TW202035915A - Lighting device includes one or more leaded circuit components, one or more chip circuit components, a mounting substrate 61, a first housing 31, and a second housing 32 - Google Patents

Lighting device includes one or more leaded circuit components, one or more chip circuit components, a mounting substrate 61, a first housing 31, and a second housing 32 Download PDF

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TW202035915A
TW202035915A TW109104432A TW109104432A TW202035915A TW 202035915 A TW202035915 A TW 202035915A TW 109104432 A TW109104432 A TW 109104432A TW 109104432 A TW109104432 A TW 109104432A TW 202035915 A TW202035915 A TW 202035915A
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Taiwan
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area
circuit components
lighting device
light
per unit
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TW109104432A
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Chinese (zh)
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伊藤範男
車谷壽光
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日商松下知識產權經營股份有限公司
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Publication of TW202035915A publication Critical patent/TW202035915A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/04—Recessed bases
    • F21V21/047—Mounting arrangements with fastening means engaging the inner surface of a hole in a ceiling or wall, e.g. for solid walls or for blind holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0025—Combination of two or more reflectors for a single light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The lighting device 1 includes one or more leaded circuit components, one or more chip circuit components, a mounting substrate 61, a first housing 31, and a second housing 32. In addition, the density per unit area of one or more leaded circuit components installed in the first area E1 is greater than the density per unit area of one or leaded circuit components installed in the second area E2. In addition, the density per unit area of one or more chip circuit components mounted in the second area E2 is greater than the density per unit area of one or more chip circuit components mounted in the first area E1. The first case 31 and the second case 32 have inclined portions 32a2 to reduce the accommodating space of one or more leaded circuit components.

Description

照明裝置Lighting device

本揭示案，係關於一種照明裝置。This disclosure relates to a lighting device.

作為既有的照明裝置，專利文獻1揭示了一種天花板埋入型的照明裝置，具有：裝有電源電路元件之電源基板、裝有光源之基板、與容納裝有電源電路元件之電源基板及裝有光源之基板的矩形狀單元罩。 [習知技術文獻] [專利文獻]As an existing lighting device, Patent Document 1 discloses a ceiling-embedded lighting device, which has: a power substrate equipped with a power circuit element, a substrate equipped with a light source, and a power substrate containing the power circuit element and a device Rectangular unit cover with light source substrate. [Literature Technical Literature] [Patent Literature]

專利文獻1：日本特開2018-198141號公報Patent Document 1: Japanese Patent Application Publication No. 2018-198141

[發明所欲解決之課題][The problem to be solved by the invention]

既有的照明裝置中，安裝電源電路元件即附引線電路零件之電源基板，和安裝光源之基板係各不相同之基板。將他們分別安裝在1片基板的情況下，光源發出的熱會對附引線電路零件造成影響。另外，是互不相同的基板，所以容納空間變大，單元罩尺寸變大。In the existing lighting device, the power supply substrate with the power supply circuit components, that is, the lead circuit parts, and the substrate installed with the light source are different substrates. When they are mounted on a single substrate, the heat from the light source will affect the circuit parts with leads. In addition, since the substrates are different from each other, the storage space becomes larger and the size of the unit cover becomes larger.

因此，其目的在於提供一種照明裝置，可抑制發光模組發出的熱對附引線電路零件造成的影響，並且抑制照明裝置尺寸變大。 [解決課題之技術手段]Therefore, its purpose is to provide a lighting device that can suppress the influence of the heat generated by the light-emitting module on the circuit parts with leads and suppress the size of the lighting device from increasing. [Technical means to solve the problem]

為了達成上述目的，本揭示案相關的照明裝置的一態樣，係一種照明裝置，將光射出；該照明裝置具備：1個以上的附引線電路零件；1個以上的晶片電路零件；安裝基板，於第1區域安裝該1個以上的附引線電路零件，並且在不同於該第1區域的第2區域安裝該1個以上的晶片電路零件；殼體，包覆該1個以上的附引線電路零件及該1個以上的晶片電路零件；該第1區域所安裝之該1個以上的附引線電路零件之每單位面積密度，大於該第2區域所安裝之該1個以上的附引線電路零件之每單位面積密度；該第2區域所安裝之該1個以上的晶片電路零件之每單位面積密度，大於該第1區域所安裝之該1個以上的晶片電路零件之每單位面積密度；該殼體，具有傾斜部，使容納該1個以上的附引線電路零件之空間朝向該照明裝置出射光之射出方向的反方向縮小。 [發明的效果]In order to achieve the above object, one aspect of the lighting device related to the present disclosure is a lighting device that emits light; the lighting device includes: one or more leaded circuit components; one or more chip circuit components; and a mounting substrate , Install the one or more leaded circuit parts in the first area, and install the one or more chip circuit parts in the second area different from the first area; the housing, which covers the one or more leaded circuit parts Circuit components and the one or more chip circuit components; the density per unit area of the one or more leaded circuit components installed in the first area is greater than the one or more leaded circuit installed in the second area The density per unit area of the parts; the density per unit area of the more than one chip circuit components installed in the second area is greater than the density per unit area of the more than one chip circuit components installed in the first area; The housing has an inclined part, so that the space for accommodating the one or more leaded circuit components is reduced toward the opposite direction of the light emitted from the lighting device. [Effects of the invention]

本揭示案相關的照明裝置中，可抑制發光模組發出的熱對附引線電路零件造成的影響，並且可抑制照明裝置尺寸變大。In the lighting device related to the present disclosure, the influence of the heat generated by the light-emitting module on the circuit parts with leads can be suppressed, and the size of the lighting device can be suppressed from increasing.

以下，針對本揭示案的實施形態，利用圖式進行詳細說明。此外，以下所說明之實施形態，均顯示本揭示案的一具體例。所以，以下的實施形態所示之數值、形狀、材料、構成要素、構成要素的配置及連接形態等，僅為一例，並非意圖限定本揭示案。故，以下的實施形態的構成要素之中，針對獨立請求項所未記載之構成要素，則以任意的構成要素來說明。Hereinafter, the embodiments of the present disclosure will be described in detail using drawings. In addition, the embodiments described below all show a specific example of the present disclosure. Therefore, the numerical values, shapes, materials, constituent elements, arrangement and connection forms of constituent elements, etc. shown in the following embodiments are merely examples, and are not intended to limit the present disclosure. Therefore, among the constituent elements of the following embodiments, the constituent elements not described in the independent claims are described as arbitrary constituent elements.

另外，各圖，僅為示意圖，並非必定是精密圖示。所以，例如，各圖當中比例尺等並非必定一致。另外，各圖當中，針對實質上相同的構成賦予相同的符號，重複之說明予以省略或簡化。In addition, the drawings are only schematic diagrams, and not necessarily precise diagrams. Therefore, for example, the scales in the figures are not necessarily the same. In addition, in each figure, the same reference numerals are given to substantially the same configuration, and the repeated description is omitted or simplified.

另外，以下的實施形態當中，使用略平行等的表示手法。例如，略平行，不止是意味著完全平行，也是實質上平行，亦即，意味著也包含例如數%程度的誤差。另外，略平行，係可達本揭示案的效果之範圍當中稱為平行之意味。使用其他的「略」之表示手法也是同樣的。In addition, in the following embodiments, a representation method such as slightly parallel is used. For example, being slightly parallel does not only mean completely parallel, but also substantially parallel, that is, it means that an error of, for example, several% is included. In addition, being slightly parallel means “parallel” in the range that can achieve the effects of the present disclosure. The same is true for other expressions of "略".

首先，針對本實施形態相關的照明裝置進行說明。First, the lighting device related to this embodiment will be described.

（實施形態） ﹝構成﹞ 圖1係例示出實施形態相關的照明裝置1之立體圖。圖1中，照明裝置1當中，將照明裝置1（具體而言係後述之發光模組62）出射光之射出方向界定為X軸正向（例如，照明裝置1的下側），將器具本體3的一部分與光軸直交方向所突出之外徑方向界定為Y軸正向，將與X軸正向及Y軸正向交叉之方向界定為Z軸正向。而圖2以後的各圖所示之各方向，係對應圖1所示之各方向所表示。(Implementation form) ﹝constitute﹞ Fig. 1 is a perspective view of an illuminating device 1 according to the embodiment. In FIG. 1, in the lighting device 1, the emission direction of the light emitted by the lighting device 1 (specifically, the light-emitting module 62 described later) is defined as the positive X axis (for example, the lower side of the lighting device 1), and the main body The outer diameter direction protruding from a part of 3 perpendicular to the optical axis is defined as the positive Y-axis, and the direction crossing the positive X and Y-axis is defined as the positive Z-axis. The directions shown in the figures after Fig. 2 correspond to the directions shown in Fig. 1.

﹝照明裝置1﹞ 如圖1所示，照明裝置1，係裝設於天花板等營造建材之裝置。例如，照明裝置1，係聚光燈，下照燈等。照明裝置1，係朝既定的方向照射光進而可照明既定方向之裝置。﹝Lighting device 1﹞ As shown in Figure 1, the lighting device 1 is installed on the ceiling and other building materials. For example, the lighting device 1 is a spotlight, a downlight, etc. The lighting device 1 is a device that irradiates light in a predetermined direction and can illuminate a predetermined direction.

圖2係實施形態相關的照明裝置1的分解立體圖。圖3係圖1的III-III線當中，觀察照明裝置1的剖面之剖面圖。如圖2及圖3所示，照明裝置1，具有器具本體3、一對板片彈簧70、安裝基板61、發光模組62、照明控制部69、電源部63、支架51、遮蔽部54、透光罩55。Fig. 2 is an exploded perspective view of the lighting device 1 according to the embodiment. FIG. 3 is a cross-sectional view of the cross-section of the lighting device 1 in the line III-III of FIG. 1. As shown in FIGS. 2 and 3, the lighting device 1 has an appliance body 3, a pair of leaf springs 70, a mounting substrate 61, a light-emitting module 62, a lighting control unit 69, a power supply unit 63, a bracket 51, a shielding unit 54, Translucent cover 55.

＜器具本體3＞ 器具本體3，構成照明裝置1的外殼。器具本體3的一部分，往發光模組62射出光的光軸方向之交叉方向（Y軸正向）突出。也就是說，將照明裝置1裝設於營造建材的裝設孔之際，器具本體3的一部分，係沿著天花板延伸。此處所稱之光軸，係發光模組62所射出之光的主軸。所謂光軸方向，係和X軸方向為略平行。＜Apparatus body 3＞ The appliance body 3 constitutes the housing of the lighting device 1. A part of the appliance body 3 protrudes in the cross direction (positive direction of the Y axis) of the optical axis direction of the light emitted to the light emitting module 62. That is, when the lighting device 1 is installed in the installation hole of the construction material, a part of the appliance body 3 is extended along the ceiling. The optical axis referred to here is the main axis of the light emitted by the light-emitting module 62. The so-called optical axis direction is slightly parallel to the X axis direction.

如圖1所示，器具本體3，具有第1殼體31、第2殼體32、外裝罩40。As shown in FIG. 1, the appliance body 3 has a first housing 31, a second housing 32, and an exterior cover 40.

＜第1殼體31及第2殼體32＞ 第1殼體31及第2殼體32，構成容納安裝基板61、發光模組62、及電源部63之容納體。第1殼體31及第2殼體32以螺絲等的固定構件所固定進而形成之容納空間，形成了發光模組62配置側較小之第1空間，形成了電源部63配置空間比第1空間更大幅膨出之第2空間。第1殼體31及第2殼體32，分別為殼體的一例。<The first case 31 and the second case 32> The first housing 31 and the second housing 32 constitute an accommodating body for accommodating the mounting substrate 61, the light emitting module 62, and the power supply unit 63. The first housing 31 and the second housing 32 are fixed by fixing members such as screws to form a accommodating space, forming a first space with a smaller arrangement side of the light-emitting module 62, and forming a smaller space for the power supply 63 than the first The second space where the space bulges more greatly. The first case 31 and the second case 32 are each an example of a case.

圖4係實施形態相關的照明裝置1自第1殼體31側俯視之平面圖。如圖2及圖4所示，第1殼體31及第2殼體32，在照明裝置1自X軸正向側（沿著光軸方向）俯視的情況下，往圓筒狀的外裝罩40的外周面之外徑方向突出。換言之，照明裝置1裝設於營造建材的裝設孔的情況下，第1殼體31及第2殼體32，自外裝罩40的外周面，沿著營造建材往外徑方向延伸。此處外徑方向，為Y軸正向。所以，第1殼體31及第2殼體32的Y軸方向的長度，大於外裝罩40的半徑。Fig. 4 is a plan view of the lighting device 1 according to the embodiment viewed from the side of the first housing 31. As shown in FIGS. 2 and 4, the first housing 31 and the second housing 32 are arranged in a cylindrical shape when the lighting device 1 is viewed from the positive side of the X axis (along the optical axis direction). The outer peripheral surface of the cover 40 protrudes in the outer diameter direction. In other words, when the lighting device 1 is installed in the installation hole of the construction material, the first housing 31 and the second housing 32 extend from the outer peripheral surface of the exterior cover 40 in the outer diameter direction along the construction material. The outer diameter direction here is the positive direction of the Y axis. Therefore, the length in the Y-axis direction of the first housing 31 and the second housing 32 is greater than the radius of the exterior cover 40.

如圖1及圖3所示，第1殼體31，構成容納體的底部。第1殼體31，以Y軸方向為長邊，自外裝罩40的外周面突出之方式，往Y軸正向延伸。另外，第1殼體31，為金屬製，將例如以鋁、或鐵等為主成分之板金彎曲加工所形成。As shown in FIGS. 1 and 3, the first housing 31 constitutes the bottom of the container. The first housing 31 extends in the positive direction of the Y axis so as to protrude from the outer peripheral surface of the exterior cover 40 with the Y axis direction as the long side. In addition, the first housing 31 is made of metal, and formed by bending a sheet metal mainly composed of aluminum, iron, or the like, for example.

第1殼體31，具有底板部31a、一對第1裝設部31b。The first housing 31 has a bottom plate portion 31a and a pair of first mounting portions 31b.

底板部31a，係以既定的姿態固定第2殼體32及外裝罩40，以Y軸方向為長邊之平板。底板部31a的Y軸負向，形成了自底板部31a的兩端緣的一部分往Z軸方向延展方式延伸之一對延出片31a2。一對延出片31a2的端緣，相對於Y軸方向斜向延展。The bottom plate portion 31a is a flat plate with the second housing 32 and the exterior cover 40 fixed in a predetermined posture, and the Y-axis direction is the long side. The Y-axis negative direction of the bottom plate portion 31a forms a pair of extended pieces 31a2 that extend from a part of the two end edges of the bottom plate portion 31a in the Z-axis direction. The end edges of the pair of extended pieces 31a2 extend diagonally with respect to the Y-axis direction.

另外，一對延出片31a2之間，有用以使發光模組62露出的開口31a1於底板部31a形成。開口31a1，形成於底板部31a的Y軸負向。In addition, between the pair of extended pieces 31a2, an opening 31a1 for exposing the light-emitting module 62 is formed in the bottom plate portion 31a. The opening 31a1 is formed in the negative direction of the Y axis of the bottom plate portion 31a.

如圖1及圖2所示，一對第1裝設部31b，配置於底板部31a的Y軸負向側，位於外裝罩40的外周側，設於底板部31a的開口31a1的兩側。一對第1裝設部31b，和底板部31a的一對延出片31a2以一對一對應之方式，一體化設於第1殼體31。一對第1裝設部31b，係和一對延出片31a2的端緣連接，所以照明裝置1自X軸負向側（沿著光軸方向）俯視的情況下，用以裝設板片彈簧70的外周側表面31b2相對於X-Y平面傾斜。一對第1裝設部31b的表面31b2，係後述板片彈簧70的第2裝設部71之對向面。As shown in Figures 1 and 2, a pair of first mounting portions 31b are arranged on the Y-axis negative side of the bottom plate portion 31a, are located on the outer peripheral side of the exterior cover 40, and are provided on both sides of the opening 31a1 of the bottom plate portion 31a . The pair of first mounting portions 31b and the pair of extended pieces 31a2 of the bottom plate portion 31a are integrally provided in the first housing 31 in a one-to-one correspondence. The pair of first mounting portions 31b are connected to the end edges of the pair of extended pieces 31a2, so when the lighting device 1 is viewed from the negative side of the X axis (along the optical axis direction), it is used to mount the plate The outer peripheral side surface 31b2 of the spring 70 is inclined with respect to the XY plane. The surface 31b2 of a pair of 1st installation part 31b is the opposing surface of the 2nd installation part 71 of the leaf spring 70 mentioned later.

如圖4所示，照明裝置1自X軸負向側（例如，照明裝置1的上側）俯視的情況當中，一對第1裝設部31b之中至少一方的第1裝設部31b與另一方的第1裝設部31b，係相對於器具本體3的中心即中心線O以點對稱配置。一對第1裝設部31b，其排列相對於Z軸方向及Y軸方向，以既定的角度傾斜之方式配置。本實施形態中，一對第1裝設部31b之中至少一方的第1裝設部31b，在照明裝置1自X軸負向側俯視的情況下，配置於包含和照明裝置1的光軸（光軸方向）略一致之中心線O的Z軸方向的平行線更靠Y軸正向側的區域當中，自Y軸正向線至Z軸正向線之間的區域，或是自Y軸正向線至Z軸負向（第2方向的一例）的線之間的區域。也就是說，器具本體3的一部分往Y軸正向延伸，所以照明裝置1的重心H自中心線O往Y軸正向偏移。重心H偏移，則是將照明裝置1裝設於營造建材的裝設孔之際，會對營造建材的裝設孔施加偏負重。這種照明裝置1當中，一對第1裝設部31b之中至少一方的第1裝設部31b，以支持此偏移的重心H之方式配置。As shown in FIG. 4, when the lighting device 1 is viewed from the negative side of the X-axis (for example, the upper side of the lighting device 1), at least one of the pair of first mounting parts 31b and the other One of the first mounting parts 31b is arranged point-symmetrically with respect to the center line O of the appliance body 3. The pair of first mounting parts 31b are arranged so that the arrangement thereof is inclined at a predetermined angle with respect to the Z-axis direction and the Y-axis direction. In the present embodiment, at least one of the first mounting portions 31b among the pair of first mounting portions 31b is arranged on the optical axis of the lighting device 1 when the lighting device 1 is viewed from the negative side of the X-axis. (Optical axis direction) The Z-axis direction parallel to the center line O that is slightly consistent is closer to the Y-axis positive side, the area from the Y-axis positive line to the Z-axis positive line, or from Y The area between the positive axis line and the negative Z axis line (an example of the second direction). That is, a part of the luminaire body 3 extends in the positive direction of the Y axis, so the center of gravity H of the lighting device 1 is shifted from the center line O to the positive direction of the Y axis. When the center of gravity H is shifted, when the lighting device 1 is installed in the installation hole of the construction material, a heavy load is applied to the installation hole of the construction material. In this type of lighting device 1, at least one of the first installation parts 31b among the pair of first installation parts 31b is arranged so as to support this shifted center of gravity H.

此外，一對第1裝設部31b之中的另一方的第1裝設部31b，也更可配置於自Y軸正向線至Z軸負向線之間的區域，或是自Y軸正向線與Z軸正向線之間的區域。In addition, the other first installation portion 31b of the pair of first installation portions 31b can also be arranged in the area from the Y-axis positive line to the Z-axis negative line, or from the Y-axis The area between the positive line and the Z-axis positive line.

另外，一對第1裝設部31b之中至少一方的第1裝設部31b，只要配置於自Y軸正向線至Z軸正向線之間的區域，或是自Y軸正向線至Z軸負向線之間的區域即可，所以一對第1裝設部31b之中的另一方的第1裝設部31b，亦可配置於包含中心線O之Z軸方向線V2更靠Y軸正向側區域以外的區域。In addition, at least one of the first installation portions 31b among the pair of first installation portions 31b is only arranged in the area from the Y-axis positive line to the Z-axis positive line, or from the Y-axis positive line It is sufficient to reach the area between the negative Z-axis line, so the other first installation portion 31b among the pair of first installation portions 31b may also be arranged on the Z-axis direction line V2 including the center line O. The area outside the positive side of the Y axis.

如圖2及圖3所示，第2殼體32，構成容納體的頂板部分。也就是說，第2殼體32，配置於第1殼體31的X軸負向側。第2殼體32，作為安裝基板61及電源部63的包覆罩而發揮功能。另外，第2殼體32，為金屬製，將例如以鋁，或是鐵等為主成分之板金彎曲加工所形成。As shown in FIGS. 2 and 3, the second housing 32 constitutes the top plate portion of the container. That is, the second housing 32 is arranged on the negative X-axis side of the first housing 31. The second housing 32 functions as a cover for mounting the substrate 61 and the power supply unit 63. In addition, the second housing 32 is made of metal, and formed by bending a sheet metal mainly composed of aluminum or iron, for example.

第2殼體32，為了迴避高度高於晶片電路零件的附引線電路零件所構成之電源部63，而具有往X軸負向上升之段差部。第2殼體32，藉由段差部來和電源部63對應之部分係往X軸負向膨出之形狀。The second housing 32 has a step portion that rises in the negative direction of the X-axis in order to avoid the power supply portion 63 formed of the circuit components with leads which are higher than the chip circuit components. The portion of the second housing 32 corresponding to the power supply portion 63 by the stepped portion has a shape that bulges in the negative X-axis direction.

具體而言，第2殼體32，具有頂板32a、立壁部32b。Specifically, the second housing 32 has a top plate 32a and a standing wall portion 32b.

頂板32a，具有第1頂板部32a1、傾斜部32a2、第2頂板部32a3。The top plate 32a has a first top plate portion 32a1, an inclined portion 32a2, and a second top plate portion 32a3.

第1頂板部32a1，係用以將安裝基板61固定的裝設面部。在照明裝置1自X軸負向側俯視的情況下，第1頂板部32a1，和構成發光模組62及照明控制部69之晶片電路零件安裝於安裝基板61之第2區域E2重疊。The first top plate portion 32a1 is a mounting surface for fixing the mounting substrate 61. When the lighting device 1 is viewed from the negative side of the X axis, the first top plate portion 32a1 overlaps with the second area E2 where the chip circuit components constituting the light emitting module 62 and the lighting control portion 69 are mounted on the mounting substrate 61.

傾斜部32a2，和第1頂板部32a1的Y軸正向側的端緣連接。傾斜部32a2，使容納1個以上的附引線電路零件之空間朝向該照明裝置1出射光之射出方向（X軸正向）的反方向縮小。也就是說，傾斜部32a2，朝著X軸負向上升傾斜。在照明裝置1自X軸負向側俯視的情況下，傾斜部32a2，和晶片電路零件的控制電路零件安裝於安裝基板61之控制區域E2b重疊。The inclined portion 32a2 is connected to the edge of the first top plate portion 32a1 on the positive side of the Y axis. The inclined portion 32a2 narrows the space for accommodating one or more leaded circuit components toward the direction opposite to the emission direction of the light emitted from the lighting device 1 (the positive X-axis direction). That is, the inclined portion 32a2 is inclined upward in the negative direction of the X-axis. When the lighting device 1 is viewed from the negative side of the X-axis, the inclined portion 32a2 overlaps the control area E2b where the control circuit components of the chip circuit components are mounted on the mounting substrate 61.

第2頂板部32a3，和傾斜部32a2的Y軸正向側的端緣連接。在照明裝置1自X軸負向側俯視的情況下，第2頂板部32a3，和電源部63安裝於安裝基板61之第1區域E1重疊。The second top plate portion 32a3 is connected to the edge of the inclined portion 32a2 on the positive side of the Y axis. When the lighting device 1 is viewed from the negative side of the X axis, the second top plate portion 32a3 overlaps with the first area E1 where the power supply portion 63 is mounted on the mounting board 61.

如此，第1頂板部32a1、傾斜部32a2、及第2頂板部32a3構成段差部。In this way, the first top plate portion 32a1, the inclined portion 32a2, and the second top plate portion 32a3 constitute a step portion.

立壁部32b，係自第2頂板部32a3往X軸正向立起之壁部。立壁部32b，固定了用以對電源部63供給交流電流的電源連接器39。電源連接器39，和電源部63藉由配線而電性連接，將市電所供給之交流電流往電源部63供給。電源連接器39，亦可包含在器具本體3的構成中。The upright wall portion 32b is a wall portion that rises in the positive X-axis direction from the second top plate portion 32a3. The standing wall portion 32b is fixed with a power connector 39 for supplying alternating current to the power source portion 63. The power connector 39 is electrically connected to the power supply unit 63 by wiring, and supplies the AC current supplied by the city power to the power supply unit 63. The power connector 39 may also be included in the structure of the appliance body 3.

＜外裝罩40＞ 外裝罩40，係X軸方向兩側開口之中空圓錐台狀的外殼。外裝罩40的X軸負向側之端部，以包圍第1殼體31的底板部31a的開口31a1周圍之方式，藉由螺絲等的固定構件來固定於第1殼體31。外裝罩40的內部，讓發光模組62的發光通過。＜Exterior cover 40＞ The exterior cover 40 is a hollow truncated cone-shaped housing with openings on both sides in the X-axis direction. The end portion on the negative side of the X axis of the exterior cover 40 is fixed to the first housing 31 by a fixing member such as screws so as to surround the opening 31a1 of the bottom plate portion 31a of the first housing 31. The interior of the exterior cover 40 allows the light of the light-emitting module 62 to pass through.

外裝罩40，具有筒部41、框部42。The exterior cover 40 has a cylindrical portion 41 and a frame portion 42.

筒部41，係圓錐台狀的外裝部分。筒部41，自X軸負向朝X軸正向，徑長變大。筒部41的中心線，和上述的中心線O略一致。筒部41的直徑，小於營造建材的裝設孔的直徑。The cylindrical part 41 is a truncated cone-shaped exterior part. The cylindrical portion 41 has a larger diameter from the negative X axis to the positive X axis. The center line of the barrel 41 is slightly coincident with the center line O described above. The diameter of the barrel 41 is smaller than the diameter of the installation hole of the construction material.

筒部41的內部，讓發光模組62的發光通過。筒部41的內周面，作為讓透光罩55的射出光往既定方向配光控制的光反射罩，而發揮功能。The inside of the barrel 41 allows the light emitted by the light emitting module 62 to pass through. The inner peripheral surface of the cylindrical portion 41 functions as a light reflection cover for controlling the light distribution of the emitted light from the light transmission cover 55 in a predetermined direction.

框部42，係保持裝設照明裝置1的天花板等營造建材之圓環狀鍔部。框部42，自筒部41的下端緣（X軸正向的端緣）往外徑方向延伸。框部42的外徑，大於裝設照明裝置1之營造建材的裝設孔的內徑。框部42與一對板片彈簧70，挾持營造建材，藉以將照明裝置1安定地固定於營造建材。The frame portion 42 is an annular flange portion that holds construction materials such as the ceiling on which the lighting device 1 is installed. The frame portion 42 extends in the outer diameter direction from the lower end edge (the end edge in the positive X-axis direction) of the cylindrical portion 41. The outer diameter of the frame 42 is larger than the inner diameter of the installation hole of the construction material where the lighting device 1 is installed. The frame 42 and the pair of leaf springs 70 pinch construction materials, so that the lighting device 1 is stably fixed to the construction materials.

＜板片彈簧70＞ 一對板片彈簧70，係用以將照明裝置1裝設固定於營造建材所形成的裝設孔的彈性構件，配置於外裝罩40的外周側。一對板片彈簧70，一對一裝設於第1殼體31的一對第1裝設部31b。一對板片彈簧70，藉由外裝罩40的框部42，來挾持營造建材。板片彈簧70，係彈簧的一例。＜Leaf spring 70＞ The pair of leaf springs 70 are elastic members for mounting and fixing the lighting device 1 to mounting holes formed by construction materials, and are arranged on the outer peripheral side of the exterior cover 40. The pair of leaf springs 70 are mounted on the pair of first mounting portions 31b of the first housing 31 one by one. The pair of leaf springs 70 hold construction materials by the frame 42 of the exterior cover 40. The leaf spring 70 is an example of a spring.

此外，板片彈簧70，亦可於照明裝置1設置3個以上。In addition, three or more leaf springs 70 may be provided in the lighting device 1.

一對板片彈簧70，由例如鋼材等的金屬材料所形成。另外，一對板片彈簧70的板厚及寬度，係因應一對板片彈簧70的形成材料的楊氏係數、照明裝置1的重量等，可讓照明裝置1安定地固定於營造建材之方式，適當地訂定。此外，取代一對板片彈簧70，亦可使用線彈簧，或其他熟知的彈簧。The pair of leaf springs 70 are formed of a metal material such as steel. In addition, the thickness and width of the pair of leaf springs 70 are in accordance with the Young's coefficient of the material of the pair of leaf springs 70, the weight of the lighting device 1, etc., so that the lighting device 1 can be stably fixed to construction materials. , Set appropriately. In addition, instead of a pair of leaf springs 70, wire springs or other well-known springs can also be used.

如圖4所示，一對板片彈簧70，係因應第1殼體31的第1裝設部31b的位置所裝設。本實施形態中，在照明裝置1自X軸負向側俯視的情況下，一對板片彈簧70的後述臂部72，係以遠離中心線O方式延伸之姿態配置。As shown in FIG. 4, a pair of leaf springs 70 are installed in accordance with the position of the first installation portion 31b of the first housing 31. In this embodiment, when the lighting device 1 is viewed from the negative side of the X-axis, the later-described arm portions 72 of the pair of leaf springs 70 are arranged in a posture extending away from the center line O.

另外，一對板片彈簧70之中，至少一方的板片彈簧70，在該照明裝置1自X軸負向側俯視的情況下，配置於包含中心線O的平面，且是器具本體3的一部分突出方向的直交平面（X-Z平面）更靠器具本體3的一部分突出側（Y軸正向側）。也就是說，一對板片彈簧70之中，至少一方的板片彈簧70，配置於圖4的直線V2更靠Y軸正向側。本實施形態中，在該照明裝置1自X軸負向側俯視的情況下，通過中心線O及重心H之直線，與中心線O起至少一方的板片彈簧70延伸方向線的角度，為90度以下。In addition, among the pair of leaf springs 70, at least one of the leaf springs 70 is arranged on a plane including the center line O when the lighting device 1 is viewed from the negative side of the X-axis, and is a part of the appliance body 3. The orthogonal plane (XZ plane) of a part of the protruding direction is closer to a part of the protruding side of the appliance body 3 (the positive side of the Y axis). That is, among the pair of leaf springs 70, at least one of the leaf springs 70 is arranged on the straight line V2 in FIG. 4 closer to the positive side of the Y axis. In this embodiment, when the lighting device 1 is viewed from the negative side of the X-axis, the angle between the line passing through the center line O and the center of gravity H and the direction in which at least one of the leaf spring 70 extends from the center line O is Below 90 degrees.

此外，上述的「直交」，不只意味著完全直交，也意味著實質上直交，亦即，例如包含數%程度的誤差。In addition, the above-mentioned "orthogonal crossing" not only means complete orthogonal crossing, but also means substantially orthogonal crossing, that is, for example, it contains an error of several %.

一對板片彈簧70，分別具有第2裝設部71、臂部72。The pair of leaf springs 70 have a second mounting portion 71 and an arm portion 72, respectively.

第2裝設部71，係沿著外裝罩40的外周面配置之基端，係往X軸方向延伸之板狀。第2裝設部71，裝設於第1殼體31的第1裝設部31b。The second mounting portion 71 is a base end arranged along the outer peripheral surface of the exterior cover 40, and has a plate shape extending in the X-axis direction. The second mounting portion 71 is mounted on the first mounting portion 31b of the first housing 31.

在照明裝置1自X軸負向側俯視的情況下，第1裝設部31b的表面31b2相對於X-Y平面傾斜，所以第2裝設部71亦以相對於X-Y平面傾斜方式裝設。When the lighting device 1 is viewed from the negative side of the X-axis, the surface 31b2 of the first installation portion 31b is inclined with respect to the X-Y plane, so the second installation portion 71 is also installed in an inclined manner with respect to the X-Y plane.

臂部72，和第2裝設部71的X軸正向側的端緣連接，係外裝罩40的外周面的遠離方向延伸出之板狀的自由端。將照明裝置1裝設於營造建材的裝設孔之際，臂部72，藉由臂部72的復元力，對於營造建材的裝設孔往X軸正向側施加應力。The arm portion 72 is connected to the end edge on the positive X-axis side of the second mounting portion 71, and is a plate-shaped free end extending in the away direction of the outer peripheral surface of the exterior cover 40. When the lighting device 1 is installed in the installation hole of the construction material, the arm portion 72 applies a stress to the installation hole of the construction material to the positive side of the X axis by the restoring force of the arm portion 72.

在照明裝置1自X軸負向側俯視的情況下，一對板片彈簧70之中至少一方的板片彈簧70的臂部72，配置於自Y軸正向線至Z軸正向線之間的區域。也就是說，至少一方的板片彈簧70的臂部72，係以支持上述的偏移重心H之方式配置。因此，至少一方的板片彈簧70，支持器具本體3的偏負重。When the lighting device 1 is viewed from the negative side of the X-axis, the arm portion 72 of the leaf spring 70 of at least one of the pair of leaf springs 70 is arranged from the positive line of the Y-axis to the positive line of the Z-axis. Between areas. In other words, at least one of the arm portions 72 of the leaf spring 70 is arranged so as to support the offset center of gravity H described above. Therefore, at least one leaf spring 70 supports the partial load of the appliance body 3.

另外，在照明裝置1自X軸負向側俯視的情況下，外裝罩40的外周面之一方的板片彈簧70的臂部72延伸方向、外裝罩40之另一方的板片彈簧70的臂部72延伸方向係在同一直線上。In addition, when the lighting device 1 is viewed from the negative side of the X axis, the arm portion 72 of the leaf spring 70 on one of the outer peripheral surfaces of the exterior cover 40 extends in the direction in which the arm portion 72 of the leaf spring 70 extends, and the leaf spring 70 on the other side of the exterior cover 40 The extending direction of the arm 72 is on the same straight line.

＜安裝基板61＞ 如圖2及圖3所示，安裝基板61，係安裝構成發光模組62及電源部63等電源電路之電子零件的基板。安裝基板61，係在俯視當中，具有以Y軸方向為長邊，且為矩形狀的平面之板材。安裝基板61，往發光模組62射出光的光軸方向之交叉方向延伸。＜Mounting board 61＞ As shown in Figs. 2 and 3, the mounting substrate 61 is a substrate on which electronic components constituting the power supply circuit such as the light-emitting module 62 and the power supply unit 63 are mounted. The mounting substrate 61 is a plate material having a rectangular flat surface with the Y-axis direction as the long side in a plan view. The mounting substrate 61 extends toward the cross direction of the optical axis direction of the light emitting module 62.

安裝基板61，為例如陶瓷基板、樹脂基板或是經絕緣被覆之金屬基底基板等。安裝基板61，形成了用以使發光模組62發光，自電源部63接收直流電力之一對電極端子（正電極端子及負電極端子）（不圖示）。電極端子，透過基板的圖案，來和電源部63電性連接。The mounting substrate 61 is, for example, a ceramic substrate, a resin substrate, or an insulating-coated metal base substrate. The mounting substrate 61 is formed with a pair of electrode terminals (positive electrode terminal and negative electrode terminal) (not shown) for making the light emitting module 62 emit light and receiving direct current power from the power supply section 63. The electrode terminals are electrically connected to the power supply unit 63 through the pattern of the substrate.

安裝基板61，藉由螺絲等的固定構件固定於第2殼體32的頂板32a。具體而言，在照明裝置1自X軸負向側俯視的情況下，安裝基板61，固定於第2殼體32的頂板32a和外裝罩40重疊之裝設面部。裝設面部係和Y-Z軸方向略平行，所以安裝基板61也保持為和Y-Z軸方向略平行。如此，安裝基板61，以自裝設面部往Y軸正向延伸之方式，配置於由第1殼體31及第2殼體32所形成之容納空間。The mounting substrate 61 is fixed to the top plate 32a of the second housing 32 by a fixing member such as screws. Specifically, when the lighting device 1 is viewed from the negative side of the X-axis, the mounting substrate 61 is fixed to the mounting surface where the top plate 32a of the second housing 32 and the exterior cover 40 overlap. The mounting surface is slightly parallel to the Y-Z axis direction, so the mounting substrate 61 is also kept slightly parallel to the Y-Z axis direction. In this way, the mounting substrate 61 is arranged in the accommodating space formed by the first housing 31 and the second housing 32 so as to extend from the mounting surface to the positive direction of the Y axis.

圖5係顯示出照明裝置1的基板的第1區域E1及第2區域E2的示意圖。FIG. 5 is a schematic diagram showing the first area E1 and the second area E2 of the substrate of the lighting device 1.

如圖3及圖5所示，安裝基板61，於第1區域E1安裝1個以上的附引線電路零件，並且在不同於第1區域E1的第2區域E2安裝1個以上的晶片電路零件。1個以上的附引線電路零件，包含發光模組62及1個以上的控制電路零件。第1區域E1，形成於安裝基板61的Y軸正向側，且X軸負向側的面。另外，第2區域E2，形成於安裝基板61的Y軸負向側，且安裝基板61的X軸正向側的面。As shown in FIGS. 3 and 5, the mounting board 61 mounts one or more leaded circuit components in the first area E1, and mounts one or more chip circuit components in the second area E2 different from the first area E1. One or more leaded circuit parts, including the light-emitting module 62 and more than one control circuit parts. The first region E1 is formed on the surface of the mounting substrate 61 on the positive side of the Y axis and on the negative side of the X axis. In addition, the second area E2 is formed on the surface of the mounting substrate 61 on the negative side of the Y axis and on the surface of the mounting substrate 61 on the positive side of the X axis.

另外，第2區域E2，分成安裝發光模組62之發光區域E2a、安裝控制電路零件之控制區域E2b。控制區域E2b，配置於發光區域E2a與第1區域E1之間。另外，第1區域E1、發光區域E2a及控制區域E2b不互相重疊。In addition, the second area E2 is divided into a light emitting area E2a where the light emitting module 62 is installed, and a control area E2b where the control circuit components are installed. The control area E2b is arranged between the light-emitting area E2a and the first area E1. In addition, the first area E1, the light emitting area E2a, and the control area E2b do not overlap with each other.

第1區域E1所安裝之1個以上的附引線電路零件之每單位面積密度，大於大於第2區域E2所安裝之1個以上的附引線電路零件之每單位面積密度。也就是說，第1區域E1，密集1個以上的附引線電路零件。此外，第2區域E2，可只有附引線電路零件安裝於安裝基板61，亦可僅以晶片電路零件安裝於安裝基板61。在此，附引線電路零件之每單位面積密度，係由每單位面積所占之附引線電路零件的數量、面積等所計算出。The density per unit area of one or more circuit components with leads installed in the first area E1 is greater than the density per unit area of one or more circuit components with leads installed in the second area E2. That is, the first area E1 is densely packed with one or more leaded circuit components. In addition, in the second area E2, only the leaded circuit components may be mounted on the mounting substrate 61, or only the chip circuit components may be mounted on the mounting substrate 61. Here, the density per unit area of circuit parts with leads is calculated from the number and area of circuit parts with leads per unit area.

另外，第2區域E2所安裝之1個以上的晶片電路零件之每單位面積密度，大於第1區域E1所安裝之1個以上的晶片電路零件之每單位面積密度。也就是說，第2區域E2，密集1個以上的晶片電路零件。此外，第2區域E2，可只有晶片電路零件安裝於安裝基板61，亦可僅以附引線電路零件安裝於安裝基板61。In addition, the density per unit area of one or more chip circuit components mounted in the second area E2 is greater than the density per unit area of one or more chip circuit components mounted in the first area E1. That is, the second area E2 is densely packed with one or more wafer circuit components. In addition, in the second area E2, only the chip circuit components may be mounted on the mounting substrate 61, or only the leaded circuit components may be mounted on the mounting substrate 61.

＜發光模組62＞ 如圖2及圖3所示，發光模組62，係以放射狀射出既定光之LED（Light　Emitting　Diode，發光二極體）模組。本實施形態中，發光模組62，係射出例如白光所構成。例如，發光模組62，係以COB（Chip On Board，覆晶）型LED所構成，具備：安裝基板61上所安裝之裸晶片（LED晶片）即複數藍色LED、密封該等青色LED並包含黃色螢光體之密封構件。＜Light-emitting module 62＞ As shown in FIGS. 2 and 3, the light-emitting module 62 is an LED (Light Emitting Diode) module that emits predetermined light radially. In this embodiment, the light-emitting module 62 is configured to emit white light, for example. For example, the light-emitting module 62 is composed of COB (Chip On Board, flip chip) type LEDs, and includes: bare chips (LED chips) mounted on the mounting substrate 61, namely plural blue LEDs, sealing the cyan LEDs and Sealing member containing yellow phosphor.

如圖3及圖5所示，發光模組62，安裝於安裝基板61的縱長方向之另一側，也就是Y軸負向側。另外，發光模組62，安裝於第1頂板部32a1的對向側的安裝基板61的面，也就是X軸正向側的面。As shown in FIGS. 3 and 5, the light emitting module 62 is mounted on the other side of the mounting substrate 61 in the longitudinal direction, that is, the negative side of the Y axis. In addition, the light-emitting module 62 is mounted on the surface of the mounting substrate 61 on the opposite side of the first top plate portion 32a1, that is, the surface on the positive side of the X axis.

因此，發光模組62朝X軸正向射出。發光模組62的發光，通過後述的支架51的開口部52、遮蔽部54、透光罩55、外裝罩40的筒部41，將周圍照明。Therefore, the light emitting module 62 emits in the positive direction of the X axis. The light emitted by the light-emitting module 62 passes through the opening 52 of the holder 51, the shielding portion 54, the translucent cover 55, and the cylindrical portion 41 of the exterior cover 40, which will illuminate the surroundings.

＜照明控制部69＞ 照明控制部69，係用以對發光模組62的發光進行調色及調光控制的控制器。照明控制部69，係控制發光模組62之1個以上的控制電路零件。1個以上的控制電路零件，由微電腦等所構成。＜Lighting control unit 69＞ The lighting control unit 69 is a controller for adjusting and dimming the light emitted by the light-emitting module 62. The lighting control unit 69 is a control circuit component that controls one or more of the light-emitting modules 62. One or more control circuit parts are composed of a microcomputer, etc.

照明控制部69，安裝於安裝基板61的第2區域E2的控制區域E2b。具體而言，照明控制部69，安裝於安裝基板61的第2區域E2的控制區域E2b。也就是說，照明控制部69，安裝於發光模組62與點燈電路63a之間。The lighting control unit 69 is mounted in the control area E2b of the second area E2 of the mounting board 61. Specifically, the lighting control unit 69 is mounted in the control area E2 b of the second area E2 of the mounting board 61. That is, the lighting control unit 69 is installed between the light-emitting module 62 and the lighting circuit 63a.

控制區域E2b，係安裝基板61之和第2殼體32的傾斜部32a2對應之位置。也就是說，在照明裝置1自X軸負向側俯視的情況下，傾斜部32a2和控制區域E2b重疊。The control area E2b is a position corresponding to the inclined portion 32a2 of the second housing 32 on the mounting board 61. That is, when the lighting device 1 is viewed from the negative side of the X-axis, the inclined portion 32a2 and the control region E2b overlap.

＜電源部63＞ 電源部63，係內建有供給用以使發光模組62點燈的電力之點燈電路63a的電源模組。點燈電路63a，將電源部63所連接之配線所供給的交流電流轉換成直流電流，將轉換的直流電流，透過基板的圖案往發光模組62供給。＜Power Supply 63＞ The power supply unit 63 is a power supply module in which a lighting circuit 63a for supplying electric power for lighting the light-emitting module 62 is built-in. The lighting circuit 63a converts the alternating current supplied by the wiring connected to the power supply unit 63 into a direct current, and supplies the converted direct current to the light emitting module 62 through the pattern of the substrate.

點燈電路63a，由1個以上的附引線電路零件所構成。附引線電路零件，係例如，電解電容、變壓器、線圈等。附引線電路零件，高度高於晶片電路零件。The lighting circuit 63a is composed of one or more leaded circuit components. Circuit parts with leads, such as electrolytic capacitors, transformers, coils, etc. The lead circuit parts are higher than the chip circuit parts.

點燈電路63a，在第1殼體31及第2殼體32所構成之容納空間當中，安裝於發光模組62安裝於安裝基板61的面之反面，也就是說，X軸正向側的面。另外，點燈電路63a，安裝於安裝基板61的縱長方向之一側，也就是Y軸正向側。The lighting circuit 63a is mounted on the opposite side of the surface where the light-emitting module 62 is mounted on the mounting substrate 61 in the accommodation space formed by the first housing 31 and the second housing 32, that is, on the positive side of the X axis surface. In addition, the lighting circuit 63a is mounted on one side of the mounting substrate 61 in the longitudinal direction, that is, the Y-axis positive side.

＜支架51＞ 支架51，係藉由螺絲等的固定構件固定於安裝基板61，來限制安裝基板61的位置之環狀支持構件。＜Support 51＞ The bracket 51 is a ring-shaped support member that is fixed to the mounting substrate 61 by a fixing member such as screws to restrict the position of the mounting substrate 61.

支架51，形成了開口部52、複數的螺絲孔。The bracket 51 has an opening 52 and a plurality of screw holes.

開口部52，係使發光模組62露出而開口之部分。開口部52的開口面，以和第1殼體31之底板部31a的開口31a1的開口面重疊之方式對應。The opening 52 is a part that exposes the light-emitting module 62 and opens. The opening surface of the opening 52 corresponds to the opening surface of the opening 31a1 of the bottom plate portion 31a of the first housing 31 so as to overlap.

複數的螺絲孔，係用以將支架51以螺絲等的固定構件固定於安裝基板61的孔。具體而言，支架51，與第2殼體32的裝設面部包夾安裝基板61，在此狀態下，將安裝基板61往裝設面部推壓，以此方式藉由固定構件固定於裝設面部。如此，安裝基板61在和裝設面部密接之狀態下得到固定。藉此，讓發光模組62所產生之熱有效地往第2殼體32傳導。支架51，係例如聚對苯二甲酸丁二酯（PBT）、聚碳酸酯等的樹脂材料。The plural screw holes are holes for fixing the bracket 51 to the mounting substrate 61 with fixing members such as screws. Specifically, the bracket 51 sandwiches the mounting substrate 61 with the mounting surface of the second housing 32. In this state, the mounting substrate 61 is pressed against the mounting surface and is fixed to the mounting surface by a fixing member in this state. Face. In this way, the mounting substrate 61 is fixed in close contact with the mounting surface. Thereby, the heat generated by the light-emitting module 62 is effectively conducted to the second casing 32. The bracket 51 is made of a resin material such as polybutylene terephthalate (PBT) or polycarbonate.

＜遮蔽部54＞ 遮蔽部54，具有將發光模組62的射出光朝透光罩55反射進而控制配光之鏡面。遮蔽部54，係內面由鋁等金屬所構成之鏡面，但亦可使用例如聚對苯二甲酸丁二酯等硬質的白色樹脂材料來形成。＜Shield 54＞ The shielding portion 54 has a mirror surface that reflects the light emitted from the light-emitting module 62 toward the transparent cover 55 to control the light distribution. The shielding portion 54 is a mirror surface whose inner surface is made of metal such as aluminum, but it can also be formed using a hard white resin material such as polybutylene terephthalate.

遮蔽部54，係以X軸方向開口之無底筒狀。遮蔽部54的形狀，係自發光模組62的光入射側（X軸負向側）之端部，朝該射出側（X軸正向側）之端部，內徑逐漸變大方式所構成之圓錐台狀。The shielding portion 54 has a bottomless cylindrical shape that opens in the X-axis direction. The shape of the shielding portion 54 is formed by gradually increasing the inner diameter from the end of the light-incident side (X-axis negative side) of the light-emitting module 62 to the end of the emission side (X-axis positive side) The truncated cone shape.

遮蔽部54，藉由螺絲等的固定構件固定於第1殼體31的底板部31a。遮蔽部54的X軸負向側之端部，插入第1殼體31之底板部31a的開口31a1及支架51的開口部52，包圍發光模組62的周圍，以此方式配置。另外，遮蔽部54的中心線，和中心線O略一致。The shielding portion 54 is fixed to the bottom plate portion 31a of the first housing 31 by a fixing member such as screws. The end of the shielding portion 54 on the negative side of the X-axis is inserted into the opening 31a1 of the bottom plate portion 31a of the first housing 31 and the opening 52 of the bracket 51 to surround the light emitting module 62 and are arranged in this manner. In addition, the center line of the shielding portion 54 slightly coincides with the center line O.

＜透光罩55＞ 透光罩55，係讓遮蔽部54的反射光，及發光模組62的光入射之透光性巨蛋狀之光學罩。透光罩55，容納於外裝罩40。透光罩55，係以照明裝置1自X軸正向觀察，包覆遮蔽部54及發光模組62之狀態下固定於外裝罩40。另外，外裝罩40的中心線，和中心線O略一致。＜Translucent cover 55＞ The translucent cover 55 is a translucent dome-shaped optical cover that allows the reflected light of the shielding portion 54 and the light of the light-emitting module 62 to enter. The translucent cover 55 is accommodated in the exterior cover 40. The light-transmitting cover 55 is fixed to the outer cover 40 in a state of covering the shielding portion 54 and the light-emitting module 62 when the lighting device 1 is viewed from the positive direction of the X axis. In addition, the center line of the exterior cover 40 slightly coincides with the center line O.

此外，透光罩55，亦可具有控制遮蔽部54的反射光的配光而射出之性能。例如透光罩55，亦可為菲涅爾透鏡等。透光罩55，使用透光性材料所形成，係使用例如壓克力、聚碳酸酯（PC）等的透明樹脂材料，或是玻璃材料等的透明材料所形成。In addition, the translucent cover 55 may also have the performance of controlling the light distribution of the reflected light of the shielding portion 54 and emitting it. For example, the transparent cover 55 may also be a Fresnel lens. The light-transmitting cover 55 is formed of a light-transmitting material, and is formed of a transparent resin material such as acrylic or polycarbonate (PC), or a transparent material such as a glass material.

這種照明裝置1中，照明裝置1的重心H自中心線O往Y軸正向偏移，但一對板片彈簧70之中至少一方的板片彈簧70，支持照明裝置1的偏負重。藉此，讓照明裝置1，安定地保持於營造建材的裝設孔。In the lighting device 1 of this type, the center of gravity H of the lighting device 1 is offset from the center line O in the positive direction of the Y axis, but at least one of the leaf springs 70 among the pair of leaf springs 70 supports the biased load of the lighting device 1. Thereby, the lighting device 1 is stably held in the installation hole of the construction material.

﹝作用效果﹞ 接著，針對本實施形態之照明裝置1的作用效果進行說明。﹝Effect﹞ Next, the effect of the lighting device 1 of this embodiment will be described.

如上所述，本實施形態相關的照明裝置1，係一種將光射出之照明裝置1，其具備：1個以上的附引線電路零件；1個以上的晶片電路零件；安裝基板61，於第1區域E1安裝1個以上的附引線電路零件，並且在不同於第1區域E1的第2區域E2安裝1個以上的晶片電路零件；第1殼體31及第2殼體32，包覆1個以上的附引線電路零件及1個以上的晶片電路零件。另外，第1區域E1所安裝之1個以上的附引線電路零件之每單位面積密度，大於第2區域E2所安裝之1個以上的附引線電路零件之每單位面積密度。另外，第2區域E2所安裝之1個以上的晶片電路零件之每單位面積密度，大於第1區域E1所安裝之1個以上的晶片電路零件之每單位面積密度。而第1殼體31及第2殼體32，具有傾斜部32a2，使容納1個以上的附引線電路零件之空間朝向該照明裝置1出射光之射出方向的反方向縮小。As described above, the lighting device 1 related to this embodiment is a lighting device 1 that emits light. It includes: one or more leaded circuit components; one or more chip circuit components; and a mounting board 61 on the first One or more leaded circuit components are installed in area E1, and one or more chip circuit components are installed in a second area E2 different from the first area E1; the first case 31 and the second case 32 are covered with one The above circuit parts with leads and more than one chip circuit parts. In addition, the density per unit area of one or more circuit components with leads mounted in the first area E1 is greater than the density per unit area of one or more circuit components with leads mounted in the second area E2. In addition, the density per unit area of one or more chip circuit components mounted in the second area E2 is greater than the density per unit area of one or more chip circuit components mounted in the first area E1. On the other hand, the first housing 31 and the second housing 32 have inclined portions 32a2, so that the space for accommodating one or more leaded circuit components is reduced in the direction opposite to the direction in which the illuminating device 1 emits light.

據此，安裝基板61中，分成集合了1個以上的附引線電路零件之第1區域E1、集合了1個以上的晶片電路零件之第2區域E2。因此，可使附引線電路零件遠離成為發熱源之晶片電路零件。According to this, the mounting board 61 is divided into a first area E1 in which one or more leaded circuit components are assembled, and a second area E2 in which one or more chip circuit components are assembled. Therefore, the lead-attached circuit parts can be kept away from the chip circuit parts that are heat sources.

另外，可藉由傾斜部32a2，來抑制附引線電路零件之容納空間尺寸變大。In addition, the sloping portion 32a2 can prevent the size of the storage space of the leaded circuit component from increasing.

所以，此照明裝置1中，可抑制發光模組62發出的熱對附引線電路零件造成的影響，並且可抑制照明裝置1尺寸變大。Therefore, in this lighting device 1, the influence of the heat generated by the light-emitting module 62 on the circuit components with leads can be suppressed, and the size of the lighting device 1 can be suppressed from increasing.

特別是，傾斜部32a2使1個以上的附引線電路零件之容納空間縮小，所以讓照明裝置1尺寸變小，便可減少器具本體3所使用的材料，所以可實現照明裝置1的製造成本低價化。In particular, the inclined portion 32a2 reduces the accommodating space of one or more leaded circuit components, so that the size of the lighting device 1 can be reduced, and the material used in the appliance body 3 can be reduced, so the manufacturing cost of the lighting device 1 can be low. Valence.

另外，於營造建材的裝設孔裝設照明裝置1之際，和形成直角狀的段差部之照明裝置1相比，傾斜部32a2不會輕易地卡在營造建材的裝設孔，所以易於將照明裝置1裝設於營造建材的裝設孔。In addition, when installing the lighting device 1 in the installation hole of the construction material, the inclined portion 32a2 is not easily caught in the installation hole of the construction material, so it is easy to install The lighting device 1 is installed in the installation hole of the construction material.

另外，本實施形態相關的照明裝置1當中，1個以上的晶片電路零件，至少包含發光模組62。另外，安裝基板61，往發光模組62射出光的光軸方向之交叉方向延伸。另外，1個以上的附引線電路零件，安裝於安裝基板61的縱長方向之一側。而1個以上的晶片電路零件，安裝於安裝基板61的縱長方向之另一側。In addition, in the lighting device 1 of this embodiment, one or more chip circuit components include at least the light-emitting module 62. In addition, the mounting substrate 61 extends in the cross direction of the optical axis direction of the light emitted from the light emitting module 62. In addition, one or more circuit components with leads are mounted on one side of the mounting substrate 61 in the longitudinal direction. On the other hand, one or more chip circuit components are mounted on the other side of the mounting substrate 61 in the longitudinal direction.

據此，可將1個以上的附引線電路零件與1個以上的晶片電路零件確實間隔開，所以可抑制發光模組62發出的熱對附引線電路零件造成的影響。According to this, more than one circuit component with leads can be reliably separated from one or more chip circuit components, so the influence of heat generated by the light-emitting module 62 on the circuit components with leads can be suppressed.

另外，本實施形態相關的照明裝置1當中，1個以上的晶片電路零件，包含控制發光模組62之1個以上的控制電路零件。另外，第2區域E2，分為安裝發光模組62之發光區域E2a、安裝控制電路零件之控制區域E2b。而控制區域E2b，配置於發光區域E2a與第1區域E1之間。In addition, in the lighting device 1 according to the present embodiment, one or more chip circuit components include one or more control circuit components that control the light-emitting module 62. In addition, the second area E2 is divided into a light-emitting area E2a where the light-emitting module 62 is installed, and a control area E2b where the control circuit components are installed. The control area E2b is arranged between the light emitting area E2a and the first area E1.

據此，可使附引線電路零件和發光模組62更加間隔開。因此，可更加抑制發光模組62發出的熱對附引線電路零件造成的影響。Accordingly, the lead-attached circuit component and the light-emitting module 62 can be more spaced apart. Therefore, the influence of the heat generated by the light-emitting module 62 on the circuit components with leads can be further suppressed.

另外，本實施形態相關的照明裝置1當中，1個以上的附引線電路零件安裝於安裝基板61之面，係1個以上的晶片電路零件安裝於安裝基板61之面的反面。In addition, in the lighting device 1 according to the present embodiment, one or more leaded circuit components are mounted on the surface of the mounting substrate 61, and one or more chip circuit components are mounted on the opposite side of the surface of the mounting substrate 61.

據此，可將安裝附引線電路零件之第1區域E1與安裝晶片電路零件之第2區域E2確實分離。According to this, it is possible to reliably separate the first area E1 where the leaded circuit component is mounted and the second area E2 where the chip circuit component is mounted.

另外，本實施形態相關的照明裝置1當中，沿著照明裝置1射出光的光軸方向對照明裝置1俯視的情況下，控制區域E2b，和傾斜部32a2重疊。In addition, in the lighting device 1 according to the present embodiment, when the lighting device 1 is viewed from above along the optical axis direction of the light emitted by the lighting device 1, the control area E2b overlaps the inclined portion 32a2.

據此，安裝基板61的控制區域E2b所安裝之控制電路零件產生之輻射熱往傾斜部32a2傳導，進而可抑制第1殼體31及第2殼體32內的溫度上昇。 另外，本實施形態相關的照明裝置1當中，沿著該照明裝置1射出光的光軸方向對該照明裝置1俯視的情況下，第1區域E1，和傾斜部32a2的至少一部分重疊。 另外，本實施形態相關的照明裝置1當中，更具備外裝罩40，將發光模組62的發光往既定方向進行配光控制。而對該照明裝置1俯視的情況下，第1區域E1的至少一部分，配置於外裝罩40的外側。 另外，本實施形態相關的照明裝置1當中，傾斜部32a2，在自第2區域朝向第1區域E1之方向當中，與安裝基板61的距離逐漸增大。 另外，本實施形態相關的照明裝置1當中，控制區域E2b所安裝之1個以上的控制電路零件之每單位面積密度，大於第1區域E1及第2區域所安裝之1個以上的控制電路零件之每單位面積密度。而第1區域E1所安裝之1個以上的附引線電路零件之每單位面積密度，大於控制區域E2b所安裝之1個以上的附引線電路零件之每單位面積密度。 另外，本實施形態相關的照明裝置1當中，係一種照明裝置1，具有將光射出之發光模組62；照明裝置1具備：1個以上的附引線電路零件，用以使發光模組62點燈；1個以上的晶片電路零件，至少包含發光模組62；安裝基板61，具有：安裝1個以上的附引線電路零件之第1區域E1、安裝1個以上的晶片電路零件之區域且不和第1區域E1重疊之區域即第2區域；第1殼體31及第2殼體32，容納1個以上的附引線電路零件、1個以上的晶片電路零件及安裝基板61。另外，第1區域E1所安裝之1個以上的附引線電路零件之每單位面積密度，大於第2區域所安裝之該1個以上的附引線電路零件之每單位面積密度。另外，第2區域所安裝之1個以上的晶片電路零件之每單位面積密度，大於第1區域E1所安裝之該1個以上的晶片電路零件之每單位面積密度。而第1殼體31及第2殼體32，具有傾斜部32a2，傾斜以使1個以上的附引線電路零件之容納空間縮小。Accordingly, the radiant heat generated by the control circuit components mounted in the control area E2b of the mounting board 61 is conducted to the inclined portion 32a2, and the temperature rise in the first housing 31 and the second housing 32 can be suppressed. In addition, in the lighting device 1 according to the present embodiment, when the lighting device 1 is viewed from above along the optical axis direction in which the lighting device 1 emits light, the first area E1 overlaps with at least a part of the inclined portion 32a2. In addition, the lighting device 1 according to the present embodiment further includes an exterior cover 40 to control the light distribution of the light emitted by the light emitting module 62 in a predetermined direction. On the other hand, when the lighting device 1 is viewed from above, at least a part of the first region E1 is arranged outside the exterior cover 40. In addition, in the lighting device 1 according to this embodiment, the inclined portion 32a2 gradually increases the distance from the mounting substrate 61 in the direction from the second area to the first area E1. In addition, in the lighting device 1 of this embodiment, the density per unit area of one or more control circuit components installed in the control area E2b is greater than the one or more control circuit components installed in the first area E1 and the second area The density per unit area. The density per unit area of one or more circuit components with leads installed in the first area E1 is greater than the density per unit area of one or more circuit components with leads installed in the control area E2b. In addition, the lighting device 1 related to this embodiment is a lighting device 1 having a light emitting module 62 that emits light; the lighting device 1 includes: one or more leaded circuit parts for making the light emitting module 62 point Lamp; one or more chip circuit parts, including at least the light-emitting module 62; the mounting substrate 61, with: the first area E1 where more than one leaded circuit part is installed, the area where one or more chip circuit parts are installed and not The area overlapping with the first area E1 is the second area; the first case 31 and the second case 32 accommodate one or more leaded circuit components, one or more chip circuit components, and a mounting board 61. In addition, the density per unit area of one or more circuit components with leads mounted in the first area E1 is greater than the density per unit area of the one or more circuit components with leads mounted in the second area. In addition, the density per unit area of one or more chip circuit components mounted in the second area is greater than the density per unit area of the one or more chip circuit components mounted in the first area E1. On the other hand, the first case 31 and the second case 32 have inclined portions 32a2, which are inclined to reduce the accommodating space for one or more leaded circuit components.

（其他變形例） 以上，針對本揭示案相關的照明裝置，依據實施形態進行了說明，但本揭示案，並不限於上述的各實施形態。(Other modifications) Above, the lighting device related to the present disclosure has been described based on the embodiments, but the present disclosure is not limited to the above-mentioned embodiments.

例如，上述的各實施形態當中，一對板片彈簧，亦可配置成包含中心線之Z軸方向線更靠Y軸正向側的區域當中，和Z軸方向平行。For example, in each of the above-mentioned embodiments, a pair of leaf springs may be arranged in a region where the Z-axis direction line including the center line is closer to the positive side of the Y-axis, and is parallel to the Z-axis direction.

另外，上述的各實施形態當中，照明控制部容納於第1殼體及第2殼體，但並不限於此。照明控制部，亦可容納於容納體。In addition, in each of the above-mentioned embodiments, the lighting control unit is housed in the first housing and the second housing, but it is not limited to this. The lighting control part can also be accommodated in the containing body.

另外，上述的各實施形態當中，器具本體的構成，亦可包含散熱片。在此情況下，散熱片的一部分亦可往光軸之交叉方向突出。因此，殼體往光軸的交叉方向突出並非必要的。In addition, in each of the above-mentioned embodiments, the configuration of the appliance body may include heat sinks. In this case, a part of the heat sink may also protrude in the cross direction of the optical axis. Therefore, it is not necessary for the housing to protrude in the cross direction of the optical axis.

此外，對於上述各實施形態，所屬技術領域中具通常知識者所能思及的各種變形予以實施所得之形態，或在未脫離本揭示案主旨之範圍內將各實施形態之構成要素及性能任意組合所實現之形態，亦包含在本揭示案。In addition, with regard to the above-mentioned embodiments, various modifications that can be thought of by those skilled in the art can be implemented, or the constituent elements and performance of each embodiment may be arbitrarily implemented without departing from the scope of the present disclosure. The form realized by the combination is also included in this disclosure.

1:照明裝置 3:器具本體 31:第1殼體(殼體) 31a:底板部 31a1:開口 31a2:延出片 31b:第1裝設部(裝設部) 31b2:表面 32:第2殼體(殼體) 32a:頂板 32a1:第1頂板部 32a2:傾斜部 32a3:第2頂板部 32b:立壁部 39:電源連接器 40:外裝罩 41:筒部 42:框部 51:支架 52:開口部 54:遮蔽部 55:透光罩 61:安裝基板 62:發光模組 63:電源部 63a:點燈電路 69:照明控制部 70:板片彈簧(彈簧) 71:第2裝設部 72:臂部 E1:第1區域 E2:第2區域 E2a:發光區域 E2b:控制區域 O:中心線1: Lighting device 3: Apparatus body 31: The first shell (shell) 31a: bottom plate 31a1: opening 31a2: extended film 31b: The first installation part (installation part) 31b2: surface 32: The second shell (shell) 32a: top plate 32a1: The first top plate 32a2: inclined part 32a3: The second top plate part 32b: Standing wall 39: power connector 40: Exterior cover 41: Tube 42: Frame 51: bracket 52: opening 54: Shading part 55: Translucent cover 61: Install the base plate 62: Light-emitting module 63: Power Department 63a: lighting circuit 69: Lighting Control Department 70: leaf spring (spring) 71: The second installation department 72: Arm E1: Zone 1 E2: Zone 2 E2a: Light emitting area E2b: control area O: Centerline

圖1係例示出實施形態相關的照明裝置之立體圖。 圖2係實施形態相關的照明裝置的分解立體圖。 圖3係圖1的III-III線當中，觀察照明裝置的剖面之剖面圖。 圖4係實施形態相關的照明裝置自X軸負向側俯視之平面圖。 圖5係顯示出照明裝置的基板的第1區域及第2區域的示意圖。Fig. 1 is a perspective view showing an example of a lighting device according to the embodiment. Fig. 2 is an exploded perspective view of the lighting device according to the embodiment. Fig. 3 is a cross-sectional view of the cross section of the lighting device in the line III-III of Fig. 1. Fig. 4 is a plan view of the lighting device according to the embodiment viewed from the negative side of the X axis. FIG. 5 is a schematic diagram showing the first area and the second area of the substrate of the lighting device.

1:照明裝置 1: Lighting device

3:器具本體 3: Apparatus body

31:第1殼體(殼體) 31: The first shell (shell)

31a:底板部 31a: bottom plate

31a1:開口 31a1: opening

32:第2殼體(殼體) 32: The second shell (shell)

32a:頂板 32a: top plate

32a1:第1頂板部 32a1: The first top plate

32a2:傾斜部 32a2: inclined part

32a3:第2頂板部 32a3: The second top plate part

32b:立壁部 32b: Standing wall

39:電源連接器 39: power connector

40:外裝罩 40: Exterior cover

41:筒部 41: Tube

42:框部 42: Frame

51:支架 51: bracket

52:開口部 52: opening

54:遮蔽部 54: Shading part

55:透光罩 55: Translucent cover

61:安裝基板 61: Install the base plate

62:發光模組 62: Light-emitting module

63:電源部 63: Power Department

63a:點燈電路 63a: lighting circuit

69:照明控制部 69: Lighting Control Department

70:板片彈簧(彈簧) 70: leaf spring (spring)

E1:第1區域 E1: Zone 1

E2a:發光區域 E2a: Light emitting area

E2b:控制區域 E2b: control area

O:中心線 O: Centerline

Claims (10)

一種照明裝置，其將光射出，且具備： 1個以上的附引線電路零件； 1個以上的晶片電路零件； 安裝基板，於第1區域安裝該1個以上的附引線電路零件，並且在不同於該第1區域的第2區域安裝該1個以上的晶片電路零件； 殼體，包覆該1個以上的附引線電路零件及該1個以上的晶片電路零件； 該第1區域所安裝之該1個以上的附引線電路零件之每單位面積密度，大於該第2區域所安裝之該1個以上的附引線電路零件之每單位面積密度； 該第2區域所安裝之該1個以上的晶片電路零件之每單位面積密度，大於該第1區域所安裝之該1個以上的晶片電路零件之每單位面積密度； 該殼體具有傾斜部，該傾斜部使容納該1個以上的附引線電路零件之空間朝向該照明裝置出射光之射出方向的反方向縮小。A lighting device that emits light and has: 1 or more circuit parts with leads; More than 1 chip circuit parts; Mount the substrate, mount the one or more leaded circuit components in the first area, and mount the one or more chip circuit components in the second area different from the first area; The casing covers the one or more leaded circuit parts and the one or more chip circuit parts; The density per unit area of the one or more circuit parts with leads installed in the first area is greater than the density per unit area of the one or more circuit parts with leads installed in the second area; The density per unit area of the one or more chip circuit components installed in the second area is greater than the density per unit area of the one or more chip circuit components installed in the first area; The housing has an inclined portion, and the inclined portion reduces the space for accommodating the one or more leaded circuit components toward the opposite direction of the emission direction of the light emitted from the lighting device. 如請求項1的照明裝置，其中， 該1個以上的晶片電路零件，至少包含發光模組； 該安裝基板，朝向該發光模組射出光的光軸方向之交叉方向延伸； 該1個以上的附引線電路零件，安裝於該安裝基板的縱長方向之一側； 該1個以上的晶片電路零件，安裝於該安裝基板的縱長方向之另一側。Such as the lighting device of claim 1, wherein The one or more chip circuit components include at least a light-emitting module; The mounting substrate extends toward the cross direction of the optical axis direction of the light emitted by the light emitting module; The one or more leaded circuit parts are mounted on one side of the longitudinal direction of the mounting substrate; The one or more chip circuit components are mounted on the other side of the mounting board in the longitudinal direction. 如請求項2的照明裝置，其中， 該1個以上的晶片電路零件，包含控制該發光模組之1個以上的控制電路零件； 該第2區域，分為安裝該發光模組之發光區域及安裝該1個以上的控制電路零件之控制區域； 該控制區域，配置於該發光區域與該第1區域之間。Such as the lighting device of claim 2, wherein The one or more chip circuit parts include more than one control circuit parts that control the light-emitting module; The second area is divided into a light-emitting area where the light-emitting module is installed and a control area where the one or more control circuit components are installed; The control area is arranged between the light-emitting area and the first area. 如請求項3的照明裝置，其中， 該1個以上的附引線電路零件安裝於該安裝基板之面，係該1個以上的晶片電路零件安裝於該安裝基板之面的反面。Such as the lighting device of claim 3, wherein, The one or more leaded circuit components are mounted on the surface of the mounting substrate, and the one or more chip circuit components are mounted on the opposite side of the surface of the mounting substrate. 如請求項3或4的照明裝置，其中， 沿著該照明裝置射出光的光軸方向對該照明裝置俯視的情況下，該控制區域，和該傾斜部的至少一部分重疊。Such as the lighting device of claim 3 or 4, wherein, When the lighting device is viewed in a plan view along the optical axis direction of the light emitted from the lighting device, the control area overlaps at least a part of the inclined portion. 如請求項3或4的照明裝置，其中， 沿著該照明裝置射出光的光軸方向對該照明裝置俯視的情況下，該第1區域，和該傾斜部的至少一部分重疊。Such as the lighting device of claim 3 or 4, wherein, When the lighting device is viewed in a plan view along the optical axis direction in which the lighting device emits light, the first region overlaps with at least a part of the inclined portion. 如請求項2至4中任一項的照明裝置，其中， 更具備外裝罩，將該發光模組所發出的光往既定方向進行配光控制； 對該照明裝置俯視的情況下，該第1區域的至少一部分，配置於該外裝罩的外側。Such as the lighting device of any one of claims 2 to 4, wherein: It also has an outer cover to control the light distribution of the light emitted by the light-emitting module in a predetermined direction; In a plan view of the lighting device, at least a part of the first region is arranged outside the exterior cover. 如請求項1至4中任一項的照明裝置，其中， 該傾斜部，在由該第2區域朝向該第1區域之方向上，與該安裝基板的距離逐漸增大。Such as the lighting device of any one of claims 1 to 4, wherein: The distance between the inclined portion and the mounting board gradually increases in the direction from the second area to the first area. 如請求項3或4的照明裝置，其中， 該控制區域所安裝之該1個以上的控制電路零件之每單位面積密度，大於該第1區域及該第2區域所安裝之該1個以上的控制電路零件之每單位面積密度； 該第1區域所安裝之該1個以上的附引線電路零件之每單位面積密度，大於該控制區域所安裝之該1個以上的附引線電路零件之每單位面積密度。Such as the lighting device of claim 3 or 4, wherein, The density per unit area of the one or more control circuit components installed in the control area is greater than the density per unit area of the one or more control circuit components installed in the first area and the second area; The density per unit area of the one or more circuit components with leads installed in the first area is greater than the density per unit area of the one or more circuit components with leads installed in the control area. 一種照明裝置，具有將光射出之發光模組； 該照明裝置具備： 1個以上的附引線電路零件，用以使該發光模組點燈； 1個以上的晶片電路零件，至少包含該發光模組； 安裝基板，具有：安裝該1個以上的附引線電路零件之第1區域、及安裝該1個以上的晶片電路零件且不和該第1區域重疊之區域即第2區域； 殼體，容納該1個以上的附引線電路零件、該1個以上的晶片電路零件及該安裝基板； 該第1區域所安裝之該1個以上的附引線電路零件之每單位面積密度，大於該第2區域所安裝之該1個以上的附引線電路零件之每單位面積密度； 該第2區域所安裝之該1個以上的晶片電路零件之每單位面積密度，大於該第1區域所安裝之該1個以上的晶片電路零件之每單位面積密度； 該殼體具有傾斜部，該傾斜部以使該1個以上的附引線電路零件之容納空間縮小的方式傾斜。A lighting device having a light emitting module that emits light; The lighting device has: One or more leaded circuit parts for lighting the light-emitting module; One or more chip circuit components, including at least the light-emitting module; The mounting substrate has: a first area where the one or more leaded circuit components are installed, and an area where the one or more chip circuit components are installed and does not overlap the first area, that is, the second area; The housing contains the one or more leaded circuit components, the one or more chip circuit components, and the mounting substrate; The density per unit area of the one or more circuit parts with leads installed in the first area is greater than the density per unit area of the one or more circuit parts with leads installed in the second area; The density per unit area of the one or more chip circuit components installed in the second area is greater than the density per unit area of the one or more chip circuit components installed in the first area; The housing has an inclined portion, and the inclined portion is inclined so as to reduce an accommodation space of the one or more leaded circuit components.
TW109104432A 2019-02-18 2020-02-13 Lighting device includes one or more leaded circuit components, one or more chip circuit components, a mounting substrate 61, a first housing 31, and a second housing 32 TW202035915A (en)

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