CN111649272A - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
CN111649272A
CN111649272A CN202010084022.6A CN202010084022A CN111649272A CN 111649272 A CN111649272 A CN 111649272A CN 202010084022 A CN202010084022 A CN 202010084022A CN 111649272 A CN111649272 A CN 111649272A
Authority
CN
China
Prior art keywords
region
circuit components
lighting device
leaded
per unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010084022.6A
Other languages
Chinese (zh)
Inventor
伊藤范男
车谷寿光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN111649272A publication Critical patent/CN111649272A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/04—Recessed bases
    • F21V21/047—Mounting arrangements with fastening means engaging the inner surface of a hole in a ceiling or wall, e.g. for solid walls or for blind holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0025—Combination of two or more reflectors for a single light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The lighting device (1) is provided with: 1 or more lead-equipped circuit components, 1 or more chip circuit components, a mounting substrate (61), a1 st frame (31), and a2 nd frame (32). The density per unit area of 1 or more leaded circuit components mounted in the 1 st region (E1) is higher than the density per unit area of 1 or more leaded circuit components mounted in the 2 nd region (E2). The density per unit area of 1 or more chip circuit components mounted in the 2 nd region (E2) is higher than the density per unit area of 1 or more chip circuit components mounted in the 1 st region (E1). The 1 st frame body (31) and the 2 nd frame body (32) have inclined parts (32a2), and the space for accommodating more than 1 circuit component with leads is gradually narrowed by the inclined parts (32a 2).

Description

Lighting device
Technical Field
The present application relates to lighting devices.
Background
As a conventional lighting device, patent document 1 discloses a ceiling-embedded lighting device including: a power supply substrate on which a power supply circuit element is mounted; a substrate on which a light source is mounted; and a rectangular-shaped module case that accommodates the power supply substrate on which the power supply circuit element is mounted and the substrate on which the light source is mounted.
Patent document 1 Japanese laid-open patent application publication No. 2018-198141
In a conventional lighting device, a power supply substrate on which a circuit component with leads, which is a power supply circuit element, is mounted and a substrate on which a light source is mounted are different substrates. However, when these elements are mounted on one substrate, heat generated from the light source affects the circuit components with leads. Further, if these elements are formed of different substrates, the accommodation space increases, and the module case becomes large.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a lighting device that can suppress an increase in size of the lighting device while suppressing an influence of heat generated by a light-emitting module on a circuit member with a lead.
In order to achieve the above object, one aspect of the illumination device according to the present invention is an illumination device that emits light, including: 1 or more leaded circuit components; 1 or more chip circuit components; a mounting substrate having a1 st region and a2 nd region different from the 1 st region, the 1 or more leaded circuit components being mounted in the 1 st region, the 1 or more chip circuit components being mounted in the 2 nd region; and a frame body covering the 1 or more leaded circuit components and the 1 or more chip circuit components, wherein the density per unit area of the 1 or more leaded circuit components mounted on the 1 st region is higher than the density per unit area of the 1 or more leaded circuit components mounted on the 2 nd region, and the density per unit area of the 1 or more chip circuit components mounted on the 2 nd region is higher than the density per unit area of the 1 or more chip circuit components mounted on the 1 st region, and the frame body has an inclined portion, and a space for accommodating the 1 or more leaded circuit components is gradually narrowed toward a direction opposite to an emission direction of light emitted from the lighting device due to the inclined portion.
Effects of the invention
In the lighting device according to the present application, not only the influence of heat generated by the light emitting module on the leaded circuit member can be suppressed, but also the size of the lighting device can be suppressed.
Drawings
Fig. 1 is a perspective view showing an example of a lighting device according to an embodiment.
Fig. 2 is an exploded perspective view of the lighting device according to the embodiment.
Fig. 3 is a sectional view showing a section of the lighting device at the line III-III of fig. 1.
Fig. 4 is a plan view of the illumination device according to the embodiment viewed from the X-axis negative direction side.
Fig. 5 is a schematic diagram showing the 1 st and 2 nd regions in the substrate of the lighting device.
Description of the symbols
1 Lighting device
3 main body of the apparatus
31 st frame body (frame body)
31b installation part 1 (taking and paying part)
31b2 surface
32 nd 2 nd frame body (frame body)
40 outer cover
61 substrate
62 light emitting module
63a lighting circuit
70 plate spring (spring)
72 arm part
Detailed Description
Embodiments of the present application will be described in detail below with reference to the drawings. The embodiments to be described below are specific examples of the present application. Accordingly, the numerical values, shapes, materials, constituent elements, arrangement of constituent elements, connection modes, and the like shown in the following embodiments are merely examples, and the present application is not limited thereto. Therefore, among the components of the following embodiments, components that are not described in an independent claim illustrating the highest concept of the present application will be described as arbitrary components.
Each figure is a schematic diagram, and is not a strict diagram. Thus, for example, the scales and the like in the respective drawings may not necessarily be uniform. In the drawings, substantially the same components are denoted by the same reference numerals, and redundant description is omitted or simplified.
In the following embodiments, expressions such as substantially parallel are used. Substantially parallel includes not only completely parallel but also substantially parallel, i.e. may include errors of, for example, a few percent or so. The substantially parallel also means that the effects of the present invention can be achieved similarly to the completely parallel. The same applies to other expressions using "approximate".
First, the lighting device according to the present embodiment will be described.
(embodiment mode)
[ constitution ]
Fig. 1 is a perspective view showing an example of an illumination device 1 according to embodiment 1. In fig. 1, the direction of light emitted from the illumination device 1 (specifically, a light-emitting module 62 described later) is defined as the positive X-axis direction (for example, the lower side of the illumination device 1), the outer diameter direction in which a part of the device body 3 protrudes in the direction orthogonal to the optical axis is defined as the positive Y-axis direction, and the direction intersecting the positive X-axis direction and the positive Y-axis direction is defined as the positive Z-axis direction. The directions shown in the respective drawings from fig. 2 and onward correspond to the directions shown in fig. 1.
[ Lighting device 1]
As shown in fig. 1, the lighting device 1 is a device mounted on a building structure such as a ceiling. The lighting device 1 is, for example, a spot lamp, a down lamp, or the like. The illumination device 1 illuminates in a predetermined direction by irradiating light in the predetermined direction.
Fig. 2 is an exploded perspective view of the lighting device 1 according to embodiment 1. Fig. 3 is a sectional view showing a section of the lighting device 1 at the line III-III of fig. 1. As shown in fig. 2 and 3, the lighting device 1 includes: the light-emitting device includes a device main body 3, a pair of plate springs 70, a mounting substrate 61, a light-emitting module 62, a lighting control unit 69, a power supply unit 63, a holder 51, an umbrella unit 54, and a light-transmitting cover 55.
< device body 3 >
The appliance main body 3 constitutes a housing of the lighting device 1. A part of the device body 3 protrudes in a direction (Y-axis positive direction) intersecting the optical axis direction of light emitted from the light emitting module 62. That is, when the lighting device 1 is mounted to a mounting hole of a building structure, a part of the fixture body 3 extends along the ceiling. The optical axis here means a main axis of light emitted from the light emitting module 62. The optical axis direction is substantially parallel to the X-axis direction.
As shown in fig. 1, the device main body 3 includes: a1 st frame 31, a2 nd frame 32, and a cover 40.
< 1 st frame 31 and 2 nd frame 32 >
The 1 st frame 31 and the 2 nd frame 32 constitute an accommodating body that accommodates the mounting substrate 61, the light emitting module 62, and the power supply section 63. The 1 st frame 31 and the 2 nd frame 32 are fixed by a fixing member such as a screw to form a housing space, and a1 st space and a2 nd space are formed in the housing space, the 1 st space being a small space in which the light emitting module 62 is arranged, and the 2 nd space being a larger space than the 1 st space in which the power supply portion 63 is arranged. The 1 st housing 31 and the 2 nd housing 32 are examples of housings.
Fig. 4 is a plan view of the illumination device 1 according to the embodiment when viewed from the 1 st housing 31 side. As shown in fig. 2 and 4, when the illumination device 1 is viewed from the positive X-axis direction (along the optical axis), the 1 st frame 31 and the 2 nd frame 32 protrude in the outer diameter direction from the outer peripheral surface of the cylindrical cover 40. In other words, when the lighting device 1 is mounted in the mounting hole of the building structure, the 1 st frame 31 and the 2 nd frame 32 extend from the outer peripheral surface of the cover 40 in the outer diameter direction of the building structure. Here, the outer diameter direction is the positive Y-axis direction. Accordingly, the length of the 1 st frame 31 and the 2 nd frame 32 in the Y axis direction is larger than the radius of the cover 40.
As shown in fig. 1 and 3, the 1 st frame 31 constitutes a bottom of the accommodating body. The 1 st frame 31 is elongated in the Y axis direction, and extends in the Y axis positive direction so as to protrude from the outer peripheral surface of the cover 40. The 1 st frame 31 is made of metal, and is formed by bending a sheet metal mainly composed of aluminum, iron, or the like, for example.
The 1 st frame 31 has a bottom plate 31a and a pair of 1 st mounting portions 31 b.
The bottom plate 31a is a flat plate elongated in the Y-axis direction, and fixes the 2 nd frame 32 and the cover 40 in a predetermined posture. A pair of extending pieces 31a2 extending in the Z-axis direction from a part of both end edges of the bottom plate portion 31a are formed in the Y-axis negative direction of the bottom plate portion 31 a. The end edges of the pair of extension pieces 31a2 extend obliquely with respect to the Y-axis direction.
An opening 31a1 for exposing the light emitting module 62 is formed in the bottom plate 31a, and the opening 31a1 is provided between the pair of extending pieces 31a 2. The opening 31a1 is formed in the Y-axis negative direction of the bottom plate portion 31 a.
As shown in fig. 1 and 2, the pair of 1 st mounting portions 31b are disposed on the Y-axis negative side of the bottom plate portion 31a, on the outer peripheral side of the cover 40, and on both sides of the opening 31a1 of the bottom plate portion 31 a. The pair of 1 st mounting portions 31b are provided integrally with the 1 st frame 31 so as to correspond one-to-one to the pair of extending pieces 31a2 of the bottom plate portion 31 a. Since the pair of first mounting portions 31b are connected to the end edges of the pair of extending pieces 31a2, the outer peripheral surface 31b2 for mounting the plate spring 70 is inclined with respect to the X-Y plane when the lighting device 1 is viewed in plan from the X-axis negative direction side (along the optical axis direction). The surfaces 31b2 of the pair of 1 st mounting portions 31b are surfaces facing the 2 nd mounting portion 71 of the plate spring 70 described later.
As shown in fig. 4, when the lighting device 1 is viewed from the X-axis negative direction side (for example, the upper side of the lighting device 1) in a plan view, at least one 1 st mounting part 31b and the other 1 st mounting part 31b of the pair of 1 st mounting parts 31b are arranged in point symmetry with respect to a center line O which is the center of the appliance main body 3. The pair of 1 st mounting portions 31b are arranged so as to be inclined at a predetermined angle with respect to the Z-axis direction and the Y-axis direction. In the present embodiment, when the lighting device 1 is viewed in a plan view from the X-axis negative direction side, at least one 1 st attachment part 31b of the pair of 1 st attachment parts 31b is disposed in the region a1 or the region a2, the region a1 is a region of a diagonal line portion between a line in the Y-axis positive direction and a line in the Z-axis negative direction (an example of the 2 nd direction) in a region on the Y-axis positive direction side of a line parallel to the Z-axis direction including the center line O substantially coincident with the optical axis (the optical axis direction) of the lighting device 1, and the region a2 is a region of a diagonal line portion between a line in the Y-axis positive direction and a line in the Z-axis negative direction (an example of the 2 nd direction). That is, since a part of the fixture body 3 extends in the Y-axis positive direction, the center of gravity H of the lighting device 1 is shifted from the center line O in the Y-axis positive direction. Since the center of gravity H is deviated, an eccentric load is generated in the mounting hole of the building structure when the lighting device 1 is mounted in the mounting hole of the building structure. In the lighting device 1, at least one 1 st attachment portion 31b of the pair of 1 st attachment portions 31b is disposed so as to support the center of gravity H of the offset.
Similarly, the other 1 st mounting part 31b of the pair of 1 st mounting parts 31b may be disposed in an area a2 between a line of the positive Y-axis direction and a line of the negative Z-axis direction, or an area a1 between a line of the positive Y-axis direction and a line of the positive Z-axis direction.
Further, at least one 1 st attachment part 31b of the pair of 1 st attachment parts 31b may be disposed in a region between a line in the positive Y-axis direction and a line in the positive Z-axis direction, or a region between a line in the positive Y-axis direction and a line in the negative Z-axis direction, and therefore the other 1 st attachment part 31b of the pair of 1 st attachment parts 31b may be disposed in a region other than the region on the positive Y-axis direction side than the line V2 in the Z-axis direction including the center line O.
As shown in fig. 2 and 3, the 2 nd frame 32 constitutes a table portion of the accommodating body. That is, the 2 nd frame body 32 is disposed on the X-axis negative direction side of the 1 st frame body 31. The 2 nd frame body 32 functions as a cover for covering the mounting substrate 61 and the power supply unit 63. The 2 nd frame body 32 is made of metal, and is formed by bending a sheet metal mainly composed of aluminum, iron, or the like, for example.
The 2 nd frame body 32 has a step portion rising in the X-axis negative direction so as to avoid the power supply portion 63, and therefore the power supply portion 63 is constituted by a circuit component with leads that is taller than the chip circuit component. Since the 2 nd frame body 32 has a stepped portion, a portion thereof facing the power supply portion 63 is formed to protrude in the X-axis negative direction.
Specifically, the 2 nd frame 32 includes a floor 32a and a standing wall 32 b.
The mesa 32a has: the 1 st mesa portion 32a1, the inclined portion 32a2, and the 2 nd mesa portion 32a 3.
The 1 st step surface portion 32a1 is a mounting surface portion for fixing the mounting substrate 61. When the lighting device 1 is viewed from the X-axis negative direction side in a plan view, the 1 st mesa portion 32a1 overlaps with the 2 nd region E2, and the 2 nd region E2 is a region where the chip circuit components constituting the light emitting module 62 and the lighting control portion 69 are mounted on the mounting substrate 61.
The inclined portion 32a2 is connected to the end edge of the 1 st mesa portion 32a1 on the positive Y-axis direction side. The inclined portion 32a2 is inclined in a direction opposite to the emission direction (positive X-axis direction) of the light emitted from the lighting device 1 so as to gradually narrow the space in which 1 or more leaded circuit components are housed. That is, the inclined portion 32a2 is inclined so as to rise in the negative X-axis direction. When the lighting device 1 is viewed from the X-axis negative direction side in plan view, the inclined portion 32a2 overlaps with the control region E2b of the control circuit component in which the chip circuit component is mounted on the mounting substrate 61.
The 2 nd mesa portion 32a3 is connected to the edge of the inclined portion 32a2 on the Y-axis positive direction side. When the lighting device 1 is viewed from the X-axis negative direction side in plan view, the 2 nd mesa portion 32a3 overlaps with the 1 st region E1 where the power supply portion 63 is mounted on the mounting substrate 61.
Thus, the 1 st mesa portion 32a1, the inclined portion 32a2, and the 2 nd mesa portion 32a3 constitute a stepped portion.
The standing wall portion 32b is a wall portion standing from the 2 nd floor portion 32a3 in the X-axis positive direction. A power supply connector 39 for supplying an ac current to the power supply unit 63 is fixed to the upright wall portion 32 b. The power connector 39 and the power supply unit 63 are electrically connected by wiring, and an ac current supplied from a commercial power supply is supplied to the power supply unit 63. The power supply connector 39 may be included in the structure of the appliance main body 3.
< housing 40 >
The cover 40 is a hollow truncated cone-shaped housing having openings on both sides in the X-axis direction. The end portion of the cover 40 on the X-axis negative direction side is fixed to the 1 st frame 31 by a fixing member such as a screw so as to surround the opening 31a1 of the bottom plate portion 31a of the 1 st frame 31. The light emitted from the light emitting module 62 is transmitted through the inside of the housing 40.
The cover 40 includes a tube 41 and a frame 42.
The cylindrical portion 41 is a truncated cone-shaped peripheral portion. The diameter of the cylindrical portion 41 gradually increases from the negative X-axis direction to the positive X-axis direction. The center line of the cylindrical portion 41 substantially coincides with the center line O. The diameter of the cylindrical portion 41 is smaller than the diameter of the mounting hole of the building structure.
The light emitted from the light emitting module 62 passes through the inside of the cylindrical portion 41. The inner peripheral surface of the tube portion 41 functions as a light reflector for controlling the light distribution so that the light emitted from the light-transmitting cover 55 is distributed in a predetermined direction.
The frame portion 42 is an annular flange that holds a building structure such as a ceiling to which the lighting device 1 is attached. The frame portion 42 extends in the outer radial direction from the lower end edge (end edge in the positive X-axis direction) of the tube portion 41. The outer diameter of the frame portion 42 is larger than the inner diameter of the mounting hole of the building structure to which the lighting device 1 is mounted. The bezel portion 42 sandwiches the building structure with the pair of plate springs 70, and the lighting device 1 is stably fixed to the building structure.
< leaf spring 70 >
The pair of leaf springs 70 are elastic members for fixing the lighting device 1 to a mounting hole formed in a building structure, and are disposed on the outer peripheral side of the housing 40. The pair of plate springs 70 are attached to the pair of 1 st attaching portions 31b of the 1 st frame 31 in a one-to-one manner. A pair of leaf springs 70 sandwich the building structure with the frame portion 42 of the housing 40. The leaf spring 70 is an example of a spring.
In addition, 3 or more leaf springs 70 may be provided in the lighting device 1.
The pair of plate springs 70 is formed of a metal material such as steel, for example. The thickness and width of the pair of leaf springs 70 may be appropriately determined according to the young's modulus of the material forming the pair of leaf springs 70, the weight of the lighting device 1, and the like, so that the lighting device 1 can be stably fixed to the building structure. Instead of the pair of plate springs 70, a coil spring or another well-known spring may be used.
As shown in fig. 4, the pair of plate springs 70 are attached in accordance with the position of the 1 st attachment portion 31b of the 1 st frame 31. In the present embodiment, when the illumination device 1 is viewed from the X-axis negative direction side in a plan view, the arm portions 72 (to be described later) of the pair of leaf springs 70 are arranged so as to extend away from the center line O.
At least one leaf spring 70 of the pair of leaf springs 70 is disposed on a side (Y-axis positive side) of the lighting device 1 from which a part of the device body 3 protrudes when viewed in a plane from the X-axis negative direction side, as compared with a plane (X-Z plane) that is a plane including the center line O and that is orthogonal to the direction in which a part of the device body 3 protrudes. That is, at least one leaf spring 70 of the pair of leaf springs 70 is disposed on the positive Y-axis direction side of the straight line V2 in fig. 4. In the present embodiment, when the lighting device 1 is viewed from the X-axis negative direction side in a plan view, a straight line passing through a point indicating the center line O and the center of gravity H forms an angle of 90 degrees or less with a line extending from the center line O of at least one of the leaf springs 70.
In addition, the above-mentioned "orthogonal" means not only perfect orthogonal but also substantially orthogonal, that is, may include an error of approximately several percent.
The pair of plate springs 70 has a2 nd mounting portion 71 and an arm portion 72, respectively.
The 2 nd mounting portion 71 is a base end portion disposed along the outer peripheral surface of the cover 40, and is plate-shaped extending in the X-axis direction. The 2 nd mounting portion 71 is mounted on the 1 st mounting portion 31b of the 1 st frame 31.
In the case where the lighting device 1 is viewed in plan from the X-axis negative direction side, since the surface 31b2 of the 1 st mounting part 31b is inclined with respect to the X-Y plane, the 2 nd mounting part 71 is mounted in an inclined manner with respect to the X-Y plane.
The arm portion 72 is a plate-shaped free end connected to an end edge of the 2 nd mounting portion 71 on the positive X-axis direction side and extending in a direction away from the outer peripheral surface of the cover 40. When the lighting device 1 is mounted to the mounting hole of the building structure, the arm portion 72 applies stress to the mounting hole of the building structure in the X-axis positive direction side due to the restoring force of the arm portion 72.
When the lighting device 1 is viewed from the X-axis negative direction side in a plan view, the arm portion 72 of at least one leaf spring 70 of the pair of leaf springs 70 is disposed in a region between a line of the Y-axis positive direction and a line of the Z-axis positive direction. That is, the arm portion 72 of at least one of the leaf springs 70 is arranged to support the above-described deviated center of gravity H. Therefore, at least one of the plate springs 70 supports the eccentric load generated by the device main body 3.
When the lighting device 1 is viewed in plan from the X-axis negative direction side, the direction in which the arm portion 72 of one leaf spring 70 extends from the outer peripheral surface of the cover 40 and the direction in which the arm portion 72 of the other leaf spring 70 extends from the cover 40 are on the same straight line V1.
< mounting substrate 61 >
As shown in fig. 2 and 3, the mounting substrate 61 is a substrate on which electronic components constituting a power circuit such as the light-emitting module 62 and the power supply unit 63 are mounted. The mounting substrate 61 is a plate material elongated in the Y-axis direction and having a rectangular plane when viewed in a plan view. The mounting substrate 61 extends in a direction intersecting with the optical axis direction of light emitted from the light emitting module 62.
The mounting substrate 61 is, for example, a ceramic substrate, a resin substrate, an insulated metal-based substrate, or the like. The mounting substrate 61 is provided with a pair of electrode terminals (a positive electrode terminal and a negative electrode terminal) for receiving dc power (not shown) for causing the light-emitting module 62 to emit light from the power supply unit 63. The electrode terminals are electrically connected to the power supply unit 63 via the pattern of the substrate.
The mounting substrate 61 is fixed to the top 32a of the 2 nd frame 32 by a fixing member such as a screw. Specifically, when the lighting device 1 is viewed in a plane from the X-axis negative direction side, the mounting board 61 is fixed to the mounting surface portion 32a1 where the top surface 32a of the 2 nd frame body 32 and the cover 40 overlap. Since the mounting surface portion is substantially parallel to the Y-Z axis direction, the mounting substrate 61 is also held substantially parallel to the Y-Z axis direction. Thus, the mounting substrate 61 is disposed in the accommodating space formed by the 1 st frame 31 and the 2 nd frame 32 so as to extend from the mounting surface portion in the Y-axis positive direction.
Fig. 5 is a schematic diagram showing the 1 st region E1 and the 2 nd region E2 on the substrate of the lighting device 1.
As shown in fig. 3 and 5, on the mounting substrate 61, 1 or more circuit components with leads are mounted in the 1 st region E1, and 1 or more chip circuit components are mounted in the 2 nd region E2 different from the 1 st region E1. The 1 or more leaded circuit components include the light emitting module 62 and 1 or more control circuit components. The 1 st region E1 is formed on the surface of the mounting substrate 61 on the Y-axis positive direction side and the X-axis negative direction side. The 2 nd region E2 is formed on the surface of the mounting substrate 61 on the Y-axis negative direction side and on the X-axis positive direction side of the mounting substrate 61.
The 2 nd region E2 is divided into a light-emitting region E2a in which the light-emitting module 62 is mounted, and a control region E2b in which control circuit components are mounted. The control region E2b is disposed between the light-emitting region E2a and the 1 st region E1. Also, the 1 st region E1, the light-emitting region E2a, and the control region E2b do not overlap with each other.
The density per unit area of 1 or more lead-equipped circuit components mounted in the 1 st region E1 is greater than the density per unit area of 1 or more lead-equipped circuit components disposed in the 2 nd region E2. That is, in the 1 st region E1, 1 or more circuit components with leads are densely packed. In the 2 nd region E2, only the leaded circuit component may be mounted on the mounting substrate 61, or a part of the chip circuit component may be mounted on the mounting substrate 61. Here, the density of the leaded circuit component per unit area is calculated from the number, area, and the like of the leaded circuit components per unit area.
The density per unit area of 1 or more chip circuit components mounted in the 2 nd region E2 is higher than the density per unit area of 1 or more chip circuit components mounted in the 1 st region E1. That is, in the 2 nd area E2, 1 or more chip circuit components are dense. In the 2 nd region E2, only the chip circuit component may be mounted on the mounting substrate 61, or a part of the leaded circuit component may be mounted on the mounting substrate 61.
< light emitting module 62 >
As shown in fig. 2 and 3, the light emitting module 62 is an led (light emitting diode) module that radially emits predetermined light. In the present embodiment, the light emitting module 62 is configured to emit white light, for example. For example, the light emitting module 62 is constituted by a cob (chip On board) type LED, and includes: a plurality of blue LEDs of bare chips (LED chips) mounted on the mounting substrate 61; and a sealing member which seals the blue LEDs and includes a yellow phosphor.
As shown in fig. 3 and 5, the light emitting module 62 is mounted on the other side in the longitudinal direction of the mounting substrate 61, that is, on the Y-axis negative direction side. The light-emitting module 62 is mounted on the surface of the mounting substrate 61 facing the 1 st stage surface portion 32a1, that is, the surface on the X-axis positive direction side.
Therefore, the light emitting module 62 emits light in the positive X-axis direction. The light emitted from the light emitting module 62 illuminates the surroundings via the opening 52 of the holder 51, the umbrella 54, the translucent cover 55, and the cylindrical portion 41 of the cover 40, which will be described later.
< illumination control part 69 >
The illumination control unit 69 is a controller that performs color adjustment and dimming control on the light emitted from the light emitting module 62. The illumination control unit 69 is 1 or more control circuit components that control the light emitting module 62. More than 1 control circuit component is composed of a microcomputer or the like.
The lighting control section 69 is mounted in the control area E2b of the 2 nd area E2 of the mounting substrate 61. Specifically, the lighting control unit 69 is mounted in the control area E2b of the 2 nd area E2 of the mounting substrate 61. That is, the illumination control unit 69 is installed between the light emitting module 62 and the lighting circuit 63 a.
The control region E2b is located at a position of the mounting substrate 61 corresponding to the inclined portion 32a2 of the 2 nd frame body 32. That is, when the lighting device 1 is viewed from the X-axis negative direction side in a plan view, the inclined portion 32a2 overlaps the control region E2 b.
< power supply part 63 >
The power supply section 63 is a power supply module incorporating a lighting circuit 63a, and the lighting circuit 63a supplies power for lighting the light emitting module 62. The lighting circuit 63a converts an alternating current supplied from a wire connected to the power supply unit 63 into a direct current, and supplies the converted direct current to the light emitting module 62 via the pattern of the substrate.
The lighting circuit 63a is constituted by 1 or more circuit components with leads. Examples of the leaded circuit component include an electrolytic capacitor, a transformer, and a coil. The leaded circuit component is taller than the chip circuit component.
The lighting circuit 63a is mounted on the surface of the mounting substrate 61 opposite to the surface on which the light emitting module 62 is mounted, that is, the surface on the positive X-axis direction side, in the housing space formed by the 1 st housing 31 and the 2 nd housing 32. The lighting circuit 63a is mounted on one end side in the longitudinal direction of the mounting substrate 61, that is, on the positive Y-axis direction side.
< holder 51 >
The holder 51 is fixed to the mounting substrate 61 by a fixing member such as a screw, and is an annular holding member that regulates the position of the mounting substrate 61.
The holder 51 is formed with an opening 52 and a plurality of screw holes.
The opening 52 is a portion of the opening that exposes the light emitting module 62. The opening surface of the opening 52 is disposed to face the opening surface of the opening 31a1 of the bottom plate 31a of the 1 st frame 31 so as to overlap with the opening surface.
The plurality of screw holes are holes for fixing the holder 51 to the mounting substrate 61 with fixing members such as screws. Specifically, the holder 51 and the mounting surface portion of the 2 nd housing 32 are fixed to the mounting surface portion by a fixing member in a state of sandwiching the mounting substrate 61, that is, in a state of pressing the mounting substrate 61 against the mounting surface portion. Thus, the mounting substrate 61 is fixed in close contact with the mounting surface portion. Accordingly, the heat generated in the light emitting module 62 can be efficiently conducted to the 2 nd housing 32. The retainer 51 is made of a resin material such as polybutylene terephthalate (PBT) or polycarbonate.
< umbrella part 54 >
The umbrella portion 54 has a mirror surface for controlling light distribution, and reflects light emitted from the light emitting module 62 toward the translucent cover 55. The umbrella portion 54 is a mirror surface having an inner surface made of metal such as aluminum, but may be formed of a hard white resin material such as polybutylene terephthalate.
The umbrella portion 54 is a bottomless cylinder that is open in the X-axis direction. The umbrella portion 54 has a truncated cone shape, and has a configuration in which the inner diameter gradually increases from the end on the light incident side (X-axis negative direction side) of the light emission module 62 to the end on the light emission side (X-axis positive direction side).
The umbrella portion 54 is fixed to the bottom plate portion 31a of the 1 st frame 31 by a fixing member such as a screw. The end portion of the umbrella portion 54 on the X-axis negative direction side is inserted into the opening 31a1 of the bottom plate portion 31a of the 1 st frame 31 and the opening 52 of the holder 51, and is disposed so as to surround the light emitting module 62. The center line of the umbrella portion 54 substantially coincides with the center line O.
< light-transmitting cover 55 >
The light-transmitting cover 55 is an optical cover having a light-transmitting dome shape, and light reflected by the umbrella portion 54 and light from the light-emitting module 62 enter the light-transmitting cover 55. The light-transmissive cover 55 is accommodated in the housing 40. When the lighting device 1 is viewed from the X-axis direction, the light-transmitting cover 55 is fixed to the housing 40 so as to cover the umbrella portion 54 and the light-emitting module 62. The center line of the outer cover 40 substantially coincides with the center line O.
The light-transmitting cover 55 may have a function of controlling the distribution of light reflected by the umbrella part 54 and emitting the light. For example, the light transmissive cover 55 may be a fresnel lens or the like. The light-transmitting cover 55 is formed of a light-transmitting material, for example, a transparent resin material such as acrylic or Polycarbonate (PC), or a transparent material such as a glass material.
In the lighting device 1, even if the center of gravity H of the lighting device 1 is shifted in the positive Y-axis direction from the center line O, at least one leaf spring 70 of the pair of leaf springs 70 can support the eccentric load generated by the lighting device 1. Accordingly, the lighting device 1 is stably held in the mounting hole of the building structure.
[ Effect effect ]
The operation and effects of the lighting device 1 in the present embodiment will be described below.
As described above, the illumination device 1 according to the present embodiment emits light, and the illumination device 1 includes: 1 or more leaded circuit components; 1 or more chip circuit components; a mounting substrate 61 in which 1 or more leaded circuit components are mounted in a1 st region E1 and 1 or more chip circuit components are mounted in a2 nd region E2 different from the 1 st region E1; the 1 st frame 31 and the 2 nd frame 32 cover 1 or more lead-equipped circuit components and 1 or more chip circuit components. The density per unit area of 1 or more lead-equipped circuit components mounted in the 1 st region E1 is higher than the density per unit area of 1 or more lead-equipped circuit components mounted in the 2 nd region E2. The density per unit area of 1 or more chip circuit components mounted in the 2 nd region E2 is higher than the density per unit area of 1 or more chip circuit components mounted in the 1 st region E1. The 1 st frame body 31 and the 2 nd frame body 32 have the inclined portion 32a2, and the space for accommodating 1 or more of the leaded circuit components is gradually narrowed toward the direction opposite to the emission direction of the light emitted from the lighting device 1 due to the inclined portion 32a 2.
Accordingly, the mounting substrate 61 is divided into a1 st region E1 in which 1 or more lead-equipped circuit components are collected, and a2 nd region E2 in which 1 or more chip circuit components are collected. Accordingly, the circuit component with leads can be separated from the chip circuit component serving as the heat generation source.
Further, the inclined portion 32a2 can suppress an increase in size of the housing space for housing the leaded circuit component.
Therefore, in the lighting device 1, not only the influence of the heat emitted from the light emitting module 62 on the circuit member with the lead wire can be suppressed, but also the size of the lighting device 1 can be suppressed from increasing.
In particular, since the space for accommodating 1 or more of the leaded circuit components can be narrowed by the inclined portion 32a2, the lighting device 1 can be downsized, the material used for the fixture body 3 can be reduced, and the manufacturing cost of the lighting device 1 can be reduced.
Further, when the lighting device 1 is mounted to the mounting hole of the building structure, the inclined portion 32a2 is less likely to be restricted by the mounting hole of the building structure than the lighting device 1 in which the right-angled stepped portion is formed, and thus the lighting device 1 can be easily mounted to the mounting hole of the building structure.
In the lighting device 1 according to the present embodiment, at least the light emitting module 62 is provided with 1 or more chip circuit components. The mounting substrate 61 extends in a direction intersecting the optical axis direction of the light emitted from the light emitting module 62. Further, 1 or more circuit components with leads are mounted on one side of the mounting substrate 61 in the longitudinal direction. Further, 1 or more chip circuit components are mounted on the other side in the longitudinal direction of the mounting substrate 61.
Accordingly, since the 1 or more leaded circuit components can be reliably separated from the 1 or more chip circuit components, the influence of heat generated by the light emitting module 62 on the leaded circuit components can be suppressed.
In the lighting device 1 according to the present embodiment, the 1 or more chip circuit components include 1 or more control circuit components that control the light emitting module 62. The 2 nd region E2 is divided into a light-emitting region E2a in which the light-emitting module 62 is mounted, and a control region E2b in which control circuit components are mounted. The control region E2b is disposed between the light-emitting region E2a and the 1 st region E1.
Accordingly, the leaded circuit component can be separated from the light emitting module 62. Therefore, the influence of the heat generated by the light emitting module 62 on the leaded circuit component can be suppressed.
In the lighting device 1 according to the present embodiment, the surface of the mounting substrate 61 on which the 1 or more leaded circuit components are mounted is the surface on the opposite side of the surface on which the 1 or more chip circuit components are mounted.
This makes it possible to reliably separate the 1 st region E1 where the leaded circuit component is mounted from the 2 nd region E2 where the chip circuit component is mounted.
In the lighting device 1 according to the present embodiment, when the lighting device 1 is viewed in a planar manner along the optical axis direction of light emitted from the lighting device 1, the control region E2b overlaps the inclined portion 32a 2.
Accordingly, since the radiant heat generated by the control circuit components mounted in the control area E2b of the mounting substrate 61 is conducted to the inclined portion 32a2, the temperature rise in the 1 st frame 31 and the 2 nd frame 32 can be suppressed. In the lighting device 1 according to the present embodiment, when the lighting device 1 is viewed in a plan view along the optical axis direction of light emitted from the lighting device 1, the 1 st region E1 overlaps at least a part of the inclined portion 32a 2. The lighting device 1 according to the present embodiment further includes the cover 40, and controls the light distribution emitted from the light emitting module 62 in a predetermined direction. When the lighting device 1 is viewed in a plan view, at least a part of the 1 st region E1 is disposed outside the cover 40. In the lighting device 1 according to the present embodiment, the distance from the inclined portion 32a2 to the mounting board 61 gradually increases in the direction from the 2 nd area to the 1 st area E1. In the lighting device 1 according to the present embodiment, the density per unit area of the 1 or more control circuit components mounted in the control region E2b is higher than the density per unit area of the 1 st region E1 and the 2 nd region of the 1 or more control circuit components mounted therein. The density per unit area of 1 or more lead-equipped circuit components mounted in the 1 st region E1 is higher than the density per unit area of 1 or more lead-equipped circuit components mounted in the control region E2 b. In the lighting device 1 according to the present embodiment, the lighting device 1 having the light emitting module 62 that emits light includes: 1 or more lead-equipped circuit components for lighting the light emitting module 62; 1 or more chip circuit components including at least the light emitting module 62; a mounting substrate 61 having a1 st region E1 and a2 nd region not overlapping with the 1 st region E1, wherein 1 or more circuit components with leads are mounted in the 1 st region E1, and 1 or more chip circuit components are mounted in the 2 nd region; and a1 st frame 31 and a2 nd frame 32 that house 1 or more leaded circuit components, 1 or more chip circuit components, and the mounting substrate 61. The density per unit area of the 1 or more leaded circuit components mounted in the 1 st region E1 is greater than the density per unit area of the 1 or more leaded circuit components mounted in the 2 nd region. The density per unit area of 1 or more chip circuit components mounted in the 2 nd region is higher than the density per unit area of 1 or more chip circuit components mounted in the 1 st region E1. The 1 st frame body 31 and the 2 nd frame body 32 have the inclined portions 32a2, and are inclined so that the space for accommodating 1 or more of the leaded circuit components is gradually narrowed.
(other modification example)
Although the lighting device according to the present application has been described above based on the embodiments, the present application is not limited to the above embodiments.
For example, in each of the above embodiments, the pair of leaf springs may be arranged in parallel to the Z-axis direction in a region on the positive Y-axis direction side of a line in the Z-axis direction including the center line.
In the above embodiments, the illumination control unit is housed in the 1 st housing and the 2 nd housing, but the present invention is not limited thereto. The illumination control unit may be accommodated in the accommodating body.
In the above embodiments, the device body may include a heat sink. In this case, a part of the heat sink may protrude in a direction intersecting the optical axis. Therefore, the frame does not need to protrude in the direction intersecting the optical axis.
In addition, the present invention includes a configuration obtained by performing various modifications that can be conceived by a person skilled in the art on the above-described embodiments, and a configuration obtained by arbitrarily combining the components and functions of the embodiments without departing from the scope of the present invention.

Claims (10)

1. A lighting device, which emits light,
the lighting device is provided with:
1 or more leaded circuit components;
1 or more chip circuit components;
a mounting substrate having a1 st region and a2 nd region different from the 1 st region, the 1 or more leaded circuit components being mounted in the 1 st region, the 1 or more chip circuit components being mounted in the 2 nd region; and
a frame body covering the 1 or more leaded circuit components and the 1 or more chip circuit components,
the density per unit area of the 1 or more leaded circuit components mounted on the 1 st region is greater than the density per unit area of the 1 or more leaded circuit components mounted on the 2 nd region,
the density per unit area of the 1 or more chip circuit components mounted in the 2 nd region is greater than the density per unit area of the 1 or more chip circuit components mounted in the 1 st region,
the housing has an inclined portion, and a space for accommodating the 1 or more leaded circuit components is gradually narrowed toward a direction opposite to an outgoing direction of light emitted from the lighting device.
2. The lighting device as set forth in claim 1,
the 1 or more chip circuit parts include at least a light emitting module,
the mounting substrate extends in a direction intersecting with an optical axis direction of light emitted from the light emitting module,
the 1 or more leaded circuit components are mounted on one side of the mounting substrate in the longitudinal direction,
the 1 or more chip circuit components are mounted on the other side in the longitudinal direction of the mounting substrate.
3. The lighting device as set forth in claim 2,
the 1 or more chip circuit parts include 1 or more control circuit parts that control the light emitting module,
the 2 nd area is divided into a light emitting area where the light emitting module is mounted and a control area where the 1 or more control circuit components are mounted,
the control region is disposed between the light emitting region and the 1 st region.
4. The lighting device as set forth in claim 3,
the surface of the mounting substrate on which the 1 or more leaded circuit components are mounted is the surface on the opposite side of the surface on which the 1 or more chip circuit components are mounted.
5. The lighting device of claim 3 or 4,
when the illumination device is viewed in a plane along an optical axis direction of light emitted from the illumination device, the control region overlaps at least a part of the inclined portion.
6. The lighting device of claim 3 or 4,
when the lighting device is viewed in a plane along an optical axis direction of light emitted from the lighting device, the 1 st region overlaps at least a part of the inclined portion.
7. The lighting device of any one of claims 2 to 4,
the lighting device further includes a housing for controlling the light distribution emitted from the light emitting module to a predetermined direction,
in a plan view of the lighting device, at least a part of the 1 st region is disposed outside the housing.
8. The lighting device of any one of claims 1 to 4,
the distance between the inclined portion and the mounting substrate gradually increases in a direction from the 2 nd region to the 1 st region.
9. The lighting device of claim 3 or 4,
the density per unit area of the 1 or more control circuit components mounted in the control region is greater than the density per unit area of the 1 or more control circuit components mounted in the 1 st region and the 2 nd region,
the density per unit area of the 1 or more leaded circuit components mounted in the 1 st region is greater than the density per unit area of the 1 or more leaded circuit components mounted in the control region.
10. A lighting device has a light emitting module for emitting light,
the lighting device is provided with:
1 or more leaded circuit components for lighting the light emitting module;
1 or more chip circuit components including at least the light emitting module;
a mounting substrate having a1 st region and a2 nd region not overlapping with the 1 st region, the 1 or more leaded circuit components being mounted in the 1 st region, the 1 or more chip circuit components being mounted in the 2 nd region; and
a frame body that accommodates the 1 or more leaded circuit components, the 1 or more chip circuit components, and the mounting substrate,
the density per unit area of the 1 or more leaded circuit components mounted on the 1 st region is greater than the density per unit area of the 1 or more leaded circuit components mounted on the 2 nd region,
the density per unit area of the 1 or more chip circuit components mounted in the 2 nd region is greater than the density per unit area of the 1 or more chip circuit components mounted in the 1 st region,
the frame body has an inclined portion inclined so as to gradually narrow a space for accommodating the 1 or more leaded circuit components.
CN202010084022.6A 2019-02-18 2020-02-10 Lighting device Pending CN111649272A (en)

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JP2016178013A (en) 2015-03-20 2016-10-06 東芝ライテック株式会社 Lighting device
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US20120062096A1 (en) * 2010-09-13 2012-03-15 Hon Hai Precision Industry Co., Ltd. Led illumination device and conduction structure thereof
CN102748623A (en) * 2012-06-28 2012-10-24 江苏三显照明科技有限公司 Thermal conduction LED (light emitting diode) down light of integral radiator
CN105423195A (en) * 2014-09-11 2016-03-23 松下知识产权经营株式会社 Lighting apparatus
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Application publication date: 20200911