrument body 3>
The appliance body 3 constitutes the outer shell of the lighting device 1. A portion of the device main body 3 protrudes in a direction intersecting the optical axis direction of light emitted by the light emitting module 62 (Y-axis plus direction). That is, when the lighting device 1 is attached to the attachment hole of the construction material, a part of the fixture body 3 extends along the ceiling. The optical axis here is the main axis of light emitted by the light emitting module 62. The optical axis direction is approximately parallel to the X-axis direction.

図１に示すように、器具本体３は、第１筐体３１と、第２筐体３２と、外装カバー４０とを有する。 As shown in FIG. 1, the instrument main body 3 includes a first housing 31, a second housing 32, and an exterior cover 40.

＜第１筐体３１及び第２筐体３２＞
第１筐体３１及び第２筐体３２は、実装基板６１、発光モジュール６２、及び、電源部６３を収容する収容体を構成する。第１筐体３１及び第２筐体３２がネジ等の固定部材で固定されることによって形成される収容空間は、発光モジュール６２が配置される側が小さい第１空間を形成し、電源部６３が配置される空間が、第１空間よりも大きく膨出した第２空間を形成する。第１筐体３１及び第２筐体３２のそれぞれは、筐体の一例である。 <First housing 31 and second housing 32>
The first casing 31 and the second casing 32 constitute a housing body that houses the mounting board 61 , the light emitting module 62 , and the power supply section 63 . The accommodation space formed by fixing the first casing 31 and the second casing 32 with fixing members such as screws forms a first space that is small on the side where the light emitting module 62 is disposed, and a first space where the power supply section 63 is located. The arranged space forms a second space that bulges out more than the first space. Each of the first housing 31 and the second housing 32 is an example of a housing.

図４は、実施の形態に係る照明装置１を第１筐体３１側から平面視した平面図である。図２及び図４に示すように、第１筐体３１及び第２筐体３２は、照明装置１をＸ軸プラス方向側から（光軸方向に沿って）平面視した場合に、円筒状の外装カバー４０の外周面よりも外径方向に突出する。言い換えれば、照明装置１が造営材の取付孔に取付けられた場合、第１筐体３１及び第２筐体３２は、外装カバー４０の外周面から、造営材に沿って外径方向に延びている。ここで外径方向は、Ｙ軸プラス方向である。このことから、第１筐体３１及び第２筐体３２のＹ軸方向の長さは、外装カバー４０の半径よりも大きい。 FIG. 4 is a plan view of the lighting device 1 according to the embodiment viewed from the first housing 31 side. As shown in FIGS. 2 and 4, the first housing 31 and the second housing 32 have a cylindrical shape when the lighting device 1 is viewed from above (along the optical axis direction) from the X-axis plus direction side. It protrudes in the outer radial direction from the outer circumferential surface of the exterior cover 40. In other words, when the lighting device 1 is attached to the mounting hole of the construction material, the first housing 31 and the second housing 32 extend in the outer radial direction from the outer peripheral surface of the exterior cover 40 along the construction material. There is. Here, the outer diameter direction is the Y-axis plus direction. For this reason, the length of the first housing 31 and the second housing 32 in the Y-axis direction is larger than the radius of the exterior cover 40.

図１及び図３に示すように、第１筐体３１は、収容体の底部を構成する。第１筐体３１は、Ｙ軸方向に長尺であり、外装カバー４０の外周面から突出するように、Ｙ軸プラス方向に延びる。また、第１筐体３１は、金属製であり、例えば、アルミニウム、又は鉄等を主成分とした板金を折り曲げ加工して形成される。 As shown in FIGS. 1 and 3, the first housing 31 constitutes the bottom of the container. The first housing 31 is elongated in the Y-axis direction and extends in the Y-axis plus direction so as to protrude from the outer peripheral surface of the exterior cover 40 . The first housing 31 is made of metal, and is formed by bending a sheet metal mainly made of aluminum, iron, or the like.

第１筐体３１は、底板部３１ａと、一対の第１取付部３１ｂとを有する。 The first housing 31 has a bottom plate portion 31a and a pair of first attachment portions 31b.

底板部３１ａは、第２筐体３２及び外装カバー４０を所定の姿勢で固定する、Ｙ軸方向に長尺な平板である。底板部３１ａのＹ軸マイナス方向には、底板部３１ａの両端縁の一部からＺ軸方向に張り出すように延びる一対の延出片３１ａ２が形成される。一対の延出片３１ａ２の端縁は、Ｙ軸方向に対して斜めに張り出している。 The bottom plate portion 31a is a flat plate that is elongated in the Y-axis direction and fixes the second housing 32 and the exterior cover 40 in a predetermined posture. A pair of extension pieces 31a2 are formed in the negative Y-axis direction of the bottom plate portion 31a so as to extend in the Z-axis direction from a portion of both end edges of the bottom plate portion 31a. The end edges of the pair of extending pieces 31a2 project obliquely with respect to the Y-axis direction.

また、一対の延出片３１ａ２の間には、発光モジュール６２を露出させるための開口３１ａ１が底板部３１ａに形成される。開口３１ａ１は、底板部３１ａのＹ軸マイナス方向に形成される。 Further, an opening 31a1 for exposing the light emitting module 62 is formed in the bottom plate portion 31a between the pair of extension pieces 31a2. The opening 31a1 is formed in the negative Y-axis direction of the bottom plate portion 31a.

図１及び図２に示すように、一対の第１取付部３１ｂは、底板部３１ａにおけるＹ軸マイナス方向側に配置され、外装カバー４０の外周側に位置し、底板部３１ａの開口３１ａ１の両側に設けられる。一対の第１取付部３１ｂは、底板部３１ａの一対の延出片３１ａ２と一対一で対応するように、第１筐体３１に一体的に設けられる。一対の第１取付部３１ｂは、一対の延出片３１ａ２の端縁に接続されるため、照明装置１をＸ軸マイナス方向側から（光軸方向に沿って）平面視した場合に、板バネ７０を取付けるための外周側の表面３１ｂ２がＸ－Ｙ平面に対して傾く。一対の第１取付部３１ｂの表面３１ｂ２は、後述する板バネ７０の第２取付部７１と対向する面である。 As shown in FIGS. 1 and 2, the pair of first attachment parts 31b are arranged on the Y-axis minus direction side of the bottom plate part 31a, are located on the outer peripheral side of the exterior cover 40, and are located on both sides of the opening 31a1 of the bottom plate part 31a. established in The pair of first attachment parts 31b are integrally provided in the first housing 31 so as to correspond one-to-one with the pair of extension pieces 31a2 of the bottom plate part 31a. Since the pair of first attachment parts 31b are connected to the edges of the pair of extension pieces 31a2, when the lighting device 1 is viewed from the X-axis negative side (along the optical axis direction), the plate spring The outer circumferential surface 31b2 for attaching 70 is inclined with respect to the XY plane. A surface 31b2 of the pair of first attachment portions 31b is a surface facing a second attachment portion 71 of a leaf spring 70, which will be described later.

図４に示すように、照明装置１をＸ軸マイナス方向側（例えば、照明装置１の上側）から平面視した場合において、一対の第１取付部３１ｂのうちの少なくとも一方の第１取付部３１ｂと他方の第１取付部３１ｂとは、器具本体３の中心である中心線Ｏに対して点対称に配置される。一対の第１取付部３１ｂは、その並びがＺ軸方向及びＹ軸方向に対して、所定の角度だけ傾くように配置される。本実施の形態では、一対の第１取付部３１ｂのうちの少なくとも一方の第１取付部３１ｂが、照明装置１をＸ軸マイナス方向側から平面視した場合、照明装置１の光軸（光軸方向）と略一致する中心線Ｏを含むＺ軸方向と平行な線よりもＹ軸プラス方向側の領域において、Ｙ軸プラス方向の線からＺ軸プラス方向の線までの間の領域、又は、Ｙ軸プラス方向の線からＺ軸マイナス方向（第２方向の一例）の線までの間の領域に配置される。つまり、器具本体３の一部がＹ軸プラス方向に延びているため、中心線ＯからＹ軸プラス方向に照明装置１の重心Ｈがズレている。重心Ｈがズレているということは、照明装置１を造営材の取付孔に取付けた際に、造営材の取付孔に偏荷重がかかることになる。このような照明装置１において、一対の第１取付部３１ｂのうちの少なくとも一方の第１取付部３１ｂは、このズレた重心Ｈを支持するように配置される。 As shown in FIG. 4, when the lighting device 1 is viewed from above in the negative X-axis direction (for example, from the upper side of the lighting device 1), at least one of the first mounting portions 31b of the pair of first mounting portions 31b and the other first attachment portion 31b are arranged point-symmetrically with respect to the center line O, which is the center of the instrument main body 3. The pair of first attachment parts 31b are arranged so that the arrangement thereof is inclined by a predetermined angle with respect to the Z-axis direction and the Y-axis direction. In this embodiment, at least one of the first mounting parts 31b of the pair of first mounting parts 31b is connected to the optical axis (optical axis) of the lighting apparatus 1 when the lighting apparatus 1 is viewed from the In a region on the Y-axis positive direction side of a line parallel to the Z-axis direction including the center line O that substantially coincides with the center line O, the region between the Y-axis positive direction line and the Z-axis positive direction line, or It is arranged in a region between a line in the Y-axis plus direction and a line in the Z-axis minus direction (an example of the second direction). In other words, since a portion of the fixture body 3 extends in the positive direction of the Y-axis, the center of gravity H of the lighting device 1 is shifted from the center line O in the positive direction of the Y-axis. The fact that the center of gravity H is shifted means that when the lighting device 1 is attached to the mounting hole of the construction material, an uneven load is applied to the mounting hole of the construction material. In such a lighting device 1, at least one of the pair of first mounting portions 31b is arranged so as to support the shifted center of gravity H.

なお、一対の第１取付部３１ｂのうちの他方の第１取付部３１ｂも、さらに、Ｙ軸プラス方向の線からＺ軸マイナス方向の線までの間の領域、又は、Ｙ軸プラス方向の線とＺ軸プラス方向の線との間の領域に配置されてもよい。 Note that the other first mounting portion 31b of the pair of first mounting portions 31b also covers an area between a line in the positive direction of the Y-axis and a line in the negative direction of the Z-axis, or a line in the positive direction of the Y-axis. and a line in the positive direction of the Z-axis.

また、一対の第１取付部３１ｂのうちの少なくとも一方の第１取付部３１ｂが、Ｙ軸プラス方向の線からＺ軸プラス方向の線までの間の領域、又は、Ｙ軸プラス方向の線からＺ軸マイナス方向の線までの間の領域に配置されていればよいため、一対の第１取付部３１ｂのうちの他方の第１取付部３１ｂが、中心線Ｏを含むＺ軸方向の線Ｖ２よりもＹ軸プラス方向側の領域以外の領域に配置されていてもよい。 Further, at least one of the first mounting parts 31b of the pair of first mounting parts 31b is located in an area between a line in the positive direction of the Y-axis and a line in the positive direction of the Z-axis, or from a line in the positive direction of the Y-axis. Since it is sufficient that the other first mounting portion 31b of the pair of first mounting portions 31b is disposed in a region up to the line in the Z-axis direction minus direction, the other first mounting portion 31b of the pair of first mounting portions 31b may It may be arranged in a region other than the region on the Y-axis plus direction side.

図２及び図３に示すように、第２筐体３２は、収容体の天板部分を構成する。つまり、第２筐体３２は、第１筐体３１のＸ軸マイナス方向側に配置される。第２筐体３２は、実装基板６１及び電源部６３を覆うカバーとしての役割を果たす。また、第２筐体３２は、金属製であり、例えば、アルミニウム、又は鉄等を主成分とした板金を折り曲げ加工して形成される。 As shown in FIGS. 2 and 3, the second housing 32 constitutes a top plate portion of the container. That is, the second housing 32 is arranged on the X-axis minus direction side of the first housing 31. The second housing 32 serves as a cover that covers the mounting board 61 and the power supply unit 63. The second housing 32 is made of metal, and is formed by bending a sheet metal mainly made of aluminum, iron, or the like.

第２筐体３２は、チップ回路部品よりも背の高いリード付き回路部品で構成される電源部６３を回避するように、Ｘ軸マイナス方向に上る段部を有する。第２筐体３２は、段部によって、電源部６３に対応する部分がＸ軸マイナス方向に膨出する形状である。 The second casing 32 has a stepped portion that rises in the negative direction of the X-axis so as to avoid the power supply section 63 that is made up of a leaded circuit component that is taller than the chip circuit component. The second casing 32 has a stepped portion in which a portion corresponding to the power supply portion 63 bulges in the negative direction of the X-axis.

具体的には、第２筐体３２は、天板３２ａと、立壁部３２ｂとを有する。 Specifically, the second housing 32 includes a top plate 32a and a standing wall portion 32b.

天板３２ａは、第１天板部３２ａ１と、傾斜部３２ａ２と、第２天板部３２ａ３とを有する。 The top plate 32a has a first top plate part 32a1, an inclined part 32a2, and a second top plate part 32a3.

第１天板部３２ａ１は、実装基板６１を固定するための取付け面部である。照明装置１をＸ軸マイナス方向側から平面視した場合に、第１天板部３２ａ１は、発光モジュール６２及び照明制御部６９を構成するチップ回路部品が実装基板６１に実装される第２領域Ｅ２と重なる。 The first top plate portion 32a1 is a mounting surface portion for fixing the mounting board 61. When the lighting device 1 is viewed from above in the negative X-axis direction, the first top plate portion 32a1 has a second area E2 where chip circuit components constituting the light emitting module 62 and the lighting control unit 69 are mounted on the mounting board 61. overlaps with

傾斜部３２ａ２は、第１天板部３２ａ１のＹ軸プラス方向側の端縁に接続される。傾斜部３２ａ２は、当該照明装置１が出射する光の出射方向（Ｘ軸プラス方向）と反対方向に向かって１以上のリード付き回路部品を収容する空間を狭める。つまり、傾斜部３２ａ２は、Ｘ軸マイナス方向に向かって上り傾斜している。照明装置１をＸ軸マイナス方向側から平面視した場合に、傾斜部３２ａ２は、チップ回路部品の制御回路部品が実装基板６１に実装される制御領域Ｅ２ｂと重なる。 The inclined portion 32a2 is connected to the edge of the first top plate portion 32a1 on the Y-axis plus direction side. The inclined portion 32a2 narrows the space for accommodating one or more leaded circuit components in a direction opposite to the light emission direction (X-axis plus direction) emitted by the lighting device 1. That is, the inclined portion 32a2 is inclined upward toward the negative direction of the X-axis. When the illumination device 1 is viewed from above in the negative X-axis direction, the inclined portion 32a2 overlaps the control region E2b in which the control circuit component of the chip circuit component is mounted on the mounting board 61.

第２天板部３２ａ３は、傾斜部３２ａ２のＹ軸プラス方向側の端縁に接続される。照明装置１をＸ軸マイナス方向側から平面視した場合に、第２天板部３２ａ３は、電源部６３が実装基板６１に実装される第１領域Ｅ１と重なる。 The second top plate portion 32a3 is connected to the edge of the inclined portion 32a2 on the Y-axis plus direction side. When the lighting device 1 is viewed from above in the negative X-axis direction, the second top plate portion 32a3 overlaps with the first region E1 where the power supply portion 63 is mounted on the mounting board 61.

このように、第１天板部３２ａ１、傾斜部３２ａ２、及び、第２天板部３２ａ３が段部を構成する。 In this way, the first top plate portion 32a1, the inclined portion 32a2, and the second top plate portion 32a3 constitute a stepped portion.

立壁部３２ｂは、第２天板部３２ａ３からＸ軸プラス方向に立ち上がる壁部である。立壁部３２ｂには、電源部６３に交流電流を供給するための電源コネクタ３９が固定される。電源コネクタ３９は、電源部６３と配線により電気的に接続され、商用電源から供給される交流電流を電源部６３に供給する。電源コネクタ３９は、器具本体３の構成に含まれていてもよい。 The standing wall portion 32b is a wall portion that stands up from the second top plate portion 32a3 in the positive direction of the X-axis. A power supply connector 39 for supplying alternating current to the power supply section 63 is fixed to the standing wall section 32b. The power supply connector 39 is electrically connected to the power supply section 63 by wiring, and supplies the power supply section 63 with an alternating current supplied from a commercial power source. The power connector 39 may be included in the configuration of the instrument body 3.

＜外装カバー４０＞
外装カバー４０は、Ｘ軸方向の両側で開口した中空の円錐台状の外殻である。外装カバー４０のＸ軸マイナス方向側の端部は、第１筐体３１における底板部３１ａの開口３１ａ１の周囲を囲むように、ネジ等の固定部材により第１筐体３１に固定される。外装カバー４０の内部は、発光モジュール６２が発する光が通過する。 <Exterior cover 40>
The exterior cover 40 is a hollow truncated conical outer shell that is open on both sides in the X-axis direction. The end of the exterior cover 40 on the X-axis minus direction side is fixed to the first housing 31 by a fixing member such as a screw so as to surround the opening 31a1 of the bottom plate portion 31a of the first housing 31. Light emitted by the light emitting module 62 passes through the interior of the exterior cover 40 .

外装カバー４０は、筒部４１と、枠部４２とを有する。 The exterior cover 40 has a cylindrical portion 41 and a frame portion 42.

筒部４１は、円錐台状の外装部分である。筒部４１は、Ｘ軸マイナス方向からＸ軸プラス方向に向かって大径になる。筒部４１の中心線は、上述の中心線Ｏと略一致する。筒部４１の直径は、造営材の取付孔の直径よりも小さい。 The cylindrical portion 41 is a truncated conical exterior portion. The diameter of the cylindrical portion 41 increases from the negative direction of the X-axis toward the positive direction of the X-axis. The centerline of the cylindrical portion 41 substantially coincides with the centerline O described above. The diameter of the cylindrical portion 41 is smaller than the diameter of the mounting hole of the construction material.

筒部４１の内部は、発光モジュール６２が発する光が通過する。筒部４１の内周面は、透光カバー５５から出射した光を所定方向に配光制御するための光反射カバーとしての役割を果たす。 Light emitted by the light emitting module 62 passes through the inside of the cylindrical portion 41 . The inner circumferential surface of the cylindrical portion 41 serves as a light reflecting cover for controlling the distribution of light emitted from the transparent cover 55 in a predetermined direction.

枠部４２は、照明装置１が取付けられる天井板等の造営材を保持する円環状の鍔である。枠部４２は、筒部４１の下端縁（Ｘ軸プラス方向の端縁）から外径方向に延びる。枠部４２の外径は、照明装置１が取付けられる造営材の取付孔の内径よりも大きい。枠部４２と一対の板バネ７０とは、造営材を挟持することで、照明装置１を造営材に安定的に固定する。 The frame portion 42 is an annular collar that holds construction materials such as a ceiling plate to which the lighting device 1 is attached. The frame portion 42 extends in the outer diameter direction from the lower end edge (the end edge in the positive direction of the X-axis) of the cylindrical portion 41 . The outer diameter of the frame portion 42 is larger than the inner diameter of the mounting hole of the construction material to which the lighting device 1 is mounted. The frame portion 42 and the pair of leaf springs 70 stably fix the lighting device 1 to the construction material by sandwiching the construction material.

＜板バネ７０＞
一対の板バネ７０は、造営材に形成された取付孔に照明装置１を取付けて固定するための弾性部材であり、外装カバー４０の外周側に配置される。一対の板バネ７０は、第１筐体３１の一対の第１取付部３１ｂに一対一で取付けられる。一対の板バネ７０は、外装カバー４０の枠部４２とによって、造営材を挟持する。板バネ７０は、バネの一例である。 <Plate spring 70>
The pair of leaf springs 70 are elastic members for attaching and fixing the lighting device 1 to attachment holes formed in the construction material, and are arranged on the outer peripheral side of the exterior cover 40. The pair of leaf springs 70 are attached one-to-one to the pair of first attachment parts 31b of the first housing 31. The pair of leaf springs 70 and the frame portion 42 of the exterior cover 40 sandwich the construction material. The leaf spring 70 is an example of a spring.

なお、板バネ７０は、照明装置１に３つ以上設けられていてもよい。 Note that the lighting device 1 may be provided with three or more leaf springs 70.

一対の板バネ７０は、例えば鋼材等の金属材料で形成される。また、一対の板バネ７０の板厚及び幅は、一対の板バネ７０を形成する材料のヤング率、照明装置１の重量等に応じて、照明装置１を造営材に安定的に固定できるように適宜定められる。なお、一対の板バネ７０の代わりに、線バネでもよく、他の公知のバネを用いてもよい。 The pair of leaf springs 70 are made of, for example, a metal material such as steel. The thickness and width of the pair of leaf springs 70 are determined depending on the Young's modulus of the material forming the pair of leaf springs 70, the weight of the lighting device 1, etc., so that the lighting device 1 can be stably fixed to construction materials. shall be determined as appropriate. Note that instead of the pair of leaf springs 70, wire springs or other known springs may be used.

図４に示すように、一対の板バネ７０は、第１筐体３１の第１取付部３１ｂの位置に応じて取付けられる。本実施の形態では、照明装置１をＸ軸マイナス方向側から平面視した場合に、一対の板バネ７０の後述するアーム部７２は、中心線Ｏから遠ざかるように延びる姿勢で配置される。 As shown in FIG. 4, the pair of leaf springs 70 are attached according to the position of the first attachment part 31b of the first housing 31. In this embodiment, when the illumination device 1 is viewed from above in the negative X-axis direction, the arm portions 72 of the pair of leaf springs 70, which will be described later, are arranged in a posture extending away from the center line O.

また、一対の板バネ７０のうち、少なくとも一方の板バネ７０は、当該照明装置１をＸ軸マイナス方向側から平面視した場合に、中心線Ｏを含む平面であり、かつ、器具本体３の一部が突出する方向と直交する平面（Ｘ－Ｚ平面）よりも器具本体３の一部が突出する側（Ｙ軸プラス方向側）に配置される。つまり、一対の板バネ７０のうち、少なくとも一方の板バネ７０は、図４の直線Ｖ２よりもＹ軸プラス方向側に配置される。本実施の形態では、当該照明装置１をＸ軸マイナス方向側から平面視した場合に、中心線Ｏ及び重心Ｈを通る直線と中心線Ｏから少なくとも一方の板バネ７０が延びる方向の線との角度は、９０度以下である。 Furthermore, at least one of the pair of leaf springs 70 is a plane that includes the center line O when the lighting device 1 is viewed from the X-axis minus direction side, and that It is arranged on the side in which the part of the instrument main body 3 protrudes (Y-axis positive direction side) with respect to the plane (XZ plane) perpendicular to the direction in which the part protrudes. That is, at least one of the pair of leaf springs 70 is arranged on the Y-axis plus direction side with respect to the straight line V2 in FIG. 4 . In this embodiment, when the lighting device 1 is viewed from above in the negative X-axis direction, a straight line passing through the center line O and the center of gravity H and a line in the direction in which at least one leaf spring 70 extends from the center line O The angle is 90 degrees or less.

なお、上述の「直交」は、完全に直交であることを意味するだけでなく、実質的に直交である、すなわち、例えば数％程度の誤差を含むことも意味する。 Note that the above-mentioned "orthogonal" does not only mean completely orthogonal, but also means substantially orthogonal, that is, including an error of, for example, several percent.

一対の板バネ７０のそれぞれは、第２取付部７１と、アーム部７２とを有する。 Each of the pair of leaf springs 70 has a second attachment portion 71 and an arm portion 72.

第２取付部７１は、外装カバー４０の外周面に沿って配置される基端であり、Ｘ軸方向に延びる板状である。第２取付部７１は、第１筐体３１の第１取付部３１ｂに取付けられる。 The second attachment portion 71 is a base end disposed along the outer circumferential surface of the exterior cover 40 and has a plate shape extending in the X-axis direction. The second attachment portion 71 is attached to the first attachment portion 31b of the first housing 31.

照明装置１をＸ軸マイナス方向側から平面視した場合に、第１取付部３１ｂの表面３１ｂ２がＸ－Ｙ平面に対して傾いているため、第２取付部７１もＸ－Ｙ平面に対して傾くように取付けられる。 When the lighting device 1 is viewed from above in the negative X-axis direction, since the surface 31b2 of the first mounting portion 31b is inclined with respect to the XY plane, the second mounting portion 71 is also inclined with respect to the XY plane. Mounted to tilt.

アーム部７２は、第２取付部７１のＸ軸プラス方向側の端縁と接続され、外装カバー４０の外周面から離れる方向に延びる板状の自由端である。照明装置１を造営材の取付孔に取付けた際、アーム部７２は、アーム部７２の復元力によって、造営材の取付孔に対してＸ軸プラス方向側に応力をかける。 The arm portion 72 is a plate-shaped free end that is connected to the edge of the second attachment portion 71 on the X-axis plus direction side and extends in a direction away from the outer circumferential surface of the exterior cover 40 . When the lighting device 1 is attached to the mounting hole of the construction material, the arm portion 72 applies stress to the mounting hole of the construction material in the positive direction of the X-axis due to the restoring force of the arm portion 72.

照明装置１をＸ軸マイナス方向側から平面視した場合に、一対の板バネ７０のうちの少なくとも一方の板バネ７０のアーム部７２は、Ｙ軸プラス方向の線からＺ軸プラス方向の線までの間の領域に配置される。つまり、少なくとも一方の板バネ７０のアーム部７２は、上述のズレた重心Ｈを支持するように配置される。このため、少なくとも一方の板バネ７０は、器具本体３による偏荷重を支持する。 When the lighting device 1 is viewed from above in the negative X-axis direction, the arm portion 72 of at least one of the pair of leaf springs 70 extends from a line in the positive Y-axis direction to a line in the positive Z-axis direction. placed in the area between. That is, the arm portion 72 of at least one of the leaf springs 70 is arranged so as to support the above-mentioned shifted center of gravity H. Therefore, at least one leaf spring 70 supports the uneven load caused by the instrument body 3.

また、照明装置１をＸ軸マイナス方向側から平面視した場合に、外装カバー４０の外周面から一方の板バネ７０のアーム部７２が延びる方向と、外装カバー４０から他方の板バネ７０のアーム部７２が延びる方向とは同一の直線上にある。 In addition, when the lighting device 1 is viewed from above in the negative X-axis direction, the direction in which the arm portion 72 of one leaf spring 70 extends from the outer circumferential surface of the exterior cover 40 and the direction in which the arm portion 72 of the other leaf spring 70 extends from the exterior cover 40 It is on the same straight line as the direction in which the portion 72 extends.

＜実装基板６１＞
図２及び図３に示すように、実装基板６１は、発光モジュール６２及び電源部６３等の電源回路を構成する電子部品を実装する基板である。実装基板６１は、平面視において、Ｙ軸方向に長尺、かつ、矩形状である平面を有する板材である。実装基板６１は、発光モジュール６２が出射する光の光軸方向と交差する方向に延びる。 <Mounting board 61>
As shown in FIGS. 2 and 3, the mounting board 61 is a board on which electronic components such as a light emitting module 62 and a power supply section 63, which constitute a power supply circuit, are mounted. The mounting board 61 is a plate material that is elongated in the Y-axis direction and has a rectangular plane when viewed from above. The mounting board 61 extends in a direction intersecting the optical axis direction of light emitted by the light emitting module 62.

実装基板６１は、例えばセラミックス基板、樹脂基板又は絶縁被覆されたメタルベース基板等である。実装基板６１には、発光モジュール６２を発光させるために、直流電力を電源部６３から受電する一対の電極端子（正電極端子及び負電極端子）が形成される（不図示）。電極端子は、基板のパターンを介して電源部６３に、電気的に接続される。 The mounting board 61 is, for example, a ceramic board, a resin board, or an insulated metal base board. A pair of electrode terminals (a positive electrode terminal and a negative electrode terminal) that receive DC power from the power supply unit 63 are formed on the mounting board 61 to cause the light emitting module 62 to emit light (not shown). The electrode terminal is electrically connected to the power supply section 63 via the pattern on the substrate.

実装基板６１は、第２筐体３２の天板３２ａに、ネジ等の固定部材によって固定される。具体的には、照明装置１をＸ軸マイナス方向側から平面視した場合に、実装基板６１は、第２筐体３２の天板３２ａが外装カバー４０に重なる取付け面部に固定される。取付け面部はＹ－Ｚ軸方向と略平行であるため、実装基板６１もＹ－Ｚ軸方向と略平行に保持される。このように、実装基板６１は、取付け面部からＹ軸プラス方向に延びるように第１筐体３１及び第２筐体３２によって形成された収容空間に配置される。 The mounting board 61 is fixed to the top plate 32a of the second housing 32 with a fixing member such as a screw. Specifically, when the lighting device 1 is viewed from above in the negative X-axis direction, the mounting board 61 is fixed to a mounting surface portion where the top plate 32a of the second housing 32 overlaps the exterior cover 40. Since the mounting surface portion is substantially parallel to the YZ axis direction, the mounting board 61 is also held substantially parallel to the YZ axis direction. In this way, the mounting board 61 is arranged in the accommodation space formed by the first casing 31 and the second casing 32 so as to extend from the mounting surface in the positive direction of the Y-axis.

図５は、照明装置１の基板における第１領域Ｅ１及び第２領域Ｅ２を示す模式図である。 FIG. 5 is a schematic diagram showing a first region E1 and a second region E2 on the substrate of the lighting device 1.

図３及び図５に示すように、実装基板６１は、第１領域Ｅ１に１以上のリード付き回路部品を実装し、かつ、第１領域Ｅ１と異なる第２領域Ｅ２に１以上のチップ回路部品を実装する。１以上のリード付き回路部品には、発光モジュール６２及び１以上の制御回路部品が含まれる。第１領域Ｅ１は、実装基板６１におけるＹ軸プラス方向側、かつ、Ｘ軸マイナス方向側の面に形成される。また、第２領域Ｅ２は、実装基板６１におけるＹ軸マイナス方向側、かつ、実装基板６１におけるＸ軸プラス方向側の面に形成される。 As shown in FIGS. 3 and 5, the mounting board 61 has one or more leaded circuit components mounted in a first region E1, and one or more chip circuit components mounted in a second region E2 different from the first region E1. Implement. The one or more leaded circuit components include a light emitting module 62 and one or more control circuit components. The first region E1 is formed on the surface of the mounting board 61 on the Y-axis plus direction side and on the X-axis minus direction side. Further, the second region E2 is formed on the surface of the mounting board 61 on the Y-axis minus direction side and on the surface of the mounting board 61 on the X-axis plus direction side.

また、第２領域Ｅ２は、発光モジュール６２を実装する発光領域Ｅ２ａと、制御回路部品を実装する制御領域Ｅ２ｂとに分かれる。制御領域Ｅ２ｂは、発光領域Ｅ２ａと第１領域Ｅ１との間に配置される。また、第１領域Ｅ１、発光領域Ｅ２ａ及び制御領域Ｅ２ｂは互いに重なっていない。 Further, the second area E2 is divided into a light emitting area E2a where the light emitting module 62 is mounted and a control area E2b where the control circuit components are mounted. The control region E2b is arranged between the light emitting region E2a and the first region E1. Further, the first region E1, the light emitting region E2a, and the control region E2b do not overlap with each other.

第１領域Ｅ１に実装される１以上のリード付き回路部品の単位面積当たりの密度は、第２領域Ｅ２に実装される１以上のリード付き回路部品の単位面積当たりの密度よりも大きい。つまり、第１領域Ｅ１には、１以上のリード付き回路部品が密集している。なお、第２領域Ｅ２には、リード付き回路部品だけが実装基板６１に実装されていてもよく、僅かにチップ回路部品が実装基板６１に実装されていてもよい。 The density per unit area of one or more leaded circuit components mounted in the first region E1 is higher than the density per unit area of the one or more leaded circuit components mounted in the second region E2. In other words, one or more leaded circuit components are concentrated in the first region E1. Note that in the second region E2, only leaded circuit components may be mounted on the mounting board 61, or only a few chip circuit components may be mounted on the mounting board 61.

また、第２領域Ｅ２に実装される１以上のチップ回路部品の単位面積当たりの密度は、第１領域Ｅ１に実装される１以上のチップ回路部品の単位面積当たりの密度よりも大きい。つまり、第２領域Ｅ２には、１以上のチップ回路部品が密集している。なお、第２領域Ｅ２には、チップ回路部品だけが実装基板６１に実装されていてもよく、僅かにリード付き回路部品が実装基板６１に実装されていてもよい。 Further, the density per unit area of one or more chip circuit components mounted in the second region E2 is higher than the density per unit area of the one or more chip circuit components mounted in the first region E1. In other words, one or more chip circuit components are concentrated in the second region E2. Note that in the second region E2, only chip circuit components may be mounted on the mounting board 61, or a few circuit components with leads may be mounted on the mounting board 61.

＜発光モジュール６２＞
図２及び図３に示すように、発光モジュール６２は、所定の光を放射状に出射するＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）モジュールである。本実施の形態では、発光モジュール６２は、例えば白色光を出射するように構成される。例えば、発光モジュール６２は、ＣＯＢ（Ｃｈｉｐ Ｏｎ Ｂｏａｒｄ）型ＬＥＤで構成され、実装基板６１上に実装されたベアチップ（ＬＥＤチップ）である複数の青色ＬＥＤと、それら青色ＬＥＤを封止し、黄色蛍光体を含む封止部材とを備える。 <Light-emitting module 62>
As shown in FIGS. 2 and 3, the light emitting module 62 is an LED (Light Emitting Diode) module that emits predetermined light radially. In this embodiment, the light emitting module 62 is configured to emit, for example, white light. For example, the light emitting module 62 is composed of COB (Chip On Board) type LEDs, and includes a plurality of blue LEDs that are bare chips (LED chips) mounted on the mounting board 61, and a yellow fluorescent light by sealing the blue LEDs. and a sealing member including a body.

図３及び図５に示すように、発光モジュール６２は、実装基板６１における長手方向の他方側、つまり、Ｙ軸マイナス方向側に実装される。また、発光モジュール６２は、第１天板部３２ａ１と対向する側の実装基板６１の面、つまり、Ｘ軸プラス方向側の面に実装される。 As shown in FIGS. 3 and 5, the light emitting module 62 is mounted on the other side of the mounting board 61 in the longitudinal direction, that is, on the negative Y-axis direction side. Further, the light emitting module 62 is mounted on the surface of the mounting board 61 on the side facing the first top plate portion 32a1, that is, the surface on the X-axis positive direction side.

このため、発光モジュール６２がＸ軸プラス方向に向けて出射する。発光モジュール６２が発する光は、後述するホルダ５１の開口部５２、セード部５４、透光カバー５５、外装カバー４０の筒部４１を通過し、周囲を照明する。 Therefore, the light emitting module 62 emits light in the positive direction of the X-axis. The light emitted by the light emitting module 62 passes through the opening 52 of the holder 51, the shade part 54, the transparent cover 55, and the cylindrical part 41 of the exterior cover 40, which will be described later, and illuminates the surrounding area.

＜照明制御部６９＞
照明制御部６９は、発光モジュール６２の発する光を調色及び調光制御するためのコントローラである。照明制御部６９は、発光モジュール６２を制御する１以上の制御回路部品である。１以上の制御回路部品は、マイコン等で構成される。 <Lighting control unit 69>
The lighting control unit 69 is a controller for controlling the color and dimming of the light emitted by the light emitting module 62. The lighting control unit 69 is one or more control circuit components that control the light emitting module 62. One or more control circuit components are composed of a microcomputer or the like.

照明制御部６９は、実装基板６１における第２領域Ｅ２の制御領域Ｅ２ｂに実装される。具体的には、照明制御部６９は、実装基板６１における第２領域Ｅ２の制御領域Ｅ２ｂに実装される。つまり、照明制御部６９は、発光モジュール６２と点灯回路６３ａとの間に実装される。 The illumination control unit 69 is mounted in the control area E2b of the second area E2 on the mounting board 61. Specifically, the illumination control unit 69 is mounted in the control area E2b of the second area E2 on the mounting board 61. That is, the lighting control section 69 is mounted between the light emitting module 62 and the lighting circuit 63a.

制御領域Ｅ２ｂは、実装基板６１における、第２筐体３２の傾斜部３２ａ２と対応する位置である。つまり、照明装置１をＸ軸マイナス方向側から平面視した場合に、傾斜部３２ａ２と制御領域Ｅ２ｂとは重なる。 The control region E2b is a position on the mounting board 61 that corresponds to the inclined portion 32a2 of the second casing 32. That is, when the illumination device 1 is viewed from above in the negative X-axis direction, the inclined portion 32a2 and the control region E2b overlap.

＜電源部６３＞
電源部６３は、発光モジュール６２を点灯させるための電力を供給する点灯回路６３ａが内蔵された電源モジュールである。点灯回路６３ａは、電源部６３に接続された配線から供給された交流電流を直流電流に変換し、変換した直流電流を、基板のパターンを介して発光モジュール６２に供給する。 <Power supply unit 63>
The power supply unit 63 is a power supply module that includes a lighting circuit 63a that supplies power for lighting the light emitting module 62. The lighting circuit 63a converts the alternating current supplied from the wiring connected to the power supply unit 63 into direct current, and supplies the converted direct current to the light emitting module 62 via the pattern on the board.

点灯回路６３ａは、１以上のリード付き回路部品で構成される。リード付き回路部品は、例えば、電解コンデンサ、トランス、コイル等である。リード付き回路部品は、チップ回路部品よりも背が高い。 The lighting circuit 63a is composed of one or more leaded circuit components. Examples of leaded circuit components include electrolytic capacitors, transformers, and coils. Leaded circuit components are taller than chip circuit components.

点灯回路６３ａは、第１筐体３１及び第２筐体３２で構成される収容空間において、発光モジュール６２が実装基板６１に実装される面の反対側の面、つまり、Ｘ軸プラス方向側の面に実装される。また、点灯回路６３ａは、実装基板６１における長手方向の一方側、つまり、Ｙ軸プラス方向側に実装される。 The lighting circuit 63a is installed on the surface opposite to the surface on which the light emitting module 62 is mounted on the mounting board 61, that is, on the X-axis positive direction side, in the accommodation space constituted by the first casing 31 and the second casing 32. mounted on the surface. Further, the lighting circuit 63a is mounted on one side of the mounting board 61 in the longitudinal direction, that is, on the Y-axis positive direction side.

＜ホルダ５１＞
ホルダ５１は、ネジ等の固定部材によって実装基板６１に固定され、実装基板６１の位置を規制するリング状の支持部材である。 <Holder 51>
The holder 51 is a ring-shaped support member that is fixed to the mounting board 61 with a fixing member such as a screw, and regulates the position of the mounting board 61.

ホルダ５１には、開口部５２と、複数のネジ孔とが形成される。 The holder 51 is formed with an opening 52 and a plurality of screw holes.

開口部５２は、発光モジュール６２を露出させるように、開口した部分である。開口部５２の開口面は、第１筐体３１における底板部３１ａの開口３１ａ１の開口面と重なるように対応する。 The opening 52 is a portion opened to expose the light emitting module 62. The opening surface of the opening portion 52 corresponds to overlap with the opening surface of the opening 31 a 1 of the bottom plate portion 31 a in the first housing 31 .

複数のネジ孔は、ホルダ５１を実装基板６１にネジ等の固定部材で固定するための孔である。具体的には、ホルダ５１は、第２筐体３２の取付け面部とで実装基板６１を挟んだ状態であり、実装基板６１を取付け面部に押さえつけるように、固定部材によって取付け面部に固定される。こうして、実装基板６１が取付け面部に密着した状態で固定される。これにより、発光モジュール６２で発生した熱が効率よく第２筐体３２に伝導される。ホルダ５１は、例えば、ポリブチレンテレフタレート（ＰＢＴ）、ポリカーボネート等の樹脂材料である。 The plurality of screw holes are holes for fixing the holder 51 to the mounting board 61 with fixing members such as screws. Specifically, the holder 51 is in a state where the mounting board 61 is sandwiched between the holder 51 and the mounting surface of the second housing 32, and is fixed to the mounting surface by a fixing member so as to press the mounting board 61 against the mounting surface. In this way, the mounting board 61 is fixed in close contact with the mounting surface. Thereby, the heat generated in the light emitting module 62 is efficiently conducted to the second casing 32. The holder 51 is made of, for example, a resin material such as polybutylene terephthalate (PBT) or polycarbonate.

＜セード部５４＞
セード部５４は、発光モジュール６２からの出射した光を透光カバー５５に向けて反射することで配光を制御する鏡面を有する。セード部５４は、内面がアルミニウム等の金属で構成された鏡面であるが、例えばポリブチレンテレフタレート等の硬質の白色樹脂材料を用いて形成されてもよい。 <Sade part 54>
The shade portion 54 has a mirror surface that controls light distribution by reflecting the light emitted from the light emitting module 62 toward the transparent cover 55. The shade portion 54 has a mirror surface with an inner surface made of metal such as aluminum, but may also be formed using a hard white resin material such as polybutylene terephthalate.

セード部５４は、Ｘ軸方向で開口した無底の筒状である。セード部５４の形状は、発光モジュール６２からの光が入射される側（Ｘ軸マイナス方向側）の端部から、当該光が出射される側（Ｘ軸プラス方向側）の端部に向かって内径が漸次大きくなるように構成された円錐台状である。 The shade portion 54 has a bottomless cylindrical shape that is open in the X-axis direction. The shape of the shade part 54 is from the end on the side where the light from the light emitting module 62 enters (X-axis negative direction side) to the end on the side where the light is emitted (X-axis positive direction side). It has a truncated conical shape with an inner diameter that gradually increases.

セード部５４は、ネジ等の固定部材により第１筐体３１の底板部３１ａに固定される。セード部５４のＸ軸マイナス方向側の端部は、第１筐体３１における底板部３１ａの開口３１ａ１及びホルダ５１の開口部５２に挿入され、発光モジュール６２の周囲を囲むように配置される。また、セード部５４の中心線は、中心線Ｏと略一致する。 The shade portion 54 is fixed to the bottom plate portion 31a of the first housing 31 with a fixing member such as a screw. The end of the shade part 54 on the negative side of the X-axis is inserted into the opening 31a1 of the bottom plate part 31a of the first housing 31 and the opening 52 of the holder 51, and is arranged so as to surround the light emitting module 62. Further, the center line of the shade portion 54 substantially coincides with the center line O.

＜透光カバー５５＞
透光カバー５５は、セード部５４で反射された光、及び、発光モジュール６２からの光が入射される透光性のドーム状をなした光学カバーである。透光カバー５５は、外装カバー４０に収容される。透光カバー５５は、照明装置１をＸ軸プラス方向から見て、セード部５４及び発光モジュール６２を覆う状態で外装カバー４０に固定される。また、外装カバー４０の中心線は、中心線Ｏと略一致する。 <Transparent cover 55>
The light-transmitting cover 55 is a light-transmitting dome-shaped optical cover into which the light reflected by the shade portion 54 and the light from the light emitting module 62 are incident. The transparent cover 55 is housed in the exterior cover 40. The light-transmitting cover 55 is fixed to the exterior cover 40 in a state that covers the shade part 54 and the light emitting module 62 when the lighting device 1 is viewed from the X-axis plus direction. Further, the center line of the exterior cover 40 substantially coincides with the center line O.

なお、透光カバー５５は、セード部５４で反射された光の配光を制御して出射する機能を有してもよい。例えば透光カバー５５は、フレネルレンズ等であってもよい。透光カバー５５は、透光性材料を用いて形成され、例えばアクリル、ポリカーボネート（ＰＣ）等の透明樹脂材料、又は、ガラス材料等の透明材料を用いて形成する。 Note that the light-transmitting cover 55 may have a function of controlling the distribution of light reflected by the shade portion 54 and emitting the light. For example, the transparent cover 55 may be a Fresnel lens or the like. The light-transmitting cover 55 is formed using a light-transmitting material, for example, a transparent resin material such as acrylic or polycarbonate (PC), or a transparent material such as a glass material.

このような照明装置１では、照明装置１の重心Ｈが中心線ＯからＹ軸プラス方向にズレているが、一対の板バネ７０のうちの少なくとも一方の板バネ７０が、照明装置１による偏荷重を支持する。これにより、照明装置１は、造営材の取付孔に安定的に保持される。 In such a lighting device 1, the center of gravity H of the lighting device 1 is shifted from the center line O in the positive Y-axis direction, but at least one of the pair of leaf springs 70 is deflected by the lighting device 1. Support the load. Thereby, the lighting device 1 is stably held in the mounting hole of the construction material.

［作用効果］
次に、本実施の形態における照明装置１の作用効果について説明する。 [Effect]
Next, the effects of the lighting device 1 in this embodiment will be explained.

上述したように、本実施の形態に係る照明装置１は、光を出射する照明装置１であって、１以上のリード付き回路部品と、１以上のチップ回路部品と、第１領域Ｅ１に１以上のリード付き回路部品が実装され、かつ、第１領域Ｅ１と異なる第２領域Ｅ２に１以上のチップ回路部品が実装される実装基板６１と、１以上のリード付き回路部品及び１以上のチップ回路部品を覆う第１筐体３１及び第２筐体３２とを備える。また、第１領域Ｅ１に実装される１以上のリード付き回路部品の単位面積当たりの密度は、第２領域Ｅ２に実装される１以上のリード付き回路部品の単位面積当たりの密度よりも大きい。また、第２領域Ｅ２に実装される１以上のチップ回路部品の単位面積当たりの密度は、第１領域Ｅ１に実装される１以上のチップ回路部品の単位面積当たりの密度よりも大きい。そして、第１筐体３１及び第２筐体３２は、当該照明装置１が出射する光の出射方向と反対方向に向かって１以上のリード付き回路部品を収容する空間を狭める傾斜部３２ａ２を有する。 As described above, the lighting device 1 according to the present embodiment is a lighting device 1 that emits light, and includes one or more leaded circuit components, one or more chip circuit components, and one or more leaded circuit components in the first area E1. A mounting board 61 on which the above leaded circuit components are mounted and one or more chip circuit components mounted in a second region E2 different from the first region E1, one or more leaded circuit components and one or more chips. It includes a first casing 31 and a second casing 32 that cover circuit components. Further, the density per unit area of one or more leaded circuit components mounted in the first region E1 is higher than the density per unit area of the one or more leaded circuit components mounted in the second region E2. Further, the density per unit area of one or more chip circuit components mounted in the second region E2 is higher than the density per unit area of the one or more chip circuit components mounted in the first region E1. The first casing 31 and the second casing 32 have an inclined portion 32a2 that narrows the space for accommodating one or more leaded circuit components in a direction opposite to the direction in which light is emitted from the lighting device 1. .

これによれば、実装基板６１では、１以上のリード付き回路部品が集められた第１領域Ｅ１と、１以上のチップ回路部品が集められた第２領域Ｅ２とに分けられている。このため、発熱源となるチップ回路部品からリード付き回路部品を遠ざけることができる。 According to this, the mounting board 61 is divided into a first area E1 where one or more leaded circuit components are collected and a second area E2 where one or more chip circuit components are collected. Therefore, the leaded circuit component can be kept away from the chip circuit component that becomes a heat source.

また、傾斜部３２ａ２によって、リード付き回路部品を収容する収容空間の大型化を抑制することができる。 In addition, the inclined portion 32a2 can suppress an increase in the size of the accommodation space that accommodates the leaded circuit component.

したがって、この照明装置１では、発光モジュール６２の発する熱がリード付き回路部品に与える影響を抑制するとともに、照明装置１の大型化を抑制することができる。 Therefore, in this lighting device 1, it is possible to suppress the influence of the heat generated by the light emitting module 62 on the leaded circuit components, and to suppress the increase in size of the lighting device 1.

特に、傾斜部３２ａ２が１以上のリード付き回路部品を収容する空間を狭めているため、照明装置１を小型化することで、器具本体３に用いられる材料を減らすことができるため、照明装置１の製造コストの低廉化を実現することができる。 In particular, since the inclined portion 32a2 narrows the space for accommodating one or more leaded circuit components, by downsizing the lighting device 1, the amount of material used for the fixture body 3 can be reduced. It is possible to realize lower manufacturing costs.

また、造営材の取付孔に照明装置１を取付ける際に、直角状の段部が形成される照明装置１に比べて、傾斜部３２ａ２が造営材の取付孔に引っ掛かり難くなるため、照明装置１を造営材の取付孔に取付け易くなる。 Furthermore, when the lighting device 1 is installed in the mounting hole of the construction material, the inclined portion 32a2 is less likely to get caught in the installation hole of the construction material, compared to the lighting device 1 in which a right-angled stepped portion is formed. This makes it easier to install into the mounting holes of construction materials.

また、本実施の形態に係る照明装置１において、１以上のチップ回路部品は、少なくとも発光モジュール６２を含む。また、実装基板６１は、発光モジュール６２が出射する光の光軸方向と交差する方向に延びる。また、１以上のリード付き回路部品は、実装基板６１における長手方向の一方側に実装される。そして、１以上のチップ回路部品は、実装基板６１における長手方向の他方側に実装される。 Furthermore, in the lighting device 1 according to the present embodiment, one or more chip circuit components include at least the light emitting module 62. Further, the mounting board 61 extends in a direction intersecting the optical axis direction of light emitted by the light emitting module 62. Further, one or more leaded circuit components are mounted on one side of the mounting board 61 in the longitudinal direction. Then, one or more chip circuit components are mounted on the other side of the mounting board 61 in the longitudinal direction.

これによれば、１以上のリード付き回路部品と１以上のチップ回路部品とを確実に離間することができるため、発光モジュール６２の発する熱がリード付き回路部品に与える影響を抑制することができる。 According to this, it is possible to reliably separate one or more leaded circuit components and one or more chip circuit components, so it is possible to suppress the influence of heat generated by the light emitting module 62 on the leaded circuit components. .

また、本実施の形態に係る照明装置１において、１以上のチップ回路部品は、発光モジュール６２を制御する１以上の制御回路部品を含む。また、第２領域Ｅ２は、発光モジュール６２を実装する発光領域Ｅ２ａと、制御回路部品を実装する制御領域Ｅ２ｂとに分かれる。そして、制御領域Ｅ２ｂは、発光領域Ｅ２ａと第１領域Ｅ１との間に配置される。 Furthermore, in the lighting device 1 according to the present embodiment, the one or more chip circuit components include one or more control circuit components that control the light emitting module 62. Further, the second area E2 is divided into a light emitting area E2a where the light emitting module 62 is mounted and a control area E2b where the control circuit components are mounted. The control region E2b is arranged between the light emitting region E2a and the first region E1.

これによれば、発光モジュール６２からリード付き回路部品を、より離間させることができる。このため、発光モジュール６２の発する熱がリード付き回路部品に与える影響を、より抑制することができる。 According to this, the leaded circuit component can be further spaced from the light emitting module 62. Therefore, the influence of the heat generated by the light emitting module 62 on the leaded circuit components can be further suppressed.

また、本実施の形態に係る照明装置１において、１以上のリード付き回路部品が実装基板６１に実装される面は、１以上のチップ回路部品が実装基板６１に実装される面の反対側の面である。 In the lighting device 1 according to the present embodiment, the surface on which one or more leaded circuit components are mounted on the mounting board 61 is opposite to the surface on which one or more chip circuit components are mounted on the mounting board 61. It is a surface.

これによれば、リード付き回路部品が実装される第１領域Ｅ１とチップ回路部品が実装される第２領域Ｅ２とを確実に分離することができる。 According to this, the first region E1 where the leaded circuit component is mounted and the second region E2 where the chip circuit component is mounted can be reliably separated.

また、本実施の形態に係る照明装置１において、照明装置１が出射する光の光軸方向に沿って照明装置１を平面視した場合に、制御領域Ｅ２ｂは、傾斜部３２ａ２と重なる。 Further, in the lighting device 1 according to the present embodiment, when the lighting device 1 is viewed from above along the optical axis direction of the light emitted by the lighting device 1, the control region E2b overlaps the slope portion 32a2.

これによれば、実装基板６１の制御領域Ｅ２ｂに実装される制御回路部品に生じる輻射熱が傾斜部３２ａ２に伝導することで、第１筐体３１及び第２筐体３２内の温度上昇を抑制することができる。 According to this, the radiant heat generated in the control circuit components mounted in the control area E2b of the mounting board 61 is conducted to the inclined portion 32a2, thereby suppressing the temperature rise in the first casing 31 and the second casing 32. be able to.

（その他変形例）
以上、本開示に係る照明装置について、実施の形態に基づいて説明したが、本開示は、上記の各実施の形態に限定されるものではない。 (Other variations)
Although the lighting device according to the present disclosure has been described above based on the embodiments, the present disclosure is not limited to each of the embodiments described above.

例えば、上記の各実施の形態において、一対の板バネは、中心線を含むＺ軸方向の線よりもＹ軸プラス方向側の領域においてＺ軸方向と平行になるように配置されていてもよい。 For example, in each of the embodiments described above, the pair of leaf springs may be arranged parallel to the Z-axis direction in a region on the Y-axis plus direction side from a line in the Z-axis direction including the center line. .

また、上記の各実施の形態において、照明制御部が第１筐体及び第２筐体に収容されているがこれには限定されない。照明制御部は、収容体に収容されていてもよい。 Further, in each of the above embodiments, the lighting control section is housed in the first housing and the second housing, but the invention is not limited thereto. The lighting control unit may be housed in the housing.

また、上記の各実施の形態において、器具本体の構成には、ヒートシンクが含まれていてもよい。この場合、ヒートシンクの一部が光軸と交差する方向に突出していてもよい。このため、筐体が光軸と交差する方向に突出していることが必須ではない。 Furthermore, in each of the above embodiments, the configuration of the device main body may include a heat sink. In this case, a portion of the heat sink may protrude in a direction intersecting the optical axis. Therefore, it is not essential that the housing protrudes in the direction intersecting the optical axis.

なお、上記の各実施の形態に対して当業者が思い付く各種変形を施して得られる形態や、本開示の趣旨を逸脱しない範囲で各実施の形態における構成要素及び機能を任意に組み合わせることで実現される形態も本開示に含まれる。 It should be noted that the above-described embodiments may be realized by making various modifications that those skilled in the art would think of, or by arbitrarily combining the components and functions of each embodiment without departing from the spirit of the present disclosure. The present disclosure also includes forms in which:

１ 照明装置
３ 器具本体
３１ 第１筐体（筐体）
３１ｂ 第１取付部（取付部）
３１ｂ２ 表面
３２ 第２筐体（筐体）
４０ 外装カバー
６１ 基板
６２ 発光モジュール
６３ａ 点灯回路
７０ 板バネ（バネ）
７２ アーム部 1 Lighting device 3 Fixture main body 31 First casing (casing)
31b First mounting part (mounting part)
31b2 Surface 32 Second casing (casing)
40 Exterior cover 61 Board 62 Light emitting module 63a Lighting circuit 70 Leaf spring (spring)
72 Arm part

Claims (5)

光を出射する照明装置であって、
１以上のリード付き回路部品と、
１以上のチップ回路部品と、
第１領域に前記１以上のリード付き回路部品が実装され、かつ、前記第１領域と異なる第２領域に前記１以上のチップ回路部品が実装される実装基板と、
前記１以上のリード付き回路部品及び前記１以上のチップ回路部品を覆う筐体とを備え、
前記第１領域に実装される前記１以上のリード付き回路部品の単位面積当たりの密度は、前記第２領域に実装される前記１以上のリード付き回路部品の単位面積当たりの密度よりも大きく、
前記第２領域に実装される前記１以上のチップ回路部品の単位面積当たりの密度は、前記第１領域に実装される前記１以上のチップ回路部品の単位面積当たりの密度よりも大きく、
前記筐体は、前記１以上のリード付き回路部品を覆う天板を有し、
前記天板は、当該照明装置が出射する光の光軸方向に沿って当該照明装置を平面視した場合に前記第２領域と重なる第１天板部と、前記第１天板部に接続され、当該照明装置が出射する光の出射方向と反対方向に向かって前記１以上のリード付き回路部品を収容する空間を狭める傾斜部と、前記傾斜部に接続され、当該照明装置が出射する光の光軸方向に沿って当該照明装置を平面視した場合に前記第１領域と重なる第２天板部とを有し、
前記第１天板部、前記傾斜部、及び、前記第２天板部が段部を構成し、
前記１以上のチップ回路部品は、少なくとも発光モジュールと、前記発光モジュールを制御する１以上の制御回路部品とを含み、
前記第２領域は、前記発光モジュールを実装する発光領域と、前記制御回路部品を実装する制御領域とに分かれ、
前記傾斜部は、当該照明装置が出射する光の光軸方向に沿って当該照明装置を平面視した場合に、前記制御領域及び前記第１領域にのみ重なっている
照明装置。 A lighting device that emits light,
one or more leaded circuit components;
one or more chip circuit components;
a mounting board on which the one or more leaded circuit components are mounted in a first region, and the one or more chip circuit components are mounted in a second region different from the first region;
A casing that covers the one or more leaded circuit components and the one or more chip circuit components,
The density per unit area of the one or more leaded circuit components mounted in the first region is greater than the density per unit area of the one or more leaded circuit components mounted in the second region,
The density per unit area of the one or more chip circuit components mounted in the second region is higher than the density per unit area of the one or more chip circuit components mounted in the first region,
The casing has a top plate that covers the one or more leaded circuit components,
The top plate is connected to a first top plate portion that overlaps the second region when the lighting device is viewed from above along an optical axis direction of light emitted by the lighting device, and a first top plate portion. , an inclined part that narrows the space for accommodating the one or more leaded circuit components in a direction opposite to the emission direction of the light emitted by the lighting device; a second top plate portion that overlaps the first region when the lighting device is viewed in plan along the optical axis direction;
The first top plate portion, the inclined portion, and the second top plate portion constitute a step portion ,
The one or more chip circuit components include at least a light emitting module and one or more control circuit components that control the light emitting module,
The second area is divided into a light emitting area where the light emitting module is mounted and a control area where the control circuit component is mounted,
The inclined portion overlaps only the control region and the first region when the lighting device is viewed from above along the optical axis direction of light emitted by the lighting device.
lighting equipment. 前記実装基板は、前記発光モジュールが出射する光の光軸方向と交差する方向に延び、
前記１以上のリード付き回路部品は、前記実装基板における長手方向の一方側に実装され、
前記１以上のチップ回路部品は、前記実装基板における長手方向の他方側に実装される
請求項１に記載の照明装置。 The mounting board extends in a direction intersecting an optical axis direction of light emitted by the light emitting module,
The one or more leaded circuit components are mounted on one longitudinal side of the mounting board,
The lighting device according to claim 1, wherein the one or more chip circuit components are mounted on the other longitudinal side of the mounting board. 前記制御領域は、前記発光領域と前記第１領域との間に配置される
請求項２に記載の照明装置。 The lighting device according to claim 2 , wherein the control region is arranged between the light emitting region and the first region. 前記１以上のリード付き回路部品が前記実装基板に実装される面は、前記１以上のチップ回路部品が前記実装基板に実装される面の反対側の面である
請求項３に記載の照明装置。 The lighting device according to claim 3, wherein the surface on which the one or more leaded circuit components are mounted on the mounting board is a surface opposite to the surface on which the one or more chip circuit components are mounted on the mounting board. . 造営材の取付孔に取付けられる
請求項１～４のいずれか１項に記載の照明装置。 The lighting device according to any one of claims 1 to 4, which is installed in a mounting hole of construction material .
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