JP7405294B2 - gaming machine - Google Patents

Description

The present invention relates to a gaming machine.

Pachinko machines, slot machines, and the like are known as types of gaming machines. These gaming machines are known to have a configuration in which a lottery is held based on the fulfillment of predetermined lottery conditions, and a bonus is awarded to a player according to the result of the lottery. Further, a general configuration is such that an effect is performed to make the player predict or recognize the result of the lottery. These gaming machines are equipped with a board on which electronic components for playing games and for executing performances are mounted.

Specifically, regarding pachinko machines, for example, a lottery is held based on a game ball entering a ball entry section provided in a gaming area, a fluctuating pattern is displayed on the display surface of a display device, and a lottery A known configuration is known in which, when a winning result is obtained, a specific combination of symbols is displayed on the display screen for the final time, and a transition is made to a special game state that is advantageous to the player. When the state shifts to the special gaming state, for example, a ball entry device installed in the gaming area starts to open and close, and game balls are paid out based on the ball entering the ball entry device. (For example, see Patent Document 1).

Japanese Patent Application Publication No. 2012-170465

Here, in gaming machines such as those exemplified above, it is necessary to suitably mount electronic components on a board, and there is still room for improvement in this respect.

The present invention has been made in view of the circumstances exemplified above, and an object of the present invention is to provide a gaming machine in which electronic components can be suitably mounted on a board.

In order to solve the above problem, the invention according to claim 1 provides a gaming machine equipped with a predetermined board,
A first predetermined electronic component and a second predetermined electronic component smaller than the first predetermined electronic component are mounted on the predetermined substrate,
A resist is provided on the predetermined substrate between a plurality of connection parts to which the plurality of electrodes of the first predetermined electronic component are electrically connected,
The resist is not provided between a plurality of connection parts to which a plurality of electrodes of the second predetermined electronic component are electrically connected on the predetermined substrate,
An external shape display is provided around the area on the predetermined substrate in which the first predetermined electronic component is mounted, and the outer shape is provided to partition the area.
No external shape display is provided around the area on the predetermined substrate in which the second predetermined electronic component is mounted, and the outer shape is not provided to partition the area;
In the predetermined board, a component identification display is provided outside the area where the second predetermined electronic component is mounted, indicating that the electronic component mounted in the area is the second predetermined electronic component. Ori,
The second predetermined electronic component is not mounted on the board surface on the back side of the board surface on which the specific electronic component is mounted on the predetermined board, and on the back side of the specific electronic component.

According to the present invention, it is possible to suitably mount electronic components on a board.

It is a front view of the pachinko machine in a 1st embodiment. FIG. 1 is a perspective view showing the main configuration of a pachinko machine developed. FIG. 1 is a perspective view showing the main configuration of a pachinko machine developed. It is a front view showing the structure of a game board. It is an explanatory view for explaining the composition regarding discharge of the game ball which flowed down the game area. FIG. 3 is a front view of the main controller. FIG. 2 is a front view of the pachinko machine with the decorative cover and decorative board removed. (a) A plan view showing a first mounting surface, which is one side of the first decorative board, and (b) an enlarged view of the peripheral area of a bypass capacitor mounted on the first decorative board. FIG. 3C is a plan view of the first mounting surface of the decorative substrate; be. FIG. 8(a) is a cross-sectional view taken along the line AA in FIG. 8(a). (a) A plan view showing a first mounting surface, which is one side of the second decorative board, and (b) a second plan view showing an enlarged peripheral area of a bypass capacitor mounted on the second decorative board. FIG. 7C is a plan view of the first mounting surface of the second decorative board; FIG. be. FIG. 3 is a wiring diagram of the first light emitting circuit section in the first decorative board. (a) It is a perspective view of the first mounting surface side of the first decorative board showing the periphery of the bypass capacitor in an enlarged manner, and (b) The first mounting of the first decorative board showing the periphery of the small chip resistor in an enlarged manner. FIG. (a) A plan view of the first mounting surface of the first decorative board showing an enlarged view of the peripheral area of a bypass capacitor, and (b) an explanatory diagram for explaining the relationship between pads and solder resist in the peripheral area. (c) is an explanatory diagram for explaining a movement mode of a bypass capacitor that may occur, and (d) is an explanatory diagram for explaining a movement mode of a bypass capacitor that may occur in a comparative example. (a) It is a plan view of the first mounting surface of the first decorative board showing the peripheral area of the small chip resistor in an enlarged manner, and (b) An explanation for explaining the relationship between the pads and the solder resist in the peripheral area. (c) is an explanatory diagram for explaining a movement mode of a small chip resistor that may occur, and (d) is an explanatory diagram for explaining a movement mode of a small chip resistor that may occur in a comparative example. It is. (a) It is a top view which shows the 2nd mounting surface of a 1st decorative board, and (b) It is a top view of the 2nd mounting surface of the 1st decorative board which shows the back side area of the 1st light emitting circuit part enlarged. (a) It is a sectional view of a first decorative board, and (b) It is a sectional view of a first decorative board in a comparative example. (a) It is a top view showing the first plate surface of the collective board, (b) It is an explanatory diagram for explaining the valley division of the collective board, and (c) It is an explanatory diagram for explaining the mountain division of the collective board. It is. (a) is a perspective view of a dividing jig used to divide the collective board, (b) is a front view of the dividing jig, and (c) is for explaining how to divide the collective board using the dividing jig. FIG. It is a block diagram showing the electrical configuration of a pachinko machine. FIG. 3 is an explanatory diagram for explaining the contents of various counters used for winning/losing lottery and the like. 3 is a flowchart showing main processing executed by a main CPU. 3 is a flowchart showing timer interrupt processing executed by the main CPU. It is a flowchart which shows the special figure special electric control process performed by main side CPU. It is a flowchart showing special symbol fluctuation start processing executed by the main side CPU. (a) It is a top view which shows the 1st mounting surface of the 1st decorative board in 2nd Embodiment, (b) The 1st decoration which shows the peripheral area of the bypass capacitor mounted on the 1st decorative board in enlargement FIG. 3 is a plan view of the first mounting surface of the board. It is a top view of the 1st light emitting surface of the light emitting board in 3rd Embodiment. It is a top view of the 2nd light emitting surface of a light emitting board. (a) It is a top view of the 1st light emitting surface of the light emitting board in 4th Embodiment, (b) It is a top view of the 1st light emitting surface of the light emitting board which shows the peripheral area of a bypass capacitor in enlargement. (a) It is a top view of the 2nd light emitting surface of a light emitting board, (b) It is a top view of the 2nd light emitting surface of a light emitting board which shows the peripheral area of a power supply terminal and a GND terminal in enlargement.

<First embodiment>
Hereinafter, a first embodiment of a pachinko machine 10, which is a type of gaming machine, will be described in detail based on the drawings. FIG. 1 is a front view of a pachinko machine 10, and FIGS. 2 and 3 are perspective views showing the main components of the pachinko machine 10 in a developed manner. Note that in FIG. 2, the configuration within the gaming area of the pachinko machine 10 is omitted for convenience, and in FIG. 3, the configuration of the main control device 60, which will be described later, on the rear side of the pachinko machine 10 is omitted.

As shown in FIG. 1, the pachinko machine 10 includes an outer frame 11 that forms the outer shell of the pachinko machine 10, and a gaming machine main body 12 that is attached to the outer frame 11 so as to be rotatable forward. have The outer frame 11 is constructed by connecting wooden boards on four sides, and has a rectangular frame shape. The pachinko machine 10 is installed in a game hall by attaching and fixing the outer frame 11 to island equipment. It should be noted that the outer frame 11 is not an essential component of the pachinko machine 10, and the outer frame 11 may be provided in an island facility of a game hall.

As shown in FIGS. 2 and 3, the gaming machine main body 12 includes an inner frame 13, a front door frame 14 disposed in front of the inner frame 13, and a back pack unit 15 disposed behind the inner frame 13. It is equipped with. An inner frame 13 of the gaming machine main body 12 is rotatably supported by the outer frame 11. Specifically, when viewed from the front, the inner frame 13 is rotatable forward with the left side being the rotation base end side and the right side being the rotation tip side.

A front door frame 14 is rotatably supported by the inner frame 13, and can be rotated forward with the left side as the rotation base end and the right side as the rotation tip end when viewed from the front. Further, a back pack unit 15 is rotatably supported by the inner frame 13, and is rotatable rearward with the left side as the rotation base end and the right side as the rotation tip end when viewed from the front.

The gaming machine main body 12 is provided with a locking device at its rotating tip, and has a function of locking the gaming machine main body 12 against the outer frame 11 so that it cannot be opened. It has a function of locking the door frame 14 with respect to the inner frame 13 so that it cannot be opened. Each of these locked states is released by performing an unlocking operation using an unlocking key on the cylinder lock 17 provided in an exposed manner on the front surface of the pachinko machine 10.

<Front side configuration>
Next, the configuration of the front side of the gaming machine main body 12 will be explained.

The inner frame 13 is mainly composed of a resin base 21 whose outer shape is substantially the same as that of the outer frame 11. A substantially elliptical window hole 23 is formed in the center of the resin base 21 . A game board 24 is detachably attached to the resin base 21. The game board 24 is made of plywood, and the game area PA formed on the front surface of the game board 24 is exposed to the front side of the inner frame 13 through the window hole 23 of the resin base 21.

<Game board configuration>
Here, the configuration of the game board 24 will be explained based on FIG. 4. FIG. 4 is a front view of the game board 24.

An inner rail part 25 and an outer rail part 26 are attached to the game board 24 so as to partition a part of the outer edge of the game area PA, and the inner rail part 25 and the outer rail part 26 provide a guide means. The guide rail is configured as follows. A game ball fired from a game ball firing mechanism 27 (see FIG. 2) attached below the window hole 23 in the resin base 21 is guided to the upper part of the game area PA by a guide rail.

Incidentally, the game ball firing mechanism 27 includes a firing rail 27a that extends toward the guide rail, a ball feeding device 27b that supplies game balls stored in an upper tray 54a (described later) onto the firing rail 27a, and a ball feeding device 27b that supplies game balls stored in an upper tray 54a (described later) onto the firing rail 27a. The solenoid 27c is an electric actuator that fires the game balls supplied to the guide rail toward the guide rail. When the firing operation device (or operation handle) 28 provided on the front door frame 14 is rotated, the solenoid 27c is driven and controlled, and the game ball is fired.

The game board 24 is formed with a plurality of large and small openings passing through it in the front and back direction. Each opening is provided with a general winning opening 31, a special winning winning device 32, a first operating opening 33, a second operating opening 34, a through gate 35, a variable display unit 36, a special drawing unit 37, a general drawing unit 38, etc. ing. A total of four general winning holes 31 are provided, and one each is provided for the others.

Even if a ball enters the through gate 35, the payout of the game ball is not executed. On the other hand, when a ball enters the general winning hole 31, the special electric winning device 32, the first operating hole 33, and the second operating hole 34, a predetermined number of game balls are paid out. Specifically, regarding the number of prize balls, if one game ball enters the first operating port 33 or one game ball enters the second operating port 34, In this case, when one game ball is paid out and one game ball enters the general winning hole 31, ten prize balls are paid out and sent to the special electric winning device 32. When one game ball enters the ball, 15 prize balls are paid out.

Note that the number of prize balls is arbitrary, and for example, the second operating port 34 may have a smaller number of prize balls than the first operating port 33, and the second operating port 34 may have a smaller number of winning balls than the first operating port 33. It is also possible to have a configuration in which the number of prize balls is greater than 33.

In addition, an out port 24a is provided at the bottom of the game board 24, and game balls that have not entered various winning ports are discharged from the gaming area PA through the out port 24a. Further, the game board 24 has a large number of nails 24b planted therein in order to appropriately disperse and adjust the falling direction of the game balls, and various members such as a windmill are also arranged.

Here, entering the ball means that the game ball passes through a predetermined opening, and not only the manner in which the game ball is ejected from the game area PA after passing through the opening, but also the manner in which the game ball is ejected from the game area PA after passing through the opening. It also includes a mode in which the fluid continues to flow down the gaming area PA without being discharged. However, in the following explanation, in order to clearly distinguish from the entry of the game ball into the out port 24a, the general winning hole 31, the special electric winning device 32, the first operating port 33, the second operating port 34, and the through gate 35 will be used. The landing of a game ball into a ball is also expressed as winning a prize.

The first operating port 33 and the second operating port 34 are installed in the game board 24 as a unit as an operating port device. Both the first operating port 33 and the second operating port 34 are open upward. Further, both the operating ports 33 and 34 are arranged in the vertical direction with the first operating port 33 facing upward. The second actuating port 34 is provided with a general electric accessory 34a as a guide piece consisting of a pair of left and right movable pieces. When the electric utility object 34a is in the closed state, the game ball cannot enter the second operating port 34, and when the general electric accessory 34a is in the open state, it is possible to enter the second operating hole 34.

A through gate 35 is provided on the upstream side of the second operating port 34 in the downstream direction of the game ball. The through gate 35 has a through hole (not shown) that passes through the through gate 35 in the vertical direction, and the game ball that enters the through gate 35 flows down the gaming area PA after winning the prize. Thereby, the game ball that has entered the through gate 35 can enter the second operating port 34.

Based on the winning in the through gate 35, the general electric accessory 34a of the second operating port 34 is switched from the closed state to the open state. Specifically, an internal lottery is held triggered by winning in the through gate 35, and a general figure display of the normal figure unit 38 provided in the lower right corner, which is an area where the game ball does not pass through in the gaming area PA. A changing display of the picture is performed in the section 38a. Then, when the result of the internal lottery is a power open winning, a stop result corresponding to the result is displayed, and the fluctuating display of the general figure display section 38a is ended, the state shifts to the general electric power open state. In the general power open state, the general power accessory 34a is in the open state in a predetermined manner.

Note that the general figure display section 38a is constituted by a segment display in which a plurality of display segments using LEDs are arranged in a predetermined manner, but is not limited to this, and may be a liquid crystal display device, an organic EL display device, etc. It may also be constituted by a display device, CRT or other type of display device such as a dot matrix display. In addition, the patterns that are variably displayed on the general figure display section 38a include a configuration in which multiple types of characters are variably displayed, a configuration in which multiple types of symbols are variably displayed, a configuration in which multiple types of characters are variably displayed, or A configuration in which multiple types of colors are switched and displayed is conceivable.

In the general drawing unit 38, a general drawing holding display section 38b is provided at a position adjacent to the general drawing display section 38a. The number of game balls that have entered the through gate 35 is reserved up to a maximum of four, and the number of reserved balls is displayed by lighting the regular game reservation display section 38b.

A winning lottery is held using the win at the first operating port 33 or the second operating port 34 as a trigger. Then, the lottery result is clearly displayed through the display effect on the symbol display device 41 of the special symbol unit 37 and the variable display unit 36.

Specifically regarding the special figure unit 37, the special figure unit 37 is provided with a special figure display section 37a. The display area of the special figure display section 37a is narrower than the display surface 41a of the symbol display device 41. In the special figure display section 37a, a winning lottery is performed using a prize winning in the first operating port 33 or a winning in the second operating port 34 as a trigger, so that a variable display of symbols or a predetermined display is performed. Then, the results corresponding to the lottery results are displayed. Note that the special figure display section 37a is constituted by a segment display in which a plurality of display segments using LEDs are arranged in a predetermined manner, but is not limited to this, and may be a liquid crystal display device, an organic EL display device, etc. It may also be constituted by a display device, CRT or other type of display device such as a dot matrix display. In addition, the designs displayed on the special figure display section 37a include a configuration in which multiple types of characters are displayed, a configuration in which multiple types of symbols are displayed, a configuration in which multiple types of characters are displayed, or a configuration in which multiple types of colors are displayed. Possible configurations include a configuration where .

In the special figure unit 37, a special figure pending display section 37b is provided at a position adjacent to the special figure display section 37a. The number of game balls entered into the first operating port 33 or the second operating port 34 is reserved up to a maximum of four, and the number of reserved balls is displayed by lighting the special symbol reservation display section 37b.

In detail about the symbol display device 41, the symbol display device 41 is configured as a liquid crystal display device including a liquid crystal display, and the display contents are controlled by a display control device to be described later. Note that the symbol display device 41 is not limited to a liquid crystal display device, and may be another display device having a display screen such as a plasma display device, an organic EL display device, or a CRT, and may also be a dot matrix display device. It's okay.

In the symbol display device 41, when a variable display of a symbol or a predetermined display is performed on the special symbol display section 37a based on a winning at the first operating port 33 or a winning at the second operating port 34, the symbol is changed accordingly. A variable display or a predetermined display is performed. For example, on the display surface 41a of the symbol display device 41, three symbol rows of an upper row, a middle row, and a lower row are set as a plurality of display areas, and in each symbol row, a main character numbered from "1" to "9" is set. The symbols are scrolled and displayed in ascending or descending order. In this scroll display, scrolling display for all symbol rows is first started, and then the scroll display is switched to standby display in the order of upper symbol row → lower symbol row → middle symbol row, and finally a predetermined display is displayed in each symbol row. The process ends with the symbol displayed statically. In a game round in which the game result is a jackpot, a combination of predetermined symbols is stopped and displayed on the active line set in advance on the display surface 41a of the symbol display device 41. Specifically, in the case of the most profitable jackpot result, which will be described later, the same odd-numbered symbol combination will be stopped and displayed, and in the case of a low-probability jackpot result, which will be described later, the same even-numbered symbol combination will be stopped and displayed. If the result is a low win/high probability jackpot result, the combination of symbols is not the same symbol combination, but the combination of symbols that would not be stopped and displayed if the result is not a low win/high probability jackpot result is stopped and displayed.

In addition, in the symbol display device 41, not only the display effect triggered by winning to the first operating port 33 or the second operating port 34, but also the display effect during the opening/closing execution mode that shifts after winning is performed. be exposed. In addition, based on winning to either of the actuating ports 33, 34, the display starts on the special symbol display section 37a and the symbol display device 41, and the period from displaying a predetermined result to ending is one game round. equivalent to times. Further, the manner in which the symbols are displayed in a variable manner in the symbol display device 41 is not limited to the above-mentioned one, and may be arbitrary, such as the number of symbol rows, the direction of the variable display of symbols in the symbol rows, the number of symbols in each symbol row, etc. can be changed as appropriate. Further, the symbols displayed in a variable manner on the symbol display device 41 are not limited to the above-mentioned symbols, and for example, only numbers may be displayed in a variable manner as the symbols.

If a jackpot is won in the winning lottery based on winning to the first operating port 33 or winning to the second operating port 34, a transition is made to an opening/closing execution mode in which winning to the special electric winning device 32 is possible. The special electric winning device 32 is equipped with a grand prize opening (not shown) that leads to the back side of the game board 24, and is also provided with an opening/closing door 32a that opens and closes the grand prize opening. The opening/closing door 32a is placed in either a closed state or an open state. Specifically, the opening/closing door 32a is normally in a closed state in which game balls cannot win prizes, but if the transition to the opening/closing execution mode is won in the internal lottery, it can be switched to the open state in which game balls can win prizes. It has become. Incidentally, the opening/closing execution mode is a mode to which the game will transition in the event of a winning result. Note that in the closed state, it is not impossible to win a prize, but it may be configured to be in a state in which it is more difficult to win a prize than in the open state.

<Configuration regarding ejection of game balls>
FIG. 5 is an explanatory diagram for explaining the configuration regarding the discharge of game balls that have flown down the game area PA.

As already explained, the game ball that enters any of the general winning opening 31, the special electric winning device 32, the first operating opening 33, the second operating opening 34, and the out opening 24a is ejected from the gaming area PA. In other words, the game ball ejected from the game ball launch mechanism 27 and flowing into the game area PA is either the general winning port 31, the special electric winning device 32, the first operating port 33, the second operating port 34, or the out port 24a. By entering the ball, the ball will be ejected from the gaming area PA. A game ball that enters any of the general winning opening 31, special electric winning device 32, first operating opening 33, second operating opening 34, and out opening 24a is guided to the back side of the gaming board 24.

On the back side of the game board 24, discharge passages 42 to 48 are formed in correspondence with the general winning opening 31, the special winning winning device 32, the first operating opening 33, the second operating opening 34, and the out opening 24a, respectively. . The game balls that have flowed into the discharge passages 42 to 48 flow down the discharge passages 42 to 48 into which they have flowed, and are guided to the lower end of the game board 24 on the back side of the game board 24, and then to the discharge ball collection part (not shown). will be collected. Then, the game balls collected by the discharged ball collection section are discharged to a ball circulation device of the island equipment in which the pachinko machine 10 is installed in the game hall.

Each of the discharge passages 42 to 48 is provided with various detection sensors 42a to 48a for detecting game balls. The discharge passage sections 42 to 48 and the detection sensors 42a to 48a will be explained below. As described above, there are four general winning openings 31, so there are discharge passages 42 to 44 corresponding to each of the four openings. In this case, one detection sensor 42a, 43a is provided. Specifically, the first winning a prize opening detection sensor 42a is provided so that the detection range exists in the middle of the first discharge passage part 42, and the detection range exists in the middle of the second discharge passage part 43. A second winning opening detection sensor 43a is provided so as to exist. The game ball that entered the leftmost general winning hole 31 is detected by the first winning hole detection sensor 42a while passing through the first discharge passage section 42, and the game ball that entered the general winning hole 31 on the right side The ball is detected by the second prize opening detection sensor 43a while passing through the second discharge passage section 43. In addition, a third discharge passage portion 44 is provided for the two right-side general winning ports 31 so as to merge at an intermediate position. The third discharge passage section 44 has an inlet side area corresponding to each of the two general winning ports 31, and has one outlet side area by merging the inlet side areas in the middle. are doing. The third winning a prize opening detection sensor 44a is provided so that a detection range exists in the middle of the exit side area of the third discharge passage section 44. A game ball that enters one of the two general winning holes 31 on the right side is detected by the third winning hole detection sensor 44a while passing through the third discharge passage section 44.

A fourth discharge passage section 45 is provided corresponding to the special electric prize winning device 32. A special electric detection sensor 45a is provided so that a detection range exists in the middle of the fourth discharge passage part 45, and the game ball that enters the special electric winning device 32 is on the way to pass through the fourth discharge passage part 45. It is detected by the special electric detection sensor 45a. A fifth discharge passage portion 46 is provided corresponding to the first operating port 33 . A first operation port detection sensor 46a is provided so that a detection range exists in the middle of the fifth discharge passage section 46, and the game ball that enters the first operation port 33 passes through the fifth discharge passage section 46. While passing, it is detected by the first operating port detection sensor 46a. A sixth discharge passage portion 47 is provided corresponding to the second operating port 34 . A second operating port detection sensor 47a is provided so that a detection range exists in the middle of the sixth discharge passage portion 47, and the game ball that enters the second operating port 34 passes through the sixth discharge passage portion 47. While passing, it is detected by the second operating port detection sensor 47a. A seventh discharge passage portion 48 is provided corresponding to the out port 24a. An out-port detection sensor 48a is provided so that a detection range exists in the middle of the seventh discharge passage section 48, and the game ball that enters the out-port 24a is on the way to pass through the seventh discharge passage section 48. It is detected by the outlet detection sensor 48a.

Note that a game ball that is detected by any one of the various detection sensors 42a to 48a will not be detected by any of the other detection sensors 42a to 48a. Further, a gate detection sensor 49a is also provided for the through gate 35, and a game ball passing through the through gate 35 while flowing down the gaming area PA is detected by the gate detection sensor 49a.

Although electromagnetic induction type proximity sensors are used as the various detection sensors 42a to 49a, any sensor can be used as long as the game balls can be detected individually. Further, the various detection sensors 42a to 49a are electrically connected to a main control device 60, which will be described later, and the detection results of the various detection sensors 42a to 49a are output to the main control device 60. Specifically, the various detection sensors 42a to 49a output a LOW level signal when a game ball is not detected, and output a HI level signal when a game ball is detected. Note that the present invention is not limited to this, and the relationship between HI and LOW may be reversed.

As shown in FIG. 2, a front door frame 14 is provided so as to cover the entire front side of the inner frame 13 in which the game board 24 configured as described above is attached to the resin base 21. As shown in FIG. 1, the front door frame 14 is formed with a window 51 that allows almost the entire area of the gaming area PA to be viewed from the front. The window portion 51 has a substantially elliptical shape, and a window panel 52 is fitted therein. The window panel 52 is made of glass to be colorless and transparent, but is not limited to this, and may be made of synthetic resin to be colorless and transparent. It may be colored and transparent as long as it is visible.

A pair of left and right speaker sections 53 are provided above the window section 51 to output sound effects and the like according to the gaming state. Further, below the window portion 51, an upper bulging portion 54 and a lower bulging portion 55, which bulge toward the front, are vertically arranged in parallel. An upper tray 54a that opens upward is provided inside the upper bulge 54, and a lower tray 55a that also opens upward is provided inside the lower bulge 55. The upper tray 54a has a function of temporarily storing game balls put out from a payout device described later and guiding them to the game ball firing mechanism 27 side while arranging them in a line. Further, the lower tray 55a has a function of storing surplus game balls in the upper tray 54a.

As shown in FIG. 1, on the front surface of the front door frame 14, a first decorative board 56 is provided at the lower left side of the window portion 51, and a second decorative board 56 is provided at the upper left-right center of the window portion 51. A substrate 57 is provided. A plurality of LED chips are mounted on each decorative board 56, 57, and a light emitting effect corresponding to the game state is performed on these decorative boards 56, 57. The front door frame 14 is provided with a first decorative cover 58 that covers the front of the first decorative board 56 and a second decorative cover 59 that covers the front of the second decorative board 57. These decorative covers 58 and 59 are made of transparent or semi-transparent resin that transmits light emitted from the LED chip, and bulge toward the front of the pachinko machine 10. Note that details of the decorative substrates 56, 57 and the decorative covers 58, 59 will be described later.

Next, the configuration of the back side of the gaming machine main body 12 will be explained.

As shown in FIG. 2, a main control device 60 that controls the main control of the game is mounted on the back side of the inner frame 13 (specifically, the game board 24). FIG. 6 is a front view of the main controller 60.

<Configuration of main controller 60>
As shown in FIG. 6, the main control device 60 includes a main control board 61 housed in a board box 60a. An MPU 62 is mounted on an element mounting surface, which is one board surface of the main control board 61. The board box 60a is formed transparent so that the MPU 62 housed in the board box 60a can be visually observed from the outside of the board box 60a. Note that although the board box 60a is formed to be colorless and transparent, it may be formed to be colored and transparent as long as it is possible to visually observe the MPU 62 housed in the board box 60a from outside the board box 60a. The main control device 60 is mounted on the back surface of the resin base 21 in a board box 60a such that an opposing wall portion 60b facing the element mounting surface of the main control board 61 faces the rear of the pachinko machine 10. Therefore, by opening the gaming machine main body 12 forward of the pachinko machine 10 with respect to the outer frame 11 and exposing the back surface of the resin base 21, it becomes possible to visually see the opposing wall 60b of the board box 60a, and It becomes possible to visually observe the MPU 62 through the opposing wall portion 60b.

The board box 60a is formed by combining a plurality of case bodies 60c back and forth, and these plurality of case bodies 60c prevent separation of these case bodies 60c and leave traces when these case bodies 60c are separated. A connecting portion 60e is provided for leaving a . A plurality of coupling portions 60e are arranged in parallel on one side of the substantially rectangular parallelepiped substrate box 60a. As a result, even if some of the joints 60e are destroyed and the case body 60c is separated in a state in which separation of the case body 60c is prevented using some joints 60e, another joint By bringing the portion 60e into the connected state, it becomes possible to prevent the case body 60c from being separated again. Furthermore, since the joint 60e is destroyed when the case body 60c is separated and traces thereof remain, it is possible to visually check the joint 60e to determine whether or not the case body 60c has been illegally separated. It becomes possible. Furthermore, a seal 60f is pasted on one side of the board box 60a opposite to the side on which the joint portions 60e are arranged so as to straddle the boundary between the case bodies 60c. When the sealing seal 60f is peeled off, an adhesive layer remains on the case body 60c. Thereby, when the seal 60f is peeled off when the case body 60c is separated, it is possible to leave a trace of the seal 60f.

In the main control device 60 having the above configuration, the main control board 61 includes a board owned by the game hall manager in order to generate an opportunity to change the setting state of the pachinko machine 10 in the range of "setting 1" to "setting 6". A setting key insertion section 68a into which a setting key is inserted and turned ON, an update button 68b operated to sequentially change the setting state of the pachinko machine 10 after the setting key insertion section 68a is turned ON, and a main controller. A reset button 68c that is operated to clear data in a main side RAM 65, which will be described later, is provided in the MPU 62 of 60, and first to third notification display devices 69a to 69c to notify the management results of game history. , is provided. Note that the setting state of the pachinko machine 10 is not limited to the six stages of "Setting 1" to "Setting 6", but can be any number of stages.

These setting key insertion section 68a, update button 68b, reset button 68c, and first to third notification display devices 69a to 69c are all provided on the element mounting surface of the main control board 61. Furthermore, as described above, the element mounting surface of the main control board 61 faces the opposing wall 60b of the board box 60a, but the setting key insertion section 68a, update button 68b, and reset button 68c are covered by the opposing wall 60b. Not known. That is, the opposing wall portion 60b has separate openings in areas facing each of the setting key insertion portion 68a, the update button 68b, and the reset button 68c. Thereby, it is possible to insert a setting key into the setting key insertion part 68a without having to open the board box 60a, it is possible to press the update button 68b, and it is possible to press the reset button 68c. Is possible.

By inserting the setting key into the setting key insertion part 68a and rotating it in a predetermined direction, the setting key insertion part 68a is turned on. By starting the supply of operating power to the pachinko machine 10 in this state (that is, by starting the supply of operating power to the MPU 62 of the main controller 60), it is possible to change the setting state of the pachinko machine 10. The state becomes changeable. In this state, each time the update button 68b is pressed once, the setting state of the pachinko machine 10 is changed one step at a time in ascending order within the range of "setting 1" to "setting 6." Note that if the update button 68b is operated in the state of "Setting 6", the state is updated to "Setting 1". In addition, by rotating the setting key inserted in the setting key insertion part 68a from the ON operation position in the opposite direction to the predetermined direction and returning it to the initial position, the setting key insertion part 68a can be turned OFF. Become. When the setting key insertion section 68a is turned off, the changeable state ends, and it becomes possible to play the game with the current setting values. In other words, even if the update button 68b is operated after the changeable state ends, the set value cannot be changed.

The ON operation for the setting key insertion section 68a is valid only when the supply of operating power to the pachinko machine 10 is started (that is, when the supply of operating power to the MPU 62 of the main controller 60 is started). Therefore, even if the setting key insertion section 68a is turned on after the process at the start of supply of operating power is completed in the MPU 62 of the main control device 60, the setting value cannot be changed.

The setting state of the pachinko machine 10 determines the advantage per unit time of the pachinko machine 10, and the larger the value of "setting n" (n is an integer from "1" to "6") (that is, the setting The higher the value), the higher the advantage. Details will be described later, but there are two lottery modes that determine the probability of winning a jackpot: a low probability mode in which the probability of winning is relatively low, and a high probability mode in which the probability of winning is relatively high. It is set so that the higher the probability, the higher the probability of winning a jackpot result in the low probability mode. On the other hand, regardless of the setting value, the winning probability of the jackpot result in the high probability mode is constant.

The reset button 68c is operated to clear the data in the main RAM 65 as described above, but in order to clear the data, operating power must be supplied to the pachinko machine 10 while the reset button 68c is pressed. (In other words, it is necessary to start supplying operating power to the MPU 62 of the main controller 60). The ON operation on the reset button 68c is enabled only when the supply of operating power to the pachinko machine 10 is started (that is, when the supply of operating power to the MPU 62 of the main controller 60 is started). Therefore, even if the reset button 68c is pressed after the MPU 62 of the main controller 60 completes the processing at the start of supply of operating power, the data in the main RAM 65 cannot be cleared.

Each of the first to third notification display devices 69a to 69c is a segment display device in which seven LED display segments are arranged, but the present invention is not limited to this. It may be a light emitting body, a liquid crystal display device, or an organic EL display. The first to third notification display devices 69a to 69c are all installed so that their display surfaces face the direction in which the element mounting surface of the main control board 61 faces, and are mounted on the opposing wall 60b of the board box 60a. covered. In this case, since the board box 60a is transparent, the display surfaces of the first to third notification display devices 69a to 69c housed in the board box 60a can be visually observed from the outside of the board box 60a. becomes possible. Further, as already explained, the main control device 60 is mounted on the back surface of the resin base 21 in the board box 60a so that the opposing wall portion 60b facing the element mounting surface of the main control board 61 faces toward the rear of the pachinko machine 10. Therefore, when the gaming machine main body 12 is opened to the front of the pachinko machine 10 with respect to the outer frame 11 and the back surface of the resin base 21 is exposed to the front of the pachinko machine 10, the first to third notifications are transmitted through the opposing wall portion 60b. It becomes possible to visually check the display surfaces of the display devices 69a to 69c.

On the display surface of the first notification display device 69a, not only numbers "0" to "9" but also various characters including alphabetical characters are displayed. On the other hand, numbers "0" to "9" are displayed on the second notification display device 69b and the third notification display device 69c. The game history management results are notified using the first to third notification display devices 69a to 69c. Further, in a changeable state in which the setting state of the pachinko machine 10 can be changed, a value corresponding to the current setting value is displayed on the third notification display device 69c. Note that the value corresponding to the set value may be displayed on the first notification display device 69a, or may be displayed on the second notification display device 69b. In addition, the setting value before the changeable state is displayed on one of the first to third notification display devices 69a to 69c, and the current setting value is displayed on the first to third notification display device. The information may be displayed on another one of the notification display devices 69a to 69c.

A sound emission control device 81 is provided above the main control device 60 on the back side of the inner frame 13 . The audio light emission control device 81 executes sound output control, light emission control, and control of the display control device 82 according to instructions from the main control device 60. Further, the audio light emission control device 81 executes light emission control of the LED chips mounted on the first decorative board 56 and the second decorative board 57.

As shown in FIG. 3, the back pack unit 15 is installed so as to cover the back side of the inner frame 13, including the main control device 60 and the sound emission control device 81. The back pack unit 15 includes a back pack 72 made of transparent synthetic resin, and a payout mechanism section 73 and a control device assembly unit 74 are attached to the back pack 72.

The payout mechanism section 73 includes a tank 75 to which game balls supplied from the island equipment of the game hall are sequentially replenished, and a payout device 76 for paying out the game balls stored in the tank 75. The game balls put out by the payout device 76 are delivered to the upper tray 54a or the lower tray 55a through a payout passage provided on the downstream side of the payout device 76. The dispensing mechanism section 73 is supplied with a main power source of, for example, 24 volts AC, and is equipped with a back pack board having a power switch for turning the power on and off.

The control device assembly unit 74 includes a payout control device 77 that has a function of controlling the payout device 76, and a predetermined amount of power required by various control devices, etc., is generated and outputted, and is also used to generate and output electricity when the player operates the firing operation device 28. A power supply/launch control device 78 is provided to control the launch of the game ball. The payout control device 77 and the power supply/launch control device 78 are arranged one on top of the other so that the payout control device 77 is located at the rear of the pachinko machine 10.

FIG. 7 is a front view of the pachinko machine 10 with the decorative covers 58, 59 and decorative boards 56, 57 removed. As shown in FIG. 1, the first decorative cover 58 has cylindrical cover fixing bosses 58a to 58c with the upper, lower left, and lower right portions of the first decorative cover 58 standing up at the rear of the pachinko machine 10. are integrally formed. Further, the second decorative cover 59 is integrally formed with cylindrical cover fixing bosses 59a and 59b, with the left and right parts of the back surface of the second decorative cover 59 erected toward the rear of the pachinko machine 10. Screw holes (not shown) are formed in the upright ends of these cover fixing bosses 58a to 58c, 59a, and 59b. As shown in FIG. 7, through holes 14a to 14e are formed in the front door frame 14 to correspond to these cover fixing bosses 58a to 58c, 59a, and 59b, and extend through the front door frame 14 in the front and back directions. . As shown in FIG. 1, the first decorative cover 58 and the second decorative cover 59 are attached to the front door frame 14 by fixing cover fixing bosses 58a to 58c, 59a, and 59b with screws from the back side of the front door frame 14. Fixed.

<Configuration of decorative substrates 56 and 57>
Next, the configuration of the decorative substrates 56 and 57 will be explained.

8(a) is a plan view showing a first mounting surface 84 which is one side of the first decorative board 56, and FIG. 8(b) is a plan view showing a bypass capacitor 85 mounted on the first decorative board 56. 8(c) is a plan view of the first mounting surface 84 of the first decorative board 56 showing an enlarged peripheral area 86 of the first decorative board 56. FIG. 88 is an enlarged plan view of the first mounting surface 84 of the first decorative board 56, and FIG. 9 is a cross-sectional view taken along the line AA in FIG. 8(a). 10(a) is a plan view showing the first mounting surface 89, which is one side of the second decorative board 57, and FIG. 10(b) is a plan view showing the bypass mounted on the second decorative board 57. 10(c) is a plan view of the first mounting surface 89 of the second decorative board 57 showing an enlarged view of the peripheral area 98 of the capacitor 97, and FIG. 7 is a plan view of the first mounting surface 89 of the second decorative board 57 showing an enlarged view of the peripheral region 102. FIG.

The decorative substrates 56 and 57 are four-layer substrates having a structure in which conductive layers and insulating layers are alternately laminated. As the insulating layer, a composite material such as a glass cloth base material impregnated with a thermosetting epoxy resin is used. The conductive layer is formed by etching a copper foil plate placed above or below the insulating layer.

As shown in FIG. 9, the first decorative board 56 has a first wiring layer 91 disposed on the first mounting surface 84 side of the first decorative board 56 as a conductive layer, and a first wiring layer 91 on the other side of the first decorative board 56. and a second wiring layer 92 disposed on the second mounting surface 95 side, which is the plate surface. The first decorative board 56 also includes a GND plane layer 93 (ground plane layer or ground plane layer) and a power plane layer 94 as conductive layers arranged between the first wiring layer 91 and the second wiring layer 92. It is equipped with. Lands and wiring patterns are formed in the first wiring layer 91 and the second wiring layer 92 by etching a copper foil plate.

Although not shown, the second decorative board 57, like the first decorative board 56, has a first wiring layer disposed on the first mounting surface 89 side as a conductive layer, and the other of the second decorative board 57. and a second wiring layer disposed on the second mounting surface side, which is the side plate surface. Further, like the first decorative board 56, the second decorative board 57 includes a GND plane layer (ground plane layer or ground plane layer) as a conductive layer disposed between the first wiring layer and the second wiring layer. , and a power plane layer. Lands and wiring patterns are formed in the first wiring layer and the second wiring layer by etching a copper foil plate.

As shown in FIG. 1, a stepped recess 56a corresponding to the lower left portion of the curved window portion 51 is formed at the upper right side of the first decorative substrate 56. Further, a notch 56b is formed at the lower left side of the first decorative board 56 to avoid the cover fixing boss 58b of the first decorative cover 58. By providing the notch 56b in the first decorative board 56, it is possible to provide the first decorative board 56 in a wide area behind the first decorative cover 58 while avoiding the cover fixing boss 58b.

The first decorative substrate 56 is an irregularly shaped substrate having a stepped recess 56a and a notch 56b. The first decorative substrate 56 is not a rectangular or substantially rectangular substrate. As shown in FIG. 8(a), the dimension of the first decorative board 56 in the first direction DR1 (vertical direction in FIG. 8(a)) is the same as the dimension of the first decorative board 56 in the second direction It is larger than the dimension in direction DR2 (left-right direction in FIG. 8(a)).

As shown in FIG. 10(a), the second decorative substrate 57 is shaped into a horizontally elongated substantially oval shape. The second decorative substrate 57 is not a rectangular or substantially rectangular substrate. The dimension of the second decorative substrate 57 in the long axis direction LD (horizontal direction in FIG. 10(a)) is larger than the dimension in the short axis direction SD (vertical direction in FIG. 10(a)) of the second decorative substrate 57.

As shown in FIG. 8(a), a protrusion 56c is provided approximately at the vertical center of the stepped recess 56a. The first decorative board 56 is passed through in the thickness direction at the upper left side of the first decorative board 56, the protruding part 56c, the lower left side, and the lower right side of the first decorative board 56, and the first decorative board 56 is inserted into the front surface of the front door frame 14. Fixing through holes 56d to 56g are formed to allow screw fixation. Further, as shown in FIG. 10(a), the second decorative board 57 is passed through the left and right parts of the second decorative board 57 in the thickness direction, so that the second decorative board 57 is inserted into the front door frame 14. Fixing through holes 57a and 57b are formed in which screws can be fixed.

As shown in FIG. 7, the front door frame 14 has a cylindrical substrate on which decorative substrates 56, 57 (FIGS. 8(a) and 10(a)) can be fixed. Fixed bosses 103 to 108 are integrally formed. The board fixing bosses 103 to 108 stand up in front of the pachinko machine 10 from the front surface of the front door frame 14, and decorative boards 56 and 57 can be fixed with screws to the ends of the upright ends of the board fixing bosses 103 to 108. Screw holes 103a to 108a are formed. The decorative boards 56 and 57 are screwed to the board fixing bosses 103 to 108 from the front of the pachinko machine 10, so that the first mounting surfaces 84 and 89 (FIGS. 8(a) and 10(a)) are attached to the pachinko machine 10. It is fixed to the front surface of the front door frame 14, as shown in FIG. 1, so as to face forward.

As already explained, the light emission control of the LED chips mounted on the decorative boards 56 and 57 and the sound output control of the speaker section 53 are performed by the audio light emission control device 81 (FIG. 3). As shown in FIG. 8(a), the first decorative board 56 has a first connector 111 and a second connector mounted on a second mounting surface 95 (FIG. A connector 112 is mounted. Further, as shown in FIG. 10(a), the second decorative board 57 has a third connector 113, a fourth connector 114 and A fifth connector 115 is mounted.

A harness (not shown) that electrically connects the sound emission control device 81 (FIG. 3) and the first decorative board 56 is attached to the first connector 111. A harness (not shown) that electrically connects the first decorative board 56 and the second decorative board 57 is attached to the second connector 112 and the third connector 113. Further, a harness (not shown) is attached to the fourth connector 114 and the fifth connector 115 to electrically connect the second decorative board 57 and the pair of left and right speaker sections 53. The audio light emission control device 81 outputs information for controlling the light emission of the LED chips mounted on the first decorative board 56 to the first decorative board 56. The audio light emission control device 81 also sends information to the second decorative board 57 via the first decorative board 56 to control the light emission of the LED chips mounted on the second decorative board 57 and the speaker section 53. Outputs information for controlling the sound output of.

As shown in FIG. 7, the front door frame 14 has connectors that penetrate the front door frame 14 in the front and rear directions in correspondence with the first to fifth connectors 111 to 115 (FIGS. 8(a) and 10(a)). First to fifth connector insertion holes 14f to 14j are formed. The decorative boards 56, 57 (FIGS. 8(a) and 10(a)) are in a state where the connectors 111 to 115 are inserted into the corresponding connector insertion holes 14f to 14j and exposed on the back side of the front door frame 14. and is fixed to the front door frame 14. Harnesses (not shown) are attached to and detached from the first to fifth connectors 111 to 115 from the rear side of the front door frame 14.

As shown in FIG. 8A, the first decorative board 56 is provided with a first light emitting circuit section 121, a second light emitting circuit section 122, and a third light emitting circuit section 123. Further, as shown in FIG. 10(a), the second decorative board 57 is provided with a fourth light emitting circuit section 124. These light emitting circuit units 121 to 124 include a circuit for controlling light emission of a plurality of LED chips.

The specific configurations of the light emitting circuit units 121 to 124 will be explained using the configuration of the first light emitting circuit unit 121 as an example.

FIG. 11 is a wiring diagram of the first light emitting circuit section 121 in the first decorative board 56. As shown in FIG. 11, the first light emitting circuit section 121 includes an LED driver 126, a bypass capacitor 85, 16 LED chips 127 to 142, and eight small chip resistors 87, 143 to 149. . Although not shown, the second to fourth light emitting circuit sections 122 to 124 also include an LED driver, a bypass capacitor, a plurality of LED chips, and a plurality of small chip resistors. Note that the number of LED chips included in each light emitting circuit section 121 to 124 is arbitrary, and the number of small chip resistors included in each light emitting circuit section 121 to 124 depends on the connection mode between the LED driver and the LED chip. It's decided.

As shown in FIG. 11, the LED driver 126 has a power terminal 151, a clock terminal 152, a data terminal 153, a GND terminal 154 (ground terminal or ground terminal), and first to eighth output terminals 155 to 162. , is equipped with. The clock terminal 152 is electrically connected to a wiring pattern 164 for inputting the clock signal received from the audio lighting control device 81, and the data terminal 153 is connected to the wiring pattern 164 for inputting the clock signal received from the audio lighting control device 81. An input wiring pattern 165 is electrically connected. Further, a second wiring pattern 172b for electrically connecting the LED driver 126 to the GND plane layer 93 (FIG. 9) is connected to the GND terminal 154, and a second wiring pattern 172b for electrically connecting the LED driver 126 to the GND plane layer 93 (FIG. 9) is connected to the power terminal 151. A fourth wiring pattern 172d that supplies power is electrically connected.

Note that the term "terminal" in this specification refers to a linear metal part (for example, , the power supply terminal 151 and the GND terminal 154 (FIG. 8(b)) in the LED driver 126. In addition, in this specification, "electrode" means electrically in plane with the corresponding pad (or pad). A metal part (for example, a first electrode 85a and a second electrode 85b (FIG. 8(b)) in a bypass capacitor 85 (described later)) provided on an electronic component (including a small chip component described later) for connection with the On the other hand, in this specification, "electrode" refers to an electronic component (such as a small chip component described later) for electrically connecting with a corresponding pad (or pad). ), and includes the above-mentioned "terminal".

The LED driver 126 controls the light emission of the LED chips 127 to 142 connected to the first to eighth output terminals 155 to 162 based on the lighting control data received from the audio light emission control device 81. Each of the output terminals 155 to 162 of the LED driver 126 has two LED chips among the 16 LED chips 127 to 142 described above and one small chip among the eight small chip resistors 87 and 143 to 149 described above. The resistor is electrically connected. Small chip resistors 87, 143-149 are provided to limit the current flowing through the LED chips 127-142. By providing the small chip resistors 87, 143 to 149, the LED chips 127 to 142 can be driven with less than the allowable current.

12(a) is an enlarged perspective view of the first mounting surface 84 side of the first decorative board 56 showing the vicinity of the bypass capacitor 85, and FIG. 12(b) is an enlarged view of the vicinity of the small chip resistor 87. FIG. 3 is a perspective view of the first mounting surface 84 side of the first decorative board 56 shown in FIG. As shown in FIG. 12A, the bypass capacitor 85 is a surface-mounted chip capacitor, specifically a multilayer ceramic capacitor in which a large number of dielectrics and electrodes are stacked. The bypass capacitor 85 has a substantially rectangular parallelepiped shape, and includes a pair of metal first electrodes 85a and second electrodes 85b at both ends in the longitudinal direction.

The bypass capacitor 85 has a dimension in a longitudinal direction along a plane perpendicular to the thickness direction of the bypass capacitor 85 (hereinafter also referred to as "longitudinal direction of the bypass capacitor 85") of 0.1 mm or more and 0.9 mm or less. It is a small chip component. In this specification, a small chip component is an electronic component whose dimension in the longitudinal direction of the small chip component (hereinafter also referred to as "longitudinal direction of the small chip component") is 0.1 mm or more and 0.9 mm or less. It is. Since the longitudinal dimension of the small chip component is 0.9 mm or less, the area occupied by the small chip component on the first decorative substrate 56 can be suppressed. This makes it possible to secure a large area on the first decorative board 56 for mounting electronic components other than the small chip component. Moreover, the electronic components mounted between the first decorative substrate 56 and a substrate with a high mounting density of electronic components can be commonly used as small chip components. When the longitudinal dimension of the small chip component is 0.1 mm or more, the mechanical strength at the connection point between the small chip component and the first decorative board 56 and the mechanical strength of the small chip component itself are reduced too much. You can prevent it from being put away. Here, the connection point of the small chip component includes a pad electrically connected to the electrode of the small chip component, a solder fillet that electrically connects the electrode and the pad, and a wiring pattern drawn out from the pad. . By setting the longitudinal dimension of the small chip component to 0.1 mm or more, it is possible to prevent it from becoming difficult to visually confirm whether or not the small chip component is missing from mounting. The longitudinal dimension of the small chip component is preferably 0.3 mm or more and 0.8 mm or less. Since the longitudinal dimension of the small chip component is 0.8 mm or less, the area occupied by the small chip component on the first decorative board 56 can be reduced. Since the longitudinal dimension of the small chip component is 0.3 mm or more, the mechanical strength at the connection point between the small chip component and the first decorative substrate 56 and the mechanical strength of the small chip component itself can be increased. Furthermore, it is possible to simplify the process for checking whether there is any omission in the mounting of small chip components. The longitudinal dimension of the small chip component is more preferably 0.4 mm or more and 0.7 mm or less. Since the longitudinal dimension of the small chip component is 0.7 mm or less, the area occupied by the small chip component on the first decorative substrate 56 can be further reduced. Since the longitudinal dimension of the small chip component is 0.4 mm or more, the mechanical strength at the connection point between the small chip component and the first decorative board 56 and the mechanical strength of the small chip component itself are increased, and the mechanical strength of the small chip component itself is increased. It is possible to reduce the possibility that the small chip component itself is damaged. In addition, since the longitudinal dimension of the small chip component is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting failure of the small chip component.

The bypass capacitor 85 has a dimension of approximately 0.6 mm in the longitudinal direction along a plane perpendicular to the thickness direction, and a width direction (hereinafter also referred to as "short direction") along the plane perpendicular to the thickness direction. ) and the dimension in the thickness direction are approximately 0.3 mm. By setting the longitudinal dimension of the bypass capacitor 85 to 0.7 mm or less, the area occupied by the bypass capacitor 85 on the first decorative board 56 can be reduced. Since the longitudinal dimension of the bypass capacitor 85 is 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 85 and the first decorative board 56 and the mechanical strength of the bypass capacitor 85 itself are increased, and the mechanical strength of the bypass capacitor 85 itself is increased. It is possible to reduce the possibility that the bypass capacitor 85 itself is damaged. Further, since the lengthwise dimension of the bypass capacitor 85 is 0.4 mm or more, it is possible to improve the accuracy of visually confirming whether or not the bypass capacitor 85 has not been mounted. Note that the lengthwise dimension of the bypass capacitor 85 may be smaller than 0.6 mm (for example, 0.4mm), and the bypass capacitor 85 may have a widthwise dimension smaller than 0.3mm. (for example, a configuration in which the thickness is 0.2 mm), or a configuration in which the dimension in the thickness direction is smaller than 0.3 mm (for example, a configuration in which the thickness is 0.2 mm) may be used.

The first decorative board 56 has, on the first mounting surface 84 side, a first pad 171a (or first pad) corresponding to the first electrode 85a of the bypass capacitor 85, and a second pad 171b corresponding to the second electrode 85b. (or a second putt). The first pad 171a and the second pad 171b are a pair. Two wiring patterns 172a and 172b are drawn out from the first pad 171a, and two wiring patterns 172c and 172d are drawn out from the second pad 171b. These pads 171a, 171b and wiring patterns 172a to 172d are integrally formed by etching a single copper foil plate.

The bypass capacitor 85 is mounted on the first mounting surface 84 side of the first decorative board 56 by soldering the electrodes 85a and 85b to the corresponding pads 171a and 171b. A solder fillet 173a that electrically connects the first electrode 85a and the first pad 171a is formed on the first pad 171a, and a solder fillet 173a that electrically connects the first electrode 85a and the first pad 171a is formed on the second pad 171b. A solder fillet 173b is formed to electrically connect the second pad 171b. The solder fillets 173a and 173b are formed by heating the solder paste applied on the pads 171a and 171b to become molten solder, and then cooling and solidifying the solder paste. In the longitudinal direction of the bypass capacitor 85, the first electrode 85a is fixed approximately at the center of the first pad 171a, and the second electrode 85b is fixed approximately at the center of the second pad 171b.

As shown in FIG. 8B, the first wiring pattern 172a drawn out from the first pad 171a connected to the first electrode 85a of the bypass capacitor 85 is connected to the first wiring pattern 172a through the via hole 174 provided in the first decorative board 56. The second wiring pattern 172b drawn out from the first pad 171a is electrically connected to the GND terminal 154 of the LED driver 126. Further, the third wiring pattern 172c drawn out from the second pad 171b electrically connected to the second electrode 85b of the bypass capacitor 85 is connected to the power plane layer 94 through the via hole 175 provided in the first decorative board 56. (FIG. 9), and the fourth wiring pattern 172d drawn out from the second pad 171b is electrically connected to the power terminal 151 of the LED driver 126. In this way, the first pad 171a is arranged between the GND terminal 154 of the LED driver 126 and the GND plane layer 93, and the second pad 171b is arranged between the power terminal 151 of the LED driver 126 and the power plane layer 94. placed in between.

The bypass capacitor 85 is capable of accumulating charge, and reduces the peaks of the noise component included in the drive power source of the LED driver 126 by charging, and reduces the valleys of the noise component by discharging. In this way, the bypass capacitor 85 absorbs noise components contained in the drive power source of the LED driver 126.

By disposing the bypass capacitor 85 between the power supply terminal 151 of the LED driver 126 and the power plane layer 94, noise components contained in the drive power supplied from the audio emission control device 81 to the LED driver 126 are reduced. The influence on the LED driver 126 can be reduced. As shown in FIG. 8(b), the bypass capacitor 85 is placed close to the power supply terminal 151 so that no electronic components such as other ICs are present between the bypass capacitor 85 and the power supply terminal 151 of the LED driver 126. It is located. This increases the possibility that noise components included in the drive power supplied to the power supply terminal 151 of the LED driver 126 will be absorbed by the bypass capacitor 85, and also allows the LED driver 126 to reduce the influence of the noise components. This can reduce the possibility of erroneous operation due to reception. Since the configuration is such that no other IC exists between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component does not cause other ICs to erroneously operate. This can prevent it from being activated. In addition, since the configuration does not include any other electronic components between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component is absorbed by other electronic components. It is possible to prevent electronic components from malfunctioning.

As shown in FIG. 12(b), like the bypass capacitor 85 (FIG. 12(a)), the small chip resistor 87 has a substantially rectangular parallelepiped shape, and has a pair of metal first electrodes at both ends in the longitudinal direction. 87a and a second electrode 87b. Similar to the bypass capacitor 85, the small chip resistor 87 has a longitudinal direction along a plane perpendicular to the thickness direction of the small chip resistor 87 (hereinafter also referred to as the "longitudinal direction of the small chip resistor 87"). It is a small chip component whose dimensions are 0.1 mm or more and 0.9 mm or less. The small chip resistor 87 has a longitudinal dimension of approximately 0.6 mm along a plane perpendicular to the thickness direction, and a transversal dimension (hereinafter also referred to as "transversal direction") along a plane orthogonal to the thickness direction. This is a small chip component with dimensions of approximately 0.3 mm in the thickness direction. Since the longitudinal dimension of the small chip resistor 87 is 0.7 mm or less, the area occupied by the small chip resistor 87 on the first decorative substrate 56 can be reduced. Since the longitudinal dimension of the small chip resistor 87 is 0.4 mm or more, the mechanical strength at the connection point between the small chip resistor 87 and the first decorative board 56 and the mechanical strength of the small chip resistor 87 itself are improved. It is possible to increase the resistance and reduce the possibility that the connection point is damaged, and also to reduce the possibility that the small chip resistor 87 itself is damaged. Furthermore, since the longitudinal dimension of the small chip resistor 87 is 0.4 mm or more, it is possible to improve the accuracy of visually confirming whether or not the small chip resistor 87 is missing from mounting. Note that the longitudinal dimension of the small chip resistor 87 may be smaller than 0.6 mm (for example, 0.4 mm), and the small chip resistor 87 may have a transverse dimension of 0.3 mm. (eg, 0.2 mm), or may have a dimension in the thickness direction smaller than 0.3 mm (eg, 0.2 mm).

The first decorative board 56 has, on the first mounting surface 84 side, a first pad 176a (or first pad) corresponding to the first electrode 87a of the small chip resistor 87, and a second pad 176a (or first pad) corresponding to the second electrode 87b. A pad 176b (or a second pad) is provided. The first pad 176a and the second pad 176b are a pair. One wiring pattern 181a is drawn out from the first pad 176a, and one wiring pattern 181b is drawn out from the second pad 176b. These pads 176a, 176b and wiring patterns 181a, 181b are integrally formed by etching a single copper foil plate.

The small chip resistor 87 is mounted on the first mounting surface 84 side of the first decorative substrate 56 by soldering electrodes 87a and 87b to corresponding pads 176a and 176b. A solder fillet 177a that electrically connects the first electrode 87a and the first pad 176a is formed on the first pad 176a, and a solder fillet 177a that electrically connects the first electrode 87a and the first pad 176a is formed on the second pad 176b. A solder fillet 177b is formed to electrically connect the second pad 176b. The solder fillets 177a and 177b are formed by heating the solder paste applied on the pads 176a and 176b to become molten solder, and then cooling and solidifying the solder paste. In the longitudinal direction of the small chip resistor 87, the first electrode 87a is fixed approximately at the center of the first pad 176a, and the second electrode 87b is fixed approximately at the center of the second pad 176b.

As shown in FIG. 8(c), the LED chip 142 is a surface-mounted chip component. The LED chip 142 has a substantially rectangular parallelepiped shape, and includes a pair of metal first electrodes 142a and second electrodes 142b at both longitudinal ends. The first decorative board 56 also includes a copper first pad 178a (or first pad) corresponding to the first electrode 142a, and a copper second pad 178b (or second pad) corresponding to the second electrode 142b. ) is provided. The first pad 178a and the second pad 178b are a pair.

The first wiring pattern 181a drawn out from the first pad 176a of the small chip resistor 87 is electrically connected to the second pad 178b of the LED chip 142. Further, the second wiring pattern 181b drawn out from the second pad 176b of the small chip resistor 87 is electrically connected to the eighth output terminal 162 of the LED driver 126.

As described above, electronic components such as connectors 111 to 115, LED drivers 126, LED chips 127 to 142, bypass capacitors 85 and 97, and small chip resistors 87, 101, 143 to 149 are mounted on the decorative boards 56 and 57. has been done. Among these electronic components, the external dimensions of the small chip components (bypass capacitors 85, 97 and small chip resistors 87, 101, 143 to 149) are smaller than those of other electronic components, and the electrodes and pads of the small chip components The contact area with the pad (or pad) is smaller than the contact area between the electrode and the pad (or pad) in other electronic components. Therefore, among the various electronic components mounted on the decorative substrates 56, 57, the connection points between small chip components and the decorative substrates 56, 57 are compared with the connection points between other electronic components and the decorative substrates 56, 57. Therefore, mechanical strength is low. In this specification, the connection points between the small chip component and the decorative substrates 56 and 57 include pads that are electrically connected to the electrodes of the small chip component, and pads that are electrically connected to the electrodes of the small chip component and the pads. The pad includes a solder fillet and a wiring pattern drawn out from the pad. Specifically, at the connection point between the bypass capacitor 85 and the first decorative board 56, there are pads 171a, 171b electrically connected to the electrodes 85a, 85b of the bypass capacitor 85, and electrodes 85a, 85b of the bypass capacitor 85. 85b and pads 171a, 171b, and wiring patterns 172a to 172d drawn out from the pads 171a, 171b. Further, at the connection point between the small chip resistor 87 and the first decorative board 56, pads 176a and 176b electrically connected to the electrodes 87a and 87b of the small chip resistor 87, and pads 176a and 176b of the small chip resistor 87 are provided. It includes solder fillets 177a, 177b that electrically connect electrodes 87a, 87b and pads 176a, 176b, and wiring patterns 181a, 181b drawn out from pads 176a, 176b.

By using small chip components (bypass capacitors 85, 97 and small chip resistors 87, 101, 143 to 149) that are smaller than electronic components such as the LED driver 126 and LED chips 127 to 142, capacitors can be installed on the decorative substrates 56 and 57. While the area occupied by the resistor and the resistor can be reduced, if distortion occurs in the decorative substrates 56, 57, the connection points between the small chip components and the decorative substrates 56, 57 are likely to be damaged. This poses a problem in that the small chip components themselves are more likely to be damaged. In this specification, damage to the connection point between the small chip component and the decorative substrates 56, 57 includes damage in which a crack occurs in the solder fillet that electrically connects the electrode and pad (or pad) of the small chip component, and This includes damage in which the solder fillet is peeled off, damage in which the pads are peeled off from the decorative substrates 56 and 57, and damage in which the wiring patterns around the pads are peeled off from the decorative substrates 56 and 57. Furthermore, in this specification, damage to the small chip component itself includes damage in which the small chip component is cracked, and damage in which the internal structure of the small chip component (for example, the laminated structure of the bypass capacitors 85 and 97) is destroyed. It will be done.

When the decorative substrates 56, 57 on which small chip components are mounted are screwed to the front door frame 14, the second mounting surface 95 of the decorative substrates 56, 57 may be distorted. When a harness (not shown) is attached to or detached from the connectors 111 to 115 mounted on the board, and during use, electronic components such as the LED driver 126 and the LED chips 127 to 142 mounted on the first decorative board 56 There is a case in which the decorative substrates 56 and 57 are subjected to thermal stress due to the heat generated. Further, in a manufacturing method in which electronic components including small chip components are mounted on a collective board including a plurality of decorative boards 56, 57, and then the collective board is divided to take out a plurality of decorative boards 56, 57, the collective board is divided. In such cases, distortion may occur in the decorative substrates 56 and 57 on which small chip components are mounted. In these cases, there is a possibility that bending stress will act on the decorative substrates 56, 57, and there is a possibility that torsional stress will act on the decorative substrates 56, 57.

FIG. 13(a) is a plan view of the first mounting surface 84 of the first decorative board 56 showing an enlarged view of the peripheral area 182 (FIG. 8(b)) of the bypass capacitor 85, and FIG. FIG. 6 is an explanatory diagram for explaining the relationship between pads 171a and 171b in region 182 and solder resist 222. FIG. Further, FIG. 13(c) is an explanatory diagram for explaining the movement mode of the bypass capacitor 85 that may occur in the present embodiment, and FIG. 13(d) is an explanatory diagram for explaining the movement mode of the bypass capacitor 85 that may occur in the comparative example. It is an explanatory diagram for explanation. Note that in FIG. 13(b), the solder resist 222 is shown hatched.

As shown in FIG. 13A, the first pad 171a and second pad 171b corresponding to the first electrode 85a and second electrode 85b of the bypass capacitor 85 are formed into a substantially rectangular shape. As shown in FIG. 13(b), the first pad 171a and the second pad 171b have the same shape and size. The vertical dimension LA1 of the pads 171a and 171b is approximately 0.35 mm, which is larger than the widthwise dimension (approximately 0.3 mm) of the bypass capacitor 85. Since the pair of pads 171a, 171b have the same shape and size, the amount of solder paste applied on the pair of pads 171a, 171b can be made substantially the same. Note that the vertical dimension LA1 of the pads 171a and 171b may be the same as the widthwise dimension of the bypass capacitor 85, and the vertical dimension LA1 of the pads 171a and 171b is smaller than the widthwise dimension of the bypass capacitor 85. It may also be a configuration.

The lateral dimension LA2 of the pads 171a and 171b is approximately 0.32 mm. The first pad 171a and the second pad 171b are provided at a predetermined interval LA3 (specifically approximately 0.28 mm) in the longitudinal direction (first direction DR1) of the bypass capacitor 85 (FIG. 13(a)). It is being The distance (predetermined interval LA3) between the outer edge of the first pad 171a on the second pad 171b side and the outer edge of the second pad 171b on the first pad 171a side is the length of the bypass capacitor 85 in the longitudinal direction (approximately 0.6 mm). ) is set in the range of approximately 1/3 (0.2 mm) to approximately 1/2 (approximately 0.3 mm). Thereby, in the longitudinal direction of the bypass capacitor 85, the first electrode 85a of the bypass capacitor 85 is located approximately at the center of the first pad 171a, and the second electrode 85b is located approximately at the center of the second pad 171b. The bypass capacitor 85 can be mounted on the first decorative board 56.

Solder resist 222 is not applied between the first pad 171a and the second pad 171b. If the solder resist 222 is applied to a narrow area between the first pad 171a and the second pad 171b, some or all of the pads 171a and 171b may be soldered if there is a deviation in the applied area of the solder resist 222. The probability of occurrence of defective products covered by the resist 222 increases. On the other hand, since the solder resist 222 is not applied between the first pad 171a and the second pad 171b, it is possible to prevent part or all of these pads 171a and 171b from being covered with the solder resist 222. It is possible to prevent the solder paste from adhering to the entire area of these pads 171a and 171b. As a result, it is possible to secure the connection area between the first pad 171a and the first electrode 85a and to ensure the mechanical strength of the connection point between the first pad 171a and the first electrode 85a, and also to ensure the connection area between the first pad 171a and the first electrode 85a. By ensuring a connection area with the second electrode 85b, it is possible to ensure mechanical strength at the connection point between the second pad 171b and the second electrode 85b.

As shown in FIG. 13(a), since the pair of pads 171a and 171b are spaced apart in the first direction DR1, which is the longitudinal direction of the bypass capacitor 85, the first decorative substrate 56 is placed in a reflow oven in the reflow process. When the first decorative board 56 is transported in the second direction DR2 perpendicular to the first direction DR1, the heating of the solder paste applied on the pair of pads 171a and 171b is substantially reduced. They can be started at the same time.

The solder paste applied to the pads 171a and 171b is heated in a reflow oven and becomes liquid molten solder. The molten solder floats and attracts the electrodes 85a and 85b of the bypass capacitor 85. The solder paste contains a flux component, and the molten solder flows on the pads 171a and 171b. Further, gas is released from the molten solder. If the solder paste melts on one pad 171a of the pair of pads 171a, 171b before the other pad 171b, only one electrode 85a of the pair of electrodes 85a, 85b of the bypass capacitor 85 comes into contact with the molten solder. As a result, the balance of forces acting on the electrodes 85a, 85b of the bypass capacitor 85 is disrupted due to the surface tension of the molten solder. Then, rotation of the bypass capacitor 85, in which the bypass capacitor 85 rotates around the normal direction of the first decorative substrate 56, is likely to occur, and the bypass capacitor 85 is placed on one pad 171a with one electrode 85a. So-called chip standing, which stands up almost vertically, is likely to occur. In this way, if there is a difference in the timing of melting of the solder paste between the pair of pads 171a and 171b, rotation of the bypass capacitor 85 and chipping are likely to occur. In contrast, in the reflow process, the first decorative board 56 is transported in the second direction DR2 and heating of the solder paste applied on the pair of pads 171a and 171b is started almost simultaneously, so that the The melting timing of the solder paste between 171a and 171b can be aligned, and rotation of the bypass capacitor 85 and generation of chips can be prevented.

As shown in FIG. 8(b), the bypass capacitor 85 is mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the bypass capacitor 85 is parallel to the first direction DR1. As shown in FIG. 8C, the small chip resistor 87 is mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip resistor 87 is parallel to the first direction DR1. Although not shown, the small chip resistors 143 to 149 are also mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip resistors 143 to 149 is parallel to the first direction DR1. In this way, the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149) are mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip components is parallel to the first direction DR1. has been done.

As shown in FIGS. 8(b) and 8(c), the spacing direction of the pads 171a, 171b corresponding to the electrodes 85a, 85b of the bypass capacitor 85, and the pad 176a, corresponding to the electrodes 87a, 87b of the small chip resistor 87, The separating direction of 176b is the first direction DR1. In a plurality of small chip components, the pads 171a, 171b, 176a, and 176b have a common spacing direction. Therefore, in the reflow process, by transporting the first decorative substrate 56 in a direction (second direction DR2) orthogonal to the common separation direction (first direction DR1) or in a direction substantially perpendicular to the common separation direction (first direction DR1), the pair of bypass capacitors 85 are It is possible to align the timing at which the heating of the solder paste applied on the pair of pads 171a, 171b corresponding to the electrodes 85a, 85b is started, and also to correspond to the pair of electrodes 87a, 87b of the small chip resistor 87. The heating of the solder paste applied on the pair of pads 176a and 176b can be started at the same timing. Thereby, rotation of the plurality of small chip components and generation of chip standing can be prevented.

In pads 171a and 171b corresponding to electrodes 85a and 85b of bypass capacitor 85, heat easily escapes to wiring patterns 172a to 172d at locations where wiring patterns 172a to 172d are drawn out (positions where wiring patterns 172a to 172d are drawn out). Therefore, the temperature rise in the initial stage of heating in the reflow process is likely to be delayed compared to a portion where the wiring patterns 172a to 172d are not drawn out. Further, the first wiring pattern 172a and the third wiring pattern 172c connected to the GND plane layer 93 or the power plane layer 94, which have a large area compared to the pads 171a and 171b, are connected to the GND plane layer 93 or the power plane layer 94. Compared to the second wiring pattern 172b and the fourth wiring pattern 172d which are not connected to the wiring pattern 94, the temperature rise in the initial stage of heating is delayed. Therefore, in the first pad 171a, the portion where the first wiring pattern 172a connected to the GND plane layer 93 is drawn out is different from the portion where the second wiring pattern 172b is drawn out in the initial stage of heating. Temperature rise tends to be delayed. Further, the temperature of the portion of the second pad 171b where the third wiring pattern 172c connected to the power plane layer 94 is drawn out is higher than that of the portion where the fourth wiring pattern 172d is drawn out at the initial stage of heating. Rise tends to be delayed. In the reflow process, the temperature distribution within the pads 171a, 171b at the initial stage of heating changes depending on the number of wiring patterns 172a to 172d drawn out from the pair of pads 171a, 171b, the drawing positions, and the connection destinations. Furthermore, the direction in which the wiring patterns 172a to 172d are drawn out from the pair of pads 171a and 171b may also affect the temperature distribution within the pads 171a and 171b at the initial stage of heating. Although the details will be described later, in the first decorative substrate 56 in this embodiment, the pair of pads 171a, 171b are arranged so that there is no difference in temperature distribution within the pads 171a, 171b in the initial stage of heating. The number of wiring patterns 172a to 172d drawn out from 171b, their drawn-out positions, connection destinations, and drawn-out directions are set.

As shown in FIG. 13(d), in the bypass capacitor 183 in the comparative example, the first wiring pattern 185a is drawn out toward the right from the right end of the first pad 184a (or the first pad), and the A second wiring pattern 185b is drawn out from the left end of the first pad 184a toward the left. The first wiring pattern 185a in the comparative example is a wiring pattern that is electrically connected to the GND plane layer 93 (FIG. 9) via the via hole 174, similar to the first wiring pattern 172a of the present embodiment described above. In addition, the second wiring pattern 185b in the comparative example is a wiring pattern electrically connected to the GND terminal 154 of the LED driver 126, similar to the second wiring pattern 172b in the present embodiment described above. Further, a third wiring pattern 185c is drawn out downward from the lower end of the second pad 184b (or the second pad), and a fourth wiring pattern 185d is drawn out leftward from the left end of the second pad 184b. It's being pulled out. The third wiring pattern 185c in the comparative example is a wiring pattern that is electrically connected to the power plane layer 94 (FIG. 9) via the via hole 175, similar to the third wiring pattern 172c in the present embodiment described above. In addition, the fourth wiring pattern 172d in the comparative example is a wiring pattern electrically connected to the power supply terminal 151 of the LED driver 126, similar to the fourth wiring pattern 172d in the present embodiment described above. In the first pad 184a, the temperature rise in the initial stage of heating is likely to be delayed at the locations where the first wiring pattern 185a and the second wiring pattern 185b are drawn out (the right end and left end of the first pad 184a). In particular, the temperature rise tends to be delayed at a portion where the first wiring pattern 185a connected to the GND plane layer 93 is drawn out (the left end portion of the first pad 184a). Further, in the second pad 184b, the temperature rise in the initial stage of heating tends to be delayed in the portions where the third wiring pattern 185c and the fourth wiring pattern 185d are drawn out (the lower end and left end of the second pad 184b). In particular, the temperature rise tends to be delayed at a portion where the third wiring pattern 185c connected to the power plane layer 94 is drawn out (the lower end portion of the second pad 184b). Therefore, in the initial heating stage of the reflow process, the temperature of the upper right side of the second pad 184b tends to rise. When the solder paste is melted only at the upper right side of the second pad 184b, the upper right side of the second pad 184b becomes the center of rotation, and the first decorative board 56 There is a possibility that the bypass capacitor 183 rotates with the normal direction as the rotation axis, and that the bypass capacitor 183 is mounted on the first decorative board 56 in an inclined state. In this case, the connection area between the first pad 184a and the first electrode 183a by the solder fillet 186 becomes small, which may cause a connection failure. Furthermore, due to the rotation of the bypass capacitor 183, there is a possibility that the bypass capacitor 183 may be mounted in a state where the first pad 184a and the first electrode 183a are not in electrical contact with each other. Furthermore, tip standing, where the bypass capacitor 183 stands up on one electrode 183a above the first pad 184a, is likely to occur. As described above, in the comparative example in which the wiring patterns 185a to 185d drawn out from the first pad 184a and the second pad 184b are drawn out at different positions, defective mounting of the bypass capacitor 183 is likely to occur.

On the other hand, in the first decorative board 56 according to the present embodiment, as shown in FIG. 172c is pulled out to the right from the second pad 171b. Further, the second wiring pattern 172b is drawn out to the left from the first pad 171a, and the fourth wiring pattern 172d is drawn out to the left from the second pad 171b. In a configuration in which the same number (specifically, two) of wiring patterns 172a to 172d are drawn out from the first pad 171a and the second pad 171b, the first wiring pattern 172a is drawn out when viewed from the center of the first pad 171a. The direction (rightward direction) in which the side of the first pad 171a that is drawn is present is the direction in which the side of the second pad 171b from which the third wiring pattern 172c is drawn out is present when viewed from the center of the second pad 171b. (rightward direction), and the direction (leftward direction) in which the side of the first pad 171a from which the second wiring pattern 172b is drawn out is present when viewed from the center of the first pad 171a. This is the same direction (left direction) as the side of the second pad 171b from which the fourth wiring pattern 172d is drawn when viewed from the center of the pad 171b. This makes it possible to prevent a difference in temperature distribution between the pair of pads 171a and 171b during the initial heating stage of the reflow process, and also to prevent rotation of the bypass capacitor 85 and generation of chips.

A plurality of capacitors (not shown) whose longitudinal dimensions along a plane perpendicular to the thickness direction are larger than the small chip components are mounted on the first decorative board 56. When viewed from the center of the first pad (or first pad) electrically connected to one electrode, the direction in which the side of the first pad from which the first wiring pattern is drawn is the second electrode of the capacitor. The direction is different from the direction in which the side of the second pad from which the third wiring pattern is drawn out exists when viewed from the center of the second pad electrically connected to the second pad. In the bypass capacitor 85, which is a small chip component, there are two directions: the direction in which the side of the first pad 171a from which the first wiring pattern 172a is drawn out exists when viewed from the center of the first pad 171a, and the direction in which the side of the first pad 171a from which the first wiring pattern 172a is drawn exists when viewed from the center of the second pad 171b. The third wiring pattern 172c is drawn out in the same direction as the side of the second pad 171b, and the second wiring pattern 172b is drawn out when viewed from the center of the first pad 171a. The direction in which the side of the first pad 171a exists is the same as the direction (left direction) in which the side of the second pad 171b, from which the fourth wiring pattern 172d is drawn, exists when viewed from the center of the second pad 171b. By oriented in this direction, rotation of the bypass capacitor 85 and occurrence of chip standing are prevented.

As shown in FIG. 8B, in the first pad 171a, the first wiring pattern 172a electrically connected to the GND plane layer 93 (FIG. 9) via the via hole 174 is drawn out from the first pad 171a. The third wiring pattern 172c, which is approximately in the vertical center of the right end of the second pad 171a and electrically connected to the power plane layer 94 (FIG. 9) via the via hole 175, is drawn out from the second pad 171b. This is approximately the center in the vertical direction at the right end of the second pad 171b. The GND plane layer 93 has a larger area than the first pad 171a, and the power plane layer 94 has a larger area than the second pad 171b.

The first pad 171a is electrically connected to the GND plane layer 93, which has a wider area than the first pad 171a, via the first wiring pattern 172a, and the second pad 171b is electrically connected via the third wiring pattern 172c. In a configuration in which the first wiring pattern 172a is electrically connected to the power plane layer 94 having a larger area than the second pad 171b, the first wiring pattern 172a is located on one of the four sides of the first pad 171a when viewed from the center of the first pad 171a. The direction in which the drawn out side exists (rightward direction) is the direction in which the drawn out side of the third wiring pattern 172c exists when viewed from the center of the second pad 171b among the four sides of the second pad 171b. (to the right). This reduces the possibility that a difference will occur in the temperature distribution within the pair of pads 171a, 171b in the initial heating stage of the reflow process.

As shown in FIG. 13(a), the width dimension of the first wiring pattern 172a drawn out to the right from the right end of the first pad 171a is the same as that of the third wiring pattern 172a drawn out to the right from the right end of the second pad 171b. This is approximately the same width as the wiring pattern 172c. Therefore, compared to a configuration in which the wiring patterns 172a and 172c have different width dimensions, the possibility that a difference will occur in the temperature distribution within the pair of pads 171a and 171b in the initial heating stage of the reflow process is reduced. Furthermore, the width dimension of the second wiring pattern 172b drawn out to the left from the left end of the first pad 171a is approximately the same as the width dimension of the fourth wiring pattern 172d drawn out to the left from the left end of the second pad 171b. are the same. Therefore, compared to a configuration in which the wiring patterns 172b and 172d have different width dimensions, the possibility that a difference will occur in the temperature distribution within the pair of pads 171a and 171b in the initial heating stage of the reflow process is reduced.

As already explained, the first wiring pattern 172a electrically connected to the GND plane layer 93 is drawn out from the right end of the first pad 171a, so the right side of the first pad 171a is the left side of the first pad 171a. The temperature rise in the initial stage of heating is more likely to be delayed. Further, since the third wiring pattern 172c connected to the power plane layer 94 is drawn out from the right end of the second pad 171b, the right side of the second pad 171b is more likely to be formed in the initial stage of heating than the left side of the second pad 171b. Temperature rise tends to be delayed. The number of wiring patterns 172a, 172c drawn out from the first pad 171a is the same as the number of wiring patterns 172b, 172d drawn out from the second pad 171b. Further, among the four sides of the first pad 171a, the direction in which the side on which the first wiring pattern 172a is drawn out when viewed from the center of the first pad 171a is the same as the side on which the second wiring pattern 172a is drawn out among the four sides of the second pad 171b. The direction is the same as the direction in which the side where the third wiring pattern 172c is drawn out is when viewed from the center of the pad 171b. The direction in which the side from which the second wiring pattern 172b is drawn out exists is the direction in which the side from which the fourth wiring pattern 172d is drawn out exists when viewed from the center of the second pad 171b among the four sides of the second pad 171b. is in the same direction as As a result, the force acting on the first electrode 85a of the bypass capacitor 85 due to the surface tension of the molten solder on the first pad 171a, and the force acting on the second electrode 85b of the bypass capacitor 85 due to the surface tension of the molten solder on the second pad 171b. It is possible to balance the acting forces. Therefore, even if only the left side of the solder paste melts first in the pair of pads 171a and 171b, the movement mode of the bypass capacitor 85 is parallel movement as shown in FIG. 13(c), and the bypass Rotation of the capacitor 85 can be prevented. As a result, it is possible to suppress the degree of reduction in the connection area between the first pad 171a and the first electrode 85a due to the solder fillet 173a, and also to reduce the connection area between the second pad 171b and the second electrode 85b due to the solder fillet 173b. It is possible to suppress the degree of

14(a) is a plan view of the first mounting surface 84 of the first decorative board 56 showing an enlarged view of the peripheral area 187 (FIG. 8(c)) of the small chip resistor 87, and FIG. 14(b) is a plan view of the first mounting surface 84 of the first decorative board 56. FIG. 6 is an explanatory diagram for explaining the relationship between the pads 176a and 176b of the peripheral area 187 and the solder resist 222. FIG. Further, FIG. 14(c) is an explanatory diagram for explaining the movement mode of the small chip resistor 87 that may occur in this embodiment, and FIG. 14(d) is an explanatory diagram for explaining the movement mode of the small chip resistor 191 that may occur in the comparative example. FIG. In addition, in FIG. 14(b), the solder resist 222 is shown hatched.

As shown in FIG. 14(a), the first pad 176a and second pad 176b corresponding to the first electrode 87a and second electrode 87b of the small chip resistor 87 are formed into a substantially rectangular shape. As shown in FIG. 14(b), the first pad 176a and the second pad 176b have the same shape and size. The vertical dimension LB1 of the pads 176a, 176b is approximately 0.35 mm, which is larger than the widthwise dimension (approximately 0.3 mm) of the small chip resistor 87. Since the pair of pads 176a, 176b have the same shape and size, the amount of solder paste applied on the pair of pads 176a, 176b can be approximately the same. Note that the vertical dimension LB1 of the pads 176a, 176b may be the same as the widthwise dimension of the small chip resistor 87, or the vertical dimension LB1 of the pads 176a, 176b may be the same as the widthwise dimension of the small chip resistor 87. It may be configured to be smaller than the dimensions.

The lateral dimension LB2 of the pads 176a and 176b is approximately 0.32 mm. The first pad 176a and the second pad 176b are spaced apart by a predetermined distance LB3 (specifically approximately 0.28 mm) in the longitudinal direction (first direction DR1) of the small chip resistor 87 (FIG. 14(a)). It is provided. The distance (predetermined distance LB3) between the outer edge of the first pad 176a on the second pad 176b side and the outer edge of the second pad 176b on the first pad 176a side is the dimension in the longitudinal direction of the small chip resistor 87 (approximately 0 It is set in the range of approximately 1/3 (0.2 mm) to approximately 1/2 (approximately 0.3 mm) of .6 mm). As a result, in the longitudinal direction of the small chip resistor 87, the first electrode 87a of the small chip resistor 87 is located approximately at the center of the first pad 176a, and the second electrode 87b is located approximately at the center of the second pad 176b. The small chip resistor 87 can be mounted on the first decorative substrate 56 in this manner.

No solder resist 222 is applied between the first pad 176a and the second pad 176b. If the solder resist 222 is applied to a narrow area between the first pad 176a and the second pad 176b, if the applied area of the solder resist 222 is misaligned, part or all of the pads 176a and 176b will be soldered. The probability of occurrence of defective products covered by the resist 222 increases. On the other hand, since the solder resist 222 is not applied between the first pad 176a and the second pad 176b, it is possible to prevent part or all of these pads 176a, 176b from being covered with the solder resist 222. It is possible to prevent the solder paste from adhering to the entire area of these pads 176a and 176b. Thereby, it is possible to secure the connection area between the first pad 176a and the first electrode 87a and to ensure the mechanical strength of the connection point between the first pad 176a and the first electrode 87a, and also to ensure the connection area between the first pad 176a and the first electrode 87a. By ensuring a connection area with the second electrode 87b, it is possible to ensure mechanical strength at the connection point between the second pad 176b and the second electrode 87b.

As shown in FIG. 14(d), in the small chip resistor 191 in the comparative example, the first wiring pattern 193a is drawn out from the right end of the first pad 192a (or the first pad) toward the right, and A second wiring pattern 193b is drawn out toward the left from the left end of the second pad 192b (or second pad). The first wiring pattern 193a in the comparative example is a wiring pattern electrically connected to the second electrode 142b (FIG. 8(c)) of the LED chip 142, similar to the first wiring pattern 181a of the present embodiment described above. In addition, the second wiring pattern 193b in the comparative example is a wiring pattern electrically connected to the eighth output terminal 162 of the LED driver 126, similar to the second wiring pattern 181b in the present embodiment described above. . The temperature rise on the right side of the first pad 192a from which the first wiring pattern 193a is drawn out tends to be delayed in the initial heating stage of the reflow process, compared to the left side from which the wiring pattern is not drawn out. Further, the left side of the second pad 192b from which the second wiring pattern 193b is drawn out tends to have a slower temperature rise in the initial heating stage than the right side from which the wiring pattern is not drawn out. Therefore, in the initial stage of heating, only the left side of the solder paste on the first pad 192a and only the right side of the solder paste on the second pad 192b are likely to be melted, as shown in FIG. 14(d). In addition, the small chip resistor 191 rotates with the normal direction of the first decorative board 56 serving as the rotation axis, and there is a risk that the small chip resistor 191 may be mounted on the first decorative board 56 in an inclined state. . If the small chip resistor 191 is mounted in an inclined state, the connection area between the first pad 184a and the first electrode 183a by the solder fillet 194 becomes small, and the connection area between the second pad 184b and the second electrode 183b becomes small. The connection area by the solder fillet 195 becomes small. Further, due to the rotation of the small chip resistor 191, the small chip resistor 191 may be mounted in a state where the first pad 192a and the first electrode 191a are not in electrical contact. Furthermore, chip standing, where the small chip resistor 191 stands up with one electrode 191a on the first pad 192a, is likely to occur. As described above, in the comparative example in which the wiring patterns 193a and 193b are drawn out at different positions in the pair of pads 192a and 192b, mounting defects of the small chip resistor 191 are likely to occur.

On the other hand, in the first decorative board 56 in this embodiment, as shown in FIG. 14(a), the first wiring pattern 181a is drawn out from the right end of the first pad 176a toward the right. A second wiring pattern 181b is drawn out to the right from the right end of the second pad 176b. The first wiring pattern 181a is drawn out from the right end of the first pad 176a at approximately the center in the vertical direction, and the second wiring pattern 181b is drawn out at the right end of the second pad 176b at about the center in the vertical direction. In a configuration in which the same number (specifically, one) of wiring patterns 181a and 181b are drawn out from the first pad 176a and the second pad 176b, the center of the first pad 176a among the four sides of the first pad 176a is The direction in which the side from which the first wiring pattern 181a is drawn out exists (rightward direction) is the direction in which the side from which the second wiring pattern 181b is drawn out when viewed from the center of the second pad 176b among the four sides of the second pad 176b. This is the same direction as the side that is located (to the right). Thereby, it is possible to prevent a difference in temperature distribution between the pair of pads 176a and 176b in the initial heating stage of the reflow process, and also to prevent rotation of the small chip resistor 87 and occurrence of chip standing.

The first decorative board 56 is equipped with a plurality of resistors (not shown) whose longitudinal dimensions along a plane perpendicular to the thickness direction are larger than the small chip components. Among the four sides of the first pad (or first pad) that is electrically connected to the first electrode of the device, the direction in which the side from which the first wiring pattern is drawn out exists when viewed from the center of the first pad is , Among the four sides of the second pad (or second pad) electrically connected to the second electrode of the resistor, there is a side on which the second wiring pattern is drawn out when viewed from the center of the second pad. This is different from the direction in which it is carried out. In the small chip resistor 87, which is a small chip component, there is a direction in which the side on which the first wiring pattern 181a is drawn out is located when viewed from the center of the first pad 176a among the four sides of the first pad 176a, and a second direction. By setting the direction in which the side from which the second wiring pattern 181b is drawn out when viewed from the center of the second pad 176b among the four sides of the pad 176b to be the same direction, the rotation of the small chip resistor 87 is prevented. Also, the occurrence of chip standing is prevented.

Since the right end of the first pad 176a is the extraction position of the first wiring pattern 181a, the temperature rise in the initial stage of heating is more likely to be delayed than the left end of the first pad 176a. Further, since the right end of the second pad 176b is the extraction position of the second wiring pattern 181b, the temperature rise in the initial stage of heating is more likely to be delayed than the left end of the second pad 176b. The number of wiring patterns 181a drawn out from the first pad 176a is the same as the number of wiring patterns 181b drawn out from the second pad 176b. Among the four sides of the first pad 176a, the direction (rightward direction) in which the side where the first wiring pattern 181a is drawn out when viewed from the center of the first pad 176a is This is the same direction as the side where the second wiring pattern 181b is drawn out when viewed from the center of the second pad 176b. As a result, the force acting on the first electrode 87a of the small chip resistor 87 due to the surface tension of the molten solder on the first pad 176a, and the force acting on the first electrode 87a of the small chip resistor 87 due to the surface tension of the molten solder on the second pad 176b. The forces acting on the two electrodes 87b can be balanced. Therefore, even if only the left side of the solder paste of the pair of first pads 176a and second pads 176b melts first, the movement of the small chip resistor 87 will change as shown in FIG. 14(c). is caused to move in parallel, and rotation of the small chip resistor 87 can be prevented. As a result, it is possible to suppress the degree of reduction in the connection area between the first pad 176a and the first electrode 87a due to the solder fillet 177a, and also to reduce the connection area between the second pad 176b and the second electrode 87b due to the solder fillet 177b. It is possible to suppress the degree of

As already explained, the first pad 176a, which is electrically connected to the first electrode 87a of the small chip resistor 87, is electrically connected to the second electrode 142b of the LED chip 142 via the first wiring pattern 181a. It is electrically connected to the second pad 178b (see FIG. 8(c)). Moreover, as already explained, the second pad 176b electrically connected to the second electrode 87b of the small chip resistor 87 is connected to the LED driver 126 (FIG. 8(a)) via the second wiring pattern 181b. It is electrically connected to a pad (or pad, not shown) that is electrically connected to the eighth output terminal 162 (FIG. 11). As shown in FIGS. 8(a) and 8(c), the second pad 178b to which the connection is made is located upward when viewed from the first pad 176a, and the second pad 178b to which the connection is made when viewed from the second pad 176b is located upward. A pad (or pad, not shown) corresponding to the eighth output terminal 162 exists in the upper left direction. The part where the second wiring pattern 181b is connected to the pad (not shown) corresponding to the eighth output terminal 162 is connected to the second wiring pattern 181b from the second pad 176b in the drawing direction (FIGS. 8(a) and 8(c)). When viewed in one axis direction (second direction DR2 in FIGS. 8A and 8C) including the right direction in FIGS. 8A and 8C, the second wiring from the second pad 176b is It exists in a direction opposite to the drawing direction of the pattern 181b. The second wiring pattern 181b is drawn out from the second pad 176b in the same direction (right direction) as the direction in which the first wiring pattern 181a is drawn out from the first pad 176a, and then the second wiring pattern 181b is drawn out in the direction of the one axis (second direction DR2 ), it is routed in the opposite direction with respect to the second pad 176b.

A location where the second wiring pattern 181b exists in a direction opposite to the direction in which the second wiring pattern 181b is drawn out from the second pad 176b with the second pad 176b as a reference when viewed in the uniaxial direction (second direction DR2) Also in the configuration in which the second wiring pattern 181b is connected to the connection destination, the second wiring pattern 181b is drawn out from the second pad 176b in the same direction as the direction in which the first wiring pattern 181a is drawn out from the first pad 176a. This can reduce the possibility that a difference will occur in the temperature distribution within the pair of first pad 176a and second pad 176b in the initial heating stage of the reflow process.

As shown in FIG. 14(a), the width dimension of the first wiring pattern 181a drawn out to the right from the right end of the first pad 176a is the same as that of the second wiring pattern 181a drawn out to the right from the right end of the second pad 176b. The width dimension is approximately the same as the width dimension of the wiring pattern 181. Therefore, compared to a configuration in which the wiring patterns 181a and 181b drawn out from the pads 176a and 176b have different width dimensions, there is a difference in temperature distribution within the pair of pads 176a and 176b in the initial heating stage of the reflow process. The possibility of this occurring is reduced.

As already explained with reference to FIGS. 8(a) to 8(c), in the first decorative substrate 56, the small chip components are arranged such that the longitudinal direction of the small chip components is in the first direction DR1 (the first decorative substrate 56 It is mounted on the first decorative substrate 56 in a manner parallel to the longitudinal direction). Therefore, compared to the case where the small chip component is mounted on the first decorative board 56 in such a manner that the longitudinal direction thereof is orthogonal to the first direction DR1 (the longitudinal direction of the first decorative board 56), the first decorative board 56 The maximum value of the stress that can act on the connection point between the small chip component and the first decorative board 56 when distortion occurs in the small chip component is reduced, and the maximum value of the stress that can act on the small chip component itself is reduced. ing.

As described above, a plurality of capacitors (not shown) are mounted on the first decorative substrate 56, and the capacitors (not shown) are larger in length in the plane perpendicular to the thickness direction than the small chip components. Some of these capacitors are mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the capacitors is not parallel to the first direction DR1. The small chip component is protected by being mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip component is orthogonal to the first direction DR1.

As shown in FIG. 10(b), the bypass capacitor 97 is mounted on the second decorative board 57 in such a manner that the longitudinal direction of the bypass capacitor 97 is parallel to the long axis direction LD of the second decorative board 57. Further, as shown in FIG. 10(c), the small chip resistor 101 is mounted on the second decorative substrate 57 in such a manner that the longitudinal direction of the small chip resistor 101 is parallel to the longitudinal direction LD of the second decorative substrate 57. has been implemented. In this way, the small chip components (bypass capacitor 97 and small chip resistor 101) are mounted on the second decorative substrate 57 in such a manner that the longitudinal direction of the small chip components is parallel to the long axis direction LD of the second decorative substrate 57. Since the small chip component is mounted on the second decorative board 57, compared to the case where the longitudinal direction of the small chip component is perpendicular to the long axis direction LD of the second decorative board 57, The maximum value of stress that can act on the connection point between the small chip component and the second decorative board 57 when distortion occurs is reduced, and the maximum value of stress that can act on the small chip component itself is reduced. There is.

As shown in FIG. 8B, in the first decorative board 56, the first wiring pattern 172a drawn out from the first pad 171a and the third wiring pattern 172c drawn out from the second pad 171b are connected to bypass capacitors. The bypass capacitor 85 extends in a direction perpendicular to the longitudinal direction of the bypass capacitor 85 (one of the short sides of the bypass capacitor 85). Further, the second wiring pattern 172b drawn out from the first pad 171a and the fourth wiring pattern 172d drawn out from the second pad 171b are connected in a direction perpendicular to the longitudinal direction of the bypass capacitor 85 (the short side of the bypass capacitor 85). direction). In this way, the wiring patterns 172a to 172d drawn out from the pads 171a and 171b of the bypass capacitor 85 extend in a direction (short direction) perpendicular to the longitudinal direction of the bypass capacitor 85. Note that the wiring patterns 172a to 172d drawn out from the pads 171a and 171b of the bypass capacitor 85 may extend in a direction substantially perpendicular to the longitudinal direction of the bypass capacitor 85.

As already explained, the pads 171a, 171b and the wiring patterns 172a to 172d are integrally formed, and the electrodes 85a, 85b of the bypass capacitor 85 are fixed to the pads 171a, 171b by solder fillets 173a, 173b. If the wiring patterns 172a to 172d drawn out from the pads 171a and 171b are configured to extend in a direction parallel to the longitudinal direction of the bypass capacitor 85, a fold line extending in a direction perpendicular or substantially perpendicular to the longitudinal direction is formed. When a force that bends the first decorative board 56 with respect to the base point acts on the first decorative board 56, the connecting portion between the bypass capacitor 85 and the first decorative board 56 is likely to be damaged, and the bypass capacitor 85 itself is likely to be damaged. Furthermore, in this configuration, stress acting around the bypass capacitor 85 due to distortion of the first decorative board 56 is likely to be transmitted to the bypass capacitor 85 itself, and the bypass capacitor 85 is likely to be damaged. On the other hand, by configuring the wiring patterns 172a to 172d drawn out from the pads 171a and 171b to extend in a direction perpendicular or substantially perpendicular to the longitudinal direction of the bypass capacitor 85, the first decorative board 56 The maximum value of stress that can act on the connection point between the bypass capacitor 85 and the first decorative board 56 is reduced when distortion occurs in the bypass capacitor 85 and the bypass capacitor 85 The maximum value of the stress that can act on itself is reduced. Thereby, it is possible to prevent damage to the connecting portion between the bypass capacitor 85 and the first decorative board 56, and it is also possible to prevent damage to the bypass capacitor 85 itself.

As described above, the first decorative board 56 is equipped with a plurality of capacitors (not shown) whose longitudinal dimension along the plane perpendicular to the thickness direction is larger than that of the small chip components, and some of these capacitors , the wiring pattern drawn out from the pad (or pad) electrically connected to the electrode of the capacitor is drawn out in a direction different from the direction orthogonal to the longitudinal direction of the capacitor or the direction substantially orthogonal to the longitudinal direction of the capacitor. . The bypass capacitor 85, which is a small chip component, is protected by having wiring patterns 172a to 172d drawn out from the pads 171a and 171b extending in a direction perpendicular or substantially perpendicular to the longitudinal direction of the bypass capacitor 85. has been done.

As already explained, the wiring patterns 181a and 181b drawn out from the pads 176a and 176b of the small chip resistor 87 are arranged in the second direction DR2 (the direction of the small chip resistor 87) perpendicular to the longitudinal direction of the small chip resistor 87. It extends in the lateral direction). Moreover, as already explained, the small chip resistor 87 is electrically connected to the wiring patterns 181a, 181b by solder fillets 177a, 177b that electrically contact the electrodes 87a, 87b and the pads 176a, 176b. If the wiring patterns 181a and 181b drawn out from the pads 176a and 176b are configured to extend in a direction parallel to the longitudinal direction of the small chip resistor 87, distortion of the first decorative board 56 causes damage to the area around the bypass capacitor 85. The applied stress is likely to be transmitted to the bypass capacitor 85 itself, and the bypass capacitor 85 is likely to be damaged. On the other hand, the wiring patterns 181a and 181b drawn out from the pads 176a and 176b of the small chip resistor 87 are in a direction perpendicular to the longitudinal direction of the small chip resistor 87 (the short direction of the small chip resistor 87). Alternatively, by configuring them to extend in substantially perpendicular directions, the maximum value of stress that can act on the small chip resistor 87 can be reduced. This makes it possible to prevent damage to the connecting portion between the small chip resistor 87 and the first decorative board 56 when the first decorative board 56 is distorted.

As described above, a plurality of resistors (not shown) whose longitudinal dimensions along a plane perpendicular to the thickness direction are larger than the small chip components are mounted on the first decorative board 56, and one of these resistors is In this section, the direction of the wiring pattern drawn out from the pad (or pad) electrically connected to the electrode of the resistor is in a direction different from the direction perpendicular to the longitudinal direction of the resistor and the direction substantially perpendicular to the longitudinal direction of the resistor. It's being pulled out. The small chip resistor 87, which is a small chip component, has a configuration in which wiring patterns 181a and 181b drawn out from the pads 176a and 176b extend in a direction perpendicular or substantially perpendicular to the longitudinal direction of the small chip resistor 87. protected by

As shown in FIGS. 8(a) to 8(c), small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are mounted on the first decorative board 56. It is mounted only on the surface 84 side and not on the second mounting surface 95 side. In the first decorative board 56, in a configuration in which small chip components are concentrated on the first mounting surface 84 side, the LED chips 127 to 142 (FIG. 11) and the LED driver 126 are also mounted on the first mounting surface 84.

15(a) is a plan view showing the second mounting surface 95 of the first decorative board 56, and FIG. 15(b) is a plan view of the first decorative board 56 showing the back side area 205 of the first light emitting circuit section 121 in an enlarged manner. FIG. 3 is a plan view of a second mounting surface 95 of FIG. As shown in FIG. 15(b), no small chip component is mounted on the LED back side corresponding area 201 of the second mounting surface 95. The LED back side corresponding area 201 includes an area of the second mounting surface 95 located on the back side of the area where the LED chips 127 to 142 (FIG. 9) are mounted on the first mounting surface 84 (FIG. 8(a)) and the corresponding second mounting surface 95. The distance from the outer edge of the area of the second mounting surface 95 is within 1 mm. Due to the configuration in which small chip components are not mounted in the area of the second mounting surface 95 located on the back side of the area where the LED chips 127 to 142 are mounted on the first mounting surface 84, the LED chips 127 to 142 are mounted. The influence of thermal stress that may act on the first decorative substrate 56 due to heat generation on the small chip components is reduced. The LED backside corresponding region 201 is a region that is repeatedly heated by the heat generated when the LED chips 127 to 142 are driven, and is a region where the first decorative substrate 56 is likely to be distorted by heat. If a small chip component is mounted in the LED back side corresponding area 201, the light emission effect on the first decorative board 56 is repeatedly executed, and thermal stress is generated at the connection point between the small chip component and the first decorative board 56. There is a risk that thermal stress loads may accumulate in the small chip components themselves. On the other hand, since the small chip components are mounted avoiding the LED backside corresponding area 201, the light emitting effect on the first decorative board 56 is repeatedly executed, which causes the small chip components and the first decorative It is possible to prevent the connection point with the board 56 from being damaged, and also to prevent the small chip component itself from being damaged.

As shown in FIG. 15(b), no small chip component is mounted on the driver back side corresponding area 202 of the second mounting surface 95. The driver back side corresponding area 202 is a pad (or pad) corresponding to the area where the LED driver 126 (FIG. 8(a)) is mounted and the terminal of the LED driver 126 on the first mounting surface 84 (FIG. 8(a)). The second mounting surface 95 is located on the back side of the region where the second mounting surface 95 is provided, and the distance from the outer edge of the second mounting surface 95 is within 1 mm. Due to the configuration in which small chip components are not mounted in the area of the second mounting surface 95 located on the back side of the area where the LED driver 126 is mounted on the first mounting surface 84, the heat generated by the LED driver 126 causes the first The influence of thermal stress that may act on the decorative substrate 56 on the small chip components is reduced. The driver backside corresponding region 202 is a region that is repeatedly heated by the heat generated when the LED driver 126 is driven, and is a region where the first decorative substrate 56 is likely to be distorted by heat. If a small chip component is mounted in the area 202 corresponding to the back side of the driver, the light emitting effect on the first decorative board 56 is repeatedly executed, thereby causing thermal stress at the connection point between the small chip component and the first decorative board 56. There is a risk that thermal stress loads may accumulate in the small chip components themselves. On the other hand, since the small chip components are mounted avoiding the area 202 corresponding to the back side of the driver, the light emitting effect on the first decorative board 56 is repeatedly executed, which causes the small chip components and the first decorative It is possible to prevent the connection point with the board 56 from being damaged, and also to prevent the small chip component itself from being damaged.

As shown in FIGS. 8(a) to 8(c), in the first decorative board 56, the small chip components (bypass capacitor 85 and small chip resistor 87) are located at a distance of 1 mm or more from the outer edge of the LED chip 142. It is placed and placed. By arranging the small chip component at a distance of 1 mm or more from the outer edge of the LED chip 142, it is possible to prevent the connection point between the small chip component and the first decorative board 56 from being damaged due to thermal stress, and It is possible to prevent the small chip component itself from being damaged by thermal stress.

As shown in FIGS. 8(a) to 8(c), in the first decorative board 56, small chip components (bypass capacitor 85 and small chip resistor 87) are connected to the outer edge of the LED driver 126 and the terminals of the LED driver 126. is placed at a distance of 1 mm or more from the corresponding pad. By arranging the small chip component at a distance of 1 mm or more from the outer edge of the LED driver 126 and the pad corresponding to the terminal of the LED driver 126, the connection point between the small chip component and the first decorative board 56 can be prevented from being damaged by thermal stress. It is possible to prevent the small chip components from being put away, and also to prevent the small chip components themselves from being damaged due to thermal stress.

As shown in FIGS. 8(a) to 8(c), in the first decorative board 56, small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are placed around the through holes. It is arranged avoiding the regions 211a to 211d. The through-hole peripheral regions 211a to 211d are regions whose distance from the outer edge of the fixed through holes 56d to 56g is less than 5 mm. When fixing the first decorative board 56 to the front door frame 14 with screws, a force that causes distortion in the first decorative board 56 may act on the through-hole peripheral regions 211a to 211d. By arranging the small chip components at a distance of 5 mm or more from the outer edges of the fixing through holes 56d to 56g, chips that may occur near the fixing through holes 56d to 56g when the first decorative board 56 is screwed to the front door frame 14 can be avoided. It is possible to prevent the connection portion between the small chip component and the first decorative board 56 from being damaged due to the distortion of the first decorative board 56, and also to prevent the small chip component itself from being damaged.

As shown in FIG. 8(a), the fixed through holes 56d to 56g are provided at the corners of the first decorative board 56. Therefore, compared to a configuration in which the fixed through holes 56d to 56g are provided near the center of the first decorative board 56, the area of the area on the first decorative board 56 where small chip components cannot be mounted is reduced.

As already explained, the fixed through hole 56e is provided in the protrusion 56c of the stepped recess 56a. This makes it possible to stably fix the first decorative board 56 to the front door frame 14 while ensuring an area in which small chip components can be mounted.

In the configuration in which the small chip components are concentrated on the first mounting surface 84, the connectors 111 and 112 are concentrated on the second mounting surface 95, as shown in FIG. 15(a). As shown in FIG. 8A, on the first mounting surface 84, the small chip components are arranged avoiding the connector back side corresponding areas 203 and 204. The connector back side corresponding areas 203 and 204 are the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95 (FIG. 15(a)) and the first mounting surface. This is an area where the distance from the outer edge of area 84 is less than 5 mm. By having a configuration in which small chip components are not mounted in the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95, the harness to the connectors 111 and 112 is The influence of stress that may act on the first decorative substrate 56 upon attachment and detachment on the small chip components is reduced. The connector back side corresponding areas 203 and 204 are areas where tensile stress is likely to act when a harness (not shown) is attached to the connectors 111 and 112, and where compressive stress is likely to act when the harness is pulled out from the connectors 111 and 112. This is an easy area. If the configuration is such that small chip components are mounted in the connector back side corresponding areas 203 and 204, stress may be applied to the connection points between the small chip components and the first decorative board 56 when the harness is attached to and removed from the connectors 111 and 112. In addition, there is a risk that stress may be applied to the small chip components themselves. On the other hand, since the small chip components are arranged avoiding the areas 203 and 204 corresponding to the back side of the connector, the connection points between the small chip components and the first decorative board 56 are fixed when attaching and detaching the harness to the connectors 111 and 112. This prevents damage, and also prevents the small chip component itself from being damaged.

As shown in FIG. 8A, the LED driver 126 is arranged in an area including an area less than 10 mm from the outer edge of the first decorative board 56, and small chip components (bypass capacitor 85 and small chip resistor 87) , 143 to 149 (FIG. 11)) are arranged at a distance of 10 mm or more from the outer edge of the first decorative substrate 56. As already explained, of the various electronic components mounted on the first decorative board 56, the connection points between small chip components and the first decorative board 56 are different from the connection points between other electronic components and the first decorative board 56. In comparison, mechanical strength is low. Since the small chip components are arranged at a distance of 10 mm or more from the outer edge of the first decorative board 56, when handling the first decorative board 56, an operator's hand may come into contact with the small chip components and the small chip components may The possibility that the connection point with the first decorative board 56 will be damaged is reduced, and the possibility that the small chip component itself will be damaged is also reduced.

Small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged avoiding areas around the through holes 211a to 211d and areas where the distance from the outer edge of the first decorative board 56 is less than 10 mm. In this configuration, the fixed through holes 56d to 56g are provided in an area where the distance from the outer edge of the first decorative substrate 56 is less than 10 mm. Therefore, compared to a configuration in which the fixing through holes 56d to 56g are provided at positions 10 mm or more away from the outer edge of the first decorative board 56, the area of the area on the first decorative board 56 in which small chip components can be mounted is larger. is widely secured.

As shown in FIG. 8(b), around the LED driver 126 on the first decorative board 56, there is an outline silk 213 that allows the mounting position of the LED driver 126 to be known, and the mounted electronic components are arranged around the LED driver 126. An identification silk 214 (displayed as "IC1") is provided to allow identification. Further, as shown in FIG. 8(c), around the LED chip 142, there is an outline silk 215 that allows the mounting position of the LED chip 142 to be determined, and an external shape silk 215 that allows the mounting position of the LED chip 142 to be recognized, and that the mounted electronic component is the LED chip 142. An identification silk 216 (displayed as "LED 16") is provided to enable identification. As shown in FIG. 9, the first wiring layer 91 is covered with a solder resist 222. The outline silk 213 and the identification silk 214 are printed in a manner convex from the first mounting surface 84 . Printing of the outer shape silks 213, 215 and identification silks 214, 216 is performed before electronic components are mounted on the first decorative substrate 56.

After mounting electronic components including small chip components on the first decorative board 56, when visually confirming that no electronic components have been left unmounted, the operator must place the outline silks 213 and 215 on the By comparing the locations where the electronic components (LED driver 126 and LED chip 142) are mounted, it is possible to determine whether the electronic components are mounted at accurate locations. Further, the operator can grasp the type of the mounted electronic component (LED driver 126 and LED chip 142) based on the display contents of the identification silks 214 and 216.

As shown in FIG. 8(b), only an identification silk 217 (labeled "C1") is provided around the bypass capacitor 85 to make it possible to confirm that the mounted electronic component is the bypass capacitor 85. There is no outline silk that makes it possible to determine the mounting position of the bypass capacitor 85. As already explained, the external dimensions (vertical dimension, horizontal dimension, and height dimension) of the bypass capacitor 85 are compared with the external dimensions of electronic components other than small chip components (LED driver 126 and LED chips 127 to 142, etc.). small. Therefore, if the outline silk of the bypass capacitor 85 is printed on the first decorative board 56, even though the bypass capacitor 85 is actually not mounted after the electronic components are mounted, the bypass capacitor 85 is printed only by looking at the outline silk. There is a possibility that the operator may mistakenly recognize that 85 is installed. On the other hand, by adopting a configuration in which no outline silk is provided around the bypass capacitor 85, it is possible to easily identify whether the bypass capacitor 85 is not mounted after mounting the electronic components. Further, by providing the identification silk 217 around the bypass capacitor 85, it is possible to recognize that the component mounted around the identification silk 217 is the bypass capacitor 85.

As already explained, the outer dimensions of the small chip resistor 87 are smaller than the outer dimensions of electronic components other than small chip components, similar to the outer dimensions of the bypass capacitor 85. As shown in FIG. 8(c), around the small chip resistor 87 there is an identification silk 218 (displayed with "R8") that allows confirmation that the mounted electronic component is the small chip resistor 87. ) is provided, and no outline silk that makes it possible to confirm the mounting position of the small chip resistor 87 is provided. Thereby, it is possible to easily understand whether the small chip resistor 87 is missing in mounting. Further, since the identification silk 218 is provided around the small chip resistor 87, it is possible to recognize that the electronic component mounted around the identification silk 218 is the small chip resistor 87. be able to. Note that when an electronic component is mounted on the first decorative board 56 using an automatic mounting device, the automatic mounting device mounts the electronic component by controlling coordinates from a reference position on the first decorative board 56. Even in a configuration in which no external silk is provided around the small chip component, the mounting position of the small chip component will not shift.

The font size of the identification silks 217 and 218 provided around the small chip components (bypass capacitor 85 and small chip resistor 87) is the same as that of the electronic components (LED driver 126 and LED chip 142) that are larger than the small chip components. This is the same size as the character size of the identification silks 214 and 216 provided around the periphery. This facilitates visual confirmation of the identification silks 217 and 218 provided around the small chip components.

FIG. 16(a) is a cross-sectional view of the first decorative substrate 56 in this embodiment, and FIG. 16(b) is a cross-sectional view of the first decorative substrate 224 in a comparative example. As already explained, the pair of pads 171a, 171b corresponding to the pair of electrodes 85a, 85b of the bypass capacitor 85 are spaced approximately 0.28 mm apart in the longitudinal direction of the bypass capacitor 85. Moreover, as already explained, the solder resist 222 is not applied between the first pad 171a and the second pad 171b (see FIG. 16(a)). In the step of applying the solder paste to the first decorative board 56, the first mounting surface 84 and the second mounting surface 95 (FIG. 9) of the first decorative board 56 are masked by a metal mask 226 in which an opening is formed. The metal mask 226 is, for example, a thin metal plate with a thickness of approximately 150 μm. The metal mask 226 is provided with openings that penetrate the metal mask 226 in the thickness direction at positions corresponding to the pads (or pads) of the first decorative substrate 56. Solder paste is applied onto the pads through the openings in metal mask 226. Since the metal mask 226 has a uniform thickness, it is possible to uniformly apply solder paste to each pad.

As shown in FIG. 16(b), the outer silks 225a and 225b are convex with respect to the surface of the solder resist 222, so the small chip components (bypass capacitor 85 and small chip resistor 87 (FIGS. 8(b) and 87) 8(c))), the outer silks 225a and 225b exist between the first mounting surface 84 and the metal mask 226, and the first mounting The distance between the surface 84 and the metal mask 226 increases. In this configuration, there is a possibility that the solder paste 227 may wrap around the gap existing between the first pad 171a and the second pad 171b, and the first pad 171a and the second pad 171b may be electrically connected. In particular, when applying the solder paste 221 to a large number of first decorative substrates 56 continuously, the solder paste 221 accumulated on the edge of the opening of the metal mask 226 tends to wrap around the back side of the opening. The first pad 171a and the second pad 171b are likely to be electrically connected. In contrast, in this embodiment, as shown in FIG. 16(a), no outline silk is provided around the small chip component. This can prevent the distance between the first mounting surface 84 and the metal mask 226 from becoming too large, and can also prevent the occurrence of soldering defects in which the solder paste 221 gets between the pads 171a and 171b. I can do it. Further, it is possible to prevent a part of the small chip component from resting on the outer silk and causing a soldering defect.

Next, a method for manufacturing the decorative substrates 56 and 57 will be explained.

As a method for efficiently manufacturing the first decorative substrate 56, after electronic components are mounted on a collective substrate (printed wiring board before electronic components are mounted) including a plurality of first decorative substrates 56, the collective substrate is divided. A possible method is to take out a plurality of first decorative substrates 56 with electronic components mounted thereon at a time. In addition, as a method for efficiently manufacturing the second decorative board 57, after mounting electronic components on a collective board (printed wiring board before electronic components are mounted) including a plurality of second decorative boards 57, the collective board A conceivable method is to divide the board and take out a plurality of second decorative boards 57 with electronic components mounted thereon at once. By manufacturing the decorative boards 56 and 57 using these methods, the number of times the electronic component mounting process is performed can be reduced compared to manufacturing the decorative boards 56 and 57 with electronic components mounted one by one. It is possible to reduce the amount of damage and increase the manufacturing efficiency of the decorative substrates 56 and 57. Below, a method for manufacturing the decorative substrates 56 and 57 will be described, taking as an example a method for efficiently manufacturing the first decorative substrate 56.

FIG. 17(a) is a plan view showing the first plate surface 268 which is one side of the collective substrate 231, and FIG. 17(b) is a plan view showing the first plate surface 268 which is a plate surface on one side of the collective substrate 231. FIG. FIG. 17C is an explanatory diagram for explaining how to divide the collective substrate 231 into valleys, and FIG. It is an explanatory diagram. Note that, in reality, a plurality of electronic components are mounted on each of the first decorative boards 56 included in the collective board 231, and wiring patterns and the like are also formed. c) is shown in a simplified manner to avoid complication of the drawing.

The collective board 231 is a four-layer board having a structure in which conductive layers and insulating layers are alternately stacked, similar to the decorative boards 56 and 57 described above. As shown in FIG. 17(a), a collective board 231 is produced by processing a part of a single printed wiring board formed into a substantially square shape by rotating a drill-like cutting tool (router) with a blade on the side. It is created by cutting out the printed wiring board using a router or the like and forming dividing grooves 232 to 247 and slits 251 to 258 in the printed wiring board.

The collective substrate 231 is divided into four first decorative substrates 56 and seven disposable substrates 261-267 by dividing grooves 232-247 and slits 251-258. Processing to form the dividing grooves 232 to 247 and the slits 251 to 258 on the collective substrate 231 is performed before electronic components are mounted on the collective substrate 231. The collective substrate 231 is divided using the dividing grooves 232 to 247 and the slits 251 to 258.

The dividing grooves 232 to 247 are formed into linear shapes by cutting the collective substrate 231 using, for example, a disk-shaped blade that rotates at high speed. The dividing grooves 232 to 247 have V-shaped cross sections that reduce the thickness of the collective substrate 231, and the bottoms of the dividing grooves 232 to 247 have the smallest thickness. The regions of the collective substrate 231 where the dividing grooves 232 to 247 are formed have lower mechanical strength than the regions where the dividing grooves 232 to 247 are not formed. Therefore, by dividing the collective substrate 231 using the dividing grooves 232 to 247 as base points, the stress acting on the first decorative substrate 56 when dividing the collective substrate 231 can be reduced. This makes it possible to reduce the stress that may be applied to the connection points between the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149) and the first decorative board 56 when dividing the collective board 231. At the same time, stress that may act on the small chip component itself can be reduced. Further, it is possible to prevent the base point of division from shifting from the division grooves 232 to 247. Note that the cross-sectional shape of the dividing grooves 232 to 247 is not limited to the V-shape. The cross-sectional shape of the dividing grooves 232 to 247 may be rectangular or U-shaped as long as the shape allows the collective substrate 231 to be easily separated by external force.

Since the dividing grooves 232 to 247 are formed in a straight line, they act more easily on the first decorative substrate 56 when dividing the collective substrate 231, compared to a configuration in which the dividing grooves 232 to 247 are formed in a curved shape. Possible stresses are reduced.

In this embodiment, the dividing grooves 232 to 247 make it easy to distinguish between the first plate surface 268 and the second plate surface 269 (FIG. 17(b)), which is the plate surface on the opposite side of the first plate surface 268. In order to improve the workability of the substrate dividing process, it is formed only on the first plate surface 268 side of the collective substrate 231. The slits 251 to 258 are formed, for example, by the router process described above. The slits 251 to 258 are elongated holes, and are formed wider than the dividing grooves 232 to 247.

As shown in FIG. 17A, a vertically elongated substantially rectangular central disposable substrate 261 is provided at the center of the collective substrate 231 in the left-right direction. A pair of first decorative substrates 56 are provided on the left side of the central disposable substrate 261 with the dividing grooves 232 and 233 in between, and a pair of first decorative substrates 56 are provided on the right side of the central disposable substrate 261 with the dividing grooves 234 and 235 in between. A decorative substrate 56 is provided. The four first decorative substrates 56 are flush with each other, and the first mounting surfaces 84 of these first decorative substrates 56 are located on the first plate surface 268 side of the collective substrate 231.

As already explained, the first decorative substrate 56 is formed with a stepped recess 56a and a notch 56b. In the lower left first decorative board 56, the step-like recess 56a is provided on the side of the center sacrificial board 261, and the notch 56b is provided on the left side of the sacrificial board 263, which will be described later. In the upper left first decorative board 56, the step-like recess 56a is provided on the left side of the left-hand side board 263, and the notch 56b is provided on the center side of the left-hand side board 261. The stepped recesses 56a of the pair of first decorative substrates 56 face each other. The spaces between these stepped recesses 56a are cut out, and the stepped recesses 56a are not connected to each other.

In the lower right first decorative board 56, the step-like recess 56a is provided on the side of the right side sacrificial board 266, which will be described later, and the notch 56b is provided on the side of the center sacrificial board 261. In the upper right first decorative board 56, the step-like recess 56a is provided on the center sacrificial substrate 261 side, and the notch 56b is provided on the right side sacrificial substrate 266 side. The stepped recesses 56a of the pair of first decorative substrates 56 face each other. The spaces between these stepped recesses 56a are cut out, and the stepped recesses 56a are not connected to each other.

On the left side of the center disposable substrate 261, below, on the left side, and above the pair of first decorative substrates 56, a lower left disposable substrate 262, a vertically elongated substantially rectangular left disposable substrate 263, and an upper left disposable substrate 264 are provided. The lower left sacrificial board 262 is connected to the left sacrificial board 263 and the center sacrificial board 261 via dividing grooves 236 and 237, and the upper left sacrificial board 264 is connected to the left sacrificial board 263 and the center sacrificial board 261 through dividing grooves 238 and 239. It is connected to the disposable board 261. A slit 251 is formed between the lower left sacrificial substrate 262 and the upper left first decorative substrate 56, and the lower left sacrificial substrate 262 and the upper left first decorative substrate 56 are not connected. Further, a slit 252 is formed between the upper left sacrificial substrate 264 and the upper right first decorative substrate 56, and the upper left sacrificial substrate 264 and the upper right first decorative substrate 56 are not connected. The left side disposable board 263 is connected to the lower left first decorative board 56 and the upper left first decorative board 56 via the dividing grooves 240 and 241.

On the right side of the central disposable substrate 261, below, on the right side, and above the pair of first decorative substrates 56, a lower right sacrificial substrate 265, a vertically elongated substantially rectangular right sacrificial substrate 266, and an upper right sacrificial substrate 267 are provided. The lower right sacrificial board 265 is connected to the central sacrificial board 261 and the right sacrificial board 266 via dividing grooves 242 and 243, and the upper right sacrificial board 267 is connected to the central sacrificial board 261 and the right sacrificial board 266 through dividing grooves 244 and 245. It is connected to the right side disposable board 266. A slit 253 is formed between the lower right sacrificial substrate 265 and the lower left first decorative substrate 56, and the lower right sacrificial substrate 265 and the lower left first decorative substrate 56 are not connected. Further, a slit 254 is formed between the upper right sacrificial substrate 267 and the lower right first decorative substrate 56, and the upper right sacrificial substrate 267 and the lower right first decorative substrate 56 are not connected. The right side disposable board 266 is connected to the lower left first decorative board 56 and the lower right first decorative board 56 via the dividing grooves 246 and 247.

In this way, the sacrificial substrates 262 to 267 are provided around the entire outer periphery of the collective substrate 231, and the four first decorative substrates 56 are surrounded by the sacrificial substrates 262 to 267. This makes it possible to handle the collective board 231 without touching the electronic parts mounted on the first decorative board 56 after mounting the electronic parts. Therefore, the electronic components are prevented from being damaged due to the operator's hands coming into contact with the electronic components. Note that the number of first decorative substrates 56 included in the collective substrate 231 is not limited to "4". The number of first decorative boards 56 included in the collective board 231 may be more than "4" (for example, "6"), and the number of first decorative boards 56 included in the collective board 231 may be "4" or more (for example, "6"). The number may be less than 4 (for example, 2).

A pair of first decorative substrates 56 are provided on the left side of the central sacrificial substrate 261 with stepped recesses 56a facing each other, and a pair of first decorative substrates 56 are provided on the right side of the central sacrificial substrate 261 with stepped recesses 56a facing each other. 56, the vertical dimension of the collective board 231 including the four first decorative boards 56 is reduced.

Next, the manufacturing process of the decorative substrates 56 and 57 will be explained using the manufacturing process of the first decorative substrate 56 as an example.

In the manufacturing process of the first decorative board 56, first, with the second plate surface 269 (second mounting surface 95 side, see FIG. 17(b)) of the collective board 231 facing upward, The connectors 111 and 112 are assembled using a solder application process of applying solder paste to the pads (or pads) provided on the plate surface 269, an adhesive application process of applying an adhesive for fixing the connector, and an automatic mounting device (not shown). (FIG. 8(a)) on the second plate surface 269 side of the collective board 231, a reflow process in which the collective board 231 is transferred to a reflow oven and heated, and a cooling process in which the collective board 231 is cooled to room temperature. The process is carried out. As a result, the connectors 111 and 112 are mounted on the second plate surface 269 side of the collective board 231. By curing the adhesive, the connectors 111 and 112 are prevented from falling during the second reflow process.

After that, with the first board surface 268 of the collective board 231 facing upward, solder paste is applied onto the lands provided on the first board surface 268 side (first mounting surface 84 side) of the collective board 231. a solder application step, a component mounting step in which electronic components including small chip components are mounted on the first plate surface 268 side of the assembled board 231 using an automatic mounting device (not shown), and a component mounting step in which the assembled board 231 is transferred to a reflow oven. A reflow process of heating, a cooling process of cooling the collective board 231 to room temperature, a board dividing process of dividing the collective board 231 after electronic components are mounted, and a visual check to see if there are any omissions in the mounting of electronic components on the first decorative board 56. A mounting confirmation process, etc., is performed. As a result, electronic components including small chip components are mounted on the first plate surface 268 side of the collective substrate 231.

As shown in FIG. 17(a), a first mounting reference hole 271 and a second mounting reference hole 272 are formed in the left side disposable board 263 and the right side disposable board 266 by penetrating the collective board 231 in the thickness direction. ing. The first mounting reference hole 271 is used for positioning the collective board 231 in the component mounting process of mounting the electronic component on the first plate surface 268 side, and the second mounting reference hole 272 is used for positioning the electronic component on the second plate surface 268 side. It is used for positioning the collective board 231 in the component mounting process for mounting on the board surface 269 side. After aligning the collective board 231, the automatic mounting device first positions the small chip component using coordinate control so that the electrode of the small chip component is placed on the solder paste applied to the corresponding pad (or pads). 1 set on the decorative board 56.

As methods for dividing the collective substrate 231, there are known methods in which an operator manually divides the collective substrate 231, and a method in which the collective substrate 231 is mechanically cut using a press or the like. Among these, by adopting a manual dividing method, it is possible to flexibly handle multiple types of collective boards while keeping equipment costs down.

The collective substrate 231 can be divided into two ways: one is to divide the collective substrate 231 in such a way that the first plate surface 268 on which the small chip components are aggregated based on the dividing grooves 232 to 247 has a valley shape (concave); A conceivable method is to divide the collective substrate 231 so that the plate surface 268 has a mountain shape (convex). In the substrate dividing step, as shown in FIG. 17(b), the collective substrate 231 is divided into a plurality of pieces (specifically Specifically, four first decorative substrates 56 are taken out.

As already explained, in the first decorative board 56, the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149) are concentrated on the first mounting surface 84 side. In the collective board 231, the small chip components are concentrated on the first board surface 268 side (first mounting surface 84 side) and are not mounted on the second board surface 269 side (second mounting surface 95 side). Moreover, as already explained, the connection points between the small chip component and the first decorative board 56 have lower mechanical strength than the connection points between other electronic components and the first decorative board 56. When dividing the collective board 231 into peaks as shown in FIG. The force that can act on the plate surface 269 side (second mounting surface 95 side) becomes compressive stress. On the other hand, when the collective board 231 is divided into valleys as shown in FIG. The force that can act on the second plate surface 269 side (second mounting surface 95 side) becomes tensile stress.

The stress when dividing the collective substrate 231 acts more strongly on the plate surface having a mountain shape (convex) than on the plate surface having a valley shape (concave). By dividing the collective board 231 into valleys so that the first board surface 268 side (the first mounting surface 84 side) where small chip components are aggregated has a valley shape (concave), small chips can be separated when the collective board 231 is divided. It is possible to reduce the stress that may act on the connection portion between the component and the first decorative board 56, and also reduce the stress that may act on the small chip component itself. Thereby, it is possible to reduce the possibility that the connection portion between the small chip component and the first decorative board 56 will be damaged, and it is also possible to reduce the possibility that the small chip component itself will be damaged. In this way, by reducing the possibility of poor contact between small chip components occurring in the board dividing process, the manufacturing efficiency of the first decorative board 56 can be improved.

Among the small chip components, the multilayer ceramic capacitor used as the bypass capacitor 85 is susceptible to tensile stress, and when tensile stress acts on the bypass capacitor 85, cracks are likely to occur in the bypass capacitor 85 itself. By dividing the collective board 231 into valleys so that the first plate surface 268 side (the first mounting surface 84 side) where small chip components including the bypass capacitor 85 are aggregated has a valley shape (concave), the bypass capacitor 85 It is possible to avoid tensile stress from acting on the bypass capacitor 85 by treating the force that may act on the bypass capacitor 85 as a compressive stress. This can reduce the possibility that the bypass capacitor 85 itself will be damaged when the collective substrate 231 is divided.

As already explained, by dividing the collective substrate 231 based on the dividing grooves 232 to 247, it is possible to minimize the stress that may be applied to the connection points between the small chip components and the first decorative substrate 56, and Stress that can act on small chip components can be minimized. On the other hand, if the dividing base point deviates from the dividing grooves 232 to 247, these stresses will increase. A dividing jig is used to prevent the dividing base point from shifting from the dividing grooves 232 to 247 and to improve the workability of the substrate dividing process.

FIG. 18(a) is a perspective view of the dividing jig 281 used for dividing the collective substrate 231 in this embodiment, FIG. 18(b) is a front view of the dividing jig 281, and FIG. 18(c) is a front view of the dividing jig 281. 2 is an explanatory diagram for explaining how the collective substrate 231 is divided using a dividing jig 281. FIG. As shown in FIG. 18(a), the dividing jig 281 has a metal thin blade 282 that comes into contact with the dividing grooves 232 to 247 and serves as a fulcrum when dividing the collective substrate 231, and supports the thin blade 282. A base portion 283 is provided. The base portion 283 includes a resin base portion 283a formed in the shape of a horizontally long rectangular parallelepiped, and a rectangular parallelepiped-shaped standing portion 283b integrally formed by standing up from one plate surface of the base portion 283a. There is.

The thin blade 282 includes a plate-shaped blade portion 282a and a flange portion 282b. The thin blade 282 is fixed to the base portion 283 by screwing the flange portion 282b to the upright portion 283b. The blade portion 282a projects upward from the upper plane of the upright portion 283b and extends in the longitudinal direction of the upright portion 283b.

A protrusion 283c is integrally formed at approximately the center in the longitudinal direction of the upright portion 283b to assist in positioning the collective substrate 231 with respect to the blade portion 282a so that the blade portion 282a comes into contact with the dividing grooves 232 to 247. There is. The protruding portion 283c protrudes upward from the upper plane of the upright portion 283b with a larger protrusion dimension than the blade portion 282a. As shown in FIG. 17(a), on the right side of the left side disposable board 263 and on the left side of the center left side board 261, there are recesses 284, 285 between the pair of first decorative boards 56 through which the protrusion 283c can be inserted. is provided. Further, on the right side of the center disposable board 261 and on the left side of the right side disposable board 266, recesses 286 and 287 are provided between the pair of first decorative boards 56 through which the protrusion 283c can be inserted.

As shown in FIG. 18(c), the operator faces down the first board surface 268 (first mounting surface 84) of the collective board 231, and places the center disposable board 261, the left side disposable board 263, and the right side disposable board 266. One of them (center discarded substrate 261 in FIG. 18(c)) is fixed on the upright portion 283b. At this time, by inserting the protrusion 283c into the recesses 284 to 287 (FIG. 17(a)) provided in the substrates 261, 263, and 266, the dividing grooves 232 to 247, which are the base points for division, come into contact with the blade part 282a. A state of contact can be easily created. In this state, by applying a downward force to the second plate surface 269 side and pushing the portion protruding to the right from the upright portion 283b downward, the first plate surface 268 is shaped into a valley shape (concave). , the collective substrate 231 can be divided into valleys using the dividing grooves 232 to 247 as base points.

For example, the operator first assembles the collective board 231 (FIG. 17(a)) into a first unit including a pair of first decorative boards 56 on the left side, a lower left throwaway board 262, a left throwaway board 263, and an upper left throwaway board 264; It is divided into a second unit including a pair of first decorative substrates 56 on the right side, a center sacrificial substrate 261, a lower right sacrificial substrate 265, a right side sacrificial substrate 266, and an upper right sacrificial substrate 267. Thereafter, in the first unit, the pair of first decorative substrates 56 and the left side disposable substrate 263 are separated, so that the two first decorative substrates 56 can be taken out. Furthermore, in the second unit, by dividing the pair of first decorative substrates 56 and the center disposable substrate 261, and by dividing the pair of first decorative substrates 56 and the right side disposable substrate 266, the two first decorative substrates 56 and the right side disposable substrate 266 are divided. Decorative substrate 56 can be taken out. Note that the order in which the collective substrate 231 is divided to take out the four first decorative substrates 56 is arbitrary.

With the blade portion 282a in contact with the dividing grooves 232 to 247, which serve as the dividing base point, by dividing the collective substrate 231 using the blade portion 282a as a fulcrum, the dividing base point is shifted from the dividing grooves 232 to 247. You can prevent this from happening. This makes it possible to minimize the stress that may act on the connection points between the small chip components and the first decorative substrate 56 when dividing the collective board 231, and also to minimize the stress that may act on the small chip components themselves. It can be suppressed.

The configuration in which the collective board 231 is divided into valleys by pushing the second mounting surface 95 downward allows the worker to This makes it easier to apply force to divide the collective substrate 231. Further, in the center disposable board 261, the left side disposable board 263, and the right side disposable board 266, the recesses 284 to 287 (FIG. 17(a)) are provided between the pair of first decorative boards 56, so that the first decorative It is possible to fix the collective substrate 231 to the dividing jig 281 while preventing stress acting on the electronic components mounted on the substrate 56 from increasing.

As already explained with reference to FIG. 8(a), the first decorative board 56 is provided with fixed through holes 56d to 56g, and the small chip components are arranged avoiding the areas around the through holes 211a to 211d. There is. Therefore, as shown in FIG. 18(c), one of the center disposable board 261, the left side disposable board 263, and the right side disposable board 266 is placed on the upright portion with the first board surface 268 (first mounting surface 84) facing downward. When dividing the collective board 231 by applying a downward force to the second plate surface 269 side while fixed to the second plate surface 269 and pushing downward the portion protruding from the upright portion 283b, the fixed through hole is used as the part to be pushed downward. Around 56d to 56g can be selected. Thereby, stress that may act on the small chip components mounted on the first plate surface 268 side (first mounting surface 84 side) can be minimized.

As already explained, the dividing grooves 232 to 247 are formed only on the first plate surface 268 side of the collective substrate 231, and not on the second plate surface 269 side. Therefore, the operator only has to set the collective board 231 on the dividing jig 281 with the plate surface (first plate surface 268) on the side where the dividing grooves 232 to 247 are formed facing downward, and the operator may accidentally set the collective board 231 on the dividing jig 281. The possibility that 231 will be divided into peaks is reduced.

As shown in FIG. 17(a), the 16 dividing grooves 232 to 247 existing in the collective substrate 231 extend in the first direction DR1. The extending directions of these dividing grooves 232 to 247 are parallel to each other. Furthermore, as already explained with reference to FIGS. 8(a) to 8(c), the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are are mounted on the first decorative substrate 56 in such a manner that the longitudinal direction thereof is parallel to the 16 dividing grooves 232 to 247 existing in the collective substrate 231. Therefore, compared to a configuration in which the longitudinal direction of the small chip components is perpendicular to the extending direction of the dividing grooves 232 to 247, when the collective substrate 231 is divided based on the dividing grooves 232 to 247, the small chip components and The stress that may act on the connection point with the first decorative board 56 is reduced, and the stress that may act on the small chip component itself is reduced.

As shown in FIG. 17(a), slits 255 to 258 are provided in the collective substrate 231 at locations corresponding to the areas where the bypass capacitors 85 are mounted. As already explained, the slits 255 to 258 are elongated holes and are formed wider than the dividing grooves 233, 234, 240, and 247. When the collective substrate 231 is divided into valleys using the dividing grooves 232 to 247 as base points, the stress that can act on the periphery of the slits 255 to 258 is smaller than the stress that can act on the periphery of the dividing grooves 232 to 247. By providing the slits 255 to 258 at corresponding locations in the mounting area of the bypass capacitor 85, stress that may act on the connection location between the bypass capacitor 85 and the first decorative board 56 when the collective board 231 is divided is reduced. At the same time, the stress that can act on the bypass capacitor 85 itself is reduced.

As shown in FIGS. 8A and 8B, the bypass capacitor 85 is arranged closer to the stepped recess 56a than the LED driver 126. As already explained with reference to FIG. 17(a), the dividing grooves 233, 234, 240, and 247 are not provided on the stepped recess 56a side of the collective substrate 231. Since the bypass capacitor 85 is arranged on the opposite side of the dividing grooves 233, 234, 240, 247 with the LED driver 126 in between, when the collective board 231 is divided based on the dividing grooves 233, 234, 240, 247, It is possible to reduce the stress that may act on the connection portion between the bypass capacitor 85 and the first decorative board 56, and also reduce the stress that may act on the bypass capacitor 85 itself. This reduces the possibility that the connection between the bypass capacitor 85 and the first decorative board 56 will be destroyed when dividing the collective board 231, and also reduces the possibility that the bypass capacitor 85 itself will be destroyed. has been reduced.

As already explained with reference to FIGS. 8(b) and (c), the spacing direction of the pads 171a, 171b corresponds to the electrodes 85a, 85b of the bypass capacitor 85, and corresponds to the electrodes 87a, 87b of the small chip resistor 87. The direction in which the pads 176a and 176b are separated is the first direction DR1. In the reflow process, by transporting the collective substrate 231 in a direction (second direction DR2) or substantially orthogonal to the common separation direction (first direction DR1), the pair of electrodes 85a, 85b of the bypass capacitor 85 is The heating timing of the solder paste applied on the corresponding pair of pads 171a, 171b can be aligned, and the pair of pads 176a corresponding to the pair of electrodes 87a, 87b of the small chip resistor 87 can be aligned. , 176b can be started at the same timing. Thereby, rotation of the plurality of small chip components and generation of chip standing can be prevented. As shown in FIG. 17A, a recognition mark 288 is provided on the first plate surface 268 side of the left side discarded substrate 263 to enable confirmation of the conveyance direction of the collective substrate 231 in the reflow process. Although not shown, a recognition mark is also provided on the second plate surface 269 side of the left side disposable substrate 263 to enable confirmation of the conveyance direction of the collective substrate 231 in the reflow process. This reduces the possibility that the operator will transport the collective substrate 231 in the wrong direction.

As already explained with reference to FIG. 8(a), in the configuration in which the LED driver 126 is arranged in an area including an area less than 10 mm from the outer edge of the first decorative board 56, small chip components (bypass capacitor 85 and small The chip resistors 87, 143 to 149 (FIG. 11)) are arranged at a distance of 10 mm or more from the outer edge of the first decorative substrate 56. As already explained, of the various electronic components mounted on the first decorative board 56, the connection points between small chip components and the first decorative board 56 are different from the connection points between other electronic components and the first decorative board 56. In comparison, mechanical strength is low. Furthermore, an area within 10 mm from the outer edge of the first decorative substrate 56 is an area that may exist near the dividing grooves 232 to 247 (FIG. 17) in the aggregate substrate 231 (FIG. 17), and This is an area where force may be applied to divide the substrate 231. Since the small chip components are arranged 10 mm or more away from the outer edge of the first decorative board 56, the maximum value of stress that can be applied to the connection points between the small chip components and the first decorative board 56 when the collective board 231 is divided. is reduced, and the maximum value of stress that can act on the small chip component itself is also reduced.

<Electrical configuration of pachinko machine 10>
FIG. 19 is a block diagram showing the electrical configuration of the pachinko machine 10.

The main control device 60 includes a main control board 61 that controls the main control of the game, and a power outage monitoring board 67 that monitors the power supply. The main control board 61 is equipped with an MPU 62 . The MPU 62 includes a main ROM 64 and a main RAM 65 in addition to a main CPU 63 which is an arithmetic processing unit including a control section and an arithmetic section. In addition to the above elements, the MPU 62 includes an interrupt circuit, a timer circuit, a data input/output circuit, various counter circuits as a random number generator, and the like.

The main ROM 64 is a memory such as a NOR flash memory or a NAND flash memory that does not require an external power supply to retain memory (ie, nonvolatile storage means), and is used for reading only. The main side ROM 64 stores various control programs and fixed value data executed by the main side CPU 63.

The main RAM 65 is a memory such as SRAM and DRAM (ie, volatile storage means) that requires an external power supply to maintain memory, and is used for both reading and writing. The main side RAM 65 can be randomly accessed, and when compared with the same data capacity, the time required for reading is faster than the main side ROM 64. The main RAM 65 temporarily stores various data for execution of the control program stored in the main ROM 64.

The main CPU 63 executes processing for managing game history. The main CPU 63 grasps the entry history of game balls into the general winning opening 31, the special electric winning device 32, the first operating opening 33, the second operating opening 34, and the out opening 24a, and uses the grasped entry history as well. Accordingly, the frequency of balls entering the general winning hole 31, the special electric winning device 32, the first operating hole 33, and the second operating hole 34 is grasped. Further, the main CPU 63 grasps the frequency of occurrence of the opening/closing execution mode and the high-frequency support mode, which will be described later.

The MPU 62 is provided with an input port and an output port, respectively. A power outage monitoring board 67 and a payout control device 77 provided in the main control device 60 are connected to the input side of the MPU 62. A power supply/launch control device 78 having a function of supplying operating power is connected to the power outage monitoring board 67, and operating power is supplied to the MPU 62 via the power outage monitoring board 67.

Various sensors such as ball entry detection sensors 42a to 49a are connected to the input side of the MPU 62. As already explained, each ball entry detection sensor 42a to 49a includes a first winning opening detection sensor 42a, a second winning opening detection sensor 43a, a third winning opening detection sensor 44a, a special electric detection sensor 45a, and a first operating opening detection sensor. A sensor 46a, a second operating port detection sensor 47a, an outlet detection sensor 48a, and a gate detection sensor 49a are included. Based on the detection results of these ball entry detection sensors 42a to 49a, the main CPU 63 determines whether the ball enters each ball entry section. Further, the main side CPU 63 executes various lottery drawings based on winnings to the first operating port 33 and various drawings based on winnings to the second operating port 34.

On the input side of the MPU 62, a setting key insertion section 68a, an update button 68b, and a reset button 68c provided on the main control board 61 are provided. The setting key insertion portion 68a is provided with a sensor (not shown), and the sensor detects whether the setting key insertion portion 68a is placed in an ON operation position or an OFF operation position. Then, the main CPU 63 specifies whether the setting key insertion portion 68a is located at the ON operation position or the OFF operation position based on the detection result from the sensor. The update button 68b is provided with a sensor (not shown), and the sensor detects whether or not the update button 68b is pressed. Then, the main CPU 63 determines whether or not the update button 68b is pressed based on the detection result from the sensor. The reset button 68c is provided with a sensor (not shown), and the sensor detects whether or not the reset button 68c is pressed. Then, the main CPU 63 determines whether or not the reset button 68c is pressed based on the detection result from the sensor.

A power outage monitoring board 67, a payout control device 77, and a sound emission control device 81 are connected to the output side of the MPU 62. For example, a prize ball command is output to the payout control device 77 based on the fact that a game ball has entered a prize ball corresponding entering part of the above-mentioned ball entering part where the occurrence of the ball entering corresponds to the payout of the game ball. Ru. Various commands such as a variation command, a type command, and an opening command are output to the audio emission control device 81.

On the output side of the MPU 62, there are a drive unit 32b for special electricity that opens and closes the opening/closing door 32a of the special electricity prize winning device 32, a drive unit 34b for general electricity that opens and closes the general electricity accessory 34a of the second operating port 34, and a drive unit 34b for general electricity that opens and closes the opening/closing door 32a of the special electricity winning device 32. A drawing unit 37 and a general drawing unit 38 are connected. Incidentally, the special figure unit 37 is provided with a special figure display section 37a and a special figure pending display section 37b, all of which are connected to the output side of the MPU 62. Similarly, the general drawing unit 38 is provided with a general drawing display section 38a and a general drawing holding display section 38b, all of which are connected to the output side of the MPU 62. The main control board 61 is provided with various driver circuits, and the MPU 62 executes drive control of various drive units and various display units through the driver circuits.

That is, in the opening/closing execution mode, drive control of the special electric drive unit 32b is executed in the main side CPU 63 so that the special electric prize winning device 32 is opened and closed. Further, when the open state of the general electric utility object 34a is won, the drive control of the general electric drive unit 34b is executed in the main CPU 63 so that the general electric utility object 34a is opened and closed. Furthermore, in each game round, display control of the special figure display section 37a is executed by the main CPU 63. In addition, when displaying the lottery result as to whether or not to open the general utility object 34a, the main side CPU 63 executes display control of the general public figure display section 38a. In addition, when a winning occurs in the first operating port 33 or the second operating port 34, or when a variable display starts in the special symbol display section 37a, the main CPU 63 controls the display of the special symbol pending display section 37b. is executed, and when a winning occurs in the through gate 35, or when variable display is started on the common picture display section 38a, display control of the common picture pending display section 38b is executed in the main CPU 63.

First to third notification display devices 69a to 69c are connected to the output side of the MPU 62. The first to third notification display devices 69a to 69c display game history management results. Further, when changing the setting state of the pachinko machine 10, the current setting value is displayed on the third notification display device 69c. The display of the first to third notification display devices 69a to 69c is controlled by the main CPU 63.

The power outage monitoring board 67 relays between the main control board 61 and the power source/launch control device 78, and monitors the stable DC voltage of 24 volts, which is the maximum voltage output from the power source/launch control device 78. The payout control device 77 controls the payout of prize balls and rental balls by the payout device 76 based on the prize ball command received from the main control device 60.

The power source/launch control device 78 is connected to a commercial power source (external power source) in, for example, an amusement hall or the like. Then, based on the external power supplied from the commercial power source, necessary operating power is generated for the main control board 61, payout control device 77, etc., and the generated operating power is supplied. Incidentally, the power supply/launch control device 78 is provided with a power supply unit for power outages such as a backup capacitor, and even if the power of the pachinko machine 10 is OFF, the power supply unit for power outages supplies power from the main power supply unit. Power for memory retention is supplied to the main side RAM 65 of the control device 60 and the payout control device 77. Further, the power supply/launch control device 78 is responsible for controlling the launch of the game ball launch mechanism 27, and the game ball launch mechanism 27 is driven when predetermined launch conditions are met. Further, as already explained, the payout mechanism section 73 is provided with a power switch, and when the power switch is turned ON, the supply of operating power to the Pachinko machine 10 is started, and when the power switch is turned OFF, operation power is started to be supplied to the Pachinko machine 10. As a result, the supply of operating power to the pachinko machine 10 is stopped.

The audio emission control device 81 drives and controls the speaker section 53 provided in the front door frame 14 based on various commands received from the main control device 60. Furthermore, as already explained, the audio light emission control device 81 controls the light emission of the LED chips 127 to 142 mounted on the first decorative board 56 and the LED chips mounted on the second decorative board 57. Furthermore, the audio light emission control device 81 controls the display control device 82. The display control device 82 executes display control of the symbol display device 41 based on commands received from the audio emission control device 81.

<Electrical configuration for performing various lottery drawings on the main CPU 63>
Next, the electrical configuration for performing various lottery drawings in the main CPU 63 will be described using FIG. 20.

When playing a game, the main CPU 63 uses various types of counter information to perform jackpot occurrence lottery, settings for display on the special pattern display section 37a, settings for display on the pattern display device 41, settings for display on the general pattern display section 38a, etc. Specifically, as shown in FIG. 20, the winning random number counter C1 used in the lottery of winning occurrences, the jackpot type counter C2 used to determine the jackpot type, and the symbol display device 41 are changed when the winning occurs. Determine the reach random number counter C3 used for the reach occurrence lottery when playing, the random number initial value counter CINI used to set the initial value of the hit random number counter C1, and the display duration time on the special symbol display section 37a and the symbol display device 41. A variation type counter CS is used. Furthermore, a general electric utility object release counter C4 is used to determine whether or not the general electric utility object 34a of the second operating port 34 should be brought into the general electric power open state. The counters C1 to C3, CINI, CS, and C4 are provided in various counter areas 65b of the main RAM 65.

Each of the counters C1 to C3, CINI, CS, and C4 is a loop counter in which 1 is added to the previous value each time the counter is updated, and returns to "0" after reaching the maximum value. Each counter is updated at short intervals. Information corresponding to the winning random number counter C1, the jackpot type counter C2, and the reach random number counter C3 is provided in the main side RAM 65 as an acquisition information storage means when a winning occurs in the first operating port 33 or the second operating port 34. The data is stored in the reserved storage area 65a.

The reservation storage area 65a includes a reservation area RE and an execution area AE. The holding area RE includes a first holding area RE1, a second holding area RE2, a third holding area RE3, and a fourth holding area RE4. In addition, a combination of the numerical information of the hit random number counter C1, the jackpot type counter C2, and the reach random number counter C3 is stored as pending information in any of the pending areas RE1 to RE4.

In this case, if winnings to the first operating port 33 or the second operating port 34 occur multiple times in a row, the first holding area RE1 to the fourth holding area RE4 are Each piece of numerical information is stored in chronological order in the order of reservation area RE2 → third reservation area RE3 → fourth reservation area RE4. By providing the four holding areas RE1 to RE4 in this way, the winning history of game balls entered into the first operating port 33 or the second operating port 34 can be held and stored up to a maximum of four. .

Note that the number that can be held and stored is not limited to four, but is arbitrary, and may be other plural numbers such as two, three, or five or more, or may be a single number.

The execution area AE is an area for moving each numerical information stored in the first reservation area RE1 of the reservation area RE when starting the variable display of the special figure display section 37a, and is an area for moving each numerical information stored in the first reservation area RE1 of the reservation area RE. At this time, a judgment is made based on various numerical information stored in the execution area AE.

Each of the above counters will be explained in detail.

First, the general utility utility release counter C4 will be explained. The general utility utility release counter C4 is configured such that, for example, it is incremented by 1 in sequence within the range of 0 to 250, and returns to "0" after reaching the maximum value. The general electric utility object release counter C4 is updated regularly and is stored in the general electric power holding area 65c of the main side RAM 65 at the timing when a game ball enters the through gate 35. Then, at a predetermined timing, a lottery is performed to determine whether or not to control the general electric utility object 34a to an open state based on the stored value of the general electric utility object opening counter C4.

In this pachinko machine 10, a plurality of types of support modes are set so that the modes of support provided by the common electric accessory 34a are different from each other. In detail, in the support mode, when compared with the situation where the game ball continues to be launched in the same manner into the game area PA, the general electrical accessory 34a of the second actuation port 34 opens per unit time. A high-frequency support mode and a low-frequency support mode are set so that the frequency of the state is relatively high or low.

In the high-frequency support mode and the low-frequency support mode, the probability of winning the general electricity release state in the general electricity release lottery using the general electricity utility item release counter C4 is the same (for example, 4/5 in both cases). , In the high-frequency support mode, the number of times that the general electric utility accessory 34a is in the open state when the general electric power open state is won is set to be greater than that in the low-frequency support mode, and the opening time for one time is also set to be longer. has been done. In this case, when the general power open state is won in the high frequency support mode and the open state of the general power accessory 34a occurs multiple times, the period from the end of one open state to the start of the next open state is The closing time is set shorter than the one-time opening time. Furthermore, in the high-frequency support mode, compared to the low-frequency support mode, the minimum secured time (i.e., The duration of one display on the display section 38a is set short.

As described above, in the high-frequency support mode, the probability of winning the second operating port 34 is higher than in the low-frequency support mode. In other words, in the low-frequency support mode, the probability of winning a prize is higher in the first operating port 33 than in the second operating port 34, but in the high-frequency support mode, the probability of winning is higher in the first operating port 33 than in the second operating port 34. The probability of winning a prize in the mouth 34 increases. When a winning occurs in the second operation port 34, a predetermined number of game balls are paid out, so in the high-frequency support mode, the player can play the game without reducing the number of balls he has too much. It can be carried out.

Note that the configuration for making the high-frequency support mode more frequently open to the power grid per unit time than the low-frequency support mode is not limited to the above, and for example, in the power grid release lottery. It may be configured to increase the probability of winning the general power open state. In addition, the secured time period that is secured between the time when one general electricity lottery is held and the next general electricity distribution lottery is held (for example, the period of time that is secured on the general electricity map display section 38a based on winnings in the through gate 35) is In configurations where multiple types of variable display times are available, it is easier to select a shorter securing time in the high-frequency support mode than in the low-frequency support mode, or the average securing time is set to be shorter. Good too. In addition, the number of times the power grid is released, the length of time it is open, the amount of time secured between one general power grid release lottery and the next power grid release lottery is shortened, and such secured time. The advantage of the high-frequency support mode over the low-frequency support mode may be increased by applying any one condition or any combination of shortening the average time and increasing the probability of winning.

Here, as already explained, the pachinko machine 10 has setting states of "Setting 1" to "Setting 6", but the opening frequency and opening mode of the general electric accessory 34a in the low frequency support mode are different from each other. The setting values are the same, and the opening frequency and opening mode of the utility power accessory 34a in the high-frequency support mode are also the same regardless of the setting values. However, the present invention is not limited to this, and at least one of the opening frequency and opening mode of the general electric accessory 34a varies depending on the setting state of the pachinko machine 10 in at least one of the low-frequency support mode and the high-frequency support mode. It may also be a configuration. For example, the higher the setting value is, the higher the frequency of opening of the general electric accessory 34a in the low frequency support mode may be configured, and the second operation when the general electric accessory 34a is opened once in the low frequency support mode. A configuration may be adopted in which the probability of a game ball entering the mouth 34 is increased. Further, the higher the set value, the higher the frequency of opening of the general electric utility object 34a in the high-frequency support mode. A configuration may be adopted in which the probability of the game ball entering the operating port 34 is increased.

Next, the winning random number counter C1 will be explained. The winning random number counter C1 is configured to increment sequentially by 1 within the range of 0 to 7999, for example, and return to "0" after reaching the maximum value. In particular, when the winning random number counter C1 completes one round, the value of the random number initial value counter CINI at that time is read as the initial value of the winning random number counter C1. Note that the random number initial value counter CINI is a loop counter similar to the winning random number counter C1 (value=0 to 7999). The winning random number counter C1 is updated regularly and is stored in the holding storage area 65a of the main side RAM 65 at the timing when a game ball enters the first operating port 33 or the second operating port 34.

The random number value that results in a jackpot is stored in the main ROM 64 as a win/fail table. As shown in FIG. 19, the main ROM 64 is provided with a validity table storage area 64a. The validity table storage area 64a stores a low probability table for the low probability mode and a high probability table for the high probability mode as the probability tables.

The low probability correctness table is provided in one-to-one correspondence with the setting states of "Setting 1" to "Setting 6". In other words, there is a low probability table for setting 1 that is referenced when the setting state of the pachinko machine 10 is "setting 1", and a setting 2 that is referenced when the setting state of the pachinko machine 10 is "setting 2". a low probability correctness table for setting 3 that is referred to when the setting state of the pachinko machine 10 is "setting 3", and a low probability correctness table for setting 3 that is referred to when the setting state of the pachinko machine 10 is "setting 4". A low probability table for setting 4 that is referred to when the setting state of the pachinko machine 10 is "setting 5", a low probability table for setting 5 that is referenced when the setting state of the pachinko machine 10 is "setting 5", and a low probability table for setting 5 that is referred to when the setting state of the pachinko machine 10 is "setting 5". "Setting 6", there is a low certainty probability table for setting 6 that is referred to.

These low probability success/failure tables are set so that the higher the set value, the higher the probability of winning a jackpot result. Specifically, if the low probability table for setting 1 is referred to, the jackpot result will be 1/320, and if the low probability table for setting 2 is referred to, the jackpot result will be approximately 1/308. Therefore, if the low probability table for setting 3 is referred to, the result will be a jackpot at approximately 1/278, and if the low probability table for setting 4 is referred to, the result will be a jackpot at approximately 1/286, When the low probability success/failure table for setting 5 is referred to, a jackpot result is obtained at approximately 1/276, and when the low probability probability table for setting 6 is referred to, a jackpot result is obtained at approximately 1/267. As a result, when the setting state of the pachinko machine 10 is set to a high setting value, a jackpot result is more likely to occur in the low probability mode, which is advantageous for the player.

On the other hand, only one type of high certainty correctness table is provided so that it is common to any setting state from "Setting 1" to "Setting 6". The high probability success/failure table is set so that the probability of winning a jackpot result is higher than the low probability success/failure table in any setting state from "Setting 1" to "Setting 6". Specifically, when the high probability success/failure table is referred to, the jackpot result is approximately 1/30. This makes it possible to make the high probability mode more advantageous than the low probability mode regardless of the setting state of the pachinko machine 10. In addition, even the lowest setting state "Setting 1" becomes a high probability mode, making it possible to make the probability of a jackpot result higher than the low probability mode of "Setting 6" which is the highest setting state. becomes. In addition, in the high probability mode, it is possible to prevent advantages or disadvantages from occurring depending on the setting state of the pachinko machine 10, and the storage capacity for storing the high probability probability table in advance in the main side ROM 64 can be suppressed. becomes possible.

The jackpot type counter C2 is configured to be incremented by 1 within the range of 0 to 29, and return to "0" after reaching the maximum value. The jackpot type counter C2 is updated regularly, and is stored in the holding storage area 65a at the timing when the game ball enters the first operating port 33 or the second operating port 34.

In this pachinko machine 10, a plurality of jackpot results are set. These plurality of jackpot results include (1) the mode of opening/closing control of the special electric prize winning device 32 in the opening/closing execution mode, (2) the lottery mode in the win/fail lottery means after the opening/closing execution mode ends, and (3) the opening/closing mode after the opening/closing execution mode ends. A plurality of jackpot results are set by differentiating three conditions, namely, the support mode in the general electric accessory 34a of the second operation port 34.

The mode of opening/closing control of the special electric winning device 32 in the opening/closing execution mode is such that the frequency of winnings on the special electric winning device 32 from the start to the end of the opening/closing execution mode is relatively high or low. A frequent winning mode and a low frequency winning mode are set. Specifically, in both the high-frequency winning mode and the low-frequency winning mode, round games are executed up to a predetermined number of times.

A round game is a game that continues until either one of the following conditions is met: a predetermined upper limit duration period elapses, and a predetermined upper limit number of game balls enters the special electric winning device 32. That's true. Further, the number of round games in the opening/closing execution mode triggered by a jackpot result is fixed and the same number of rounds regardless of the type of jackpot result that triggered the transition. Specifically, the upper limit number of round games is set to 15 rounds regardless of the jackpot result.

In addition, in this pachinko machine 10, a plurality of types are set for one opening mode of the special electric winning device 32, with different opening durations from when the special electric winning device 32 is opened until it is closed. Specifically, a long time mode in which the open duration is set to a long time of 29 seconds, and a short time mode in which the open duration is set to 0.06 seconds, which is a short time shorter than the above long time, is set.

In this pachinko machine 10, when the firing operation device 28 is operated by the player, the game ball firing mechanism 27 is driven so that one game ball is fired toward the gaming area PA every 0.6 seconds. controlled. Further, in the round game, the upper limit number of end conditions is set to nine. Then, in the long-time mode among the above-mentioned open modes, the open continuation time is set to be longer than the product of the game ball firing cycle and one round game. On the other hand, in the short time mode, the open duration time is set to be shorter than the product of the game ball firing cycle and one round game, more specifically, shorter than the game ball firing cycle. Therefore, if one opening is made in a long-time mode, it is expected that the special electric winning device 32 will receive a prize equal to the upper limit number in one round game, and one in a short-time mode. When the rounds are opened, it is expected that no prizes will be won in the special electric prize winning device 32, or that only about one prize will be won even if a prize is won.

In the high frequency winning mode, the special electric winning device 32 is opened once in a long time mode in each round game. On the other hand, in the low frequency winning mode, the special electric winning device 32 is opened once in a short time mode in each round game.

In addition, the number of times the special electric winning device 32 is opened and closed in the high-frequency winning mode and the low-frequency winning mode, the number of round games, the opening duration time for one opening, and the upper limit number of pieces in one round game are the same as those in the high-frequency winning mode. is not limited to the above values and may be set arbitrarily if the frequency of winnings in the special electric winning device 32 from the start to the end of the opening/closing execution mode is higher than that of the low-frequency winning mode. It is.

As shown in FIG. 19, the main side ROM 64 is provided with a distribution table storage area 64b. The distribution table storage area 64b stores a distribution table in which destinations of the jackpot results for the jackpot type counter C2 are set. In the distribution table, in the case of a jackpot result, a low probability jackpot result, a low winning high probability jackpot result, and a most advantageous jackpot result are set as the destinations to which the jackpot result is distributed.

The low-probability jackpot result is a jackpot result in which the opening/closing execution mode becomes the high-frequency winning mode, and after the opening/closing execution mode ends, the win/fail lottery mode becomes the low-probability mode and the support mode becomes the high-frequency support mode. However, this high-frequency support mode shifts to the low-frequency support mode when the number of games has reached the end standard number of times (specifically, 100 times) after the shift.

For low winning and high probability jackpot results, the opening/closing execution mode becomes the low frequency winning mode, and after the opening/closing execution mode ends, the win/fail lottery mode becomes the high probability mode and the support mode becomes the high frequency support mode. be. These high probability mode and high frequency support mode continue until the lottery result in the win/fail lottery becomes a jackpot state win and the state shifts to a jackpot state accordingly.

The most advantageous jackpot result is a jackpot result in which the opening/closing execution mode becomes a high-frequency winning mode, and furthermore, after the opening/closing execution mode ends, the win/fail lottery mode becomes a high probability mode and the support mode becomes a high-frequency support mode. These high probability mode and high frequency support mode continue until the lottery result in the win/fail lottery becomes a jackpot state win and the state shifts to a jackpot state accordingly.

In relation to each gaming state mentioned above, the normal gaming state refers to a state in which the win/fail lottery mode is a low probability mode and the support mode is a low frequency support mode, not the opening/closing execution mode. Furthermore, a configuration may be adopted in which a low winning/high winning jackpot result is not set as a game result. Further, in the opening/closing execution mode in the case of a low winning/high probability jackpot result, the number of round games may be smaller than in the case of the low probability jackpot result and the most advantageous jackpot result.

In the distribution table, among the values of jackpot type counter C2 of "0 to 29", "0 to 9" correspond to low probability jackpot results, and "10 to 14" correspond to low probability jackpot results. "15-29" corresponds to the most profitable jackpot result.

Only one type of distribution table is provided so that it is common to any of the setting states "Setting 1" to "Setting 6". As a result, it is possible to prevent advantage or disadvantage from occurring depending on the setting state of the pachinko machine 10 in the distribution mode of jackpot results, and to reduce the storage capacity for storing the distribution table in advance in the main side ROM 64. It is possible to suppress it.

It should be noted that a configuration may be adopted in which the manner in which the jackpot results are distributed differs depending on the setting state of the pachinko machine 10. For example, the higher the setting value, the higher the probability of being allocated to the most profitable jackpot result, or the higher the setting value, the higher the probability of being allocated to the most profitable jackpot result or the low winning, high probability jackpot result. In this case, the higher the set value, the higher the probability that the game will enter the high probability mode after a jackpot result. In addition, the higher the setting value, the lower the probability of being assigned to a low winning/high probability jackpot result.If the setting value is high, it will not be assigned to a low winning/high probability jackpot result, whereas if the setting value is low, the probability of being assigned to a low winning/high probability jackpot result will be lower. It may also be configured such that it can be distributed to jackpot results. In this case, the higher the set value, the higher the probability that the opening/closing execution mode of the high frequency winning mode will occur.

Next, the reach random number counter C3 will be explained. The reach random number counter C3 is configured to increment sequentially by 1 within the range of 0 to 238, for example, and return to "0" after reaching the maximum value. In this pachinko machine 10, an expected performance is set as a type of display performance on the symbol display device 41. Expected production is a gaming machine that is equipped with a symbol display device 41 that can display fluctuating symbols, and in which the final stop result is the award corresponding result in a game round that results in a predetermined jackpot result. This is a display state that is made to make the player think that the variable display state is likely to result in the award corresponding result after the start of the variable display of symbols and before the stop result is derived and displayed. Specifically, regarding the award correspondence result, combinations of symbols with the same number attached on any active line are stopped and displayed.

Two types of expected effects are set: a ready-to-reach display and a preview display for making users expect the occurrence of a ready-to-reach display or a grant response result at a stage before the ready-to-reach display occurs.

In the ready-to-reach display, the combination of ready-to-win symbols is displayed by stopping and displaying some of the symbol rows among the plurality of symbol rows displayed on the display surface 41a of the symbol display device 41, and in this state, the remaining symbol rows are displayed. This includes a display state in which symbols are displayed in a variable manner in a symbol row. In addition, while the combination of ready-to-reach symbols is displayed as described above, the remaining symbol rows are displayed with fluctuating symbols, and a predetermined character or the like is displayed as a moving image on the background screen to create a ready-to-reach effect. , those that perform a reach effect by displaying a predetermined character or the like as a moving image on substantially the entire display surface 41a after displaying or not displaying a combination of ready-to-reach symbols are included.

The preview display may be performed in a situation where the symbols are being displayed in a variable manner in all symbol rows after the variable display of the symbols has started on the display surface 41a of the symbol display device 41, or in a situation in which symbols are being displayed in a variable manner in all symbol rows, or in some symbol rows but in a plurality of symbol rows. In a situation where symbols are displayed in a variable manner in a symbol column, a mode is included in which a character is displayed separately from the symbols on the symbol column. Also included are those in which the background screen is set in a predetermined mode different from the previous mode, and those in which the symbols on the symbol row are set in a predetermined mode different from the previous mode. Such a notice display can occur in any game round when a reach display is displayed or when a reach display is not performed, but it is higher when a reach display is performed than when a reach display is not performed. It is set to occur with probability.

The reach display is executed regardless of the value of the reach random number counter C3 in the game round in which the same combination of symbols is finally stopped and displayed. Further, in a game round corresponding to a jackpot result in which the same combination of symbols is not stopped and displayed, the game is not executed regardless of the value of the reach random number counter C3. In addition, in the game round corresponding to the winning result, this is executed when the reach random number counter C3 obtained at a predetermined timing by referring to the reach table stored in the main side ROM 64 corresponds to the occurrence of the reach display. .

On the other hand, the decision as to whether or not to display a preview is not made by the main control device 60 but by the sound emission control device 81. In this case, the sound emission control device 81 recognizes that a preview display is more likely to occur in a game round corresponding to a jackpot result than in a game round corresponding to a losing result, and that a preview display with a low appearance rate is A lottery process for displaying a preview is executed so as to satisfy at least one condition that the occurrence is likely to occur. Incidentally, this lottery result is reflected when the symbol display device 41 performs a game repeat effect.

Here, the probability that a reach display will occur in a game round with a losing result is the same regardless of the setting state from "Setting 1" to "Setting 6". This makes it possible to prevent the setting state of the pachinko machine 10 from having an advantage or disadvantage with respect to the probability that a reach display will occur in a game round that results in a losing result. However, the present invention is not limited to this, and a configuration may be adopted in which the higher the set value is, the higher the probability that the reach display will occur in a game round that results in a losing result.

Next, the variation type counter CS will be explained. The variation type counter CS is configured to be incremented by 1 in sequence within the range of 0 to 198, for example, and return to "0" after reaching the maximum value. The variation type counter CS is used by the main CPU 63 to determine the display duration time on the special symbol display section 37a and the display duration time of symbols on the symbol display device 41. The variation type counter CS is updated once every time a timer interrupt process, which will be described later, is executed once, and is repeatedly updated within the remaining time until the next timer interrupt process is executed. Then, the buffer value of the variation type counter CS is acquired when determining the variation pattern at the start of the variation display on the special symbol display section 37a and at the time the symbol display device 41 starts the variation of the symbol.

<About the processing configuration of the main CPU 63>
Next, each process executed by the main CPU 63 to advance the game will be explained. The processing of the main CPU 63 can be roughly divided into main processing that is started upon power-on, and timer interrupt processing that is started periodically (in this embodiment, every 4 milliseconds).

<Main processing>
First, the main processing will be explained with reference to the flowchart in FIG.

In the main process, first, a power-on wait process is executed (step S101). In the power-on wait process, for example, the process waits without proceeding to the next process until a predetermined wait time (specifically, 1 second) has elapsed after the main process is started. The operation start and initial setting of the symbol display device 41 are completed during the execution period of the power-on wait process. Thereafter, access to the main RAM 65 is permitted (step S102).

Thereafter, it is determined whether the setting key insertion section 68a has been turned on (step S103). If the setting key insertion section 68a has not been turned on (step S103: NO), it is determined whether the reset button 68c has been pressed (step S104). When the reset button 68c is pressed (step S104: YES), each area of the main side RAM 65 is " 0" is cleared, and initial settings are made for the area cleared to "0" (step S105). In other words, if the supply of operating power to the pachinko machine 10 is started while pressing the reset button 68c without turning on the setting key insertion part 68a, the operation to the pachinko machine 10 regarding the setting value information is Clearing of the main RAM 65 is performed while maintaining the state before the power supply was stopped, and the storage area where the clearing has been performed is initialized. This makes it possible to initialize other areas of the main RAM 65 without changing set values. In addition, in step S105, initial settings are performed after various registers of the main CPU 63 are also cleared to "0".

If the reset button 68c is not pressed (step S104: NO), it is determined whether the power outage flag is set to "1" (step S106). A power outage flag is provided in the main side RAM 65, and when the supply of operating power to the main side CPU 63 is stopped and a predetermined power outage process is normally executed, the power outage flag is set to "1". will be set. If the power outage flag is set to "1", it is determined whether the checksum calculation result matches the checksum saved when the power was cut off, that is, the validity of the stored data is determined (step S107). . When the process of step S105 is executed, or when an affirmative determination is made in step S107, it is determined whether the set values of the pachinko machine 10 are normal by checking the main side RAM 65 (step S108). Specifically, the setting value is determined to be normal if it is one of "setting 1" to "setting 6", and it is determined to be abnormal if it is "0" or 7 or more.

If a negative determination is made in any of steps S106 to S108, an operation prohibition process is executed. In the operation prohibition process, after executing an error notification process to notify the hall manager and the like of the occurrence of an error (step S109), an infinite loop occurs. The operation prohibition process is canceled by executing the all clear process (step S115), which will be described later.

If a positive determination is made in all steps S106 to S108, a power-on setting process is executed (step S110). In the power-on setting process, a predetermined area of the main side RAM 65, such as initialization of a power outage flag, is set to an initial value, and a command corresponding to the current gaming state is transmitted to the audio emission control device 81.

Although the main CPU 63 is configured to periodically execute timer interrupt processing, generation of timer interrupt processing is prohibited at the stage when main processing is started. This state in which generation of the timer interrupt process is prohibited is canceled at a timing when the process in step S110 is completed and before the process in step S111 is executed, and execution of the timer interrupt process is permitted. As a result, when the supply of operating power to the main CPU 63 is started, the power-on setting process in step S110 is completed and the timer interrupt process is not executed until the stage before the process in step S111 is started. Therefore, the main CPU 63 will not start the process for advancing the game until the situation is reached.

Thereafter, the process proceeds to the remaining processing of steps S111 to S114. In other words, although the main CPU 63 is configured to periodically execute timer interrupt processing, there is a remaining time between one timer interrupt processing and the next timer interrupt processing. Although this remaining time will vary depending on the processing completion time of each timer interrupt process, the remaining process of steps S111 to S114 is repeatedly executed using such irregular time. In this respect, it can be said that the remaining processing of steps S111 to S114 is non-regular processing that is executed non-regularly.

In the remaining processing, first, in step S111, interrupt prohibition is set to prohibit generation of timer interrupt processing. In the subsequent step S112, a random number initial value update process is executed to update the random number initial value counter CINI, and in step S113, a variation counter update process is executed to update the variation type counter CS. In these update processes, the current numerical information is read from the corresponding counter in the main side RAM 65, the read numerical information is incremented by 1, and then the process of overwriting the counter from which it was read is executed. In this case, each counter value is cleared to "0" when it exceeds the maximum value. Thereafter, in step S114, interrupt permission is set to switch from a state in which generation of timer interrupt processing is prohibited to a state in which generation of timer interrupt processing is permitted. When the process of step S114 is executed, the process returns to step S111 and the processes of steps S111 to S114 are repeated.

On the other hand, if the setting key insertion section 68a is turned on (step S103: YES), all clear processing is executed (step S115). In the all clearing process, all areas of the main side RAM 65 are cleared to "0", including the area where setting value information indicating the setting state of the pachinko machine 10 is set in the main side RAM 65, and the area is cleared to "0". Perform initial settings for the area. In other words, if an operation is being performed to change the setting state of the pachinko machine 10, all areas of the main RAM 65 are cleared to "0" even if the reset button 68c is not pressed. Initial settings are performed for the storage area where the process was executed. Further, in step S115, initial settings are performed after various registers of the main CPU 63 are also cleared to "0". Note that this is not limited to this, and even if an operation is being performed to change the setting state of the pachinko machine 10, if the reset button 68c is not pressed, all of the main side RAM 65 is A configuration may be adopted in which the clearing process is not executed and the all clearing process is executed when an operation for changing the setting state of the pachinko machine 10 is performed and the reset button 68c is pressed.

Thereafter, after executing a setting value update process in step S116, the process moves to step S110. In the setting value update process (step S116), first, a setting value counter provided in the main side RAM 65 is set to "1". The setting value counter is a counter for the main CPU 63 to specify which setting value the setting state of the pachinko machine 10 is at. By setting "1" to the setting value counter, when the setting value update process is executed, the setting value becomes "setting 1" regardless of the previous setting value. Thereafter, the display of the third notification display device 69c is controlled so that the number "1" corresponding to "Setting 1" is displayed. When changing the setting value, the game hall manager can grasp the current setting state of the pachinko machine 10 by checking the third notification display device 69c. After that, update execution processing is executed.

In the update execution process, it is determined whether the update button 68b has been pressed once on the condition that the setting key insertion section 68a has not been turned off, and if the update button 68b has been pressed once, adds 1 to the value of the setting value counter in the main side RAM 65. Furthermore, if the value of the set value counter after the addition by 1 exceeds "6", the set value counter is set to "1". As a result, each time the update button 68b is pressed once, the set value is updated to one step higher, and if the update button 68b is pressed once in the situation of "Setting 6", it is changed to "Setting 1". I will be going back. In the update execution process, when the value of the set value counter is updated, the display of the third notification display device 69c is controlled so that a number corresponding to the value of the set value counter of the main side RAM 65 is displayed. By checking the third notification display device 69c, the game hall manager can grasp the setting state of the pachinko machine 10 after pressing the update button 68b. In the setting value update process (step S116), the update execution process is repeatedly executed until the setting key insertion section 68a is turned off. Then, when the setting key insertion section 68a is turned off, the display of the setting value on the third notification display device 69c is ended, and the present setting value updating process is ended.

<Timer interrupt processing>
Next, timer interrupt processing will be explained with reference to the flowchart of FIG. 22. The timer interrupt process is executed periodically (for example, every 4 milliseconds).

In the timer interrupt process, first, a power outage information storage process is executed (step S201). In the power outage information storage process, it is monitored whether or not a power outage signal corresponding to the occurrence of a power outage is received from the power outage monitoring board 67, and if the occurrence of a power outage is identified, an infinite loop is executed after executing power outage processing. Become. In the power outage processing, the power outage flag in the main side RAM 65 is set to "1", a checksum is calculated, and the calculated checksum is saved.

After that, a lottery random number update process is executed (step S202). In the random number update process for lottery, the winning random number counter C1, the jackpot type counter C2, the reach random number counter C3, and the general utility object opening counter C4 are updated. Specifically, the current numerical information was sequentially read from the hit random number counter C1, the jackpot type counter C2, the reach random number counter C3, and the general utility goods release counter C4, and a process was performed in which each of the read numerical information was incremented by 1. Afterwards, a process is executed to overwrite the reading source counter. In this case, each counter value is cleared to "0" when it exceeds the maximum value. Thereafter, in step S203, a random number initial value update process is executed as in step S112, and in step S204, a variation counter update process is executed as in step S113.

Thereafter, fraud detection processing is executed to monitor whether or not a predetermined event set as a monitoring target for fraud has occurred (step S205). In the fraud detection process, the occurrence of a plurality of types of events is monitored, and by confirming that a predetermined event has occurred, the game stop flag provided in the main side RAM 65 is set to "1". In the subsequent step S206, it is determined whether or not the game stop flag is set to "1", thereby determining whether or not the progress of the game is stopped. If a negative determination is made in step S206, the processes from step S207 onwards are executed.

In step S207, port output processing is executed. In the port output processing, when the output information has been set in the previous timer interrupt processing, processing is executed to perform output corresponding to the output information to the various drive units 32b and 34b. For example, if information is set to switch the special electric winning device 32 to the open state, output of a drive signal to the special electric drive unit 32b is started, and if information is set to switch the special electric prize winning device 32 to the closed state. stops the output of the drive signal. In addition, if information is set to switch the general electric accessory 34a of the second operating port 34 to the open state, output of a drive signal to the general electric drive unit 34b should be started, and the general electric accessory 34a of the second operating port 34 should be switched to the closed state. If the information is set, the output of the drive signal is stopped.

After that, reading processing is executed (step S208). In the reading process, signals other than the power outage signal and winning signal are read, and the read information is stored for use in future processing.

Thereafter, ball entry detection processing is executed (step S209). In the ball entry detection process, the signals received from each ball entry detection sensor 42a to 49a are read, and based on the reading results, the output port 24a, general winning port 31, special electric winning device 32, and first operating port 33 are activated. , the presence or absence of the ball entering the second operating port 34 and the through gate 35 is determined.

Thereafter, a timer update process is executed to collectively update numerical information of multiple types of timer counters provided in the main side RAM 65 (step S210). In this case, the configuration is such that the timer counters that are updated by subtracting the stored numerical information are handled collectively, but both the subtraction-type timer counter update and the addition-type timer counter update are performed collectively. It may also be a configuration.

Thereafter, a firing control process for controlling the firing of game balls is executed (step S211). In a situation where the firing operation to the firing operation device 28 is continued, one game ball is fired every 0.6 seconds, which is a predetermined firing cycle. In the subsequent step S212, as an input state monitoring process, based on the information read in the reading process in step S208, the disconnection of each ball entry detection sensor 42a to 49a is confirmed, and the opening of the gaming machine main body 12 and the front door frame 14 is confirmed. I do.

Thereafter, a special figure special electric control process for controlling the execution of the game round and the opening/closing execution mode is executed (step S213). The special figure special electric control process will be explained in detail later.

Thereafter, general electric power control processing is executed (step S214). In the general map and general electric power control process, when a prize is won in the through gate 35, a process is executed to obtain the reservation information on the general electrician side, and when the reservation information on the general electrician side is stored. Then, a release determination is made regarding the pending information, and further, using the release determination as a trigger, a process for performing a production for a regular map is executed. Further, based on the result of the open determination, a process for opening and closing the general electric accessory 34a of the second operating port 34 is executed. In this case, if the support mode is low-frequency support mode, the corresponding process is executed, and if the support mode is high-frequency support mode, the corresponding process is executed. Furthermore, in the case of the opening/closing execution mode, even if the immediately previous support mode was the high-frequency support mode, the mode becomes the low-frequency support mode.

In the following step S215, based on the processing results of the immediately preceding step S213 and step S214, output information is set to reflect the increase or decrease in the number of pending information related to the special figure display section 37a on the special figure pending display section 37b. , Output information is set to reflect the increase/decrease in the number of hold information related to the general figure display section 38a on the ordinary figure pending display section 38b. In addition, in step S215, based on the processing results of the immediately preceding step S213 and step S214, output information for updating the display content of the special figure display section 37a is set, and the display content of the regular figure display section 38a is updated. Configure the output information for updating.

Thereafter, the content of the command and signal received from the payout control device 77 is confirmed, and a payout state receiving process is executed to perform processing corresponding to the confirmation result (step S216). Further, a payout output process for setting the prize ball command as an output target is executed (step S217). Further, an external information setting process is executed to control the start and end of output of an external signal according to the processing results of various processes executed in the current timer interrupt process (step S218). After that, a management process is executed to display information corresponding to the result of the game ball entering the game area PA on the first to third notification display devices 69a to 69c (step S219), and this timer interrupt is executed. Finish the process.

<Special figure special electric control processing>
Next, the special figure special electric control process in step S213 will be explained with reference to the flowchart of FIG. 23.

First, a reservation information acquisition process is executed (step S301). In the reservation information acquisition process, it is determined whether or not a winning has occurred in the first operating port 33 or the second operating port 34, and if a winning has occurred, the number of pending in the pending storage area 65a is the upper limit. It is determined whether the value is less than the value (“4” in this embodiment). If the number of reservations is less than the upper limit value, the number of reservations is increased by 1, and each numerical information of the hit random number counter C1, jackpot type counter C2, and reach random number counter C3 updated in the previous step S202 is added to the reservation number. It is stored in the first reservation area among the vacant reservation areas RE1 to RE4 of area RE. In addition, if winnings to the first operating port 33 and the second operating port 34 occur at the same time, the process for acquiring the pending information is executed within the range of executing the pending information obtaining process once. Run multiple times. Furthermore, when new hold information is acquired, a corresponding acquisition command is transmitted to the audio emission control device 81. When the audio emission control device 81 receives the command, it updates the display of the image showing the number of pending information on the symbol display device 41 to the display content corresponding to the increase in the pending information.

Thereafter, the information of the special figure special electric line counter provided in the main side RAM 65 is read out (step S302), and the special figure special electric line address table provided in the main side ROM 64 is read out (step S303). Then, the start address corresponding to the information of the special figure/special electric line counter is acquired from the special figure/special electric line address table (step S304), and the process jumps to the process indicated by the acquired start address among the processes of steps S306 to S312 (step S305). ). The special figure special electric line counter is a counter for the main CPU 63 to grasp which of the various processes from step S306 to step S312 should be executed, and the special figure special electric line address table is a counter for the special figure special electric line counter. The start address of the program for executing the processes from step S306 to step S312 is set in correspondence with the numerical information.

In step S306, special figure fluctuation start processing is executed. FIG. 24 is a flowchart showing the special figure fluctuation start process.

In the special figure fluctuation start process, the data setting process is executed on the condition that the number of pieces of reservation information stored in the reservation area RE is 1 or more (step S401: YES) (step S402). In the data setting process, first, the number of reservations is subtracted by 1, and the data stored in the first reservation area RE1 of the reservation area RE is moved to the execution area AE. Thereafter, a process is executed to shift the data stored in each of the reservation areas RE1 to RE4 of the reservation area RE. This data shift process is a process of sequentially shifting the data stored in the first reservation area RE1 to the fourth reservation area RE4 to the lower area side. Specifically, the data is shifted from the second reservation area RE2 to the first reservation area RE1. , third reservation area RE3 → second reservation area RE2, fourth reservation area RE4 → third reservation area RE3, and then the fourth reservation area RE4 is cleared to "0". At this time, a shift command is sent to the audio emission control device 81 to make it recognize that the data in the reservation area has been shifted. When the sound emission control device 81 receives the command, it updates the display of the image showing the number of pending information on the symbol display device 41 to display content corresponding to the decrease in the pending information.

After executing the data setting process, the validity table is read from the validity table storage area 64a of the main side ROM 64 (step S403). As already explained, the validity table storage area 64a stores the low probability validity table for setting 1 to the low probability validity table for setting 6 and the high probability validity table as validity tables. In step S403, the current winning/losing lottery mode is grasped by first reading out the information indicating the winning/failing lottery mode from the main side RAM 65. If the high probability mode is selected, a high probability success/failure table is read from the success/failure table storage area 64a. On the other hand, when the mode is low probability mode, the setting state of the pachinko machine 10 is grasped by reading the value of the setting value counter in the main side RAM 65. Then, the low probability validity table corresponding to the grasped set value is read from the validity table storage area 64a.

Thereafter, the validity determination process is executed with reference to the validity table read in step S403 (step S404). In the win/fail determination process, the information for the win/fail determination among the information stored in the execution area AE, that is, the numerical information related to the winning random number counter C1 matches the jackpot numerical information set in the win/fail table read out in step S403. Determine whether or not the

If the result of the success/failure determination process is a jackpot winning result (step S405: YES), a distribution determination process is executed (step S406). In the distribution determination process, information for distribution determination, that is, numerical information related to the jackpot type counter C2, is read out of the information stored in the execution area AE. Then, referring to the distribution table provided in the distribution table storage area 64b of the main side ROM 64, it is specified to which jackpot result the numerical information related to the read jackpot type counter C2 corresponds. Specifically, it is specified which jackpot result corresponds to a low-probability jackpot result, a low-win high-probability jackpot result, and a most profitable jackpot result.

Thereafter, a stop result setting process for jackpot results is executed (step S407). Specifically, information on the mode of the pattern to be finally stopped and displayed on the special figure display section 37a in the game round related to the start of the current variation is obtained from the stop result table for jackpot results stored in advance in the main side ROM 64. The identified information is written to the main RAM 65. In this stop result table for jackpot results, information on the mode of the picture that is stopped and displayed on the special figure display section 37a is set differently for each type of jackpot result.

Thereafter, flag setting processing corresponding to the distribution determination result is executed (step S408). Specifically, the main RAM 65 is provided with flags corresponding to the types of jackpot results, and in step S408, among the flags corresponding to the types of jackpot results, the flags used in the distribution determination process of step S406 are selected. Set "1" to the flag corresponding to the result.

On the other hand, if it is determined in step S405 that the result is not a jackpot winning result, a stop result setting process for a winning result is executed (step S409). Specifically, information on the mode of the picture to be finally stopped and displayed on the special figure display section 37a in the game round related to the start of the current variation is obtained from the stop result table for miss results stored in advance in the main side ROM 64. The identified information is written to the main RAM 65. The information on the pattern mode selected in this case is different from the information on the pattern mode selected in the case of a jackpot result.

After executing either step S408 or step S409, a process for determining the duration of a gaming session is executed (step S410). In this process, numerical information of the variation type counter CS is acquired. Furthermore, it is determined whether or not a ready-to-reach display will occur on the symbol display device 41 in the current game round. Specifically, if the game round related to the start of the current variation is a low-probability jackpot result or a most advantageous jackpot result, it is determined that the reach display will occur. Moreover, if it is not any jackpot result and the numerical information related to the reach random number counter C3 stored in the execution area AE is numerical information corresponding to the occurrence of the reach, it is determined that the reach display occurs.

If it is determined that a reach display will occur, refer to the reach occurrence duration table stored in the main side ROM 64 to obtain the duration of the game round corresponding to the numerical information of the current variation type counter CS. . On the other hand, if it is determined that the reach display does not occur, the continuation of the game round corresponding to the numerical information of the current variation type counter CS is continued by referring to the continuation period table for non-reach occurrence stored in the main side ROM 64. Get the period. Incidentally, the continuation period of a gaming session that can be obtained by referring to the continuation period table for non-reach occurrence is different from the continuation period of a gaming session that can be obtained by referring to the continuation period table for non-reach occurrence.

The duration of the game round when no reach occurs is set such that the longer the number of reservation information stored in the reservation area RE, the shorter the duration of the game round. Also, in situations where the support mode is high-frequency support mode, a shorter game duration is selected than in situations where the support mode is low-frequency support mode, compared to cases where the number of pending information is the same. A duration table for reach non-occurrence is set. However, the present invention is not limited to this, and a configuration may be adopted in which the duration of a game round does not vary depending on the number of pending information or the support mode, or the above relationship may be reversed. Furthermore, the above configuration may be applied to the duration of the game round when the reach occurs. Further, in the case of various jackpot results, separate duration tables may be set for each of the case of a losing reach and the case of a losing result in which no reach occurs. In this case, the duration of the game round will be allocated according to each game result.

Thereafter, the information on the duration of the game round acquired in step S410 is set in the special figure special electric timer counter provided in the main side RAM 65 (step S411). The numerical information set in the special figure special electric timer counter is updated in a timer update process (step S210). Incidentally, as a performance for a game round, a fluctuating display of symbols on the special symbol display section 37a and a fluctuating display of symbols on the symbol display device 41 are performed, but when each of these fluctuating displays is ended, the game cycle The final stop is displayed for a final stop period (for example, 0.5 seconds) in a state in which the stop result is displayed (a state in which a predetermined combination of symbols is on standby on the active line in the symbol display device 41). In this case, the duration of the game round acquired in step S410 is the total time of one game round.

Thereafter, the variation command and the type command are transmitted to the audio emission control device 81 (step S412). The variation command includes information about the duration of the game. Here, as mentioned above, the duration of the gaming session obtained by referring to the non-reach duration table is different from the duration of the gaming session obtained by referring to the duration table for reach occurrence. Even if the variation command does not include information on whether or not a reach has occurred, the audio emission control device 81 can identify whether or not a reach has occurred from the information on the duration of the game round. In this respect, it can be said that the variation command includes information indicating the presence or absence of reach. Note that the variation command may include information that directly indicates the presence or absence of reach. Further, the type command includes information on game results.

When the audio emission control device 81 receives the variation command and the type command from the main CPU 63, it causes the decoration boards 56, 57, the speaker section 53, and the symbol display device 41 to execute the performance for the game round. In this case, the effect of the game round is performed in a manner corresponding to the contents of the variation command and the type command. In addition, in the symbol display device 41, a fluctuating display of symbols is performed as a performance for the game round, and when the performance for the game round ends, a combination of symbols corresponding to the results of the win/fail judgment process and the distribution judgment process is displayed. Stop display.

Thereafter, variable display of the symbols on the special figure display section 37a is started (step S413). Then, the special figure special electric line counter is incremented by 1 (step S414), and this special figure fluctuation start process is ended. The numerical information of the special figure special electric counter when the special figure fluctuation start process is executed is "0". By adding "1" in step S414, the numerical information of the special figure special electric counter becomes "1".

Returning to the explanation of the special figure special electric control process (FIG. 23), in step S307, a process during special figure variation is executed. In the special figure variation processing, it is determined whether the timing is during the duration of the game round and before the final stop display, and if it is before the final stop display, the display mode of the symbols in the special figure display section 37a is set as a rule. Execute processing to change the When it is time to display the final stop, by adding 1 to the numerical information of the special figure special electric counter, the numerical information of the counter changes from the one corresponding to the process during special figure fluctuation to the one corresponding to the process during special figure confirmation. Update things. Note that in this embodiment, the final stop command is not sent from the main side CPU 63 to the audio emission control device 81.

In step S308, special figure confirmation processing is executed. In the special figure confirmation process, the display mode of the symbols in the special figure display section 37a is set to a display mode corresponding to the lottery result of the current game round. In addition, in the special figure confirmation process, it is determined whether or not the final stop period has elapsed, and if the period has elapsed, it is determined whether or not a transition to the opening/closing execution mode will occur. If the transition to the opening/closing execution mode does not occur, the numerical information of the special figure special electric counter is cleared to "0". When a transition to the opening/closing execution mode occurs, by adding 1 to the numerical information of the special figure special electric counter, the numerical information of the counter changes from the one corresponding to the process during special figure confirmation to the one corresponding to the special electric line start process. Update.

In step S309, special call start processing is executed. In the special call start process, if the process for starting the opening period in the current opening/closing execution mode has not been executed yet, the opening period setting process is executed. Further, an opening command is transmitted to the audio emission control device 81. By receiving the opening command, the audio emission control device 81 causes the decorative boards 56, 57, the speaker section 53, and the symbol display device 41 to execute the opening effect. If the opening period has elapsed, start processing is executed to start the first round game. In the start process, the special electric winning device 32 is opened and conditions for ending the round game are set. When setting this termination condition, the upper limit duration period for keeping the special electric winning device 32 in the open state in the first round game of this time is set, and the maximum duration of the winning period of the special electric winning device 32 in the first round game of this time is set. The upper limit number of game balls is set in a winning number counter provided in the main side RAM 65.

In step S310, a special electric line opening process is executed. In the special electric current opening process, it is determined whether or not the end condition of the round game is satisfied. If the termination condition is met, the special electric prize winning device 32 is brought into a closed state. If the round game that has ended this time is the round game of the last run, then by adding 1 to the numerical information of the special figure special electric counter, the numerical information of the counter is changed from that corresponding to the special electric line opening process to the special electric line closed process. If the round game that ended this time is the last round game to be played, the numerical information of the special figure special electric counter is added by 2 to make the numerical information of the counter correspond to the special electric current open process. Update from a new version to one that supports special call termination processing.

In step S311, special train closed processing is executed. In the special train closing process, it is determined whether the interval period between round games has elapsed. The interval period is set when the previous round game ends. When the interval period has elapsed, the special electric winning device 32 is opened and conditions for ending the round game are set. Then, by subtracting 1 from the numerical information of the special train special train counter, the numerical information of the counter is updated from that corresponding to the special train closed process to that corresponding to the special train open process.

In step S312, special call termination processing is executed. In the special electric signal termination process, if the process for starting the ending period in the current opening/closing execution mode has not been executed yet, the ending period (for example, 5 seconds) is set and an ending command is sent to the audio emission control device 81. . By receiving the ending command, the audio emission control device 81 causes the decorative boards 56, 57, the speaker section 53, and the symbol display device 41 to execute the ending effect. When the ending period has elapsed, each of the win/fail lottery mode and support mode after the end of the opening/closing execution mode is set to a mode corresponding to the jackpot result that triggered the start of the current opening/closing execution mode.

According to this embodiment described in detail above, the following excellent effects are achieved.

On the first decorative board 56, the same number (specifically, two) of wiring patterns 172a to 172d are drawn out from a pair of pads 171a and 171b corresponding to a pair of electrodes 85a and 85b of a bypass capacitor 85. Of the four sides of the first pad 171a, the direction (right direction) in which the side where the first wiring pattern 172a is drawn out when viewed from the center of the first pad 171a is This is the same direction (rightward direction) as the side from which the third wiring pattern 172c is drawn out when viewed from the center of the second pad 171b. Further, among the four sides of the first pad 171a, the direction (left direction) in which the side where the second wiring pattern 172b is drawn out when viewed from the center of the first pad 171a is the four sides of the second pad 171b. This direction is the same as the direction (left direction) in which the side from which the fourth wiring pattern 172d is drawn out exists when viewed from the center of the second pad 171b. This makes it possible to prevent a difference in temperature distribution between the pair of pads 171a and 171b during the initial heating stage of the reflow process, and also to prevent rotation of the bypass capacitor 85 and generation of chips.

The bypass capacitor 85 is a small chip component having a longitudinal dimension of approximately 0.6 mm, and a transversal dimension and a thickness direction dimension of approximately 0.3 mm. Since the longitudinal dimension of the bypass capacitor 85 along the plane orthogonal to the thickness direction is 0.7 mm or less, the area occupied by the bypass capacitor 85 on the first decorative substrate 56 can be reduced. By setting the longitudinal dimension of the bypass capacitor 85 to 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 85 and the first decorative board 56 and the mechanical strength of the bypass capacitor 85 itself are increased, and the connection It is possible to reduce the possibility that the portion will be damaged, and it is also possible to reduce the possibility that the bypass capacitor 85 itself will be damaged. Further, since the dimension of the bypass capacitor 85 in the longitudinal direction is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming whether or not the bypass capacitor 85 has not been mounted.

In a configuration in which the same number (specifically, one) of wiring patterns 181a and 181b are drawn out from a pair of pads 176a and 176b corresponding to a pair of electrodes 87a and 87b of a small chip resistor 87, the first pad 176a Among the four sides of the second pad 176b, the direction (rightward direction) in which the side where the first wiring pattern 181a is drawn out exists when viewed from the center of the first pad 176a is the second pad 176b among the four sides of the second pad 176b. This is the same direction (rightward direction) in which the side from which the second wiring pattern 181b is drawn out exists when viewed from the center. Thereby, it is possible to prevent a difference in temperature distribution between the pair of pads 176a and 176b in the initial heating stage of the reflow process, and also to prevent rotation of the small chip resistor 87 and occurrence of chip standing.

Like the bypass capacitor 85, the small chip resistor 87 has a longitudinal dimension (longitudinal dimension of the small chip resistor 87) of 0.1 mm or more along a plane perpendicular to the thickness direction of the component. It is a small chip component with a diameter of 9 mm or less. The small chip resistor 87 is a small chip component having a longitudinal dimension of approximately 0.6 mm, and a transversal dimension and a thickness direction dimension of approximately 0.3 mm. Since the longitudinal dimension of the small chip resistor 87 is 0.7 mm or less, the area occupied by the small chip resistor 87 on the first decorative substrate 56 can be reduced. Since the longitudinal dimension of the small chip resistor 87 is 0.4 mm or more, the mechanical strength at the connection point between the small chip resistor 87 and the first decorative board 56 and the mechanical strength of the small chip resistor 87 itself are improved. It is possible to increase the strength and reduce the possibility that the connection point will be damaged, and also to reduce the possibility that the small chip resistor 87 itself will be damaged. Further, since the longitudinal dimension of the small chip resistor 87 is 0.4 mm or more, it is possible to improve the accuracy of visually confirming whether or not the small chip resistor 87 is missing from mounting.

The first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85 is electrically connected to the GND plane layer 93, which has a larger area than the first pad 171a, via the first wiring pattern 172a. A second pad 171b corresponding to the second electrode 85b of 85 is electrically connected to a power plane layer 94 having a wider area than the second pad 171b via a third wiring pattern 172c. Of the four sides of the first pad 171a, the direction (right direction) in which the side where the first wiring pattern 172a is drawn out when viewed from the center of the first pad 171a is This is the same direction (rightward direction) as the side from which the third wiring pattern 172c is drawn out when viewed from the center of the second pad 171b. This reduces the possibility that a difference will occur in the temperature distribution within the pair of pads 171a, 171b in the initial heating stage of the reflow process.

The width dimension of the first wiring pattern 172a drawn out from the first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85 is the same as that of the third wiring pattern drawn out from the second pad 171b corresponding to the second electrode 85b. The width dimension is approximately the same as that of 172c. Therefore, compared to a configuration in which the wiring patterns 172a and 172c have different width dimensions, the possibility that a difference will occur in the temperature distribution within the pair of pads 171a and 171b in the initial heating stage of the reflow process is reduced. Further, the width dimension of the second wiring pattern 172b drawn out from the first pad 171a is approximately the same as the width dimension of the fourth wiring pattern 172d drawn out from the second pad 171b. Therefore, compared to a configuration in which the wiring patterns 172b and 172d have different width dimensions, the possibility that a difference will occur in the temperature distribution within the pair of pads 171a and 171b in the initial heating stage of the reflow process is reduced.

The width dimension of the first wiring pattern 181a drawn out from the first pad 176a corresponding to the first electrode 87a of the small chip resistor 87 is the same as that of the second wiring pattern 181a drawn out from the second pad 176b corresponding to the second electrode 87b. The width dimension is approximately the same as the width dimension of the wiring pattern 181. Therefore, compared to a configuration in which the wiring patterns 181a and 181b drawn out from the pads 176a and 176b have different width dimensions, there is a difference in temperature distribution within the pair of pads 176a and 176b in the initial heating stage of the reflow process. The possibility of this occurring is reduced.

Since the number and position of the wiring patterns 172a to 172d drawn out from the pair of pads 171a and 171b corresponding to the pair of electrodes 85a and 85b of the bypass capacitor 85 are common, the molten solder on the first pad 171a The force acting on the first electrode 85a of the bypass capacitor 85 due to the surface tension of the molten solder on the second pad 171b can be balanced with the force acting on the second electrode 85b of the bypass capacitor 85 due to the surface tension of the molten solder on the second pad 171b. Therefore, even if only the left side of the solder paste melts first in the pair of pads 171a and 171b, the bypass capacitor 85 can be moved in parallel, and rotation of the bypass capacitor 85 can be prevented. . As a result, it is possible to suppress the degree of reduction in the connection area between the first pad 171a and the first electrode 85a due to the solder fillet 173a, and also to reduce the connection area between the second pad 171b and the second electrode 85b due to the solder fillet 173b. It is possible to suppress the degree of

Since the number and the position of the wiring patterns 181a and 181b drawn out from the pair of pads 176a and 176b corresponding to the pair of electrodes 87a and 87b of the small chip resistor 87 are common, The force acting on the first electrode 87a of the small chip resistor 87 due to the surface tension of the molten solder, and the force acting on the second electrode 87b of the small chip resistor 87 due to the surface tension of the molten solder on the second pad 176b. It can be balanced. Therefore, even if only the left side of the solder paste of the pair of first pad 176a and second pad 176b melts first, the movement mode of the small chip resistor 87 is parallel movement, and the small chip resistor 87 rotation can be prevented. As a result, it is possible to suppress the degree of reduction in the connection area between the first pad 176a and the first electrode 87a due to the solder fillet 177a, and also to reduce the connection area between the second pad 176b and the second electrode 87b due to the solder fillet 177b. It is possible to suppress the degree of

The small chip components (bypass capacitor 85 and small chip resistor 87) are mounted on the first decorative substrate 56 such that the longitudinal direction of the small chip components is parallel to the first direction DR1. The dimension of the first decorative substrate 56 in the first direction DR1 is larger than the dimension of the first decorative substrate 56 in the second direction DR2 orthogonal to the first direction DR1. If the small chip component is mounted on the first decorative board 56 such that the longitudinal direction of the small chip component is orthogonal to the first direction DR1, the first decoration is set from the boundary line extending in the first direction DR1 as a base point. When a force that bends the board 56 is applied to the first decorative board 56, stress may be applied to the connection point between the small chip component and the first decorative board 56 that may damage the connection point. In addition, there is a risk that stress that may damage the small chip component itself may be applied to the small chip component itself. On the other hand, since the small chip component is mounted on the first decorative board 56 such that the longitudinal direction of the small chip component is orthogonal to the first direction DR1, the small chip component and the first decorative The maximum value of stress that can be applied to the connection point with the substrate 56 is reduced, and the maximum value of stress that can be applied to the small chip component is also reduced. Therefore, damage to the connection portion between the small chip component and the first decorative board 56 is prevented, and damage to the small chip component itself is also prevented.

The small chip components (bypass capacitor 97 and small chip resistor 101) are mounted on the second decorative substrate 57 such that the longitudinal direction of the small chip components is parallel to the long axis direction LD. The dimension of the second decorative substrate 57 in the major axis direction LD is larger than the dimension of the second decorative substrate 57 in the minor axis direction SD perpendicular to the major axis direction LD. If the small chip component is mounted on the second decorative substrate 57 such that the longitudinal direction of the small chip component is orthogonal to the long axis direction LD, the second decoration is set from the boundary line extending in the long axis direction LD as a base point. When a force that bends the substrate 57 is applied to the second decorative substrate 57, stress may be applied to the connection portion between the small chip component and the second decoration substrate 57, which may damage the connection portion. In addition, there is a risk that stress that may damage the small chip component itself may be applied to the small chip component itself. On the other hand, since the small chip component is mounted on the second decorative board 57 such that the longitudinal direction of the small chip component is perpendicular to the long axis direction LD, the small chip component and the second decorative The maximum value of stress that can be applied to the connection point with the substrate 57 is reduced, and the maximum value of stress that can be applied to the small chip component is also reduced. Therefore, damage to the connection portion between the small chip component and the second decorative board 57 is prevented, and damage to the small chip component itself is also prevented.

Electrodes 85a and 85b of bypass capacitor 85 are fixed to pads 171a and 171b by solder fillets 173a and 173b. Pads 171a, 171b and wiring patterns 172a to 172d are integrally formed by etching a copper foil plate. The wiring patterns 172a to 172d drawn out from the pads 171a and 171b extend in a direction perpendicular to the longitudinal direction of the bypass capacitor 85 (short direction) or in a direction substantially perpendicular to the longitudinal direction of the bypass capacitor 85. If the wiring patterns 172a to 172d drawn out from the pads 171a and 171b are configured to extend in a direction parallel to the longitudinal direction of the bypass capacitor 85, a boundary line perpendicular to the long side direction of the bypass capacitor 85 or a border substantially perpendicular to the long side direction of the bypass capacitor 85 is assumed. When the first decorative board 56 is distorted in the direction of bending the first decorative board 56 with respect to the line as a base point, stress that may damage the connection point between the bypass capacitor 85 and the first decorative board 56 is applied. In addition, there is a possibility that stress that may damage the bypass capacitor 85 itself may be applied to the bypass capacitor 85 itself. In contrast, by configuring the wiring patterns 172a to 172d drawn out from the pads 171a and 171b to extend in a direction perpendicular or substantially perpendicular to the longitudinal direction of the bypass capacitor 85, the first decorative board 56 It is possible to reduce the maximum value of stress that can act on the connection point between bypass capacitor 85 and first decorative board 56 when distortion occurs, and also reduce the maximum value of stress that can act on bypass capacitor 85 itself. be able to.

Electrodes 87a, 87b of small chip resistor 87 are fixed to pads 176a, 176b by solder fillets 177a, 177b. Pads 176a, 176b and wiring patterns 181a, 181b are integrally formed by etching a copper foil plate. The wiring patterns 181a and 181b drawn out from the pads 176a and 176b extend in a direction perpendicular to the longitudinal direction of the small chip resistor 87 (short side direction) or in a direction substantially perpendicular to the longitudinal direction of the small chip resistor 87. If the wiring patterns 181a and 181b drawn out from the pads 176a and 176b extend in a direction parallel to the longitudinal direction of the small chip resistor 87, a line perpendicular to the long side direction of the small chip resistor 87 or approximately When a bending stress that bends the first decorative board 56 with the orthogonal line as a boundary is applied to the first decorative board 56, the connection point between the small chip resistor 87 and the first decorative board 56 is There is a possibility that stress that may damage the small chip resistor 87 may be applied to the small chip resistor 87 itself, and there is a possibility that stress that may damage the small chip resistor 87 may be applied to the small chip resistor 87 itself. In contrast, by configuring the wiring patterns 181a and 181b drawn out from the pads 176a and 176b to extend in a direction perpendicular or substantially perpendicular to the longitudinal direction of the small chip resistor 87, the first decorative substrate It is possible to reduce the maximum value of stress that may act on the connection point between the small chip resistor 87 and the first decorative substrate 56 when distortion occurs in the small chip resistor 56, and to reduce the stress that may act on the small chip resistor 87 itself. The maximum value of can be reduced.

The first pad 176a electrically connected to the first electrode 87a of the small chip resistor 87 is connected to the second pad 176a electrically connected to the second electrode 142b of the LED chip 142 via the first wiring pattern 181a. It is electrically connected to the pad 178b (see FIG. 8(c)). Further, the second pad 176b electrically connected to the second electrode 87b of the small chip resistor 87 is connected to the eighth output terminal 162 of the LED driver 126 (FIG. 8(a)) via the second wiring pattern 181b. It is electrically connected to a pad (not shown) that is electrically connected to (FIG. 11). The part where the second wiring pattern 181b is connected to the pad (not shown) corresponding to the eighth output terminal 162 is connected to the second wiring pattern 181b from the second pad 176b in the drawing direction (FIGS. 8(a) and 8(c)). When viewed in one axis direction (second direction DR2 in FIGS. 8A and 8C) including the right direction in FIGS. 8A and 8C, the second wiring from the second pad 176b is It exists in a direction opposite to the drawing direction of the pattern 181b. The second wiring pattern 181b is drawn out from the second pad 176b in the same direction (right direction) as the direction in which the first wiring pattern 181a is drawn out from the first pad 176a, and then the second wiring pattern 181b is drawn out in the direction of the one axis (second direction DR2 ), it is routed in the opposite direction with respect to the second pad 176b. A location where the second wiring pattern 181b exists in a direction opposite to the direction in which the second wiring pattern 181b is drawn out from the second pad 176b with the second pad 176b as a reference when viewed in the uniaxial direction (second direction DR2) Also in the configuration in which the second wiring pattern 181b is connected to the connection destination, the second wiring pattern 181b is drawn out from the second pad 176b in the same direction as the direction in which the first wiring pattern 181a is drawn out from the first pad 176a. This can reduce the possibility that a difference will occur in the temperature distribution within the pair of first pad 176a and second pad 176b in the initial heating stage of the reflow process.

A pair of pads corresponding to a pair of electrodes of a small chip component have the same shape and size. Therefore, the amount of solder paste applied to the pair of pads in the solder application process can be made uniform, and the amount of molten solder produced on the pair of pads can be made equal. As a result, the force acting on the first electrode of the small chip component due to the surface tension of the molten solder on the first pad, and the force acting on the second electrode of the small chip component due to the surface tension of the molten solder on the second pad. balance can be achieved. Therefore, it is possible to prevent the small chip components from rotating and from standing up.

The bypass capacitor 85 is mounted on the first decorative substrate 56 such that the longitudinal direction of the bypass capacitor 85 is parallel to the first direction DR1. A pair of pads 171a, 171b corresponding to a pair of electrodes 85a, 85b of bypass capacitor 85 are spaced apart in the longitudinal direction of bypass capacitor 85. Furthermore, the small chip resistor 87 is mounted on the first decorative substrate 56 such that the longitudinal direction of the small chip resistor 87 is parallel to the first direction DR1. A pair of pads 176a, 176b corresponding to a pair of electrodes 87a, 87b of the small chip resistor 87 are spaced apart in the longitudinal direction of the small chip resistor 87. In this way, in a plurality of small chip components (bypass capacitor 85 and small chip resistor 87), the pair of pads 176a and 176b have the same direction of separation. Therefore, by conveying the first decorative substrate 56 in a direction perpendicular to or substantially perpendicular to the common separation direction in the reflow process, the pair of pads 171a, which correspond to the pair of electrodes 85a, 85b of the bypass capacitor 85, The timing at which the heating of the solder paste applied on the solder paste 171b is started can be aligned, and the solder paste applied on the pair of pads 176a and 176b corresponding to the pair of electrodes 87a and 87b of the small chip resistor 87 can be aligned. The timing at which the heating of the solder paste starts can be aligned. Thereby, rotation of the plurality of small chip components and generation of chip standing can be prevented.

In a configuration in which small chip components (bypass capacitor 85 and small chip resistor 87) are concentrated on the first mounting surface 84 of the first decorative board 56, the connectors 111 and 112 are mounted on the second mounting surface of the first decorative board 56. It is only implemented in 95. On the first mounting surface 84, the small chip components are mounted on the connector back side corresponding areas 203, 204 (an area of the first mounting surface 84 corresponding to the area where the connectors 111, 112 are mounted on the second mounting surface 95 and the surrounding area thereof). ) are arranged to avoid. This makes it possible to reduce the maximum value of tensile stress that may act on the connection between the small chip component and the first decorative board 56 when attaching the harness to the connectors 111 and 112, and also to reduce the maximum tensile stress that may act on the small chip component itself. The maximum possible tensile stress can be reduced. Further, when the harness is pulled out from the connectors 111 and 112, the maximum value of compressive stress that may act on the connection point between the small chip component and the first decorative board 56 can be reduced, and the compressive stress that may be applied to the small chip component itself can be reduced. The maximum value of compressive stress can be reduced.

In the first decorative board 56, the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged at a distance of 5 mm or more from the outer edge of the fixed through holes 56d to 56g. There is. No small chip components are mounted in the through-hole peripheral regions 211a to 211d. By arranging the small chip components at a distance of 5 mm or more from the outer edges of the fixing through holes 56d to 56g, chips that may occur near the fixing through holes 56d to 56g when the first decorative board 56 is screwed to the front door frame 14 can be avoided. It is possible to prevent the connection portion between the small chip component and the first decorative board 56 from being damaged due to the distortion of the first decorative board 56, and also to prevent the small chip component itself from being damaged.

No small chip component is mounted on the LED back side corresponding area 201 on the second mounting surface 95 of the first decorative board 56 . The LED back side corresponding area 201 is the area of the second mounting surface 95 located on the back side of the area where the LED chips 127 to 142 are mounted on the first mounting surface 84 and the distance from the outer edge of the area of the second mounting surface 95. is the area within 1 mm. Due to the configuration in which small chip components are not mounted in the area of the second mounting surface 95 located on the back side of the area where the LED chips 127 to 142 are mounted on the first mounting surface 84, the LED chips 127 to 142 are mounted. The influence of thermal stress that may act on the first decorative substrate 56 due to heat generation on the small chip components is reduced. Since the small chip components are mounted avoiding the LED backside corresponding area 201, the light emitting effect on the first decorative board 56 is repeatedly executed, which causes the connection between the small chip components and the first decorative board 56 to be Not only can the parts be prevented from being damaged, but also the small chip components themselves can be prevented from being damaged.

No small chip components are mounted on the driver back side corresponding area 202 of the second mounting surface 95. The driver back side corresponding area 202 is an area of the second mounting surface 95 located on the back side of the area where the LED driver 126 is mounted on the first mounting surface 84 and the area where pads corresponding to the terminals of the LED driver 126 are provided. and an area within a distance of 1 mm from the outer edge of the area of the second mounting surface 95. Small chip components are mounted on the second mounting surface 95 located on the back side of the first mounting surface 84 where the LED driver 126 is mounted and the region where pads corresponding to the terminals of the LED driver 126 are provided. This configuration reduces the influence of thermal stress that may be exerted on the first decorative substrate 56 due to heat generated by the LED driver 126 on the small chip components. Since the small chip components are mounted avoiding the area 202 corresponding to the back side of the driver, the light emitting effect on the first decorative board 56 is repeatedly executed, which causes the connection between the small chip components and the first decorative board 56 to occur. Not only can the parts be prevented from being damaged, but also the small chip components themselves can be prevented from being damaged.

In the first decorative board 56, the small chip components (bypass capacitor 85 and small chip resistor 87) are arranged at a distance of 1 mm or more from the outer edge of the LED chip 142. By arranging the small chip component at a distance of 1 mm or more from the outer edge of the LED chip 142, it is possible to minimize the influence of thermal stress on the connection point between the small chip component and the first decorative board 56. The effect of thermal stress on the component itself can be minimized. Further, by arranging the small chip component at a distance of 1 mm or more from the outer edge of the LED chip 142, it is possible to prevent the connection point between the small chip component and the first decorative board 56 from being damaged due to thermal stress. At the same time, it is possible to prevent the small chip component itself from being damaged due to thermal stress.

In the first decorative board 56, the small chip components (bypass capacitor 85 and small chip resistor 87) are arranged at a distance of 1 mm or more from the outer edge of the LED driver 126 and the pad corresponding to the terminal of the LED driver 126. . By arranging the small chip component at a distance of 1 mm or more from the outer edge of the LED driver 126 and the pad corresponding to the terminal of the LED driver 126, the connection point between the small chip component and the first decorative board 56 can be prevented from being damaged by thermal stress. It is possible to prevent the small chip components from being put away, and also to prevent the small chip components themselves from being damaged due to thermal stress.

In the first decorative board 56, small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged avoiding the through hole peripheral regions 211a to 211d. The through-hole peripheral regions 211a to 211d are regions whose distance from the outer edge of the fixed through holes 56d to 56g is less than 5 mm. By arranging the small chip components at a distance of 5 mm or more from the outer edges of the fixing through holes 56d to 56g, chips that may occur near the fixing through holes 56d to 56g when the first decorative board 56 is screwed to the front door frame 14 can be avoided. It is possible to prevent the connection portion between the small chip component and the first decorative board 56 from being damaged due to the distortion of the first decorative board 56, and also to prevent the small chip component itself from being damaged.

On the first mounting surface 84, the small chip components are arranged avoiding the areas 203 and 204 corresponding to the back side of the connector. The connector back side corresponding areas 203 and 204 are the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95, and the area from the outer edge of the area of the first mounting surface 84. This is a region where the distance is less than 5 mm. By having a configuration in which small chip components are not mounted in the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95, the harness to the connectors 111 and 112 is The influence of stress that may act on the first decorative substrate 56 upon attachment and detachment on the small chip components is reduced. Since the small chip components are arranged avoiding the connector back side corresponding areas 203 and 204, the connection points between the small chip components and the first decorative board 56 may be damaged when the harness is attached to and removed from the connectors 111 and 112. This also prevents damage to the small chip component itself.

The LED driver 126 is arranged in an area including an area less than 10 mm from the outer edge of the first decorative board 56, while the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) , are arranged at a distance of 10 mm or more from the outer edge of the first decorative substrate 56. Among the various electronic components mounted on the first decorative board 56, the connection points between small chip components and the first decorative board 56 are mechanically larger than the connection points between other electronic components and the first decorative board 56. target strength is low. Since the small chip components are arranged at a distance of 10 mm or more from the outer edge of the first decorative board 56, the worker's hand may touch the small chip components when handling the first decorative board 56, and the small chip components may come into contact with the small chip components. The possibility that the connection point with the first decorative board 56 will be damaged is reduced, and the possibility that the small chip component itself will be damaged is also reduced. Furthermore, when dividing the collective board 231, the maximum value of stress that can act on the connection points between the small chip components and the first decorative board 56 is reduced, and the maximum value of stress that can act on the small chip components themselves is reduced. has been done.

Small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged avoiding areas around the through holes 211a to 211d and areas where the distance from the outer edge of the first decorative board 56 is less than 10 mm. In this configuration, the fixed through holes 56d to 56g are provided in an area where the distance from the outer edge of the first decorative substrate 56 is less than 10 mm. Therefore, compared to a configuration in which the fixing through holes 56d to 56g are provided at positions 10 mm or more away from the outer edge of the first decorative board 56, the area of the area on the first decorative board 56 in which small chip components can be mounted is larger. is widely secured.

A bypass capacitor 85 is arranged between the power supply terminal 151 of the LED driver 126 and the power plane layer 94. This reduces the influence of noise components included in the drive power supplied from the audio emission control device 81 to the LED driver 126 on the LED driver 126. The bypass capacitor 85 is placed close to the power supply terminal 151 so that no electronic components such as other ICs are present between the bypass capacitor 85 and the power supply terminal 151. This increases the possibility that noise components included in the drive power supplied to the power supply terminal 151 of the LED driver 126 will be absorbed by the bypass capacitor 85, and also allows the LED driver 126 to reduce the influence of the noise components. This can reduce the possibility of erroneous operation due to reception. Since the configuration is such that no other IC exists between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component does not cause other ICs to erroneously operate. This can prevent it from being activated. In addition, since the configuration does not include any other electronic components between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component is absorbed by other electronic components. It is possible to prevent electronic components from malfunctioning.

Around the bypass capacitor 85, only an identification silk 217 (labeled "C1") is provided to confirm that the mounted electronic component is the bypass capacitor 85. There is no external silk that can be grasped. The outer dimensions (vertical dimension, horizontal dimension, and height dimension) of the bypass capacitor 85 are smaller than the outer dimensions of electronic components other than small chip components (LED driver 126, LED chips 127 to 142, etc.). Therefore, if the outline silk of the bypass capacitor 85 is printed on the first decorative board 56, even though the bypass capacitor 85 is actually not mounted after the electronic components are mounted, the bypass capacitor 85 is printed only by looking at the outline silk. There is a possibility that the operator may mistakenly recognize that 85 is installed. On the other hand, by adopting a configuration in which no outline silk is provided around the bypass capacitor 85, it is possible to easily identify whether the bypass capacitor 85 is not mounted after mounting the electronic components. Further, by providing the identification silk 217 around the bypass capacitor 85, it is possible to recognize that the component mounted around the identification silk 217 is the bypass capacitor 85.

The outer dimensions of the small chip resistor 87, like the outer dimensions of the bypass capacitor 85, are smaller than the outer dimensions of electronic components other than small chip components. Around the small chip resistor 87, only an identification silk 218 (displayed as "R8") is provided to confirm that the mounted electronic component is the small chip resistor 87. No outline silk is provided that allows the mounting position of the resistor 87 to be confirmed. Thereby, it is possible to easily understand whether the small chip resistor 87 is missing in mounting. Further, since the identification silk 218 is provided around the small chip resistor 87, it is possible to recognize that the electronic component mounted around the identification silk 218 is the small chip resistor 87. be able to.

Since the outer silks 225a and 225b are convex with respect to the surface of the solder resist 222, if the outer silks 225a and 225b are provided around the small chip components (bypass capacitor 85 and small chip resistor 87), The outer silks 225a and 225b exist between the first mounting surface 84 and the metal mask 226, and the distance between the first mounting surface 84 and the metal mask 226 increases. In this configuration, there is a possibility that the solder paste 227 may wrap around the gap existing between the first pad 171a and the second pad 171b, and the first pad 171a and the second pad 171b may be electrically connected. In particular, when applying the solder paste 221 to a large number of first decorative substrates 56 continuously, the solder paste 221 accumulated on the edge of the opening of the metal mask 226 tends to wrap around the back side of the opening. The first pad 171a and the second pad 171b are likely to be electrically connected. In contrast, in this embodiment, no external silk is provided around the small chip component. This can prevent the distance between the first mounting surface 84 and the metal mask 226 from becoming too large, and can also prevent the occurrence of soldering defects in which the solder paste 221 gets between the pads 171a and 171b. I can do it. Further, it is possible to prevent a part of the small chip component from resting on the outer silk and causing a soldering defect.

Note that the LED back side corresponding area 201 where no small chip components are mounted on the second mounting surface 95 of the first decorative board 56 is the area where the LED chips 127 to 142 (FIG. 9) are mounted on the first mounting surface 84 (FIG. 8(a)). The distance from the area of the second mounting surface 95 located on the back side of the area where the second mounting surface 95 is mounted and the outer edge of the area of the second mounting surface 95 is not limited to 1 mm or less. The distance of the LED back side corresponding area 201 from the area of the second mounting surface 95 located on the back side of the area where the LED chips 127 to 142 are mounted on the first mounting surface 84 and the outer edge of the area of the second mounting surface 95. may be within a range of 2 mm. This makes it possible to further reduce the influence of thermal stress on the small chip components that may be exerted on the first decorative substrate 56 due to the heat generated by the LED chips 127 to 142. Therefore, it is possible to reduce the possibility that the connection point between the small chip component and the first decorative board 56 is damaged due to repeated execution of the light emitting effect on the first decorative board 56, and also to It is possible to reduce the possibility that the chip component itself will be damaged.

- The driver back side corresponding area 202 on the second mounting surface 95 of the first decorative board 56 where small chip components are not mounted is the region 202 corresponding to the driver back side where the small chip components are not mounted, and the LED driver 126 (FIG. 8(a)) is The area of the second mounting surface 95 located on the back side of the area where the pads corresponding to the terminals of the LED driver 126 are provided and the area where the LED driver 126 is mounted, and the distance from the outer edge of the area of the second mounting surface 95 is within 1 mm. It is not limited to this area. The driver back side corresponding area 202 is defined as the area of the second mounting surface 95 located on the back side of the area where the LED driver 126 is mounted on the first mounting surface 84 and the area where pads corresponding to the terminals of the LED driver 126 are provided. The distance from the outer edge of the second mounting surface 95 may be within 2 mm. Thereby, it is possible to further reduce the influence of thermal stress that may be exerted on the first decorative board 56 due to the heat generated by the LED driver 126 on the small chip components. Therefore, it is possible to reduce the possibility that the connection point between the small chip component and the first decorative board 56 is damaged due to repeated execution of the light emitting effect on the first decorative board 56, and It is possible to reduce the possibility that the chip component itself will be damaged.

- In the first decorative board 56, through-hole peripheral regions 211a to 211d where small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are not mounted are the outer edges of fixed through holes 56d to 56g. It is not limited to a region where the distance from the center is less than 5 mm. The through-hole peripheral regions 211a to 211d may be a region whose distance from the outer edge of the fixed through holes 56d to 56g is less than 7 mm. As a result, when the first decorative board 56 is fixed to the front door frame 14 with screws, distortion of the first decorative board 56 that may occur in the vicinity of the fixing through holes 56d to 56g may cause small chip components and the first decorative board. It is possible to reduce the possibility that the connection point with 56 will be damaged, and it is also possible to reduce the possibility that the small chip component itself will be damaged. Further, the through-hole peripheral regions 211a to 211d may be a region whose distance from the outer edge of the fixed through holes 56d to 56g is less than 4 mm. As a result, when the first decorative board 56 is fixed to the front door frame 14 with screws, the stress acting on the connection point between the small chip component and the first decorative board 56 and the stress acting on the small chip component itself can be reduced. , it is possible to secure a large area on the first decorative substrate 56 in which small chip components can be mounted.

- On the first mounting surface 84 of the first decorative board 56, the connector back side corresponding areas 203 and 204 where small chip components are not mounted are the areas where the connectors 111 and 112 are mounted on the second mounting surface 95 (FIG. 15(a)). The area of the first mounting surface 84 located on the back side of the area where the first mounting surface 84 is located and the distance from the outer edge of the area of the first mounting surface 84 is not limited to less than 5 mm. The connector back side corresponding areas 203 and 204 are defined as the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95 and from the outer edge of the area of the first mounting surface 84. The distance may be less than 7 mm. This reduces the possibility that the connection between the small chip component and the first decorative board 56 will be damaged when the harness is attached to or removed from the connectors 111, 112, and the small chip component itself will be damaged. The possibility can be reduced. In addition, the connector back side corresponding areas 203 and 204 are defined as the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95, and the outer edge of the area of the first mounting surface 84. The area may be less than 4 mm away from the center. This allows the small chip components to be mounted on the first decorative board 56 while reducing the stress acting on the connection points between the small chip components and the first decorative board 56 and the small chip components themselves when attaching and detaching the harness to the connectors 111 and 112. It is possible to secure a large mounting area.

- The area near the outer edge of the first decorative board 56 where small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are not mounted has a distance from the outer edge of the first decorative board 56. The area is not limited to less than 10 mm. The area near the outer edge of the board where the small chip component is not mounted may be an area where the distance from the outer edge of the first decorative board 56 is less than 12 mm. This reduces the possibility that the connection between the small chip component and the first decorative board 56 will be damaged due to the operator's hand touching the small chip component when handling the first decorative board 56. At the same time, the possibility of damage to the small chip component itself can be reduced. In addition, when dividing the collective board 231 including a plurality of first decorative boards 56 to take out the first decorative board 56, when dividing the collective board 231, it acts on the connection points between the small chip components and the first decorative board 56. The resulting stress can be reduced, and the stress acting on the small chip component itself can be reduced. Further, the area near the outer edge of the board where the small chip component is not mounted may be an area where the distance from the outer edge of the first decorative board 56 is less than 8 mm. Thereby, the area on the first decorative board 56 where the small chip component can be mounted is reduced while reducing the possibility that the connection point between the small chip component and the first decorative board 56 will be damaged and the possibility that the small chip component itself will be damaged. A large area can be secured.

<Second embodiment>
This embodiment differs from the first embodiment in that the longitudinal direction of some of the small chip components mounted on the first decorative board 56 is orthogonal to the first direction DR1. . Hereinafter, configurations that are different from the first embodiment will be described. Note that descriptions of the same configurations as in the first embodiment will be basically omitted.

25(a) is a plan view showing the first mounting surface 84 of the first decorative board 56 in this embodiment, and FIG. 25(b) is a peripheral area of the bypass capacitor 291 mounted on the first decorative board 56. 292 is an enlarged plan view of the first mounting surface 84 of the first decorative board 56. FIG. Similar to the first embodiment, as shown in FIG. 25(a), the dimensions of the first decorative substrate 56 in the first direction DR1 are the dimensions of the first decorative substrate 56 in the direction perpendicular to the first direction DR1. larger than

As shown in FIG. 25(b), like the bypass capacitor 85 in the first embodiment, the bypass capacitor 291 is arranged in a longitudinal direction (hereinafter referred to as "bypass capacitor 291") along a plane orthogonal to the thickness direction of the bypass capacitor 291. It is a small chip component whose dimension in the "longitudinal direction" is 0.1 mm or more and 0.9 mm or less. The bypass capacitor 291 has a longitudinal dimension of approximately 0.6 mm along a plane perpendicular to the thickness direction, and a width direction (hereinafter also referred to as "short direction") along a plane perpendicular to the thickness direction. ) and the dimension in the thickness direction are approximately 0.3 mm. Since the longitudinal dimension of the bypass capacitor 291 along the plane orthogonal to the thickness direction is 0.7 mm or less, the area occupied by the bypass capacitor 291 on the light emitting substrate 301 can be reduced. Since the longitudinal dimension of the bypass capacitor 291 along the plane perpendicular to the thickness direction is 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 291 and the light emitting board 301 and the mechanical strength of the bypass capacitor 291 itself are improved. It is possible to increase the strength and reduce the possibility that the connection point will be damaged, and it is also possible to reduce the possibility that the bypass capacitor 291 itself will be damaged. Further, since the lengthwise dimension of the bypass capacitor 291 is 0.4 mm or more, it is possible to improve the accuracy of visually confirming whether or not the bypass capacitor 291 has been omitted. Note that the lengthwise dimension of the bypass capacitor 291 may be smaller than 0.6 mm (for example, 0.4mm), and the bypass capacitor 291 may have a widthwise dimension smaller than 0.3mm. (for example, a configuration in which the thickness is 0.2 mm), or a configuration in which the dimension in the thickness direction is smaller than 0.3 mm (for example, a configuration in which the thickness is 0.2 mm) may be used.

The first wiring pattern 294a drawn out from the first pad 293a (or first pad) corresponding to the first electrode 291a of the bypass capacitor 291 is connected to the GND plane layer 93 ( 9), and the second wiring pattern 294b drawn out from the first pad 293a is electrically connected to the GND terminal 297 (ground terminal or ground terminal) of the LED driver 296. . Further, the third wiring pattern 294c drawn out from the second pad 293b (or second pad) corresponding to the second electrode 291b of the bypass capacitor 291 is connected to the power plane layer through the via hole 298 provided in the first decorative board 56. 94 (FIG. 9), and a fourth wiring pattern 294d drawn out from the second pad 293b is electrically connected to a power terminal 299 of the LED driver 296. In this way, the first pad 293a is arranged between the GND terminal 297 of the LED driver 296 and the GND plane layer 93, and the second pad 293b is arranged between the power terminal 299 of the LED driver 296 and the power plane layer 94. placed in between.

The bypass capacitor 291 is mounted on the first decorative substrate 56 such that the longitudinal direction of the bypass capacitor 291 is perpendicular or substantially perpendicular to the first direction DR1. The first wiring pattern 294a is drawn upward from the upper end of the first pad 293a, and the second wiring pattern 294b is drawn downward from the lower end of the first pad 293a. Further, the third wiring pattern 294c is drawn upward from the upper end of the second pad 293b, and the fourth wiring pattern 294d is drawn downward from the lower end of the second pad 293b.

In this way, the wiring patterns 294a to 294d drawn out from the pair of pads 293a and 293b corresponding to the pair of electrodes 291a and 291b of the bypass capacitor 291 are arranged in a direction perpendicular or substantially perpendicular to the longitudinal direction of the bypass capacitor 291. It extends to Therefore, compared to a configuration in which the wiring patterns 294a to 294d drawn out from the pair of pads 293a and 293b extend in a direction parallel to the longitudinal direction of the bypass capacitor 291, distortion occurs in the first decorative board 56. In this case, it is possible to reduce the stress that may act on the connection portion between the bypass capacitor 291 and the first decorative board 56, and also reduce the stress that may act on the bypass capacitor 291 itself. For example, when dividing the collective board 231, it is possible to reduce the stress that may act on the connection between the bypass capacitor 291 and the first decorative board 56, and also reduce the stress that may act on the bypass capacitor 291 itself. can.

According to this embodiment described in detail above, the following excellent effects are achieved.

The dimension of the first decorative substrate 56 in the first direction DR1 is larger than the dimension of the first decorative substrate 56 in the direction perpendicular to the first direction DR1. In the configuration in which the longitudinal direction of the bypass capacitor 291 is orthogonal to the first direction DR1, the wiring patterns 294a to 294d drawn out from the pair of pads 293a and 293b corresponding to the pair of electrodes 291a and 291b of the bypass capacitor 291 are as follows. The bypass capacitor 291 extends in a direction perpendicular or substantially perpendicular to the longitudinal direction of the bypass capacitor 291 . Therefore, compared to a configuration in which the wiring patterns 294a to 294d drawn out from the pair of pads 293a and 293b extend in a direction parallel to the longitudinal direction of the bypass capacitor 291, distortion occurs in the first decorative board 56. In this case, it is possible to reduce the stress that may act on the connection portion between the bypass capacitor 291 and the first decorative board 56, and also reduce the stress that may act on the bypass capacitor 291 itself.

<Third embodiment>
This embodiment differs from the first embodiment in that it includes a light emitting board on which both board surfaces are mounted with LED chips. Hereinafter, configurations that are different from the first embodiment will be described. Note that descriptions of the same configurations as in the first embodiment will be basically omitted.

A movable object (not shown) is provided on the right side of the symbol display device 41 on the front side of the game board 24 (FIG. 4). The movable object is placed in an area where the game ball does not flow down. The movable part includes a light emitting board 301 (FIG. 26) on which LED chips are mounted on both board surfaces, and a board case (not shown) that accommodates the light emitting board 301.

FIG. 26 is a plan view of the first light emitting surface 302 of the light emitting substrate 301 in this embodiment, and FIG. 27 is a plan view of the second light emitting surface 303 of the light emitting substrate 301. In FIG. 26, the wiring pattern formed on the first light emitting surface 302 is not shown, and in FIG. 27, the wiring pattern formed on the second light emitting surface 303 is not shown. As shown in FIG. 26, the light emitting substrate 301 is formed into a vertically elongated substantially elliptical shape. The light emitting substrate 301 is a four-layer substrate having a structure in which conductive layers and insulating layers are alternately stacked, similar to the first decorative substrate 56 in the first embodiment. Although not shown, the light emitting board 301 includes a first wiring layer disposed on the first light emitting surface 302 side and a second light emitting surface 303 side, similar to the first decorative board 56 in the first embodiment. and a second wiring layer disposed in the second wiring layer. In addition, the light emitting board 301 includes a GND plane layer (ground plane layer) as a conductive layer disposed between the first wiring layer and the second wiring layer, similar to the first decorative board 56 in the first embodiment. or a ground plane layer) and a power plane layer.

As shown in FIG. 26, LED chips 304 to 313 and a first LED driver 314 that controls light emission of these LED chips 304 to 313 are mounted on the first light emitting surface 302 of the light emitting board 301. Further, as shown in FIG. 27, LED chips 315 to 325 and a second LED driver 326 that controls light emission of these LED chips 315 to 325 are mounted on the second light emitting surface 303 of the light emitting board 301. As shown in FIG. 26, the LED chips 304 to 313 are arranged near the center of the first light emitting surface 302, and as shown in FIG. located in the area.

As shown in FIG. 27, a connector 327 for receiving lighting control data from the audio light emission control device 81 (FIG. 19) is mounted on the second light emitting surface 303 of the light emitting board 301. A harness (not shown) that electrically connects the light emitting board 301 and the audio light emitting control device 81 is attached to the connector 327 . The first LED driver 314 controls the light emission of the LED chips 304 to 313 mounted on the first light emitting surface 302 based on the lighting control data received from the sound light emission control device 81, and the second LED driver 326 controls the sound light emission. Based on the lighting control data received from the control device 81, the light emission of the LED chips 315 to 325 mounted on the second light emitting surface 303 is controlled.

The substrate case (not shown) is made of transparent or semi-transparent resin that transmits light emitted from the LED chips 304 to 313 and 315 to 325. The board case is pivotally supported on the front side of the game board 24, and is rotatable about a shaft extending in the vertical direction. In a gaming state other than the opening/closing execution mode, the first light emitting surface 302 of the light emitting board 301 faces the front of the pachinko machine 10. In the gaming state, the LED chips 304 to 313 mounted on the first light emitting surface 302 are controlled to emit light, so that a region near the center of the first light emitting surface 302 emits light. When the gaming state shifts to the opening/closing execution mode, the movable object (not shown) rotates 180 degrees around the axis so that the second light emitting surface 303 of the light emitting board 301 faces the front of the pachinko machine 10. In the opening/closing execution mode, the LED chips 315 to 325 mounted on the second light emitting surface 303 are controlled to emit light, so that a region near the outer edge of the second light emitting surface 303 emits light. When the opening/closing execution mode ends, the movable part rotates 180 degrees about the axis in the opposite direction from the start of the opening/closing execution mode so that the first light emitting surface 302 faces the front of the pachinko machine 10. In the opening/closing execution mode, the movable object is configured to perform a light emitting performance that is different from the game states other than the opening/closing execution mode, thereby improving the interest of the performance during the opening/closing execution mode.

As shown in FIG. 26, a bypass capacitor 328 and small chip resistors 331 to 335 are mounted on the first light emitting surface 302 of the light emitting board 301. Like the bypass capacitor 85 in the first embodiment, the bypass capacitor 328 has a substantially rectangular parallelepiped shape. The bypass capacitor 328, like the bypass capacitor 85 in the first embodiment, extends in a longitudinal direction along a plane perpendicular to the thickness direction of the bypass capacitor 328 (hereinafter also referred to as "longitudinal direction of the bypass capacitor 328"). It is a small chip component whose dimensions are 0.1 mm or more and 0.9 mm or less. The bypass capacitor 328 has a longitudinal dimension of approximately 0.6 mm along a plane perpendicular to the thickness direction, and a transverse direction (hereinafter also referred to as "transverse direction") along a plane perpendicular to the thickness direction. ) and the dimension in the thickness direction are approximately 0.3 mm. By setting the longitudinal dimension of the bypass capacitor 328 to 0.7 mm or less, the area occupied by the bypass capacitor 328 on the light emitting substrate 301 can be further reduced. Since the lengthwise dimension of the bypass capacitor 328 is 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 328 and the light emitting board 301 and the mechanical strength of the bypass capacitor 328 itself are increased, and the connection point is prevented from being damaged. It is possible to reduce the possibility that the bypass capacitor 328 itself is damaged. Further, since the lengthwise dimension of the bypass capacitor 328 is 0.4 mm or more, it is possible to improve the accuracy of visually confirming whether or not the bypass capacitor 328 is missing in mounting. Note that the lengthwise dimension of the bypass capacitor 328 may be smaller than 0.6 mm (for example, 0.4 mm), and the bypass capacitor 328 may have a shorter length smaller than 0.3 mm. (for example, a configuration in which the thickness is 0.2 mm), or a configuration in which the dimension in the thickness direction is smaller than 0.3 mm (for example, a configuration in which the thickness is 0.2 mm) may be used.

Similar to the small chip resistor 87 in the first embodiment, the small chip resistors 331 to 335 are substantially rectangular parallelepipeds. Similar to the small chip resistor 87 in the first embodiment, the small chip resistors 331 to 335 are arranged in a longitudinal direction (hereinafter referred to as "small chip resistor") along a plane orthogonal to the thickness direction of the small chip resistors 331 to 335. The chip resistors 331 to 335 are small chip components whose dimensions (also referred to as "longitudinal direction of the chip resistors 331 to 335") are 0.1 mm or more and 0.9 mm or less. The small chip resistors 331 to 335 have a longitudinal dimension of approximately 0.6 mm along a plane perpendicular to the thickness direction, and a width direction of the small chip resistors 331 to 335 (hereinafter referred to as the "short direction"). It is a small chip component with dimensions of approximately 0.3 mm in the thickness direction. Since the longitudinal dimension of the small chip resistors 331 to 335 is 0.7 mm or less, the area occupied by the small chip resistors 331 to 335 on the light emitting substrate 301 can be further reduced. Since the longitudinal dimension of the small chip resistors 331 to 335 is 0.4 mm or more, the mechanical strength at the connection point between the small chip resistors 331 to 335 and the light emitting board 301 and the small chip resistors 331 to 335 themselves are improved. The mechanical strength of the small chip resistors 331 to 335 can be increased, and the possibility of damage to the connection points can be reduced, and the possibility of damage to the small chip resistors 331 to 335 themselves can be reduced. Furthermore, since the longitudinal dimension of the small chip resistors 331 to 335 is 0.4 mm or more, it is possible to increase the accuracy of confirmation when visually confirming whether or not the small chip resistors 331 to 335 have been left unmounted. . Note that the longitudinal dimension of the small chip resistors 331 to 335 may be smaller than 0.6 mm (for example, 0.4 mm), and the longitudinal dimension of the small chip resistors 331 to 335 may be smaller than 0.6 mm. may be smaller than 0.3 mm (for example, 0.2 mm), or the dimension in the thickness direction may be smaller than 0.3 mm (for example, 0.2 mm). .

In the light emitting board 301, small chip components (bypass capacitor 328 and small chip resistors 331 to 335) are concentrated on the first light emitting surface 302 side and are not mounted on the second light emitting surface 303 side. Therefore, by handling the light emitting board 301 so that the stress acting on the first light emitting surface 302 side of the light emitting board 301 is smaller than the stress acting on the second light emitting surface 303 side, small chip components and the light emitting board 301 can be separated. It is possible to reduce the possibility that the connection points of the small chip components themselves are damaged, and also to reduce the possibility that the small chip components themselves are damaged. For example, when dividing a collective substrate (not shown) including a plurality of light-emitting substrates 301 and taking out the light-emitting substrates 301, it is possible to reduce the size by dividing the collective substrate in such a manner that the first light-emitting surface 302 side has a valley shape (concave). It is possible to prevent tensile stress from acting on the connection portion between the chip component and the light emitting board 301. As a result, it is possible to prevent the connection between the small chip component and the light emitting board 301 from being damaged, and also to prevent the small chip component itself from being damaged.

As shown in FIG. 27, chip resistors 336 to 346 are mounted on the second light emitting surface 303 of the light emitting board 301 to limit the current flowing to the LED chips 315 to 325. By providing the chip resistors 336 to 346, the LED chips 315 to 325 can be driven with less than the allowable current. The chip resistors 336 to 346 are substantially rectangular parallelepipeds, and each has a pair of metal first and second electrodes (not shown) at both ends in the longitudinal direction. The chip resistors 336 to 346 are surface-mounted resistors having a longitudinal dimension of 1 mm, and a transverse dimension and a thickness direction of 0.5 mm. The longitudinal dimension of the chip resistors 336 to 346 along a plane perpendicular to the thickness direction (1 mm, which is the longitudinal dimension of the chip resistors 336 to 346) is larger than 0.9 mm, and the chip resistors 336 to 346 is not a small chip component. Note that the longitudinal dimension of the chip resistors 336 to 346 may be larger than 1 mm (for example, 1.6 mm), and the transverse dimension may be larger than 0.5 mm (for example, 0.8 mm). The dimension in the thickness direction may be larger than 0.5 mm (for example, 0.8 mm).

The driving power for the second LED driver 326 is supplied from the audio/emission control device 81 to the power terminal 348 of the second LED driver 326 via the connector 327 . A bypass capacitor 352 is mounted on the second light emitting surface 303 of the light emitting board 301 to absorb noise components contained in the drive power source of the second LED driver 326. The bypass capacitor 352 has a substantially rectangular parallelepiped shape, and includes a pair of metal first electrodes 352a and second electrodes 352b at both ends in the longitudinal direction. The bypass capacitor 352 is a surface-mounted capacitor having a longitudinal dimension of 1 mm, and a transversal dimension and a thickness direction of 0.5 mm. The longitudinal dimension of the bypass capacitor 352 along a plane perpendicular to the thickness direction (1 mm, which is the longitudinal dimension of the bypass capacitor 352) is larger than 0.9 mm, and the bypass capacitor 352 is not a small chip component. Note that the lengthwise dimension of the bypass capacitor 352 may be larger than 1 mm (for example, 1.6 mm), and the widthwise dimension may be larger than 0.5 mm (for example, 0.8 mm). The dimension in the thickness direction may be larger than 0.5 mm (for example, 0.8 mm).

The first electrode 352a of the bypass capacitor 352 is electrically connected to the GND terminal 349 of the second LED driver 326 and a GND plane layer (not shown), and the second electrode 352b is connected to the power terminal 348 of the second LED driver 326 and the power source. It is electrically connected to a plane layer (not shown). By disposing the bypass capacitor 352 between the power supply terminal 348 and the power plane layer, noise components contained in the drive power supplied from the audio emission control device 81 to the second LED driver 326 are removed from the second LED driver 326. impact has been reduced.

The chip resistor 340 on the second light emitting surface 303 of the light emitting substrate 301 is arranged in an area including the driver backside corresponding region 353 on the first light emitting surface 302 . The driver back side corresponding area 353 is provided with pads (or pads) corresponding to the area where the first LED driver 314 (FIG. 26) is mounted and the terminals of the first LED driver 314 on the first light emitting surface 302 (FIG. 26). A region of the second light emitting surface 303 located on the back side of the region where the light emitting device is located, and a region within 1 mm from the region of the second light emitting surface 303. As already explained, the chip resistor 340 is not a small chip component. The connection point between the chip resistor 340 and the light emitting board 301 has higher mechanical strength than the connection point between the small chip component and the light emitting board 301. Furthermore, the chip resistor 340 itself has higher mechanical strength than the small chip component itself. By arranging the chip resistor 340 in a region including the driver backside corresponding region 353 on the second light emitting surface 303, the LED chip 319 can be arranged near the driver backside corresponding region 353. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) on the first light emitting surface 302 of the light emitting board 301 are arranged avoiding the driver backside corresponding region 354. The driver back side corresponding area 354 is provided with pads (or pads) corresponding to the area where the second LED driver 326 (FIG. 27) is mounted and the terminals of the second LED driver 326 on the second light emitting surface 303 (FIG. 27). These are the area of the first light emitting surface 302 located on the back side of the area where the light emitting device is located, and the area within 1 mm from the area of the first light emitting surface 302. A small chip component is located in a region of the first light emitting surface 302 located on the back side of the region on the second light emitting surface 303 where the second LED driver 326 is mounted and the region where pads corresponding to the terminals of the second LED driver 326 are provided. Due to the unmounted configuration, the influence of thermal stress that may be exerted on the light emitting board 301 due to heat generation of the second LED driver 326 on the small chip components is reduced. By arranging the small chip components so as to avoid the area 354 corresponding to the back side of the driver, it is possible to prevent the connection between the small chip components and the light emitting board 301 from being damaged due to the influence of thermal stress caused by the heat generated by the second LED driver 326. It is possible to prevent damage to the small chip component itself.

As shown in FIG. 27, the chip resistor 343 on the second light emitting surface 303 of the light emitting substrate 301 is arranged in a region of the first light emitting surface 302 that includes the LED back side corresponding region 355. The LED back side corresponding area 355 is the area of the second light emitting surface 303 located on the back side of the area where the LED chips 310, 311 (FIG. 26) are mounted on the first light emitting surface 302 (FIG. 26) and the second light emitting surface. The distance from the outer edge of the area 303 is within 1 mm. By arranging the chip resistor 343 in a region including the LED backside corresponding region 355 on the second light emitting surface 303, the LED chip 322 can be arranged near the LED backside corresponding region 355. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) on the first light emitting surface 302 of the light emitting board 301 are arranged avoiding the LED back side corresponding areas 361 to 371. There is. The LED backside corresponding regions 361 to 371 are the regions of the first light emitting surface 302 located on the back side of the regions where the LED chips 315 to 325 (FIG. 27) are mounted on the second light emitting surface 303 (FIG. 27), and the corresponding first regions. This is an area within a distance of 1 mm from the outer edge of the area of the light emitting surface 302. Due to the configuration in which no small chip components are mounted in the region of the first light emitting surface 302 located on the back side of the region in which the LED chips 315 to 325 are mounted on the second light emitting surface 303, the LED chips 315 to 325 are mounted. The influence of thermal stress that may act on the light emitting substrate 301 due to heat generation on the small chip components is reduced. Because the small chip components are arranged avoiding the LED back side corresponding areas 361 to 371, the connection points between the small chip components and the light emitting board 301 are damaged due to the influence of thermal stress caused by the heat generated by the LED chips 315 to 325. This can prevent damage to the small chip component itself.

As shown in FIG. 26, an LED chip 310 is mounted near the center of the first light emitting surface 302 of the light emitting board 301. The longitudinal dimension of the LED chip 310 along the plane perpendicular to the thickness direction is larger than 0.9 mm, and the LED chip 310 is not a small chip component. As shown in FIG. 26, the LED chip 310 is mounted on the first light emitting surface 302 in an area including the LED back side corresponding area 368. The LED chip 310 has a region of the first light emitting surface 302 located on the back side of the region where the LED chip 322 (FIG. 27) is mounted on the second light emitting surface 303 (FIG. 27) in the LED back side corresponding region 368. Implemented in the containing area. A part of the electronic component (LED chip 310) which is not a small chip component is mounted on the first light emitting surface 302 of the light emitting board 301, and an LED chip 322 (FIG. 27) is mounted on the second light emitting surface 303 (FIG. 27). By being mounted in an area including the area of the first light emitting surface 302 located on the back side of the area, a large area is secured on the first light emitting surface 302 in which electronic components other than small chip components can be mounted. .

A part of the electronic component (LED chip 310) that is not a small chip component is located on the first light emitting surface 302 on the back side of the area where the LED chip 322 (FIG. 27) is mounted on the second light emitting surface 303 (FIG. 27). In the light emitting board 301 mounted in the area including the area, the small chip components are arranged avoiding the areas 361 to 371 corresponding to the back side of the LED. This reduces the possibility that the connection portion between the small chip component and the light emitting substrate 301 and the small chip component itself will be damaged due to the influence of thermal stress.

As shown in FIG. 27, the chip resistor 341 on the second light emitting surface 303 of the light emitting board 301 is arranged in an area including the connector peripheral area 372. The connector peripheral area 372 is an area less than 5 mm from the outer edge of the connector 327. By arranging the chip resistor 341 in a region including the connector peripheral region 372 on the second light emitting surface 303, the LED chips 315 to 325 can be placed on the light emitting board 301, compared to the case where the chip resistor 341 is arranged avoiding the connector peripheral region 372. can be widely dispersed, and the light emitting area of the second light emitting surface 303 can be expanded. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) on the first light emitting surface 302 of the light emitting board 301 are arranged avoiding the connector back side corresponding area 373. The connector back side corresponding area 373 is a region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted on the second light emitting surface 303 (FIG. 27) and a region from the outer edge of the region of the first light emitting surface 302. This is a region where the distance is less than 5 mm. Due to the structure in which no small chip components are mounted in the region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted on the second light emitting surface 303, light is emitted when the harness is attached to and detached from the connector 327. The influence of stress that may act on the substrate 301 on small chip components is reduced. By arranging the small chip component so as to avoid the connector backside corresponding area 373, stress that may be applied to the connection point between the small chip component and the light emitting board 301 is reduced when a harness (not shown) is attached to and removed from the connector 327. At the same time, the stress acting on the small chip component itself can be reduced. Therefore, when the harness is attached to and removed from the connector 327, it is possible to prevent the connecting portion between the small chip component and the light emitting board 301 from being damaged, and it is also possible to prevent the small chip component itself from being damaged.

As shown in FIG. 27, the chip resistor 336 on the second light emitting surface 303 of the light emitting substrate 301 is arranged in a region including the substrate outer edge region 374 on the second light emitting surface 303 side. The substrate outer edge region 374 on the second light emitting surface 303 side is an area less than 10 mm from the outer edge of the light emitting substrate 301 on the second light emitting surface 303 . By arranging the chip resistor 336 in a region including the substrate outer edge region 374 on the second light emitting surface 303, compared to the case where the chip resistor 336 is arranged avoiding the substrate outer edge region 374, the LED chips 315 to 325 can be placed on the light emitting substrate 301. can be widely dispersed. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) on the first light emitting surface 302 of the light emitting substrate 301 avoid the substrate outer edge region 375 on the first light emitting surface 302 side. It is arranged as follows. The substrate outer edge region 375 on the first light emitting surface 302 side is an area less than 10 mm from the outer edge of the light emitting substrate 301 on the first light emitting surface 302 . By arranging the small chip components on the first light emitting surface 302 while avoiding the outer edge area 375 of the substrate, it is possible to prevent the small chip components from touching the small chip components when handling the light emitting board 301. It is possible to prevent the connecting portion between the light emitting board 301 and the light emitting board 301 from being damaged, and also to prevent the small chip component itself from being damaged. Furthermore, when dividing a collective board including a plurality of light-emitting boards 301 to take out the light-emitting boards 301, it is possible to reduce stress that may be applied to the connection points between small chip components and the light-emitting boards 301 when dividing the collective board. At the same time, stress acting on the small chip component itself can be reduced. Therefore, it is possible to prevent the connection points between the small chip components and the light emitting substrate 301 from being damaged when the collective board is divided, and it is also possible to prevent the small chip components themselves from being damaged.

As shown in FIGS. 26 and 27, the light emitting board 301 has a fixing through hole 301a that penetrates the light emitting board 301 in the thickness direction and allows the light emitting board 301 to be fixed to a board case body (not shown) with screws. , 301b are formed. As shown in FIG. 27, the chip resistor 346 on the second light emitting surface 303 of the light emitting substrate 301 is arranged in a region including the fixed through hole peripheral region 376. The fixed through hole peripheral region 376 is an area less than 5 mm from the outer edge of the fixed through hole 301b. By arranging the chip resistor 346 in a region including the fixed through hole peripheral region 376 on the second light emitting surface 303, compared to the case where the chip resistor 346 is arranged avoiding the fixed through hole peripheral region 376, the LED Chips 315-325 can be widely distributed. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) on the first light emitting surface 302 of the light emitting board 301 are arranged avoiding the fixed through hole peripheral areas 377 and 378. ing. The fixed through hole peripheral regions 377 and 378 are regions of the first light emitting surface 302 that are less than 5 mm from the outer edges of the fixed through holes 301a and 301b. By arranging the small chip components on the first light emitting surface 302 while avoiding the areas 377 and 378 surrounding the fixing through holes, when the light emitting board 301 is fixed to the board case body (not shown), the small chip components and the light emitting board It is possible to reduce stress that may act on the connection point with 301, and also reduce stress that may act on the small chip component itself. Therefore, when fixing the light emitting board 301 to the board case body, it is possible to prevent the connecting portion between the small chip component and the light emitting board 301 from being damaged, and also to prevent the small chip component itself from being damaged.

As shown in FIG. 27, the lengthwise dimension of the LED chips 317, 324 along the plane perpendicular to the thickness direction is larger than 0.9 mm, and the LED chips 317, 324 are not small chip components. Moreover, the lengthwise dimension of the chip resistors 338, 345 along the plane perpendicular to the thickness direction is larger than 0.9 mm, and the chip resistors 338, 345 are not small chip components. In the light-emitting substrate 301, the LED chips 317, 324 have a longitudinal direction along a plane perpendicular to the thickness direction of the LED chips 317, 324 parallel to a short-axis direction SDA perpendicular to the long-axis direction LDA of the light-emitting substrate 301. It is mounted on the light emitting board 301 in this manner. Furthermore, the chip resistors 338 and 345 have their longitudinal directions along a plane perpendicular to the thickness direction of the chip resistors 338 and 345 parallel to the short axis direction SDA that is perpendicular to the long axis direction LDA of the light emitting substrate 301. It is mounted on the light emitting substrate 301 in a manner similar to the above. On the other hand, as shown in FIG. 26, in the light emitting board 301, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) have longitudinal directions along a plane perpendicular to the thickness direction of the small chip components. It is mounted on the light emitting board 301 in a manner parallel to the long axis direction LDA of the light emitting board 301. As a result, when distortion occurs in the light emitting board 301, compared to the case where the small chip component is mounted on the light emitting board 301 in such a manner that the longitudinal direction is parallel to the short axis direction SDA orthogonal to the long axis direction LDA. In addition, the maximum value of the stress that can act on the connection point between the small chip component and the light emitting board 301 is reduced, and the maximum value of the stress that can act on the small chip component itself is reduced.

The mechanical strength of the connection point between the small chip component and the light emitting board 301 is lower than the mechanical strength of the connection point between the light emitting board 301 and an electronic component that is larger than the small chip component. Further, the mechanical strength of the small chip component itself is lower than the mechanical strength of the electronic component itself, which is larger than the small chip component. In a configuration in which a part of an electronic component larger than a small chip component is mounted on the light emitting board 301 in such a manner that the longitudinal direction of the electronic component is not parallel to the long axis direction LDA of the light emitting board 301, the small chip component is larger than the small chip component. The chip component is mounted on the light emitting board 301 in such a manner that the longitudinal direction of the chip component is parallel to the long axis direction LDA of the light emitting board 301. This protects the connection point between the small chip component and the light emitting board 301 and the small chip component itself.

According to this embodiment described in detail above, the following excellent effects are achieved.

In a configuration in which the chip resistor 340 is arranged in a region including the driver back side corresponding region 353 on the second light emitting surface 303 of the light emitting substrate 301, small chip components (bypass capacitor 328 and small chip resistor 331 on the first light emitting surface 302) 335) are arranged avoiding the area 354 corresponding to the back side of the driver. The driver back side corresponding region 354 is the first light emitting surface 302 located on the back side of the region where the second LED driver 326 is mounted on the second light emitting surface 303 and the region where pads corresponding to the terminals of the second LED driver 326 are provided. The distance from the area and the area of the first light emitting surface 302 is within 1 mm. A small chip component is located in a region of the first light emitting surface 302 located on the back side of the region on the second light emitting surface 303 where the second LED driver 326 is mounted and the region where pads corresponding to the terminals of the second LED driver 326 are provided. Due to the unmounted configuration, the influence of thermal stress that may be exerted on the light emitting board 301 due to heat generation of the second LED driver 326 on the small chip components is reduced. By arranging the small chip components so as to avoid the area 354 corresponding to the back side of the driver, it is possible to prevent the connection between the small chip components and the light emitting board 301 from being damaged due to the influence of thermal stress caused by the heat generated by the second LED driver 326. In addition, damage to the small chip component itself can be prevented.

In a configuration in which the chip resistor 343 on the second light emitting surface 303 of the light emitting board 301 is arranged in an area including the LED back side corresponding area 355, the small chip component on the first light emitting surface 302 of the light emitting board 301 is arranged in the LED back side corresponding area. It is arranged avoiding 361 to 371. The LED back side corresponding regions 361 to 371 are from the area of the first light emitting surface 302 located on the back side of the area where the LED chips 315 to 325 are mounted on the second light emitting surface 303 and the outer edge of the area of the first light emitting surface 302. This is an area where the distance between the two points is within 1 mm. Due to the configuration in which no small chip components are mounted in the region of the first light emitting surface 302 located on the back side of the region in which the LED chips 315 to 325 are mounted on the second light emitting surface 303, the LED chips 315 to 325 are mounted. The influence of thermal stress that may act on the light emitting substrate 301 due to heat generation on the small chip components is reduced. Because the small chip components are arranged avoiding the LED back side corresponding areas 361 to 371, the connection points between the small chip components and the light emitting board 301 are damaged due to the influence of thermal stress caused by the heat generated by the LED chips 315 to 325. This can prevent damage to the small chip component itself.

A part of the electronic component (LED chip 310) that is not a small chip component is located on the first light emitting surface 302 on the back side of the area where the LED chip 322 (FIG. 27) is mounted on the second light emitting surface 303 (FIG. 27). In the light emitting board 301 mounted in the area including the area, the small chip components are arranged avoiding the areas 361 to 371 corresponding to the back side of the LED. This reduces the possibility that the connection portion between the small chip component and the light emitting substrate 301 and the small chip component itself will be damaged due to the influence of thermal stress.

In the configuration in which the chip resistor 341 on the second light emitting surface 303 of the light emitting board 301 is arranged in the area including the connector peripheral area 372, the small chip component on the first light emitting surface 302 of the light emitting board 301 is placed in the area 373 corresponding to the back side of the connector. It is located to avoid The connector back side corresponding area 373 has a distance of less than 5 mm from the area of the first light emitting surface 302 located on the back side of the area where the connector 327 is mounted on the second light emitting surface 303 and the outer edge of the area of the first light emitting surface 302. This is the area of Due to the structure in which no small chip components are mounted in the region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted on the second light emitting surface 303, light is emitted when the harness is attached to and detached from the connector 327. The influence of stress that may act on the substrate 301 on small chip components is reduced. By arranging the small chip component so as to avoid the connector backside corresponding area 373, stress that may be applied to the connection point between the small chip component and the light emitting board 301 is reduced when a harness (not shown) is attached to and removed from the connector 327. At the same time, it is possible to reduce the stress acting on the small chip component itself. Therefore, when the harness is attached to and removed from the connector 327, it is possible to prevent the connecting portion between the small chip component and the light emitting board 301 from being damaged, and it is also possible to prevent the small chip component itself from being damaged.

In a configuration in which the chip resistor 336 on the second light emitting surface 303 of the light emitting substrate 301 is arranged in an area including the substrate outer edge region 374, the small chip component on the first light emitting surface 302 of the light emitting substrate 301 is arranged on the first light emitting surface 302. It is arranged so as to avoid the outer edge region 375 of the substrate on the side. This prevents damage to the connection between the small chip component and the light emitting board 301 due to an operator's hand touching the small chip component when handling the light emitting board 301, and also prevents damage to the small chip component itself. can be prevented from being damaged. Furthermore, when dividing a collective board including a plurality of light-emitting boards 301 to take out the light-emitting boards 301, it is possible to reduce stress that may be applied to the connection points between small chip components and the light-emitting boards 301 when dividing the collective board. At the same time, stress acting on the small chip component itself can be reduced. Therefore, it is possible to prevent the connection points between the small chip components and the light emitting substrate 301 from being damaged when the collective board is divided, and it is also possible to prevent the small chip components themselves from being damaged.

In a configuration in which the chip resistor 346 on the second light emitting surface 303 of the light emitting board 301 is arranged in a region including the fixed through hole peripheral region 376, the small chip component on the first light emitting surface 302 of the light emitting board 301 is arranged in the fixed through hole. It is arranged avoiding the peripheral areas 377 and 378. As a result, when fixing the light emitting board 301 to the board case body, it is possible to reduce the stress that may act on the connection point between the small chip component and the light emitting board 301, and also reduce the stress that acts on the small chip component itself. can do. Therefore, when fixing the light emitting board 301 to the board case body, it is possible to prevent the connecting portion between the small chip component and the light emitting board 301 from being damaged, and also to prevent the small chip component itself from being damaged.

In a configuration in which some of the electronic components larger than the small chip components are mounted on the light emitting board 301 in such a manner that the longitudinal direction of the electronic components is not parallel to the long axis direction LDA of the light emitting board 301, the small chip components (bypass capacitors) 328 and the small chip resistors 331 to 335) are mounted on the light emitting board 301 in such a manner that the longitudinal direction along the plane perpendicular to the thickness direction of the small chip component is parallel to the longitudinal direction LDA of the light emitting board 301. ing. As a result, when distortion occurs in the light emitting board 301, compared to the case where the small chip component is mounted on the light emitting board 301 in such a manner that the longitudinal direction is parallel to the short axis direction SDA orthogonal to the long axis direction LDA. In addition, the maximum value of the stress that can act on the connection point between the small chip component and the light emitting board 301 is reduced, and the maximum value of the stress that can act on the small chip component itself is reduced.

Note that on the first light emitting surface 302 of the light emitting board 301, a region 354 corresponding to the back side of the driver where small chip components (bypass capacitor 328 and small chip resistors 331 to 335) are not mounted is a region 354 corresponding to the back side of the driver where small chip components (bypass capacitor 328 and small chip resistors 331 to 335) are not mounted. The area of the first light emitting surface 302 located on the back side of the area where the 2 LED driver 326 (FIG. 27) is mounted and the area where the pad corresponding to the terminal of the second LED driver 326 is provided, and the area of the first light emitting surface 302 The distance from the area is not limited to an area within 1 mm. The driver back side corresponding region 354 is defined as the first light emitting surface 302 located on the back side of the region where the second LED driver 326 is mounted on the second light emitting surface 303 and the region where pads corresponding to the terminals of the second LED driver 326 are provided. The distance from the area and the area of the first light emitting surface 302 may be within 2 mm. Thereby, it is possible to further reduce the influence of thermal stress that may be exerted on the light emitting board 301 due to the heat generated by the second LED driver 326 on the small chip components. Therefore, it is possible to reduce the possibility that the connection point between the small chip component and the light emitting board 301 will be damaged due to the influence of thermal stress caused by the heat generated by the second LED driver 326, and the possibility that the small chip component itself will be damaged. can be reduced. In addition, the driver back side corresponding area 354 is defined as the first light emitting area located on the back side of the area where the second LED driver 326 is mounted on the second light emitting surface 303 and the area where pads corresponding to the terminals of the second LED driver 326 are provided. The distance from the area of the surface 302 and the area of the first light emitting surface 302 may be within 0.5 mm. This reduces the influence of thermal stress that may act on the light emitting board 301 due to heat generated by the second LED driver 326 on the small chip parts, while reducing the area on the first light emitting surface 302 of the light emitting board 301 where the small chip parts can be mounted. A large area can be secured.

- The LED backside corresponding areas 361 to 371 where small chip components (bypass capacitor 328 and small chip resistors 331 to 335) are not mounted on the first light emitting surface 302 of the light emitting board 301 are covered by LEDs on the second light emitting surface 303 (FIG. 27). Limited to the area of the first light emitting surface 302 located on the back side of the area where the chips 315 to 325 (FIG. 27) are mounted and the area within 1 mm from the outer edge of the area of the first light emitting surface 302. There isn't. The LED backside corresponding regions 361 to 371 are defined from the region of the first light emitting surface 302 located on the back side of the region where the LED chips 315 to 325 are mounted on the second light emitting surface 303 and the outer edge of the region of the first light emitting surface 302. The distance may be within 2 mm. This makes it possible to further reduce the influence of thermal stress on the small chip components that may be exerted on the light emitting substrate 301 due to the heat generated by the LED chips 315 to 325. Therefore, it is possible to reduce the possibility that the connection point between the small chip component and the light emitting board 301 will be damaged due to the influence of thermal stress due to the heat generated by the LED chips 315 to 325, and the possibility that the small chip component itself will be damaged. It is possible to reduce the In addition, the LED back side corresponding areas 361 to 371 are defined as the area of the first light emitting surface 302 located on the back side of the area where the LED chips 315 to 325 are mounted on the second light emitting surface 303, and the area of the first light emitting surface 302. The distance from the outer edge may be within 0.5 mm. This makes it possible to mount small chip components on the first light emitting surface 302 of the light emitting board 301 while reducing the influence of thermal stress that may act on the light emitting board 301 due to heat generated by the LED chips 315 to 325 on the small chip components. A wide area can be secured.

- Connector back side corresponding area 373 where small chip components (bypass capacitor 328 and small chip resistors 331 to 335) are not mounted on the first light emitting surface 302 of the light emitting board 301 is where the connector 327 is mounted on the second light emitting surface 303 (FIG. 27). It is not limited to the area of the first light emitting surface 302 located on the back side of the area where the light emitting surface is located, and the area where the distance from the outer edge of the area of the first light emitting surface 302 is less than 5 mm. The distance of the connector back side corresponding area 373 from the area of the first light emitting surface 302 located on the back side of the area where the connector 327 is mounted on the second light emitting surface 303 and the outer edge of the area of the first light emitting surface 302 is less than 7 mm. It may also be the area of Thereby, it is possible to reduce the stress that may act on the connection portion between the small chip component and the light emitting board 301 when attaching and detaching the harness to the connector 327, and it is also possible to reduce the stress that acts on the small chip component itself. Therefore, when attaching and detaching the harness to the connector 327, it is possible to reduce the possibility that the connection between the small chip component and the light emitting board 301 will be damaged, and it is also possible to reduce the possibility that the small chip component itself will be damaged. Furthermore, the distance of the connector back side corresponding area 373 from the area of the first light emitting surface 302 located on the back side of the area where the connector 327 is mounted on the second light emitting surface 303 and the outer edge of the area of the first light emitting surface 302 is The area may be less than 4 mm. This allows the small chip component to be attached to the first light emitting surface 302 of the light emitting board 301 while reducing the stress acting on the connection point between the small chip component and the light emitting board 301 and the small chip component itself when attaching and detaching the harness to the connector 327. It is possible to secure a wide mounting area.

- Fixed through hole peripheral areas 377, 378 where small chip components (bypass capacitor 328 and small chip resistors 331 to 335) are not mounted on the first light emitting surface 302 of the light emitting board 301 are fixed through holes 301a on the first light emitting surface 302. , 301b is not limited to an area less than 5 mm from the outer edge. The fixed through-hole peripheral regions 377 and 378 may be areas less than 7 mm from the outer edges of the fixed through-holes 301a and 301b on the first light emitting surface 302. As a result, when fixing the light emitting board 301 to the board case body (not shown), it is possible to reduce stress that may act on the connection points between the small chip components and the light emitting board 301, and also to reduce stress that may be applied to the small chip components themselves. It is possible to reduce the stress caused by Therefore, when fixing the light emitting board 301 to the board case body, it is possible to reduce the possibility that the connection between the small chip component and the light emitting board 301 is damaged, and the possibility that the small chip component itself is damaged is reduced. can do. Furthermore, the fixed through hole peripheral regions 377 and 378 may be a region of the first light emitting surface 302 that is less than 4 mm from the outer edge of the fixed through holes 301a and 301b. As a result, when fixing the light emitting board 301 to a board case body (not shown), stress acting on the connection points between the small chip component and the light emitting board 301 and the small chip component itself can be reduced, while the stress acting on the small chip component itself can be reduced. It is possible to secure a large area on one light emitting surface 302 in which a small chip component can be mounted.

- The substrate outer edge region 375 on the first light emitting surface 302 side where small chip components (bypass capacitor 328 and small chip resistors 331 to 335) are not mounted on the first light emitting surface 302 of the light emitting board 301 emits light on the first light emitting surface 302. The area is not limited to less than 10 mm from the outer edge of the substrate 301. The substrate outer edge region 375 on the first light emitting surface 302 side may be a region less than 12 mm from the outer edge of the light emitting substrate 301 on the first light emitting surface 302 . This reduces the possibility that the connection between the small chip component and the light emitting board 301 will be damaged due to the worker's hand touching the small chip component when handling the light emitting board 301. , it is possible to reduce the possibility that the small chip component itself is damaged. Furthermore, when dividing a collective board including a plurality of light-emitting boards 301 to take out the light-emitting boards 301, it is possible to reduce stress that may be applied to the connection points between small chip components and the light-emitting boards 301 when dividing the collective board. At the same time, stress acting on the small chip component itself can be reduced. Further, the substrate outer edge region 375 on the first light emitting surface 302 side may be a region less than 8 mm from the outer edge of the light emitting substrate 301 on the first light emitting surface 302. This makes it possible to mount small chip components on the first light emitting surface 302 of the light emitting board 301 while reducing the possibility that the connection between the small chip components and the light emitting board 301 will be damaged and the possibility that the small chip components themselves will be damaged. A large area can be secured.

<Fourth embodiment>
In this embodiment, a bypass capacitor is mounted on the first light emitting surface 302 side to absorb noise components included in the drive power supply of the second LED driver 326 mounted on the second light emitting surface 303 side of the light emitting board 301. This embodiment is different from the third embodiment described above in that the third embodiment is Hereinafter, configurations that are different from the third embodiment described above will be explained. Note that descriptions of the same configurations as in the third embodiment will be basically omitted.

FIG. 28(a) is a plan view of the first light emitting surface 302 of the light emitting substrate 301 in this embodiment. As shown in FIG. 28(a), on the first light emitting surface 302 side of the light emitting board 301, there is a second LED driver 326 (FIG. 29(a)) mounted on the second light emitting surface 303 side (FIG. 29(a)). )) A bypass capacitor 381 is mounted to absorb noise components contained in the drive power source. FIG. 28(b) is a plan view of the first light emitting surface 302 of the light emitting substrate 301 showing an enlarged view of the peripheral region 388 of the bypass capacitor 381.

Similar to the bypass capacitor 85 in the first embodiment, the bypass capacitor 381 has a substantially rectangular parallelepiped shape, as shown in FIG. 28(b), and has a pair of metal first electrodes 381a and A second electrode 381b is provided. The bypass capacitor 381, like the bypass capacitor 85 in the first embodiment, extends in a longitudinal direction along a plane perpendicular to the thickness direction of the bypass capacitor 381 (hereinafter also referred to as "the longitudinal direction of the bypass capacitor 381"). It is a small chip component whose dimensions are 0.1 mm or more and 0.9 mm or less. The bypass capacitor 381 has a longitudinal dimension of approximately 0.6 mm along a plane perpendicular to the thickness direction, and a width direction (hereinafter also referred to as "short direction") along a plane perpendicular to the thickness direction. ) and the dimension in the thickness direction are approximately 0.3 mm. By setting the longitudinal dimension of the bypass capacitor 381 to 0.7 mm or less, the area occupied by the bypass capacitor 381 on the light emitting substrate 301 can be further reduced. Since the lengthwise dimension of the bypass capacitor 381 is 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 381 and the light emitting board 301 and the mechanical strength of the bypass capacitor 381 itself are increased, and the connection point is prevented from being damaged. It is possible to reduce the possibility that the bypass capacitor 381 itself is damaged. Furthermore, the accuracy of confirmation when visually confirming whether the bypass capacitor 381 has not been mounted can be improved. Note that the lengthwise dimension of the bypass capacitor 381 may be smaller than 0.6 mm (eg, 0.4 mm), and the bypass capacitor 381 may have a shorter length smaller than 0.3 mm. (for example, a configuration in which the thickness is 0.2 mm), or a configuration in which the dimension in the thickness direction is smaller than 0.3 mm (for example, a configuration in which the thickness is 0.2 mm) may be used.

The first light-emitting surface 302 of the light-emitting substrate 301 has a metal (specifically, copper) first pad 382a (or first pad) corresponding to the first electrode 381a of the bypass capacitor 381, and a second electrode 381b. A corresponding second pad 382b (or second pad) made of metal (specifically, copper) is provided. The first pad 382a and the second pad 382b are a pair. The first electrode 381a is electrically connected to the first pad 382a, and the second electrode 381b is electrically connected to the second pad 382b.

FIG. 29A is a plan view of the second light emitting surface 303 of the light emitting substrate 301. As already explained in the third embodiment, the second LED driver 326 includes a power terminal 348 and a GND terminal 349. FIG. 29(b) is a plan view of the second light emitting surface 303 of the light emitting substrate 301 showing an enlarged view of the peripheral region 389 of the power supply terminal 348 and the GND terminal 349. As shown in FIGS. 28(b) and 29(b), the light emitting board 301 includes a first pad 382a (FIG. 28(b)) corresponding to the first electrode 381a of the bypass capacitor 381 and a second pad 382a (FIG. 28(b)) corresponding to the first electrode 381a of the bypass capacitor 381. A first through hole 383 is provided to electrically connect the GND terminal 349 (FIG. 29(b)), and a second pad 382b (FIG. 28(b)) corresponding to the second electrode 381b of the bypass capacitor 381 is provided. ) and the power supply terminal 348 (FIG. 29(b)) of the second LED driver 326 are provided. These through holes 383, 384 are formed to penetrate the light emitting substrate 301 in the thickness direction, and the inner circumferences of these through holes 383, 384 are plated with metal such as copper.

As shown in FIG. 28(b), the first pad 382a and the GND via hole 385 (ground via hole or ground via hole) provided in the light emitting substrate 301 are electrically connected to the first light emitting surface 302 of the light emitting substrate 301. A first wiring pattern 386a that electrically connects the first pad 382a and the first through hole 383 is provided. A first pad 382a corresponding to a first electrode 381a of a bypass capacitor 381 is electrically connected to a GND plane layer (not shown) via a first wiring pattern 386a and a GND via hole 385, and is also connected to a second wiring pattern. 386b and the first through hole 383, it is electrically connected to the GND terminal 349 (FIG. 29(b)) of the second LED driver 326.

The first light emitting surface 302 of the light emitting board 301 is provided with a third wiring pattern 386c that electrically connects the second pad 382b and the power supply via hole 387 provided in the light emitting board 301. A fourth wiring pattern 386d is provided to electrically connect the second through hole 384 and the fourth wiring pattern 386d. A second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 is electrically connected to a power plane layer (not shown) via a third wiring pattern 386c and a power supply via hole 387, and is also connected to a fourth wiring pattern. 386d and the second through hole 384, it is electrically connected to the power supply terminal 348 (FIG. 29(b)) of the second LED driver 326.

By disposing the bypass capacitor 381 between the power supply terminal 348 of the second LED driver 326 and the power plane layer (not shown), the drive power supplied from the audio emission control device 81 to the second LED driver 326 does not include the bypass capacitor 381. The influence of the noise component on the second LED driver 326 can be reduced. The bypass capacitor 381 (FIG. 28(b)) is connected to the power supply so that no electronic components such as other ICs are present between the bypass capacitor 381 and the power terminal 348 (FIG. 29(b)) of the second LED driver 326. It is located close to the terminal 348. This increases the possibility that noise components included in the drive power supplied to the power supply terminal 348 of the second LED driver 326 will be absorbed by the bypass capacitor 381, and also increases the possibility that the second LED driver 326 absorbs the noise components. The possibility of malfunction due to influence can be reduced. Further, by absorbing the noise component generated from the second LED driver 326 into the bypass capacitor 381, it is possible to prevent the noise component from causing other electronic components such as ICs to malfunction.

In the light emitting board 301, small chip components including the bypass capacitor 381 are concentrated on the first light emitting surface 302 side (FIG. 28(a)), and mounted on the second light emitting surface 303 side (FIG. 29(a)). It has not been. Therefore, by handling the light emitting board 301 so that the stress acting on the first light emitting surface 302 side of the light emitting board 301 is smaller than the stress acting on the second light emitting surface 303 side, small chip components and the light emitting board 301 can be separated. It is possible to reduce the possibility that the connection points of the small chip components themselves are damaged, and also to reduce the possibility that the small chip components themselves are damaged. For example, when dividing a collective substrate (not shown) including a plurality of light-emitting substrates 301 and taking out the light-emitting substrates 301, it is possible to reduce the size by dividing the collective substrate in such a manner that the first light-emitting surface 302 side has a valley shape (concave). It is possible to prevent tensile stress from acting on the connection portion between the chip component and the light emitting substrate 301. As a result, it is possible to prevent the connection between the small chip component and the light emitting board 301 from being damaged, and also to prevent the small chip component itself from being damaged.

As shown in FIGS. 29(a) and 29(b), in the second light emitting surface 303 of the light emitting board 301, the first through hole 383 and the second through hole 384 are spaced approximately 0.8 mm from the outer edge of the second LED driver 326. It is located in the same position. Furthermore, as shown in FIGS. 28(a) and 28(b), the bypass capacitor 381 is connected to the first through hole 383 and the second through hole in the direction away from the second LED driver 326 (FIGS. 28(a) and 28(b)). It is mounted at a position approximately 0.8 mm away from the hole 384.

As shown in FIG. 28(a), the bypass capacitor 381 is arranged avoiding the region 391 corresponding to the back side of the driver. The driver back side corresponding area 391 is provided with pads (or pads) corresponding to the area where the second LED driver 326 (FIG. 29) is mounted and the terminals of the second LED driver 326 on the second light emitting surface 303 (FIG. 29). These are the area of the first light emitting surface 302 located on the back side of the area where the light emitting device is located, and the area within 1 mm from the area of the first light emitting surface 302. A bypass capacitor 381 is provided in a region of the first light emitting surface 302 located on the back side of a region of the second light emitting surface 303 where the second LED driver 326 is mounted and a region where pads corresponding to terminals of the second LED driver 326 are provided. Due to the unmounted configuration, the influence of thermal stress that may act on the light emitting board 301 due to heat generation of the second LED driver 326 on the bypass capacitor 381 is reduced. By arranging the bypass capacitor 381 so as to avoid the region 391 corresponding to the back side of the driver, it is possible to prevent the connection between the bypass capacitor 381 and the light emitting board 301 from being damaged due to the influence of thermal stress caused by the heat generated by the second LED driver 326. This can be prevented, and damage to the bypass capacitor 381 itself can be prevented.

As shown in FIG. 28(b), on the first light emitting surface 302 of the light emitting substrate 301, a first wiring electrically connects the first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 and the GND via hole 385. The pattern 386a is a linear wiring pattern drawn out to the left from the left end of the first pad 382a. Further, a third wiring pattern 386c that electrically connects the second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 and the power supply via hole 387 is a straight line drawn out to the left from the left end of the second pad 382b. The wiring pattern is shaped like this.

Of the four sides of the first pad 382a, the direction (left direction) in which the side where the first wiring pattern 386a is drawn out when viewed from the center of the first pad 382a is the same as that of the four sides of the second pad 382b. This is the same direction (left direction) as the side from which the third wiring pattern 386c is drawn out when viewed from the center of the second pad 382b. Therefore, it is possible to prevent a difference in temperature distribution between the pair of first pad 382a and second pad 382b in the initial heating stage of the reflow process. The direction in which the first wiring pattern 386a is drawn out from the first pad 382a is the same direction (to the left) as the direction in which the third wiring pattern 386c is drawn out from the second pad 382b. Therefore, it is possible to reduce the difference in temperature distribution that may occur between the pair of first pad 382a and second pad 382b in the initial stage of heating.

The first wiring pattern 386a and the third wiring pattern 386c are drawn out in a direction perpendicular or substantially perpendicular to the longitudinal direction of the bypass capacitor 381. Therefore, when distortion occurs in the light emitting board 301, it is possible to reduce the maximum value of stress that may act on the connection between the bypass capacitor 381 and the light emitting board 301, and to reduce the stress that may act on the bypass capacitor 381 itself. The maximum value can be reduced. Further, the first wiring pattern 386a and the third wiring pattern 386c extend linearly in the longitudinal direction of the bypass capacitor 381. Therefore, it is possible to reduce the possibility that the connecting portion between the bypass capacitor 381 and the light emitting board 301 is damaged due to the influence of distortion that may occur in the light emitting board 301, and it is also possible to reduce the possibility that the bypass capacitor 381 itself is damaged.

On the first light emitting surface 302 of the light emitting substrate 301, the second wiring pattern 386b electrically connects the first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 and the first through hole 383. This is a straight wiring pattern drawn out to the right from the right end of the . Further, a fourth wiring pattern 386d that electrically connects the second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 and the second through hole 384 is drawn out to the right from the right end of the second pad 382b. This is a straight line wiring pattern.

Among the four sides of the first pad 382a, the direction (right direction) in which the side where the second wiring pattern 386b is drawn out when viewed from the center of the first pad 382a is This is the same direction (rightward direction) as the side from which the fourth wiring pattern 386d is drawn out when viewed from the center of the second pad 382b. Therefore, it is possible to prevent a difference in temperature distribution between the pair of first pad 382a and second pad 382b in the initial heating stage of the reflow process. The direction in which the second wiring pattern 386b is drawn out from the first pad 382a (rightward direction) is the same as the direction in which the fourth wiring pattern 386d is drawn out from the second pad 382b (rightward direction). Therefore, it is possible to reduce the difference in temperature distribution that may occur between the pair of first pad 382a and second pad 382b in the initial stage of heating.

The second wiring pattern 386b and the fourth wiring pattern 386d are drawn out in a direction perpendicular or substantially perpendicular to the longitudinal direction of the bypass capacitor 381. Therefore, when distortion occurs in the light emitting board 301, it is possible to reduce the maximum value of stress that may act on the connection between the bypass capacitor 381 and the light emitting board 301, and to reduce the stress that may act on the bypass capacitor 381 itself. The maximum value can be reduced. Further, the second wiring pattern 386b and the fourth wiring pattern 386d extend linearly in the longitudinal direction of the bypass capacitor 381. Therefore, it is possible to reduce the possibility that the connecting portion between the bypass capacitor 381 and the light emitting board 301 will be damaged due to the influence of distortion that may occur in the light emitting board 301, and the possibility that the bypass capacitor 381 itself will be damaged can be reduced.

According to this embodiment described in detail above, the following excellent effects are achieved.

A bypass capacitor 381 for absorbing noise components included in the drive power supply of the second LED driver 326 mounted on the second light emitting surface 303 side of the light emitting board 301 is mounted on a board on the opposite side to the second light emitting surface 303. It is mounted on the first light emitting surface 302 side which is a surface. Bypass capacitor 381 is a small chip component. The second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 is electrically connected to the power plane layer via the third wiring pattern 386c and the power supply via hole 387, and is also connected to the fourth wiring pattern 386d and the second It is electrically connected to the power terminal 348 of the second LED driver 326 via the through hole 384 . Since the bypass capacitor 381 is arranged between the power supply terminal 348 of the second LED driver 326 and the power plane layer, noise components contained in the drive power supplied from the audio emission control device 81 to the second LED driver 326 are reduced. The influence on the second LED driver 326 can be reduced.

The bypass capacitor 381 is placed close to the power terminal 348 so that no electronic components such as other ICs are present between the bypass capacitor 381 and the power terminal 348 of the second LED driver 326 . This increases the possibility that noise components included in the drive power supplied to the power supply terminal 348 of the second LED driver 326 will be absorbed by the bypass capacitor 381, and also increases the possibility that the second LED driver 326 absorbs the noise components. The possibility of malfunction due to influence can be reduced. Further, by absorbing the noise component generated from the second LED driver 326 into the bypass capacitor 381, it is possible to prevent the noise component from causing other electronic components such as ICs to malfunction.

The first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 is electrically connected to the GND terminal 349 of the second LED driver 326 via the first through hole 383, and the second electrode 381b of the bypass capacitor 381 is electrically connected to the GND terminal 349 of the second LED driver 326. A second pad 382b corresponding to the second pad 382b is electrically connected to the power terminal 348 of the second LED driver 326 via the second through hole 384. For this reason, a bypass capacitor 381 for absorbing noise components included in the drive power supply of the second LED driver 326 mounted on the second light emitting surface 303 side is installed on the opposite side of the second light emitting surface 303. It can be placed on a certain first light emitting surface 302 side. In a configuration in which the bypass capacitor 381 is a small chip component, by arranging the bypass capacitor 381 on the first light emitting surface 302 side, the small chip components can be concentrated on the first light emitting surface 302 side in the light emitting board 301. Therefore, by handling the light emitting board 301 so that the stress acting on the first light emitting surface 302 side of the light emitting board 301 is smaller than the stress acting on the second light emitting surface 303 side, small chip components and the light emitting board 301 can be separated. It is possible to reduce the possibility that the connection points of the small chip components themselves are damaged, and also to reduce the possibility that the small chip components themselves are damaged. For example, when dividing a collective substrate (not shown) including a plurality of light-emitting substrates 301 and taking out the light-emitting substrates 301, it is possible to reduce the size by dividing the collective substrate in such a manner that the first light-emitting surface 302 side has a valley shape (concave). It is possible to prevent tensile stress from acting on the connection portion between the chip component and the light emitting substrate 301. As a result, it is possible to prevent the connection between the small chip component and the light emitting board 301 from being damaged, and also to prevent the small chip component itself from being damaged.

The bypass capacitor 381 is placed avoiding the driver back side corresponding area 391. The driver back side corresponding region 391 is the first light emitting surface 302 located on the back side of the region where the second LED driver 326 is mounted on the second light emitting surface 303 and the region where pads corresponding to the terminals of the second LED driver 326 are provided. The distance from the area and the area of the first light emitting surface 302 is within 1 mm. A bypass capacitor 381 is provided in a region of the first light emitting surface 302 located on the back side of a region of the second light emitting surface 303 where the second LED driver 326 is mounted and a region where pads corresponding to terminals of the second LED driver 326 are provided. Due to the unmounted configuration, the influence of thermal stress that may act on the light emitting board 301 due to heat generation of the second LED driver 326 on the bypass capacitor 381 is reduced. By arranging the bypass capacitor 381 so as to avoid the region 391 corresponding to the back side of the driver, it is possible to prevent the connection between the bypass capacitor 381 and the light emitting board 301 from being damaged due to the influence of thermal stress caused by the heat generated by the second LED driver 326. This can be prevented, and damage to the bypass capacitor 381 itself can be prevented.

Among the four sides of the first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381, the side where the first wiring pattern 386a is drawn out when viewed from the center of the first pad 382a exists in the direction in which the bypass capacitor 381 Among the four sides of the second pad 382b corresponding to the second electrode 381b, this direction is the same as the direction in which the side from which the third wiring pattern 386c is drawn out exists when viewed from the center of the second pad 382b. Therefore, it is possible to prevent a difference in temperature distribution between the pair of first pads 382a and second pads 382b during the initial heating stage of the reflow process. The direction in which the first wiring pattern 386a is drawn out from the first pad 382a is the same direction as the direction in which the third wiring pattern 386c is drawn out from the second pad 382b. Therefore, the difference in temperature distribution within the pair of first pad 382a and second pad 382b can be reduced in the initial stage of heating.

The first wiring pattern 386a and the third wiring pattern 386c are drawn out in a direction perpendicular or substantially perpendicular to the longitudinal direction of the bypass capacitor 381. Therefore, when distortion occurs in the light emitting board 301, it is possible to reduce the maximum value of stress that may act on the connection between the bypass capacitor 381 and the light emitting board 301, and to reduce the stress that may act on the bypass capacitor 381 itself. The maximum value can be reduced. Further, the first wiring pattern 386a and the third wiring pattern 386c extend linearly in the longitudinal direction of the bypass capacitor 381. Therefore, it is possible to reduce the possibility that the connecting portion between the bypass capacitor 381 and the light emitting board 301 will be damaged due to the influence of distortion that may occur in the light emitting board 301, and the possibility that the bypass capacitor 381 itself will be damaged can be reduced.

Among the four sides of the first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381, the side where the second wiring pattern 386b is drawn out when viewed from the center of the first pad 382a is located in the direction of the bypass capacitor 381. Among the four sides of the second pad 382b corresponding to the second electrode 381b, this direction is the same as the direction in which the side from which the fourth wiring pattern 386d is drawn out exists when viewed from the center of the second pad 382b. Therefore, it is possible to prevent a difference in temperature distribution between the pair of first pads 382a and second pads 382b during the initial heating stage of the reflow process. The direction in which the second wiring pattern 386b is drawn out from the first pad 382a is the same as the direction in which the fourth wiring pattern 386d is drawn out from the second pad 382b. Therefore, the difference in temperature distribution within the pair of first pad 382a and second pad 382b can be reduced in the initial stage of heating.

The second wiring pattern 386b and the fourth wiring pattern 386d are drawn out in a direction perpendicular or substantially perpendicular to the longitudinal direction of the bypass capacitor 381. Therefore, when distortion occurs in the light emitting board 301, it is possible to reduce the maximum value of stress that may act on the connection between the bypass capacitor 381 and the light emitting board 301, and to reduce the stress that may act on the bypass capacitor 381 itself. The maximum value can be reduced. Further, the second wiring pattern 386b and the fourth wiring pattern 386d extend linearly in the longitudinal direction of the bypass capacitor 381. Therefore, it is possible to reduce the possibility that the connecting portion between the bypass capacitor 381 and the light emitting board 301 will be damaged due to the influence of distortion that may occur in the light emitting board 301, and the possibility that the bypass capacitor 381 itself will be damaged can be reduced.

Note that on the first light emitting surface 302 of the light emitting board 301, the region 391 corresponding to the back side of the driver where the bypass capacitor 381 is not mounted is the region on the second light emitting surface 303 (FIG. 29) where the second LED driver 326 (FIG. 29) is mounted. and a region of the first light emitting surface 302 located on the back side of the region where the pad corresponding to the terminal of the second LED driver 326 is provided, and a region within 1 mm from the region of the first light emitting surface 302. Never. The driver back side corresponding area 391 is the first light emitting surface 302 located on the back side of the area where the second LED driver 326 is mounted on the second light emitting surface 303 and the area where pads corresponding to the terminals of the second LED driver 326 are provided. The distance from the area and the area of the first light emitting surface 302 may be within 2 mm. Thereby, it is possible to further reduce the influence of thermal stress that may be exerted on the light emitting board 301 due to the heat generated by the second LED driver 326 on the small chip components. Therefore, it is possible to reduce the possibility that the connection point between the bypass capacitor 381 and the light emitting board 301 will be damaged due to the influence of thermal stress due to the heat generated by the second LED driver 326, and the possibility that the bypass capacitor 381 itself will be damaged. can be reduced. In addition, the driver back side corresponding area 391 is defined as the first light emitting area located on the back side of the area where the second LED driver 326 is mounted on the second light emitting surface 303 and the area where pads corresponding to the terminals of the second LED driver 326 are provided. The distance from the area of the surface 302 and the area of the first light emitting surface 302 may be within 0.5 mm. This reduces the influence of thermal stress that may act on the light emitting board 301 due to heat generated by the second LED driver 326 on the small chip parts, while reducing the area on the first light emitting surface 302 of the light emitting board 301 where the small chip parts can be mounted. A large area can be secured.

<Other embodiments>
Note that the present invention is not limited to the contents described in the embodiments described above, and various modifications and improvements can be made without departing from the spirit of the present invention. For example, the following changes may be made. Incidentally, the configurations of the following alternative forms may be applied individually to the configuration of the above embodiment, or may be applied in combination.

(1) In the first embodiment, all electronic components including the connectors 111 and 112 and small chip components are concentrated on the mounting surface, which is one side of the first decorative board 56, and the mounting A configuration may also be adopted in which the small chip components are arranged avoiding the peripheral areas of the connectors 111 and 112. Specifically, the first connector 111, the second connector 112, and small chip components (bypass capacitors 85, 97 and small chip resistors 87, 101, 143) are mounted on the mounting surface, which is one side of the first decorative board 56. All electronic components including 149) are consolidated. No electronic components are mounted on the back side of the first decorative board 56, which is the opposite side of the mounting surface. In the first decorative board 56, no small chip component is mounted in a region around the first connector that is less than a predetermined distance (specifically, less than 5 mm) from the outer edge of the first connector 111. The first connector peripheral area is an area where tensile stress tends to act when the harness is attached to the first connector 111, and a compressive stress tends to act when the harness is removed from the first connector. Furthermore, no small chip component is mounted in the area around the second connector that is less than a predetermined distance from the second connector 112 (specifically, less than 5 mm). The second connector peripheral region is a region where tensile stress is likely to act when the harness is attached to the second connector 112, and a region where compressive stress is likely to act when the harness is removed from the second connector 112. If a small chip component is mounted in the peripheral area of the connector, there is a risk of damage to the connection point between the small chip component and the first decorative board 56 when the harness is attached to and removed from the connectors 111 and 112, and There is a risk that the small chip component itself may be damaged. On the other hand, by arranging the small chip components so as to avoid the area around the connectors, damage to the connection between the small chip components and the first decorative board 56 is prevented when the harness is attached to and removed from the connectors 111 and 112. At the same time, damage to the small chip component itself is prevented.

In this configuration, all the electronic components are concentrated on the mounting surface of the first decorative board 56, and the small chip components are arranged on the mounting surface while avoiding the peripheral areas of the connectors 111 and 112. By doing so, it is possible to prevent damage to the connection point between the small chip component and the first decorative board 56 when attaching and detaching the harness to the connectors 111 and 112, and also prevent damage to the small chip component itself. .

(2) In the first embodiment, the wiring patterns 172a to 172d drawn out from the pair of pads 171a and 171b may be drawn out in different directions. Specifically, a first wiring pattern is drawn out diagonally upward to the right from approximately the center in the vertical direction at the right end of the first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85, and a first wiring pattern is drawn out diagonally upward to the right. A third wiring pattern is drawn out diagonally downward to the right from approximately the center in the vertical direction at the right end of the second pad 171b. Even if the first wiring pattern and the third wiring pattern drawn out from the pads 171a and 171b are drawn out in different directions, one of the four sides of the first pad 171a when viewed from the center of the first pad 171a. the direction in which the side from which the first wiring pattern is drawn out exists, and the direction in which the side from which the third wiring pattern is drawn out exists when viewed from the center of the second pad 171b among the four sides of the second pad 171b. By adopting a configuration in which these are common, it is possible to reduce the possibility that a difference will occur in the temperature distribution within the pads 171a and 171b in the initial heating stage of the reflow process.

(3) In the first embodiment, a portion of the wiring patterns 172a to 172d drawn out from the pads 171a and 171b may extend in a direction not perpendicular to the longitudinal direction of the bypass capacitor 85. Specifically, as in the first embodiment, the first wiring pattern 172a is drawn out to the right from the right end of the first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85, and the second The wiring pattern 172b is drawn out to the left from the left end of the first pad 171a. Further, similarly to the first embodiment, the fourth wiring pattern 172d is drawn out to the left from the left end of the second pad 171b corresponding to the second electrode 85b of the bypass capacitor 85. The third wiring pattern in this configuration is drawn out diagonally downward to the right from the right end of the second pad 171b. In this way, even if a part of the wiring patterns 172a to 172d drawn out from the pads 171a and 171b extends in a direction not perpendicular to the longitudinal direction of the bypass capacitor 85, the wiring patterns 172a to 172d drawn out from the pads 171a and 171b are not drawn out from the pads 171a and 171b. Compared to a configuration in which the wiring pattern extends in the longitudinal direction of the bypass capacitor 85, stress that can be applied to the connection point between the bypass capacitor 85 and the first decorative board 56 when distortion occurs in the first decorative board 56 is reduced. The maximum value of stress that can act on the bypass capacitor 85 itself can be reduced.

(4) In the first embodiment, the first decorative substrate 56 includes a GND solid pattern (a ground solid pattern or a ground solid pattern) instead of the GND plane layer 93, and a power source instead of the power plane layer 94. A configuration including a solid pattern may also be used. Specifically, the first decorative board is a two-layer board having a first mounting surface and a second mounting surface. On the second mounting surface of the first decorative board, a GND solid pattern and a power supply solid pattern, which are larger in area than the wiring patterns 172a to 172d, are formed. The first wiring pattern 172a drawn out from the first pad 171a of the bypass capacitor 85 is electrically connected to the GND solid pattern via a through hole provided in the first decorative board, and is also connected to the GND solid pattern from the first pad 171a. The drawn out second wiring pattern 172b is electrically connected to the GND terminal 154 of the LED driver 126. Further, the third wiring pattern 172c drawn out from the second pad 171b of the bypass capacitor 85 is electrically connected to the power supply solid pattern via a through hole provided in the first decorative board, and the second pad 171b of the bypass capacitor 85 is A fourth wiring pattern 172d drawn out from 171b is electrically connected to the power terminal 151 of the LED driver 126. The temperature of the first wiring pattern 172a connected to the GND solid pattern, which has a larger area than the first pad 171a, increases in the initial stage of heating compared to the second wiring pattern 172b that is not connected to the GND solid pattern. is delayed. Further, the third wiring pattern 172c connected to the power supply solid pattern, which has a larger area than the second pad 171b, is more stable in the initial heating stage than the fourth wiring pattern 172d, which is not connected to the power supply solid pattern. Temperature rise is delayed. Also in this configuration, in a configuration in which the same number (specifically, two) of wiring patterns 172a to 172d are drawn out from the first pad 171a and the second pad 171b, the corresponding one of the four sides of the first pad 171a Viewed from the center of the first pad 171a, the direction in which the side from which the first wiring pattern 172a is drawn is located is the direction in which the third wiring pattern 172c is located among the four sides of the second pad 171b when viewed from the center of the second pad 171b. The direction is the same as the direction in which the drawn edge exists. Further, the direction in which the side where the second wiring pattern 172b is drawn out when viewed from the center of the first pad 171a among the four sides of the first pad 171a is the second side of the four sides of the second pad 171b. This is the same direction as the side where the fourth wiring pattern 172d is drawn out when viewed from the center of the pad 171b. This makes it possible to reduce the difference in temperature distribution between the pair of pads 171a and 171b during the initial heating stage of the reflow process, and to prevent rotation of the bypass capacitor 85 and occurrence of chipping.

(5) In the third embodiment, the second LED driver 326 for controlling the light emission of the LED chips 315 to 325 on the second light emitting surface 303 and the noise component contained in the drive power source of the second LED driver 326 A configuration may also be adopted in which a noise absorption capacitor for absorbing the noise is mounted on the first light emitting surface 302. The noise absorption capacitor in this configuration is a small chip component like the bypass capacitor 85 in the first embodiment. By mounting the noise absorbing capacitor on the first light emitting surface 302, all the small chip components mounted on the light emitting board 301 can be concentrated on the first light emitting surface 302 side while the noise absorbing capacitor is a small chip component. can. Therefore, by handling the light emitting board 301 so that the stress acting on the first light emitting surface 302 side of the light emitting board 301 is smaller than the stress acting on the second light emitting surface 303 side, small chip components and the light emitting board 301 can be separated. It is possible to reduce the possibility that the connection points of the small chip components themselves are damaged, and also to reduce the possibility that the small chip components themselves are damaged. For example, when dividing a collective substrate (not shown) including a plurality of light-emitting substrates 301 and taking out the light-emitting substrates 301, it is possible to reduce the size by dividing the collective substrate in such a manner that the first light-emitting surface 302 side has a valley shape (concave). It is possible to prevent tensile stress from acting on the connection portion between the chip component and the light emitting board 301. As a result, it is possible to prevent the connection between the small chip component and the light emitting board 301 from being damaged, and also to prevent the small chip component itself from being damaged.

(6) In the third and fourth embodiments described above, instead of the structure in which the light emitting board 301 is fixed to the board case with screws, the light emitting board 301 is held between the board case from the front side and the back side. You can also use it as The board case includes a front case body and a back case body. The front side case body is provided with a front side fixing protrusion that stands up on the back side, and the back side case body is provided with a back side fixing protrusion that stands up on the front side. The light emitting board 301 is fixed to the board case by being held between the front side fixing protrusion and the back side fixing protrusion. In the light emitting board 301, the small chip component is placed 5 mm or more away from the sandwiched portion formed by the front side fixing protrusion and the back side fixing protrusion. As a result, it is possible to prevent the connection point between the small chip component and the light emitting board 301 from being damaged due to the influence of distortion of the light emitting board 301 that may occur near the holding part, and it is also possible to prevent the small chip component itself from being damaged. .

(7) In each of the above embodiments, among the four sides of the first pad (or first pad), the direction in which the side from which the wiring pattern is drawn out when viewed from the center of the first pad exists, and the second pad (or or the second pad), if the direction in which the side on which the wiring pattern is drawn out is the same direction as the side on which the wiring pattern is drawn out when viewed from the center of the second pad, the wiring pattern is drawn out on the first pad. The configuration may be such that the position where the wiring pattern is drawn out on the side where the wiring pattern is drawn out is not the same as the position where the wiring pattern is drawn out on the side where the wiring pattern is drawn out on the second pad. For example, in the first embodiment, from a position above the vertical center on the right side of the rectangular first pad 176a electrically connected to the first electrode 87a of the small chip resistor 87, The first wiring pattern 181a is drawn out, and the second wiring pattern 181a is drawn out to the right from a position lower than the center in the vertical direction on the right side of the rectangular second pad 176b electrically connected to the second electrode 87b. A configuration may be adopted in which the wiring pattern 181b is drawn out. Even in such a configuration, there is a direction (right direction) in which the side where the first wiring pattern 181a is drawn out when viewed from the center of the first pad 176a among the four sides of the first pad 176a, and Among the four sides of the second pad 176b, the side from which the second wiring pattern 181b is drawn out is in the same direction (right direction) when viewed from the center of the second pad 176b, so that the initial heating stage of the reflow process It is possible to reduce the possibility that there will be a difference in temperature distribution between the first pad 176a and the second pad 176b.

(8) In each of the above embodiments, the first pad (or first pad) electrically connected to the first electrode of the small chip component and the second pad (or second pad) electrically connected to the second electrode The shape of the pad is not limited to a rectangle, and may be a polygon such as a hexagon or an octagon. For example, in a configuration in which the first pad and the second pad have a hexagonal shape, the direction in which the side from which the first wiring pattern is drawn out exists when viewed from the center of the first pad among the six sides of the first pad. is the same direction as the side where the second wiring pattern is drawn out when viewed from the center of the second pad among the six sides of the second pad, so that the It is possible to reduce the possibility that there will be a difference in temperature distribution within the first pad and the second pad.

(9) In each of the above embodiments, small chip components (bypass capacitors 85, 97 in the first embodiment, small chip resistors 87, 101, bypass capacitor 291 in the second embodiment, bypass in the fourth embodiment) Instead of the configuration in which the capacitor 381) is provided with narrow electrodes (first electrodes 85a, 87a, 97a, 101a, 291a, 381a and second electrodes 85b, 87b, 97b, 101b, 291b, 381b), the small A configuration may also be adopted in which the chip component is provided with a terminal. As already explained in the first embodiment, a "terminal" is a linear wire provided on an electronic component (including small chip components) to electrically connect with a corresponding pad (or pad). In addition to being a metal part, an "electrode" in a narrow sense is a metal part provided on an electronic component (including small chip components) in order to make an electrical surface connection with a corresponding pad (or pad). Yes, but does not include the above "terminal".

Specifically, a line extending from one end of the bypass capacitor 85, 97, 291, 381 to one side of the longitudinal direction along a plane orthogonal to the thickness direction of the bypass capacitor 85, 97, 291, 381. A linear first terminal is provided, and a linear first terminal extends from the other end of the bypass capacitor 85 in the longitudinal direction opposite to the one end to the other end in the longitudinal direction opposite to the one end. A configuration may also be adopted in which a second terminal is provided. Further, the small chip resistors 87, 101 are provided with a linear first terminal extending from one end in the longitudinal direction to one side in the longitudinal direction along a plane orthogonal to the thickness direction of the small chip resistors 87, 101. and a linear second terminal extending from the other end of the small chip resistor 87 opposite to the one end in the longitudinal direction to the other end opposite to the one end in the longitudinal direction. It is also possible to have a configuration in which

(10) In each of the above embodiments, instead of the configuration in which the LED drivers 126, 314, 326 are provided with terminals, the LED drivers 126, 314, 326 may be provided with electrodes in a narrow sense. As already explained in the first embodiment, a "terminal" is a linear wire provided on an electronic component (including small chip components) to electrically connect with a corresponding pad (or pad). In addition to being a metal part, an "electrode" in a narrow sense is a metal part provided on an electronic component (including small chip components) in order to make an electrical surface connection with a corresponding pad (or pad). Yes, but does not include the above "terminal". Specifically, in the substantially rectangular parallelepiped housings of the LED drivers 126, 314, and 326, electrodes in a narrow sense are provided at locations facing pads (or pads), and the pads and electrodes are electrically connected by soldering. It may also be configured to be connected to.

(11) In the first embodiment, the slits 255 to 258 are provided in the area corresponding to the area where the bypass capacitor 85 is mounted on the collective board 231, but the configuration is not limited to this. Instead, a configuration may be adopted in which a second dividing groove (dividing groove with a thinner bottom) is formed at the location, which is deeper than the normal first dividing groove. The first dividing groove and the second dividing groove are formed in a straight line. The plate thickness at the bottom of the second dividing groove is smaller than the plate thickness at the bottom of the first dividing groove, and the mechanical strength of the second dividing groove is lower than the mechanical strength of the first dividing groove. Therefore, when the collective substrate 231 is divided into valleys using the first dividing groove and the second dividing groove existing in a straight line as base points, the stress acting on the periphery of the second dividing groove acts on the periphery of the first dividing groove. less than the stress caused by By configuring the collective board 231 to have a second dividing groove at a location corresponding to the area where the bypass capacitor 85 is mounted, it is possible to separate the bypass capacitor 85 and the first decorative board 56 when dividing the collective board 231. It is possible to reduce the stress that may act on the connection location, and also reduce the stress that may act on the bypass capacitor 85 itself.

(12) In the first embodiment, the dividing grooves 232 to 247 are formed only on the first plate surface 268 side of the collective substrate 231, but the dividing grooves 232 to 247 are not limited to this. 247 may be provided on both the first plate surface 268 side and the second plate surface 269 side. The dividing grooves 232 to 247 are formed one each on the first plate surface 268 side and the second plate surface 269 side of the collective substrate 231, and their formation positions are on the first plate surface 268 side and the second plate surface. They are almost matched on the 269 side. In this configuration, each of the disposable substrates 261 to 267 is provided with a mountain side display by silk printing, which makes it possible to confirm the board surface that becomes a mountain shape (convex) when dividing the collective substrate 231 into valleys. The mountain side display is provided on the second plate surface 269 side. The operator sets the collective board 231 in the dividing jig 281 with the side on which the mountain side display is printed facing upward, so that the first board surface 268 forms a valley shape (concave). can be divided into valleys. The mountain side display is printed only on the disposable substrate, and is not printed on the first decorative substrate 56 taken out from the collective substrate 231. By having the configuration in which the mountain side display is printed on the disposable boards 261 to 267 in this manner, it is possible to prevent the collective board 231 from being erroneously divided into mountains.

(13) In the first embodiment, the dividing grooves 232 to 235, 240, 241, 246, 247 are formed at the boundary between the first decorative substrate 56 and the disposable substrates 261, 263, 266 in the collective substrate 231. However, the present invention is not limited to this, and the first decorative substrate 56 and the disposable substrates 261, 263, 266 are connected to the boundary between the first decorative substrate 56 and the disposable substrates 261, 263, 266. It is also possible to have a configuration in which perforations are formed in which portions and unconnected portions are alternately present. The mechanical strength at the perforation of the collective substrate 231 is lower than the mechanical strength at the peripheral area of the perforation. By providing perforations at the boundaries between the first decorative board 56 and the disposable boards 261, 263, 266, stress that may be applied to the connection points between the small chip components and the first decorative board 56 is reduced when the collective board 231 is divided. At the same time, it is possible to reduce stress that may act on the small chip component itself.

(14) In the first embodiment, a plurality of first decorative substrates 56 are set on the collective board 231, but the configuration is not limited to this, and a plurality of types of boards are set on the collective board 231. It may be configured as follows. Thereby, it is possible to take out a plurality of types of substrates from one collective substrate 231.

(15) In the first embodiment described above, a configuration may be adopted in which a push position display indicating a place where force should be applied to divide the collective substrate 231 is silk-printed on the collective substrate 231. After fixing the collective substrate 231 to the dividing jig 281, the operator can divide the collective substrate 231 by pushing downward with a finger the part where the push position display is printed. By specifying the location where force should be applied to divide the collective board 231 by indicating the push position, the stress that can be applied to the connection points between the small chip components and the first decorative board 56 when dividing the collective board 231 can be minimized. It is possible to minimize stress that may act on the small chip components themselves.

(16) In the first embodiment and the second embodiment, small chip components (bypass capacitor 85 and small chip resistor 87) are mounted on the decorative substrates 56 and 57 for performing the light emission effect. However, the present invention is not limited to this, and for example, a configuration may be adopted in which a small chip component is mounted on a motor control board for executing a vibration effect that vibrates the pachinko machine 10. In addition, the main control board 61 included in the main control device 60, the audio emission control board included in the audio emission control device 81, the payout control board included in the payout control device 77, and the power supply/launch control device 78 provided. A configuration may also be adopted in which small chip components are mounted on at least one of the power supply/emission control board included in the display control board and the display control board included in the display control device 82.

(17) Instead of the configuration in which the display control device 82 is controlled by the audio emission control device 81 based on the command sent from the main control device 60, the display control device 82 is controlled based on the command sent from the main control device 60. A configuration may be adopted in which the device 82 controls the audio emission control device 81. Further, instead of the configuration in which the audio emission control device 81 and the display control device 82 are provided separately, a configuration in which both control devices are provided as one control device may be used, and the function of one of the two control devices may be may be integrated into the main control device 60, or both functions of these two control devices may be integrated into the main control device 60. Furthermore, the contents of the commands sent from the main control device 60 to the audio emission control device 81 and the contents of the commands sent from the audio emission control device 81 to the display control device 82 are also arbitrary.

(18) Other types of pachinko machines different from the above embodiments, such as pachinko machines in which an electric accessory is released a predetermined number of times when a game ball enters a specific area of a special device, or a game ball that opens a game ball in a specific area of a special device. The present invention can also be applied to game machines such as a pachinko machine in which a jackpot is generated when a ball is entered, a pachinko machine equipped with other accessories, an arranged ball machine, and a mahjong ball machine.

In addition, non-pinball type game machines, for example, are equipped with multiple reels with multiple types of symbols attached in the circumferential direction, and rotation of the reels is started by inserting a medal and operating a start lever, and a stop switch is operated. After the reels have stopped after a predetermined period of time has elapsed, if a specific symbol or a specific symbol combination is established on the active line that can be seen from the display window, the player is given benefits such as a payout of medals, etc. The present invention can also be applied to slot machines.

In addition, the game machine main body, which is supported by the outer frame in an openable and closable manner, is equipped with a storage section and a retrieval device, and the start lever is operated after a predetermined number of game balls stored in the storage section are retrieved by the retrieval device. The present invention can also be applied to a gaming machine that is a combination of a pachinko machine and a slot machine, which starts the rotation of the reels by doing so.

<About the invention group extracted from each of the above embodiments>
Hereinafter, the features of the invention group extracted from each of the embodiments described above will be explained, showing effects etc. as necessary. In the following, for ease of understanding, structures corresponding to each of the above embodiments are indicated in parentheses as appropriate, but the present invention is not limited to the specific structures shown in parentheses.

<Characteristics Group A>
Feature A1. A predetermined electronic component (bypass capacitors 85, 97 in the first embodiment, small chip resistors 87, 101, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) is mounted. In a game machine equipped with a board (first decorative board 56 in the first embodiment, second decorative board 57, light emitting board 301 in the fourth embodiment),
The predetermined electronic component includes a first predetermined electrode (first electrode 85a, 87a, 291a, 381a) and a second predetermined electrode (second electrode 85b, 87b, 291b, 381b) as a pair of electrodes,
The predetermined substrate is
a first predetermined connection portion (first pads 171a, 176a, 293a, 382a) to which the first predetermined electrode is electrically connected;
a first predetermined wiring pattern (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b) drawn out from the first predetermined connection portion;
a second predetermined connection portion (second pads 171b, 176b, 293b, 382b) to which the second predetermined electrode is electrically connected;
a second predetermined wiring pattern (second wiring pattern 181b, third wiring pattern 172c, 294c, 386c, fourth wiring pattern 172d, 294d, 386d) drawn out from the second predetermined connection portion;
It is equipped with
The direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion when viewed from the center of the second predetermined connection portion. A gaming machine characterized in that the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out is in the same direction as the direction in which the second predetermined connection portion exists.

According to feature A1, when viewed from the center of the first predetermined connection section, the direction in which the side of the first predetermined connection section from which the first predetermined wiring pattern is drawn exists is, when viewed from the center of the second predetermined connection section. This is the same direction as the side of the second predetermined connection portion from which the second predetermined wiring pattern is drawn. Therefore, it is possible to equalize the temperature distribution within the pair of first and second predetermined connection portions in the initial heating stage of the reflow process, and to prevent the coating from occurring on the first and second predetermined connection portions. The manner in which the solder paste melts can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined board as the rotation axis, and also to prevent the predetermined electronic component from rotating on one connection portion (the first predetermined connection portion or the second predetermined connection portion). It is possible to prevent so-called chip standing from occurring where only one electrode (the first predetermined electrode or the second predetermined electrode) stands up. Therefore, it is possible to ensure the electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is also possible to ensure the electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature A2. Feature A1 is characterized in that the direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion is the same direction as the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion. The game machine described.

According to feature A2, it is possible to reduce the possibility that a difference will occur in the temperature distribution within the first predetermined connection portion and the second predetermined connection portion in the initial heating stage of the reflow process.

Feature A3. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the first predetermined wiring pattern,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern. The gaming machine according to feature A1 or A2.

According to feature A3, the predetermined wiring pattern is electrically connected to a metal region with a large area (first metal region or second metal region) at a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). (The first predetermined wiring pattern or the second predetermined wiring pattern) on the side where the lead-out part is present tends to have a delayed temperature rise in the initial heating stage of the reflow process, but when viewed from the center of the first predetermined connection part, The direction in which the side where the temperature rise is likely to be delayed is the same direction as the side where the temperature rise is likely to be delayed in the initial stage of heating when viewed from the center of the second predetermined connection portion. Thereby, the temperature distribution within the first predetermined connection portion and the second predetermined connection portion at the initial stage of heating can be made uniform.

Feature A4. The wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern,
The gaming machine according to any one of features A1 to A3, wherein the wiring pattern drawn out from the second predetermined connection portion is only the second predetermined wiring pattern.

According to feature A4, it is possible to reduce the possibility that a difference will occur in the temperature distribution within the pair of first predetermined connection portion and second predetermined connection portion in the initial stage of heating.

Feature A5. The predetermined substrate is
a third predetermined wiring pattern (second wiring patterns 172b, 294b, 386b) drawn out from the first predetermined connection portion;
a fourth predetermined wiring pattern (fourth wiring patterns 172d, 294d, 386d) drawn out from the second predetermined connection portion;
It is equipped with
The direction in which the side of the first predetermined connection portion from which the third predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the direction in which the side of the first predetermined connection portion is located when viewed from the center of the second predetermined connection portion. The gaming machine according to any one of features A1 to A3, characterized in that the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out is in the same direction as the direction in which it exists.

According to feature A5, the direction in which the side of the first predetermined connection portion having the configuration of feature A1 and from which the first predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion. When viewed from the center of the first predetermined connection portion, the second predetermined wiring pattern is drawn out in the same direction as the side of the second predetermined connection portion, when viewed from the center of the first predetermined connection portion. 3 The direction in which the side of the first predetermined connection portion from which the predetermined wiring pattern is drawn out exists is the direction in which the side of the first predetermined connection portion from which the fourth predetermined wiring pattern is drawn out exists when viewed from the center of the second predetermined connection portion. The direction is the same as the direction in which the edge exists. Therefore, the temperature distribution within the pair of first predetermined connection parts and second predetermined connection parts in the initial heating stage of the reflow process can be made uniform, and the coating on these first predetermined connection parts and second predetermined connection parts can be made uniform. The manner in which the solder paste melts can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined board as the rotation axis, and the predetermined electronic component can be placed on one of the connection parts (the first predetermined connection part or the second predetermined connection part). It is possible to prevent so-called chip standing from occurring, which occurs only at the electrode (the first predetermined electrode or the second predetermined electrode). Therefore, it is possible to ensure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is also possible to ensure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature A6. Feature A5 is characterized in that the direction in which the third predetermined wiring pattern is drawn out from the first predetermined connection portion is the same direction as the direction in which the fourth predetermined wiring pattern is drawn out from the second predetermined connection portion. The game machine described.

According to feature A6, it is possible to reduce the possibility that a difference will occur in the temperature distribution within the pair of first predetermined connection portion and second predetermined connection portion in the initial heating stage of the reflow process.

Feature A7. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the first predetermined wiring pattern,
The third predetermined wiring pattern is not electrically connected to a metal region having a larger area than the first predetermined connection portion,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern,
The gaming machine according to feature A5 or A6, wherein the fourth predetermined wiring pattern is not electrically connected to a metal region having a larger area than the second predetermined connection portion.

According to feature A7, the predetermined wiring pattern is electrically connected to a metal region with a large area (first metal region or second metal region) at a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). (The first predetermined wiring pattern or the second predetermined wiring pattern) on the side where the lead-out part is present tends to have a delayed temperature rise in the initial heating stage of the reflow process, but when viewed from the center of the first predetermined connection part, The direction in which the side where the temperature rise is likely to be delayed is the same direction as the side where the temperature rise is likely to be delayed in the initial stage of heating when viewed from the center of the second predetermined connection portion. Furthermore, when viewed from the center of the first predetermined connection portion, the direction in which the side where the third predetermined wiring pattern is drawn out from the first predetermined connection portion that is not electrically connected to the metal region with a large area exists is , the same direction as the side from which the fourth predetermined wiring pattern that is not electrically connected to the metal region with a large area is drawn out from the second predetermined connection portion when viewed from the center of the second predetermined connection portion. The direction is Therefore, the temperature distribution within the first predetermined connection portion and the second predetermined connection portion at the initial stage of heating can be made uniform.

Feature A8. The second predetermined wiring pattern is used in the connection target (the pad electrically connected to the eighth output terminal 162 of the LED driver 126) that is electrically connected to the second predetermined connection portion using the second predetermined wiring pattern. The location where the wiring pattern is connected is in a predetermined uniaxial direction including the direction in which the second predetermined wiring pattern is pulled out from the second predetermined connection portion (the second direction in FIGS. 8(a) and 8(c) When viewed from DR2), the second predetermined wiring pattern is located in a direction opposite to the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion, with respect to the second predetermined connection portion as a reference;
The second predetermined wiring pattern is drawn out from the second predetermined connection portion in the same direction as the direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion, and then is The gaming machine according to any one of features A1 to A7, characterized in that when viewed, the gaming machine is routed in the opposite direction with respect to the second predetermined connection portion.

According to feature A8, when the second predetermined wiring pattern is viewed in the direction of one predetermined axis, the direction is opposite to the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion with the second predetermined connection portion as a reference. Even in a configuration in which the second predetermined wiring pattern is connected to the connection target at a location where the second predetermined wiring pattern is drawn out from the second predetermined connection portion in the same direction as the direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion. ing. Thereby, it is possible to reduce the possibility that a difference will occur in the temperature distribution within the pair of first predetermined connection portion and second predetermined connection portion in the initial heating stage of the reflow process.

Feature A9. The predetermined electronic component has a configuration in which a dimension in a first direction perpendicular to the thickness direction of the predetermined electronic component is larger than a dimension in a second direction orthogonal to the thickness direction of the predetermined electronic component,
At least one of the direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion is a direction orthogonal to the first direction or approximately The gaming machine according to any one of features A1 to A8, characterized in that the directions are perpendicular to each other.

According to feature A9, when distortion occurs in the predetermined board, it is possible to reduce the maximum value of stress that may act on the connection point between the predetermined electronic component and the predetermined board, and to reduce the stress that may act on the predetermined electronic component itself. The maximum value of can be reduced. Thereby, it is possible to prevent the connection portion between the predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the predetermined electronic component itself from being damaged.

Feature A10. The first predetermined connection portion, the second predetermined connection portion, the first predetermined wiring pattern, and the second predetermined wiring pattern are connected to a predetermined mounting surface (of the first decorative board 56) which is one side of the board surface of the predetermined board. provided on the first mounting surface 84),
The gaming machine according to feature A9, wherein at least one of the first predetermined wiring pattern and the second predetermined wiring pattern is a wiring pattern that extends linearly on the predetermined mounting surface.

According to feature A10, at least one of the first predetermined wiring pattern and the second predetermined wiring pattern extends linearly on the predetermined mounting surface. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced. Thereby, it is possible to prevent the connection portion between the predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the predetermined electronic component itself from being damaged.

Feature A11. The predetermined substrate has non-penetrating predetermined via holes (via holes 174, 175) extending from the predetermined mounting surface in the thickness direction of the predetermined substrate, or predetermined through holes (first through hole 383) that penetrate the predetermined substrate in the thickness direction. , a second through hole 384),
At least one of the first predetermined wiring pattern and the second predetermined wiring pattern electrically connects the first predetermined connection portion or the second predetermined connection portion and the predetermined via hole or the predetermined through hole on the predetermined mounting surface. The gaming machine according to feature A10, characterized in that the gaming machine has a linear wiring pattern connected to.

According to feature A11, when a predetermined substrate is distorted by providing a predetermined via hole or a predetermined through hole in a predetermined substrate and making at least one of the first predetermined wiring pattern and the second predetermined wiring pattern a straight wiring pattern. In this case, it is possible to reduce the maximum value of stress that can act on the connection portion between the predetermined electronic component and the predetermined substrate, and also reduce the maximum value of stress that can act on the predetermined electronic component itself.

Feature A12. The predetermined substrate is
a third predetermined wiring pattern (second wiring patterns 172b, 294b, 386b) drawn out from the first predetermined connection portion;
a fourth predetermined wiring pattern (fourth wiring patterns 172d, 294d, 386d) drawn out from the second predetermined connection portion;
It is equipped with
The predetermined electronic component has a configuration in which a dimension in a first direction perpendicular to the thickness direction of the predetermined electronic component is larger than a dimension in a second direction orthogonal to the thickness direction of the predetermined electronic component,
A direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion, a direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion, and a direction in which the third predetermined wiring pattern is drawn out from the first predetermined connection portion. and the direction in which the fourth predetermined wiring pattern is drawn out from the second predetermined connection portion are perpendicular or substantially perpendicular to the first direction. 1. The gaming machine described in 1.

According to feature A12, in a configuration in which the dimension of the predetermined electronic component in the first direction is larger than the dimension in the second direction, The direction in which the third predetermined wiring pattern is drawn out from the first predetermined connection portion, and the direction in which the fourth predetermined wiring pattern is drawn out from the second predetermined connection portion are a direction orthogonal to the first direction or This is a substantially orthogonal direction. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced.

Feature A13. The predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, and the bypass capacitor 381 in the fourth embodiment) or a resistor (the bypass capacitor 381 in the first embodiment). The gaming machine according to any one of features A1 to A12, characterized in that the gaming machine is a small chip resistor (87, 101).

According to feature A13, the direction in which the side of the first predetermined connection portion having the configuration of feature A1 and from which the first predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion. This is the same direction as the side of the second predetermined connection portion from which the second predetermined wiring pattern is drawn out when viewed from the center of the predetermined connection portion. Therefore, it is possible to equalize the temperature distribution within the pair of first and second predetermined connecting portions in the initial heating stage of the reflow process, and the coating on the first and second predetermined connecting portions can be made uniform. The manner in which the solder paste melts can be made uniform. This prevents the capacitor or resistor from rotating with the normal direction of the predetermined board as the rotation axis, and also allows the capacitor or resistor to It is possible to prevent so-called chip standing, which occurs when only one electrode (the first predetermined electrode or the second predetermined electrode) stands up. Therefore, it is possible to ensure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is also possible to ensure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature A14. A predetermined electronic component (bypass capacitors 85, 97 in the first embodiment, small chip resistors 87, 101, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) is mounted. In a game machine equipped with a board (first decorative board 56 in the first embodiment, second decorative board 57, light emitting board 301 in the fourth embodiment),
The predetermined electronic component includes a first predetermined electrode (first electrode 85a, 87a, 291a, 381a) and a second predetermined electrode (second electrode 85b, 87b, 291b, 381b) as a pair of electrodes,
The predetermined substrate is
a first predetermined connection portion (first pads 171a, 176a, 293a, 382a) to which the first predetermined electrode is electrically connected;
a first predetermined wiring pattern (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b) drawn out from the first predetermined connection portion;
a second predetermined connection portion (second pads 171b, 176b, 293b, 382b) to which the second predetermined electrode is electrically connected;
a second predetermined wiring pattern (second wiring pattern 181b, third wiring pattern 172c, 294c, 386c, fourth wiring pattern 172d, 294d, 386d) drawn out from the second predetermined connection portion;
It is equipped with
A gaming machine characterized in that a direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion is the same direction as a direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion.

According to feature A14, since the direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion is the same as the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion, the heating in the reflow process is It is possible to reduce the possibility that a difference will occur in the temperature distribution within the pair of first predetermined connection portions and second predetermined connection portions in the initial stage, and also to reduce the possibility that a difference will occur in the temperature distribution within the pair of first predetermined connection portions and second predetermined connection portions. The manner in which the solder paste melts can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined board as the rotation axis, and also to prevent the predetermined electronic component from rotating on one connection portion (the first predetermined connection portion or the second predetermined connection portion). It is possible to prevent so-called chip standing from occurring where only one electrode (the first predetermined electrode or the second predetermined electrode) stands up. Therefore, it is possible to ensure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is also possible to ensure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Note that for the configuration of features A1 to A14, which one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 Alternatively, one or more configurations may be applied. Thereby, it becomes possible to produce a synergistic effect by the combined configuration.

<Characteristics Group B>
Feature B1. A predetermined electronic component (bypass capacitors 85, 97 in the first embodiment, small chip resistors 87, 101, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) is mounted. In a game machine equipped with a board (first decorative board 56 in the first embodiment, second decorative board 57, light emitting board 301 in the fourth embodiment),
The predetermined electronic component has a configuration in which a dimension in a first direction perpendicular to the thickness direction of the predetermined electronic component is larger than a dimension in a second direction orthogonal to the thickness direction of the predetermined electronic component,
The predetermined substrate is
Predetermined connection portions (first pads 171a, 176a, 293a, 382a) to which the electrodes (first electrodes 85a, 87a, 291a, 381a, second electrodes 85b, 87b, 291b, 381b) of the predetermined electronic components are electrically connected; , second pads 171b, 176b, 293b, 382b),
Predetermined wiring patterns drawn out from the predetermined connection portions (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b, second wiring patterns 181b, third wiring patterns 172c, 294c, 386c) , fourth wiring patterns 172d, 294d, 386d),
Equipped with
A gaming machine characterized in that a direction in which the predetermined wiring pattern is drawn out from the predetermined connection portion is a direction perpendicular or substantially perpendicular to the first direction.

According to feature B1, the direction in which the predetermined wiring pattern is drawn out from the predetermined connection portion is a direction perpendicular or substantially perpendicular to the first direction. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced. Thereby, it is possible to prevent the connection portion between the predetermined electronic component and the predetermined board from being damaged. Further, by reducing the maximum value of stress that can act on the predetermined electronic component itself, it is possible to prevent the predetermined electronic component itself from being damaged.

Feature B2. The predetermined connection portion and the predetermined wiring pattern are provided on a predetermined mounting surface (first mounting surface 84 of the first decorative board 56) that is one side of the predetermined board,
The gaming machine according to feature B1, wherein the predetermined wiring pattern is a wiring pattern that extends linearly on the predetermined mounting surface.

According to feature B2, the predetermined wiring pattern extends linearly on the predetermined mounting surface. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced. As a result, it is possible to prevent the connection portion between the predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the predetermined electronic component itself from being damaged.

Feature B3. The predetermined substrate has non-penetrating predetermined via holes (via holes 174, 175) extending from the predetermined mounting surface in the thickness direction of the predetermined substrate, or predetermined through holes (first through hole 383) that penetrate the predetermined substrate in the thickness direction. , a second through hole 384),
The gaming machine according to feature B2, wherein the predetermined wiring pattern is a linear wiring pattern that electrically connects the predetermined connection portion and the predetermined via hole or the predetermined through hole on the predetermined mounting surface. .

According to feature B3, when a predetermined via hole or a predetermined through hole is provided in a predetermined board and the predetermined wiring pattern is a straight wiring pattern, when distortion occurs in the predetermined board, the connection between the predetermined electronic component and the predetermined board is prevented. It is possible to reduce the maximum value of stress that can act on a location, and also reduce the maximum value of stress that can act on a given electronic component itself.

Feature B4. The predetermined electronic component includes a first predetermined electrode (first electrode 85a, 87a, 291a, 381a) and a second predetermined electrode (second electrode 85b, 87b, 291b, 381b),
The predetermined substrate is
a first predetermined connection portion (first pads 171a, 176a, 293a, 382a), which is the predetermined connection portion to which the first predetermined electrode is electrically connected;
a first predetermined wiring pattern (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b), which is the predetermined wiring pattern electrically connected to the first predetermined connection portion;
a second predetermined connection portion (second pads 171b, 176b, 293b, 382b), which is the predetermined connection portion to which the second predetermined electrode is electrically connected;
A second predetermined wiring pattern (second wiring pattern 181b, third wiring pattern 172c, 294c, 386c, fourth wiring pattern 172d, 294d, 386d) and
It is equipped with
The direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion are perpendicular or substantially perpendicular to the first direction. The gaming machine according to any one of features B1 to B3.

According to feature B4, the direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion are perpendicular or substantially perpendicular to the first direction. It is the direction. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced. This can prevent damage to the connection portion between the predetermined electronic component and the predetermined board. Further, by reducing the maximum value of stress that can act on the predetermined electronic component itself, it is possible to prevent the predetermined electronic component itself from being damaged.

Feature B5. The direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion when viewed from the center of the second predetermined connection portion. The gaming machine according to feature B4, characterized in that the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out is in the same direction as the direction in which it exists.

According to feature B5, the temperature distribution within the first predetermined connection portion and the second predetermined connection portion can be made uniform in the initial heating stage of the reflow process, and the temperature distribution within the first predetermined connection portion and the second predetermined connection portion can be made uniform. The manner in which the solder paste melts can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined board as the rotation axis, and also to prevent the predetermined electronic component from rotating on one connection portion (the first predetermined connection portion or the second predetermined connection portion). It is possible to prevent so-called chip standing from occurring where only one electrode (the first predetermined electrode or the second predetermined electrode) stands up. Therefore, it is possible to ensure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is also possible to ensure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature B6. The game machine according to feature B4 or B5, wherein the predetermined electronic component includes the first predetermined electrode and the second predetermined electrode as a pair of electrodes.

According to feature B6, the direction in which the position where the first predetermined wiring pattern is drawn out from the first predetermined connection portion exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion. Since the direction is the same as the direction in which the second predetermined wiring pattern is pulled out from the second predetermined connection portion when viewed from the center of The temperature distribution within the connection portion can be made uniform, and the manner in which the solder paste applied on the pair of first predetermined connection portion and second predetermined connection portion is melted can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined board as the rotation axis, and also to prevent the predetermined electronic component from rotating on one connection portion (the first predetermined connection portion or the second predetermined connection portion). It is possible to prevent so-called chip standing from occurring where only one electrode (the first predetermined electrode or the second predetermined electrode) stands up. Therefore, it is possible to ensure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is also possible to ensure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature B7. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the first predetermined wiring pattern,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern. The gaming machine according to any one of features B4 to B6.

According to feature B7, the predetermined wiring pattern is electrically connected to a metal region with a large area (first metal region or second metal region) at a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). (The first predetermined wiring pattern or the second predetermined wiring pattern) on the side where the lead-out part is present tends to have a delayed temperature rise in the initial heating stage of the reflow process, but when viewed from the center of the first predetermined connection part, the temperature rise in the initial heating stage The direction in which the side where the temperature rise is likely to be delayed is the same direction as the side where the temperature rise is likely to be delayed in the initial stage of heating when viewed from the center of the second predetermined connection portion. Thereby, the temperature distribution within the first predetermined connection portion and the second predetermined connection portion at the initial stage of heating can be made uniform.

Feature B8. The wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern,
The gaming machine according to any one of features B4 to B7, wherein the wiring pattern drawn out from the second predetermined connection portion is only the second predetermined wiring pattern.

According to feature B8, the structure of feature B4 is provided, and the direction in which the first predetermined wiring pattern is drawn from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion are in the first direction. In the configuration in which the directions are orthogonal or substantially orthogonal, the wiring pattern drawn out from the first predetermined connection part is only the first predetermined wiring pattern, and the wiring pattern drawn out from the second predetermined connection part is the first predetermined wiring pattern. 2. There are only two predetermined wiring patterns. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced.

Feature B9. The predetermined substrate is
a third predetermined wiring pattern (second wiring patterns 172b, 294b, 386b) drawn out from the first predetermined connection portion;
a fourth predetermined wiring pattern (fourth wiring patterns 172d, 294d, 386d) drawn out from the second predetermined connection portion;
It is equipped with
The direction in which the third predetermined wiring pattern is drawn out from the first predetermined connection portion and the direction in which the fourth predetermined wiring pattern is drawn out from the second predetermined connection portion are perpendicular or substantially perpendicular to the first direction. The gaming machine according to any one of features B4 to B7.

According to feature B9, the first predetermined wiring pattern, the second predetermined wiring pattern, the third predetermined wiring pattern, and the fourth predetermined wiring pattern extend in a direction perpendicular to or substantially perpendicular to the first direction. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced. Thereby, it is possible to prevent the connection portion between the predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the predetermined electronic component itself from being damaged.

Feature B10. The direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion when viewed from the center of the second predetermined connection portion. The direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out exists;
The direction in which the side of the first predetermined connection portion from which the third predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the direction in which the side of the first predetermined connection portion is located when viewed from the center of the second predetermined connection portion. The gaming machine according to feature B9, characterized in that the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out is in the same direction as the direction in which it exists.

According to feature B10, the direction in which the position where the first predetermined wiring pattern is drawn out from the first predetermined connection portion is located is the second predetermined connection portion when viewed from the center of the first predetermined connection portion. In a configuration in which the position where the second predetermined wiring pattern is drawn out from the second predetermined connection portion is in the same direction as the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion when viewed from the center of the first predetermined connection portion, The direction in which the lead-out position from the first predetermined connection part exists is the same direction as the direction in which the lead-out position from the second predetermined connection part of the fourth predetermined wiring pattern exists when viewed from the center of the second predetermined connection part. Therefore, the temperature distribution within the first predetermined connection portion and the second predetermined connection portion in the initial heating stage of the reflow process can be made uniform, and the solder applied on the first predetermined connection portion and the second predetermined connection portion can be made uniform. The manner in which the paste melts can be adjusted. This prevents the specified electronic component from rotating with the normal direction of the specified substrate as the rotation axis, and also causes the so-called chip standing in which the specified electronic component stands up on one of the specified connections with only one of the specified electrodes. This can be prevented. Therefore, the electrical connection area between the predetermined electrode and the predetermined connection portion can be secured.

Feature B11. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the first predetermined wiring pattern,
The third predetermined wiring pattern is not connected to a metal region having a larger area than the first predetermined connection portion,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern,
The gaming machine according to feature B9 or B10, wherein the fourth predetermined wiring pattern is not connected to a metal region having a larger area than the second predetermined connection portion.

According to feature B11, of the first predetermined wiring pattern and the third predetermined wiring pattern drawn out from the first predetermined connection portion, only the first predetermined wiring pattern is connected to a metal region having a larger area than the first predetermined connection portion. At the same time, of the second predetermined wiring pattern and the fourth predetermined wiring pattern drawn out from the second predetermined connection part, only the second predetermined wiring pattern is connected to a metal region having a larger area than the second predetermined connection part. ing. Therefore, in the initial heating stage of the reflow process, it is possible to reduce the possibility that a difference will occur between the manner in which the temperature of the first predetermined wiring pattern increases and the manner in which the temperature of the second predetermined wiring pattern increases. Moreover, the third wiring pattern drawn out from the first predetermined connection part and the fourth predetermined wiring pattern drawn out from the second predetermined connection part are not electrically connected to the metal region having a large area. Therefore, in the initial heating stage of the reflow process, it is possible to reduce the possibility that a difference will occur between the manner in which the temperature of the third predetermined wiring pattern increases and the manner in which the temperature of the fourth predetermined wiring pattern increases. This can prevent a difference between the temperature distribution within the first predetermined connection portion and the temperature distribution within the second predetermined connection portion.

Feature B12. The predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, and the bypass capacitor 381 in the fourth embodiment) or a resistor (the bypass capacitor 381 in the first embodiment). The gaming machine according to any one of features B1 to B11, characterized in that the gaming machine is a small chip resistor (87, 101).

According to feature B12, the device has the configuration of feature B1 above, and the direction in which the predetermined wiring pattern is drawn out from the predetermined connection portion is a direction perpendicular or substantially perpendicular to the first direction. Therefore, when distortion occurs on a given board, it is possible to reduce the maximum value of stress that may act on the connection point between the capacitor or resistor and the given board, and to reduce the stress that may act on the capacitor or resistor itself. The maximum value can be reduced. By reducing the maximum value of stress that can act on the connection point between the capacitor or resistor and the predetermined substrate, it is possible to prevent the connection point between the capacitor or resistor and the predetermined substrate from being damaged. Further, by reducing the maximum value of stress that can act on the capacitor or resistor itself, it is possible to prevent the capacitor or resistor itself from being damaged.

Note that for the configuration of features B1 to B12, which one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 Alternatively, one or more configurations may be applied. Thereby, it becomes possible to produce a synergistic effect by the combined configuration.

<Feature C group>
Feature C1. A first predetermined electronic component (the connectors 111 and 112 in the first embodiment, the second LED driver 326, the connector 327, and the LED chips 315 to 325 in the third embodiment) and a second predetermined electronic component smaller than the first predetermined electronic component. A predetermined substrate (first decorative substrate 56) on which electronic components (bypass capacitor 85 and small chip resistor 87 in the first embodiment, bypass capacitor 328 and small chip resistors 331 to 335 in the third embodiment) are mounted. , a gaming machine equipped with a light emitting board 301),
The first predetermined electronic component is mounted on a first predetermined board surface (second mounting surface 95, second light emitting surface 303) side that is one side of the predetermined board,
The second predetermined electronic component is mounted on a second predetermined board surface (first mounting surface 84, first light emitting surface 302) side of the predetermined board opposite to the first predetermined board surface,
A game machine characterized in that, on the second predetermined board surface, the second predetermined electronic component is not mounted in a region on the back side of the region on the first predetermined board surface in which the first predetermined electronic component is mounted. .

According to feature C1, since the second predetermined electronic component is not mounted on the second predetermined board surface on the back side of the region on the first predetermined board surface where the first predetermined electronic component is mounted, When a stress that distorts the predetermined board is applied to the region, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged due to the influence of the stress, and also to prevent the second predetermined electronic component itself from being damaged. can be prevented from happening.

Feature C2. An area on the second predetermined plate surface that is less than a predetermined distance from the area on the back side of the area where the first predetermined electronic component is mounted on the first predetermined plate surface (regions 203 and 204 corresponding to the back side of the connector, corresponding to the back side of the driver) The gaming machine according to feature C1, wherein the second predetermined electronic component is not mounted in the region 354 and the LED back side corresponding regions 361 to 371).

According to feature C2, on the second predetermined board surface, the second predetermined electronic component is also located in an area that is less than the predetermined distance from the area on the back side of the area on the first predetermined board surface where the first predetermined electronic component is mounted. Since the configuration is such that the second predetermined electronic component and the predetermined substrate are It is possible to prevent the connection point from being damaged, and it is also possible to prevent the second predetermined electronic component itself from being damaged.

Feature C3. A specific electronic component (LED chip 310) larger than the second predetermined electronic component is mounted on the second predetermined plate surface side of the predetermined substrate,
On the second predetermined plate surface, the specific electronic component is placed in an area (LED back side corresponding area 368) that is less than a predetermined distance from the area on the back side of the area where the first predetermined electronic component is mounted on the first predetermined plate surface. The gaming machine according to feature C2, wherein the gaming machine is equipped with a component.

According to feature C3, the second predetermined board surface has the configuration of feature C2, and the distance from the region on the back side of the region on the first predetermined board surface in which the first predetermined electronic component is mounted is less than the predetermined distance. In a configuration in which the second predetermined electronic component is not mounted, the specific electronic component is mounted in an area that is less than a predetermined distance from the rear side area. This makes it possible to secure a large area on the second predetermined plate surface in which a specific electronic component larger than the second predetermined electronic component can be placed.

Feature C4. A specific electronic component (LED chip 310) larger than the second predetermined electronic component is mounted on the second predetermined plate surface side of the predetermined substrate,
Features C1 to C3, characterized in that the specific electronic component is mounted on the second predetermined board surface in a region on the back side of the region on the first predetermined board surface in which the first predetermined electronic component is mounted. The gaming machine according to any one of the above.

According to feature C4, the second predetermined electronic component is provided with the configuration of feature C1 above, and the second predetermined electronic component is mounted on the second predetermined board surface in a region on the back side of the region on the first predetermined board surface where the first predetermined electronic component is mounted. In a configuration where there is no configuration, a specific electronic component is mounted in the area on the back side. This makes it possible to secure a large area on the second predetermined plate surface in which a specific electronic component larger than the second predetermined electronic component can be placed.

Feature C5. The predetermined substrate is
a specific connection part connected to the electrode of the first predetermined electronic component (a pad connected to the power supply terminal 348 of the second LED driver 326, a pad connected to the GND terminal 349);
a predetermined connection portion (first pad 382a, second pad 382b) connected to the electrode of the second predetermined electronic component (electrode 381a, 381b of bypass capacitor 381);
a predetermined wiring pattern (second wiring pattern 386b, fourth wiring pattern 386d) that electrically connects the predetermined connection portion and the specific connection portion;
It is equipped with
The predetermined wiring pattern is electrically connected to the predetermined connection portion on the second predetermined board surface outside a region on the back side of the region on the first predetermined board surface in which the first predetermined electronic component is mounted. ,
On the second predetermined board surface, the second predetermined electronic component is mounted in a region on the back side of the region on the first predetermined board surface in which the first predetermined electronic component is mounted (the mounting region of the second LED driver 326). The gaming machine according to any one of features C1 to C4, characterized in that:

According to feature C5, the predetermined wiring pattern is extended on the second predetermined board surface to outside the region on the back side of the region on the first predetermined board surface in which the first predetermined electronic component is mounted, and electrically connected to the predetermined connection portion. By doing so, it is possible to prevent the second predetermined electronic component from being placed in the region on the back side.

Feature C6. The second predetermined electronic component is not mounted in a predetermined outer edge region whose distance from the outer edge of the predetermined substrate is less than a predetermined distance (an area less than 10 mm from the outer edge of the first decorative board 56). The gaming machine according to any one of features C1 to C5.

According to feature C6, on the predetermined substrate, the second predetermined electronic component is arranged avoiding the predetermined outer edge area. Therefore, when handling the predetermined board, the worker's hand may accidentally touch the second predetermined electronic component, resulting in damage to the connection between the second predetermined electronic component and the predetermined board or the second predetermined electronic component itself. The possibility can be reduced. In addition, in a method for manufacturing a predetermined board in which a collective board including a plurality of predetermined boards is divided and a plurality of predetermined boards are taken out, the connection between the second predetermined electronic component and the predetermined board is made when dividing the collective board. It is possible to reduce stress that may act on the location, and also reduce stress that may act on the second predetermined electronic component itself. Thereby, it is possible to prevent the connection portion between the second predetermined electronic component and the predetermined substrate from being damaged when dividing the collective board, and it is also possible to prevent the second predetermined electronic component itself from being damaged.

Feature C7. The gaming machine according to feature C6, wherein the first predetermined electronic component is mounted in the predetermined outer edge area.

According to feature C7, in a configuration having the configuration of feature C6 above, in which the second predetermined electronic component is not mounted in the predetermined outer edge region, by mounting the first predetermined electronic component in the predetermined outer edge region, the predetermined outer edge Compared to a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the region, it is possible to secure a larger area of the region in which the first predetermined electronic component can be mounted on the predetermined substrate.

Feature C8. The predetermined board is provided with a board fixing part (fixing through holes 56d to 56g) for fixing the predetermined board,
Any one of the features C1 to C7 characterized in that the second predetermined electronic component is not mounted in the fixing part surrounding area (the through hole surrounding areas 211a to 211d) whose distance from the board fixing part is less than a specific distance. 1. The gaming machine described in 1.

According to feature C8, since the second predetermined electronic component is arranged avoiding the area around the fixed part, it can act on the connection point between the second predetermined electronic component and the predetermined board when the predetermined board is fixed. Stress can be reduced, and stress that may act on the second predetermined electronic component itself can be reduced.

Feature C9. The gaming machine according to feature C8, characterized in that the first predetermined electronic component is mounted in the peripheral area of the fixed part.

According to feature C9, in a configuration having the configuration of feature C8 above and in which the second predetermined electronic component is not mounted in the region surrounding the fixed portion, by mounting the first predetermined electronic component in the region surrounding the fixed portion, Compared to a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the peripheral area of the fixed part, it is possible to secure a larger area of the region on the predetermined board in which the first predetermined electronic component can be mounted. can.

Feature C10. On the first predetermined plate surface of the predetermined substrate, the second Specified electronic components are not mounted,
The gaming machine according to feature C8 or C9, wherein the board fixing part is provided in the predetermined outer edge area.

According to feature C10, by arranging the fixing portion in the predetermined outer edge region where the second predetermined electronic component cannot be placed, it is possible to secure a large area of the region where the second predetermined electronic component can be mounted on the predetermined substrate. In addition, in a method for manufacturing a predetermined board in which a collective board including a plurality of predetermined boards is divided and a plurality of predetermined boards are taken out, the connection between the second predetermined electronic component and the predetermined board is made when dividing the collective board. It is possible to reduce stress that may act on the location, and also reduce stress that may act on the second predetermined electronic component itself. Thereby, when dividing the collective board, it is possible to prevent the connection portion between the second predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the second predetermined electronic component itself from being damaged. By providing the fixing portion at the outer edge, it is possible to reduce the area of the region on the predetermined substrate where the second predetermined electronic component cannot be mounted.

Feature C11. Any one of features C1 to C10, wherein the first predetermined electronic component is a connector (connectors 111, 112, 327), an IC (second LED driver 326), or an LED chip (LED chips 315 to 325). The gaming machine described in .

According to feature C11, when the first predetermined electronic component is a connector, it is possible to reduce the tensile stress that may act on the connection point between the second predetermined electronic component and the predetermined board when attaching the harness to the connector. , it is possible to reduce compressive stress that may be applied to the connection portion between the second predetermined electronic component and the predetermined board when the harness is removed from the connector. Thereby, when the harness is attached to and detached from the connector, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the second predetermined electronic component itself from being damaged. Furthermore, when the first predetermined electronic component is an IC, since the IC is arranged avoiding the predetermined backside area, when the IC generates heat and thermal stress acts on the predetermined substrate, the stress It is possible to prevent the connection portion between the second predetermined electronic component and the predetermined board from being damaged due to the influence, and it is also possible to prevent the second predetermined electronic component itself from being damaged. Furthermore, when the first predetermined electronic component includes an LED chip, the LED chip is arranged to avoid the predetermined backside area, so the LED chip generates heat and thermal stress is applied to the predetermined substrate. In this case, it is possible to prevent the connection portion between the second predetermined electronic component and the predetermined substrate from being damaged due to the influence of the stress, and also to prevent the second predetermined electronic component itself from being damaged.

Feature C12. The second predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, and the bypass capacitor 381 in the fourth embodiment) or a resistor (the bypass capacitor 381 in the fourth embodiment). The gaming machine according to any one of features C1 to C11, characterized in that the gaming machine is a small chip resistor (87, 101) in the form of a small chip resistor (87, 101).

According to feature C12, a capacitor or a resistor is mounted on the second predetermined board surface in a region on the back side of the region on the first predetermined board surface in which the first predetermined electronic component is mounted. Since the configuration is such that the connection point between the capacitor or resistor and the specified board can be prevented from being damaged due to the influence of the stress when stress that distorts the specified board is applied to the area on the back side, , the capacitor or resistor itself can be prevented from being damaged.

Note that for the configuration of features C1 to C12, which of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 Alternatively, one or more configurations may be applied. Thereby, it becomes possible to produce a synergistic effect by the combined configuration.

<Characteristic group D>
Feature D1. In a gaming machine equipped with predetermined substrates (first decorative substrate 56, second decorative substrate 57, light emitting substrate 301),
The predetermined board includes first predetermined electronic components (the connectors 111 and 112 in the first embodiment, the second LED driver 326, the connector 327, and the LED chips 315 to 325 in the third embodiment) and the first predetermined electronic component. A plurality of second predetermined electronic components smaller than the component (bypass capacitor 85 and small chip resistor 87 in the first embodiment, bypass capacitor 328 and small chip resistors 331 to 335 in the third embodiment) are mounted. has been
The plurality of second predetermined electronic components are mounted on the first board surface (first mounting surface 84, first light emitting surface 302), which is one of the board surfaces of the predetermined board, and A game machine characterized in that the device is not mounted on the second board surface (second mounting surface 95, second light emitting surface 303), which is the opposite board surface from the first board surface.

According to feature D1, the second predetermined electronic components are concentrated on the first board surface side of the predetermined board, and are not mounted on the second board surface side. Therefore, by handling the predetermined board so that the stress acting on the first plate side of the predetermined board is minimized, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged. At the same time, it is possible to prevent the second predetermined electronic component itself from being damaged. For example, in a method for manufacturing a predetermined board in which a plurality of predetermined boards are taken out by dividing a collective board in which a plurality of predetermined boards are connected, the first board surface on which the second predetermined electronic component is mounted has a valley shape (concave). By dividing the collective board so that This can be prevented. Moreover, it is possible to reduce stress that may act on the connection portion between the second predetermined electronic component and the predetermined substrate, and also to reduce stress that may act on the second predetermined electronic component itself. Thereby, when the collective board is divided, it is possible to prevent the connection portion between the second predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the second predetermined electronic component itself from being damaged.

Feature D2. A plurality of the first predetermined electronic components are mounted on the predetermined board,
Some of the first predetermined electronic components among the plurality of first predetermined electronic components are mounted on the second plate surface side,
The gaming machine according to feature D1, wherein some of the first predetermined electronic components among the plurality of first predetermined electronic components are mounted on the first board surface side.

According to feature D2, in a configuration in which the first predetermined electronic component is mounted on both the first plate surface side and the second plate surface side of the predetermined board, the plurality of second predetermined electronic components The components are concentrated on the first board side of the predetermined board and are not mounted on the second board side. Even in a configuration in which the first predetermined electronic components are mounted on both the first board surface side and the second board surface side of the predetermined board, the second predetermined electronic components are concentrated on the first board surface side of the predetermined board. Therefore, by handling the predetermined board so that the stress acting on the first plate side of the predetermined board is minimized, the connection point between the second predetermined electronic component and the predetermined board may be damaged. This can be prevented, and the second predetermined electronic component itself can be prevented from being damaged. Furthermore, by adopting a configuration in which the first predetermined electronic component is mounted on both the first board surface side and the second board surface side of the predetermined board, the degree of freedom in arranging the first predetermined electronic component on the predetermined board is increased. be able to.

Feature D3. Feature D1 or D2 characterized in that, on the first plate surface, the second predetermined electronic component is not mounted in an area on the back side of the area on the second plate surface in which the first predetermined electronic component is mounted. The gaming machine described in .

According to feature D3, when a stress that distorts the predetermined board acts on a region on the first board surface that is behind the region on the second board surface in which the first predetermined electronic component is mounted, It is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the second predetermined electronic component itself from being damaged.

Feature D4. The predetermined substrate is
a specific connection part (a pad connected to the power supply terminal 348 of the second LED driver 326, a pad connected to the GND terminal 349) electrically connected to the electrode of the first predetermined electronic component;
A predetermined connection portion (first pad 382a, second pad 382b) electrically connected to the electrode of the second predetermined electronic component (electrode 381a, 381b of bypass capacitor 381),
The gaming machine according to any one of features D1 to D3, wherein the predetermined connection part and the specific connection part are electrically connected.

According to feature D4, the second predetermined electronic component that is electrically connected to the first predetermined electronic component mounted on the second board surface is mounted on the first board surface opposite to the second board surface. By arranging the second predetermined electronic components on the first plate side, the second predetermined electronic components can be concentrated on the first plate side, and a configuration can be obtained in which the second predetermined electronic components are not mounted on the second plate side.

Feature D5. The predetermined substrate is
a specific connection part connected to the electrode of the first predetermined electronic component (a pad connected to the power supply terminal 348 of the second LED driver 326, a pad connected to the GND terminal 349);
a predetermined connection portion (first pad 382a, second pad 382b) connected to the electrode of the second predetermined electronic component (electrode 381a, 381b of bypass capacitor 381);
a predetermined wiring pattern (second wiring pattern 386b, fourth wiring pattern 386d) that electrically connects the predetermined connection portion and the specific connection portion;
It is equipped with
The predetermined wiring pattern is electrically connected to the predetermined connection portion on the first board surface outside a region on the back side of the region on the second board surface in which the first predetermined electronic component is mounted,
On the first board surface, the second predetermined electronic component is not mounted in a region on the back side of the region on the second board surface in which the first predetermined electronic component is mounted (the mounting region of the second LED driver 326). The gaming machine according to any one of features D1 to D4.

According to feature D5, the predetermined wiring pattern is extended on the first board surface to outside the region on the back side of the region on the second board surface in which the first predetermined electronic component is mounted, and electrically connected to the predetermined connection portion. Accordingly, it is possible to prevent the second predetermined electronic component from being placed in the region on the back side.

Feature D6. The second predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, and the bypass capacitor 381 in the fourth embodiment) or a resistor (the bypass capacitor 381 in the fourth embodiment). The gaming machine according to any one of features D1 to D5, characterized in that the gaming machine is a small chip resistor (87, 101) in the form of a small chip resistor (87, 101).

According to feature D6, the device has the configuration of feature D1 above, and the capacitors or resistors are concentrated on the first board side of the predetermined board and are not mounted on the second board side. Therefore, by handling a given board so that the stress acting on the first plate side of the given board is minimized, it is possible to prevent damage to the connection point between the capacitor or resistor and the given board, and , the capacitor or resistor itself can be prevented from being damaged. For example, in a method for manufacturing a predetermined board in which a plurality of predetermined boards are taken out by dividing a collective board in which a plurality of predetermined boards are connected, the first board surface on which a capacitor or resistor is mounted has a valley shape (concave). By splitting the collective board so that can do. Further, it is possible to reduce stress that may act on the connection point between the capacitor or resistor and a predetermined substrate, and it is also possible to reduce stress that may act on the capacitor or resistor itself. Thereby, when dividing the collective board, it is possible to prevent damage to the connecting portion between the capacitor or resistor and the predetermined board, and also to prevent damage to the capacitor or resistor itself.

Feature D7. The second predetermined electronic component is not mounted in a predetermined outer edge region whose distance from the outer edge of the predetermined substrate is less than a predetermined distance (an area less than 10 mm from the outer edge of the first decorative board 56). The gaming machine according to any one of features D1 to D6.

According to feature D7, on the predetermined substrate, the second predetermined electronic component is arranged avoiding the predetermined outer edge area. Therefore, when handling the predetermined board, the worker's hand may accidentally touch the second predetermined electronic component, resulting in damage to the connection between the second predetermined electronic component and the predetermined board or the second predetermined electronic component itself. The possibility can be reduced. In addition, in a method for manufacturing a predetermined board in which a collective board including a plurality of predetermined boards is divided and a plurality of predetermined boards are taken out, the connection between the second predetermined electronic component and the predetermined board is made when dividing the collective board. It is possible to reduce stress that may act on the location, and also reduce stress that may act on the second predetermined electronic component itself. Thereby, it is possible to prevent the connection portion between the second predetermined electronic component and the predetermined substrate from being damaged when dividing the collective board, and it is also possible to prevent the second predetermined electronic component itself from being damaged.

Feature D8. The gaming machine according to feature D7, wherein the first predetermined electronic component is mounted in the predetermined outer edge area.

According to feature D8, in a configuration having the configuration of feature D7 above, in which the second predetermined electronic component is not mounted in the predetermined outer edge region, by mounting the first predetermined electronic component in the predetermined outer edge region, the predetermined outer edge Compared to a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the region, it is possible to secure a larger area of the region in which the first predetermined electronic component can be mounted on the predetermined substrate.

Feature D9. The predetermined board is provided with a board fixing part (fixing through holes 56d to 56g) for fixing the predetermined board,
Features D1 to D8 are characterized in that the second predetermined electronic component is arranged avoiding a fixing part surrounding area (through hole surrounding areas 211a to 211d) whose distance from the board fixing part is less than a specific distance. The gaming machine according to any one of the above.

According to feature D9, since the second predetermined electronic component is arranged avoiding the area around the fixing part, it can act on the connection point between the second predetermined electronic component and the predetermined substrate when the predetermined board is fixed. Stress can be reduced, and stress that may act on the second predetermined electronic component itself can be reduced.

Feature D10. The gaming machine according to feature D9, wherein the first predetermined electronic component is mounted in the peripheral area of the fixed part.

According to feature D10, in a configuration having the configuration of feature D9 above and in which the second predetermined electronic component is not mounted in the region surrounding the fixed portion, by mounting the first predetermined electronic component in the region surrounding the fixed portion, Compared to a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the peripheral area of the fixed portion, it is possible to secure a larger area of the region on the predetermined board in which the first predetermined electronic component can be mounted. can.

Feature D11. On the first plate surface of the predetermined substrate, in a predetermined outer edge region (an area less than 10 mm from the outer edge of the first decorative substrate 56) that is less than a predetermined distance from the outer edge of the predetermined substrate, the second predetermined No electronic components are mounted,
The gaming machine according to feature D9 or D10, wherein the board fixing part is provided in the predetermined outer edge area.

According to feature D11, by arranging the fixing portion in the predetermined outer edge area where the second predetermined electronic component cannot be placed, it is possible to secure a large area of the region where the second predetermined electronic component can be mounted on the predetermined substrate. In addition, in a method for manufacturing a predetermined board in which a collective board including a plurality of predetermined boards is divided and a plurality of predetermined boards are taken out, the connection between the second predetermined electronic component and the predetermined board is made when dividing the collective board. It is possible to reduce stress that may act on the location, and also reduce stress that may act on the second predetermined electronic component itself. Thereby, it is possible to prevent the connection portion between the second predetermined electronic component and the predetermined substrate from being damaged when dividing the collective board, and it is also possible to prevent the second predetermined electronic component itself from being damaged. By providing the fixing portion at the outer edge, it is possible to reduce the area of the region on the predetermined substrate where the second predetermined electronic component cannot be mounted.

Feature D12. A specific capacitor (bypass capacitor 352 in the third embodiment) is mounted as the first predetermined electronic component on the second board side of the predetermined board, and the first board is mounted on the first board side of the predetermined board. 2. A configuration in which a predetermined capacitor (bypass capacitor 328 in the third embodiment) is mounted as a predetermined electronic component, and a specific resistor (a third chip resistors 336 to 346 in the embodiment) are mounted as the second predetermined electronic component on the first plate surface side of the predetermined substrate (small chip resistor 331 in the third embodiment). - 335), the gaming machine according to any one of features D1 to D11, characterized in that the gaming machine is equipped with at least one of the configurations in which 335) is implemented.

According to feature D12, in a configuration in which a specific capacitor as a first predetermined electronic component and a predetermined capacitor as a second predetermined electronic component are mounted on a predetermined board, by arranging the predetermined capacitor on the first board surface side. , the second predetermined electronic components can be concentrated on the first plate side, and the second predetermined electronic components can not be mounted on the second plate side. Furthermore, in a configuration in which a specific resistor as a first predetermined electronic component and a predetermined resistor as a second predetermined electronic component are mounted on a predetermined board, by arranging the predetermined resistor on the first board surface side, The second predetermined electronic components can be concentrated on the first plate side, and the second predetermined electronic components can not be mounted on the second plate side.

Note that for the configuration of features D1 to D12, which of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 Alternatively, one or more configurations may be applied. Thereby, it becomes possible to produce a synergistic effect by the combined configuration.

<Characteristic group E>
Feature E1. In a gaming machine equipped with a predetermined board (first decorative board 56),
The predetermined board includes a first predetermined electronic component (LED driver 126, LED chip 142) and a second predetermined electronic component (bypass capacitor 85, small chip resistor 87) smaller than the first predetermined electronic component. It has been implemented,
A plurality of connection parts (a first pad 178a, a second pad 178b) A resist is provided between the
A plurality of connection portions (a first pad 171a, a first pad 176a) to which a plurality of electrodes (first electrodes 85a, 87a, second electrodes 85b, 87b) of the second predetermined electronic component are electrically connected on the predetermined substrate. , the second pad 171b, and the second pad 176b), the resist is not provided between them;
Around the area on the predetermined substrate in which the first predetermined electronic component is mounted, an outer shape display (outer shape silk 213, 215) is provided to partition the area,
A game machine characterized in that, on the predetermined board, no external shape display is provided around the area in which the second predetermined electronic component is mounted to partition the area.

According to feature E1, during visual confirmation after mounting the first predetermined electronic component and the second predetermined electronic component, the outer shape display provided around the first predetermined electronic component is used to check the appearance of the first predetermined electronic component. It is possible to check whether there is a mounting omission or not, and it is also possible to check whether a positional shift of the first predetermined electronic component has occurred. By having a configuration in which no external shape display is provided around the second predetermined electronic component, it is possible to prevent a gap from forming between the predetermined substrate and the metal mask in the area where the second predetermined electronic component is mounted. . This can prevent the solder paste from entering between the connection parts to which no resist is applied and causing electrical contact between the two connection parts.

Feature E2. On the predetermined board, outside the area where the second predetermined electronic component is mounted, there is a component identification display (identification silk) indicating that the electronic component mounted in the area is the second predetermined electronic component. 217, 218), the gaming machine according to feature E1.

According to feature E2, it is possible to visually confirm that the electronic component mounted on the predetermined board is the second predetermined electronic component based on the component identification display. Further, in a configuration having the configuration of feature E1 described above and in which no external shape display is provided around the area on the predetermined board in which the second predetermined electronic component is mounted to partition the area, the second predetermined electronic component may be displayed based on the component identification display. It is possible to confirm whether or not a predetermined electronic component is mounted.

Feature E3. Outside the area where the first predetermined electronic component is mounted on the predetermined board, there is a first component identification display (for identification purposes) indicating that the electronic component mounted in the area is the first predetermined electronic component. Silk 214, 216) are provided,
Outside the area where the second predetermined electronic component is mounted on the predetermined board, there is a second component identification display (for identification) indicating that the electronic component mounted in the area is the second predetermined electronic component. Silk 217, 218) is provided,
The gaming machine according to feature E1 or E2, wherein the font size of the second component identification display is the same as the font size of the first component identification display.

According to feature E3, it is possible to visually confirm that the electronic component mounted on the predetermined board is the first predetermined electronic component based on the first component identification display, and the second component identification display Based on this, it is possible to visually confirm that the electronic component mounted on the predetermined substrate is the second predetermined electronic component. Further, in a configuration having the configuration of feature E1 described above and in which no external shape display is provided around the area on the predetermined board in which the second predetermined electronic component is mounted to partition the area, the second predetermined electronic component may be displayed based on the component identification display. It is possible to confirm whether or not a predetermined electronic component is mounted.

The second predetermined electronic component has the configuration of feature E1 described above, and the second predetermined electronic component is smaller than the first predetermined electronic component, but the font size of the second component identification display is the same as the font size of the first component identification display. Therefore, it is possible to easily visually confirm that the electronic component mounted on the predetermined substrate is the second predetermined electronic component.

Feature E4. A predetermined control component (LED driver 126 in the first embodiment, second LED driver 326 in the fourth embodiment) is mounted on the predetermined board,
The predetermined substrate is
a predetermined connection part (second pad 171b, 382b) electrically connected to the electrode of the second predetermined electronic component (second electrode 85b of bypass capacitor 85, second electrode 381b of bypass capacitor 381);
A specific connection part (a pad electrically connected to the power terminal 151, a pad electrically connected to the power terminal 348) that is electrically connected to the predetermined terminal (power terminal 151, 348) of the predetermined control component. )and,
It is equipped with
The predetermined connection portion and the specific connection portion are electrically connected,
The gaming machine according to any one of features E1 to E3, wherein no control component (IC) other than the predetermined control component is disposed between the predetermined terminal and the second predetermined electronic component. .

According to feature E4, it is possible to prevent other control components from malfunctioning due to the influence of noise components at a predetermined terminal of a predetermined control component.

Feature E5. The gaming machine according to feature E4, wherein no electronic component other than the predetermined control component is disposed between the predetermined terminal and the second predetermined electronic component.

According to feature E5, it is possible to prevent other electronic components from malfunctioning due to the influence of noise components at a predetermined terminal of a predetermined control component.

Feature E6. The second predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, and the bypass capacitor 381 in the fourth embodiment) or a resistor (the bypass capacitor 381 in the fourth embodiment). The gaming machine according to any one of features E1 to E5, characterized in that the gaming machine is a small chip resistor (87, 101) in the form of a small chip resistor (87, 101).

According to feature E6, which has the configuration of feature E1, it is possible to prevent a gap from forming between the predetermined substrate and the metal mask in the region where the capacitor or resistor is mounted. This can prevent the solder paste from entering between the connection parts to which no resist is applied and causing electrical contact between the two connection parts.

Note that for the configuration of features E1 to E6, which of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 Alternatively, one or more configurations may be applied. Thereby, it becomes possible to produce a synergistic effect by the combined configuration.

<Characteristic group F>
Feature F1. Predetermined substrates (first decorative substrate 56, second decorative substrate 56, second In a gaming machine equipped with a decorative board 57 and a light emitting board 301,
The predetermined electronic component has dimensions in a first direction (longitudinal direction of the bypass capacitors 85, 97, 381, longitudinal direction of the small chip resistors 87, 101) perpendicular to the thickness direction of the predetermined electronic component. It is configured to be larger than the dimension in the second direction (the width direction of the bypass capacitors 85, 97, 381, the width direction of the small chip resistors 87, 101) perpendicular to the thickness direction of the component,
The predetermined substrate has dimensions in a predetermined direction (first direction DR1, long axis directions LD, LDA) along the plate surface of the predetermined substrate, which are in the direction along the plate surface of the predetermined substrate and in the predetermined direction. It has a configuration that is larger than the dimensions in a specific direction (second direction DR2, short axis direction SD, SDA) that is orthogonal,
A gaming machine characterized in that the predetermined electronic component is mounted on the predetermined substrate such that the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined substrate.

According to feature F1, since the predetermined electronic component is mounted on the predetermined substrate such that the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined substrate, the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined substrate. Compared to a configuration in which the predetermined electronic component is mounted on the predetermined board in a manner that is not parallel to the predetermined direction of the predetermined board, when distortion occurs in the predetermined board, it may act on the connection point between the predetermined electronic component and the predetermined board. Stress can be reduced, and stress that can act on the predetermined electronic component itself can be reduced. Thereby, it is possible to prevent the connection portion between the predetermined electronic component and the predetermined board from being damaged. Further, by reducing stress that may act on the predetermined electronic component itself when distortion occurs in the predetermined substrate, it is possible to prevent the predetermined electronic component itself from being damaged.

Feature F2. The predetermined board includes specific electronic components (LED chips 317, 324, chip resistors 338, 345) larger than the predetermined electronic components,
The specific electronic component has dimensions in a first specific direction (longitudinal direction of LED chips 317, 324, longitudinal direction of chip resistors 338, 345) perpendicular to the thickness direction of the specific electronic component. It is configured to be larger than the dimension in a specific second direction (the width direction of the LED chips 317, 324, the width direction of the chip resistors 338, 345) perpendicular to the thickness direction,
The gaming machine according to feature F1, wherein the specific electronic component is mounted on the predetermined board in such a manner that the specific first direction of the specific electronic component is not parallel to the predetermined direction of the predetermined board. .

According to feature F2, in a configuration in which the specific electronic component is mounted on the predetermined board in such a manner that the specific first direction of the specific electronic component is not parallel to the predetermined direction of the predetermined board, The electronic component is mounted on the predetermined substrate such that a first direction of the predetermined electronic component is parallel to a predetermined direction of the predetermined substrate. For this reason, in a configuration in which stress that may act on the connection point between the predetermined electronic component and the predetermined board and stress that may act on the predetermined electronic component itself when distortion occurs on the predetermined board, the specific electronic component on the predetermined board is reduced. The degree of freedom in implementation can be increased.

Feature F3. The gaming machine according to feature F1 or F2, wherein the external shape of the predetermined board is not rectangular or substantially rectangular.

According to feature F3, in a configuration in which the external shape of the predetermined substrate is not rectangular or substantially rectangular, the predetermined electronic component has the configuration of feature F1, and the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined substrate. It is mounted on a predetermined board in such a manner. For this reason, compared to a configuration in which the first direction of the predetermined electronic component is perpendicular to the predetermined direction of the predetermined board, stress that may act on the connection point between the predetermined electronic component and the predetermined board when distortion occurs in the predetermined board In addition, it is possible to reduce the stress that may act on the predetermined electronic component itself.

Feature F4. The predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, and the bypass capacitor 381 in the fourth embodiment) or a resistor (the bypass capacitor 381 in the first embodiment). The gaming machine according to any one of features F1 to F3, characterized in that the gaming machine is a small chip resistor (87, 101).

According to feature F4, compared to a structure having the configuration of feature F1 above, the capacitor or resistor is mounted on the predetermined substrate in such a manner that the first direction of the capacitor or resistor is not parallel to the predetermined direction of the predetermined substrate. Therefore, it is possible to reduce the stress that may act on the connection point between the capacitor or resistor and the predetermined substrate when distortion occurs on the predetermined substrate, and it is also possible to reduce the stress that may act on the capacitor or resistor itself. . By reducing the stress that may act on the connection point between the capacitor or resistor and the predetermined substrate when distortion occurs in the predetermined substrate, it is possible to prevent the connection point between the capacitor or resistor and the predetermined substrate from being damaged. Furthermore, by reducing the stress that may act on the capacitor or resistor itself when a given substrate is distorted, it is possible to prevent the capacitor or resistor itself from being damaged.

Feature F5. The predetermined substrate is
Predetermined connection portions (first pads 171a, 176a, 293a, 382a) to which the electrodes (first electrodes 85a, 87a, 291a, 381a, second electrodes 85b, 87b, 291b, 381b) of the predetermined electronic components are electrically connected; , second pads 171b, 176b, 293b, 382b),
Predetermined wiring patterns drawn out from the predetermined connection portions (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b, second wiring patterns 181b, third wiring patterns 172c, 294c, 386c) , fourth wiring patterns 172d, 294d, 386d),
It is equipped with
The gaming machine according to any one of features F1 to F4, wherein the direction in which the predetermined wiring pattern is drawn out from the predetermined connection portion is a direction perpendicular or substantially perpendicular to the first direction.

According to feature F5, the predetermined wiring pattern extends in a direction perpendicular or substantially perpendicular to the first direction. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced. Thereby, it is possible to prevent the connection portion between the predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the predetermined electronic component itself from being damaged.

Feature F6. The predetermined connection portion and the predetermined wiring pattern are provided on a predetermined mounting surface (first mounting surface 84 of the first decorative board 56) that is one side of the predetermined board,
The gaming machine according to feature F5, wherein the predetermined wiring pattern is a wiring pattern that extends linearly on the predetermined mounting surface.

According to feature F6, the predetermined wiring pattern extends linearly on the predetermined mounting surface. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced. Thereby, it is possible to prevent the connection portion between the predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the predetermined electronic component itself from being damaged.

Feature F7. The predetermined substrate has non-penetrating predetermined via holes (via holes 174, 175) extending from the predetermined mounting surface in the thickness direction of the predetermined substrate, or predetermined through holes (first through hole 383) that penetrate the predetermined substrate in the thickness direction. , a second through hole 384),
The gaming machine according to feature F6, wherein the predetermined wiring pattern is a linear wiring pattern that electrically connects the predetermined connection portion and the predetermined via hole or the predetermined through hole on the predetermined mounting surface. .

According to feature F7, when a predetermined via hole or a predetermined through hole is provided on a predetermined board and the predetermined wiring pattern is a straight wiring pattern, when distortion occurs in the predetermined board, the connection between the predetermined electronic component and the predetermined board is prevented. It is possible to reduce the maximum value of stress that can act on a location, and also reduce the maximum value of stress that can act on a predetermined electronic component itself.

Feature F8. The predetermined electronic component includes a first predetermined electrode (first electrode 85a, 87a, 291a, 381a) and a second predetermined electrode (second electrode 85b, 87b, 291b, 381b),
The predetermined substrate is
a first predetermined connection portion (first pads 171a, 176a, 293a, 382a) to which the first predetermined electrode is electrically connected;
a first predetermined wiring pattern (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b) electrically connected to the first predetermined connection portion;
a second predetermined connection portion (second pads 171b, 176b, 293b, 382b) to which the second predetermined electrode is electrically connected;
a second predetermined wiring pattern (second wiring pattern 181b, third wiring pattern 172c, 294c, 386c, fourth wiring pattern 172d, 294d, 386d) electrically connected to the second predetermined connection portion;
It is equipped with
The direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion are directions orthogonal to the first direction of the predetermined electronic component. or the gaming machine according to any one of features F1 to F7, characterized in that the directions are substantially perpendicular to each other.

According to feature F8, the direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion are perpendicular or substantially perpendicular to the first direction. It is the direction. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced. Thereby, it is possible to prevent the connection portion between the predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the predetermined electronic component itself from being damaged.

Feature F9. The direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion when viewed from the center of the second predetermined connection portion. The gaming machine according to feature F8, characterized in that the direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out exists.

According to feature F9, the temperature distribution within the first predetermined connection portion and the second predetermined connection portion can be made uniform in the initial heating stage of the reflow process, and the temperature distribution within the first predetermined connection portion and the second predetermined connection portion can be made uniform. The manner in which the solder paste melts can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined board as the rotation axis, and also to prevent the predetermined electronic component from rotating on one connection portion (the first predetermined connection portion or the second predetermined connection portion). It is possible to prevent so-called chip standing from occurring where only one electrode (the first predetermined electrode or the second predetermined electrode) stands up. Therefore, it is possible to ensure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is also possible to ensure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature F10. The game machine according to feature F8 or F9, wherein the predetermined electronic component includes the first predetermined electrode and the second predetermined electrode as a pair of electrodes.

According to feature F10, the direction in which the position where the first predetermined wiring pattern is drawn out from the first predetermined connection portion is located is the second predetermined connection portion when viewed from the center of the first predetermined connection portion. Since the direction is the same as the direction in which the second predetermined wiring pattern is pulled out from the second predetermined connection portion when viewed from the center of The temperature distribution within the connection portion can be made uniform, and the manner in which the solder paste applied on the pair of first predetermined connection portion and second predetermined connection portion is melted can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined board as the rotation axis, and also to prevent the predetermined electronic component from rotating on one connection portion (the first predetermined connection portion or the second predetermined connection portion). It is possible to prevent so-called chip standing from occurring where only one electrode (the first predetermined electrode or the second predetermined electrode) stands up. Therefore, it is possible to ensure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is also possible to ensure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature F11. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the first predetermined wiring pattern,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern. The gaming machine according to any one of features F8 to F10.

According to feature F11, the predetermined wiring pattern is electrically connected to a metal region with a large area (first metal region or second metal region) at a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). (The first predetermined wiring pattern or the second predetermined wiring pattern) on the side where the lead-out part is present tends to have a delayed temperature rise in the initial heating stage of the reflow process, but when viewed from the center of the first predetermined connection part, The direction in which the side where the temperature rise is likely to be delayed is the same direction as the side where the temperature rise is likely to be delayed in the initial stage of heating when viewed from the center of the second predetermined connection portion. Thereby, the temperature distribution within the first predetermined connection portion and the second predetermined connection portion at the initial stage of heating can be made uniform.

Feature F12. The wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern,
The gaming machine according to any one of features F8 to F11, wherein the wiring pattern drawn out from the second predetermined connection portion is only the second predetermined wiring pattern.

According to feature F12, the structure of feature F8 is provided, and the direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is drawn out from the second predetermined connection portion are in the first direction. In the configuration in which the directions are orthogonal or substantially orthogonal, the wiring pattern drawn out from the first predetermined connection part is only the first predetermined wiring pattern, and the wiring pattern drawn out from the second predetermined connection part is Only the second predetermined wiring pattern. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced.

Feature F13. The predetermined substrate is
a third predetermined wiring pattern (second wiring patterns 172b, 294b, 386b) drawn out from the first predetermined connection portion;
a fourth predetermined wiring pattern (fourth wiring patterns 172d, 294d, 386d) drawn out from the second predetermined connection portion;
It is equipped with
The direction in which the third predetermined wiring pattern is drawn out from the first predetermined connection portion and the direction in which the fourth predetermined wiring pattern is drawn out from the second predetermined connection portion are directions perpendicular to the first direction of the predetermined electronic component. or the gaming machine according to any one of features F8 to F11, characterized in that the directions are substantially perpendicular to each other.

According to feature F13, the first predetermined wiring pattern, the second predetermined wiring pattern, the third predetermined wiring pattern, and the fourth predetermined wiring pattern extend in a direction perpendicular to or substantially perpendicular to the first direction. Therefore, when distortion occurs in a given board, it is possible to reduce the maximum value of stress that can act on the connection between a given electronic component and a given board, and also reduce the maximum value of stress that can act on the given electronic component itself. can be reduced. As a result, it is possible to prevent the connection portion between the predetermined electronic component and the predetermined board from being damaged, and it is also possible to prevent the predetermined electronic component itself from being damaged.

Feature F14. The direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion when viewed from the center of the second predetermined connection portion. The direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out exists;
The direction in which the side of the first predetermined connection portion from which the third predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the direction in which the side of the first predetermined connection portion is located when viewed from the center of the second predetermined connection portion. The gaming machine according to feature F13, characterized in that the direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out exists.

According to feature F14, it is possible to equalize the temperature distribution within the pair of first predetermined connection portions and the second predetermined connection portions in the initial heating stage of the reflow process, and also to make the temperature distribution over the first predetermined connection portions and the second predetermined connection portions uniform. The manner in which the solder paste applied to the solder paste melts can be made uniform. This prevents the specified electronic component from rotating with the normal direction of the specified substrate as the rotation axis, and also causes the so-called chip standing in which the specified electronic component stands up on one of the specified connections with only one of the specified electrodes. This can be prevented. Therefore, the electrical connection area between the predetermined electrode and the predetermined connection portion can be secured.

Feature F15. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the predetermined wiring pattern,
The third predetermined wiring pattern is not electrically connected to a metal region having a larger area than the first predetermined connection portion,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the predetermined wiring pattern,
The gaming machine according to feature F13 or F14, wherein the fourth predetermined wiring pattern is not electrically connected to a metal region having a larger area than the second predetermined connection portion.

According to feature F15, the predetermined wiring pattern is electrically connected to a metal region with a large area (first metal region or second metal region) at a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). (The first predetermined wiring pattern or the second predetermined wiring pattern) on the side where the lead-out part is present tends to have a delayed temperature rise in the initial heating stage of the reflow process, but when viewed from the center of the first predetermined connection part, The direction in which the side where the temperature rise is likely to be delayed is the same direction as the side where the temperature rise is likely to be delayed in the initial stage of heating when viewed from the center of the second predetermined connection portion. Furthermore, when viewed from the center of the first predetermined connection portion, the direction in which the side where the third predetermined wiring pattern is drawn out from the first predetermined connection portion that is not electrically connected to the metal region with a large area exists is , the same direction as the side where the fourth predetermined wiring pattern that is not electrically connected to the metal region with a large area is drawn out from the second predetermined connection portion when viewed from the center of the second predetermined connection portion. The direction is Therefore, the temperature distribution within the first predetermined connection portion and the second predetermined connection portion at the initial stage of heating can be made equal.

Note that for the configuration of features F1 to F15, which of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 Alternatively, one or more configurations may be applied. Thereby, it becomes possible to produce a synergistic effect by the combined configuration.

<Feature G group>
Feature G1. Predetermined control components (LED driver 126 in the first embodiment, second LED driver 326 in the fourth embodiment) and predetermined capacitors (bypass capacitor 85 in the first embodiment, bypass capacitor 381 in the fourth embodiment) In a game machine equipped with a predetermined board (first decorative board 56, light emitting board 301),
The predetermined board has power supply wiring patterns (third wiring patterns 172c, 386c, fourth wiring patterns 172d, 386d),
The predetermined capacitor is electrically connected to the power supply wiring pattern and the ground (GND plane layer 93),
A game machine characterized in that no control component (IC) other than the predetermined control component is disposed between the predetermined terminal and the predetermined capacitor.

Feature G1. By allowing the predetermined capacitor to absorb the noise component of the drive power supplied to the predetermined terminal of the predetermined control component, it is possible to prevent the predetermined control component from malfunctioning due to the influence of the noise component. Further, by absorbing the noise component generated from the predetermined control component into the predetermined capacitor, it is possible to prevent other electronic components from malfunctioning due to the influence of the noise component.

Note that for the configuration of feature G1, any one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 Alternatively, multiple configurations may be applied. Thereby, it becomes possible to produce a synergistic effect by the combined configuration.

<Feature H group>
Feature H1. In a gaming machine equipped with a predetermined board (first decorative board 56),
The predetermined board includes a first predetermined electronic component (the LED driver 126 and the LED chip 142 in the first embodiment) and a second predetermined electronic component smaller than the first predetermined electronic component (the bypass in the first embodiment). A capacitor 85, a small chip resistor 87) are mounted,
Around the area on the predetermined substrate in which the first predetermined electronic component is mounted, an outer shape display (outer shape silk 213, 215) is provided to partition the area,
A game machine characterized in that, on the predetermined board, no external shape display is provided around the area in which the second predetermined electronic component is mounted to partition the area.

According to feature H1, in visual confirmation after mounting the first predetermined electronic component and the second predetermined electronic component, the outer shape display provided around the first predetermined electronic component is used to remove the first predetermined electronic component. It is possible to check whether there is any omission in the mounting of the electronic component, and it is also possible to check whether or not the first predetermined electronic component is misaligned. In a configuration where the second predetermined electronic component is smaller than the first predetermined electronic component, by not providing an external shape indication around the second predetermined electronic component, it is possible that the predetermined electronic component is not actually mounted during the visual confirmation. It is possible to prevent an operator from erroneously recognizing that a predetermined electronic component is mounted by looking only at the external display even though the electronic component is mounted.

Note that for the configuration of feature H1, any one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 Alternatively, multiple configurations may be applied. Thereby, it becomes possible to produce a synergistic effect by the combined configuration.

According to the invention relating to the above feature A group, the above feature B group, the above feature C group, the above feature D group, the above feature E group, the above feature F group, the above feature G group, and the above feature H group, the following problems can be solved. It is possible to solve it.

Pachinko machines, slot machines, and the like are known as types of gaming machines. These gaming machines are known to have a configuration in which a lottery is held based on the fulfillment of predetermined lottery conditions, and a bonus is awarded to a player according to the result of the lottery. Further, a general configuration is such that an effect is performed to make the player predict or recognize the result of the lottery. These gaming machines are equipped with a board on which electronic components for advancing the game and electronic components for executing the performance are mounted.

Specifically, regarding pachinko machines, for example, a lottery is held based on a game ball entering a ball entry section provided in a gaming area, a fluctuating pattern is displayed on the display surface of a display device, and a lottery A known configuration is known in which, when a winning result is obtained, a specific combination of symbols is displayed on the display screen for the final time, and a transition is made to a special game state that is advantageous to the player. When the state shifts to the special gaming state, for example, a ball entry device installed in the gaming area starts to open and close, and game balls are paid out based on the ball entering the ball entry device. ing.

Here, in gaming machines such as those exemplified above, it is necessary to suitably mount electronic components on a board, and there is still room for improvement in this respect.

Below, the basic configuration of a gaming machine to which each of the above features can be applied or is applied to each feature will be shown.

Pachinko game machine: an operating means operated by a player, a game ball firing means that fires a game ball based on the operation of the operating means, a ball path that guides the fired game ball to a predetermined gaming area, A game machine comprising game parts arranged within a region, and giving a bonus to a player when a game ball passes through a predetermined passage part of each game part.

A reel-type gaming machine such as a slot machine: equipped with a pattern display device that variably displays a plurality of symbols, the variable display of the plurality of symbols is started due to the operation of the start operation means, and the variable display of the plurality of symbols is started due to the operation of the stop operation means. A gaming machine in which variable display of the plurality of symbols is stopped after the display is stopped or after a predetermined period of time has elapsed, and a bonus is given to a player according to the symbols after the stoppage.

10... Pachinko machine, 56... First decorative board, 56d to 56g... Fixed through hole, 57... Second decorative board, 84... First mounting surface, 85... Bypass capacitor, 85a... First electrode, 85b... Second electrode , 87... Small chip resistor, 87a... First electrode, 87b... Second electrode, 93... GND plane layer, 94... Power plane layer, 95... Second mounting surface, 97... Bypass capacitor, 101... Small chip resistor , 111, 112...Connector, 126...LED driver, 142...LED chip, 142a...First electrode, 142b...Second electrode, 151...Power terminal, 152,153...Terminal, 154...GND terminal, 155-162...Terminal , 171a...first pad, 171b...second pad, 172a...first wiring pattern, 172b...second wiring pattern, 172c...third wiring pattern, 172d...fourth wiring pattern, 174, 175...via hole, 176a...th 1 pad, 176b...Second pad, 178a...First pad, 178b...Second pad, 181a...First wiring pattern, 181b...Second wiring pattern, 203, 204...Connector back side corresponding area, 211a-211d...Through hole Peripheral area, 213... External silk, 214... Identification silk, 215... Outer silk, 216-218... Identification silk, 291... Bypass capacitor, 291a... First electrode, 291b... Second electrode, 293a... First pad, 293b...second pad, 294a...first wiring pattern, 294b...second wiring pattern, 294c...third wiring pattern, 294d...fourth wiring pattern, 301...light emitting board, 302...first light emitting surface, 303...second Light emitting surface, 310...LED chip, 315-325...LED chip, 326...2nd LED driver, 327...connector, 328...bypass capacitor, 331-335...small chip resistor, 336-346...chip resistor, 348...power supply Terminal, 349... GND terminal, 352... Bypass capacitor, 353, 354... Area corresponding to back side of driver, 355, 361 to 371... Area corresponding to back side of LED, 381... Bypass capacitor, 381a... First electrode, 381b... Second electrode, 382a ...first pad, 382b...second pad, 383...first through hole, 384...second through hole, 386a...first wiring pattern, 386b...second wiring pattern, 386c...third wiring pattern, 386d...fourth Wiring pattern, DR1...first direction, DR2...second direction, LD, LDA...long axis direction, SD, SDA...short axis direction.

Claims (1)

In a gaming machine equipped with a predetermined board,
A first predetermined electronic component and a second predetermined electronic component smaller than the first predetermined electronic component are mounted on the predetermined substrate,
A resist is provided on the predetermined substrate between a plurality of connection parts to which the plurality of electrodes of the first predetermined electronic component are electrically connected,
The resist is not provided between a plurality of connection parts to which a plurality of electrodes of the second predetermined electronic component are electrically connected on the predetermined substrate,
An external shape display is provided around the area on the predetermined substrate in which the first predetermined electronic component is mounted, and the outer shape is provided to partition the area.
No external shape display is provided around the area on the predetermined substrate in which the second predetermined electronic component is mounted, and the outer shape is not provided to partition the area;
In the predetermined board, a component identification display is provided outside the area where the second predetermined electronic component is mounted, indicating that the electronic component mounted in the area is the second predetermined electronic component. Ori,
A game characterized in that the second predetermined electronic component is not mounted on a board surface on the back side of the board surface on which a specific electronic component is mounted on the predetermined board, and on the back side of the specific electronic component. Machine.

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