JP2020136022A - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
JP2020136022A
JP2020136022A JP2019026511A JP2019026511A JP2020136022A JP 2020136022 A JP2020136022 A JP 2020136022A JP 2019026511 A JP2019026511 A JP 2019026511A JP 2019026511 A JP2019026511 A JP 2019026511A JP 2020136022 A JP2020136022 A JP 2020136022A
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Prior art keywords
lighting device
circuit components
region
light emitting
axis
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JP2019026511A
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JP7411947B2 (en
Inventor
範男 伊藤
Norio Ito
範男 伊藤
寿光 車谷
Hisamitsu Kurumaya
寿光 車谷
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2019026511A priority Critical patent/JP7411947B2/en
Priority to CN202010084022.6A priority patent/CN111649272A/en
Priority to TW109104432A priority patent/TW202035915A/en
Publication of JP2020136022A publication Critical patent/JP2020136022A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/04—Recessed bases
    • F21V21/047—Mounting arrangements with fastening means engaging the inner surface of a hole in a ceiling or wall, e.g. for solid walls or for blind holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0025—Combination of two or more reflectors for a single light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

To provide a lighting device which can suppress influence given to a lead-attached circuit component by heat generated by a light-emitting module, and upsizing of which can be suppressed.SOLUTION: A lighting device 1 incudes at least one lead-attached circuit component, at least one chip circuit component, a mounting substrate 61, a first casing 31 and a second casing 32. Density per unit area of at least one lead-attached circuit component mounted on a first area E1 is larger than density per unit area of at least one lead-attached circuit component mounted on a second area E2. Density per unit area of at least one chip circuit component mounted on the second area E2 is larger than density per unit area of at least one chip circuit component mounted on the first area E1. The first casing 31 and the second casing 32 each includes an inclination part 32a2 narrowing a space where at least one lead-attached circuit component is housed toward a direction opposite to a direction of emitting light emitted by the lighting device 1.SELECTED DRAWING: Figure 3

Description

本開示は、照明装置に関する。 The present disclosure relates to a lighting device.

従来の照明装置として特許文献１には、電源回路素子を実装した電源基板と、光源を実装した基板と、電源回路素子を実装した電源基板及び光源を実装した基板を収容する矩形状のユニットカバーとを有する天井埋め込み型の照明装置が開示されている。 As a conventional lighting device, Patent Document 1 describes a rectangular unit cover that houses a power supply board on which a power supply circuit element is mounted, a board on which a light source is mounted, a power supply board on which a power supply circuit element is mounted, and a board on which a light source is mounted. A ceiling-embedded lighting device having the above is disclosed.

特開２０１８−１９８１４１号公報JP-A-2018-198141

従来の照明装置では、電源回路素子であるリード付き回路部品を実装する電源基板と、光源を実装する基板とはそれぞれ異なる基板である。これを１つの基板にそれぞれ実装する場合、光源が発する熱がリード付き回路部品に影響を与えてしまうことがある。また、それぞれが異なる基板であるため、収容空間が大きくなり、ユニットカバーが大型化してしまうことがある。 In a conventional lighting device, a power supply board on which a circuit component with a lead, which is a power supply circuit element, is mounted, and a board on which a light source is mounted are different boards. When this is mounted on one board, the heat generated by the light source may affect the circuit components with leads. Further, since each is a different substrate, the accommodation space becomes large, and the unit cover may become large.

そこで、発光モジュールの発する熱がリード付き回路部品に与える影響を抑制することができるとともに、照明装置の大型化を抑制することができる照明装置を提供することを目的とする。 Therefore, it is an object of the present invention to provide a lighting device capable of suppressing the influence of heat generated by a light emitting module on a circuit component with a lead and suppressing an increase in size of the lighting device.

上記目的を達成するために、本開示に係る照明装置の一態様は、光を出射する照明装置であって、１以上のリード付き回路部品と、１以上のチップ回路部品と、第１領域に前記１以上のリード付き回路部品が実装され、かつ、前記第１領域と異なる第２領域に前記１以上のチップ回路部品が実装される実装基板と、前記１以上のリード付き回路部品及び前記１以上のチップ回路部品を覆う筐体とを備え、前記第１領域に実装される前記１以上のリード付き回路部品の単位面積当たりの密度は、前記第２領域に実装される前記１以上のリード付き回路部品の単位面積当たりの密度よりも大きく、前記第２領域に実装される前記１以上のチップ回路部品の単位面積当たりの密度は、前記第１領域に実装される前記１以上のチップ回路部品の単位面積当たりの密度よりも大きく、前記筐体は、当該照明装置が出射する光の出射方向と反対方向に向かって前記１以上のリード付き回路部品を収容する空間を狭める傾斜部を有する。 In order to achieve the above object, one aspect of the lighting device according to the present disclosure is a lighting device that emits light, which includes one or more leaded circuit components, one or more chip circuit components, and a first region. A mounting board on which one or more leaded circuit components are mounted and one or more chip circuit components are mounted in a second region different from the first region, one or more leaded circuit components, and the first The density per unit area of the circuit component with one or more leads mounted in the first region, which includes a housing covering the chip circuit components, is such that the one or more leads mounted in the second region. The density per unit area of the one or more chip circuit components mounted in the second region is larger than the density per unit area of the attached circuit components, and the density per unit area of the one or more chip circuits mounted in the first region is The housing has an inclined portion that is larger than the density per unit area of the component and narrows the space for accommodating the one or more leaded circuit components in a direction opposite to the emission direction of the light emitted by the lighting device. ..

本開示に係る照明装置では、発光モジュールの発する熱がリード付き回路部品に与える影響を抑制することができるとともに、照明装置の大型化を抑制することができる。 In the lighting device according to the present disclosure, it is possible to suppress the influence of the heat generated by the light emitting module on the circuit components with leads, and it is possible to suppress the increase in size of the lighting device.

図１は、実施の形態に係る照明装置を例示する斜視図である。FIG. 1 is a perspective view illustrating the lighting device according to the embodiment. 図２は、実施の形態に係る照明装置の分解斜視図である。FIG. 2 is an exploded perspective view of the lighting device according to the embodiment. 図３は、図１のＩＩＩ−ＩＩＩ線における、照明装置の断面を見た断面図である。FIG. 3 is a cross-sectional view of the illuminating device in lines III-III of FIG. 図４は、実施の形態に係る照明装置をＸ軸マイナス方向側から平面視した平面図である。FIG. 4 is a plan view of the lighting device according to the embodiment as viewed from the minus direction side of the X-axis. 図５は、照明装置の基板における第１領域及び第２領域を示す模式図である。FIG. 5 is a schematic view showing a first region and a second region on the substrate of the lighting device.

以下では、本開示の実施の形態について、図面を用いて詳細に説明する。なお、以下に説明する実施の形態は、いずれも本開示の一具体例を示すものである。したがって、以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置及び接続形態等は、一例であり、本開示を限定する趣旨ではない。よって、以下の実施の形態における構成要素のうち、本開示の最上位概念を示す独立請求項に記載されていない構成要素については、任意の構成要素として説明される。 Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. It should be noted that all of the embodiments described below show a specific example of the present disclosure. Therefore, the numerical values, shapes, materials, components, arrangement of components, connection forms, etc. shown in the following embodiments are examples, and are not intended to limit the present disclosure. Therefore, among the components in the following embodiments, the components not described in the independent claims indicating the highest level concept of the present disclosure will be described as arbitrary components.

また、各図は、模式図であり、必ずしも厳密に図示されたものではない。したがって、例えば、各図において縮尺等は必ずしも一致しない。また、各図において、実質的に同一の構成については同一の符号を付しており、重複する説明は省略又は簡略化する。 Further, each figure is a schematic view and is not necessarily exactly illustrated. Therefore, for example, the scales and the like do not always match in each figure. Further, in each figure, substantially the same configuration is designated by the same reference numerals, and duplicate description will be omitted or simplified.

また、以下の実施の形態において、略平行等の表現を用いている。例えば、略平行は、完全に平行であることを意味するだけでなく、実質的に平行である、すなわち、例えば数％程度の誤差を含むことも意味する。また、略平行は、本開示による効果を奏し得る範囲において平行という意味である。他の「略」を用いた表現についても同様である。 Further, in the following embodiments, expressions such as substantially parallel are used. For example, substantially parallel not only means that they are perfectly parallel, but also that they are substantially parallel, that is, they include an error of, for example, about several percent. In addition, substantially parallel means parallel to the extent that the effects of the present disclosure can be achieved. The same applies to expressions using other "abbreviations".

まず、本実施の形態に係る照明装置について説明する。 First, the lighting device according to the present embodiment will be described.

（実施の形態）
［構成］
図１は、実施の形態に係る照明装置１を例示する斜視図である。図１では、照明装置１において、照明装置１（具体的には後述する発光モジュール６２）から出射する光の出射方向をＸ軸プラス方向（例えば、照明装置１の下側）と規定し、器具本体３の一部が光軸と直交する方向に突出する外径方向をＹ軸プラス方向と規定し、Ｘ軸プラス方向及びＹ軸プラス方向と交差する方向をＺ軸プラス方向と規定する。そして、図２以降の各図に示す各方向は、図１に示す各方向に対応させて表示する。 (Embodiment)
[Constitution]
FIG. 1 is a perspective view illustrating the lighting device 1 according to the embodiment. In FIG. 1, in the lighting device 1, the emission direction of the light emitted from the lighting device 1 (specifically, the light emitting module 62 described later) is defined as the X-axis plus direction (for example, the lower side of the lighting device 1). The outer radial direction in which a part of the main body 3 protrudes in the direction orthogonal to the optical axis is defined as the Y-axis plus direction, and the direction intersecting the X-axis plus direction and the Y-axis plus direction is defined as the Z-axis plus direction. Then, each direction shown in each figure after FIG. 2 is displayed corresponding to each direction shown in FIG.

［照明装置１］
図１に示すように、照明装置１は、天井等の造営材に取付けられる装置である。例えば、照明装置１は、スポットライト、ダウンライト等である。照明装置１は、所定の方向に向けて光を照射することで所定方向を照明することができる装置である。 [Lighting device 1]
As shown in FIG. 1, the lighting device 1 is a device attached to a construction material such as a ceiling. For example, the lighting device 1 is a spotlight, a downlight, or the like. The lighting device 1 is a device capable of illuminating a predetermined direction by irradiating light in a predetermined direction.

図２は、実施の形態に係る照明装置１の分解斜視図である。図３は、図１のＩＩＩ−ＩＩＩ線における、照明装置１の断面を見た断面図である。図２及び図３に示すように、照明装置１は、器具本体３と、一対の板バネ７０と、実装基板６１と、発光モジュール６２と、照明制御部６９と、電源部６３と、ホルダ５１と、セード部５４と、透光カバー５５とを有する。 FIG. 2 is an exploded perspective view of the lighting device 1 according to the embodiment. FIG. 3 is a cross-sectional view of the illuminating device 1 in lines III-III of FIG. As shown in FIGS. 2 and 3, the lighting device 1 includes an appliance main body 3, a pair of leaf springs 70, a mounting board 61, a light emitting module 62, a lighting control unit 69, a power supply unit 63, and a holder 51. And a shade portion 54, and a translucent cover 55.

＜器具本体３＞
器具本体３は、照明装置１の外殻を構成する。器具本体３の一部は、発光モジュール６２が出射する光の光軸方向と交差する方向（Ｙ軸プラス方向）に突出する。つまり、照明装置１を造営材の取付孔に取付けた際に、器具本体３の一部は、天井に沿って延びる。ここでいう光軸とは、発光モジュール６２が出射する光の主たる軸である。光軸方向とは、Ｘ軸方向と略平行である。 <Instrument body 3>
The fixture body 3 constitutes the outer shell of the lighting device 1. A part of the instrument main body 3 projects in a direction (Y-axis plus direction) intersecting the optical axis direction of the light emitted by the light emitting module 62. That is, when the lighting device 1 is attached to the mounting hole of the construction material, a part of the fixture main body 3 extends along the ceiling. The optical axis referred to here is the main axis of light emitted by the light emitting module 62. The optical axis direction is substantially parallel to the X-axis direction.

図１に示すように、器具本体３は、第１筐体３１と、第２筐体３２と、外装カバー４０とを有する。 As shown in FIG. 1, the instrument main body 3 has a first housing 31, a second housing 32, and an exterior cover 40.

＜第１筐体３１及び第２筐体３２＞
第１筐体３１及び第２筐体３２は、実装基板６１、発光モジュール６２、及び、電源部６３を収容する収容体を構成する。第１筐体３１及び第２筐体３２がネジ等の固定部材で固定されることによって形成される収容空間は、発光モジュール６２が配置される側が小さい第１空間を形成し、電源部６３が配置される空間が、第１空間よりも大きく膨出した第２空間を形成する。第１筐体３１及び第２筐体３２のそれぞれは、筐体の一例である。 <First housing 31 and second housing 32>
The first housing 31 and the second housing 32 form an accommodating body for accommodating the mounting board 61, the light emitting module 62, and the power supply unit 63. The accommodation space formed by fixing the first housing 31 and the second housing 32 with a fixing member such as a screw forms a first space on which the side on which the light emitting module 62 is arranged is small, and the power supply unit 63 The space to be arranged forms a second space that bulges larger than the first space. Each of the first housing 31 and the second housing 32 is an example of a housing.

図４は、実施の形態に係る照明装置１を第１筐体３１側から平面視した平面図である。図２及び図４に示すように、第１筐体３１及び第２筐体３２は、照明装置１をＸ軸プラス方向側から（光軸方向に沿って）平面視した場合に、円筒状の外装カバー４０の外周面よりも外径方向に突出する。言い換えれば、照明装置１が造営材の取付孔に取付けられた場合、第１筐体３１及び第２筐体３２は、外装カバー４０の外周面から、造営材に沿って外径方向に延びている。ここで外径方向は、Ｙ軸プラス方向である。このことから、第１筐体３１及び第２筐体３２のＹ軸方向の長さは、外装カバー４０の半径よりも大きい。 FIG. 4 is a plan view of the lighting device 1 according to the embodiment as viewed from the first housing 31 side. As shown in FIGS. 2 and 4, the first housing 31 and the second housing 32 have a cylindrical shape when the lighting device 1 is viewed in a plan view (along the optical axis direction) from the X-axis plus direction side. It projects in the outer diameter direction from the outer peripheral surface of the exterior cover 40. In other words, when the lighting device 1 is attached to the mounting hole of the building material, the first housing 31 and the second housing 32 extend from the outer peripheral surface of the exterior cover 40 in the outer diameter direction along the building material. There is. Here, the outer diameter direction is the Y-axis plus direction. From this, the lengths of the first housing 31 and the second housing 32 in the Y-axis direction are larger than the radius of the exterior cover 40.

図１及び図３に示すように、第１筐体３１は、収容体の底部を構成する。第１筐体３１は、Ｙ軸方向に長尺であり、外装カバー４０の外周面から突出するように、Ｙ軸プラス方向に延びる。また、第１筐体３１は、金属製であり、例えば、アルミニウム、又は鉄等を主成分とした板金を折り曲げ加工して形成される。 As shown in FIGS. 1 and 3, the first housing 31 constitutes the bottom of the housing. The first housing 31 is elongated in the Y-axis direction and extends in the Y-axis plus direction so as to project from the outer peripheral surface of the exterior cover 40. The first housing 31 is made of metal, and is formed by bending a sheet metal containing, for example, aluminum or iron as a main component.

第１筐体３１は、底板部３１ａと、一対の第１取付部３１ｂとを有する。 The first housing 31 has a bottom plate portion 31a and a pair of first mounting portions 31b.

底板部３１ａは、第２筐体３２及び外装カバー４０を所定の姿勢で固定する、Ｙ軸方向に長尺な平板である。底板部３１ａのＹ軸マイナス方向には、底板部３１ａの両端縁の一部からＺ軸方向に張り出すように延びる一対の延出片３１ａ２が形成される。一対の延出片３１ａ２の端縁は、Ｙ軸方向に対して斜めに張り出している。 The bottom plate portion 31a is a flat plate elongated in the Y-axis direction that fixes the second housing 32 and the exterior cover 40 in a predetermined posture. In the Y-axis minus direction of the bottom plate portion 31a, a pair of extension pieces 31a2 extending from a part of both end edges of the bottom plate portion 31a so as to project in the Z-axis direction are formed. The edges of the pair of extension pieces 31a2 project diagonally with respect to the Y-axis direction.

また、一対の延出片３１ａ２の間には、発光モジュール６２を露出させるための開口３１ａ１が底板部３１ａに形成される。開口３１ａ１は、底板部３１ａのＹ軸マイナス方向に形成される。 Further, an opening 31a1 for exposing the light emitting module 62 is formed in the bottom plate portion 31a between the pair of extension pieces 31a2. The opening 31a1 is formed in the Y-axis minus direction of the bottom plate portion 31a.

図１及び図２に示すように、一対の第１取付部３１ｂは、底板部３１ａにおけるＹ軸マイナス方向側に配置され、外装カバー４０の外周側に位置し、底板部３１ａの開口３１ａ１の両側に設けられる。一対の第１取付部３１ｂは、底板部３１ａの一対の延出片３１ａ２と一対一で対応するように、第１筐体３１に一体的に設けられる。一対の第１取付部３１ｂは、一対の延出片３１ａ２の端縁に接続されるため、照明装置１をＸ軸マイナス方向側から（光軸方向に沿って）平面視した場合に、板バネ７０を取付けるための外周側の表面３１ｂ２がＸ−Ｙ平面に対して傾く。一対の第１取付部３１ｂの表面３１ｂ２は、後述する板バネ７０の第２取付部７１と対向する面である。 As shown in FIGS. 1 and 2, the pair of first mounting portions 31b are arranged on the Y-axis minus direction side of the bottom plate portion 31a, are located on the outer peripheral side of the exterior cover 40, and are both sides of the opening 31a1 of the bottom plate portion 31a. It is provided in. The pair of first mounting portions 31b are integrally provided on the first housing 31 so as to correspond one-to-one with the pair of extension pieces 31a2 of the bottom plate portion 31a. Since the pair of first mounting portions 31b are connected to the end edges of the pair of extension pieces 31a2, the leaf spring is viewed in a plan view from the minus direction side of the X axis (along the optical axis direction). The outer peripheral surface 31b2 for mounting the 70 is tilted with respect to the XY plane. The surface 31b2 of the pair of first mounting portions 31b is a surface facing the second mounting portion 71 of the leaf spring 70, which will be described later.

図４に示すように、照明装置１をＸ軸マイナス方向側（例えば、照明装置１の上側）から平面視した場合において、一対の第１取付部３１ｂのうちの少なくとも一方の第１取付部３１ｂと他方の第１取付部３１ｂとは、器具本体３の中心である中心線Ｏに対して点対称に配置される。一対の第１取付部３１ｂは、その並びがＺ軸方向及びＹ軸方向に対して、所定の角度だけ傾くように配置される。本実施の形態では、一対の第１取付部３１ｂのうちの少なくとも一方の第１取付部３１ｂが、照明装置１をＸ軸マイナス方向側から平面視した場合、照明装置１の光軸（光軸方向）と略一致する中心線Ｏを含むＺ軸方向と平行な線よりもＹ軸プラス方向側の領域において、Ｙ軸プラス方向の線からＺ軸プラス方向の線までの間の領域、又は、Ｙ軸プラス方向の線からＺ軸マイナス方向（第２方向の一例）の線までの間の領域に配置される。つまり、器具本体３の一部がＹ軸プラス方向に延びているため、中心線ＯからＹ軸プラス方向に照明装置１の重心Ｈがズレている。重心Ｈがズレているということは、照明装置１を造営材の取付孔に取付けた際に、造営材の取付孔に偏荷重がかかることになる。このような照明装置１において、一対の第１取付部３１ｂのうちの少なくとも一方の第１取付部３１ｂは、このズレた重心Ｈを支持するように配置される。 As shown in FIG. 4, when the lighting device 1 is viewed in a plan view from the X-axis minus direction side (for example, the upper side of the lighting device 1), at least one of the pair of first mounting portions 31b is the first mounting portion 31b. And the other first mounting portion 31b are arranged point-symmetrically with respect to the center line O which is the center of the instrument main body 3. The pair of first mounting portions 31b are arranged so that their arrangement is inclined by a predetermined angle with respect to the Z-axis direction and the Y-axis direction. In the present embodiment, when at least one of the first mounting portions 31b of the pair of first mounting portions 31b views the lighting device 1 in a plan view from the minus direction side of the X axis, the optical axis (optical axis) of the lighting device 1 In the region on the Y-axis plus direction side of the line parallel to the Z-axis direction including the center line O that substantially coincides with the direction), the region between the Y-axis plus direction line and the Z-axis plus direction line, or It is arranged in the region between the line in the positive direction of the Y axis and the line in the negative direction of the Z axis (an example of the second direction). That is, since a part of the fixture main body 3 extends in the positive direction of the Y axis, the center of gravity H of the lighting device 1 is displaced from the center line O in the positive direction of the Y axis. The fact that the center of gravity H is deviated means that when the lighting device 1 is attached to the mounting hole of the building material, an eccentric load is applied to the mounting hole of the building material. In such a lighting device 1, at least one of the pair of first mounting portions 31b, the first mounting portion 31b, is arranged so as to support the displaced center of gravity H.

なお、一対の第１取付部３１ｂのうちの他方の第１取付部３１ｂも、さらに、Ｙ軸プラス方向の線からＺ軸マイナス方向の線までの間の領域、又は、Ｙ軸プラス方向の線とＺ軸プラス方向の線との間の領域に配置されてもよい。 The other first mounting portion 31b of the pair of first mounting portions 31b is also a region between the Y-axis plus direction line and the Z-axis minus direction line, or the Y-axis plus direction line. It may be arranged in the region between the Z-axis plus the line.

また、一対の第１取付部３１ｂのうちの少なくとも一方の第１取付部３１ｂが、Ｙ軸プラス方向の線からＺ軸プラス方向の線までの間の領域、又は、Ｙ軸プラス方向の線からＺ軸マイナス方向の線までの間の領域に配置されていればよいため、一対の第１取付部３１ｂのうちの他方の第１取付部３１ｂが、中心線Ｏを含むＺ軸方向の線Ｖ２よりもＹ軸プラス方向側の領域以外の領域に配置されていてもよい。 Further, at least one of the first mounting portions 31b of the pair of first mounting portions 31b is from the region between the Y-axis plus direction line and the Z-axis plus direction line, or from the Y-axis plus direction line. Since it suffices to be arranged in the region up to the line in the minus direction of the Z axis, the other first mounting portion 31b of the pair of first mounting portions 31b is the line V2 in the Z axis direction including the center line O. It may be arranged in a region other than the region on the positive side of the Y-axis.

図２及び図３に示すように、第２筐体３２は、収容体の天板部分を構成する。つまり、第２筐体３２は、第１筐体３１のＸ軸マイナス方向側に配置される。第２筐体３２は、実装基板６１及び電源部６３を覆うカバーとしての役割を果たす。また、第２筐体３２は、金属製であり、例えば、アルミニウム、又は鉄等を主成分とした板金を折り曲げ加工して形成される。 As shown in FIGS. 2 and 3, the second housing 32 constitutes a top plate portion of the housing. That is, the second housing 32 is arranged on the X-axis minus direction side of the first housing 31. The second housing 32 serves as a cover that covers the mounting board 61 and the power supply unit 63. The second housing 32 is made of metal, and is formed by bending a sheet metal containing, for example, aluminum or iron as a main component.

第２筐体３２は、チップ回路部品よりも背の高いリード付き回路部品で構成される電源部６３を回避するように、Ｘ軸マイナス方向に上る段部を有する。第２筐体３２は、段部によって、電源部６３に対応する部分がＸ軸マイナス方向に膨出する形状である。 The second housing 32 has a step portion that rises in the minus direction of the X-axis so as to avoid a power supply unit 63 composed of a circuit component with a lead that is taller than the chip circuit component. The second housing 32 has a shape in which a portion corresponding to the power supply portion 63 bulges in the minus direction of the X-axis due to the step portion.

具体的には、第２筐体３２は、天板３２ａと、立壁部３２ｂとを有する。 Specifically, the second housing 32 has a top plate 32a and a standing wall portion 32b.

天板３２ａは、第１天板部３２ａ１と、傾斜部３２ａ２と、第２天板部３２ａ３とを有する。 The top plate 32a has a first top plate portion 32a1, an inclined portion 32a2, and a second top plate portion 32a3.

第１天板部３２ａ１は、実装基板６１を固定するための取付け面部である。照明装置１をＸ軸マイナス方向側から平面視した場合に、第１天板部３２ａ１は、発光モジュール６２及び照明制御部６９を構成するチップ回路部品が実装基板６１に実装される第２領域Ｅ２と重なる。 The first top plate portion 32a1 is a mounting surface portion for fixing the mounting board 61. When the lighting device 1 is viewed in a plan view from the minus direction side of the X-axis, the first top plate portion 32a1 has a second region E2 in which the chip circuit components constituting the light emitting module 62 and the lighting control unit 69 are mounted on the mounting board 61. Overlaps with.

傾斜部３２ａ２は、第１天板部３２ａ１のＹ軸プラス方向側の端縁に接続される。傾斜部３２ａ２は、当該照明装置１が出射する光の出射方向（Ｘ軸プラス方向）と反対方向に向かって１以上のリード付き回路部品を収容する空間を狭める。つまり、傾斜部３２ａ２は、Ｘ軸マイナス方向に向かって上り傾斜している。照明装置１をＸ軸マイナス方向側から平面視した場合に、傾斜部３２ａ２は、チップ回路部品の制御回路部品が実装基板６１に実装される制御領域Ｅ２ｂと重なる。 The inclined portion 32a2 is connected to the end edge of the first top plate portion 32a1 on the Y-axis plus direction side. The inclined portion 32a2 narrows a space for accommodating one or more leaded circuit components in a direction opposite to the emission direction (X-axis plus direction) of the light emitted by the lighting device 1. That is, the inclined portion 32a2 is inclined upward in the minus direction of the X axis. When the lighting device 1 is viewed in a plan view from the minus direction side of the X-axis, the inclined portion 32a2 overlaps with the control region E2b on which the control circuit component of the chip circuit component is mounted on the mounting board 61.

第２天板部３２ａ３は、傾斜部３２ａ２のＹ軸プラス方向側の端縁に接続される。照明装置１をＸ軸マイナス方向側から平面視した場合に、第２天板部３２ａ３は、電源部６３が実装基板６１に実装される第１領域Ｅ１と重なる。 The second top plate portion 32a3 is connected to the end edge of the inclined portion 32a2 on the Y-axis plus direction side. When the lighting device 1 is viewed in a plan view from the minus direction side of the X axis, the second top plate portion 32a3 overlaps with the first region E1 in which the power supply portion 63 is mounted on the mounting board 61.

このように、第１天板部３２ａ１、傾斜部３２ａ２、及び、第２天板部３２ａ３が段部を構成する。 In this way, the first top plate portion 32a1, the inclined portion 32a2, and the second top plate portion 32a3 form the step portion.

立壁部３２ｂは、第２天板部３２ａ３からＸ軸プラス方向に立ち上がる壁部である。立壁部３２ｂには、電源部６３に交流電流を供給するための電源コネクタ３９が固定される。電源コネクタ３９は、電源部６３と配線により電気的に接続され、商用電源から供給される交流電流を電源部６３に供給する。電源コネクタ３９は、器具本体３の構成に含まれていてもよい。 The vertical wall portion 32b is a wall portion that rises from the second top plate portion 32a3 in the plus direction of the X axis. A power connector 39 for supplying an alternating current to the power supply unit 63 is fixed to the vertical wall portion 32b. The power connector 39 is electrically connected to the power supply unit 63 by wiring, and supplies an alternating current supplied from a commercial power source to the power supply unit 63. The power connector 39 may be included in the configuration of the instrument body 3.

＜外装カバー４０＞
外装カバー４０は、Ｘ軸方向の両側で開口した中空の円錐台状の外殻である。外装カバー４０のＸ軸マイナス方向側の端部は、第１筐体３１における底板部３１ａの開口３１ａ１の周囲を囲むように、ネジ等の固定部材により第１筐体３１に固定される。外装カバー４０の内部は、発光モジュール６２が発する光が通過する。 <Exterior cover 40>
The exterior cover 40 is a hollow truncated cone-shaped outer shell that is open on both sides in the X-axis direction. The end portion of the exterior cover 40 on the negative direction side of the X-axis is fixed to the first housing 31 by a fixing member such as a screw so as to surround the periphery of the opening 31a1 of the bottom plate portion 31a in the first housing 31. The light emitted by the light emitting module 62 passes through the inside of the exterior cover 40.

外装カバー４０は、筒部４１と、枠部４２とを有する。 The exterior cover 40 has a tubular portion 41 and a frame portion 42.

筒部４１は、円錐台状の外装部分である。筒部４１は、Ｘ軸マイナス方向からＸ軸プラス方向に向かって大径になる。筒部４１の中心線は、上述の中心線Ｏと略一致する。筒部４１の直径は、造営材の取付孔の直径よりも小さい。 The tubular portion 41 is a truncated cone-shaped exterior portion. The diameter of the tubular portion 41 increases from the minus direction of the X axis toward the plus direction of the X axis. The center line of the tubular portion 41 substantially coincides with the above-mentioned center line O. The diameter of the tubular portion 41 is smaller than the diameter of the mounting hole of the construction material.

筒部４１の内部は、発光モジュール６２が発する光が通過する。筒部４１の内周面は、透光カバー５５から出射した光を所定方向に配光制御するための光反射カバーとしての役割を果たす。 The light emitted by the light emitting module 62 passes through the inside of the tubular portion 41. The inner peripheral surface of the tubular portion 41 serves as a light reflection cover for controlling the light distribution in a predetermined direction of the light emitted from the light transmitting cover 55.

枠部４２は、照明装置１が取付けられる天井板等の造営材を保持する円環状の鍔である。枠部４２は、筒部４１の下端縁（Ｘ軸プラス方向の端縁）から外径方向に延びる。枠部４２の外径は、照明装置１が取付けられる造営材の取付孔の内径よりも大きい。枠部４２と一対の板バネ７０とは、造営材を挟持することで、照明装置１を造営材に安定的に固定する。 The frame portion 42 is an annular collar that holds a building material such as a ceiling plate to which the lighting device 1 is attached. The frame portion 42 extends in the outer diameter direction from the lower end edge (end edge in the X-axis plus direction) of the tubular portion 41. The outer diameter of the frame portion 42 is larger than the inner diameter of the mounting hole of the construction material to which the lighting device 1 is mounted. The frame portion 42 and the pair of leaf springs 70 sandwich the building material to stably fix the lighting device 1 to the building material.

＜板バネ７０＞
一対の板バネ７０は、造営材に形成された取付孔に照明装置１を取付けて固定するための弾性部材であり、外装カバー４０の外周側に配置される。一対の板バネ７０は、第１筐体３１の一対の第１取付部３１ｂに一対一で取付けられる。一対の板バネ７０は、外装カバー４０の枠部４２とによって、造営材を挟持する。板バネ７０は、バネの一例である。 <Leaf spring 70>
The pair of leaf springs 70 are elastic members for mounting and fixing the lighting device 1 in the mounting holes formed in the construction material, and are arranged on the outer peripheral side of the exterior cover 40. The pair of leaf springs 70 are mounted one-to-one on the pair of first mounting portions 31b of the first housing 31. The pair of leaf springs 70 sandwich the construction material with the frame portion 42 of the exterior cover 40. The leaf spring 70 is an example of a spring.

なお、板バネ７０は、照明装置１に３つ以上設けられていてもよい。 In addition, three or more leaf springs 70 may be provided in the lighting device 1.

一対の板バネ７０は、例えば鋼材等の金属材料で形成される。また、一対の板バネ７０の板厚及び幅は、一対の板バネ７０を形成する材料のヤング率、照明装置１の重量等に応じて、照明装置１を造営材に安定的に固定できるように適宜定められる。なお、一対の板バネ７０の代わりに、線バネでもよく、他の公知のバネを用いてもよい。 The pair of leaf springs 70 are formed of a metal material such as a steel material. Further, the thickness and width of the pair of leaf springs 70 are adjusted so that the lighting device 1 can be stably fixed to the construction material according to the Young's modulus of the material forming the pair of leaf springs 70, the weight of the lighting device 1, and the like. It is determined as appropriate. Instead of the pair of leaf springs 70, a wire spring may be used, or another known spring may be used.

図４に示すように、一対の板バネ７０は、第１筐体３１の第１取付部３１ｂの位置に応じて取付けられる。本実施の形態では、照明装置１をＸ軸マイナス方向側から平面視した場合に、一対の板バネ７０の後述するアーム部７２は、中心線Ｏから遠ざかるように延びる姿勢で配置される。 As shown in FIG. 4, the pair of leaf springs 70 are mounted according to the position of the first mounting portion 31b of the first housing 31. In the present embodiment, when the lighting device 1 is viewed in a plan view from the minus direction side of the X-axis, the arm portions 72 described later of the pair of leaf springs 70 are arranged in a posture extending away from the center line O.

また、一対の板バネ７０のうち、少なくとも一方の板バネ７０は、当該照明装置１をＸ軸マイナス方向側から平面視した場合に、中心線Ｏを含む平面であり、かつ、器具本体３の一部が突出する方向と直交する平面（Ｘ−Ｚ平面）よりも器具本体３の一部が突出する側（Ｙ軸プラス方向側）に配置される。つまり、一対の板バネ７０のうち、少なくとも一方の板バネ７０は、図４の直線Ｖ２よりもＹ軸プラス方向側に配置される。本実施の形態では、当該照明装置１をＸ軸マイナス方向側から平面視した場合に、中心線Ｏ及び重心Ｈを通る直線と中心線Ｏから少なくとも一方の板バネ７０が延びる方向の線との角度は、９０度以下である。 Further, at least one of the pair of leaf springs 70 is a plane including the center line O when the lighting device 1 is viewed in a plane from the minus direction side of the X axis, and the fixture main body 3 has a plane. It is arranged on the side (Y-axis plus direction side) where a part of the instrument main body 3 protrudes from the plane (XZ plane) orthogonal to the direction in which the part protrudes. That is, at least one of the pair of leaf springs 70 is arranged on the Y-axis plus direction side with respect to the straight line V2 in FIG. In the present embodiment, when the lighting device 1 is viewed in a plan view from the minus direction side of the X axis, a straight line passing through the center line O and the center of gravity H and a line in the direction in which at least one leaf spring 70 extends from the center line O. The angle is 90 degrees or less.

なお、上述の「直交」は、完全に直交であることを意味するだけでなく、実質的に直交である、すなわち、例えば数％程度の誤差を含むことも意味する。 The above-mentioned "orthogonal" not only means that it is completely orthogonal, but also means that it is substantially orthogonal, that is, it includes an error of, for example, about several percent.

一対の板バネ７０のそれぞれは、第２取付部７１と、アーム部７２とを有する。 Each of the pair of leaf springs 70 has a second mounting portion 71 and an arm portion 72.

第２取付部７１は、外装カバー４０の外周面に沿って配置される基端であり、Ｘ軸方向に延びる板状である。第２取付部７１は、第１筐体３１の第１取付部３１ｂに取付けられる。 The second mounting portion 71 is a base end arranged along the outer peripheral surface of the exterior cover 40, and has a plate shape extending in the X-axis direction. The second mounting portion 71 is mounted on the first mounting portion 31b of the first housing 31.

照明装置１をＸ軸マイナス方向側から平面視した場合に、第１取付部３１ｂの表面３１ｂ２がＸ−Ｙ平面に対して傾いているため、第２取付部７１もＸ−Ｙ平面に対して傾くように取付けられる。 When the illuminating device 1 is viewed in a plan view from the minus direction side of the X-axis, the surface 31b2 of the first mounting portion 31b is tilted with respect to the XY plane, so that the second mounting portion 71 is also relative to the XY plane. It is installed so that it tilts.

アーム部７２は、第２取付部７１のＸ軸プラス方向側の端縁と接続され、外装カバー４０の外周面から離れる方向に延びる板状の自由端である。照明装置１を造営材の取付孔に取付けた際、アーム部７２は、アーム部７２の復元力によって、造営材の取付孔に対してＸ軸プラス方向側に応力をかける。 The arm portion 72 is a plate-shaped free end that is connected to the end edge of the second mounting portion 71 on the X-axis positive direction side and extends in a direction away from the outer peripheral surface of the exterior cover 40. When the lighting device 1 is attached to the mounting hole of the building material, the arm portion 72 applies stress to the mounting hole of the building material in the positive direction of the X-axis by the restoring force of the arm portion 72.

照明装置１をＸ軸マイナス方向側から平面視した場合に、一対の板バネ７０のうちの少なくとも一方の板バネ７０のアーム部７２は、Ｙ軸プラス方向の線からＺ軸プラス方向の線までの間の領域に配置される。つまり、少なくとも一方の板バネ７０のアーム部７２は、上述のズレた重心Ｈを支持するように配置される。このため、少なくとも一方の板バネ７０は、器具本体３による偏荷重を支持する。 When the lighting device 1 is viewed in a plan view from the minus direction side of the X axis, the arm portion 72 of at least one leaf spring 70 of the pair of leaf springs 70 extends from the line in the plus direction of the Y axis to the line in the plus direction of the Z axis. Placed in the area between. That is, the arm portion 72 of at least one leaf spring 70 is arranged so as to support the above-mentioned displaced center of gravity H. Therefore, at least one leaf spring 70 supports the eccentric load by the instrument body 3.

また、照明装置１をＸ軸マイナス方向側から平面視した場合に、外装カバー４０の外周面から一方の板バネ７０のアーム部７２が延びる方向と、外装カバー４０から他方の板バネ７０のアーム部７２が延びる方向とは同一の直線上にある。 Further, when the lighting device 1 is viewed in a plan view from the minus direction side of the X-axis, the arm portion 72 of one leaf spring 70 extends from the outer peripheral surface of the exterior cover 40, and the arm of the other leaf spring 70 extends from the exterior cover 40. The portion 72 is on the same straight line as the extending direction.

＜実装基板６１＞
図２及び図３に示すように、実装基板６１は、発光モジュール６２及び電源部６３等の電源回路を構成する電子部品を実装する基板である。実装基板６１は、平面視において、Ｙ軸方向に長尺、かつ、矩形状である平面を有する板材である。実装基板６１は、発光モジュール６２が出射する光の光軸方向と交差する方向に延びる。 <Mounting board 61>
As shown in FIGS. 2 and 3, the mounting board 61 is a board on which electronic components constituting a power supply circuit such as a light emitting module 62 and a power supply unit 63 are mounted. The mounting substrate 61 is a plate material having a flat surface that is long and rectangular in the Y-axis direction in a plan view. The mounting board 61 extends in a direction intersecting the optical axis direction of the light emitted by the light emitting module 62.

実装基板６１は、例えばセラミックス基板、樹脂基板又は絶縁被覆されたメタルベース基板等である。実装基板６１には、発光モジュール６２を発光させるために、直流電力を電源部６３から受電する一対の電極端子（正電極端子及び負電極端子）が形成される（不図示）。電極端子は、基板のパターンを介して電源部６３に、電気的に接続される。 The mounting substrate 61 is, for example, a ceramic substrate, a resin substrate, an insulation-coated metal base substrate, or the like. A pair of electrode terminals (positive electrode terminal and negative electrode terminal) that receive DC power from the power supply unit 63 are formed on the mounting substrate 61 in order to cause the light emitting module 62 to emit light (not shown). The electrode terminals are electrically connected to the power supply unit 63 via a pattern on the substrate.

実装基板６１は、第２筐体３２の天板３２ａに、ネジ等の固定部材によって固定される。具体的には、照明装置１をＸ軸マイナス方向側から平面視した場合に、実装基板６１は、第２筐体３２の天板３２ａが外装カバー４０に重なる取付け面部に固定される。取付け面部はＹ−Ｚ軸方向と略平行であるため、実装基板６１もＹ−Ｚ軸方向と略平行に保持される。このように、実装基板６１は、取付け面部からＹ軸プラス方向に延びるように第１筐体３１及び第２筐体３２によって形成された収容空間に配置される。 The mounting board 61 is fixed to the top plate 32a of the second housing 32 by a fixing member such as a screw. Specifically, when the lighting device 1 is viewed in a plan view from the negative direction side of the X-axis, the mounting board 61 is fixed to the mounting surface portion where the top plate 32a of the second housing 32 overlaps the exterior cover 40. Since the mounting surface portion is substantially parallel to the YZ axis direction, the mounting board 61 is also held substantially parallel to the YZ axis direction. In this way, the mounting board 61 is arranged in the accommodation space formed by the first housing 31 and the second housing 32 so as to extend from the mounting surface portion in the positive direction of the Y axis.

図５は、照明装置１の基板における第１領域Ｅ１及び第２領域Ｅ２を示す模式図である。 FIG. 5 is a schematic view showing a first region E1 and a second region E2 on the substrate of the lighting device 1.

図３及び図５に示すように、実装基板６１は、第１領域Ｅ１に１以上のリード付き回路部品を実装し、かつ、第１領域Ｅ１と異なる第２領域Ｅ２に１以上のチップ回路部品を実装する。１以上のリード付き回路部品には、発光モジュール６２及び１以上の制御回路部品が含まれる。第１領域Ｅ１は、実装基板６１におけるＹ軸プラス方向側、かつ、Ｘ軸マイナス方向側の面に形成される。また、第２領域Ｅ２は、実装基板６１におけるＹ軸マイナス方向側、かつ、実装基板６１におけるＸ軸プラス方向側の面に形成される。 As shown in FIGS. 3 and 5, the mounting board 61 mounts one or more leaded circuit components in the first region E1 and has one or more chip circuit components in the second region E2 different from the first region E1. To implement. One or more leaded circuit components include a light emitting module 62 and one or more control circuit components. The first region E1 is formed on the Y-axis positive direction side and the X-axis negative direction side surface of the mounting substrate 61. Further, the second region E2 is formed on the Y-axis minus direction side of the mounting board 61 and the X-axis plus direction side of the mounting board 61.

また、第２領域Ｅ２は、発光モジュール６２を実装する発光領域Ｅ２ａと、制御回路部品を実装する制御領域Ｅ２ｂとに分かれる。制御領域Ｅ２ｂは、発光領域Ｅ２ａと第１領域Ｅ１との間に配置される。また、第１領域Ｅ１、発光領域Ｅ２ａ及び制御領域Ｅ２ｂは互いに重なっていない。 The second region E2 is divided into a light emitting region E2a on which the light emitting module 62 is mounted and a control region E2b on which the control circuit components are mounted. The control region E2b is arranged between the light emitting region E2a and the first region E1. Further, the first region E1, the light emitting region E2a, and the control region E2b do not overlap each other.

第１領域Ｅ１に実装される１以上のリード付き回路部品の単位面積当たりの密度は、第２領域Ｅ２に実装される１以上のリード付き回路部品の単位面積当たりの密度よりも大きい。つまり、第１領域Ｅ１には、１以上のリード付き回路部品が密集している。なお、第２領域Ｅ２には、リード付き回路部品だけが実装基板６１に実装されていてもよく、僅かにチップ回路部品が実装基板６１に実装されていてもよい。 The density per unit area of one or more leaded circuit components mounted in the first region E1 is higher than the density per unit area of one or more leaded circuit components mounted in the second region E2. That is, one or more leaded circuit components are densely packed in the first region E1. In the second region E2, only circuit components with leads may be mounted on the mounting board 61, or slightly chip circuit components may be mounted on the mounting board 61.

また、第２領域Ｅ２に実装される１以上のチップ回路部品の単位面積当たりの密度は、第１領域Ｅ１に実装される１以上のチップ回路部品の単位面積当たりの密度よりも大きい。つまり、第２領域Ｅ２には、１以上のチップ回路部品が密集している。なお、第２領域Ｅ２には、チップ回路部品だけが実装基板６１に実装されていてもよく、僅かにリード付き回路部品が実装基板６１に実装されていてもよい。 Further, the density per unit area of one or more chip circuit components mounted in the second region E2 is larger than the density per unit area of one or more chip circuit components mounted in the first region E1. That is, one or more chip circuit components are densely packed in the second region E2. In the second region E2, only the chip circuit components may be mounted on the mounting board 61, or the circuit components with leads may be slightly mounted on the mounting board 61.

＜発光モジュール６２＞
図２及び図３に示すように、発光モジュール６２は、所定の光を放射状に出射するＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）モジュールである。本実施の形態では、発光モジュール６２は、例えば白色光を出射するように構成される。例えば、発光モジュール６２は、ＣＯＢ（Ｃｈｉｐ Ｏｎ Ｂｏａｒｄ）型ＬＥＤで構成され、実装基板６１上に実装されたベアチップ（ＬＥＤチップ）である複数の青色ＬＥＤと、それら青色ＬＥＤを封止し、黄色蛍光体を含む封止部材とを備える。 <Light emitting module 62>
As shown in FIGS. 2 and 3, the light emitting module 62 is an LED (Light Emitting Diode) module that emits a predetermined light radially. In the present embodiment, the light emitting module 62 is configured to emit white light, for example. For example, the light emitting module 62 is composed of a COB (Chip On Board) type LED, and seals a plurality of blue LEDs which are bare chips (LED chips) mounted on the mounting substrate 61 and the blue LEDs to emit yellow fluorescence. It includes a sealing member including a body.

図３及び図５に示すように、発光モジュール６２は、実装基板６１における長手方向の他方側、つまり、Ｙ軸マイナス方向側に実装される。また、発光モジュール６２は、第１天板部３２ａ１と対向する側の実装基板６１の面、つまり、Ｘ軸プラス方向側の面に実装される。 As shown in FIGS. 3 and 5, the light emitting module 62 is mounted on the other side of the mounting substrate 61 in the longitudinal direction, that is, on the side in the minus direction of the Y axis. Further, the light emitting module 62 is mounted on the surface of the mounting substrate 61 on the side facing the first top plate portion 32a1, that is, the surface on the X-axis plus direction side.

このため、発光モジュール６２がＸ軸プラス方向に向けて出射する。発光モジュール６２が発する光は、後述するホルダ５１の開口部５２、セード部５４、透光カバー５５、外装カバー４０の筒部４１を通過し、周囲を照明する。 Therefore, the light emitting module 62 emits light in the positive direction of the X axis. The light emitted by the light emitting module 62 passes through the opening 52 of the holder 51, the shade portion 54, the translucent cover 55, and the tubular portion 41 of the exterior cover 40, which will be described later, and illuminates the surroundings.

＜照明制御部６９＞
照明制御部６９は、発光モジュール６２の発する光を調色及び調光制御するためのコントローラである。照明制御部６９は、発光モジュール６２を制御する１以上の制御回路部品である。１以上の制御回路部品は、マイコン等で構成される。 <Lighting control unit 69>
The illumination control unit 69 is a controller for toning and controlling the light emitted by the light emitting module 62. The illumination control unit 69 is one or more control circuit components that control the light emitting module 62. One or more control circuit components are composed of a microcomputer or the like.

照明制御部６９は、実装基板６１における第２領域Ｅ２の制御領域Ｅ２ｂに実装される。具体的には、照明制御部６９は、実装基板６１における第２領域Ｅ２の制御領域Ｅ２ｂに実装される。つまり、照明制御部６９は、発光モジュール６２と点灯回路６３ａとの間に実装される。 The illumination control unit 69 is mounted in the control region E2b of the second region E2 on the mounting board 61. Specifically, the illumination control unit 69 is mounted in the control region E2b of the second region E2 on the mounting board 61. That is, the lighting control unit 69 is mounted between the light emitting module 62 and the lighting circuit 63a.

制御領域Ｅ２ｂは、実装基板６１における、第２筐体３２の傾斜部３２ａ２と対応する位置である。つまり、照明装置１をＸ軸マイナス方向側から平面視した場合に、傾斜部３２ａ２と制御領域Ｅ２ｂとは重なる。 The control area E2b is a position on the mounting board 61 corresponding to the inclined portion 32a2 of the second housing 32. That is, when the lighting device 1 is viewed in a plan view from the minus direction side of the X axis, the inclined portion 32a2 and the control region E2b overlap each other.

＜電源部６３＞
電源部６３は、発光モジュール６２を点灯させるための電力を供給する点灯回路６３ａが内蔵された電源モジュールである。点灯回路６３ａは、電源部６３に接続された配線から供給された交流電流を直流電流に変換し、変換した直流電流を、基板のパターンを介して発光モジュール６２に供給する。 <Power supply unit 63>
The power supply unit 63 is a power supply module having a built-in lighting circuit 63a for supplying electric power for lighting the light emitting module 62. The lighting circuit 63a converts the alternating current supplied from the wiring connected to the power supply unit 63 into a direct current, and supplies the converted direct current to the light emitting module 62 via the pattern of the substrate.

点灯回路６３ａは、１以上のリード付き回路部品で構成される。リード付き回路部品は、例えば、電解コンデンサ、トランス、コイル等である。リード付き回路部品は、チップ回路部品よりも背が高い。 The lighting circuit 63a is composed of one or more leaded circuit components. Circuit components with leads are, for example, electrolytic capacitors, transformers, coils, and the like. Circuit components with leads are taller than chip circuit components.

点灯回路６３ａは、第１筐体３１及び第２筐体３２で構成される収容空間において、発光モジュール６２が実装基板６１に実装される面の反対側の面、つまり、Ｘ軸プラス方向側の面に実装される。また、点灯回路６３ａは、実装基板６１における長手方向の一方側、つまり、Ｙ軸プラス方向側に実装される。 The lighting circuit 63a is a surface opposite to the surface on which the light emitting module 62 is mounted on the mounting board 61 in the accommodation space composed of the first housing 31 and the second housing 32, that is, on the X-axis plus direction side. It is mounted on the surface. Further, the lighting circuit 63a is mounted on one side of the mounting board 61 in the longitudinal direction, that is, on the Y-axis plus direction side.

＜ホルダ５１＞
ホルダ５１は、ネジ等の固定部材によって実装基板６１に固定され、実装基板６１の位置を規制するリング状の支持部材である。 <Holder 51>
The holder 51 is a ring-shaped support member that is fixed to the mounting board 61 by a fixing member such as a screw and regulates the position of the mounting board 61.

ホルダ５１には、開口部５２と、複数のネジ孔とが形成される。 The holder 51 is formed with an opening 52 and a plurality of screw holes.

開口部５２は、発光モジュール６２を露出させるように、開口した部分である。開口部５２の開口面は、第１筐体３１における底板部３１ａの開口３１ａ１の開口面と重なるように対応する。 The opening 52 is a portion opened so as to expose the light emitting module 62. The opening surface of the opening 52 corresponds to overlap with the opening surface of the opening 31a1 of the bottom plate portion 31a in the first housing 31.

複数のネジ孔は、ホルダ５１を実装基板６１にネジ等の固定部材で固定するための孔である。具体的には、ホルダ５１は、第２筐体３２の取付け面部とで実装基板６１を挟んだ状態であり、実装基板６１を取付け面部に押さえつけるように、固定部材によって取付け面部に固定される。こうして、実装基板６１が取付け面部に密着した状態で固定される。これにより、発光モジュール６２で発生した熱が効率よく第２筐体３２に伝導される。ホルダ５１は、例えば、ポリブチレンテレフタレート（ＰＢＴ）、ポリカーボネート等の樹脂材料である。 The plurality of screw holes are holes for fixing the holder 51 to the mounting board 61 with a fixing member such as a screw. Specifically, the holder 51 is in a state where the mounting board 61 is sandwiched between the mounting surface portion of the second housing 32, and is fixed to the mounting surface portion by a fixing member so as to press the mounting board 61 against the mounting surface portion. In this way, the mounting board 61 is fixed in close contact with the mounting surface portion. As a result, the heat generated in the light emitting module 62 is efficiently conducted to the second housing 32. The holder 51 is a resin material such as polybutylene terephthalate (PBT) or polycarbonate.

＜セード部５４＞
セード部５４は、発光モジュール６２からの出射した光を透光カバー５５に向けて反射することで配光を制御する鏡面を有する。セード部５４は、内面がアルミニウム等の金属で構成された鏡面であるが、例えばポリブチレンテレフタレート等の硬質の白色樹脂材料を用いて形成されてもよい。 <Sade part 54>
The shade portion 54 has a mirror surface that controls the light distribution by reflecting the light emitted from the light emitting module 62 toward the light transmitting cover 55. The shade portion 54 is a mirror surface whose inner surface is made of a metal such as aluminum, but may be formed by using a hard white resin material such as polybutylene terephthalate.

セード部５４は、Ｘ軸方向で開口した無底の筒状である。セード部５４の形状は、発光モジュール６２からの光が入射される側（Ｘ軸マイナス方向側）の端部から、当該光が出射される側（Ｘ軸プラス方向側）の端部に向かって内径が漸次大きくなるように構成された円錐台状である。 The shade portion 54 has a bottomless tubular shape that opens in the X-axis direction. The shape of the shade portion 54 is from the end on the side where the light from the light emitting module 62 is incident (X-axis minus direction side) toward the end on the side where the light is emitted (X-axis plus direction side). It has a truncated cone shape with an inner diameter that gradually increases.

セード部５４は、ネジ等の固定部材により第１筐体３１の底板部３１ａに固定される。セード部５４のＸ軸マイナス方向側の端部は、第１筐体３１における底板部３１ａの開口３１ａ１及びホルダ５１の開口部５２に挿入され、発光モジュール６２の周囲を囲むように配置される。また、セード部５４の中心線は、中心線Ｏと略一致する。 The shade portion 54 is fixed to the bottom plate portion 31a of the first housing 31 by a fixing member such as a screw. The end portion of the shade portion 54 on the negative direction side of the X-axis is inserted into the opening 31a1 of the bottom plate portion 31a and the opening 52 of the holder 51 in the first housing 31, and is arranged so as to surround the periphery of the light emitting module 62. Further, the center line of the shade portion 54 substantially coincides with the center line O.

＜透光カバー５５＞
透光カバー５５は、セード部５４で反射された光、及び、発光モジュール６２からの光が入射される透光性のドーム状をなした光学カバーである。透光カバー５５は、外装カバー４０に収容される。透光カバー５５は、照明装置１をＸ軸プラス方向から見て、セード部５４及び発光モジュール６２を覆う状態で外装カバー４０に固定される。また、外装カバー４０の中心線は、中心線Ｏと略一致する。 <Transparent cover 55>
The translucent cover 55 is a translucent dome-shaped optical cover into which the light reflected by the shade portion 54 and the light from the light emitting module 62 are incident. The translucent cover 55 is housed in the exterior cover 40. The translucent cover 55 is fixed to the exterior cover 40 in a state of covering the shade portion 54 and the light emitting module 62 when the lighting device 1 is viewed from the X-axis plus direction. Further, the center line of the exterior cover 40 substantially coincides with the center line O.

なお、透光カバー５５は、セード部５４で反射された光の配光を制御して出射する機能を有してもよい。例えば透光カバー５５は、フレネルレンズ等であってもよい。透光カバー５５は、透光性材料を用いて形成され、例えばアクリル、ポリカーボネート（ＰＣ）等の透明樹脂材料、又は、ガラス材料等の透明材料を用いて形成する。 The light-transmitting cover 55 may have a function of controlling and emitting the light distributed by the shade portion 54. For example, the translucent cover 55 may be a Fresnel lens or the like. The translucent cover 55 is formed by using a translucent material, and is formed by using a transparent resin material such as acrylic or polycarbonate (PC) or a transparent material such as glass material.

このような照明装置１では、照明装置１の重心Ｈが中心線ＯからＹ軸プラス方向にズレているが、一対の板バネ７０のうちの少なくとも一方の板バネ７０が、照明装置１による偏荷重を支持する。これにより、照明装置１は、造営材の取付孔に安定的に保持される。 In such a lighting device 1, the center of gravity H of the lighting device 1 is deviated from the center line O in the positive direction of the Y axis, but at least one of the pair of leaf springs 70 is biased by the lighting device 1. Support the load. As a result, the lighting device 1 is stably held in the mounting hole of the construction material.

［作用効果］
次に、本実施の形態における照明装置１の作用効果について説明する。 [Action effect]
Next, the action and effect of the lighting device 1 in the present embodiment will be described.

上述したように、本実施の形態に係る照明装置１は、光を出射する照明装置１であって、１以上のリード付き回路部品と、１以上のチップ回路部品と、第１領域Ｅ１に１以上のリード付き回路部品が実装され、かつ、第１領域Ｅ１と異なる第２領域Ｅ２に１以上のチップ回路部品が実装される実装基板６１と、１以上のリード付き回路部品及び１以上のチップ回路部品を覆う第１筐体３１及び第２筐体３２とを備える。また、第１領域Ｅ１に実装される１以上のリード付き回路部品の単位面積当たりの密度は、第２領域Ｅ２に実装される１以上のリード付き回路部品の単位面積当たりの密度よりも大きい。また、第２領域Ｅ２に実装される１以上のチップ回路部品の単位面積当たりの密度は、第１領域Ｅ１に実装される１以上のチップ回路部品の単位面積当たりの密度よりも大きい。そして、第１筐体３１及び第２筐体３２は、当該照明装置１が出射する光の出射方向と反対方向に向かって１以上のリード付き回路部品を収容する空間を狭める傾斜部３２ａ２を有する。 As described above, the lighting device 1 according to the present embodiment is a lighting device 1 that emits light, and includes one or more leaded circuit components, one or more chip circuit components, and one in the first region E1. A mounting board 61 on which the above-mentioned circuit components with leads are mounted and one or more chip circuit components are mounted in a second region E2 different from the first region E1, one or more circuit components with leads, and one or more chips. A first housing 31 and a second housing 32 that cover circuit components are provided. Further, the density per unit area of one or more leaded circuit components mounted in the first region E1 is larger than the density per unit area of one or more leaded circuit components mounted in the second region E2. Further, the density per unit area of one or more chip circuit components mounted in the second region E2 is larger than the density per unit area of one or more chip circuit components mounted in the first region E1. The first housing 31 and the second housing 32 have an inclined portion 32a2 that narrows a space for accommodating one or more leaded circuit components in a direction opposite to the light emitting direction emitted by the lighting device 1. ..

これによれば、実装基板６１では、１以上のリード付き回路部品が集められた第１領域Ｅ１と、１以上のチップ回路部品が集められた第２領域Ｅ２とに分けられている。このため、発熱源となるチップ回路部品からリード付き回路部品を遠ざけることができる。 According to this, the mounting board 61 is divided into a first region E1 in which one or more leaded circuit components are collected and a second region E2 in which one or more chip circuit components are collected. Therefore, the circuit component with a lead can be kept away from the chip circuit component that is a heat source.

また、傾斜部３２ａ２によって、リード付き回路部品を収容する収容空間の大型化を抑制することができる。 Further, the inclined portion 32a2 can suppress an increase in the size of the accommodation space for accommodating the circuit component with a lead.

したがって、この照明装置１では、発光モジュール６２の発する熱がリード付き回路部品に与える影響を抑制するとともに、照明装置１の大型化を抑制することができる。 Therefore, in the lighting device 1, it is possible to suppress the influence of the heat generated by the light emitting module 62 on the circuit components with leads, and to suppress the increase in size of the lighting device 1.

特に、傾斜部３２ａ２が１以上のリード付き回路部品を収容する空間を狭めているため、照明装置１を小型化することで、器具本体３に用いられる材料を減らすことができるため、照明装置１の製造コストの低廉化を実現することができる。 In particular, since the inclined portion 32a2 narrows the space for accommodating one or more leaded circuit components, the material used for the fixture main body 3 can be reduced by downsizing the lighting device 1, so that the lighting device 1 It is possible to reduce the manufacturing cost of the product.

また、造営材の取付孔に照明装置１を取付ける際に、直角状の段部が形成される照明装置１に比べて、傾斜部３２ａ２が造営材の取付孔に引っ掛かり難くなるため、照明装置１を造営材の取付孔に取付け易くなる。 Further, when the lighting device 1 is attached to the mounting hole of the building material, the inclined portion 32a2 is less likely to be caught in the mounting hole of the building material as compared with the lighting device 1 in which the right-angled step portion is formed. Can be easily mounted in the mounting hole of the construction material.

また、本実施の形態に係る照明装置１において、１以上のチップ回路部品は、少なくとも発光モジュール６２を含む。また、実装基板６１は、発光モジュール６２が出射する光の光軸方向と交差する方向に延びる。また、１以上のリード付き回路部品は、実装基板６１における長手方向の一方側に実装される。そして、１以上のチップ回路部品は、実装基板６１における長手方向の他方側に実装される。 Further, in the lighting device 1 according to the present embodiment, one or more chip circuit components include at least a light emitting module 62. Further, the mounting substrate 61 extends in a direction intersecting the optical axis direction of the light emitted by the light emitting module 62. Further, one or more lead-attached circuit components are mounted on one side of the mounting board 61 in the longitudinal direction. Then, one or more chip circuit components are mounted on the other side of the mounting board 61 in the longitudinal direction.

これによれば、１以上のリード付き回路部品と１以上のチップ回路部品とを確実に離間することができるため、発光モジュール６２の発する熱がリード付き回路部品に与える影響を抑制することができる。 According to this, since one or more leaded circuit components and one or more chip circuit components can be reliably separated from each other, the influence of the heat generated by the light emitting module 62 on the leaded circuit components can be suppressed. ..

また、本実施の形態に係る照明装置１において、１以上のチップ回路部品は、発光モジュール６２を制御する１以上の制御回路部品を含む。また、第２領域Ｅ２は、発光モジュール６２を実装する発光領域Ｅ２ａと、制御回路部品を実装する制御領域Ｅ２ｂとに分かれる。そして、制御領域Ｅ２ｂは、発光領域Ｅ２ａと第１領域Ｅ１との間に配置される。 Further, in the lighting device 1 according to the present embodiment, one or more chip circuit components include one or more control circuit components that control the light emitting module 62. The second region E2 is divided into a light emitting region E2a on which the light emitting module 62 is mounted and a control region E2b on which the control circuit components are mounted. The control region E2b is arranged between the light emitting region E2a and the first region E1.

これによれば、発光モジュール６２からリード付き回路部品を、より離間させることができる。このため、発光モジュール６２の発する熱がリード付き回路部品に与える影響を、より抑制することができる。 According to this, the circuit component with a lead can be further separated from the light emitting module 62. Therefore, the influence of the heat generated by the light emitting module 62 on the lead-attached circuit component can be further suppressed.

また、本実施の形態に係る照明装置１において、１以上のリード付き回路部品が実装基板６１に実装される面は、１以上のチップ回路部品が実装基板６１に実装される面の反対側の面である。 Further, in the lighting device 1 according to the present embodiment, the surface on which one or more leaded circuit components are mounted on the mounting board 61 is opposite to the surface on which one or more chip circuit components are mounted on the mounting board 61. It is a face.

これによれば、リード付き回路部品が実装される第１領域Ｅ１とチップ回路部品が実装される第２領域Ｅ２とを確実に分離することができる。 According to this, the first region E1 on which the circuit component with a lead is mounted and the second region E2 on which the chip circuit component is mounted can be reliably separated.

また、本実施の形態に係る照明装置１において、照明装置１が出射する光の光軸方向に沿って照明装置１を平面視した場合に、制御領域Ｅ２ｂは、傾斜部３２ａ２と重なる。 Further, in the illuminating device 1 according to the present embodiment, when the illuminating device 1 is viewed in a plan view along the optical axis direction of the light emitted by the illuminating device 1, the control region E2b overlaps with the inclined portion 32a2.

これによれば、実装基板６１の制御領域Ｅ２ｂに実装される制御回路部品に生じる輻射熱が傾斜部３２ａ２に伝導することで、第１筐体３１及び第２筐体３２内の温度上昇を抑制することができる。 According to this, the radiant heat generated in the control circuit component mounted on the control region E2b of the mounting board 61 is conducted to the inclined portion 32a2, thereby suppressing the temperature rise in the first housing 31 and the second housing 32. be able to.

（その他変形例）
以上、本開示に係る照明装置について、実施の形態に基づいて説明したが、本開示は、上記の各実施の形態に限定されるものではない。 (Other variants)
The lighting device according to the present disclosure has been described above based on the embodiments, but the present disclosure is not limited to each of the above embodiments.

例えば、上記の各実施の形態において、一対の板バネは、中心線を含むＺ軸方向の線よりもＹ軸プラス方向側の領域においてＺ軸方向と平行になるように配置されていてもよい。 For example, in each of the above embodiments, the pair of leaf springs may be arranged so as to be parallel to the Z-axis direction in the region on the Y-axis plus direction side of the Z-axis direction line including the center line. ..

また、上記の各実施の形態において、照明制御部が第１筐体及び第２筐体に収容されているがこれには限定されない。照明制御部は、収容体に収容されていてもよい。 Further, in each of the above embodiments, the lighting control unit is housed in the first housing and the second housing, but the present invention is not limited to this. The lighting control unit may be housed in the housing.

また、上記の各実施の形態において、器具本体の構成には、ヒートシンクが含まれていてもよい。この場合、ヒートシンクの一部が光軸と交差する方向に突出していてもよい。このため、筐体が光軸と交差する方向に突出していることが必須ではない。 Further, in each of the above-described embodiments, the configuration of the appliance main body may include a heat sink. In this case, a part of the heat sink may protrude in the direction intersecting the optical axis. Therefore, it is not essential that the housing protrudes in the direction intersecting the optical axis.

なお、上記の各実施の形態に対して当業者が思い付く各種変形を施して得られる形態や、本開示の趣旨を逸脱しない範囲で各実施の形態における構成要素及び機能を任意に組み合わせることで実現される形態も本開示に含まれる。 It should be noted that it is realized by arbitrarily combining the components and functions in each embodiment within the range obtained by applying various modifications that can be conceived by those skilled in the art to each of the above embodiments and the purpose of the present disclosure. The form to be used is also included in the present disclosure.

１ 照明装置
３ 器具本体
３１ 第１筐体（筐体）
３１ｂ 第１取付部（取付部）
３１ｂ２ 表面
３２ 第２筐体（筐体）
４０ 外装カバー
６１ 基板
６２ 発光モジュール
６３ａ 点灯回路
７０ 板バネ（バネ）
７２ アーム部 1 Lighting device 3 Instrument body 31 First housing (housing)
31b 1st mounting part (mounting part)
31b2 Surface 32 Second housing (housing)
40 Exterior cover 61 Board 62 Light emitting module 63a Lighting circuit 70 Leaf spring (spring)
72 Arm part

Claims (5)

光を出射する照明装置であって、
１以上のリード付き回路部品と、
１以上のチップ回路部品と、
第１領域に前記１以上のリード付き回路部品が実装され、かつ、前記第１領域と異なる第２領域に前記１以上のチップ回路部品が実装される実装基板と、
前記１以上のリード付き回路部品及び前記１以上のチップ回路部品を覆う筐体とを備え、
前記第１領域に実装される前記１以上のリード付き回路部品の単位面積当たりの密度は、前記第２領域に実装される前記１以上のリード付き回路部品の単位面積当たりの密度よりも大きく、
前記第２領域に実装される前記１以上のチップ回路部品の単位面積当たりの密度は、前記第１領域に実装される前記１以上のチップ回路部品の単位面積当たりの密度よりも大きく、
前記筐体は、当該照明装置が出射する光の出射方向と反対方向に向かって前記１以上のリード付き回路部品を収容する空間を狭める傾斜部を有する
照明装置。 A lighting device that emits light
With one or more leaded circuit components,
With one or more chip circuit components
A mounting board on which the one or more leaded circuit components are mounted in the first region and the one or more chip circuit components are mounted in a second region different from the first region.
The circuit component with one or more leads and the housing covering the one or more chip circuit components are provided.
The density per unit area of the one or more leaded circuit components mounted in the first region is larger than the density per unit area of the one or more leaded circuit components mounted in the second region.
The density per unit area of the one or more chip circuit components mounted in the second region is larger than the density per unit area of the one or more chip circuit components mounted in the first region.
The housing is a lighting device having an inclined portion that narrows a space for accommodating the one or more leaded circuit components in a direction opposite to the light emitting direction emitted by the lighting device. 前記１以上のチップ回路部品は、少なくとも発光モジュールを含み、
前記実装基板は、前記発光モジュールが出射する光の光軸方向と交差する方向に延び、
前記１以上のリード付き回路部品は、前記実装基板における長手方向の一方側に実装され、
前記１以上のチップ回路部品は、前記実装基板における長手方向の他方側に実装される
請求項１に記載の照明装置。 The one or more chip circuit components include at least a light emitting module.
The mounting board extends in a direction intersecting the optical axis direction of the light emitted by the light emitting module.
The one or more leaded circuit components are mounted on one side of the mounting board in the longitudinal direction.
The lighting device according to claim 1, wherein the one or more chip circuit components are mounted on the other side of the mounting board in the longitudinal direction. 前記１以上のチップ回路部品は、前記発光モジュールを制御する１以上の制御回路部品を含み、
前記第２領域は、前記発光モジュールを実装する発光領域と、前記制御回路部品を実装する制御領域とに分かれ、
前記制御領域は、前記発光領域と前記第１領域との間に配置される
請求項２に記載の照明装置。 The one or more chip circuit components include one or more control circuit components that control the light emitting module.
The second region is divided into a light emitting region in which the light emitting module is mounted and a control region in which the control circuit component is mounted.
The lighting device according to claim 2, wherein the control region is arranged between the light emitting region and the first region. 前記１以上のリード付き回路部品が前記実装基板に実装される面は、前記１以上のチップ回路部品が前記実装基板に実装される面の反対側の面である
請求項３に記載の照明装置。 The lighting device according to claim 3, wherein the surface on which the one or more leaded circuit components are mounted on the mounting board is the surface opposite to the surface on which the one or more chip circuit components are mounted on the mounting board. .. 当該照明装置が出射する光の光軸方向に沿って当該照明装置を平面視した場合に、前記制御領域は、前記傾斜部と重なる
請求項３又は４に記載の照明装置。 The lighting device according to claim 3 or 4, wherein the control area overlaps the inclined portion when the lighting device is viewed in a plan view along the optical axis direction of the light emitted from the lighting device.
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