JP2021178018A - Game machine - Google Patents

Abstract

To provide a game machine capable of suitably mounting electronic components on a board.SOLUTION: A game machine includes a first decorative board 56 for mounting a connector, and a compact chip component smaller than the connector. The connector is mounted in a second mounting surface side as a plate surface in one side of the first decorative board 56. The compact chip component is mounted in a side of a first mounting surface 84 in a side opposite to the second mounting surface of the first decorative board 56. No compact chip components are mounted in an area in a back side of an area for mounting a connector on the second mounting surface in the first mounting surface 84.SELECTED DRAWING: Figure 8

Description

The present invention relates to a gaming machine.

Pachinko machines, slot machines, and the like are known as a type of gaming machine. In these gaming machines, it is known that a lottery is performed based on the fact that a predetermined lottery condition is satisfied, and a privilege is given to a player according to the result of the lottery. In addition, it is common to have an effect for making the player predict or recognize the result of the lottery. These gaming machines include a substrate on which electronic components for advancing the game and electronic components for executing the effect are mounted.

Specifically, for pachinko machines, for example, a lottery is performed based on the fact that a game ball enters a ball entry portion provided in a game area, and a variable display of a pattern is performed on the display surface of a display device, and the lottery is performed. When the winning result is obtained, the combination of specific patterns and the like is finally stopped and displayed on the display surface, and it is known that the player shifts to a special gaming state that is advantageous to the player. Then, when the state shifts to the special gaming state, for example, opening and closing of the ball entry device provided in the game area is started, and the game ball is paid out based on the entry into the ball entry device. (See, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2012-170465

Here, in a gaming machine such as the above example, it is necessary to mount electronic components on a substrate, and there is still room for improvement in this respect.

The present invention has been made in view of the above-exemplified circumstances and the like, and an object of the present invention is to provide a gaming machine capable of suitably mounting electronic components on a substrate.

The invention according to claim 1 is a gaming machine provided with a predetermined substrate on which a first predetermined electronic component and a second predetermined electronic component smaller than the first predetermined electronic component are mounted.
The first predetermined electronic component is mounted on the first predetermined plate surface side, which is the plate surface on one side of the predetermined substrate.
The second predetermined electronic component is mounted on the second predetermined plate surface side opposite to the first predetermined plate surface of the predetermined substrate.
The second predetermined electronic component is not mounted in the region on the second predetermined plate surface on the back side of the region on the first predetermined plate surface on which the first predetermined electronic component is mounted.

According to the present invention, electronic components can be suitably mounted on a substrate.

It is a front view of the pachinko machine in 1st Embodiment. It is a perspective view which shows the main composition of a pachinko machine in an unfolded manner. It is a perspective view which shows the main composition of a pachinko machine in an unfolded manner. It is a front view which shows the structure of a game board. It is explanatory drawing for demonstrating the composition concerning the discharge of the game ball which flowed down the game area. It is a front view of the main control device. It is a front view of the pachinko machine with the decorative cover and the decorative substrate removed. (A) It is a plan view which shows the 1st mounting surface which is the plate surface of one side of the 1st decorative board, and (b) is the 1st which enlarges and shows the peripheral area of the bypass capacitor mounted on the 1st decorative board. It is a plan view of the 1st mounting surface of a decorative board, and (c) is the plan view of the 1st mounting surface of the 1st decorative board which enlarges and shows the peripheral area of the small chip resistor mounted on the 1st decorative board. be. 8 is a cross-sectional view taken along the line AA of FIG. 8A. (A) It is a plan view which shows the 1st mounting surface which is the plate surface of one side of the 2nd decorative board, and (b) is the 2nd which enlarges and shows the peripheral area of the bypass capacitor mounted on the 2nd decorative board. It is a plan view of the 1st mounting surface of the decorative board, and (c) is the plan view of the 1st mounting surface of the 2nd decorative board which enlarges and shows the peripheral area of the small chip resistor mounted on the 2nd decorative board. be. It is a wiring diagram of the 1st light emitting circuit part in the 1st decorative board. (A) It is a perspective view of the 1st mounting surface side of the 1st decorative board which magnifies the periphery of a bypass capacitor, and (b) is the 1st mounting of the 1st decorative board which enlarges and shows the periphery of a small chip resistor. It is a perspective view of a surface side. (A) It is a plan view of the 1st mounting surface of the 1st decorative board which enlarges and shows the peripheral area of a bypass capacitor, and (b) is the explanatory drawing for explaining the relationship between the pad of the peripheral area and a solder resist. There is, (c) is an explanatory diagram for explaining the movement mode of the bypass capacitor that can occur, and (d) is an explanatory diagram for explaining the movement mode of the bypass capacitor that can occur in the comparative example. (A) It is a plan view of the 1st mounting surface of the 1st decorative substrate which enlarges and shows the peripheral area of a small chip resistor, and (b) the description for demonstrating the relationship between the pad of the peripheral area and a solder resist. It is an explanatory diagram for explaining (c) the movement mode of the small chip resistor which may occur, and (d) explanatory drawing for explaining the movement mode of the small chip resistor which may occur in the comparative example. Is. (A) is a plan view showing the second mounting surface of the first decorative board, and (b) is a plan view of the second mounting surface of the first decorative board showing an enlarged back area of the first light emitting circuit portion. (A) is a cross-sectional view of a first decorative substrate, and (b) is a sectional view of the first decorative substrate in a comparative example. (A) It is a plan view which shows the 1st plate surface of an assembly board, (b) is an explanatory view for explaining the valley division of an assembly board, and (c) is the explanatory view for explaining the mountain division of an assembly board. Is. (A) It is a perspective view of the dividing jig used for dividing an assembly board, (b) is a front view of a dividing jig, and (c) is for explaining how the assembly board is divided using the dividing jig. It is an explanatory diagram of. It is a block diagram which shows the electric structure of a pachinko machine. It is explanatory drawing for demonstrating the contents of various counters used for a winning or failing lottery. It is a flowchart which shows the main process executed by the main CPU. It is a flowchart which shows the timer interrupt processing executed by the main CPU. It is a flowchart which shows the special figure special electric control process which is executed by the main CPU. It is a flowchart which shows the special figure variation start processing executed by the main CPU. (A) It is a plan view which shows the 1st mounting surface of the 1st decorative board in 2nd Embodiment, and (b) is the 1st decoration which enlarges and shows the peripheral area of the bypass capacitor mounted on the 1st decorative board. It is a top view of the 1st mounting surface of a substrate. It is a top view of the 1st light emitting surface of the light emitting substrate in 3rd Embodiment. It is a top view of the 2nd light emitting surface of a light emitting substrate. (A) is a plan view of the first light emitting surface of the light emitting board in the fourth embodiment, and (b) is a plan view of the first light emitting surface of the light emitting board showing an enlarged peripheral region of the bypass capacitor. (A) is a plan view of the second light emitting surface of the light emitting board, and (b) is a plan view of the second light emitting surface of the light emitting board showing an enlarged peripheral region of a power supply terminal and a GND terminal.

<First Embodiment>
Hereinafter, the first embodiment of the pachinko machine 10, which is a kind of gaming machine, will be described in detail with reference to the drawings. FIG. 1 is a front view of the pachinko machine 10, and FIGS. 2 and 3 are perspective views showing the main configurations of the pachinko machine 10 in an expanded manner. Note that, for convenience, the configuration in the gaming area of the pachinko machine 10 is omitted in FIG. 2, and the configuration on the rear side of the pachinko machine 10 of the main control device 60, which will be described later, is omitted in FIG.

As shown in FIG. 1, the pachinko machine 10 includes an outer frame 11 forming an outer shell of the pachinko machine 10 and a gaming machine main body 12 rotatably attached to the outer frame 11 in the forward direction. Have. The outer frame 11 is formed by connecting wooden plates on all four sides and has a rectangular frame shape. The pachinko machine 10 is installed in the game hall by attaching and fixing the outer frame 11 to the island equipment. The outer frame 11 is not an indispensable configuration for the pachinko machine 10, and the outer frame 11 may be provided in the island equipment of the game hall.

As shown in FIGS. 2 and 3, the gaming machine main body 12 includes an inner frame 13, a front door frame 14 arranged in front of the inner frame 13, and a back pack unit 15 arranged behind the inner frame 13. And have. The inner frame 13 of the gaming machine main body 12 is rotatably supported by the outer frame 11. Specifically, the inner frame 13 can rotate forward with the left side as the rotation base end side and the right side as the rotation tip side in front view.

The front door frame 14 is rotatably supported by the inner frame 13, and is rotatable forward with the left side as the rotation base end side and the right side as the rotation tip side in front view. Further, the back pack unit 15 is rotatably supported on the inner frame 13, and is rotatable rearward with the left side as the rotation base end side and the right side as the rotation tip side in front view.

The gaming machine main body 12 is provided with a locking device at the rotating tip portion thereof, and has a function of locking the gaming machine main body 12 to the outer frame 11 so as not to be openable. It has a function of locking the door frame 14 to the inner frame 13 so that it cannot be opened. Each of these locked states is released by performing an unlocking operation using the unlocking key on the cylinder lock 17 exposed on the front surface of the pachinko machine 10.

<Front side configuration>
Next, the configuration of the front side of the gaming machine main body 12 will be described.

The inner frame 13 is mainly composed of a resin base 21 having an outer shape substantially the same as that of the outer frame 11. A substantially elliptical window hole 23 is formed in the central portion of the resin base 21. A game board 24 is detachably attached to the resin base 21. The game board 24 is made of plywood, and the game area PA formed on the front surface of the game board 24 is exposed to the front side of the inner frame 13 through the window hole 23 of the resin base 21.

<Composition of game board>
Here, the configuration of the game board 24 will be described with reference to FIG. FIG. 4 is a front view of the game board 24.

An inner rail portion 25 and an outer rail portion 26 are attached to the game board 24 so as to partition a part of the outer edge of the game area PA, and the guiding means is provided by the inner rail portion 25 and the outer rail portion 26. As a guide rail is configured. The game ball launched from the game ball launching mechanism 27 (see FIG. 2) attached below the window hole 23 in the resin base 21 is guided to the upper part of the game area PA by the guide rail.

By the way, the game ball launch mechanism 27 has a launch rail 27a extending toward the guide rail, a ball feeding device 27b for supplying the game ball stored in the precision plate 54a described later on the launch rail 27a, and the launch rail 27a. It is equipped with a solenoid 27c, which is an electric actuator that launches the game ball supplied to the guide rail toward the guide rail. The solenoid 27c is driven and controlled by the rotation operation of the launch operation device (or operation handle) 28 provided on the front door frame 14, and the game ball is launched.

The game board 24 is formed with a plurality of large and small openings penetrating in the front-rear direction. Each opening is provided with a general winning opening 31, a special electric winning device 32, a first operating port 33, a second operating port 34, a through gate 35, a variable display unit 36, a special drawing unit 37, a normal drawing unit 38, and the like. ing. A total of four general winning openings 31 are provided, and one each is provided for the others.

Even if a ball enters the through gate 35, the game ball is not paid out. On the other hand, when a ball enters the general winning opening 31, the special electric winning device 32, the first operating opening 33, and the second operating opening 34, a predetermined number of game balls are paid out. Specifically, regarding the number of prize balls, when one game ball enters the first operating port 33 or when one game ball enters the second operating port 34. Is executed to pay out one prize ball, and when one game ball is entered into the general winning opening 31, 10 prize balls are paid out to the special electric winning device 32. When one of the game balls is entered, 15 prize balls are paid out.

The number of prize balls is arbitrary. For example, the number of prize balls in the second operating port 34 may be smaller than that in the first operating port 33, and the second operating port 34 is the first operating port. The number of prize balls may be larger than 33.

In addition, an out opening 24a is provided at the lowermost portion of the game board 24, and a game ball that has not entered various winning openings or the like is discharged from the game area PA through the out opening 24a. Further, a large number of nails 24b are planted on the game board 24 in order to appropriately disperse and adjust the falling direction of the game ball, and various members such as a windmill are arranged.

Here, the entry ball means that the game ball passes through a predetermined opening, and not only is the ball discharged from the game area PA after passing through the opening, but also from the game area PA after passing through the opening. A mode in which the flow of the game area PA is continued without being discharged is also included. However, in the following description, in order to clearly distinguish the ball from entering the game ball into the out opening 24a, the general winning opening 31, the special electric winning device 32, the first operating port 33, the second operating port 34, and the through gate 35 The entry of a game ball into a game is also referred to as a prize.

The first operating port 33 and the second operating port 34 are unitized as an operating port device and installed on the game board 24. Both the first actuating port 33 and the second actuating port 34 are open upward. Further, both the operating ports 33 and 34 are arranged in the vertical direction so that the first operating port 33 faces upward. The second actuating port 34 is provided with a universal electric accessory 34a as a guide piece made of a pair of left and right movable pieces. In the closed state of the general electric accessory 34a, the game ball cannot win the prize in the second operating port 34, and when the general electric accessory 34a is in the open state, the prize can be won in the second operating port 34.

A through gate 35 is provided on the upstream side of the second operating port 34 in the flow direction of the game ball. The through gate 35 has a through hole (not shown) penetrating in the vertical direction, and the game ball winning the through gate 35 flows down the game area PA after winning. As a result, the game ball that has won the through gate 35 can win the second operating port 34.

Based on the winning of the through gate 35, the universal electric accessory 34a of the second operating port 34 is switched from the closed state to the open state. Specifically, an internal lottery is performed triggered by winning a prize in the through gate 35, and a normal map display of the normal map unit 38 provided in the lower right corner, which is an area where the game ball does not pass in the game area PA. The variable display of the pattern is performed in the part 38a. Then, when the result of the internal lottery is the winning of the electric service opening, the stop result corresponding to the result is displayed, and the variable display of the general map display unit 38a is completed, the state shifts to the general electric opening state. In the open state of the normal electric power, the public electric accessory 34a is in the open state in a predetermined manner.

The normal figure display unit 38a is composed of a segment display in which a plurality of display segments by LEDs are arranged in a predetermined manner, but the present invention is not limited to this, and the liquid crystal display device and the organic EL are used. It may be composed of a display device, a CRT, a dot matrix display, or other type of display device. Further, as the pattern to be variablely displayed on the general map display unit 38a, a configuration in which a plurality of types of characters are variablely displayed, a configuration in which a plurality of types of symbols are variablely displayed, a configuration in which a plurality of types of characters are variablely displayed, or a configuration in which a plurality of types of characters are variablely displayed. A configuration in which multiple types of colors are switched and displayed can be considered.

In the normal drawing unit 38, a normal drawing holding display unit 38b is provided at a position adjacent to the normal drawing display unit 38a. The number of game balls that have won a prize in the through gate 35 is reserved up to four, and the reserved number is displayed by lighting the general drawing reservation display unit 38b.

A winning lottery is performed with a prize in the first operating port 33 or the second operating port 34 as a trigger. Then, the lottery result is clearly shown through the display effect in the symbol display device 41 of the special figure unit 37 and the variable display unit 36.

More specifically, the special figure unit 37 is provided with a special figure display unit 37a. The display area of the special figure display unit 37a is narrower than the display surface 41a of the symbol display device 41. In the special figure display unit 37a, a winning lottery is performed triggered by a prize in the first operating port 33 or a winning in the second operating port 34, so that a variable display or a predetermined display of the pattern is performed. Then, the result corresponding to the lottery result is displayed. The special figure display unit 37a is composed of a segment display in which a plurality of display segments by LEDs are arranged in a predetermined manner, but the present invention is not limited to this, and the liquid crystal display device and the organic EL are used. It may be composed of a display device, a CRT, a dot matrix display, or other type of display device. Further, as the pattern displayed on the special figure display unit 37a, a configuration in which a plurality of types of characters are displayed, a configuration in which a plurality of types of symbols are displayed, a configuration in which a plurality of types of characters are displayed, or a configuration in which a plurality of types of colors are displayed. Is displayed.

In the special figure unit 37, a special figure hold display unit 37b is provided at a position adjacent to the special figure display unit 37a. The number of winning balls in the first operating port 33 or the second operating port 34 is reserved up to four, and the reserved number is displayed by lighting the special figure reservation display unit 37b.

About the symbol display device 41 In detail, the symbol display device 41 is configured as a liquid crystal display device provided with a liquid crystal display, and the display content is controlled by a display control device described later. The symbol display device 41 is not limited to the liquid crystal display device, and may be another display device having a display screen such as a plasma display device, an organic EL display device, or a CRT, and is a dot matrix display device. You may.

In the symbol display device 41, when the special symbol display unit 37a performs a variable display or a predetermined display of the symbol based on the winning of the first operating port 33 or the winning of the second operating port 34, the symbol is displayed accordingly. A variable display or a predetermined display is performed. For example, on the display surface 41a of the symbol display device 41, three symbol rows of upper, middle, and lower rows are set as a plurality of display areas, and the numbers "1" to "9" are added to each symbol row. The symbols are scrolled and displayed in ascending or descending order. In this scroll display, the scroll display in all the symbol columns is started first, the scroll display is switched to the standby display in the order of the upper symbol column → the lower symbol column → the middle symbol column, and finally the predetermined symbol display is specified in each symbol column. It ends with the symbol still displayed. Then, in the game times in which the game result is a big hit result, a predetermined combination of symbols is stopped and displayed on the effective line preset on the display surface 41a of the symbol display device 41. Specifically, the same odd-numbered symbol combination is stopped and displayed when the most advantageous jackpot result described later is obtained, and the same even-numbered symbol combination is stopped and displayed when the low-probability jackpot result described later is obtained. If the result is a low-winning high-accuracy jackpot, the combination of symbols that are not the same combination, but if the result is not a low-winning high-accuracy jackpot, the combination of symbols that is not stopped is displayed as a stop.

In the symbol display device 41, not only the display effect triggered by winning a prize in the first actuating port 33 or the second actuating port 34, but also the display effect in the open / close execution mode that shifts after winning is performed. Will be. Further, based on the winning of any of the operating ports 33 and 34, the display is started on the special figure display unit 37a and the symbol display device 41, and the game times 1 until the predetermined result is displayed and ended. Equivalent to times. Further, the mode of variable display of symbols in the symbol display device 41 is not limited to the above, and is arbitrary, such as the number of symbol rows, the direction of variable display of symbols in the symbol row, the number of symbols in each symbol row, and the like. Can be changed as appropriate. Further, the pattern to be variablely displayed by the symbol display device 41 is not limited to the above-mentioned symbol, and may be configured such that only numbers are variablely displayed as the symbol, for example.

If a big hit is won in the winning lottery based on the winning of the first operating port 33 or the winning of the second operating port 34, the mode shifts to the opening / closing execution mode in which the special electric winning device 32 can be won. The special electric winning device 32 is provided with a large winning opening (not shown) leading to the back side of the game board 24, and is provided with an opening / closing door 32a for opening and closing the large winning opening. The opening / closing door 32a is arranged in either a closed state or an open state. Specifically, the opening / closing door 32a is normally in a closed state in which the game ball cannot win a prize, and is switched to an open state in which the game ball can win a prize when the transition to the open / close execution mode is won in the internal lottery. It has become. By the way, the open / close execution mode is a mode in which the transition is made when a hit result is obtained. It should be noted that although it is not impossible to win a prize in the closed state, it may be configured in a state in which it is more difficult for the prize to occur than in the open state.

<Structure related to ejection of game balls>
FIG. 5 is an explanatory diagram for explaining a configuration relating to discharge of a game ball flowing down the game area PA.

As described above, the game ball that has entered any of the general winning opening 31, the special electric winning device 32, the first operating port 33, the second operating port 34, and the out port 24a is discharged from the gaming area PA. In other words, the game ball launched from the game ball launching mechanism 27 and flowing into the game area PA is any one of the general winning opening 31, the special electric winning device 32, the first operating port 33, the second operating port 34, and the out port 24a. By entering the ball, it will be discharged from the game area PA. The game ball that has entered any of the general winning opening 31, the special electric winning device 32, the first operating opening 33, the second operating opening 34, and the out opening 24a is guided to the back side of the game board 24.

On the back surface of the game board 24, discharge passage portions 42 to 48 are formed corresponding to each of the general winning opening 31, the special electric winning device 32, the first operating port 33, the second operating port 34, and the out port 24a. .. The game balls that have flowed into the discharge passages 42 to 48 are guided to the lower end of the game board 24 on the back side of the game board 24 by flowing down the flowed discharge passages 42 to 48, and become a discharge ball recovery part (not shown). Will be collected. Then, the game balls collected by the discharge ball collection unit are discharged to the ball circulation device of the island facility in which the pachinko machine 10 is installed in the game hall.

Various detection sensors 42a to 48a for detecting the game ball are provided in the discharge passage portions 42 to 48. The discharge passage portions 42 to 48 and the detection sensors 42a to 48a will be described below. Since four general winning openings 31 are provided as described above, the discharge passage portions 42 to 44 exist corresponding to each of the four general winning openings 31. In this case, one detection sensor 42a, one for each of the first discharge passage portion 42 corresponding to the leftmost general winning opening 31 and the second discharge passage portion 43 corresponding to the general winning opening 31 on the right side thereof. 43a is provided. Specifically, the first winning opening detection sensor 42a is provided so that the detection range exists in the middle position of the first discharge passage portion 42, and the detection range is provided in the middle position of the second discharge passage portion 43. The second winning opening detection sensor 43a is provided so as to exist. The game ball that has entered the leftmost general winning opening 31 is detected by the first winning opening detection sensor 42a while passing through the first discharge passage portion 42, and the game that has entered the general winning opening 31 to the right of the first winning opening detection sensor 42a. The ball is detected by the second winning opening detection sensor 43a on the way through the second discharge passage portion 43. Further, a third discharge passage portion 44 formed so as to join the two general winning openings 31 on the right side at an intermediate position is provided. The third discharge passage portion 44 has an inlet side region corresponding to each of the two general winning openings 31, and has one outlet side region when the inlet side regions merge in the middle. doing. The third winning opening detection sensor 44a is provided so that the detection range exists in the middle position of the exit side region in the third discharge passage portion 44. The game ball that has entered any of the two general winning openings 31 on the right side is detected by the third winning opening detection sensor 44a while passing through the third discharge passage portion 44.

The fourth discharge passage portion 45 exists corresponding to the special electric winning device 32. A special electric detection sensor 45a is provided so that a detection range exists in the middle of the fourth discharge passage portion 45, and the game ball that has entered the special electric winning device 32 is on the way through the fourth discharge passage portion 45. It is detected by the special electric detection sensor 45a. A fifth discharge passage portion 46 exists corresponding to the first actuating port 33. The first actuating port detection sensor 46a is provided so that the detection range exists in the middle of the fifth discharge passage portion 46, and the game ball that has entered the first actuating port 33 passes through the fifth discharge passage portion 46. It is detected by the first actuating port detection sensor 46a on the way through. A sixth discharge passage portion 47 exists corresponding to the second actuating port 34. The second operating port detection sensor 47a is provided so that the detection range exists in the middle position of the sixth discharging passage portion 47, and the game ball that has entered the second operating port 34 uses the sixth discharging passage portion 47. It is detected by the second actuating port detection sensor 47a on the way through. The seventh discharge passage portion 48 exists corresponding to the out port 24a. The out port detection sensor 48a is provided so that the detection range exists in the middle position of the seventh discharge passage portion 48, and the game ball that has entered the out port 24a is on the way through the seventh discharge passage portion 48. It is detected by the out port detection sensor 48a.

The game ball that is the target of detection by any one of the various detection sensors 42a to 48a is not the target of detection by the other detection sensors 42a to 48a. Further, the gate detection sensor 49a is also provided for the through gate 35, and the game ball passing through the through gate 35 while flowing down the game area PA is detected by the gate detection sensor 49a.

As the various detection sensors 42a to 49a, electromagnetic induction type proximity sensors are used, but any sensor can be used as long as the game balls can be individually detected. Further, the various detection sensors 42a to 49a are electrically connected to the main control device 60 described later, and the detection results of the various detection sensors 42a to 49a are output to the main control device 60. Specifically, the various detection sensors 42a to 49a output a LOW level signal when the game ball is not detected, and output a HI level signal when the game ball is detected. The relationship between HI and LOW is not limited to this, and the relationship between HI and LOW may be reversed.

As shown in FIG. 2, the front door frame 14 is provided so as to cover the entire front surface side of the inner frame 13 in which the game board 24 having the above configuration is attached to the resin base 21. As shown in FIG. 1, the front door frame 14 is formed with a window portion 51 so that almost the entire area of the game area PA can be visually recognized from the front. The window portion 51 has a substantially elliptical shape, and the window panel 52 is fitted therein. The window panel 52 is colorless and transparently formed by glass, but is not limited to this, and may be colorless and transparent by synthetic resin, and the gaming area PA is formed from the front of the pachinko machine 10 through the window panel 52. It may be colored and transparent as long as it is visible.

Above the window portion 51, a pair of left and right speaker portions 53 for outputting sound effects and the like according to the gaming state are provided. Further, below the window portion 51, an upper bulging portion 54 bulging toward the front side and a lower bulging portion 55 are vertically arranged side by side. An upper plate 54a opened upward is provided inside the upper bulging portion 54, and a lower plate 55a also opened upward is provided inside the lower bulging portion 55. The upper plate 54a has a function of temporarily storing the game balls paid out from the payout device described later and guiding them to the game ball launching mechanism 27 side while arranging them in a row. Further, the lower plate 55a has a function of storing excess game balls in the upper plate 54a.

As shown in FIG. 1, on the front surface of the front door frame 14, the first decorative substrate 56 is provided on the lower left side of the window portion 51, and the second decoration is substantially centered on the upper side of the window portion 51 in the left-right direction. A substrate 57 is provided. A plurality of LED chips are mounted on the decorative boards 56 and 57, and the decorative boards 56 and 57 perform a light emitting effect corresponding to the gaming state. The front door frame 14 is provided with a first decorative cover 58 that covers the front of the first decorative board 56 and a second decorative cover 59 that covers the front of the second decorative board 57. These decorative covers 58 and 59 are made of a transparent or translucent resin that transmits light emitted from the LED chip, and bulge toward the front of the pachinko machine 10. The details of the decorative substrates 56 and 57 and the decorative covers 58 and 59 will be described later.

Next, the configuration of the back side of the gaming machine main body 12 will be described.

As shown in FIG. 2, a main control device 60 that controls the main control of the game is mounted on the back surface of the inner frame 13 (specifically, the game board 24). FIG. 6 is a front view of the main control device 60.

<Configuration of main control device 60>
As shown in FIG. 6, the main control device 60 includes a main control board 61 housed in a board box 60a. The MPU 62 is mounted on the element mounting surface, which is one of the plate surfaces of the main control board 61. The substrate box 60a is transparently formed so that the MPU 62 housed in the substrate box 60a can be visually recognized from the outside of the substrate box 60a. Although the substrate box 60a is formed to be colorless and transparent, it may be formed to be colored and transparent as long as the MPU 62 housed in the substrate box 60a can be visually recognized from the outside of the substrate box 60a. The main control device 60 is mounted on the back surface of the resin base 21 so that the facing wall portion 60b facing the element mounting surface of the main control board 61 faces the rear of the pachinko machine 10 in the board box 60a. Therefore, by opening the gaming machine main body 12 to the front of the pachinko machine 10 with respect to the outer frame 11 to expose the back surface of the resin base 21, it becomes possible to visually recognize the facing wall portion 60b of the substrate box 60a. The MPU 62 can be visually observed through the facing wall portion 60b.

The substrate box 60a is formed by combining a plurality of case bodies 60c back and forth, and the plurality of case bodies 60c prevent the case bodies 60c from being separated and trace the case bodies 60c when they are separated. A joint portion 60e is provided for leaving the surface. A plurality of connecting portions 60e are arranged side by side on one side of the substrate box 60a having a substantially rectangular parallelepiped shape. As a result, even if the part of the connecting portion 60e is destroyed and the case body 60c is separated in a state where the separation of the case body 60c is prevented by using a part of the connecting portion 60e, another coupling is subsequently performed. By putting the portion 60e in the coupled state, it is possible to prevent the case body 60c from being separated again. Further, when the case body 60c is separated, the joint portion 60e is destroyed and its trace remains, so that it is possible to grasp whether or not the case body 60c is illegally separated by visually checking the joint portion 60e. It will be possible. Further, in the substrate box 60a, a sealing seal 60f is attached so as to straddle the boundary between the case bodies 60c on the side opposite to the side on which the connecting portions 60e are arranged side by side. When the seal seal 60f is peeled off, an adhesive layer remains on the case body 60c. As a result, when the sealing seal 60f is peeled off when the case body 60c is separated, it is possible to leave a trace thereof.

In the main control device 60 having the above configuration, the main control board 61 is owned by the manager of the game hall in order to give an opportunity to change the setting state of the pachinko machine 10 in the range of "setting 1" to "setting 6". The setting key insertion unit 68a in which the setting key is inserted and turned on, the update button 68b operated to sequentially change the setting state of the pachinko machine 10 after the setting key insertion unit 68a is turned on, and the main control device. A reset button 68c operated to clear the data of the main RAM 65 provided in the MPU 62 of the 60, and the first to third notification display devices 69a to 69c for notifying the management result of the game history. , Are provided. The setting state of the pachinko machine 10 is not limited to the six stages of "setting 1" to "setting 6", and is arbitrary as long as it is a plurality of stages.

The setting key insertion unit 68a, the update button 68b, the reset button 68c, and the first to third notification display devices 69a to 69c are all provided on the element mounting surface of the main control board 61. Further, the element mounting surface of the main control board 61 faces the facing wall portion 60b of the board box 60a as described above, but the setting key insertion portion 68a, the update button 68b, and the reset button 68c are covered by the facing wall portion 60b. Not reset. That is, the facing wall portion 60b has a region facing each of the setting key insertion portion 68a, the update button 68b, and the reset button 68c as individual openings. As a result, the setting key can be inserted into the setting key insertion unit 68a without the need to open the board box 60a, the update button 68b can be pressed, and the reset button 68c can be pressed. It is possible.

By inserting the setting key into the setting key insertion unit 68a and rotating the setting key in a predetermined direction, the setting key insertion unit 68a is turned on. By starting the supply of the operating power to the pachinko machine 10 in that state (that is, by starting the supply of the operating power to the MPU 62 of the main control device 60), it is possible to change the setting state of the pachinko machine 10. It becomes a changeable state. Then, each time the update button 68b is pressed once in this state, the setting state of the pachinko machine 10 is changed one step at a time in ascending order in the range of "setting 1" to "setting 6". If the update button 68b is operated in the state of "setting 6", it is updated to "setting 1". Further, the setting key insertion unit 68a is turned off by rotating the setting key inserted in the setting key insertion unit 68a in the direction opposite to the predetermined direction from the ON operation position to return to the initial position. Become. When the setting key insertion unit 68a is turned off, the changeable state ends, and the game can be played in the state of the set value at that time. That is, the set value cannot be changed even if the update button 68b is operated after the changeable state ends.

The ON operation for the setting key insertion unit 68a is valid only when the supply of the operating power to the pachinko machine 10 starts (that is, when the supply of the operating power to the MPU 62 of the main control device 60 starts). Therefore, even if the setting key insertion unit 68a is turned on after the processing at the start of supply of the operating power is completed in the MPU 62 of the main control device 60, the set value cannot be changed.

The setting state of the pachinko machine 10 determines the advantage per unit time in the pachinko machine 10, and the larger n of "setting n" (n is an integer of "1" to "6"), the larger the value (that is, the setting). (The higher the value), the higher the advantage. Although the details will be described later, there are a low probability mode in which the winning probability is relatively low and a high probability mode in which the winning probability is relatively high as a winning / losing lottery mode for determining the winning probability of the jackpot result. The higher the probability, the higher the winning probability of the jackpot result in the low probability mode. On the other hand, the winning probability of the jackpot result in the high probability mode is constant regardless of the set value.

The reset button 68c is operated to clear the data of the main RAM 65 as described above, but in order to generate the clearing of the data, the operating power is supplied to the pachinko machine 10 while the reset button 68c is pressed. (That is, it is necessary to start supplying the operating power to the MPU 62 of the main controller 60). The ON operation for the reset button 68c is valid only when the supply of the operating power to the pachinko machine 10 starts (that is, when the supply of the operating power to the MPU 62 of the main control device 60 starts). Therefore, even if the reset button 68c is pressed after the processing at the start of supply of the operating power is completed in the MPU 62 of the main control device 60, the data in the main RAM 65 cannot be cleared.

The first to third notification display devices 69a to 69c are all segment display devices in which seven display segments by LEDs are arranged, but the present invention is not limited to this, and a single multicolor light emitting type is used. It may be a light emitter, a liquid crystal display device, or an organic EL display. The first to third notification display devices 69a to 69c are all installed so that their display surfaces face the direction in which the element mounting surface of the main control board 61 faces, and the facing wall portion 60b of the board box 60a causes the display devices to face each other. It is covered. In this case, since the substrate box 60a is transparently formed, the display surfaces of the first to third notification display devices 69a to 69c housed in the substrate box 60a are visually observed from the outside of the substrate box 60a. It becomes possible. Further, as described above, the main control device 60 is mounted on the back surface of the resin base 21 in the board box 60a so that the facing wall portion 60b facing the element mounting surface of the main control board 61 faces the rear of the pachinko machine 10. Therefore, when the gaming machine main body 12 is opened to the front of the pachinko machine 10 with respect to the outer frame 11 and the back surface of the resin base 21 is exposed to the front of the pachinko machine 10, the first to third notifications are sent through the facing wall portion 60b. It is possible to visually check the display surface of the display devices 69a to 69c.

On the display surface of the first notification display device 69a, not only the numbers "0" to "9" but also various characters including alphabetic characters are displayed. On the other hand, the numbers "0" to "9" are displayed on the second notification display device 69b and the third notification display device 69c. The management result of the game history is notified by using the first to third notification display devices 69a to 69c. Further, in the changeable state in which the setting state of the pachinko machine 10 can be changed, the value corresponding to the current setting value is displayed on the third notification display device 69c. The value corresponding to the set value may be displayed on the first notification display device 69a, or may be displayed on the second notification display device 69b. Further, the set value before the changeable state is displayed on the notification display device of one of the first to third notification display devices 69a to 69c, and the current set value is the first to third notification. The display device may be configured to be displayed on the other notification display device among the display devices 69a to 69c.

A voice emission control device 81 is provided above the main control device 60 on the back surface of the inner frame 13. The voice emission control device 81 executes sound output control, light emission control, and control of the display control device 82 according to instructions from the main control device 60. Further, the voice emission control device 81 executes emission control of the LED chip mounted on the first decorative substrate 56 and the second decorative substrate 57.

As shown in FIG. 3, the back pack unit 15 is installed so as to cover the back side of the inner frame 13 including the main control device 60 and the voice emission control device 81. The back pack unit 15 includes a back pack 72 formed of a transparent synthetic resin, and a payout mechanism unit 73 and a control device collective unit 74 are attached to the back pack 72.

The payout mechanism unit 73 includes a tank 75 in which game balls supplied from the island equipment of the game hall are sequentially replenished, and a payout device 76 for paying out the game balls stored in the tank 75. The game ball paid out from the payout device 76 is discharged to the upper plate 54a or the lower plate 55a through the payout passage provided on the downstream side of the payout device 76. The payout mechanism unit 73 is provided with, for example, a back pack board having a power switch for turning on and off the power supply while supplying a main power supply of AC 24 volts.

The control device collective unit 74 generates and outputs predetermined electric power required by the payout control device 77 having a function of controlling the payout device 76 and various control devices, and is accompanied by the operation of the launch operation device 28 by the player. It is equipped with a power supply / launch control device 78 for controlling the launch of a game ball. The payout control device 77 and the power supply / launch control device 78 are arranged so as to be stacked in the front-rear direction so that the payout control device 77 is behind the pachinko machine 10.

FIG. 7 is a front view of the pachinko machine 10 with the decorative covers 58 and 59 and the decorative substrates 56 and 57 removed. As shown in FIG. 1, in the first decorative cover 58, the upper portion, the lower left portion, and the lower right portion of the back surface of the first decorative cover 58 are erected behind the pachinko machine 10, and the columnar cover fixing bosses 58a to 58c are formed. Is integrally formed. Further, in the second decorative cover 59, columnar cover fixing bosses 59a and 59b are integrally formed by erecting the left and right portions of the back surface of the second decorative cover 59 behind the pachinko machine 10. A screw hole (not shown) is formed at the end of the standing tip of these cover fixing bosses 58a to 58c, 59a, 59b. As shown in FIG. 7, the front door frame 14 is formed with through holes 14a to 14e that penetrate the front door frame 14 back and forth in correspondence with the cover fixing bosses 58a to 58c, 59a, 59b. .. As shown in FIG. 1, the first decorative cover 58 and the second decorative cover 59 are attached to the front door frame 14 by fixing the cover fixing bosses 58a to 58c, 59a, 59b from the back side of the front door frame 14. It is fixed.

<Structure of decorative substrates 56 and 57>
Next, the configurations of the decorative substrates 56 and 57 will be described.

FIG. 8A is a plan view showing a first mounting surface 84 which is a plate surface on one side of the first decorative board 56, and FIG. 8B is a bypass capacitor 85 mounted on the first decorative board 56. FIG. 8 (c) is a plan view of the first mounting surface 84 of the first decorative substrate 56 in which the peripheral region 86 of the first decorative substrate 56 is enlarged, and FIG. 8 (c) shows the peripheral region of the small chip resistor 87 mounted on the first decorative substrate 56. 88 is an enlarged plan view of the first mounting surface 84 of the first decorative substrate 56, and FIG. 9 is a sectional view taken along line AA of FIG. 8A. Further, FIG. 10A is a plan view showing a first mounting surface 89 which is a plate surface on one side of the second decorative substrate 57, and FIG. 10B is a bypass mounted on the second decorative substrate 57. FIG. 10 (c) is a plan view of the first mounting surface 89 of the second decorative board 57 in which the peripheral region 98 of the capacitor 97 is enlarged, and FIG. 10 (c) shows the small chip resistor 101 mounted on the second decorative board 57. It is a top view of the 1st mounting surface 89 of the 2nd decorative substrate 57 which enlarges and shows the peripheral area 102.

The decorative substrates 56 and 57 are four-layer substrates having a structure in which conductive layers and insulating layers are alternately laminated. As the insulating layer, a composite material obtained by impregnating a base material of glass cloth with a thermosetting epoxy resin is used. The conductive layer is formed by etching a copper foil plate arranged above or below the insulating layer.

As shown in FIG. 9, the first decorative substrate 56 has a first wiring layer 91 arranged on the first mounting surface 84 side of the first decorative substrate 56 as a conductive layer, and the other side of the first decorative substrate 56. A second wiring layer 92 arranged on the side of the second mounting surface 95, which is the plate surface of the above, is provided. Further, the first decorative substrate 56 has a GND plane layer 93 (ground plane layer or ground plane layer) and a power supply plane layer 94 as conductive layers arranged between the first wiring layer 91 and the second wiring layer 92. And have. Lands and wiring patterns are formed on the first wiring layer 91 and the second wiring layer 92 by etching a copper foil plate.

Although not shown, the second decorative substrate 57 has a first wiring layer arranged on the first mounting surface 89 side as a conductive layer and the other of the second decorative substrate 57, similarly to the first decorative substrate 56. It is provided with a second wiring layer arranged on the side of the second mounting surface, which is the plate surface on the side. Further, the second decorative substrate 57 is a GND plane layer (ground plane layer or ground plane layer) as a conductive layer arranged between the first wiring layer and the second wiring layer, similarly to the first decorative substrate 56. And a power plane layer. Lands and wiring patterns are formed on the first wiring layer and the second wiring layer by etching a copper foil plate.

As shown in FIG. 1, a stepped recess 56a corresponding to the lower left of the curved window portion 51 is formed on the upper right side of the first decorative substrate 56. Further, a notch 56b for avoiding the cover fixing boss 58b of the first decorative cover 58 is formed on the lower left side of the first decorative substrate 56. Since the notch 56b is provided in the first decorative substrate 56, it is possible to provide the first decorative substrate 56 in a wide area behind the first decorative cover 58 while avoiding the cover fixing boss 58b.

The first decorative substrate 56 is a modified substrate having a stepped recess 56a and a notch 56b. The first decorative substrate 56 is not a rectangular or substantially rectangular substrate. As shown in FIG. 8A, the dimensions of the first decorative substrate 56 in the first direction DR1 (vertical direction in FIG. 8A) are the second orthogonal to the first direction DR1 of the first decorative substrate 56. It is larger than the dimension in the direction DR2 (the left-right direction in FIG. 8A).

As shown in FIG. 10A, the second decorative substrate 57 is formed into a horizontally long substantially elliptical shape. The second decorative substrate 57 is not a rectangular or substantially rectangular substrate. The dimension in the long axis direction LD (horizontal direction in FIG. 10A) of the second decorative substrate 57 is larger than the dimension in the minor axis direction SD (vertical direction in FIG. 10A) of the second decorative substrate 57.

As shown in FIG. 8A, a protruding portion 56c is provided at substantially the center of the stepped recess 56a in the vertical direction. The first decorative substrate 56 is passed through the left side of the upper end portion, the protruding portion 56c, the left side of the lower end portion and the right side of the lower end portion of the first decorative substrate 56 in the thickness direction, and the first decorative substrate 56 is passed through the front surface of the front door frame 14. A fixing through hole 56d to 56g is formed in the hole so that the screw can be fixed. Further, as shown in FIG. 10A, the second decorative substrate 57 is passed through the left portion and the right portion of the second decorative substrate 57 in the thickness direction, and the second decorative substrate 57 is passed through the front door frame 14. The fixing through holes 57a and 57b that can be fixed with screws are formed in the hole.

As shown in FIG. 7, the front door frame 14 has a columnar substrate to which decorative substrates 56 and 57 (FIGS. 8A and 10A) can be fixed to the front surface of the front door frame 14. The fixed bosses 103 to 108 are integrally formed. The board fixing bosses 103 to 108 stand in front of the pachinko machine 10 from the front surface of the front door frame 14, and the decorative boards 56 and 57 can be screw-fixed to the ends of the standing points of the board fixing bosses 103 to 108. Screw holes 103a to 108a are formed. The decorative boards 56 and 57 are screwed to the board fixing bosses 103 to 108 from the front of the pachinko machine 10, so that the first mounting surfaces 84 and 89 (FIGS. 8A and 10A) are the pachinko machines 10. It is fixed to the front surface of the front door frame 14 as shown in FIG. 1 so as to face forward.

As described above, the light emission control of the LED chip mounted on the decorative boards 56 and 57 and the sound output control of the speaker unit 53 are performed by the voice light emission control device 81 (FIG. 3). As shown in FIG. 8A, the first decorative substrate 56 has the first connector 111 and the second connector 111 and the second on the second mounting surface 95 (FIG. 9), which is a plate surface opposite to the first mounting surface 84. The connector 112 is mounted. Further, as shown in FIG. 10A, the second decorative substrate 57 has the third connector 113, the fourth connector 114, and the second connector 114 on the second mounting surface, which is a plate surface opposite to the first mounting surface 89. A fifth connector 115 is mounted.

A harness (not shown) for electrically connecting the voice emission control device 81 (FIG. 3) and the first decorative substrate 56 is attached to the first connector 111. A harness (not shown) for electrically connecting the first decorative board 56 and the second decorative board 57 is attached to the second connector 112 and the third connector 113. Further, a harness (not shown) for electrically connecting the second decorative board 57 and the pair of left and right speaker portions 53 is attached to the fourth connector 114 and the fifth connector 115. The voice emission control device 81 outputs information for controlling the emission of the LED chip mounted on the first decorative substrate 56 to the first decorative substrate 56. Further, the voice emission control device 81 provides information and a speaker unit 53 for controlling the emission of the LED chip mounted on the second decorative substrate 57 with respect to the second decorative substrate 57 via the first decorative substrate 56. Outputs information for controlling the sound output of.

As shown in FIG. 7, the front door frame 14 penetrates the front door frame 14 back and forth in correspondence with the first to fifth connectors 111 to 115 (FIGS. 8A and 10A). The first to fifth connector insertion holes 14f to 14j are formed. The decorative substrates 56, 57 (FIGS. 8A and 10A) are in a state where the connectors 111 to 115 are inserted into the corresponding connector insertion holes 14f to 14j and exposed on the back side of the front door frame 14. It is fixed to the front door frame 14. The harness (not shown) is attached to and detached from the first to fifth connectors 111 to 115 from the back side of the front door frame 14.

As shown in FIG. 8A, the first decorative substrate 56 is provided with a first light emitting circuit unit 121, a second light emitting circuit unit 122, and a third light emitting circuit unit 123. Further, as shown in FIG. 10A, the second decorative substrate 57 is provided with a fourth light emitting circuit unit 124. These light emitting circuit units 121 to 124 include a circuit for controlling light emission of a plurality of LED chips.

The specific configuration of the light emitting circuit units 121 to 124 will be described by taking the configuration of the first light emitting circuit unit 121 as an example.

FIG. 11 is a wiring diagram of the first light emitting circuit unit 121 in the first decorative substrate 56. As shown in FIG. 11, the first light emitting circuit unit 121 includes an LED driver 126, a bypass capacitor 85, 16 LED chips 127 to 142, and eight small chip resistors 87, 143 to 149. .. Although not shown, the second to fourth light emitting circuit units 122 to 124 also include an LED driver, a bypass capacitor, a plurality of LED chips, and a plurality of small chip resistors. The number of LED chips included in each light emitting circuit unit 121 to 124 is arbitrary, and the number of small chip resistors included in each light emitting circuit unit 121 to 124 depends on the connection mode between the LED driver and the LED chip. It will be decided.

As shown in FIG. 11, the LED driver 126 includes a power supply terminal 151, a clock terminal 152, a data terminal 153, a GND terminal 154 (ground terminal or ground terminal), and first to eighth output terminals 155 to 162. , Is equipped. A wiring pattern 164 for inputting a clock signal received from the voice emission control device 81 is electrically connected to the clock terminal 152, and lighting control data received from the voice emission control device 81 is connected to the data terminal 153. The input wiring pattern 165 is electrically connected. Further, a second wiring pattern 172b for electrically connecting the LED driver 126 to the GND plane layer 93 (FIG. 9) is connected to the GND terminal 154, and the LED driver 126 is driven to the power supply terminal 151. The fourth wiring pattern 172d that supplies power is electrically connected.

The term "terminal" as used herein refers to a linear metal portion (for example, a linear metal portion) provided on an electronic component (including a small chip component described later) for electrically connecting to a corresponding pad (or pad). , The power supply terminal 151 and the GND terminal 154 (FIG. 8 (b)) in the LED driver 126. Further, the “electrode” in the present specification is, in a narrow sense, an electrical surface with a corresponding pad (or pad). (For example, in the bypass capacitor 85, the first electrode 85a and the second electrode 85b (FIG. 8 (b)) described later) provided in the electronic component (including the small chip component described later) for connection with the above. Yes, and does not include the above "terminals". On the other hand, the "electrode" in the present specification broadly refers to an electronic component (small chip component described later) for electrically connecting to a corresponding pad (or pad). It is a metal part provided in) and includes the above-mentioned "terminal".

The LED driver 126 controls the light emission of the LED chips 127 to 142 connected to the first to eighth output terminals 155 to 162 based on the lighting control data received from the voice light emission control device 81. Each output terminal 155 to 162 of the LED driver 126 has two LED chips out of the 16 LED chips 127 to 142 described above and one small chip among the eight small chip resistors 87, 143 to 149 described above. It is electrically connected to the resistor. The small chip resistors 87, 143 to 149 are provided to limit the current flowing through the LED chips 127 to 142. By providing the small chip resistors 87, 143 to 149, the LED chips 127 to 142 can be driven with an allowable current or less.

FIG. 12A is a perspective view of the first decorative substrate 56 on the side of the first mounting surface 84, which is an enlarged view of the periphery of the bypass capacitor 85, and FIG. 12B is an enlarged view of the periphery of the small chip resistor 87. It is a perspective view of the 1st mounting surface 84 side of the 1st decorative substrate 56 shown by the above. As shown in FIG. 12A, the bypass capacitor 85 is a surface mount type chip capacitor, specifically, a multilayer ceramic capacitor in which a large number of dielectrics and electrodes are stacked. The bypass capacitor 85 is a substantially rectangular parallelepiped and includes a pair of metal first electrodes 85a and second electrodes 85b at both ends in the longitudinal direction.

The bypass capacitor 85 has a dimension in the longitudinal direction along a plane orthogonal to the thickness direction of the bypass capacitor 85 (hereinafter, also referred to as “longitudinal direction of the bypass capacitor 85”) of 0.1 mm or more and 0.9 mm or less. It is a small chip component. In the present specification, the small chip component is an electronic component having a dimension in the longitudinal direction of the small chip component (hereinafter, also referred to as “longitudinal direction of the small chip component”) of 0.1 mm or more and 0.9 mm or less. Is. Since the dimension of the small chip component in the longitudinal direction is 0.9 mm or less, the area occupied by the small chip component in the first decorative substrate 56 can be suppressed. As a result, it is possible to secure a large area of the area for mounting the electronic components other than the small chip components on the first decorative substrate 56. Further, the electronic components mounted between the first decorative substrate 56 and the substrate having a high mounting density of the electronic components can be shared with the small chip components. When the dimension in the longitudinal direction of the small chip component is 0.1 mm or more, the mechanical strength at the connection point between the small chip component and the first decorative substrate 56 and the mechanical strength of the small chip component itself are excessively lowered. It can be prevented from being stored. Here, the connection point of the small chip component includes a pad electrically connected to the electrode of the small chip component, a solder fillet electrically connecting the electrode and the pad, and a wiring pattern drawn from the pad. .. When the dimension in the longitudinal direction of the small chip component is 0.1 mm or more, it is possible to prevent it from becoming difficult to visually confirm the presence or absence of mounting omission of the small chip component. The lengthwise dimension of the small chip component is preferably 0.3 mm or more and 0.8 mm or less. Since the dimension of the small chip component in the longitudinal direction is 0.8 mm or less, the area occupied by the small chip component in the first decorative substrate 56 can be reduced. When the dimension in the longitudinal direction of the small chip component is 0.3 mm or more, the mechanical strength at the connection point between the small chip component and the first decorative substrate 56 and the mechanical strength of the small chip component itself can be increased. In addition, it is possible to simplify the process for confirming the presence or absence of mounting omission of small chip components. The longitudinal dimension of the small chip component is more preferably 0.4 mm or more and 0.7 mm or less. When the dimension of the small chip component in the longitudinal direction is 0.7 mm or less, the area occupied by the small chip component in the first decorative substrate 56 can be further reduced. When the dimension of the small chip component in the longitudinal direction is 0.4 mm or more, the mechanical strength at the connection point between the small chip component and the first decorative substrate 56 and the mechanical strength of the small chip component itself are increased, and the connection point is increased. It is possible to reduce the possibility of damage to the small chip component itself and reduce the possibility of damage to the small chip component itself. Further, when the dimension in the longitudinal direction of the small chip component is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting omission of the small chip component.

The bypass capacitor 85 has a dimension in the longitudinal direction along a plane orthogonal to the thickness direction of approximately 0.6 mm, and is also referred to as a lateral direction along a plane orthogonal to the thickness direction (hereinafter, also referred to as a “minor direction”). ) And the thickness direction are approximately 0.3 mm, which is a small chip component. Since the dimension of the bypass capacitor 85 in the longitudinal direction is 0.7 mm or less, the area occupied by the bypass capacitor 85 in the first decorative substrate 56 can be reduced. When the dimension of the bypass capacitor 85 in the longitudinal direction is 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 85 and the first decorative substrate 56 and the mechanical strength of the bypass capacitor 85 itself are increased, and the connection point is increased. It is possible to reduce the possibility that the bypass capacitor 85 itself is damaged, and it is possible to reduce the possibility that the bypass capacitor 85 itself is damaged. Further, when the dimension of the bypass capacitor 85 in the longitudinal direction is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting omission of the bypass capacitor 85. The longitudinal dimension of the bypass capacitor 85 may be smaller than 0.6 mm (for example, 0.4 mm), and the lateral dimension of the bypass capacitor 85 may be smaller than 0.3 mm. (For example, a configuration having a thickness of 0.2 mm) may be used, or a configuration having a dimension in the thickness direction smaller than 0.3 mm (for example, a configuration having a thickness of 0.2 mm) may be used.

On the first decorative substrate 56, the first pad 171a (or the first pad) corresponding to the first electrode 85a of the bypass capacitor 85 and the second pad 171b corresponding to the second electrode 85b are on the first mounting surface 84 side. (Or a second putt) is provided. The first pad 171a and the second pad 171b are a pair. Two wiring patterns 172a and 172b are drawn out from the first pad 171a, and two wiring patterns 172c and 172d are drawn out from the second pad 171b. These pads 171a, 171b and wiring patterns 172a to 172d are integrally formed by etching one copper foil plate.

The bypass capacitor 85 is mounted on the first mounting surface 84 side of the first decorative substrate 56 by soldering the electrodes 85a and 85b to the corresponding pads 171a and 171b. A solder fillet 173a for electrically connecting the first electrode 85a and the first pad 171a is formed on the first pad 171a, and the second electrode 85b and the second electrode 85b are formed on the second pad 171b. A solder fillet 173b that electrically connects the two pads 171b is formed. The solder fillets 173a and 173b are formed by heating the solder paste applied on the pads 171a and 171b to form molten solder, which is then cooled and solidified. In the longitudinal direction of the bypass capacitor 85, the first electrode 85a is fixed to the substantially center of the first pad 171a, and the second electrode 85b is fixed to the substantially center of the second pad 171b.

As shown in FIG. 8B, the first wiring pattern 172a drawn from the first pad 171a connected to the first electrode 85a of the bypass capacitor 85 passes through the via hole 174 provided in the first decorative substrate 56. The second wiring pattern 172b drawn out from the first pad 171a is electrically connected to the GND terminal 154 of the LED driver 126 while being electrically connected to the GND plane layer 93 (FIG. 9). Further, the third wiring pattern 172c drawn from the second pad 171b electrically connected to the second electrode 85b of the bypass capacitor 85 is connected to the power supply plane layer 94 via the via hole 175 provided in the first decorative substrate 56. The fourth wiring pattern 172d drawn from the second pad 171b is electrically connected to the power supply terminal 151 of the LED driver 126 while being electrically connected to FIG. 9 (FIG. 9). As described above, the first pad 171a is arranged between the GND terminal 154 of the LED driver 126 and the GND plane layer 93, and the second pad 171b is provided with the power supply terminal 151 of the LED driver 126 and the power supply plane layer 94. It is placed in between.

The bypass capacitor 85 can store electric charges, and the peak portion of the noise component contained in the drive power supply of the LED driver 126 is reduced by charging, and the valley portion of the noise component is reduced by discharging. In this way, the bypass capacitor 85 absorbs the noise component contained in the drive power supply of the LED driver 126.

By arranging the bypass capacitor 85 between the power supply terminal 151 of the LED driver 126 and the power supply plane layer 94, the noise component included in the drive power supply supplied from the voice emission control device 81 to the LED driver 126 is included. The influence on the LED driver 126 can be reduced. As shown in FIG. 8B, the bypass capacitor 85 is brought close to the power supply terminal 151 so that there are no other electronic components such as ICs between the bypass capacitor 85 and the power supply terminal 151 of the LED driver 126. Have been placed. As a result, it is possible to increase the possibility that the noise component contained in the drive power supply supplied to the power supply terminal 151 of the LED driver 126 is absorbed by the bypass capacitor 85, and the LED driver 126 is affected by the noise component. It is possible to reduce the possibility of receiving and malfunctioning. Since the configuration is such that no other IC exists between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component mistakenly mistakes the other IC. It is possible to prevent it from being activated. Further, since the configuration is such that no other electronic component exists between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component becomes another. It is possible to prevent the electronic components from malfunctioning.

As shown in FIG. 12 (b), the small chip resistor 87 is a substantially rectangular parallelepiped like the bypass capacitor 85 (FIG. 12 (a)), and has a pair of metal first electrodes at both ends in the longitudinal direction. It includes 87a and a second electrode 87b. Similar to the bypass capacitor 85, the small chip resistor 87 has a longitudinal direction along a plane orthogonal to the thickness direction of the small chip resistor 87 (hereinafter, also referred to as “longitudinal direction of the small chip resistor 87”). It is a small chip component having a size of 0.1 mm or more and 0.9 mm or less. The small chip resistor 87 has a dimension in the longitudinal direction along a plane orthogonal to the thickness direction of approximately 0.6 mm, and has a lateral direction along a plane orthogonal to the thickness direction (hereinafter, also referred to as a "minor direction"). It is a small chip component having a dimension of (referred to) and a dimension in the thickness direction of approximately 0.3 mm. Since the dimension of the small chip resistor 87 in the longitudinal direction is 0.7 mm or less, the area occupied by the small chip resistor 87 in the first decorative substrate 56 can be reduced. Since the longitudinal dimension of the small chip resistor 87 is 0.4 mm or more, the mechanical strength at the connection point between the small chip resistor 87 and the first decorative substrate 56 and the mechanical strength of the small chip resistor 87 itself. It is possible to reduce the possibility that the connection portion is damaged, and it is possible to reduce the possibility that the small chip resistor 87 itself is damaged. Further, since the dimension of the small chip resistor 87 in the longitudinal direction is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting omission of the small chip resistor 87. The longitudinal dimension of the small chip resistor 87 may be smaller than 0.6 mm (for example, 0.4 mm), and the lateral dimension of the small chip resistor 87 may be 0.3 mm. It may be a configuration smaller than (for example, a configuration having a thickness of 0.2 mm) or a configuration having a dimension in the thickness direction smaller than 0.3 mm (for example, a configuration having a thickness of 0.2 mm).

On the first decorative substrate 56, the first pad 176a (or the first pad) corresponding to the first electrode 87a of the small chip resistor 87 and the second electrode 87b corresponding to the second electrode 87b are on the first mounting surface 84 side. A pad 176b (or a second pad) is provided. The first pad 176a and the second pad 176b are a pair. One wiring pattern 181a is drawn out from the first pad 176a, and one wiring pattern 181b is drawn out from the second pad 176b. These pads 176a, 176b and wiring patterns 181a, 181b are integrally formed by etching one copper foil plate.

The small chip resistor 87 is mounted on the first mounting surface 84 side of the first decorative substrate 56 by soldering the electrodes 87a and 87b to the corresponding pads 176a and 176b. A solder fillet 177a for electrically connecting the first electrode 87a and the first pad 176a is formed on the first pad 176a, and the second electrode 87b and the second electrode 87b are formed on the second pad 176b. A solder fillet 177b that electrically connects the two pads 176b is formed. The solder fillets 177a and 177b are formed by heating the solder paste applied on the pads 176a and 176b to form molten solder, which is then cooled and solidified. In the longitudinal direction of the small chip resistor 87, the first electrode 87a is fixed to the substantially center of the first pad 176a, and the second electrode 87b is fixed to the substantially center of the second pad 176b.

As shown in FIG. 8C, the LED chip 142 is a surface mount type chip component. The LED chip 142 is a substantially rectangular parallelepiped, and includes a pair of metal first electrodes 142a and second electrodes 142b at both ends in the longitudinal direction. Further, on the first decorative substrate 56, a copper first pad 178a (or a first pad) corresponding to these first electrodes 142a and a copper second pad 178b (or a second pad) corresponding to the second electrode 142b are formed. ) And are provided. The first pad 178a and the second pad 178b are a pair.

The first wiring pattern 181a drawn from the first pad 176a of the small chip resistor 87 is electrically connected to the second pad 178b of the LED chip 142. Further, the second wiring pattern 181b drawn out from the second pad 176b of the small chip resistor 87 is electrically connected to the eighth output terminal 162 of the LED driver 126.

As described above, electronic components such as connectors 111-115, LED drivers 126, LED chips 127-142, bypass capacitors 85, 97, and small chip resistors 87, 101, 143-149 are mounted on the decorative boards 56, 57. Has been done. Of these electronic components, the outer dimensions of the small chip components (bypass capacitors 85, 97 and small chip resistors 87, 101, 143 to 149) are smaller than the outer dimensions of other electronic components, and the electrodes and pads of the small chip components The contact area with (or pad) is smaller than the contact area between the electrode and the pad (or pad) in other electronic components. Therefore, among the various electronic components mounted on the decorative boards 56 and 57, the connection points between the small chip components and the decorative boards 56 and 57 are compared with the connection points between the other electronic components and the decorative boards 56 and 57. And the mechanical strength is low. In the present specification, at the connection points between the small chip component and the decorative boards 56, 57, the pad electrically connected to the electrode of the small chip component and the electrode and the pad of the small chip component are electrically connected. Includes the solder fillet to be used and the wiring pattern drawn from the pad. Specifically, at the connection points between the bypass capacitor 85 and the first decorative substrate 56, the pads 171a and 171b electrically connected to the electrodes 85a and 85b of the bypass capacitor 85 and the electrodes 85a of the bypass capacitor 85, It includes solder fillets 173a and 173b that electrically connect the 85b and the pads 171a and 171b, and wiring patterns 172a to 172d drawn from the pads 171a and 171b. Further, at the connection points between the small chip resistor 87 and the first decorative substrate 56, the pads 176a and 176b electrically connected to the electrodes 87a and 87b of the small chip resistor 87 and the small chip resistor 87 are connected. It includes solder fillets 177a, 177b that electrically connect the electrodes 87a, 87b and the pads 176a, 176b, and wiring patterns 181a, 181b drawn from the pads 176a, 176b.

Capacitors on decorative boards 56, 57 by using smaller chip components (bypass capacitors 85, 97 and small chip resistors 87, 101, 143 to 149) that are smaller than electronic components such as LED drivers 126 and LED chips 127-142. And while the area occupied by the resistor can be reduced, when the decorative boards 56 and 57 are distorted, the connection points between the small chip components and the decorative boards 56 and 57 are likely to be damaged. , And the problem is that the small chip component itself is likely to be damaged. In the present specification, the damage at the connection point between the small chip component and the decorative boards 56, 57 means that the solder fillet that electrically connects the electrode and the pad (or pad) of the small chip component is cracked. This includes damage in which the solder fillet is peeled off, damage in which the pad is peeled off from the decorative substrates 56 and 57, and damage in which the wiring pattern around the pad is peeled off from the decorative substrates 56 and 57. Further, in the present specification, the damage of the small chip component itself includes the damage that the small chip component is cracked and the damage that the internal structure of the small chip component (for example, the laminated structure of bypass capacitors 85 and 97) is destroyed. Is done.

As a case where the decorative boards 56, 57 in which the small chip components are mounted may be distorted, when the decorative boards 56, 57 are screwed to the front door frame 14, the second mounting surface 95 of the decorative boards 56, 57 Electronic components such as the LED driver 126 and the LED chips 127 to 142 mounted on the first decorative board 56 when the harness (not shown) is attached to and detached from the connectors 111 to 115 mounted on the first decorative substrate 56. Is generated, and the heat exerts a thermal stress on the decorative substrates 56 and 57. Further, in a manufacturing method in which an electronic component including a small chip component is mounted on an assembly board including a plurality of decorative boards 56, 57 and then the assembly board is divided to take out a plurality of decorative boards 56, 57, the assembly board is divided. In this case, the decorative boards 56 and 57 on which the small chip components are mounted may be distorted. In these cases, bending stress may act on the decorative substrates 56 and 57, and torsional stress may act on the decorative substrates 56 and 57.

13 (a) is a plan view of the first mounting surface 84 of the first decorative substrate 56 in which the peripheral region 182 (FIG. 8 (b)) of the bypass capacitor 85 is enlarged, and FIG. 13 (b) is the peripheral region. It is explanatory drawing for demonstrating the relationship between the pad 171a, 171b of a region 182 and a solder resist 222. Further, FIG. 13 (c) is an explanatory diagram for explaining a movement mode of the bypass capacitor 85 that may occur in the present embodiment, and FIG. 13 (d) shows a movement mode of the bypass capacitor 85 that may occur in the comparative example. It is explanatory drawing for demonstrating. In FIG. 13B, the solder resist 222 is displayed with a hatch.

As shown in FIG. 13A, the first pad 171a and the second pad 171b corresponding to the first electrode 85a and the second electrode 85b of the bypass capacitor 85 are formed into a substantially rectangular shape. As shown in FIG. 13B, the first pad 171a and the second pad 171b have the same shape and the same size as each other. The vertical dimension LA1 of the pads 171a and 171b is approximately 0.35 mm, which is larger than the lateral dimension (approximately 0.3 mm) of the bypass capacitor 85. Since the pair of pads 171a and 171b have the same shape and the same size, the amount of solder paste applied on the pair of pads 171a and 171b can be substantially the same. The vertical dimension LA1 of the pads 171a and 171b may be the same as the dimension in the lateral direction of the bypass capacitor 85, and the vertical dimension LA1 of the pads 171a and 171b may be smaller than the dimension in the lateral direction of the bypass capacitor 85. It may be configured.

The lateral dimension LA2 of the pads 171a and 171b is approximately 0.32 mm. The first pad 171a and the second pad 171b are provided at a predetermined interval LA3 (specifically, approximately 0.28 mm) in the longitudinal direction (first direction DR1) of the bypass capacitor 85 (FIG. 13 (a)). Has been done. The distance (predetermined interval LA3) between the outer edge of the first pad 171a on the second pad 171b side and the outer edge of the second pad 171b on the first pad 171a side is a dimension (approximately 0.6 mm) in the longitudinal direction of the bypass capacitor 85. ) Is set in the range of approximately 1/3 (0.2 mm) to approximately 1/2 (approximately 0.3 mm). As a result, in the longitudinal direction of the bypass capacitor 85, the first electrode 85a of the bypass capacitor 85 is located substantially in the center of the first pad 171a, and the second electrode 85b is located substantially in the center of the second pad 171b. The bypass capacitor 85 can be mounted on the first decorative substrate 56.

No solder resist 222 is applied between the first pad 171a and the second pad 171b. When the solder resist 222 is applied to a narrow area between the first pad 171a and the second pad 171b, a part or all of the pads 171a and 171b are soldered when the application area of the solder resist 222 is displaced. The probability of defective products covered with resist 222 increases. On the other hand, since the solder resist 222 is not applied between the first pad 171a and the second pad 171b, a part or all of these pads 171a and 171b are covered with the solder resist 222. To prevent this, the solder paste can be adhered to the entire area of these pads 171a and 171b. As a result, the connection area between the first pad 171a and the first electrode 85a can be secured, and the mechanical strength of the connection portion between the first pad 171a and the first electrode 85a can be secured, and the second pad 171b and the second pad 171b can be secured. It is possible to secure the connection area with the second electrode 85b and secure the mechanical strength of the connection portion between the second pad 171b and the second electrode 85b.

As shown in FIG. 13A, since the pair of pads 171a and 171b are provided apart from the first direction DR1 which is the longitudinal direction of the bypass capacitor 85, the first decorative substrate 56 is used in the reflow furnace in the reflow process. By transporting the first decorative substrate 56 to the second direction DR2 orthogonal to the first direction DR1, the heating of the solder paste applied on the pair of pads 171a and 171b is abbreviated. It can be started at the same time.

The solder paste applied to the pads 171a and 171b is heated in a reflow furnace to become liquid molten solder. The molten solder floats and attracts the electrodes 85a and 85b of the bypass capacitor 85. The solder paste contains a flux component, and the molten solder flows on the pads 171a and 171b. In addition, gas is released from the molten solder. When the solder paste melts in one of the pads 171a and 171b before the other pad 171b, only one of the electrodes 85a and 85b of the bypass capacitor 85 comes into contact with the molten solder. The balance of the forces acting on the electrodes 85a and 85b of the bypass capacitor 85 is lost due to the surface tension of the molten solder. Then, the bypass capacitor 85 tends to rotate about the normal direction of the first decorative substrate 56, and the bypass capacitor 85 is placed on one pad 171a with one electrode 85a. So-called chip standing, which stands up substantially vertically, tends to occur. As described above, when there is a difference in the timing at which the solder paste melts between the pair of pads 171a and 171b, rotation of the bypass capacitor 85 and chip standing are likely to occur. On the other hand, in the reflow step, the first decorative substrate 56 is conveyed to the second direction DR2 and the heating of the solder paste applied on the pair of pads 171a and 171b is started substantially at the same time, whereby the pair of pads is started. The timing at which the solder paste melts can be aligned between 171a and 171b, and the rotation of the bypass capacitor 85 and the occurrence of chip standing can be prevented.

As shown in FIG. 8B, the bypass capacitor 85 is mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the bypass capacitor 85 is parallel to the first direction DR1. As shown in FIG. 8C, the small chip resistor 87 is mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip resistor 87 is parallel to the first direction DR1. Although not shown, the small chip resistors 143 to 149 are also mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip resistors 143 to 149 is parallel to the first direction DR1. As described above, the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149) are mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip components is parallel to the first direction DR1. Has been done.

As shown in FIGS. 8B and 8C, the separation directions of the pads 171a and 171b corresponding to the electrodes 85a and 85b of the bypass capacitor 85, and the pads 176a and the pads 176a corresponding to the electrodes 87a and 87b of the small chip resistor 87, The separation direction of 176b is the first direction DR1. The pads 171a, 171b, 176a, and 176b have a common separation direction in the plurality of small chip components. Therefore, in the reflow step, the first decorative substrate 56 is conveyed in a direction orthogonal to the common separation direction (first direction DR1) (second direction DR2) or in a direction substantially orthogonal to the common separation direction (first direction DR1), thereby causing a pair of bypass capacitors 85. It is possible to align the timing at which the heating of the solder paste applied on the pair of pads 171a and 171b corresponding to the electrodes 85a and 85b is started, and it corresponds to the pair of electrodes 87a and 87b of the small chip resistor 87. It is possible to align the timing at which the heating of the solder paste applied on the pair of pads 176a and 176b is started. This makes it possible to prevent the rotation of a plurality of small chip components and the occurrence of chip standing.

In the pads 171a and 171b corresponding to the electrodes 85a and 85b of the bypass capacitor 85, heat easily escapes to the wiring patterns 172a to 172d at the places where the wiring patterns 172a to 172d are drawn out (the drawing positions of the wiring patterns 172a to 172d). Therefore, the temperature rise in the initial heating stage of the reflow process is likely to be delayed as compared with the portion where the wiring patterns 172a to 172d are not drawn out. Further, the first wiring pattern 172a and the third wiring pattern 172c connected to the GND plane layer 93 or the power supply plane layer 94, which have a larger area than the pads 171a and 171b, are the GND plane layer 93 or the power supply plane layer. Compared with the second wiring pattern 172b and the fourth wiring pattern 172d which are not connected to 94, the temperature rise in the initial stage of heating is delayed. Therefore, in the first pad 171a, the place where the first wiring pattern 172a connected to the GND plane layer 93 is pulled out is in the initial stage of heating as compared with the place where the second wiring pattern 172b is pulled out. The temperature rise tends to be delayed. Further, in the second pad 171b, the temperature at the place where the third wiring pattern 172c connected to the power supply plane layer 94 is pulled out is higher than the place where the fourth wiring pattern 172d is pulled out at the initial stage of heating. The rise is likely to be delayed. In the reflow step, the temperature distribution in the pads 171a and 171b at the initial stage of heating changes due to the influence of the number of wiring patterns 172a to 172d drawn out from the pair of pads 171a and 171b, the drawing position and the connection destination. Further, the drawing direction of the wiring patterns 172a to 172d drawn out from the pair of pads 171a and 171b may also affect the temperature distribution in the pads 171a and 171b at the initial stage of heating. Although the details will be described later, in the first decorative substrate 56 in the present embodiment, the pair of pads 171a, 171b, so as not to cause a difference in the temperature distribution in the pads 171a, 171b at the initial stage of heating between the pair of pads 171a, 171b. The number of wiring patterns 172a to 172d drawn out from 171b, the drawing position, the connection destination, and the drawing direction are set.

As shown in FIG. 13D, in the bypass capacitor 183 in the comparative example, the first wiring pattern 185a is pulled out from the right end of the first pad 184a (or the first pad) toward the right, and the first wiring pattern 185a is drawn out. The second wiring pattern 185b is pulled out from the left end of the 1-pad 184a toward the left. The first wiring pattern 185a in the comparative example is a wiring pattern electrically connected to the GND plane layer 93 (FIG. 9) via the via hole 174, similarly to the first wiring pattern 172a of the present embodiment described above. The second wiring pattern 185b in the comparative example is a wiring pattern electrically connected to the GND terminal 154 of the LED driver 126, similarly to the second wiring pattern 172b in the present embodiment described above. Further, the third wiring pattern 185c is pulled out downward from the lower end of the second pad 184b (or the second pad), and the fourth wiring pattern 185d is drawn from the left end of the second pad 184b toward the left. It has been pulled out. The third wiring pattern 185c in the comparative example is a wiring pattern electrically connected to the power supply plane layer 94 (FIG. 9) via the via hole 175, similarly to the third wiring pattern 172c of the present embodiment described above. Further, the fourth wiring pattern 172d in the comparative example is a wiring pattern electrically connected to the power supply terminal 151 of the LED driver 126, similarly to the fourth wiring pattern 172d of the present embodiment described above. In the first pad 184a, the temperature rise at the portion where the first wiring pattern 185a and the second wiring pattern 185b are pulled out (the right end portion and the left end portion of the first pad 184a) tends to be delayed in the initial stage of heating. In particular, the temperature rise at the portion where the first wiring pattern 185a connected to the GND plane layer 93 is pulled out (the left end portion of the first pad 184a) tends to be delayed. Further, in the second pad 184b, the temperature rise at the portion where the third wiring pattern 185c and the fourth wiring pattern 185d are pulled out (the lower end portion and the left end portion of the second pad 184b) tends to be delayed in the initial stage of heating. In particular, the temperature rise at the portion where the third wiring pattern 185c connected to the power supply plane layer 94 is pulled out (the lower end portion of the second pad 184b) tends to be delayed. Therefore, in the initial heating stage of the reflow process, the temperature of the upper right side of the second pad 184b tends to rise. When the solder paste is melted only in the upper right side of the second pad 184b, as shown in FIG. 13D, the upper right side of the second pad 184b becomes the center of rotation and the first decorative substrate 56. The bypass capacitor 183 rotates with the normal direction as the rotation axis, and the bypass capacitor 183 may be mounted on the first decorative substrate 56 in a tilted state. In this case, the connection area between the first pad 184a and the first electrode 183a by the solder fillet 186 becomes small, which may cause a connection failure. Further, there is a possibility that the bypass capacitor 183 is mounted in a state where the first pad 184a and the first electrode 183a are not in electrical contact due to the rotation of the bypass capacitor 183. Furthermore, chip standing is likely to occur in which the bypass capacitor 183 rises on the first pad 184a with one electrode 183a. As described above, in the comparative example in which the drawing positions of the wiring patterns 185a to 185d drawn from the first pad 184a and the second pad 184b are different, the mounting failure of the bypass capacitor 183 is likely to occur.

On the other hand, in the first decorative substrate 56 in the present embodiment, as shown in FIG. 13A, the first wiring pattern 172a is pulled out from the first pad 171a in the right direction, and the third wiring pattern is formed. 172c is pulled out from the second pad 171b to the right. Further, the second wiring pattern 172b is pulled out from the first pad 171a to the left, and the fourth wiring pattern 172d is pulled out from the second pad 171b to the left. In a configuration in which the same number (specifically, two) of wiring patterns 172a to 172d are drawn out from the first pad 171a and the second pad 171b, the first wiring pattern 172a is pulled out from the center of the first pad 171a. The direction (right direction) in which the side of the first pad 171a is present is the direction in which the side of the second pad 171b from which the third wiring pattern 172c is pulled out is present when viewed from the center of the second pad 171b. The direction (left direction) in which the side of the first pad 171a from which the second wiring pattern 172b is pulled out when viewed from the center of the first pad 171a is present in the same direction as (right direction) is the second. The direction is the same as the direction (left direction) in which the side of the second pad 171b from which the fourth wiring pattern 172d is pulled out is present when viewed from the center of the pad 171b. As a result, it is possible to prevent a difference in the temperature distribution in the pair of pads 171a and 171b at the initial stage of heating in the reflow step, and it is possible to prevent the rotation of the bypass capacitor 85 and the occurrence of chip standing.

The first decorative substrate 56 is mounted with a plurality of capacitors (not shown) having larger dimensions in the longitudinal direction along a plane orthogonal to the thickness direction than the small chip components, and some of these capacitors are the first of the capacitors. The direction in which the side of the first pad from which the first wiring pattern is drawn from the center of the first pad (or the first pad) electrically connected to the first electrode exists is the second electrode of the capacitor. It is different from the direction in which the side of the second pad from which the third wiring pattern is pulled out is present when viewed from the center of the second pad (second pad) electrically connected to the capacitor. In the bypass capacitor 85, which is a small chip component, the direction in which the side of the first pad 171a from which the first wiring pattern 172a is pulled out is present when viewed from the center of the first pad 171a, and the direction seen from the center of the second pad 171b. The direction in which the side of the second pad 171b from which the third wiring pattern 172c is pulled out is the same, and the second wiring pattern 172b is pulled out when viewed from the center of the first pad 171a. The direction in which the side of the first pad 171a exists is the same as the direction in which the side of the second pad 171b from which the fourth wiring pattern 172d is pulled out when viewed from the center of the second pad 171b exists (left direction). By setting the direction to, the rotation of the bypass capacitor 85 and the occurrence of chip standing are prevented.

As shown in FIG. 8B, in the first pad 171a, the lead-out position of the first wiring pattern 172a electrically connected to the GND plane layer 93 (FIG. 9) via the via hole 174 is the first pad. At the right end of 171a, the third wiring pattern 172c, which is substantially centered in the vertical direction and is electrically connected to the power plane layer 94 (FIG. 9) via the via hole 175 in the second pad 171b, is at the lead-out position. It is approximately the center in the vertical direction at the right end of the 2 pad 171b. The GND plane layer 93 has a larger area than the first pad 171a, and the power supply plane layer 94 has a wider area than the second pad 171b.

The first pad 171a is electrically connected to the GND plane layer 93 having a larger area than the first pad 171a via the first wiring pattern 172a, and the second pad 171b is connected via the third wiring pattern 172c. In a configuration electrically connected to the power supply plane layer 94 having a larger area than the second pad 171b, the first wiring pattern 172a among the four sides of the first pad 171a is viewed from the center of the first pad 171a. The direction in which the pulled out side exists (right direction) is the direction in which the side in which the third wiring pattern 172c is pulled out is present when viewed from the center of the second pad 171b among the four sides of the second pad 171b (the right direction). It is the same direction as the right direction). This reduces the possibility that the temperature distribution in the pair of pads 171a and 171b will differ in the initial heating stage of the reflow step.

As shown in FIG. 13A, the width dimension of the first wiring pattern 172a drawn to the right from the right end of the first pad 171a is the third width dimension drawn to the right from the right end of the second pad 171b. It is substantially the same as the width dimension of the wiring pattern 172c. Therefore, the possibility that the temperature distribution in the pair of pads 171a and 171b is different in the initial heating stage of the reflow process is reduced as compared with the configurations in which the width dimensions of the wiring patterns 172a and 172c are different. Further, the width dimension of the second wiring pattern 172b pulled out from the left end of the first pad 171a to the left is abbreviated as the width dimension of the fourth wiring pattern 172d pulled out from the left end of the second pad 171b to the left. It is the same. Therefore, as compared with the configurations in which the width dimensions of the wiring patterns 172b and 172d are different, the possibility that the temperature distribution in the pair of pads 171a and 171b is different in the initial heating stage of the reflow process is reduced.

As described above, since the first wiring pattern 172a electrically connected to the GND plane layer 93 is drawn from the right end of the first pad 171a, the right side of the first pad 171a is the left side of the first pad 171a. The temperature rise in the initial stage of heating is more likely to be delayed. Further, since the third wiring pattern 172c connected to the power plane layer 94 is pulled out from the right end of the second pad 171b, the right side of the second pad 171b is in the initial heating stage than the left side of the second pad 171b. The temperature rise tends to be delayed. The number of wiring patterns 172a and 172c drawn out from the first pad 171a is the same as the number of wiring patterns 172b and 172d drawn out from the second pad 171b. Further, the direction in which the side from which the first wiring pattern 172a is drawn out when viewed from the center of the first pad 171a among the four sides of the first pad 171a exists is the second of the four sides of the second pad 171b. The third wiring pattern 172c is in the same direction as the direction in which the side from which the third wiring pattern 172c is pulled out exists when viewed from the center of the pad 171b, and is the third of the four sides of the first pad 171a when viewed from the center of the first pad 171a. 2 The direction in which the side from which the wiring pattern 172b is drawn exists is the direction in which the side from which the fourth wiring pattern 172d is drawn exists from the four sides of the second pad 171b when viewed from the center of the second pad 171b. In the same direction as. As a result, the force acting on the first electrode 85a of the bypass capacitor 85 due to the surface tension of the molten solder on the first pad 171a and the surface tension of the molten solder on the second pad 171b cause the second electrode 85b of the bypass capacitor 85 to be affected. It can be balanced with the acting force. Therefore, even if only the left side portion of the solder paste is melted first in the pair of pads 171a and 171b, as shown in FIG. 13C, the movement mode of the bypass capacitor 85 is set to translation and bypass is performed. The rotation of the capacitor 85 can be prevented. As a result, the degree of decrease in the connection area between the first pad 171a and the first electrode 85a due to the solder fillet 173a can be suppressed, and the decrease in the connection area between the second pad 171b and the second electrode 85b due to the solder fillet 173b can be suppressed. The degree of can be suppressed.

14 (a) is a plan view of the first mounting surface 84 of the first decorative substrate 56 showing an enlarged peripheral region 187 (FIG. 8 (c)) of the small chip resistor 87, and FIG. 14 (b) is a plan view. It is explanatory drawing for demonstrating the relationship between the pad 176a, 176b of the peripheral area 187 and the solder resist 222. Further, FIG. 14 (c) is an explanatory diagram for explaining a movement mode of the small chip resistor 87 that may occur in the present embodiment, and FIG. 14 (d) is a small chip resistor 191 that may occur in the comparative example. It is explanatory drawing for demonstrating the movement mode of. In FIG. 14B, the solder resist 222 is displayed with a hatch.

As shown in FIG. 14A, the first pad 176a and the second pad 176b corresponding to the first electrode 87a and the second electrode 87b of the small chip resistor 87 are formed into substantially rectangular shapes. As shown in FIG. 14B, the first pad 176a and the second pad 176b have the same shape and the same size as each other. The vertical dimension LB1 of the pads 176a and 176b is approximately 0.35 mm, which is larger than the lateral dimension (approximately 0.3 mm) of the small chip resistor 87. Since the pair of pads 176a and 176b have the same shape and the same size, the amount of solder paste applied on the pair of pads 176a and 176b can be substantially the same. The vertical dimension LB1 of the pads 176a and 176b may be the same as the dimension in the lateral direction of the small chip resistor 87, and the vertical dimension LB1 of the pads 176a and 176b may be the same as the dimension in the lateral direction of the small chip resistor 87. The configuration may be smaller than the dimensions.

The horizontal dimension LB2 of the pads 176a and 176b is approximately 0.32 mm. The first pad 176a and the second pad 176b are separated from each other in the longitudinal direction (first direction DR1) of the small chip resistor 87 (FIG. 14 (a)) by a predetermined interval LB3 (specifically, approximately 0.28 mm). It is provided. The distance (predetermined interval LB3) between the outer edge of the first pad 176a on the second pad 176b side and the outer edge of the second pad 176b on the first pad 176a side is a dimension (approximately 0) in the longitudinal direction of the small chip resistor 87. It is set in the range of approximately 1/3 (0.2 mm) to approximately 1/2 (approximately 0.3 mm) of (0.6 mm). As a result, in the longitudinal direction of the small chip resistor 87, the first electrode 87a of the small chip resistor 87 is located substantially in the center of the first pad 176a and the second electrode 87b is located substantially in the center of the second pad 176b. In this embodiment, the small chip resistor 87 can be mounted on the first decorative substrate 56.

No solder resist 222 is applied between the first pad 176a and the second pad 176b. When the solder resist 222 is applied to a narrow area between the first pad 176a and the second pad 176b, a part or all of the pads 176a and 176b are soldered when the application area of the solder resist 222 is displaced. The probability of defective products covered with resist 222 increases. On the other hand, since the solder resist 222 is not applied between the first pad 176a and the second pad 176b, a part or all of these pads 176a and 176b are covered with the solder resist 222. To prevent this, the solder paste can be adhered to the entire area of these pads 176a and 176b. As a result, the connection area between the first pad 176a and the first electrode 87a can be secured, and the mechanical strength of the connection portion between the first pad 176a and the first electrode 87a can be secured, and the second pad 176b and the second pad 176b can be secured. It is possible to secure the connection area with the second electrode 87b and secure the mechanical strength of the connection portion between the second pad 176b and the second electrode 87b.

As shown in FIG. 14D, in the small chip resistor 191 in the comparative example, the first wiring pattern 193a is pulled out from the right end of the first pad 192a (or the first pad) toward the right, and the first wiring pattern 193a is drawn out. The second wiring pattern 193b is pulled out from the left end of the second pad 192b (or the second pad) toward the left. The first wiring pattern 193a in the comparative example is a wiring pattern electrically connected to the second electrode 142b (FIG. 8C) of the LED chip 142, similarly to the first wiring pattern 181a of the present embodiment described above. The second wiring pattern 193b in the comparative example is a wiring pattern electrically connected to the eighth output terminal 162 of the LED driver 126, similarly to the second wiring pattern 181b in the present embodiment described above. .. The right side of the first pad 192a from which the first wiring pattern 193a is pulled out tends to be delayed in temperature rise in the initial heating stage of the reflow process as compared with the left side from which the wiring pattern is not pulled out. Further, the left side of the second pad 192b from which the second wiring pattern 193b is pulled out tends to be delayed in temperature rise in the initial stage of heating as compared with the right side from which the wiring pattern is not pulled out. Therefore, in the initial stage of heating, a state in which only the left side portion of the solder paste on the first pad 192a and only the right side portion of the solder paste on the second pad 192b are likely to be melted is likely to occur, as shown in FIG. 14 (d). In addition, the small chip resistor 191 rotates with the normal direction of the first decorative board 56 as the rotation axis, and the small chip resistor 191 may be mounted on the first decorative board 56 in an inclined state. .. When the small chip resistor 191 is mounted in an inclined state, the connection area between the first pad 184a and the first electrode 183a by the solder fillet 194 becomes smaller, and the second pad 184b and the second electrode 183b become smaller. The connection area by the solder fillet 195 becomes small. Further, there is a possibility that the small chip resistor 191 is mounted in a state where the first pad 192a and the first electrode 191a are not in electrical contact due to the rotation of the small chip resistor 191. Furthermore, chip standing in which the small chip resistor 191 rises on one electrode 191a on the first pad 192a is likely to occur. As described above, in the comparative example in which the wiring patterns 193a and 193b are different from each other in the pair of pads 192a and 192b, the mounting defect of the small chip resistor 191 is likely to occur.

On the other hand, in the first decorative substrate 56 in the present embodiment, as shown in FIG. 14A, the first wiring pattern 181a is pulled out from the right end to the right of the first pad 176a, and the first wiring pattern 181a is drawn out. The second wiring pattern 181b is pulled out from the right end of the second pad 176b toward the right. The pull-out position of the first wiring pattern 181a is substantially centered in the vertical direction at the right end of the first pad 176a, and the pull-out position of the second wiring pattern 181b is substantially centered in the vertical direction at the right end of the second pad 176b. In a configuration in which the same number (specifically, one) of wiring patterns 181a and 181b are drawn out from the first pad 176a and the second pad 176b, the center of the first pad 176a among the four sides of the first pad 176a. In the direction (right direction) in which the side from which the first wiring pattern 181a is pulled out exists, the second wiring pattern 181b is pulled out from the center of the second pad 176b among the four sides of the second pad 176b. It is the same direction as the direction in which the side is present (right direction). As a result, it is possible to prevent a difference in the temperature distribution in the pair of pads 176a and 176b at the initial stage of heating in the reflow process, and it is possible to prevent the rotation of the small chip resistor 87 and the occurrence of chip standing.

The first decorative substrate 56 is equipped with a plurality of resistors (not shown) having a larger longitudinal dimension along a plane orthogonal to the thickness direction than the small chip component, and some of these resistors have resistors. Of the four sides of the first pad (or first pad) electrically connected to the first electrode of the vessel, the direction in which the side from which the first wiring pattern is drawn from the center of the first pad exists is Of the four sides of the second pad (or second pad) electrically connected to the second electrode of the resistor, there is a side from which the second wiring pattern is drawn out when viewed from the center of the second pad. It is different from the direction of doing. In the small chip resistor 87, which is a small chip component, of the four sides of the first pad 176a, the direction in which the side from which the first wiring pattern 181a is drawn out when viewed from the center of the first pad 176a exists and the second. The rotation of the small chip resistor 87 is performed by making the direction in which the side from which the second wiring pattern 181b is drawn out is present when viewed from the center of the second pad 176b among the four sides of the pad 176b. And the occurrence of chip standing is prevented.

Since the right end of the first pad 176a is the drawing position of the first wiring pattern 181a, the temperature rise in the initial heating stage is more likely to be delayed than the left end of the first pad 176a. Further, since the right end of the second pad 176b is the drawing position of the second wiring pattern 181b, the temperature rise in the initial heating stage is more likely to be delayed than the left end of the second pad 176b. The number of wiring patterns 181a drawn out from the first pad 176a is the same as the number of wiring patterns 181b drawn out from the second pad 176b. Of the four sides of the first pad 176a, the direction (right direction) in which the side from which the first wiring pattern 181a is drawn out when viewed from the center of the first pad 176a is the direction (right direction) among the four sides of the second pad 176b. When viewed from the center of the second pad 176b, the direction is the same as the direction in which the side from which the second wiring pattern 181b is pulled out exists. As a result, the force acting on the first electrode 87a of the small chip resistor 87 due to the surface tension of the molten solder on the first pad 176a and the surface tension of the molten solder on the second pad 176b cause the small chip resistor 87 to become the first. The force acting on the two electrodes 87b can be balanced. Therefore, even if only the left side portion of the solder paste of the pair of first pads 176a and second pad 176b is melted first, as shown in FIG. 14 (c), the movement mode of the small chip resistor 87 Can be translated to prevent the small chip resistor 87 from rotating. As a result, the degree of decrease in the connection area between the first pad 176a and the first electrode 87a due to the solder fillet 177a can be suppressed, and the decrease in the connection area between the second pad 176b and the second electrode 87b due to the solder fillet 177b can be suppressed. The degree of can be suppressed.

As described above, the first pad 176a electrically connected to the first electrode 87a of the small chip resistor 87 is electrically connected to the second electrode 142b of the LED chip 142 via the first wiring pattern 181a. It is electrically connected to the second pad 178b (see FIG. 8C). Further, as already described, the second pad 176b electrically connected to the second electrode 87b of the small chip resistor 87 is the LED driver 126 (FIG. 8A) via the second wiring pattern 181b. It is electrically connected to a pad (or pad, not shown) that is electrically connected to the eighth output terminal 162 (FIG. 11). As shown in FIGS. 8 (a) and 8 (c), the second pad 178b of the connection destination when viewed from the first pad 176a exists in the upward direction, and is connected to the connection destination when viewed from the second pad 176b. The pad (or pad, not shown) corresponding to the eighth output terminal 162 exists in the upper left direction. In the pad (not shown) corresponding to the eighth output terminal 162, the place where the second wiring pattern 181b is connected is the drawing direction of the second wiring pattern 181b from the second pad 176b (FIGS. 8A and 8C). 2nd wiring from the 2nd pad 176b with reference to the 2nd pad 176b when viewed in the direction of one axis (the second direction DR2 in FIGS. 8A and 8C) including the right direction in the above. It exists in the direction opposite to the pull-out direction of the pattern 181b. The second wiring pattern 181b is drawn out from the second pad 176b in the same direction (right direction) as the drawing direction of the first wiring pattern 181a from the first pad 176a, and then in the direction of the one axis (second direction DR2). ), It is routed in the opposite direction with respect to the second pad 176b.

A location where the second wiring pattern 181b exists in the direction opposite to the drawing direction of the second wiring pattern 181b from the second pad 176b with respect to the second pad 176b when viewed in the direction of one axis (second direction DR2). The second wiring pattern 181b is also drawn out from the second pad 176b in the same direction as the drawing direction of the first wiring pattern 181a from the first pad 176a even in the configuration in which the second wiring pattern 181b is connected to the connection destination. This makes it possible to reduce the possibility of a difference in temperature distribution in the pair of first pads 176a and second pads 176b in the initial heating stage of the reflow step.

As shown in FIG. 14A, the width dimension of the first wiring pattern 181a drawn to the right from the right end of the first pad 176a is the second width dimension drawn to the right from the right end of the second pad 176b. It is substantially the same as the width dimension of the wiring pattern 181. Therefore, there is a difference in the temperature distribution in the pair of pads 176a, 176b in the initial heating stage of the reflow process, as compared with the configuration in which the width dimensions of the wiring patterns 181a, 181b drawn from the pads 176a, 176b are different. The possibility of occurrence is reduced.

As already described with reference to FIGS. 8A to 8C, in the first decorative substrate 56, the small chip component has a longitudinal direction of the small chip component in the first direction DR1 (first decorative substrate 56). It is mounted on the first decorative substrate 56 in a manner parallel to the longitudinal direction of the first decorative substrate 56. Therefore, the first decorative substrate 56 is compared with the case where the small chip component is mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip component is orthogonal to the first direction DR1 (longitudinal direction of the first decorative substrate 56). The maximum value of stress that can be applied to the connection point between the small chip component and the first decorative substrate 56 when the small chip component is distorted is reduced, and the maximum value of stress that can be applied to the small chip component itself is reduced. ing.

As described above, the first decorative substrate 56 is mounted with a plurality of capacitors (not shown) having a larger dimension in the longitudinal direction along a plane orthogonal to the thickness direction than the small chip component. Some of these capacitors are mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the capacitors is not parallel to the first direction DR1. The small chip component is protected by being mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip component is orthogonal to the first direction DR1.

As shown in FIG. 10B, the bypass capacitor 97 is mounted on the second decorative substrate 57 in such a manner that the longitudinal direction of the bypass capacitor 97 is parallel to the longitudinal direction LD of the second decorative substrate 57. Further, as shown in FIG. 10 (c), the small chip resistor 101 has a second decorative substrate 57 in such a manner that the longitudinal direction of the small chip resistor 101 is parallel to the longitudinal direction LD of the second decorative substrate 57. It is implemented in. As described above, the small chip component (bypass capacitor 97 and small chip resistor 101) is attached to the second decorative substrate 57 in such a manner that the longitudinal direction of the small chip component is parallel to the long axis direction LD of the second decorative substrate 57. Since it is mounted, it is mounted on the second decorative board 57 in a manner in which the longitudinal direction of the small chip component is orthogonal to the long axis direction LD of the second decorative board 57, as compared with the case where the small chip component is mounted on the second decorative board 57. The maximum value of the stress that can be applied to the connection point between the small chip component and the second decorative substrate 57 when distortion occurs is reduced, and the maximum value of the stress that can be applied to the small chip component itself is reduced. There is.

As shown in FIG. 8B, in the first decorative substrate 56, the first wiring pattern 172a drawn from the first pad 171a and the third wiring pattern 172c drawn out from the second pad 171b are bypass capacitors. It extends in a direction orthogonal to the longitudinal direction of the 85 (one of the lateral directions of the bypass capacitor 85). Further, the second wiring pattern 172b drawn from the first pad 171a and the fourth wiring pattern 172d drawn out from the second pad 171b are in a direction orthogonal to the longitudinal direction of the bypass capacitor 85 (the short side of the bypass capacitor 85). Extends in the other direction). As described above, the wiring patterns 172a to 172d drawn out from the pads 171a and 171b of the bypass capacitor 85 extend in the direction orthogonal to the longitudinal direction (short direction) of the bypass capacitor 85. The wiring patterns 172a to 172d drawn out from the pads 171a and 171b of the bypass capacitor 85 may extend in a direction substantially orthogonal to the longitudinal direction of the bypass capacitor 85.

As described above, the pads 171a and 171b and the wiring patterns 172a to 172d are integrally formed, and the electrodes 85a and 85b of the bypass capacitor 85 are fixed to the pads 171a and 171b by the solder fillets 173a and 173b. Assuming that the wiring patterns 172a to 172d drawn out from the pads 171a and 171b extend in a direction parallel to the longitudinal direction of the bypass capacitor 85, a folding line extending in a direction orthogonal to the longitudinal direction or a direction substantially orthogonal to the longitudinal direction. When a force that bends the first decorative substrate 56 acts on the first decorative substrate 56 with the above as a starting point, the connection portion between the bypass capacitor 85 and the first decorative substrate 56 is likely to be damaged, and the bypass capacitor is easily damaged. The 85 itself is likely to be damaged. Further, in this configuration, the stress acting on the periphery of the bypass capacitor 85 due to the distortion of the first decorative substrate 56 is likely to be transmitted to the bypass capacitor 85 itself, and the bypass capacitor 85 is likely to be damaged. On the other hand, the wiring patterns 172a to 172d drawn out from the pads 171a and 171b extend in a direction orthogonal to the longitudinal direction of the bypass capacitor 85 or in a direction substantially orthogonal to the longitudinal direction, whereby the first decorative substrate 56 The maximum value of the stress that can act on the connection point between the bypass capacitor 85 and the first decorative board 56 when the first decorative board 56 is distorted is reduced, and the bypass capacitor 85 is reduced when the first decorative board 56 is distorted. The maximum value of stress that can act on itself has been reduced. As a result, it is possible to prevent damage to the connection portion between the bypass capacitor 85 and the first decorative substrate 56, and it is also possible to prevent damage to the bypass capacitor 85 itself.

As described above, the first decorative substrate 56 is equipped with a plurality of capacitors (not shown) having larger dimensions in the longitudinal direction along a plane orthogonal to the thickness direction than the small chip components, and some of these capacitors are mounted. , The drawing direction of the wiring pattern drawn from the pad (or pad) electrically connected to the electrode of the capacitor is drawn in a direction different from the direction orthogonal to the longitudinal direction of the capacitor and the direction substantially orthogonal to the longitudinal direction of the capacitor. .. The bypass capacitor 85, which is a small chip component, is protected by the configuration in which the wiring patterns 172a to 172d drawn out from the pads 171a and 171b extend in a direction orthogonal to the longitudinal direction of the bypass capacitor 85 or in a direction substantially orthogonal to the longitudinal direction. Has been done.

As described above, the wiring patterns 181a and 181b drawn out from the pads 176a and 176b of the small chip resistor 87 are the second direction DR2 (of the small chip resistor 87) orthogonal to the longitudinal direction of the small chip resistor 87. It extends in the lateral direction). Further, as described above, the small chip resistor 87 is electrically connected to the wiring patterns 181a and 181b by the solder fillets 177a and 177b that electrically contact the electrodes 87a and 87b and the pads 176a and 176b. Assuming that the wiring patterns 181a and 181b drawn out from the pads 176a and 176b extend in a direction parallel to the longitudinal direction of the small chip resistor 87, the distortion of the first decorative substrate 56 causes the bypass capacitor 85 to be around. The acting stress is easily transmitted to the bypass capacitor 85 itself, and the bypass capacitor 85 is easily damaged. On the other hand, the wiring patterns 181a and 181b drawn out from the pads 176a and 176b of the small chip resistor 87 are orthogonal to the longitudinal direction of the small chip resistor 87 (the short side direction of the small chip resistor 87). Alternatively, the maximum value of the stress that can act on the small chip resistor 87 can be reduced by adopting a configuration that extends in a direction substantially orthogonal to each other. As a result, it is possible to prevent damage to the connection portion between the small chip resistor 87 and the first decorative substrate 56 when the first decorative substrate 56 is distorted.

As described above, the first decorative substrate 56 is equipped with a plurality of resistors (not shown) having a larger longitudinal dimension along a plane orthogonal to the thickness direction than the small chip component, and one of these resistors. In the section, the pull-out direction of the wiring pattern drawn from the pad (or pad) electrically connected to the electrode of the resistor is different from the direction orthogonal to the longitudinal direction of the resistor and the direction substantially orthogonal to the longitudinal direction of the resistor. It has been pulled out. The small chip resistor 87, which is a small chip component, has a configuration in which the wiring patterns 181a and 181b drawn out from the pads 176a and 176b extend in a direction orthogonal to the longitudinal direction of the small chip resistor 87 or in a direction substantially orthogonal to the longitudinal direction. It is protected by doing.

As shown in FIGS. 8 (a) to 8 (c), in the first decorative substrate 56, the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are first mounted. It is mounted only on the surface 84 side, and is not mounted on the second mounting surface 95 side. In the first decorative substrate 56, the LED chips 127 to 142 (FIG. 11) and the LED driver 126 are also mounted on the first mounting surface 84 in a configuration in which the small chip components are integrated on the first mounting surface 84 side.

FIG. 15A is a plan view showing a second mounting surface 95 of the first decorative substrate 56, and FIG. 15B is a first decorative substrate 56 showing an enlarged back side region 205 of the first light emitting circuit unit 121. It is a plan view of the 2nd mounting surface 95 of the above. As shown in FIG. 15B, the small chip component is not mounted in the LED back side corresponding area 201 of the second mounting surface 95. The LED back side corresponding area 201 includes a region of the second mounting surface 95 located on the back side of the region where the LED chips 127 to 142 (FIG. 9) are mounted on the first mounting surface 84 (FIG. 8A) and the second mounting surface 95. 2 The area where the distance from the outer edge of the area of the mounting surface 95 is within 1 mm. The LED chips 127 to 142 have a configuration in which the small chip components are not mounted in the region of the second mounting surface 95 located on the back side of the region where the LED chips 127 to 142 are mounted on the first mounting surface 84. The influence of the thermal stress that can act on the first decorative substrate 56 due to the heat generation on the small chip component is reduced. The LED back side corresponding region 201 is a region that is repeatedly heated by the heat generated when the LED chips 127 to 142 are driven, and is a region in which distortion due to heat of the first decorative substrate 56 is likely to occur. Assuming that the small chip component is mounted in the corresponding area 201 on the back side of the LED, the light emitting effect on the first decorative substrate 56 is repeatedly executed, so that the thermal stress is applied to the connection point between the small chip component and the first decorative substrate 56. There is a risk that the load of the LED will accumulate, and the load of thermal stress may accumulate on the small chip component itself. On the other hand, since the small chip component is mounted avoiding the LED back side corresponding area 201, the small chip component and the first decoration are caused by the fact that the light emitting effect on the first decorative substrate 56 is repeatedly executed. It is possible to prevent the connection point with the substrate 56 from being damaged, and it is possible to prevent the small chip component itself from being damaged.

As shown in FIG. 15B, the small chip component is not mounted in the corresponding area 202 on the back side of the driver on the second mounting surface 95. The driver back side corresponding area 202 is a pad (or pad) corresponding to the area where the LED driver 126 (FIG. 8 (a)) is mounted on the first mounting surface 84 (FIG. 8 (a)) and the terminal of the LED driver 126. Is a region of the second mounting surface 95 located on the back side of the region provided with the above, and a region where the distance from the outer edge of the region of the second mounting surface 95 is within 1 mm. Since the small chip component is not mounted in the area of the second mounting surface 95 located on the back side of the area where the LED driver 126 is mounted on the first mounting surface 84, the first is generated by the heat generated by the LED driver 126. The influence of the thermal stress that can act on the decorative substrate 56 on the small chip components is reduced. The driver back side corresponding region 202 is a region that is repeatedly heated by the heat generated when the LED driver 126 is driven, and is a region in which distortion due to heat of the first decorative substrate 56 is likely to occur. Assuming that the small chip component is mounted in the corresponding area 202 on the back side of the driver, the light emitting effect on the first decorative board 56 is repeatedly executed, so that thermal stress is applied to the connection point between the small chip component and the first decorative board 56. There is a risk that the load will accumulate, and at the same time, the load of thermal stress may accumulate on the small chip component itself. On the other hand, since the small chip component is mounted so as to avoid the corresponding area 202 on the back side of the driver, the small chip component and the first decoration are caused by the fact that the light emitting effect on the first decorative substrate 56 is repeatedly executed. It is possible to prevent the connection point with the substrate 56 from being damaged, and it is possible to prevent the small chip component itself from being damaged.

As shown in FIGS. 8A to 8C, in the first decorative substrate 56, the small chip components (bypass capacitor 85 and small chip resistor 87) have a distance of 1 mm or more from the outer edge of the LED chip 142. It is placed and placed. By arranging the small chip component at a distance of 1 mm or more from the outer edge of the LED chip 142, it is possible to prevent the connection point between the small chip component and the first decorative substrate 56 from being damaged by thermal stress. It is possible to prevent the small chip component itself from being damaged by thermal stress.

As shown in FIGS. 8A to 8C, in the first decorative substrate 56, the small chip components (bypass capacitor 85 and small chip resistor 87) are the outer edge of the LED driver 126 and the terminals of the LED driver 126. It is arranged at a distance of 1 mm or more from the corresponding pad. By arranging the small chip component at a distance of 1 mm or more from the outer edge of the LED driver 126 and the pad corresponding to the terminal of the LED driver 126, the connection point between the small chip component and the first decorative substrate 56 is damaged by thermal stress. It is possible to prevent the small chip component itself from being damaged by thermal stress.

As shown in FIGS. 8 (a) to 8 (c), in the first decorative substrate 56, the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are around the through hole. It is arranged so as to avoid the regions 211a to 211d. The through-hole peripheral regions 211a to 211d are regions where the distance from the outer edge of the fixed through-holes 56d to 56g is less than 5 mm. When the first decorative substrate 56 is screwed to the front door frame 14, a force that causes distortion in the first decorative substrate 56 may act on the through-hole peripheral regions 211a to 211d. By arranging the small chip component at a distance of 5 mm or more from the outer edge of the fixed through hole 56d to 56 g, it may occur in the vicinity of the fixed through hole 56d to 56 g when the first decorative substrate 56 is screwed to the front door frame 14. It is possible to prevent the connection portion between the small chip component and the first decorative board 56 from being damaged due to the distortion of the decorative substrate 56, and it is possible to prevent the small chip component itself from being damaged.

As shown in FIG. 8A, the fixed through holes 56d to 56g are provided at the corners of the first decorative substrate 56. Therefore, the area of the region where the small chip component cannot be mounted on the first decorative substrate 56 is reduced as compared with the configuration in which the fixed through holes 56d to 56 g are provided near the center of the first decorative substrate 56.

As described above, the fixed through hole 56e is provided in the protruding portion 56c of the stepped recess 56a. This makes it possible to stably fix the first decorative substrate 56 to the front door frame 14 while securing an area on which small chip components can be mounted.

In the configuration in which the small chip components are integrated on the first mounting surface 84, the connectors 111 and 112 are integrated on the second mounting surface 95 as shown in FIG. 15A. As shown in FIG. 8A, the small chip components are arranged on the first mounting surface 84 so as to avoid the corresponding areas 203 and 204 on the back side of the connector. The corresponding areas 203 and 204 on the back side of the connector are the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95 (FIG. 15A) and the first mounting surface. The region of 84 is a region where the distance from the outer edge is less than 5 mm. Harnesses to the connectors 111 and 112 are configured so that the small chip components are not mounted in the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95. The influence of the stress that can act on the first decorative substrate 56 when attaching and detaching the first decorative substrate 56 to the small chip component is reduced. The corresponding areas 203 and 204 on the back side of the connector are areas in which tensile stress is likely to be applied when the harness (not shown) is attached to the connectors 111 and 112, and compressive stress is applied when the harness is pulled out from the connectors 111 and 112. It is an easy area. If the small chip parts are mounted in the corresponding areas 203 and 204 on the back side of the connector, stress may act on the connection points between the small chip parts and the first decorative board 56 when the harness is attached to and detached from the connectors 111 and 112. At the same time, stress may act on the small chip component itself. On the other hand, since the small chip parts are arranged so as to avoid the corresponding areas 203 and 204 on the back side of the connector, the connection points between the small chip parts and the first decorative board 56 are provided when the harness is attached to and detached from the connectors 111 and 112. It is prevented from being damaged and the small chip component itself is prevented from being damaged.

As shown in FIG. 8A, the LED driver 126 is arranged in an area including an area less than 10 mm from the outer edge of the first decorative substrate 56, while the small chip components (bypass capacitor 85 and small chip resistor 87) are arranged. , 143 to 149 (FIG. 11)) are arranged at a distance of 10 mm or more from the outer edge of the first decorative substrate 56. As described above, among the various electronic components mounted on the first decorative board 56, the connection points between the small chip components and the first decorative board 56 are the connection points between the other electronic components and the first decorative board 56. In comparison, the mechanical strength is low. Since the small chip component is arranged at a distance of 10 mm or more from the outer edge of the first decorative substrate 56, the operator's hand touches the small chip component when handling the first decorative substrate 56, and the small chip component and the first decorative substrate 56 are arranged. 1 The possibility that the connection point with the decorative substrate 56 is damaged is reduced, and the possibility that the small chip component itself is damaged is reduced.

Small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged avoiding areas around the through holes 211a to 211d and areas where the distance from the outer edge of the first decorative substrate 56 is less than 10 mm. In this configuration, the fixed through holes 56d to 56 g are provided in a region where the distance from the outer edge of the first decorative substrate 56 is less than 10 mm. Therefore, the area of the area where the small chip component can be mounted in the first decorative substrate 56 is compared with the configuration in which the fixed through holes 56d to 56 g are provided at a position 10 mm or more away from the outer edge of the first decorative substrate 56. Is widely secured.

As shown in FIG. 8B, in the first decorative substrate 56, around the LED driver 126, an outer silk 213 that makes it possible to grasp the mounting position of the LED driver 126, and the mounted electronic components are the LED driver 126. The identification silk 214 (indicated as "IC1"), which makes it possible to grasp the fact that the silk 214 is used, is provided. Further, as shown in FIG. 8 (c), around the LED chip 142, the outer silk 215 that makes it possible to grasp the mounting position of the LED chip 142, and the mounted electronic component is the LED chip 142. An identification silk 216 (displayed as "LED 16") that can be grasped is provided. As shown in FIG. 9, the first wiring layer 91 is covered with a solder resist 222. The outer shape silk 213 and the identification silk 214 are printed in such a manner that they are convex from the first mounting surface 84. Printing of the outer silks 213 and 215 and the identification silks 214 and 216 is performed before the electronic components are mounted on the first decorative substrate 56.

After mounting the electronic components including the small chip components on the first decorative substrate 56, when visually confirming that no mounting omission of the electronic components has occurred, the operator is in the place where the outer silks 213 and 215 are provided. By comparing with the place where the electronic component (LED driver 126 and the LED chip 142) is mounted, it is possible to grasp whether or not the electronic component is mounted at an accurate position. Further, the operator can grasp the types of the mounted electronic components (LED driver 126 and LED chip 142) based on the display contents of the identification silks 214 and 216.

As shown in FIG. 8B, only the identification silk 217 (indicated as “C1”) is provided around the bypass capacitor 85 so that it can be confirmed that the mounted electronic component is the bypass capacitor 85. The outer silk is not provided so that the mounting position of the bypass capacitor 85 can be grasped. As already explained, the outer dimensions (vertical dimension, horizontal dimension and height dimension) of the bypass capacitor 85 are compared with the outer dimensions of electronic parts (LED driver 126, LED chips 127 to 142, etc.) other than small chip parts. small. Therefore, when the outer silk of the bypass capacitor 85 is printed on the first decorative substrate 56, the bypass capacitor is viewed only by looking at the outer silk even though the mounting omission of the bypass capacitor 85 actually occurs after the electronic components are mounted. If 85 is mounted, the operator may mistakenly recognize it. On the other hand, by forming the outer shape silk around the bypass capacitor 85, it is possible to easily grasp the mounting omission of the bypass capacitor 85 after mounting the electronic components. Further, since the identification silk 217 is provided around the bypass capacitor 85, it is possible to grasp that the component mounted around the identification silk 217 is the bypass capacitor 85.

As described above, the outer dimensions of the small chip resistor 87 are smaller than the outer dimensions of electronic components other than the small chip components, similar to the outer dimensions of the bypass capacitor 85. As shown in FIG. 8 (c), the identification silk 218 (indicated as "R8") that makes it possible to confirm that the electronic component mounted around the small chip resistor 87 is the small chip resistor 87. ) Is provided, and no external silk is provided so that the mounting position of the small chip resistor 87 can be confirmed. As a result, it is possible to easily grasp the mounting omission of the small chip resistor 87. Further, since the identification silk 218 is provided around the small chip resistor 87, it is possible to grasp that the electronic component mounted around the identification silk 218 is the small chip resistor 87. be able to. When the electronic component is mounted on the first decorative board 56 by using the automatic mounting device, the automatic mounting device mounts the electronic component by controlling the coordinates from the reference position on the first decorative board 56, so that it is a small chip component. Even if the outer shape silk is not provided around the surface, the mounting position of the small chip component does not shift.

The character dimensions of the identification silks 217 and 218 provided around the small chip components (bypass capacitor 85 and small chip resistor 87) are larger than those of the small chip components (LED driver 126 and LED chip 142). It is the same size as the character size of the identification silks 214 and 216 provided around it. This facilitates visual confirmation of the identification silks 217 and 218 provided around the small chip parts.

16 (a) is a cross-sectional view of the first decorative substrate 56 in the present embodiment, and FIG. 16 (b) is a cross-sectional view of the first decorative substrate 224 in the comparative example. As described above, the pair of pads 171a and 171b corresponding to the pair of electrodes 85a and 85b of the bypass capacitor 85 are formed at intervals of approximately 0.28 mm in the longitudinal direction of the bypass capacitor 85. Further, as already described, the solder resist 222 is not applied between the first pad 171a and the second pad 171b (see FIG. 16A). In the step of applying the solder paste to the first decorative substrate 56, the first mounting surface 84 and the second mounting surface 95 (FIG. 9) of the first decorative substrate 56 are masked by the metal mask 226 having the openings formed therein. The metal mask 226 is, for example, a thin metal plate having a thickness of about 150 μm. The metal mask 226 is provided with an opening that penetrates the metal mask 226 in the thickness direction at a position corresponding to the pad (or pad) of the first decorative substrate 56. The solder paste is applied onto the pad through the opening of the metal mask 226. Since the thickness of the metal mask 226 is uniform, it is possible to uniformly apply the solder paste to each pad.

As shown in FIG. 16 (b), since the outer silks 225a and 225b are convex with respect to the surface of the solder resist 222, small chip components (bypass capacitor 85 and small chip resistor 87 (FIG. 8 (b) and FIG. 8) are shown. If the outer silks 225a and 225b are provided around the 8 (c))), the outer silks 225a and 225b exist between the first mounting surface 84 and the metal mask 226, and the first mounting The distance between the surface 84 and the metal mask 226 increases. In this configuration, the solder paste 227 may wrap around the gap existing between the first pad 171a and the second pad 171b, and the first pad 171a and the second pad 171b may be electrically connected. In particular, when the solder paste 221 is continuously applied to a large number of first decorative substrates 56, the solder paste 221 collected at the edge of the opening of the metal mask 226 tends to wrap around to the back side of the opening. The first pad 171a and the second pad 171b are easily electrically connected. On the other hand, in the present embodiment, as shown in FIG. 16A, no outer silk is provided around the small chip component. As a result, it is possible to prevent the first mounting surface 84 and the metal mask 226 from being too far apart, and it is possible to prevent the occurrence of solder defects in which the solder paste 221 enters between the pads 171a and 171b. Can be done. In addition, it is prevented that a part of the small chip parts is placed on the outer silk and causes soldering failure.

Next, a method of manufacturing the decorative substrates 56 and 57 will be described.

As a method for efficiently manufacturing the first decorative board 56, the collective board is divided after mounting the electronic components on the collective board (printed wiring board before the electronic components are mounted) including the plurality of first decorative boards 56. Then, a method of taking out a plurality of first decorative substrates 56 in a state where electronic components are mounted can be considered. Further, as a method for efficiently manufacturing the second decorative board 57, after mounting the electronic components on the collective board (printed wiring board before the electronic components are mounted) including the plurality of second decorative boards 57, the collective circuit board is concerned. A method is conceivable in which a plurality of second decorative substrates 57 in a state where electronic components are mounted are taken out at one time. By manufacturing the decorative boards 56 and 57 by these methods, the number of executions of the process of mounting the electronic components can be reduced as compared with the case where the decorative boards 56 and 57 in which the electronic components are mounted are manufactured one by one. It can be reduced and the manufacturing efficiency of the decorative substrates 56 and 57 can be increased. Hereinafter, the method for manufacturing the decorative substrates 56 and 57 will be described by exemplifying a method for efficiently producing the first decorative substrate 56.

FIG. 17A is a plan view showing a first plate surface 268 which is a plate surface on one side of the collective substrate 231, and FIG. 17B is a plan view so that the first plate surface 268 has a valley shape (concave). It is explanatory drawing for explaining the valley division which divides the assembly board 231, and FIG. 17C is for explaining the mountain division which divides the assembly board 231 so that the 1st plate surface 268 has a mountain shape (convex). It is explanatory drawing. In reality, a plurality of electronic components are mounted on each of the first decorative boards 56 included in the collective board 231 and wiring patterns and the like are also formed. However, FIGS. 17 (a) to 17 (Fig. 17) In c), it is simplified and illustrated in order to avoid complication of the drawing.

The collective substrate 231 is a four-layer substrate having a structure in which conductive layers and insulating layers are alternately laminated, similar to the decorative substrates 56 and 57 described above. As shown in FIG. 17A, the assembly board 231 is processed by rotating a part of one printed wiring board formed into a substantially square shape while rotating a drill-shaped cutting tool (router) having a blade on the side surface. It is created by cutting out by processing a router or the like and forming a dividing groove 223 to 247 and slits 251 to 258 in the printed wiring board.

The assembly substrate 231 is divided into four first decorative substrates 56 and seven discarded substrates 261 to 267 by dividing grooves 223 to 247 and slits 251 to 258. The processing for forming the split grooves 223 to 247 and the slits 251 to 258 on the assembly substrate 231 is performed before the electronic components are mounted on the assembly substrate 231. The division of the assembly substrate 231 is performed using the division grooves 223 to 247 and the slits 251 to 258.

The dividing grooves 223 to 247 are formed linearly by cutting the assembly substrate 231 using, for example, a disk-shaped blade that rotates at high speed. The cross section of the dividing grooves 223 to 247 has a V shape that reduces the plate thickness of the assembly substrate 231, and the bottom of the dividing grooves 223 to 247 is the portion having the smallest plate thickness. The region in which the dividing grooves 223 to 247 are formed in the assembly substrate 231 has a lower mechanical strength than the region in which the dividing grooves 223 to 247 are not formed. Therefore, by dividing the assembly substrate 231 with the division grooves 223 to 247 as the base points, the stress acting on the first decorative substrate 56 when the assembly substrate 231 is divided can be reduced. This makes it possible to reduce the stress that may act on the connection points between the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149) and the first decorative board 56 when the assembly board 231 is divided. At the same time, the stress that can act on the small chip component itself can be reduced. In addition, it is possible to prevent the base point of division from shifting from the division grooves 223 to 247. The cross-sectional shape of the dividing grooves 223 to 247 is not limited to the V shape. The cross-sectional shape of the dividing grooves 223 to 247 may be rectangular or U-shaped as long as the assembly substrate 231 can be easily separated by an external force.

Since the dividing grooves 223 to 247 are formed in a straight line, the first decorative substrate 56 is acted upon when the assembly substrate 231 is divided, as compared with the configuration in which the dividing grooves 232 to 247 are formed in a curved shape. Possible stress is reduced.

In the present embodiment, the dividing grooves 223 to 247 make it easy to distinguish between the first plate surface 268 and the second plate surface 269 (FIG. 17 (b)) which is a plate surface opposite to the first plate surface 268. Therefore, in order to improve the workability of the substrate dividing step, it is formed only on the first plate surface 268 side of the collective substrate 231. The slits 251 to 258 are formed, for example, by the router processing described above. The slits 251 to 258 have an elongated elongated hole shape, and are formed wider than the dividing grooves 223 to 247.

As shown in FIG. 17A, a vertically long substantially rectangular central discard substrate 261 is provided at the center in the left-right direction of the assembly substrate 231. A pair of first decorative substrates 56 are provided on the left side of the central discard substrate 261 sandwiching the dividing grooves 223 and 233, and a pair of first decorative substrates 56 are provided on the right side of the central discard substrate 261 sandwiching the dividing grooves 234 and 235. A decorative substrate 56 is provided. The four first decorative substrates 56 are flush with each other, and the first mounting surface 84 of these first decorative substrates 56 exists on the first plate surface 268 side of the collective substrate 231.

As described above, the first decorative substrate 56 is formed with a stepped recess 56a and a notch 56b. In the first decorative substrate 56 at the lower left, the stepped recess 56a is provided on the central discard substrate 261 side, and the notch 56b is provided on the left discard substrate 263 side described later. In the first decorative substrate 56 on the upper left, the stepped recess 56a is provided on the left side of the discarded substrate 263, and the notch 56b is provided on the side of the central discarded substrate 261. The stepped recesses 56a of the pair of first decorative substrates 56 face each other. The stepped recesses 56a are cut out, and the stepped recesses 56a are not connected to each other.

In the first decorative substrate 56 at the lower right, the stepped recess 56a is provided on the right side discarding substrate 266 side, which will be described later, and the notch 56b is provided on the central discarding substrate 261 side. In the first decorative substrate 56 on the upper right, the stepped recess 56a is provided on the central discard substrate 261 side, and the notch 56b is provided on the right discard substrate 266 side. The stepped recesses 56a of the pair of first decorative substrates 56 face each other. The stepped recesses 56a are cut out, and the stepped recesses 56a are not connected to each other.

On the left side of the central discard substrate 261, a lower left discard substrate 262, a vertically long substantially rectangular left discard substrate 263, and an upper left discard substrate 264 are provided on the lower side, the left side, and the upper side of the pair of first decorative substrates 56. The lower left discard substrate 262 is connected to the left discard substrate 263 and the center discard substrate 261 via the dividing grooves 236 and 237, and the upper left discard substrate 264 is connected to the left discard substrate 263 and the center via the dividing grooves 238 and 239. It is connected to the discard board 261. A slit 251 is formed between the lower left discard substrate 262 and the upper left first decorative substrate 56, and the lower left discard substrate 262 and the upper left first decorative substrate 56 are not connected to each other. Further, a slit 252 is formed between the upper left discard substrate 264 and the upper right first decorative substrate 56, and the upper left discard substrate 264 and the upper right first decorative substrate 56 are not connected. The left-side discarding substrate 263 is connected to the lower left first decorative substrate 56 and the upper left first decorative substrate 56 via the dividing grooves 240 and 241.

On the right side of the central discard substrate 261, a lower right discard substrate 265, a vertically long substantially rectangular right discard substrate 266, and an upper right discard substrate 267 are provided on the lower side, the right side, and the upper side of the pair of first decorative substrates 56. The lower right discard substrate 265 is connected to the central discard substrate 261 and the right discard substrate 266 via the dividing grooves 242 and 243, and the upper right discard substrate 267 is connected to the central discard substrate 261 and the central discard substrate 261 via the dividing grooves 244 and 245. It is connected to the right side discard board 266. A slit 253 is formed between the lower right discard substrate 265 and the lower left first decorative substrate 56, and the lower right discard substrate 265 and the lower left first decorative substrate 56 are not connected to each other. Further, a slit 254 is formed between the upper right discard substrate 267 and the lower right first decorative substrate 56, and the upper right discard substrate 267 and the lower right first decorative substrate 56 are not connected. The right-side discarded substrate 266 is connected to the lower left first decorative substrate 56 and the lower right first decorative substrate 56 via the dividing grooves 246 and 247.

As described above, the discarded substrate 262 to 267 is provided on the outer circumference of the collective substrate 231 over the entire circumference, and the four first decorative substrates 56 are surrounded by the discarded substrate 262 to 267. This makes it possible to handle the collective substrate 231 without touching the electronic components mounted on the first decorative substrate 56 after mounting the electronic components. Therefore, it is prevented that the electronic component is damaged due to the operator's hand coming into contact with the electronic component. The number of the first decorative substrates 56 included in the collective substrate 231 is not limited to "4". The number of the first decorative substrates 56 included in the assembly substrate 231 may be larger than that of "4" (for example, "6"), and the number of the first decorative substrates 56 included in the assembly substrate 231 is ". The configuration may be less than "4" (for example, "2").

A pair of first decorative boards 56 are provided on the left side of the central discard substrate 261 with the stepped recesses 56a facing each other, and a pair of first decorative boards with the stepped recesses 56a facing each other on the right side of the central discard board 261. By providing the 56, the vertical dimension of the collective substrate 231 including the four first decorative substrates 56 is reduced.

Next, the manufacturing process of the decorative substrates 56 and 57 will be described by taking the manufacturing process of the first decorative substrate 56 as an example.

In the manufacturing process of the first decorative substrate 56, first, the second plate surface 269 of the assembly substrate 231 (second mounting surface 95 side, see FIG. 17B) is facing upward, and the second assembly substrate 231 is second. A solder application process for applying solder paste to a pad (or pad) provided on the plate surface 269, an adhesive application process for applying an adhesive for fixing a connector, and connectors 111 and 112 using an automatic mounting device (not shown). (Fig. 8 (a)) is a component mounting process for mounting the assembly board 231 on the second plate surface 269 side, a reflow process for transporting the assembly substrate 231 to a reflow furnace to heat it, and cooling for cooling the assembly substrate 231 to room temperature. The process is carried out. As a result, the connectors 111 and 112 are mounted on the second plate surface 269 side of the assembly board 231. The curing of the adhesive prevents the connectors 111 and 112 from falling in the second reflow step.

After that, with the first plate surface 268 of the assembly board 231 facing upward, solder paste is applied onto the lands provided on the first plate surface 268 side (first mounting surface 84 side) of the assembly board 231. The solder coating process, the component mounting process for mounting electronic components including small chip components on the first plate surface 268 side of the assembly board 231 using an automatic mounting device (not shown), and the component mounting process for transporting the assembly board 231 to a reflow furnace. A reflow process for heating, a cooling process for cooling the assembly board 231 to room temperature, a substrate division process for dividing the assembly board 231 after mounting electronic components, and a visual check for omission of mounting of electronic components on the first decorative board 56. The mounting confirmation process and the like are performed. As a result, electronic components including small chip components are mounted on the first plate surface 268 side of the assembly board 231.

As shown in FIG. 17A, the left-side discarding substrate 263 and the right-side discarding substrate 266 are formed with the first mounting reference hole 271 and the second mounting reference hole 272 by penetrating the assembly board 231 in the thickness direction. ing. The first mounting reference hole 271 is used for aligning the assembly board 231 in the component mounting process in which the electronic component is mounted on the first plate surface 268 side, and the second mounting reference hole 272 is used to mount the electronic component on the second plate surface 268. It is used for alignment of the assembly board 231 in the component mounting process for mounting on the plate surface 269 side. After aligning the assembly board 231, the automatic mounting device sets the small chip component so that the electrodes of the small chip component are placed on the solder paste applied to the corresponding pad (or pad) by coordinate control. 1 Set on the decorative substrate 56.

As a method for dividing the collective substrate 231, a method in which an operator manually splits the collective substrate 231 and a method in which the collective substrate 231 is mechanically cut by using a press machine or the like are known. Of these, by adopting the manual division method, it is possible to flexibly respond to a plurality of types of collective boards while suppressing equipment costs.

As a method of dividing the assembly board 231, a valley division in which the assembly board 231 is divided so that the first plate surface 268 in which the small chip parts are aggregated from the dividing groove 232 to 247 has a valley shape (concave) is formed, and the first It is conceivable to divide the assembly board 231 so that the plate surface 268 has a mountain shape (convex). In the substrate division step, as shown in FIG. 17B, the assembly substrate 231 is divided into a plurality of sheets (specifically) by a valley division having the first plate surface 268 as a valley shape (concave) with the division grooves 223 to 247 as the base points. The first decorative substrate 56 (4 sheets) is taken out.

As described above, in the first decorative substrate 56, the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149) are integrated on the first mounting surface 84 side. In the assembly board 231 the small chip components are integrated on the first plate surface 268 side (first mounting surface 84 side) and not mounted on the second plate surface 269 side (second mounting surface 95 side). Further, as already described, the connection portion between the small chip component and the first decorative substrate 56 has a lower mechanical strength than the connection portion between the other electronic component and the first decorative substrate 56. When the assembly substrate 231 is divided into mountains as shown in FIG. 17C, the force that can act on the first plate surface 268 side (first mounting surface 84 side) of the assembly substrate 231 becomes a tensile stress and a second. The force that can act on the plate surface 269 side (second mounting surface 95 side) is compressive stress. On the other hand, when the assembly substrate 231 is divided into valleys as shown in FIG. 17B, the force that can act on the first plate surface 268 side (first mounting surface 84 side) of the assembly substrate 231 becomes a compressive stress and is also a compressive stress. The force that can act on the second plate surface 269 side (second mounting surface 95 side) is tensile stress.

The stress at the time of dividing the assembly substrate 231 acts more on the plate surface having a mountain shape (convex) than on the plate surface having a valley shape (concave). By dividing the assembly board 231 into valleys so that the first plate surface 268 side (first mounting surface 84 side) on which the small chip components are integrated has a valley shape (concave), the small chips are divided when the assembly board 231 is divided. The stress that can act on the connection point between the component and the first decorative substrate 56 can be reduced, and the stress that can act on the small chip component itself can be reduced. As a result, the possibility that the connection portion between the small chip component and the first decorative substrate 56 is damaged can be reduced, and the possibility that the small chip component itself is damaged can be reduced. As described above, the manufacturing efficiency of the first decorative substrate 56 can be improved by reducing the possibility of contact failure of small chip components in the substrate division step.

Among the small chip components, the monolithic ceramic capacitor used as the bypass capacitor 85 is vulnerable to tensile stress, and when the tensile stress acts on the bypass capacitor 85, the bypass capacitor 85 itself tends to crack. The bypass capacitor 85 is formed by dividing the assembly board 231 into a valley shape (concave) so that the first plate surface 268 side (first mounting surface 84 side) on which the small chip components including the bypass capacitor 85 are integrated has a valley shape (concave). It is possible to avoid the tensile stress acting on the bypass capacitor 85 by using the force that can act on the bypass capacitor 85 as the compressive stress. This makes it possible to reduce the possibility that the bypass capacitor 85 itself will be damaged when the assembly board 231 is divided.

As described above, by dividing the assembly substrate 231 with the division grooves 223 to 247 as the base points, the stress that can be applied to the connection point between the small chip component and the first decorative substrate 56 can be minimized, and the stress that can be applied to the connection point can be minimized. The stress that can act on small chip components can be minimized. On the other hand, if the base point of the division deviates from the division grooves 223 to 247, these stresses increase. A division jig is used to prevent the base point of division from shifting from the division grooves 223 to 247 and to improve the workability of the substrate division process.

18 (a) is a perspective view of the dividing jig 281 used for dividing the collective substrate 231 in the present embodiment, and FIG. 18 (b) is a front view of the dividing jig 281, FIG. 18 (c). Is an explanatory diagram for explaining how the assembly board 231 is divided by using the dividing jig 281. As shown in FIG. 18A, the dividing jig 281 supports a metal thin blade 282 which is abutted against the dividing grooves 223 to 247 and serves as a fulcrum when dividing the assembly substrate 231 and the thin blade 282. It comprises a base 283 and. The base portion 283 includes a resin-made base portion 283a formed into a horizontally long rectangular parallelepiped shape, and a rectangular parallelepiped upright portion 283b integrally formed by standing upright from a plate surface on one side of the base portion 283a. There is.

The thin blade 282 includes a plate-shaped blade portion 282a and a flange portion 282b. The thin blade 282 is fixed to the base portion 283 by screwing the flange portion 282b to the upright portion 283b. The blade portion 282a projects upward from the upper plane of the upright portion 283b and extends in the longitudinal direction of the upright portion 283b.

A protrusion 283c for assisting the alignment of the assembly substrate 231 with respect to the blade portion 282a is integrally formed at substantially the center of the upright portion 283b in the longitudinal direction so that the blade portion 282a abuts on the dividing grooves 223 to 247. There is. The protrusion 283c protrudes upward from the upper plane of the upright portion 283b with a protrusion dimension larger than that of the blade portion 282a. As shown in FIG. 17A, in the right portion of the left discard substrate 263 and the left portion of the center discard substrate 261, recesses 284 and 285 that allow the protrusion 283c to be inserted between the pair of first decorative substrates 56. Is provided. Further, in the right portion of the central discard substrate 261 and the left portion of the right discard substrate 266, recesses 286 and 287 that allow the protrusions 283c to be inserted are provided between the pair of first decorative substrates 56.

As shown in FIG. 18 (c), the operator faces the first plate surface 268 (first mounting surface 84) of the assembly substrate 231 downward, and the center discard substrate 261 and the left discard substrate 263 and the right discard substrate 266. One of them (center discard substrate 261 in FIG. 18C) is fixed on the upright portion 283b. At this time, by discarding the protrusion 283c and inserting it into the recesses 284 to 287 (FIG. 17 (a)) provided in the substrates 261, 263, 266, the division grooves 223 to 247 serving as the base point of the division hit the blade portion 282a. You can easily create a state of contact. In this state, by applying a downward force to the second plate surface 269 side and pushing the portion protruding to the right from the upright portion 283b downward, the first plate surface 268 becomes a valley shape (concave). , The assembly substrate 231 can be divided into valleys with the dividing groove 223 to 247 as a base point.

For example, the operator first attaches the assembly board 231 (FIG. 17A) to a first unit including a pair of left first decorative boards 56, a left lower discard board 262, a left discard board 263, and an upper left discard board 264. It is divided into a pair of the first decorative substrate 56 on the right side, a central waste substrate 261 and a second unit including a lower right discard substrate 265, a right discard substrate 266 and an upper right discard substrate 267. After that, in the first unit, the two first decorative substrates 56 can be taken out by dividing the pair of the first decorative substrate 56 and the left side discard substrate 263. Further, in the second unit, the pair of the first decorative substrate 56 and the central discard substrate 261 are divided, and the pair of the first decorative substrate 56 and the right side discard substrate 266 are divided into two first pieces. The decorative substrate 56 can be taken out. The order in which the assembly substrate 231 is divided in order to take out the four first decorative substrates 56 is arbitrary.

With the blade portion 282a in contact with the split groove 232-247 which is the base point of the division, the assembly substrate 231 is divided into valleys with the blade portion 282a as a fulcrum, so that the base point of the division shifts from the division groove 223-247. It can be prevented from being lost. As a result, the stress that can be applied to the connection point between the small chip component and the first decorative substrate 56 when the assembly board 231 is divided can be minimized, and the stress that can be applied to the small chip component itself can be minimized. It can be suppressed.

Since the assembly board 231 is divided into valleys by pushing the second mounting surface 95 downward, the operator is compared with the configuration in which the assembly board 231 is divided into valleys by pulling up the second mounting surface 95. Is easy to apply a force for dividing the collective substrate 231. Further, in the central discard substrate 261 and the left discard substrate 263 and the right discard substrate 266, the recesses 284 to 287 (FIG. 17A) are provided between the pair of first decorative substrates 56, so that the first decoration is provided. It is possible to fix the collective substrate 231 to the dividing jig 281 while preventing the stress acting on the electronic components mounted on the substrate 56 from increasing.

As already described with reference to FIG. 8A, the first decorative substrate 56 is provided with fixed through holes 56d to 56 g, and the small chip components are arranged so as to avoid the through hole peripheral regions 211a to 211d. There is. Therefore, as shown in FIG. 18 (c), one of the central discard substrate 261 and the left discard substrate 263 and the right discard substrate 266 is raised with the first plate surface 268 (first mounting surface 84) facing downward. When a downward force is applied to the second plate surface 269 side in a state of being fixed to 283b and the portion protruding from the upright portion 283b is pushed downward to divide the assembly board 231, the fixed through hole is pushed downward. The vicinity of 56d to 56g can be selected. As a result, the stress that can be applied to the small chip components mounted on the first plate surface 268 side (first mounting surface 84 side) can be minimized.

As described above, the dividing grooves 223 to 247 are formed only on the first plate surface 268 side of the assembly substrate 231 and not on the second plate surface 269 side. Therefore, the operator may set the assembly board 231 on the division jig 281 with the plate surface (first plate surface 268) on the side where the division grooves 223 to 247 are formed facing downward, and the assembly substrate may be erroneously set. The possibility that the 231 is split into mountains is reduced.

As shown in FIG. 17A, the 16 dividing grooves 223 to 247 existing in the assembly substrate 231 extend in the first direction DR1. The extending directions of these dividing grooves 223 to 247 are parallel to each other. Further, as already described with reference to FIGS. 8 (a) to 8 (c), the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are the small chip components. Is mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the above is parallel to the 16 dividing grooves 232 to 247 existing in the collective substrate 231. Therefore, as compared with the configuration in which the longitudinal direction of the small chip component is orthogonal to the extending direction of the dividing groove 223 to 247, when the assembly substrate 231 is divided with the dividing groove 223 to 247 as the base point, the small chip component and the first 1 The stress that can act on the connection point with the decorative substrate 56 is reduced, and the stress that can act on the small chip component itself is reduced.

As shown in FIG. 17A, slits 255 to 258 are provided in the assembly substrate 231 at a location corresponding to the region where the bypass capacitor 85 is mounted. As described above, the slits 255 to 258 have an elongated elongated hole shape and are formed wider than the dividing grooves 233, 234, 240 and 247. The stress that can be applied to the periphery of the slits 255 to 258 when the assembly substrate 231 is valley-divided with the dividing groove 223 to 247 as the base point is smaller than the stress that can be applied to the periphery of the dividing groove 223 to 247. Since the slits 255 to 258 are provided in the corresponding portions of the mounting area of the bypass capacitor 85, the stress that can act on the connection portion between the bypass capacitor 85 and the first decorative substrate 56 when the assembly substrate 231 is divided is applied. At the same time, the stress that can act on the bypass capacitor 85 itself is reduced.

As shown in FIGS. 8A and 8B, the bypass capacitor 85 is arranged on the stepped recess 56a side of the LED driver 126. As already described with reference to FIG. 17A, the assembly substrate 231 is not provided with the dividing grooves 233, 234, 240, 247 on the stepped recess 56a side. When the assembly board 231 is divided with the dividing groove 233, 234, 240, 247 as the base point because the bypass capacitor 85 is arranged on the opposite side of the dividing grooves 233, 234, 240, 247 with the LED driver 126 interposed therebetween. In addition, the stress that can act on the connection point between the bypass capacitor 85 and the first decorative substrate 56 can be reduced, and the stress that can act on the bypass capacitor 85 itself can be reduced. As a result, when the assembly board 231 is divided, the possibility that the connection point between the bypass capacitor 85 and the first decorative board 56 is destroyed is reduced, and the possibility that the bypass capacitor 85 itself is destroyed is reduced. It has been reduced.

As already described with reference to FIGS. 8 (b) and 8 (c), it corresponds to the separation direction of the pads 171a and 171b corresponding to the electrodes 85a and 85b of the bypass capacitor 85 and the electrodes 87a and 87b of the small chip resistor 87. The separation direction of the pads 176a and 176b is the first direction DR1. In the reflow step, by transporting the assembly substrate 231 in a direction orthogonal to the common separation direction (first direction DR1) (second direction DR2) or in a direction substantially orthogonal to the common separation direction (first direction DR1), the assembly substrate 231 is transferred to the pair of electrodes 85a and 85b of the bypass capacitor 85. The timing at which the heating of the solder paste applied on the pair of pads 171a and 171b can be started can be aligned, and the pair of pads 176a corresponding to the pair of electrodes 87a and 87b of the small chip resistor 87 can be aligned. , The timing at which the heating of the solder paste applied on the 176b is started can be aligned. This makes it possible to prevent the rotation of a plurality of small chip components and the occurrence of chip standing. As shown in FIG. 17A, a recognition mark 288 is provided on the first plate surface 268 side of the left side discarded substrate 263 so that the transport direction of the assembled substrate 231 in the reflow process can be confirmed. Further, although not shown, a recognition mark is also provided on the second plate surface 269 side of the left side discarded substrate 263 so that the transport direction of the assembled substrate 231 in the reflow process can be confirmed. As a result, the possibility that the operator makes a mistake in the transport direction of the collective substrate 231 is reduced.

As already described with reference to FIG. 8 (a), in a configuration in which the LED driver 126 is arranged in an area including an area of less than 10 mm from the outer edge of the first decorative substrate 56, small chip components (bypass capacitor 85 and small size). The chip resistors 87, 143 to 149 (FIG. 11) are arranged at a distance of 10 mm or more from the outer edge of the first decorative substrate 56. As described above, among the various electronic components mounted on the first decorative board 56, the connection points between the small chip components and the first decorative board 56 are the connection points between the other electronic components and the first decorative board 56. In comparison, the mechanical strength is low. Further, the region within 10 mm from the outer edge of the first decorative substrate 56 is a region that may exist in the vicinity of the dividing grooves 223 to 247 (FIG. 17) in the assembly substrate 231 (FIG. 17) and is aggregated. This is an area where a force may be applied to split the substrate 231 into valleys. Since the small chip components are arranged at a distance of 10 mm or more from the outer edge of the first decorative substrate 56, the maximum value of stress that can act on the connection point between the small chip components and the first decorative substrate 56 when the assembly substrate 231 is divided. Is reduced, and the maximum value of stress that can act on the small chip component itself is reduced.

<Electrical configuration of pachinko machine 10>
FIG. 19 is a block diagram showing an electrical configuration of the pachinko machine 10.

The main control device 60 includes a main control board 61 that controls the main control of the game, and a power failure monitoring board 67 that monitors the power supply. The MPU 62 is mounted on the main control board 61. The MPU 62 contains a main ROM 64 and a main RAM 65 in addition to the main CPU 63, which is an arithmetic processing unit including a control unit and an arithmetic unit. In addition to the above elements, the MPU 62 has a built-in interrupt circuit, timer circuit, data input / output circuit, various counter circuits as a random number generator, and the like.

The main ROM 64 is a memory (that is, a non-volatile storage means) that does not require external power supply for storage retention such as a NOR type flash memory and a NAND type flash memory, and is used only for reading. The main ROM 64 stores various control programs and fixed value data executed by the main CPU 63.

The main RAM 65 is a memory (that is, a volatile storage means) that requires external power supply for storage retention such as SRAM and DRAM, and is used for both reading and writing. The main RAM 65 can be randomly accessed, and the time required for reading is faster than that of the main ROM 64 when compared with the same data capacity. The main RAM 65 temporarily stores various data and the like for the execution of the control program stored in the main ROM 64.

The main CPU 63 executes a process for managing the game history. The main CPU 63 grasps the entry history of the game ball into the general winning opening 31, the special electric winning device 32, the first operating opening 33, the second operating opening 34, and the out opening 24a, and the grasped entry history Accordingly, the frequency of entering the ball into the general winning opening 31, the special electric winning device 32, the first operating opening 33, and the second operating opening 34 is grasped. Further, the main CPU 63 grasps the frequency of occurrence of the open / close execution mode and the high frequency support mode, which will be described later.

The MPU 62 is provided with an input port and an output port, respectively. A power failure monitoring board 67 and a payout control device 77 provided in the main control device 60 are connected to the input side of the MPU 62. A power supply / emission control device 78 having a function of supplying operating power is connected to the power failure monitoring board 67, and operating power is supplied to the MPU 62 via the power failure monitoring board 67.

Various sensors such as ball entry detection sensors 42a to 49a are connected to the input side of the MPU 62. As described above, the ball entry detection sensors 42a to 49a include the first winning opening detection sensor 42a, the second winning opening detection sensor 43a, the third winning opening detection sensor 44a, the special electric detection sensor 45a, and the first operating opening detection sensor. A sensor 46a, a second operating port detection sensor 47a, an out port detection sensor 48a, and a gate detection sensor 49a are included. Based on the detection results of the ball entry detection sensors 42a to 49a, the main CPU 63 determines the entry into each entry portion. Further, in the main CPU 63, various lottery is executed based on the winning of the first operating port 33, and various lottery is executed based on the winning of the second operating port 34.

On the input side of the MPU 62, a setting key insertion portion 68a, an update button 68b, and a reset button 68c provided on the main control board 61 are provided. The setting key insertion unit 68a is provided with a sensor (not shown), and the sensor detects whether the setting key insertion unit 68a is located at the ON operation position or the OFF operation position. Then, the main CPU 63 specifies whether the setting key insertion unit 68a is located at the ON operation position or the OFF operation position based on the detection result from the sensor. The update button 68b is provided with a sensor (not shown), and the sensor detects whether or not the update button 68b is pressed. Then, the main CPU 63 specifies whether or not the update button 68b is pressed based on the detection result from the sensor. The reset button 68c is provided with a sensor (not shown), and the sensor detects whether or not the reset button 68c is pressed. Then, the main CPU 63 specifies whether or not the reset button 68c is pressed based on the detection result from the sensor.

A power failure monitoring board 67, a payout control device 77, and a voice emission control device 81 are connected to the output side of the MPU 62. The payout control device 77 outputs, for example, a prize ball command based on the fact that the game ball has entered the prize ball corresponding entry unit corresponding to the payout of the game ball in the above-mentioned entry unit. NS. Various commands such as fluctuation commands, type commands, and opening commands are output to the voice emission control device 81.

On the output side of the MPU 62, there is a drive unit 32b for special electric power that opens and closes the opening / closing door 32a of the special electric winning device 32, and a drive unit 34b for general electric power that opens and closes the general electric accessory 34a of the second operating port 34. The figure unit 37 and the normal figure unit 38 are connected. Incidentally, the special figure unit 37 is provided with a special figure display unit 37a and a special figure hold display unit 37b, all of which are connected to the output side of the MPU 62. Similarly, the normal drawing unit 38 is provided with a normal drawing display unit 38a and a normal drawing holding display unit 38b, all of which are connected to the output side of the MPU 62. Various driver circuits are provided on the main control board 61, and the MPU 62 executes drive control of various drive units and various display units through the driver circuits.

That is, in the open / close execution mode, the drive control of the special electric drive unit 32b is executed in the main CPU 63 so that the special electric winning device 32 is opened / closed. Further, when the open state of the utility accessory 34a is won, the drive control of the drive unit 34b for the utility is executed in the main CPU 63 so that the utility accessory 34a is opened and closed. Further, at each game round, the display control of the special figure display unit 37a is executed on the main CPU 63. Further, when the lottery result of whether or not to open the general electric accessory 34a is clearly shown, the display control of the general drawing display unit 38a is executed in the main CPU 63. Further, when a prize is awarded to the first operating port 33 or the second operating port 34, or when the variable display is started in the special figure display unit 37a, the display control of the special figure hold display unit 37b is performed on the main CPU 63. Is executed, and when a prize is won in the through gate 35, or when the variable display is started in the normal figure display unit 38a, the display control of the normal figure hold display unit 38b is executed in the main CPU 63.

The first to third notification display devices 69a to 69c are connected to the output side of the MPU 62. The first to third notification display devices 69a to 69c display the management result of the game history. Further, when the setting state of the pachinko machine 10 is changed, the current set value is displayed on the third notification display device 69c. The display control of the first to third notification display devices 69a to 69c is performed by the main CPU 63.

The power failure monitoring board 67 relays between the main control board 61 and the power supply / emission control device 78, and monitors the DC stable 24 volt voltage, which is the maximum voltage output from the power supply / emission control device 78. The payout control device 77 controls the payout of prize balls and rental balls by the payout device 76 based on the prize ball command received from the main control device 60.

The power supply / launch control device 78 is connected to, for example, a commercial power supply (external power supply) in a game hall or the like. Then, based on the external power supplied from the commercial power source, the operating power required for each of the main control board 61, the payout control device 77, and the like is generated, and the generated operating power is supplied. By the way, the power supply / emission control device 78 is provided with a power supply unit for power failure such as a backup capacitor, and even when the power of the pachinko machine 10 is in the OFF state, the power supply unit for power failure is mainly used. Power for storage retention is supplied to the main RAM 65 of the control device 60 and the payout control device 77. Further, the power supply / launch control device 78 is responsible for launch control of the game ball launch mechanism 27, and the game ball launch mechanism 27 is driven when predetermined launch conditions are met. Further, the payout mechanism unit 73 is provided with a power switch as described above, and when the power switch is turned on, the supply of operating power to the pachinko machine 10 is started and the power switch is turned off. The supply of operating power to the pachinko machine 10 is stopped.

The voice emission control device 81 drives and controls the speaker unit 53 provided on the front door frame 14 based on various commands received from the main control device 60. Further, as described above, the voice emission control device 81 controls the emission of the LED chips 127 to 142 mounted on the first decorative substrate 56 and the LED chips mounted on the second decorative substrate 57. Furthermore, the voice emission control device 81 controls the display control device 82. The display control device 82 executes the display control of the symbol display device 41 based on the command received from the voice emission control device 81.

<Electrical configuration for performing various lottery on the main CPU 63>
Next, an electrical configuration for performing various lottery on the main CPU 63 will be described with reference to FIG. 20.

The main CPU 63 uses various counter information during the game to perform a big hit generation lottery, a setting of the display of the special figure display unit 37a, a setting of the symbol display of the symbol display device 41, a setting of the display of the normal figure display unit 38a, and the like. Specifically, as shown in FIG. 20, the hit random number counter C1 used for the lottery for the occurrence of hits, the jackpot type counter C2 used for determining the jackpot type, and the symbol display device 41 are displaced and fluctuate. The reach random number counter C3 used for the reach generation lottery, the random number initial value counter CINI used for setting the initial value of the winning random number counter C1, and the display duration in the special figure display unit 37a and the symbol display device 41 are determined. The variable type counter CS is used. Further, the general electric accessory opening counter C4 used for the lottery as to whether or not the general electric accessory 34a of the second operating port 34 is set to the general electric accessory open state is used. The counters C1 to C3, CINI, CS, and C4 are provided in various counter areas 65b of the main RAM 65.

Each of the counters C1 to C3, CINI, CS, and C4 is a loop counter in which 1 is added to the previous value each time the counter is updated, and the counter returns to "0" after reaching the maximum value. Each counter is updated at short intervals. Information corresponding to the hit random number counter C1, the jackpot type counter C2, and the reach random number counter C3 is provided in the main RAM 65 as an acquisition information storage means when a prize is won in the first operating port 33 or the second operating port 34. It is stored in the reserved storage area 65a.

The hold storage area 65a includes a hold area RE and an execution area AE. The holding area RE includes a first holding area RE1, a second holding area RE2, a third holding area RE3, and a fourth holding area RE4, and is recorded in the winning history of the first operating port 33 or the second operating port 34. In addition, the combination of the numerical information of the hit random number counter C1, the jackpot type counter C2, and the reach random number counter C3 is stored as the hold information in any of the hold areas RE1 to RE4.

In this case, in the first holding area RE1 to the fourth holding area RE4, when the first operating port 33 or the second operating port 34 is awarded a plurality of times in succession, the first holding area RE1 → the second. Each numerical information is stored in the order of the holding area RE2 → the third holding area RE3 → the fourth holding area RE4 in chronological order. By providing the four holding areas RE1 to RE4 in this way, up to four winning histories of the game balls to the first operating port 33 or the second operating port 34 can be held and stored. ..

The number that can be stored on hold is not limited to four, and may be any other, such as two, three, or five or more, or may be a single number.

The execution area AE is an area for moving each numerical information stored in the first holding area RE1 of the holding area RE when starting the variable display of the special figure display unit 37a, and is the start of one game. At that time, a hit / fail judgment or the like is performed based on various numerical information stored in the execution area AE.

Each of the above counters will be described in detail.

First, the general electric utility opening counter C4 will be described. The general electric utility opening counter C4 is configured to, for example, add 1 in order within the range of 0 to 250, and return to "0" after reaching the maximum value. The general electric accessory opening counter C4 is periodically updated, and is stored in the general electric holding area 65c of the main RAM 65 at the timing when the game ball wins the through gate 35. Then, at a predetermined timing, a lottery is performed as to whether or not to control the general electric accessory 34a to the open state by the value of the stored general electric accessory open counter C4.

In the pachinko machine 10, a plurality of types of support modes are set so that the modes of support by the general electric accessory 34a are different from each other. Specifically, in the support mode, the general electric accessory 34a of the second operating port 34 is opened per unit time when compared in the situation where the launch of the game ball is continued in the game area PA in the same manner. A high-frequency support mode and a low-frequency support mode are set so that the frequency of states is relatively high or low.

In the high-frequency support mode and the low-frequency support mode, the probability of winning the normal-electricity open state in the general-purpose electric power opening lottery using the general-purpose electric goods opening counter C4 is the same (for example, both are 4/5). In the high-frequency support mode, the number of times the general-purpose accessory 34a is opened when the general-purpose electric accessory 34a is won is set more than in the low-frequency support mode, and one opening time is set longer. Has been done. In this case, in the high frequency support mode, when the open state of the general electric power is won and the open state of the public electric accessory 34a occurs multiple times, from the end of one open state to the start of the next open state. The closing time is set shorter than the one-time opening time. Furthermore, in the high frequency support mode, the minimum secured time is secured for the next public power opening lottery after one public power opening lottery is performed (that is, the normal power drawing), as compared with the low frequency support mode. The duration of one display on the display unit 38a) is set short.

As described above, in the high frequency support mode, the probability of winning the second operating port 34 is higher than in the low frequency support mode. In other words, in the low frequency support mode, the probability of winning the first operating port 33 is higher than that of the second operating port 34, but in the high frequency support mode, the second operation is higher than that of the first operating port 33. The probability that a prize will be awarded to the mouth 34 increases. Then, when a prize is won in the second operating port 34, a predetermined number of game balls are paid out. Therefore, in the high frequency support mode, the player plays a game while not reducing the number of balls held so much. It can be carried out.

In addition, the configuration for increasing the frequency of the high-frequency support mode to be in the open state per unit time is higher than that of the low-frequency support mode, and the configuration is not limited to the above. It may be configured to increase the probability of winning the public electric open state. In addition, the secured time secured for the next Fuden opening lottery after one Fuden opening lottery is performed (for example, is executed by the Fuzu display unit 38a based on the winning of the through gate 35). In a configuration in which multiple types of variable display times are prepared, the high frequency support mode is set so that a shorter reservation time is easier to select or the average reservation time is shorter than the low frequency support mode. May be good. Furthermore, the number of times of opening is increased, the opening time is lengthened, and the securing time secured for the next public power opening lottery after one public power opening lottery is held is shortened. By applying any one of the conditions or any combination of the conditions of shortening the average time and increasing the winning probability, the advantage of the high frequency support mode over the low frequency support mode may be enhanced.

Here, as described above, the pachinko machine 10 has the setting states of "setting 1" to "setting 6", but whichever is the opening frequency and opening mode of the general electric accessory 34a in the low frequency support mode. The set values are the same, and the opening frequency and opening mode of the general electric accessory 34a in the high frequency support mode are the same regardless of the set values. However, the present invention is not limited to this, and for at least one of the low-frequency support mode and the high-frequency support mode, at least one of the opening frequency and the opening mode of the general electric accessory 34a varies depending on the setting state of the pachinko machine 10. It may be configured. For example, the higher the set value, the higher the frequency of opening the utility accessory 34a in the low frequency support mode. In the low frequency support mode, the second operation when the utility accessory 34a is opened once. The configuration may be such that the probability of the game ball entering the mouth 34 is high. Further, the higher the set value, the higher the frequency of opening the utility accessory 34a in the high frequency support mode. In the high frequency support mode, the utility accessory 34a is opened once. The configuration may be such that the probability of the game ball entering the operating port 34 is high.

Next, the winning random number counter C1 will be described. The winning random number counter C1 is configured to be incremented by 1 in order within the range of 0 to 7999, for example, and return to "0" after reaching the maximum value. In particular, when the hit random number counter C1 makes one round, the value of the random number initial value counter CINI at that time is read as the initial value of the hit random number counter C1. The random number initial value counter CINI is a loop counter similar to the hit random number counter C1 (value = 0 to 7999). The winning random number counter C1 is periodically updated and stored in the hold storage area 65a of the main RAM 65 at the timing when the game ball wins the first operating port 33 or the second operating port 34.

The value of the random number that wins the jackpot is stored in the main ROM 64 as a winning / failing table. As shown in FIG. 19, the main ROM 64 is provided with a pass / fail table storage area 64a. In the hit / miss table storage area 64a, a low probability / hit / fail table for the low probability mode and a high probability / hit / fail table for the high probability mode are stored as the hit / miss table.

The low accuracy / rejection table is provided so as to have a one-to-one correspondence with the setting states of "setting 1" to "setting 6". That is, the low accuracy table for setting 1 referred to when the setting state of the pachinko machine 10 is "setting 1", and the setting 2 referred to when the setting state of the pachinko machine 10 is "setting 2". When the setting state of the pachinko machine 10 is "setting 4" and the low accuracy table for setting 3 referred to when the setting state of the pachinko machine 10 is "setting 3". The low accuracy table for setting 4 referred to in the above, the low accuracy table for setting 5 referred to when the setting state of the pachinko machine 10 is "setting 5", and the setting state of the pachinko machine 10 is "setting 5". There is a low probability table for setting 6 that is referred to in the case of "setting 6".

These low probability / failure tables are set so that the higher the set value, the higher the winning probability of the jackpot result. Specifically, when the low probability / failure table for setting 1 is referred to, a jackpot result is obtained at 1/320, and when the low probability / failure table for setting 2 is referred to, a jackpot result is obtained at about 1/308. When the low probability / failure table for setting 3 is referred to, a big hit result is obtained at about 1/278, and when the low probability / failure table for setting 4 is referred to, a big hit result is obtained at about 1/286. When the low probability / failure table for setting 5 is referred to, a jackpot result is obtained at about 1/276, and when the low probability / failure table for setting 6 is referred to, a jackpot result is obtained at about 1/267. As a result, when the setting state of the pachinko machine 10 is a high setting value, a big hit result is likely to occur in the low probability mode, which is advantageous for the player.

On the other hand, only one type of high accuracy / rejection table is provided so as to be common regardless of the setting state of "setting 1" to "setting 6". The high probability hit / fail table is set so that the winning probability of the jackpot result is higher than that of the low probability hit / fail table in any of the setting states of "setting 1" to "setting 6". Specifically, when the high accuracy table is referred to, a big hit result is obtained at about 1/30. This makes it possible to make the high-probability mode more advantageous than the low-probability mode regardless of the setting state of the pachinko machine 10. In addition, even in the lowest setting state "setting 1", it is possible to increase the probability of a big hit result by setting the high probability mode as compared with the low probability mode of the highest setting state "setting 6". Will be. Further, in the high probability mode, it is possible to prevent the advantages or disadvantages due to the setting state of the pachinko machine 10 from occurring, and to suppress the storage capacity for storing the high probability accuracy table in the main ROM 64 in advance. Is possible.

The jackpot type counter C2 is configured to add 1 in order within the range of 0 to 29 and return to "0" after reaching the maximum value. The jackpot type counter C2 is periodically updated and stored in the hold storage area 65a at the timing when the game ball wins the first operating port 33 or the second operating port 34.

In this pachinko machine 10, a plurality of jackpot results are set. These plurality of big hit results are (1) the mode of opening / closing control of the special electric winning device 32 in the opening / closing execution mode, (2) the lottery mode in the winning / failing lottery means after the opening / closing execution mode ends, and (3) the first after the opening / closing execution mode ends. A plurality of jackpot results are set by providing differences in the three conditions of the support mode in the general electric accessory 34a of the two operating ports 34.

As an aspect of the opening / closing control of the special electric winning device 32 in the opening / closing execution mode, the frequency of winning the special electric winning device 32 from the start to the end of the opening / closing execution mode is relatively high and low. Frequent winning mode and low frequency winning mode are set. Specifically, in either the high-frequency winning mode or the low-frequency winning mode, the game is executed up to a predetermined number of round games.

A round game is a game that continues until either a predetermined upper limit continuation period elapses or a predetermined upper limit number of game balls wins a prize in the special electric winning device 32. That is. Further, the number of round games in the open / close execution mode triggered by the jackpot result is the same as the fixed number of rounds regardless of the type of jackpot result triggered by the transition. Specifically, the maximum number of round games is set to 15 rounds regardless of which jackpot result is obtained.

Further, in the pachinko machine 10, a plurality of types of opening modes of the special electric winning device 32 are set with different opening durations from the opening of the special electric winning device 32 to the closing of the special electric winning device 32. Specifically, a long-time mode in which the opening duration is set to 29 seconds, which is a long time, and a short-time mode in which the opening duration is set to 0.06 seconds, which is shorter than the long time, are used. Is set.

In the pachinko machine 10, when the launch operation device 28 is operated by the player, the game ball launch mechanism 27 is driven so that one game ball is launched toward the game area PA every 0.6 seconds. Be controlled. In addition, the maximum number of end conditions for round games is set to nine. Then, in the long-time mode among the above-mentioned opening modes, the opening duration is set to be longer than the product of the firing cycle of the game ball and one round game. On the other hand, in the short-time mode, the opening duration is set to be shorter than the product of the firing cycle of the game ball and one round game, and more specifically, the opening duration is shorter than the firing cycle of the game ball. Therefore, when the opening is performed once in the long-time mode, it is expected that the special electric winning device 32 will be awarded the maximum number of prizes in one round game, and 1 in the short-time mode. When the number of times is opened, it is expected that the special electric winning device 32 will not be awarded, or even if the winning is generated, the number will be about one.

In the high-frequency winning mode, the special electric winning device 32 is opened once in each round game according to the long-time mode. On the other hand, in the low-frequency winning mode, the special electric winning device 32 is opened once in each round game in a short-time mode.

In addition, the number of times of opening and closing of the special electric winning device 32 in the high frequency winning mode and the low frequency winning mode, the number of round games, the opening duration for one opening, and the upper limit number in one round game are those in the high frequency winning mode. Is not limited to the above values and is arbitrary as long as the frequency of winning the special electric winning device 32 from the start to the end of the opening / closing execution mode is higher than that of the low frequency winning mode. Is.

As shown in FIG. 19, the main ROM 64 is provided with a distribution table storage area 64b. In the distribution table storage area 64b, a distribution table in which the distribution destination of the jackpot result for the jackpot type counter C2 is set is stored. In the distribution table, the low probability jackpot result, the low winning high probability jackpot result, and the most advantageous jackpot result are set as the distribution destination of the jackpot result when the jackpot result is obtained.

The low-probability jackpot result is a jackpot result in which the open / close execution mode becomes the high-frequency winning mode, and after the open / close execution mode ends, the win / fail lottery mode becomes the low-probability mode and the support mode becomes the high-frequency support mode. However, this high-frequency support mode shifts to the low-frequency support mode when the number of games reaches the end reference number (specifically, 100 times) after the transition.

The low-winning high-probability jackpot result is a jackpot result in which the open / close execution mode becomes the low-frequency winning mode, and after the opening / closing execution mode ends, the winning / failing lottery mode becomes the high-probability mode and the support mode becomes the high-frequency support mode. be. These high-probability mode and high-frequency support mode continue until the lottery result in the winning / losing lottery becomes a big hit state and the state shifts to the big hit state.

The most advantageous jackpot result is a jackpot result in which the open / close execution mode becomes the high-frequency winning mode, and after the open / close execution mode ends, the win / fail lottery mode becomes the high-probability mode and the support mode becomes the high-frequency support mode. These high-probability mode and high-frequency support mode continue until the lottery result in the winning / losing lottery becomes a big hit state and the state shifts to the big hit state.

In relation to each of the above game states, the normal game state is not an open / close execution mode, but a state in which the winning / failing lottery mode is a low probability mode and the support mode is a low frequency support mode. Further, as a game result, a configuration in which a low winning high probability jackpot result is not set may be used. Further, in the open / close execution mode in the low winning high probability jackpot result, the number of round games may be smaller than in the case of the low probability jackpot result and the most advantageous jackpot result.

In the distribution table, among the values of the jackpot type counter C2 of "0 to 29", "0 to 9" corresponds to the low accuracy jackpot result, and "10 to 14" corresponds to the low winning high accuracy jackpot result. "15-29" corresponds to the most advantageous jackpot result.

Only one type of distribution table is provided so as to be common regardless of the setting state of "setting 1" to "setting 6". This makes it possible to prevent advantages or disadvantages due to the setting state of the pachinko machine 10 in the distribution mode of the jackpot result, and also to store the storage capacity for storing the distribution table in the main ROM 64 in advance. It becomes possible to suppress it.

In addition, the distribution mode of the jackpot result may be different depending on the setting state of the pachinko machine 10. For example, the higher the set value, the higher the probability of being distributed to the most advantageous jackpot result, or the higher the set value, the higher the probability of being distributed to the most advantageous jackpot result or the low winning high probability jackpot result. In this case, the higher the set value, the higher the probability of entering the high probability mode after the jackpot result is obtained. In addition, the higher the setting value, the lower the probability that it will be distributed to the low winning high probability jackpot result. It may be configured so that it can be distributed to the jackpot results. In this case, the higher the set value, the higher the probability that the open / close execution mode of the high frequency winning mode will occur.

Next, the reach random number counter C3 will be described. The reach random number counter C3 is configured to be incremented by 1 in order within the range of, for example, 0 to 238, and return to "0" after reaching the maximum value. In the pachinko machine 10, an expected effect is set as a kind of display effect in the symbol display device 41. The expected effect is a symbol display device 41 that is provided with a symbol display device 41 capable of displaying variable symbols, and in a gaming machine in which a final stop result is given as a result of a game that results in a predetermined jackpot. In the stage before the stop result is derived and displayed after the variable display of the symbol in the above is started, it means a display state for making the player think that the variable display state is likely to be the grant correspondence result. Specifically, regarding the grant correspondence result, the combination of symbols with the same number on any of the effective lines is stopped and displayed.

Two types of expected effects are set: a reach display and a notice display for expecting the occurrence of the reach display and the occurrence of the grant response result in the stage before the reach display occurs.

In the reach display, the combination of reach symbols is displayed by stopping and displaying a part of the symbol rows among the plurality of symbol rows displayed on the display surface 41a of the symbol display device 41, and the remaining symbols are displayed in that state. A display state in which a variable display of a symbol is performed in a symbol column is included. In addition, in the state where the combination of reach symbols is displayed as described above, the variation display of the symbols is performed in the remaining symbol rows, and the reach effect is performed by displaying a predetermined character or the like as a moving image on the background screen. , A combination of reach symbols is reduced or hidden, and a predetermined character or the like is displayed as a moving image on substantially the entire display surface 41a to perform a reach effect.

In the notice display, after the variable display of the symbol is started on the display surface 41a of the symbol display device 41, the symbol is variablely displayed in all the symbol rows, or a plurality of symbol rows. In the situation where the symbols are displayed in a variable manner in the symbol row, the mode in which the character is displayed separately from the symbols on the symbol row is included. Further, a background screen having a predetermined mode different from the previous mode and a symbol on the symbol row having a predetermined mode different from the previous mode are also included. Such a notice display may occur in any of the game times when the reach display is performed and when the reach display is not performed, but the case where the reach display is performed is higher than the case where the reach display is not performed. It is set to occur with a probability.

The reach display is executed regardless of the value of the reach random number counter C3 in the game times when the combination of the same symbols is finally stopped and displayed. Further, in the game times corresponding to the jackpot result in which the combination of the same symbols is not stopped and displayed, the game is not executed regardless of the value of the reach random number counter C3. Further, in the game round corresponding to the deviation result, it is executed when the reach random number counter C3 acquired at a predetermined timing by referring to the reach table stored in the main ROM 64 corresponds to the occurrence of the reach display. ..

On the other hand, the determination as to whether or not to display the advance notice is performed not by the main control device 60 but by the voice emission control device 81. In this case, in the voice emission control device 81, the notice display is more likely to occur in the game times corresponding to any of the jackpot results than in the game times corresponding to the missed result, and the notice display having a low appearance rate is displayed. A lottery process for displaying a notice is executed so as to satisfy at least one of the conditions that are likely to occur. Incidentally, this lottery result is reflected when the effect for the game round is executed on the symbol display device 41.

Here, the probability that the reach display will occur in the game times that result in the deviation is the same regardless of the setting state of "setting 1" to "setting 6". As a result, it is possible to prevent the advantage or disadvantage due to the setting state of the pachinko machine 10 from occurring with respect to the probability that the reach display will occur in the game times that result in the deviation. However, the present invention is not limited to this, and a configuration may be configured in which the higher the set value, the higher the probability that the reach display will occur in the game times that result in deviation.

Next, the variable type counter CS will be described. The variation type counter CS is configured to be incremented by 1 in order within the range of 0 to 198, and returns to "0" after reaching the maximum value. The variation type counter CS is used in the main CPU 63 to determine the display duration on the special symbol display unit 37a and the symbol display duration on the symbol display device 41. The variation type counter CS is updated once every time the timer interrupt process described later is executed, and is repeatedly updated even within the remaining time until the next timer interrupt process is executed. Then, the buffer value of the variation type counter CS is acquired when the variation pattern is determined at the start of the variation display on the special symbol display unit 37a and at the start of the variation of the symbol by the symbol display device 41.

<About the processing configuration of the main CPU 63>
Next, each process executed for advancing the game on the main CPU 63 will be described. The processing of the main CPU 63 is roughly divided into a main processing that is started when the power is turned on and a timer interrupt processing that is started periodically (in this embodiment, at a cycle of 4 milliseconds).

<Main processing>
First, the main process will be described with reference to the flowchart of FIG.

In the main process, first, the power-on weight process is executed (step S101). In the power-on weight process, for example, the process waits without proceeding to the next process until a predetermined time for weight (specifically, 1 second) elapses after the main process is started. During the execution period of the power-on weight process, the operation start and initial setting of the symbol display device 41 are completed. After that, the access of the main RAM 65 is permitted (step S102).

After that, it is determined whether or not the setting key insertion unit 68a is turned on (step S103). When the setting key insertion unit 68a is not turned on (step S103: NO), it is determined whether or not the reset button 68c is pressed (step S104). When the reset button 68c is pressed (step S104: YES), each area of the main RAM 65 is "" except for the area in which the information of the set value indicating the setting state of the pachinko machine 10 is set in the main RAM 65. Initial setting is performed for the area where "0" is cleared and the "0" is cleared (step S105). That is, when the supply of the operating power to the pachinko machine 10 is started while pressing the reset button 68c without turning on the setting key insertion unit 68a, the information of the set value is operated to the pachinko machine 10. The clearing process of the main RAM 65 is executed while maintaining the state before the power supply is stopped, and the initial setting is performed for the storage area where the clearing process is executed. This makes it possible to initialize other areas of the main RAM 65 without requiring a change in the set value. In step S105, the initial settings are performed after the various registers of the main CPU 63 are also cleared to "0".

When the reset button 68c is not pressed (step S104: NO), it is determined whether or not the power failure flag is set to "1" (step S106). The power failure flag is provided in the main RAM 65, and when the supply of operating power to the main CPU 63 is stopped and the predetermined power failure processing is normally executed, the power failure flag is set to "1". Will be set. When the power failure flag is set to "1", it is determined whether or not the checksum calculation result matches the checksum saved when the power is cut off, that is, the validity of the stored data is determined (step S107). .. When the process of step S105 is executed, or when an affirmative determination is made in step S107, it is determined whether or not the set value of the pachinko machine 10 is normal by checking the main RAM 65 (step S108). Specifically, when the set value is any one of "setting 1" to "setting 6", it is determined to be normal, and when it is "0" or 7 or more, it is determined to be abnormal.

If a negative determination is made in any of steps S106 to S108, the operation prohibition process is executed. In the operation prohibition process, an infinite loop occurs after the error notification process for notifying the hall manager or the like of the occurrence of an error is executed (step S109). The operation prohibition process is canceled by executing the all clear process (step S115) described later.

If an affirmative determination is made in all of steps S106 to S108, the power-on setting process is executed (step S110). In the power-on setting process, a predetermined area of the main RAM 65 such as initialization of the power failure flag is set as an initial value, and a command corresponding to the current gaming state is transmitted to the voice emission control device 81.

The main CPU 63 is configured to periodically execute the timer interrupt process, but the occurrence of the timer interrupt process is prohibited at the stage when the main process is started. The state in which the occurrence of the timer interrupt process is prohibited is released at the timing before the process of step S110 is completed and the process of step S111 is executed, and the execution of the timer interrupt process is permitted. As a result, when the supply of the operating power to the main CPU 63 is started, the power-on setting process of step S110 is completed, and the timer interrupt process is not executed until the stage before the process of step S111 is started. Therefore, the process for advancing the game is not started in the main CPU 63 until the situation is reached.

After that, the process proceeds to the residual processing of steps S111 to S114. That is, although the main CPU 63 is configured to periodically execute the timer interrupt processing, a residual time is generated between the timer interrupt processing of one and the next timer interrupt processing. This residual time varies depending on the processing completion time of each timer interrupt process, and the residual process of steps S111 to S114 is repeatedly executed by utilizing the irregular time. In this respect, it can be said that the residual processing in steps S111 to S114 is an irregular processing that is executed irregularly.

In the residual processing, first, in step S111, interrupt prohibition is set in order to prohibit the occurrence of timer interrupt processing. In the following step S112, the random number initial value update process for updating the random number initial value counter CINI is executed, and the variation counter update process for updating the variation type counter CS is executed in step S113. In these update processes, the current numerical information is read from the corresponding counter of the main RAM 65, a process of adding 1 to the read numerical information is executed, and then a process of overwriting the read source counter is executed. In this case, when the counter value exceeds the maximum value, it is cleared to "0" respectively. After that, in step S114, the interrupt enable setting for switching from the state in which the occurrence of the timer interrupt process is prohibited to the state in which the timer interrupt process is permitted is set. When the process of step S114 is executed, the process returns to step S111, and the processes of steps S111 to S114 are repeated.

On the other hand, when the setting key insertion unit 68a is turned on (step S103: YES), all clear processing is executed (step S115). In the all clear process, all areas of the main RAM 65 are cleared by "0" and "0" is cleared, including the area in which the information of the set value indicating the setting state of the pachinko machine 10 is set in the main RAM 65. Make initial settings for the area. That is, when the operation for changing the setting state of the pachinko machine 10 is performed, all the areas of the main RAM 65 are cleared to "0" even if the reset button 68c is not pressed, and the clearing is performed. Initial settings are made for the storage area where the processing was executed. Further, in step S115, the initial setting is performed after the various registers of the main CPU 63 are also cleared to "0". It should be noted that the present invention is not limited to this, and even if an operation for changing the setting state of the pachinko machine 10 is performed, if the reset button 68c is not pressed, the entire main RAM 65 is used. The clearing process may be executed when the operation for changing the setting state of the pachinko machine 10 is performed and the reset button 68c is pressed without executing the clearing process.

Then, after executing the set value update process in step S116, the process proceeds to the process of step S110. In the set value update process (step S116), first, "1" is set in the set value counter provided in the main RAM 65. The set value counter is a counter for the main CPU 63 to specify which set value the set state of the pachinko machine 10 is. By setting "1" in the set value counter, when the set value update process is executed, the set value becomes "setting 1" regardless of the set values up to that point. After that, the display control of the third notification display device 69c is performed so that the number "1" corresponding to "setting 1" is displayed. When changing the set value, the manager of the game hall can grasp the current setting state of the pachinko machine 10 by checking the third notification display device 69c. After that, the update execution process is executed.

In the update execution process, it is determined whether or not the update button 68b has been pressed once, provided that the setting key insertion unit 68a has not been pressed once, and when the update button 68b has been pressed once. Adds 1 to the value of the set value counter of the main RAM 65. If the value of the set value counter after the addition of 1 exceeds "6", "1" is set in the set value counter. As a result, each time the update button 68b is pressed once, the setting value is updated one step higher, and when the update button 68b is pressed once in the situation of "setting 6", it is set to "setting 1". Will be back. In the update execution process, when the value of the set value counter is updated, the display control of the third notification display device 69c is performed so that the number corresponding to the value of the set value counter of the main RAM 65 is displayed. By checking the third notification display device 69c, the manager of the game hall can grasp the setting state of the pachinko machine 10 after pressing the update button 68b. In the set value update process (step S116), the update execution process is repeatedly executed until the setting key insertion unit 68a is turned off. Then, when the setting key insertion unit 68a is turned off, the display of the set value on the third notification display device 69c is terminated, and the set value update process is terminated.

<Timer interrupt processing>
Next, the timer interrupt process will be described with reference to the flowchart of FIG. The timer interrupt process is executed periodically (for example, in a cycle of 4 milliseconds).

In the timer interrupt process, first, the power failure information storage process is executed (step S201). In the power failure information storage process, it is monitored whether or not a power failure signal corresponding to the occurrence of a power failure is received from the power failure monitoring board 67, and if the occurrence of a power failure is identified, an infinite loop occurs after executing the power failure processing. Become. In the power failure processing, "1" is set in the power failure flag of the main RAM 65, a checksum is calculated, and the calculated checksum is saved.

After that, the lottery random number update process is executed (step S202). In the lottery random number update process, the hit random number counter C1, the jackpot type counter C2, the reach random number counter C3, and the general electric accessory release counter C4 are updated. Specifically, the current numerical information was sequentially read from the hit random number counter C1, the jackpot type counter C2, the reach random number counter C3, and the general electric utility release counter C4, and the read numerical information was added by 1 to each. Later, a process of overwriting the read source counter is executed. In this case, when the counter value exceeds the maximum value, it is cleared to "0" respectively. After that, in step S203, the random number initial value update process is executed in the same manner as in step S112, and in step S204, the fluctuation counter update process is executed in the same manner as in step S113.

After that, a fraud detection process for monitoring whether or not a predetermined event set as a monitoring target for fraud has occurred is executed (step S205). In the fraud detection process, "1" is set in the game stop flag provided in the main RAM 65 by monitoring the occurrence of a plurality of types of events and confirming that a predetermined event has occurred. In the following step S206, it is determined whether or not the progress of the game is stopped by determining whether or not "1" is set in the game stop flag. If a negative determination is made in step S206, the processes after step S207 are executed.

In step S207, the port output process is executed. In the port output process, when the output information is set in the previous timer interrupt process, the process for outputting the output corresponding to the output information to the various drive units 32b and 34b is executed. For example, when the information to switch the special electric winning device 32 to the open state is set, the output of the drive signal to the drive unit 32b for the special electric is started, and when the information to switch to the closed state is set. Stops the output of the drive signal. Further, when the information for switching the utility accessory 34a of the second operating port 34 to the open state is set, the output of the drive signal to the drive unit 34b for the utility should be started and the state should be switched to the closed state. If the information is set, the output of the drive signal is stopped.

After that, the reading process is executed (step S208). In the reading process, signals other than the power failure signal and the winning signal are read, and the read information is stored for use in future processing.

After that, the ball entry detection process is executed (step S209). In the ball entry detection process, the signals received from the ball entry detection sensors 42a to 49a are read, and based on the read result, the out port 24a, the general winning opening 31, the special electric winning device 32, and the first operating port 33 are read. , The presence or absence of a ball entering the second operating port 34 and the through gate 35 is specified.

After that, a timer update process for collectively updating the numerical information of a plurality of types of timer counters provided in the main RAM 65 is executed (step S210). In this case, the timer counters to which the stored numerical information is subtracted and updated are collectively handled, but both the subtraction type timer counter update and the addition type timer counter update are collectively performed. It may be configured.

After that, a launch control process for controlling the launch of the game ball is executed (step S211). In a situation where the firing operation to the firing operation device 28 is continued, one game ball is launched every 0.6 seconds, which is a predetermined firing cycle. In the following step S212, as the input state monitoring process, the disconnection confirmation of the ball entry detection sensors 42a to 49a and the opening confirmation of the gaming machine main body 12 and the front door frame 14 are confirmed based on the information read in the reading process of step S208. I do.

After that, the special figure special electric control process for performing the execution control of the game times and the execution control of the open / close execution mode is executed (step S213). The special figure special electric control process will be described in detail later.

After that, the Fuzu Fuden control process is executed (step S214). In the Fuzu Fuden control process, when a prize has been won in the through gate 35, a process for acquiring the hold information on the Fuzu side is executed, and the hold information on the Fuzu side is stored. In addition, a release determination is made for the reserved information, and further, a process for performing an effect for a normal drawing is executed with the opening determination as an opportunity. Further, based on the result of the opening determination, a process of opening and closing the general electric accessory 34a of the second operating port 34 is executed. In this case, if the support mode is the low frequency support mode, the corresponding process is executed, and if the support mode is the high frequency support mode, the corresponding process is executed. Further, in the case of the open / close execution mode, even if the support mode immediately before that is the high frequency support mode, the low frequency support mode is set.

In the following step S215, based on the processing results of the immediately preceding steps S213 and S214, the output information for reflecting the increase / decrease number of the reserved information related to the special figure display unit 37a in the special figure reservation display unit 37b is set. , The output information for reflecting the increase / decrease number of the reserved information related to the normal figure display unit 38a in the normal figure hold display unit 38b is set. Further, in step S215, the output information for updating the display contents of the special figure display unit 37a is set based on the processing results of the immediately preceding steps S213 and S214, and the display contents of the normal figure display unit 38a are set. Set the output information for updating.

After that, the contents of the command and the signal received from the payout control device 77 are confirmed, and the payout state reception process for performing the process corresponding to the check result is executed (step S216). In addition, a payout output process for setting the prize ball command as an output target is executed (step S217). Further, the external information setting process for controlling the start and end of the output of the external signal according to the processing result of the various processes executed in the timer interrupt process this time is executed (step S218). After that, a management process for displaying the information corresponding to the entry result of the game ball in the game area PA on the first to third notification display devices 69a to 69c is executed (step S219), and this timer interrupt is performed. End the process.

<Special figure special electric control processing>
Next, the special figure special electric control process of step S213 will be described with reference to the flowchart of FIG. 23.

First, the pending information acquisition process is executed (step S301). In the holding information acquisition process, it is determined whether or not a prize has been generated in the first operating port 33 or the second operating port 34, and if a winning has occurred, the number of holdings in the holding storage area 65a is the upper limit. It is determined whether or not the value is less than the value (“4” in the present embodiment). If the number of holdings is less than the upper limit, the number of holdings is added by 1, and the numerical information of the hit random number counter C1, the jackpot type counter C2, and the reach random number counter C3 updated in the previous step S202 is used for holding. It is stored in the first holding area of the free holding areas RE1 to RE4 of the area RE. If the first operating port 33 and the second operating port 34 are winning at the same time, the process for acquiring the hold information is performed within the range in which the hold information acquisition process is executed once. Run multiple times. Further, when a new acquisition of the hold information is performed, an acquisition command corresponding to the acquisition is transmitted to the voice emission control device 81. When the voice emission control device 81 receives the command, the voice emission control device 81 updates the display of the image indicating the number of hold information on the symbol display device 41 to the display content corresponding to the increase in the hold information.

After that, the information of the special figure special electric counter provided in the main RAM 65 is read (step S302), and the special figure special electric address table provided in the main ROM 64 is read (step S303). Then, the start address corresponding to the information of the special figure special electric counter is acquired from the special figure special electric address table (step S304), and the process jumps to the process indicated by the acquired start address among the processes of steps S306 to S312 (step S305). ). The special figure special electric counter is a counter for the main CPU 63 to grasp which of the various processes of steps S306 to S312 should be executed, and the special figure special electric address table is a special figure special electric counter. Corresponding to the numerical information, the start address of the program for executing the processes of steps S306 to S312 is set.

In step S306, the special figure fluctuation start process is executed. FIG. 24 is a flowchart showing the special figure fluctuation start processing.

In the special figure fluctuation start process, the data setting process is executed on condition that the number of hold information stored in the hold area RE is 1 or more (step S401: YES) (step S402). In the data setting process, the number of holds is first subtracted by 1, and the data stored in the first hold area RE1 of the hold area RE is moved to the execution area AE. After that, the process of shifting the data stored in the reserved areas RE1 to RE4 of the reserved area RE is executed. This data shift process is a process of sequentially shifting the data stored in the first hold area RE1 to the fourth hold area RE4 toward the lower area side, and more specifically, the second hold area RE2 → the first hold area RE1. , 3rd holding area RE3 → 2nd holding area RE2, 4th holding area RE4 → 3rd holding area RE3, etc. After shifting the data in each area, the 4th holding area RE4 is cleared to “0”. At this time, a shift command for recognizing that the data in the hold area has been shifted is transmitted to the voice emission control device 81. When the voice emission control device 81 receives the command, the voice emission control device 81 updates the display of the image indicating the number of hold information on the symbol display device 41 to the display content corresponding to the decrease of the hold information.

After executing the data setting process, the pass / fail table is read from the pass / fail table storage area 64a of the main ROM 64 (step S403). As described above, the hit / miss table storage area 64a stores the low probability / hit / fail table for setting 1 to the low probability / hit / fail table for setting 6 and the high probability / hit / fail table as the hit / miss table. In step S403, the current winning / failing lottery mode is grasped by first reading the information indicating the winning / failing lottery mode of the main RAM 65. In the high probability mode, the high probability table is read from the hit / miss table storage area 64a. On the other hand, in the low probability mode, the setting state of the pachinko machine 10 is grasped by reading the value of the setting value counter of the main RAM 65. Then, the low probability / failure table corresponding to the grasped set value is read from the hit / miss table storage area 64a.

After that, the pass / fail determination process is executed with reference to the pass / fail table read in step S403 (step S404). In the hit / fail determination process, the hit / fail determination information, that is, the numerical information related to the hit random number counter C1 among the information stored in the execution area AE, matches the jackpot numerical information set in the hit / miss table read in step S403. Determine if it is.

If the result of the hit / fail determination process is the jackpot winning result (step S405: YES), the distribution determination process is executed (step S406). In the distribution determination process, among the information stored in the execution area AE, the information for distribution determination, that is, the numerical information related to the jackpot type counter C2 is read out. Then, with reference to the distribution table provided in the distribution table storage area 64b of the main ROM 64, it is specified which jackpot result corresponds to the numerical information related to the read jackpot type counter C2. Specifically, it is specified which of the low probability jackpot result, the low winning high probability jackpot result, and the most advantageous jackpot result corresponds to.

After that, the stop result setting process for the jackpot result is executed (step S407). Specifically, the information on the mode of the pattern to be finally stopped and displayed on the special figure display unit 37a in the game round related to the start of this fluctuation is stored in the main ROM 64 in advance from the stop result table for the jackpot result. It is specified, and the specified information is written to the main RAM 65. In the stop result table for the jackpot result, the information of the mode of the pattern to be stopped and displayed on the special figure display unit 37a is set differently for each type of the jackpot result.

After that, the flag setting process corresponding to the distribution determination result is executed (step S408). Specifically, the main RAM 65 is provided with a flag corresponding to each type of jackpot result, and in step S408, among the flags corresponding to each type of jackpot result, the distribution determination process of step S406 is performed. Set "1" to the flag corresponding to the result.

On the other hand, if it is determined in step S405 that the result is not the jackpot winning result, the stop result setting process for the loss result is executed (step S409). Specifically, the information on the mode of the pattern to be finally stopped and displayed on the special figure display unit 37a in the game round related to the start of this fluctuation is stored in advance in the main ROM 64 from the stop result table for the deviation result. It is specified, and the specified information is written to the main RAM 65. The information on the aspect of the pattern selected in this case is different from the information on the aspect of the pattern selected in the case of the jackpot result.

After executing any of the processes of step S408 and step S409, the process of grasping the duration of the game times is executed (step S410). In such processing, the numerical information of the variable type counter CS is acquired. In addition, it is determined whether or not the reach display is generated by the symbol display device 41 in this game round. Specifically, when the game times related to the start of the fluctuation this time are the low probability jackpot result or the most advantageous jackpot result, it is determined that the reach display occurs. Further, if it is not the result of any big hit and the numerical information related to the reach random number counter C3 stored in the execution area AE is the numerical information corresponding to the occurrence of reach, it is determined that the reach display occurs.

When it is determined that the reach display will occur, the duration of the game times corresponding to the numerical information of the current variation type counter CS is acquired by referring to the reach generation duration table stored in the main ROM 64. .. On the other hand, when it is determined that the reach display does not occur, the continuation of the game times corresponding to the numerical information of the variation type counter CS this time is continued by referring to the reach non-occurrence duration table stored in the main ROM 64. Get the period. Incidentally, the duration of the game times that can be acquired by referring to the reach non-occurrence duration table is different from the duration of the game times that can be acquired by referring to the reach generation duration table.

The duration of the game times when the reach does not occur is set so that the larger the number of hold information stored in the hold area RE, the shorter the duration of the game times. Also, in the situation where the support mode is the high frequency support mode, the duration of the shorter game times is selected as compared with the case where the number of pending information is the same as in the situation where the support mode is the low frequency support mode. A duration table for non-reach is set. However, the present invention is not limited to this, and the duration of the game may not change depending on the number of reserved information and the support mode, and the above relationship may be reversed. Further, the above configuration may be applied to the duration of the game times when the reach occurs. Further, in the case of various jackpot results, the duration table may be set individually for each of the case of the out-of-reach case and the case of the out-of-reach non-occurrence case. In this case, the duration of the game is distributed according to the result of each game.

After that, the information on the duration of the game times acquired in step S410 is set in the special figure special electric timer counter provided in the main RAM 65 (step S411). The update of the numerical information set in the special figure special electric timer counter is executed in the timer update process (step S210). By the way, as an effect for the game round, the variable display of the pattern on the special symbol display unit 37a and the variable display of the symbol on the symbol display device 41 are performed, and when each of these variable displays is completed, the variable display is performed. The final stop is displayed over the final stop period (for example, 0.5 seconds) in the state where the stop result of is displayed (in the symbol display device 41, a predetermined combination of symbols is waiting on the effective line). In this case, the duration of the game rounds acquired in step S410 is the total time for one game round.

After that, the variation command and the type command are transmitted to the voice emission control device 81 (step S412). The variable command includes information on the duration of the game. Here, as described above, the duration of the game times acquired by referring to the reach non-occurrence duration table is different from the duration of the game times acquired by referring to the reach generation duration table. Even if the variation command does not include information on the presence or absence of reach occurrence, the voice emission control device 81 can specify the presence or absence of reach occurrence from the information on the duration of the game times. In this respect, it can be said that the variable command contains information indicating whether or not reach has occurred. It should be noted that the variable command may include information that directly indicates whether or not reach has occurred. In addition, the type command includes information on the game result.

When the voice emission control device 81 receives the variation command and the type command from the main CPU 63, the decorative board 56, 57, the speaker unit 53, and the symbol display device 41 execute the effect of playing the game. In this case, the effect for the game round is performed in a manner corresponding to the contents of the variable command and the type command. Further, in the symbol display device 41, the variable display of the symbol is performed as the effect for the game round, and when the effect for the game round is completed, the combination of the symbols corresponding to the result of the hit / miss determination process and the distribution determination process is performed. Stop is displayed.

After that, the variable display of the pattern on the special figure display unit 37a is started (step S413). Then, the special figure special electric counter is added by 1 (step S414), and the present special figure fluctuation start process is terminated. The numerical information of the special figure special electric counter when the special figure fluctuation start processing is executed is "0". By adding "1" in step S414, the numerical information of the special figure special electric counter becomes "1".

Returning to the description of the special figure special electric control process (FIG. 23), in step S307, the special figure changing process is executed. In the special figure change processing, it is determined whether or not the timing is before the final stop display during the duration of the game round, and if it is before the final stop display, the display mode of the pattern on the special figure display unit 37a is ruled. Execute the process to change the target. When it is time to display the final stop, the numerical information of the special figure special electric counter is added by 1, so that the numerical information of the counter is changed from the one corresponding to the special figure changing process to the special figure fixing process. Update to one. In this embodiment, the final stop command is not transmitted from the main CPU 63 to the voice emission control device 81.

In step S308, the process during the determination of the special figure is executed. In the process of determining the special figure, the display mode of the pattern on the special figure display unit 37a is set to the display mode corresponding to the lottery result of the current game round. Further, in the process during the determination of the special figure, it is determined whether or not the final stop period has elapsed, and if the period has elapsed, it is determined whether or not the transition to the open / close execution mode occurs. If the transition to the open / close execution mode does not occur, the numerical information of the special figure special electric counter is cleared to "0". When the transition to the open / close execution mode occurs, the numerical information of the special figure special electric counter is added by 1, so that the numerical information of the counter is changed from the one corresponding to the special figure confirmation processing to the one corresponding to the special electric start processing. Update.

In step S309, the special electric start processing is executed. In the special electric start processing, if the processing for starting the opening period in the opening / closing execution mode of this time has not been executed yet, the opening period setting processing is executed. Further, the opening command is transmitted to the voice emission control device 81. Upon receiving the opening command, the voice emission control device 81 causes the decorative boards 56, 57, the speaker unit 53, and the symbol display device 41 to execute the opening effect. If the opening period has elapsed, the start process for starting the first round game is executed. In the start processing, the special electric winning device 32 is opened and the end condition of the round game is set. When setting this end condition, the upper limit continuation period when the special electric winning device 32 is kept in the open state in the first round game of this time is set, and the special electric winning device 32 can be won in the first round game of this time. The upper limit number of game balls is set in the winning number counter provided in the main RAM 65.

In step S310, the processing during the opening of the special electric power is executed. In the processing during the opening of the special electric power, it is determined whether or not the end condition of the round game is satisfied. If the end condition is satisfied, the special electric winning device 32 is closed. Then, if the round game ended this time is not the round game of the last execution time, the numerical information of the special electric counter is added by 1 to change the numerical information of the counter from the one corresponding to the special electric opening processing to the special electric closing processing. If the round game that ended this time is the round game of the last execution time, the numerical information of the special figure special electric counter is added by 2 to correspond to the processing while the special electric is open. Update from the one corresponding to the special train end processing.

In step S311, the process during closing of the special electric train is executed. In the special electric closed processing, it is determined whether or not the interval period between round games has elapsed. The interval period is set when the previous round game ends. When the interval period has elapsed, the special electric winning device 32 is opened and the end condition of the round game is set. Then, by subtracting 1 from the numerical information of the special figure special electric counter, the numerical information of the counter is updated from the one corresponding to the special electric closed processing to the one corresponding to the special electric opening processing.

In step S312, the special electric power termination process is executed. In the special electric end processing, if the processing for starting the ending period in the opening / closing execution mode of this time has not been executed yet, the ending period (for example, 5 seconds) is set and the ending command is transmitted to the voice emission control device 81. .. Upon receiving the ending command, the voice emission control device 81 causes the decorative boards 56, 57, the speaker unit 53, and the symbol display device 41 to execute the ending effect. When the ending period has elapsed, each of the winning / failing lottery mode and the support mode after the end of the opening / closing execution mode is set to the mode corresponding to the jackpot result that triggered the start of the opening / closing execution mode this time.

According to the present embodiment described in detail above, the following excellent effects are obtained.

In the first decorative substrate 56, the same number (specifically, two) of wiring patterns 172a to 172d are drawn out from the pair of pads 171a and 171b corresponding to the pair of electrodes 85a and 85b of the bypass capacitor 85. Of the four sides of the first pad 171a, the direction (right direction) in which the side from which the first wiring pattern 172a is pulled out when viewed from the center of the first pad 171a exists is the direction (right direction) among the four sides of the second pad 171b. It is the same direction as the direction (right direction) in which the side from which the third wiring pattern 172c is pulled out exists when viewed from the center of the second pad 171b. Further, of the four sides of the first pad 171a, the direction (left direction) in which the side from which the second wiring pattern 172b is pulled out when viewed from the center of the first pad 171a exists is the four sides of the second pad 171b. Of these, the direction is the same as the direction (left direction) in which the side from which the fourth wiring pattern 172d is pulled out exists when viewed from the center of the second pad 171b. As a result, it is possible to prevent a difference in the temperature distribution in the pair of pads 171a and 171b at the initial stage of heating in the reflow step, and it is possible to prevent the rotation of the bypass capacitor 85 and the occurrence of chip standing.

The bypass capacitor 85 is a small chip component having a longitudinal dimension of approximately 0.6 mm and a lateral dimension and a thickness direction of approximately 0.3 mm. Since the dimension in the longitudinal direction along the plane orthogonal to the thickness direction of the bypass capacitor 85 is 0.7 mm or less, the area occupied by the bypass capacitor 85 in the first decorative substrate 56 can be reduced. When the dimension of the bypass capacitor 85 in the longitudinal direction is 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 85 and the first decorative substrate 56 and the mechanical strength of the bypass capacitor 85 itself are increased, and the connection is made. The possibility of damage to the portion can be reduced, and the possibility of damage to the bypass capacitor 85 itself can be reduced. Further, when the dimension of the bypass capacitor 85 in the longitudinal direction is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting omission of the bypass capacitor 85.

In a configuration in which the same number (specifically, one) of wiring patterns 181a and 181b are drawn from the pair of pads 176a and 176b corresponding to the pair of electrodes 87a and 87b of the small chip resistor 87, the first pad 176a Of the four sides of the second pad 176b, the direction (right direction) in which the side from which the first wiring pattern 181a is pulled out when viewed from the center of the first pad 176a is the second pad 176b among the four sides of the second pad 176b. It is the same direction as the direction (right direction) in which the side from which the second wiring pattern 181b is pulled out exists when viewed from the center of the above. As a result, it is possible to prevent a difference in the temperature distribution in the pair of pads 176a and 176b at the initial stage of heating in the reflow process, and it is possible to prevent the rotation of the small chip resistor 87 and the occurrence of chip standing.

Similar to the bypass capacitor 85, the small chip resistor 87 has a longitudinal dimension (longitudinal dimension of the small chip resistor 87) along a plane orthogonal to the thickness direction of the component of 0.1 mm or more. It is a small chip component having a size of 9 mm or less. The small chip resistor 87 is a small chip component having a longitudinal dimension of about 0.6 mm and a lateral dimension and a thickness direction of approximately 0.3 mm. Since the dimension of the small chip resistor 87 in the longitudinal direction is 0.7 mm or less, the area occupied by the small chip resistor 87 in the first decorative substrate 56 can be reduced. When the dimension of the small chip resistor 87 in the longitudinal direction is 0.4 mm or more, the mechanical strength at the connection point between the small chip resistor 87 and the first decorative substrate 56 and the mechanical strength of the small chip resistor 87 itself. The strength can be increased, the possibility of damage to the connection portion can be reduced, and the possibility of damage to the small chip resistor 87 itself can be reduced. Further, when the dimension of the small chip resistor 87 in the longitudinal direction is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting omission of the small chip resistor 87.

The first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85 is electrically connected to the GND plane layer 93 having a larger area than the first pad 171a via the first wiring pattern 172a, and is also a bypass capacitor. The second pad 171b corresponding to the second electrode 85b of the 85 is electrically connected to the power supply plane layer 94 having a larger area than the second pad 171b via the third wiring pattern 172c. Of the four sides of the first pad 171a, the direction (right direction) in which the side from which the first wiring pattern 172a is pulled out when viewed from the center of the first pad 171a exists is the direction (right direction) among the four sides of the second pad 171b. It is the same direction as the direction (right direction) in which the side from which the third wiring pattern 172c is pulled out exists when viewed from the center of the second pad 171b. This reduces the possibility that the temperature distribution in the pair of pads 171a and 171b will differ in the initial heating stage of the reflow step.

The width dimension of the first wiring pattern 172a drawn from the first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85 is the third wiring pattern drawn out from the second pad 171b corresponding to the second electrode 85b. It is substantially the same as the width dimension of 172c. Therefore, the possibility that the temperature distribution in the pair of pads 171a and 171b is different in the initial heating stage of the reflow process is reduced as compared with the configurations in which the width dimensions of the wiring patterns 172a and 172c are different. Further, the width dimension of the second wiring pattern 172b drawn out from the first pad 171a is substantially the same as the width dimension of the fourth wiring pattern 172d drawn out from the second pad 171b. Therefore, as compared with the configurations in which the width dimensions of the wiring patterns 172b and 172d are different, the possibility that the temperature distribution in the pair of pads 171a and 171b is different in the initial heating stage of the reflow process is reduced.

The width dimension of the first wiring pattern 181a drawn from the first pad 176a corresponding to the first electrode 87a of the small chip resistor 87 is the second drawn from the second pad 176b corresponding to the second electrode 87b. It is substantially the same as the width dimension of the wiring pattern 181. Therefore, there is a difference in the temperature distribution in the pair of pads 176a, 176b in the initial heating stage of the reflow process, as compared with the configuration in which the width dimensions of the wiring patterns 181a, 181b drawn from the pads 176a, 176b are different. The possibility of occurrence is reduced.

Since the number and the drawing positions of the wiring patterns 172a to 172d drawn out from the pair of pads 171a and 171b corresponding to the pair of electrodes 85a and 85b of the bypass capacitor 85 are common, the molten solder on the first pad 171a is used. The force acting on the first electrode 85a of the bypass capacitor 85 due to the surface tension of the bypass capacitor 85 and the force acting on the second electrode 85b of the bypass capacitor 85 due to the surface tension of the molten solder on the second pad 171b can be balanced. Therefore, even if only the left side portion of the solder paste is melted first in the pair of pads 171a and 171b, the movement mode of the bypass capacitor 85 can be set to translation and the rotation of the bypass capacitor 85 can be prevented. .. As a result, the degree of decrease in the connection area between the first pad 171a and the first electrode 85a due to the solder fillet 173a can be suppressed, and the decrease in the connection area between the second pad 171b and the second electrode 85b due to the solder fillet 173b can be suppressed. The degree of can be suppressed.

Since the number and the drawing positions of the wiring patterns 181a and 181b drawn out from the pair of pads 176a and 176b corresponding to the pair of electrodes 87a and 87b of the small chip resistor 87 are common, the first pad 176a is used. The force acting on the first electrode 87a of the small chip resistor 87 due to the surface tension of the molten solder and the force acting on the second electrode 87b of the small chip resistor 87 due to the surface tension of the molten solder on the second pad 176b. Can be balanced. Therefore, even if only the left side portion of the solder paste of the pair of first pads 176a and the second pad 176b is melted first, the movement mode of the small chip resistor 87 is set to translation, and the small chip resistor 87 is moved. Can prevent the rotation of. As a result, the degree of decrease in the connection area between the first pad 176a and the first electrode 87a due to the solder fillet 177a can be suppressed, and the decrease in the connection area between the second pad 176b and the second electrode 87b due to the solder fillet 177b can be suppressed. The degree of can be suppressed.

The small chip components (bypass capacitor 85 and small chip resistor 87) are mounted on the first decorative substrate 56 so that the longitudinal direction of the small chip components is parallel to the first direction DR1. The dimension of the first decorative substrate 56 in the first direction DR1 is larger than the dimension of the first decorative substrate 56 in the second direction DR2 orthogonal to the first direction DR1. Assuming that the small chip component is mounted on the first decorative substrate 56 so that the longitudinal direction of the small chip component is orthogonal to the first direction DR1, the first decoration is based on the boundary line extending to the first direction DR1. When a force that bends the substrate 56 acts on the first decorative substrate 56, there is a possibility that stress that damages the connection portion between the small chip component and the first decorative substrate 56 acts on the connection portion. At the same time, there is a possibility that stress that damages the small chip component itself acts on the small chip component itself. On the other hand, the small chip component and the first decoration are configured so that the longitudinal direction of the small chip component is orthogonal to the first direction DR1 and the small chip component is mounted on the first decorative substrate 56. The maximum value of the stress that can be applied to the connection point with the substrate 56 is reduced, and the maximum value of the stress that can be applied to the small chip component is reduced. Therefore, the connection portion between the small chip component and the first decorative substrate 56 is prevented from being damaged, and the small chip component itself is prevented from being damaged.

The small chip component (bypass capacitor 97 and small chip resistor 101) is mounted on the second decorative substrate 57 so that the longitudinal direction of the small chip component is parallel to the long axis direction LD. The dimension of the second decorative substrate 57 in the major axis direction LD is larger than the dimension of the second decorative substrate 57 in the minor axis direction SD orthogonal to the major axis direction LD. Assuming that the small chip component is mounted on the second decorative substrate 57 so that the longitudinal direction of the small chip component is orthogonal to the long axis direction LD, the second decoration is based on the boundary line extending in the long axis direction LD. When a force that bends the substrate 57 acts on the second decorative substrate 57, a stress that damages the connection portion between the small chip component and the second decorative substrate 57 may be applied. At the same time, there is a possibility that stress that damages the small chip component itself acts on the small chip component itself. On the other hand, the small chip component and the second decoration are configured so that the longitudinal direction of the small chip component is orthogonal to the long axis direction LD and the small chip component is mounted on the second decorative substrate 57. The maximum value of the stress that can be applied to the connection point with the substrate 57 is reduced, and the maximum value of the stress that can be applied to the small chip component is reduced. Therefore, the connection portion between the small chip component and the second decorative substrate 57 is prevented from being damaged, and the small chip component itself is prevented from being damaged.

The electrodes 85a and 85b of the bypass capacitor 85 are fixed to the pads 171a and 171b by solder fillets 173a and 173b. The pads 171a and 171b and the wiring patterns 172a to 172d are integrally formed by etching a copper foil plate. The wiring patterns 172a to 172d drawn out from the pads 171a and 171b extend in a direction orthogonal to the longitudinal direction (short direction) or a direction substantially orthogonal to the longitudinal direction of the bypass capacitor 85. Assuming that the wiring patterns 172a to 172d drawn from the pads 171a and 171b extend in a direction parallel to the longitudinal direction of the bypass capacitor 85, a boundary line orthogonal to the long side direction of the bypass capacitor 85 or a boundary substantially orthogonal to the long side direction of the bypass capacitor 85. When the first decorative substrate 56 is distorted in the direction of bending the first decorative substrate 56 with the wire as a base point, the stress that damages the connection portion between the bypass capacitor 85 and the first decorative substrate 56. May act, and a stress that damages the bypass capacitor 85 may act on the bypass capacitor 85 itself. On the other hand, the wiring patterns 172a to 172d drawn out from the pads 171a and 171b are configured to extend in a direction orthogonal to the longitudinal direction of the bypass capacitor 85 or in a direction substantially orthogonal to the longitudinal direction, thereby forming the first decorative substrate 56. It is possible to reduce the maximum value of stress that can act on the connection point between the bypass capacitor 85 and the first decorative substrate 56 when distortion occurs, and also reduce the maximum value of stress that can act on the bypass capacitor 85 itself. be able to.

The electrodes 87a and 87b of the small chip resistor 87 are fixed to the pads 176a and 176b by solder fillets 177a and 177b. The pads 176a and 176b and the wiring patterns 181a and 181b are integrally formed by etching a copper foil plate. The wiring patterns 181a and 181b drawn out from the pads 176a and 176b extend in a direction orthogonal to the longitudinal direction (short direction) or substantially orthogonal to the longitudinal direction of the small chip resistor 87. Assuming that the wiring patterns 181a and 181b drawn from the pads 176a and 176b extend in a direction parallel to the longitudinal direction of the small chip resistor 87, a line orthogonal to the long side direction of the small chip resistor 87 or abbreviated. When a bending stress that bends the first decorative board 56 with an orthogonal line as a boundary acts on the first decorative board 56, the connection point with respect to the connection point between the small chip resistor 87 and the first decorative board 56. There is a possibility that a stress that damages the small chip resistor 87 acts on the small chip resistor 87 itself, and there is a possibility that a stress that damages the small chip resistor 87 acts on the small chip resistor 87 itself. On the other hand, the wiring patterns 181a and 181b drawn out from the pads 176a and 176b extend in a direction orthogonal to the longitudinal direction of the small chip resistor 87 or in a direction substantially orthogonal to the longitudinal direction, so that the first decorative substrate can be obtained. When the 56 is distorted, the maximum value of the stress that can act on the connection point between the small chip resistor 87 and the first decorative substrate 56 can be reduced, and the stress that can act on the small chip resistor 87 itself can be reduced. The maximum value of can be reduced.

The first pad 176a electrically connected to the first electrode 87a of the small chip resistor 87 is electrically connected to the second electrode 142b of the LED chip 142 via the first wiring pattern 181a. It is electrically connected to the pad 178b (see FIG. 8C). Further, the second pad 176b, which is electrically connected to the second electrode 87b of the small chip resistor 87, is the eighth output terminal 162 of the LED driver 126 (FIG. 8A) via the second wiring pattern 181b. It is electrically connected to a pad (not shown) that is electrically connected to (FIG. 11). In the pad (not shown) corresponding to the eighth output terminal 162, the place where the second wiring pattern 181b is connected is the drawing direction of the second wiring pattern 181b from the second pad 176b (FIGS. 8A and 8C). 2nd wiring from the 2nd pad 176b with reference to the 2nd pad 176b when viewed in the direction of one axis (the second direction DR2 in FIGS. 8A and 8C) including the right direction in the above. It exists in the direction opposite to the pull-out direction of the pattern 181b. The second wiring pattern 181b is drawn out from the second pad 176b in the same direction (right direction) as the drawing direction of the first wiring pattern 181a from the first pad 176a, and then in the direction of the one axis (second direction DR2). ), It is routed in the opposite direction with respect to the second pad 176b. A location where the second wiring pattern 181b exists in the direction opposite to the drawing direction of the second wiring pattern 181b from the second pad 176b with respect to the second pad 176b when viewed in the direction of one axis (second direction DR2). The second wiring pattern 181b is also drawn out from the second pad 176b in the same direction as the drawing direction of the first wiring pattern 181a from the first pad 176a even in the configuration in which the second wiring pattern 181b is connected to the connection destination. This makes it possible to reduce the possibility of a difference in temperature distribution in the pair of first pads 176a and second pads 176b in the initial heating stage of the reflow step.

The pair of pads corresponding to the pair of electrodes of the small chip component have the same shape and size as each other. Therefore, the amount of solder paste applied on the pair of pads in the solder application step can be made uniform, and the amount of molten solder generated on the pair of pads can be made uniform. As a result, the surface tension of the molten solder on the first pad acts on the first electrode of the small chip component, and the surface tension of the molten solder on the second pad acts on the second electrode of the small chip component. Can be balanced. Therefore, it is possible to prevent the rotation of the small chip component and the chip standing of the small chip component.

The bypass capacitor 85 is mounted on the first decorative substrate 56 so that the longitudinal direction of the bypass capacitor 85 is parallel to the first direction DR1. The pair of pads 171a and 171b corresponding to the pair of electrodes 85a and 85b of the bypass capacitor 85 are provided apart from each other in the longitudinal direction of the bypass capacitor 85. Further, the small chip resistor 87 is mounted on the first decorative substrate 56 so that the longitudinal direction of the small chip resistor 87 is parallel to the first direction DR1. The pair of pads 176a, 176b corresponding to the pair of electrodes 87a, 87b of the small chip resistor 87 are provided so as to be spaced apart from each other in the longitudinal direction of the small chip resistor 87. As described above, the pair of pads 176a and 176b have a common separation direction in the plurality of small chip components (bypass capacitor 85 and small chip resistor 87). Therefore, by transporting the first decorative substrate 56 in the direction orthogonal to the common separation direction or the direction substantially orthogonal to the common separation direction in the reflow step, the pair of pads 171a corresponding to the pair of electrodes 85a and 85b of the bypass capacitor 85, The timing at which the heating of the solder paste applied on the 171b is started can be aligned, and the solder paste is applied on the pair of pads 176a and 176b corresponding to the pair of electrodes 87a and 87b of the small chip resistor 87. It is possible to align the timing at which the heating of the solder paste is started. This makes it possible to prevent the rotation of a plurality of small chip components and the occurrence of chip standing.

In a configuration in which small chip components (bypass capacitor 85 and small chip resistor 87) are integrated on the first mounting surface 84 of the first decorative board 56, the connectors 111 and 112 are the second mounting surface of the first decorative board 56. It is implemented only in 95. On the first mounting surface 84, the small chip component is a region of the first mounting surface 84 corresponding to the area corresponding to the back side of the connector 203, 204 (the area on the second mounting surface 95 where the connectors 111, 112 are mounted and the peripheral area thereof). ) Is avoided. As a result, it is possible to reduce the maximum value of the tensile stress that can act on the connection point between the small chip component and the first decorative substrate 56 when the harness is attached to the connectors 111 and 112, and it acts on the small chip component itself. The maximum possible tensile stress can be reduced. Further, it is possible to reduce the maximum value of the compressive stress that can act on the connection point between the small chip component and the first decorative substrate 56 when the harness is pulled out from the connectors 111 and 112, and it can act on the small chip component itself. The maximum value of compressive stress can be reduced.

In the first decorative substrate 56, the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged at a distance of 5 mm or more from the outer edge of the fixed through holes 56d to 56 g. There is. Small chip components are not mounted in the through hole peripheral regions 211a to 211d. By arranging the small chip component at a distance of 5 mm or more from the outer edge of the fixed through hole 56d to 56 g, it may occur in the vicinity of the fixed through hole 56d to 56 g when the first decorative substrate 56 is screwed to the front door frame 14. It is possible to prevent the connection portion between the small chip component and the first decorative board 56 from being damaged due to the distortion of the decorative substrate 56, and it is possible to prevent the small chip component itself from being damaged.

The small chip component is not mounted on the LED back side corresponding area 201 on the second mounting surface 95 of the first decorative substrate 56. The LED back side corresponding area 201 is a distance from the outer edge of the area of the second mounting surface 95 located on the back side of the area where the LED chips 127 to 142 are mounted on the first mounting surface 84 and the area of the second mounting surface 95. Is an area within 1 mm. The LED chips 127 to 142 have a configuration in which the small chip components are not mounted in the region of the second mounting surface 95 located on the back side of the region where the LED chips 127 to 142 are mounted on the first mounting surface 84. The influence of the thermal stress that can act on the first decorative substrate 56 due to the heat generation on the small chip component is reduced. Since the small chip component is mounted avoiding the LED back side corresponding area 201, the connection between the small chip component and the first decorative substrate 56 is caused by the fact that the light emitting effect on the first decorative substrate 56 is repeatedly executed. It is possible to prevent the portion from being damaged and to prevent the small chip component itself from being damaged.

No small chip component is mounted in the corresponding area 202 on the back side of the driver on the second mounting surface 95. The driver back side corresponding area 202 is an area of the second mounting surface 95 located on the back side of the area where the LED driver 126 is mounted on the first mounting surface 84 and the area where the pad corresponding to the terminal of the LED driver 126 is provided. And the area where the distance from the outer edge of the area of the second mounting surface 95 is within 1 mm. Small chip components are mounted in the area of the second mounting surface 95 located on the back side of the area where the LED driver 126 is mounted and the area where the pad corresponding to the terminal of the LED driver 126 is provided on the first mounting surface 84. Since the configuration is not provided, the influence of the thermal stress that can act on the first decorative substrate 56 due to the heat generated by the LED driver 126 on the small chip component is reduced. Since the small chip component is mounted so as to avoid the corresponding area 202 on the back side of the driver, the connection between the small chip component and the first decorative board 56 is caused by the fact that the light emitting effect on the first decorative board 56 is repeatedly executed. It is possible to prevent the portion from being damaged and to prevent the small chip component itself from being damaged.

In the first decorative substrate 56, the small chip components (bypass capacitor 85 and small chip resistor 87) are arranged at a distance of 1 mm or more from the outer edge of the LED chip 142. By arranging the small chip component at a distance of 1 mm or more from the outer edge of the LED chip 142, the influence of thermal stress on the connection point between the small chip component and the first decorative substrate 56 can be minimized, and the small chip can be used. The effect of thermal stress on the component itself can be minimized. Further, by arranging the small chip component at a distance of 1 mm or more from the outer edge of the LED chip 142, it is possible to prevent the connection portion between the small chip component and the first decorative substrate 56 from being damaged by thermal stress. At the same time, it is possible to prevent the small chip component itself from being damaged by thermal stress.

In the first decorative substrate 56, the small chip components (bypass capacitor 85 and small chip resistor 87) are arranged at a distance of 1 mm or more from the pad corresponding to the outer edge of the LED driver 126 and the terminal of the LED driver 126. .. By arranging the small chip component at a distance of 1 mm or more from the outer edge of the LED driver 126 and the pad corresponding to the terminal of the LED driver 126, the connection point between the small chip component and the first decorative substrate 56 is damaged by thermal stress. It is possible to prevent the small chip component itself from being damaged by thermal stress.

In the first decorative substrate 56, the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged so as to avoid the through hole peripheral regions 211a to 211d. The through-hole peripheral regions 211a to 211d are regions where the distance from the outer edge of the fixed through-holes 56d to 56g is less than 5 mm. By arranging the small chip component at a distance of 5 mm or more from the outer edge of the fixed through hole 56d to 56 g, it may occur in the vicinity of the fixed through hole 56d to 56 g when the first decorative substrate 56 is screwed to the front door frame 14. It is possible to prevent the connection portion between the small chip component and the first decorative board 56 from being damaged due to the distortion of the decorative substrate 56, and it is possible to prevent the small chip component itself from being damaged.

On the first mounting surface 84, the small chip components are arranged so as to avoid the corresponding areas 203 and 204 on the back side of the connector. The corresponding areas 203 and 204 on the back side of the connector are from the outer edge of the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95 and the area of the first mounting surface 84. This is an area where the distance is less than 5 mm. Harnesses to the connectors 111 and 112 are configured so that the small chip components are not mounted in the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95. The influence of the stress that can act on the first decorative substrate 56 when attaching and detaching the first decorative substrate 56 to the small chip component is reduced. Since the small chip parts are arranged so as to avoid the corresponding areas 203 and 204 on the back side of the connector, the connection point between the small chip parts and the first decorative board 56 is damaged when the harness is attached to and detached from the connectors 111 and 112. Is prevented, and the small chip component itself is prevented from being damaged.

The LED driver 126 is arranged in an area including an area less than 10 mm from the outer edge of the first decorative substrate 56, while the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are included. , The first decorative substrate 56 is arranged at a distance of 10 mm or more from the outer edge. Among the various electronic components mounted on the first decorative board 56, the connection points between the small chip components and the first decorative board 56 are mechanical as compared with the connection points between the other electronic components and the first decorative board 56. The target strength is low. Since the small chip component is arranged at a distance of 10 mm or more from the outer edge of the first decorative substrate 56, the operator's hand touches the small chip component when handling the first decorative substrate 56, and the small chip component and the first decorative substrate 56 are arranged. 1 The possibility that the connection point with the decorative substrate 56 is damaged is reduced, and the possibility that the small chip component itself is damaged is reduced. Further, the maximum value of the stress that can act on the connection point between the small chip component and the first decorative substrate 56 when the collective substrate 231 is divided is reduced, and the maximum value of the stress that can act on the small chip component itself is reduced. Has been done.

Small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged avoiding areas around the through holes 211a to 211d and areas where the distance from the outer edge of the first decorative substrate 56 is less than 10 mm. In this configuration, the fixed through holes 56d to 56 g are provided in a region where the distance from the outer edge of the first decorative substrate 56 is less than 10 mm. Therefore, the area of the area where the small chip component can be mounted in the first decorative substrate 56 is compared with the configuration in which the fixed through holes 56d to 56 g are provided at a position 10 mm or more away from the outer edge of the first decorative substrate 56. Is widely secured.

A bypass capacitor 85 is arranged between the power supply terminal 151 of the LED driver 126 and the power supply plane layer 94. As a result, the influence of the noise component contained in the drive power supply supplied from the voice emission control device 81 to the LED driver 126 on the LED driver 126 is reduced. The bypass capacitor 85 is arranged close to the power supply terminal 151 so that no other electronic component such as an IC exists between the bypass capacitor 85 and the power supply terminal 151. As a result, it is possible to increase the possibility that the noise component contained in the drive power supply supplied to the power supply terminal 151 of the LED driver 126 is absorbed by the bypass capacitor 85, and the LED driver 126 is affected by the noise component. It is possible to reduce the possibility of receiving and malfunctioning. Since the configuration is such that no other IC exists between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component mistakenly mistakes the other IC. It is possible to prevent it from being activated. Further, since the configuration is such that no other electronic component exists between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component becomes another. It is possible to prevent the electronic components from malfunctioning.

Around the bypass capacitor 85, only the identification silk 217 (indicated as "C1") that makes it possible to confirm that the mounted electronic component is the bypass capacitor 85 is provided, and the mounting position of the bypass capacitor 85 is provided. There is no outer silk that makes it possible to grasp. The outer dimensions (vertical dimension, horizontal dimension and height dimension) of the bypass capacitor 85 are smaller than the outer dimensions of electronic components (LED driver 126, LED chips 127 to 142, etc.) other than small chip components. Therefore, when the outer silk of the bypass capacitor 85 is printed on the first decorative substrate 56, the bypass capacitor is viewed only by looking at the outer silk even though the mounting omission of the bypass capacitor 85 actually occurs after the electronic components are mounted. If 85 is mounted, the operator may mistakenly recognize it. On the other hand, by forming the outer shape silk around the bypass capacitor 85, it is possible to easily grasp the mounting omission of the bypass capacitor 85 after mounting the electronic components. Further, since the identification silk 217 is provided around the bypass capacitor 85, it is possible to grasp that the component mounted around the identification silk 217 is the bypass capacitor 85.

The outer dimensions of the small chip resistor 87 are smaller than the outer dimensions of electronic components other than the small chip components, similar to the outer dimensions of the bypass capacitor 85. Around the small chip resistor 87, only the identification silk 218 (indicated as "R8") that makes it possible to confirm that the mounted electronic component is the small chip resistor 87 is provided, and the small chip is provided. There is no external silk that allows the mounting position of the resistor 87 to be confirmed. As a result, it is possible to easily grasp the mounting omission of the small chip resistor 87. Further, since the identification silk 218 is provided around the small chip resistor 87, it is possible to grasp that the electronic component mounted around the identification silk 218 is the small chip resistor 87. be able to.

Since the outer silks 225a and 225b are convex with respect to the surface of the solder resist 222, it is assumed that the outer silks 225a and 225b are provided around the small chip components (bypass capacitor 85 and small chip resistor 87). The outer silks 225a and 225b exist between the first mounting surface 84 and the metal mask 226, and the distance between the first mounting surface 84 and the metal mask 226 increases. In this configuration, the solder paste 227 may wrap around the gap existing between the first pad 171a and the second pad 171b, and the first pad 171a and the second pad 171b may be electrically connected. In particular, when the solder paste 221 is continuously applied to a large number of first decorative substrates 56, the solder paste 221 collected at the edge of the opening of the metal mask 226 tends to wrap around to the back side of the opening. The first pad 171a and the second pad 171b are easily electrically connected. On the other hand, in the present embodiment, the outer silk is not provided around the small chip component. As a result, it is possible to prevent the first mounting surface 84 and the metal mask 226 from being too far apart, and it is possible to prevent the occurrence of solder defects in which the solder paste 221 enters between the pads 171a and 171b. Can be done. In addition, it is prevented that a part of the small chip parts is placed on the outer silk and causes soldering failure.

In the LED back side corresponding area 201 on which the small chip component is not mounted on the second mounting surface 95 of the first decorative substrate 56, the LED chips 127 to 142 (FIG. 9) are on the first mounting surface 84 (FIG. 8A). The area of the second mounting surface 95 located on the back side of the mounted area and the area of the second mounting surface 95 from the outer edge are not limited to the area within 1 mm. The distance from the outer edge of the region of the second mounting surface 95 and the region of the second mounting surface 95 located on the back side of the region where the LED chips 127 to 142 are mounted on the first mounting surface 84. May be a region of 2 mm or less. Thereby, the influence of the thermal stress that may act on the first decorative substrate 56 due to the heat generation of the LED chips 127 to 142 on the small chip component can be further reduced. Therefore, it is possible to reduce the possibility that the connection portion between the small chip component and the first decorative board 56 is damaged due to the repeated execution of the light emitting effect on the first decorative board 56, and it is possible to reduce the size. It is possible to reduce the possibility that the chip component itself will be damaged.

In the driver backside corresponding area 202 on which the small chip component is not mounted on the second mounting surface 95 of the first decorative board 56, the LED driver 126 (FIG. 8 (a)) is provided on the first mounting surface 84 (FIG. 8 (a)). The distance from the outer edge of the area of the second mounting surface 95 located behind the area where the mounting area and the area corresponding to the terminal of the LED driver 126 are provided and the area of the second mounting surface 95 is within 1 mm. It is not limited to the area of. The driver back side corresponding area 202 is the area of the second mounting surface 95 located on the back side of the area where the LED driver 126 is mounted on the first mounting surface 84 and the area where the pad corresponding to the terminal of the LED driver 126 is provided. And the area of the second mounting surface 95 from the outer edge may be a region within 2 mm. Thereby, the influence of the thermal stress that may act on the first decorative substrate 56 due to the heat generated by the LED driver 126 on the small chip component can be further reduced. Therefore, it is possible to reduce the possibility that the connection portion between the small chip component and the first decorative board 56 is damaged due to the repeated execution of the light emitting effect on the first decorative board 56, and it is possible to reduce the size. It is possible to reduce the possibility that the chip component itself will be damaged.

In the first decorative substrate 56, the through hole peripheral regions 211a to 211d on which the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are not mounted are the outer edges of the fixed through holes 56d to 56g. The distance from is not limited to a region of less than 5 mm. The through-hole peripheral regions 211a to 211d may be regions where the distance from the outer edge of the fixed through-holes 56d to 56g is less than 7 mm. As a result, the small chip component and the first decorative substrate are caused by the distortion of the first decorative substrate 56 that may occur in the vicinity of the fixing through holes 56d to 56 g when the first decorative substrate 56 is screwed to the front door frame 14. It is possible to reduce the possibility that the connection point with the 56 is damaged, and it is also possible to reduce the possibility that the small chip component itself is damaged. Further, the through hole peripheral regions 211a to 211d may be defined as regions where the distance from the outer edge of the fixed through holes 56d to 56g is less than 4 mm. As a result, when the first decorative substrate 56 is screwed to the front door frame 14, the stress acting on the connection point between the small chip component and the first decorative substrate 56 and the stress acting on the small chip component itself are reduced. , The area of the area where the small chip component can be mounted on the first decorative substrate 56 can be secured widely.

On the first mounting surface 84 of the first decorative board 56, the connectors 111 and 112 are mounted on the second mounting surface 95 (FIG. 15A) in the connector back side corresponding areas 203 and 204 on which the small chip components are not mounted. The region of the first mounting surface 84 located on the back side of the region and the region of the first mounting surface 84 are not limited to the region where the distance from the outer edge is less than 5 mm. The corresponding areas 203 and 204 on the back side of the connector are from the outer edge of the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95 and the area of the first mounting surface 84. The area may be a region where the distance is less than 7 mm. As a result, it is possible to reduce the possibility that the connection portion between the small chip component and the first decorative board 56 will be damaged when the harness is attached to and detached from the connectors 111 and 112, and the small chip component itself will be damaged. The possibility can be reduced. Further, the connector back side corresponding areas 203 and 204 are the outer edges of the area of the first mounting surface 84 and the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95. It may be a region where the distance from is less than 4 mm. As a result, the small chip component can be attached to the first decorative board 56 while reducing the stress acting on the connection point between the small chip component and the first decorative board 56 and the small chip component itself when the harness is attached to and detached from the connectors 111 and 112. A wide area that can be mounted can be secured.

In the region near the outer edge of the board on which the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are not mounted on the first decorative board 56, the distance from the outer edge of the first decorative board 56 is large. It is not limited to a region smaller than 10 mm. The region near the outer edge of the substrate on which the small chip component is not mounted may be a region where the distance from the outer edge of the first decorative substrate 56 is less than 12 mm. This reduces the possibility that the connection point between the small chip component and the first decorative board 56 will be damaged due to the operator's hand touching the small chip component when handling the first decorative board 56. At the same time, the possibility that the small chip component itself is damaged can be reduced. Further, when the assembly board 231 including the plurality of first decorative boards 56 is divided and the first decorative board 56 is taken out, it acts on the connection point between the small chip component and the first decorative board 56 when the assembly board 231 is divided. The stress obtained can be reduced, and the stress acting on the small chip component itself can be reduced. Further, the region near the outer edge of the substrate on which the small chip component is not mounted may be a region where the distance from the outer edge of the first decorative substrate 56 is less than 8 mm. This reduces the possibility that the connection point between the small chip component and the first decorative board 56 will be damaged and the possibility that the small chip component itself will be damaged, and the area where the small chip component can be mounted on the first decorative board 56. A large area can be secured.

<Second embodiment>
This embodiment differs from the first embodiment in that the longitudinal direction of some of the small chip components mounted on the first decorative substrate 56 is orthogonal to the first direction DR1. .. Hereinafter, a configuration different from that of the first embodiment will be described. The description of the same configuration as that of the first embodiment is basically omitted.

25 (a) is a plan view showing the first mounting surface 84 of the first decorative board 56 in this embodiment, and FIG. 25 (b) is a peripheral region of the bypass capacitor 291 mounted on the first decorative board 56. It is a top view of the 1st mounting surface 84 of the 1st decorative substrate 56 which enlarges and shows 292. Similar to the first embodiment, as shown in FIG. 25A, the dimensions of the first decorative substrate 56 in the first direction DR1 are the dimensions of the first decorative substrate 56 in the direction orthogonal to the first direction DR1. Greater than.

As shown in FIG. 25B, the bypass capacitor 291 is the same as the bypass capacitor 85 in the first embodiment, in the longitudinal direction along the plane orthogonal to the thickness direction of the bypass capacitor 291 (hereinafter, “bypass capacitor 291”). It is a small chip component having a dimension of 0.1 mm or more and 0.9 mm or less in the "longitudinal direction". The bypass capacitor 291 has a dimension in the longitudinal direction along a plane orthogonal to the thickness direction of approximately 0.6 mm, and is also referred to as a lateral direction along a plane orthogonal to the thickness direction (hereinafter, also referred to as a “minor direction”). ) And the thickness direction are approximately 0.3 mm, which is a small chip component. Since the dimension in the longitudinal direction along the plane orthogonal to the thickness direction of the bypass capacitor 291 is 0.7 mm or less, the area occupied by the bypass capacitor 291 in the light emitting substrate 301 can be reduced. Since the dimension in the longitudinal direction along the plane orthogonal to the thickness direction of the bypass capacitor 291 is 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 291 and the light emitting board 301 and the mechanical strength of the bypass capacitor 291 itself. The strength can be increased, the possibility of damage to the connection portion can be reduced, and the possibility of damage to the bypass capacitor 291 itself can be reduced. Further, when the dimension of the bypass capacitor 291 in the longitudinal direction is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting omission of the bypass capacitor 291. The longitudinal dimension of the bypass capacitor 291 may be smaller than 0.6 mm (for example, 0.4 mm), and the lateral dimension of the bypass capacitor 291 may be smaller than 0.3 mm. (For example, a configuration having a thickness of 0.2 mm) may be used, or a configuration having a dimension in the thickness direction smaller than 0.3 mm (for example, a configuration having a thickness of 0.2 mm) may be used.

The first wiring pattern 294a drawn from the first pad 293a (or the first pad) corresponding to the first electrode 291a of the bypass capacitor 291 passes through the via hole 295 provided in the first decorative substrate 56 to form the GND plane layer 93 (or the GND plane layer 93). In addition to being electrically connected to FIG. 9), the second wiring pattern 294b drawn out from the first pad 293a is electrically connected to the GND terminal 297 (ground terminal or ground terminal) of the LED driver 296. .. Further, the third wiring pattern 294c drawn from the second pad 293b (or the second pad) corresponding to the second electrode 291b of the bypass capacitor 291 is a power supply plane layer via the via hole 298 provided in the first decorative substrate 56. The fourth wiring pattern 294d drawn from the second pad 293b is electrically connected to the power supply terminal 299 of the LED driver 296 while being electrically connected to 94 (FIG. 9). As described above, the first pad 293a is arranged between the GND terminal 297 of the LED driver 296 and the GND plane layer 93, and the second pad 293b is provided with the power supply terminal 299 of the LED driver 296 and the power supply plane layer 94. It is placed in between.

The bypass capacitor 291 is mounted on the first decorative substrate 56 so that the longitudinal direction of the bypass capacitor 291 is orthogonal to or substantially orthogonal to the first direction DR1. The first wiring pattern 294a is drawn upward from the upper end of the first pad 293a, and the second wiring pattern 294b is drawn downward from the lower end of the first pad 293a. Further, the third wiring pattern 294c is drawn upward from the upper end of the second pad 293b, and the fourth wiring pattern 294d is drawn downward from the lower end of the second pad 293b.

As described above, the wiring patterns 294a to 294d drawn from the pair of pads 293a and 293b corresponding to the pair of electrodes 291a and 291b of the bypass capacitor 291 are in a direction orthogonal to the longitudinal direction of the bypass capacitor 291 or a direction substantially orthogonal to the longitudinal direction. Extends to. Therefore, the first decorative substrate 56 is distorted as compared with the configuration in which the wiring patterns 294a to 294d drawn out from the pair of pads 293a and 293b extend in the direction parallel to the longitudinal direction of the bypass capacitor 291. In this case, the stress that can act on the connection point between the bypass capacitor 291 and the first decorative substrate 56 can be reduced, and the stress that can act on the bypass capacitor 291 itself can be reduced. For example, it is possible to reduce the stress that can act on the connection point between the bypass capacitor 291 and the first decorative substrate 56 when the collective substrate 231 is divided, and it is also possible to reduce the stress that can act on the bypass capacitor 291 itself. can.

According to the present embodiment described in detail above, the following excellent effects are obtained.

The dimension of the first decorative substrate 56 in the first direction DR1 is larger than the dimension of the first decorative substrate 56 in the direction orthogonal to the first direction DR1. In the configuration in which the longitudinal direction of the bypass capacitor 291 is orthogonal to the first direction DR1, the wiring patterns 294a to 294d drawn from the pair of pads 293a and 293b corresponding to the pair of electrodes 291a and 291b of the bypass capacitor 291 are The bypass capacitor 291 extends in a direction orthogonal to the longitudinal direction or a direction substantially orthogonal to the longitudinal direction. Therefore, the first decorative substrate 56 is distorted as compared with the configuration in which the wiring patterns 294a to 294d drawn out from the pair of pads 293a and 293b extend in the direction parallel to the longitudinal direction of the bypass capacitor 291. In this case, the stress that can act on the connection point between the bypass capacitor 291 and the first decorative substrate 56 can be reduced, and the stress that can act on the bypass capacitor 291 itself can be reduced.

<Third embodiment>
The present embodiment is different from the first embodiment in that a light emitting substrate on which an LED chip is mounted is provided on both plate surfaces. Hereinafter, a configuration different from that of the first embodiment will be described. The description of the same configuration as that of the first embodiment is basically omitted.

A movable object (not shown) is provided on the right side of the symbol display device 41 on the front side of the game board 24 (FIG. 4). The movable object is arranged in an area where the game ball does not flow down. The movable object includes a light emitting board 301 (FIG. 26) in which LED chips are mounted on both plate surfaces, and a board case (not shown) that houses the light emitting board 301.

FIG. 26 is a plan view of the first light emitting surface 302 of the light emitting substrate 301 in the present embodiment, and FIG. 27 is a plan view of the second light emitting surface 303 of the light emitting board 301. In FIG. 26, the wiring pattern formed on the first light emitting surface 302 is omitted, and in FIG. 27, the wiring pattern formed on the second light emitting surface 303 is not shown. As shown in FIG. 26, the light emitting substrate 301 is formed into a vertically long substantially elliptical shape. The light emitting substrate 301 is a four-layer substrate having a structure in which conductive layers and insulating layers are alternately laminated, similar to the first decorative substrate 56 in the first embodiment. Although not shown, the light emitting substrate 301 has a first wiring layer arranged on the first light emitting surface 302 side and a second light emitting surface 303 side, similarly to the first decorative substrate 56 in the first embodiment. It is provided with a second wiring layer arranged in. Further, the light emitting substrate 301 is a GND plane layer (ground plane layer) as a conductive layer arranged between the first wiring layer and the second wiring layer, similarly to the first decorative substrate 56 in the first embodiment. Or a ground plane layer) and a power plane layer.

As shown in FIG. 26, the LED chips 304 to 313 and the first LED driver 314 that controls the light emission of these LED chips 304 to 313 are mounted on the first light emitting surface 302 of the light emitting substrate 301. Further, as shown in FIG. 27, the LED chips 315 to 325 and the second LED driver 326 that controls the light emission of these LED chips 315 to 325 are mounted on the second light emitting surface 303 of the light emitting substrate 301. As shown in FIG. 26, the LED chips 304 to 313 are arranged in the region near the center of the first light emitting surface 302, and as shown in FIG. 27, the LED chips 315 to 325 are located near the outer edge of the second light emitting surface 303. It is located in the area.

As shown in FIG. 27, a connector 327 for receiving lighting control data from the voice emission control device 81 (FIG. 19) is mounted on the second light emitting surface 303 of the light emitting board 301. A harness (not shown) for electrically connecting the light emitting board 301 and the voice light emitting control device 81 is attached to the connector 327. The first LED driver 314 controls the light emission of the LED chips 304 to 313 mounted on the first light emitting surface 302 based on the lighting control data received from the voice emission control device 81, and the second LED driver 326 emits voice light. Based on the lighting control data received from the control device 81, the light emission control of the LED chips 315 to 325 mounted on the second light emitting surface 303 is performed.

The substrate case (not shown) is made of a transparent or translucent resin that transmits light emitted from LED chips 304 to 313, 315 to 325. The board case is pivotally supported on the front side of the game board 24 and can rotate about a shaft extending in the vertical direction. In a gaming state other than the open / close execution mode, the first light emitting surface 302 of the light emitting board 301 faces the front of the pachinko machine 10. In the gaming state, the region near the center of the first light emitting surface 302 emits light by controlling the light emission of the LED chips 304 to 313 mounted on the first light emitting surface 302. When the gaming state shifts to the open / close execution mode, the movable object (not shown) rotates 180 degrees around the axis so that the second light emitting surface 303 of the light emitting substrate 301 faces the front of the pachinko machine 10. In the open / close execution mode, the light emission control of the LED chips 315 to 325 mounted on the second light emitting surface 303 causes the region near the outer edge of the second light emitting surface 303 to emit light. When the open / close execution mode ends, the movable object rotates 180 degrees in the direction opposite to the start of the open / close execution mode about the axis so that the first light emitting surface 302 faces the front of the pachinko machine 10. In the open / close execution mode, a light emitting effect different from that in the game state other than the open / close execution mode is performed on the movable object, so that the effect of the effect in the open / close execution mode is improved.

As shown in FIG. 26, a bypass capacitor 328 and small chip resistors 331 to 335 are mounted on the first light emitting surface 302 of the light emitting substrate 301. Similar to the bypass capacitor 85 in the first embodiment, the bypass capacitor 328 is a substantially rectangular parallelepiped. The bypass capacitor 328 is the same as the bypass capacitor 85 in the first embodiment, in the longitudinal direction along the plane orthogonal to the thickness direction of the bypass capacitor 328 (hereinafter, also referred to as “longitudinal direction of the bypass capacitor 328”). It is a small chip component having a size of 0.1 mm or more and 0.9 mm or less. The bypass capacitor 328 has a dimension in the longitudinal direction along a plane orthogonal to the thickness direction of approximately 0.6 mm, and is also referred to as a lateral direction along a plane orthogonal to the thickness direction (hereinafter, also referred to as a “minor direction”). ) And the thickness direction are approximately 0.3 mm, which is a small chip component. Since the dimension of the bypass capacitor 328 in the longitudinal direction is 0.7 mm or less, the area occupied by the bypass capacitor 328 in the light emitting substrate 301 can be further reduced. When the dimension of the bypass capacitor 328 in the longitudinal direction is 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 328 and the light emitting board 301 is increased and the mechanical strength of the bypass capacitor 328 itself is increased, and the connection point is damaged. It is possible to reduce the possibility that the bypass capacitor 328 itself is damaged. Further, since the dimension of the bypass capacitor 328 in the longitudinal direction is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting omission of the bypass capacitor 328. The length of the bypass capacitor 328 in the longitudinal direction may be smaller than 0.6 mm (for example, a configuration of 0.4 mm), and the dimension of the bypass capacitor 328 in the lateral direction may be smaller than 0.3 mm. (For example, a configuration having a thickness of 0.2 mm) may be used, or a configuration having a dimension in the thickness direction smaller than 0.3 mm (for example, a configuration having a thickness of 0.2 mm) may be used.

Similar to the small chip resistor 87 in the first embodiment, the small chip resistors 331 to 335 are substantially rectangular parallelepipeds. Similar to the small chip resistor 87 in the first embodiment, the small chip resistors 331 to 335 have a longitudinal direction along a plane orthogonal to the thickness direction of the small chip resistors 331 to 335 (hereinafter, "small size"). It is also referred to as "longitudinal direction of chip resistors 331-335"), which is a small chip component having a dimension of 0.1 mm or more and 0.9 mm or less. The small chip resistors 331 to 335 have a dimension in the longitudinal direction along a plane orthogonal to the thickness direction of approximately 0.6 mm, and the small chip resistors 331 to 335 have a lateral direction (hereinafter, "minor direction"). It is also a small chip component having a dimension of (also referred to as) and a dimension in the thickness direction of approximately 0.3 mm. Since the dimensions of the small chip resistors 331 to 335 in the longitudinal direction are 0.7 mm or less, the area occupied by the small chip resistors 331 to 335 in the light emitting substrate 301 can be further reduced. Since the longitudinal dimension of the small chip resistors 331 to 335 is 0.4 mm or more, the mechanical strength at the connection point between the small chip resistors 331 to 335 and the light emitting substrate 301 and the small chip resistors 331 to 335 themselves. It is possible to increase the mechanical strength of the small chip resistor 331 to 335 and reduce the possibility of damage to the connection portion. Further, since the dimensions of the small chip resistors 331 to 335 in the longitudinal direction are 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting omission of the small chip resistors 331 to 335. .. The dimensions of the small chip resistors 331 to 335 in the longitudinal direction may be smaller than 0.6 mm (for example, a configuration of 0.4 mm), and the dimensions of the small chip resistors 331 to 335 in the lateral direction may be smaller. May be smaller than 0.3 mm (for example, 0.2 mm), and may be smaller than 0.3 mm in thickness direction (for example, 0.2 mm). ..

In the light emitting board 301, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) are integrated on the first light emitting surface 302 side and are not mounted on the second light emitting surface 303 side. Therefore, by handling the light emitting board 301 so that the stress acting on the first light emitting surface 302 side of the light emitting board 301 is smaller than the stress acting on the second light emitting surface 303 side, the small chip component and the light emitting board 301 can be combined. It is possible to reduce the possibility of damage to the connection portion of the small chip component itself and reduce the possibility of damage to the small chip component itself. For example, when the light emitting board 301 including the plurality of light emitting boards 301 is divided and the light emitting board 301 is taken out, the collective board is made smaller by dividing the collective board so that the first light emitting surface 302 side has a valley shape (concave). It is possible to prevent tensile stress from acting on the connection point between the chip component and the light emitting substrate 301. As a result, it is possible to prevent the connection portion between the small chip component and the light emitting board 301 from being damaged, and it is possible to prevent the small chip component itself from being damaged.

As shown in FIG. 27, chip resistors 336 to 346 that limit the current flowing through the LED chips 315 to 325 are mounted on the second light emitting surface 303 of the light emitting substrate 301. By providing the chip resistors 336 to 346, the LED chips 315 to 325 can be driven with an allowable current or less. The chip resistors 336 to 346 are substantially rectangular parallelepipeds, and are provided with a pair of metal first electrodes and second electrodes (not shown) at both ends in the longitudinal direction. The chip resistors 336 to 346 are surface mount type resistors having a longitudinal dimension of 1 mm and a lateral dimension and a thickness direction of 0.5 mm. The longitudinal dimension along the plane orthogonal to the thickness direction of the chip resistors 336 to 346 (1 mm, which is the longitudinal dimension of the chip resistors 336 to 346) is larger than 0.9 mm, and the chip resistors 336 to 346 Is not a small chip component. The lengthwise dimension of the chip resistors 336 to 346 may be larger than 1 mm (for example, 1.6 mm), and the lateral dimension may be larger than 0.5 mm (for example, 0.8 mm). The dimension in the thickness direction may be a dimension larger than 0.5 mm (for example, 0.8 mm).

The drive power supply for the second LED driver 326 is supplied from the voice emission control device 81 to the power supply terminal 348 of the second LED driver 326 via the connector 327. A bypass capacitor 352 for absorbing a noise component contained in the drive power supply of the second LED driver 326 is mounted on the second light emitting surface 303 of the light emitting board 301. The bypass capacitor 352 is a substantially rectangular parallelepiped and includes a pair of metal first electrodes 352a and second electrodes 352b at both ends in the longitudinal direction. The bypass capacitor 352 is a surface mount type capacitor having a longitudinal dimension of 1 mm and a lateral dimension and a thickness direction of 0.5 mm. The longitudinal dimension along the plane orthogonal to the thickness direction of the bypass capacitor 352 (1 mm, which is the longitudinal dimension of the bypass capacitor 352) is larger than 0.9 mm, and the bypass capacitor 352 is not a small chip component. The length of the bypass capacitor 352 may be larger than 1 mm (for example, 1.6 mm), and the length of the bypass capacitor 352 may be larger than 0.5 mm (for example, 0.8 mm). The dimension in the thickness direction may be a dimension larger than 0.5 mm (for example, 0.8 mm).

The first electrode 352a of the bypass capacitor 352 is electrically connected to the GND terminal 349 and the GND plane layer (not shown) of the second LED driver 326, and the second electrode 352b is the power supply terminal 348 and the power supply of the second LED driver 326. It is electrically connected to a plain layer (not shown). By arranging the bypass capacitor 352 between the power supply terminal 348 and the power supply plane layer, the second LED driver 326 of the noise component included in the drive power supply supplied from the voice emission control device 81 to the second LED driver 326 is provided. The impact on is reduced.

The chip resistor 340 in the second light emitting surface 303 of the light emitting substrate 301 is arranged in the region including the driver back side corresponding region 353 in the first light emitting surface 302. The driver back side corresponding area 353 is provided with an area on the first light emitting surface 302 (FIG. 26) on which the first LED driver 314 (FIG. 26) is mounted and a pad (or pad) corresponding to the terminal of the first LED driver 314. The region of the second light emitting surface 303 located on the back side of the region and the region where the distance from the region of the second light emitting surface 303 is within 1 mm. As described above, the chip resistor 340 is not a small chip component. The connection point between the chip resistor 340 and the light emitting board 301 has higher mechanical strength than the connection point between the small chip component and the light emitting board 301. Further, the chip resistor 340 itself has higher mechanical strength than the small chip component itself. By arranging the chip resistor 340 in the area including the driver back side corresponding area 353 on the second light emitting surface 303, the LED chip 319 can be arranged in the vicinity of the driver back side corresponding area 353. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331-335) on the first light emitting surface 302 of the light emitting board 301 are arranged so as to avoid the corresponding region 354 on the back side of the driver. The driver back side corresponding area 354 is provided with an area on the second light emitting surface 303 (FIG. 27) on which the second LED driver 326 (FIG. 27) is mounted and a pad (or pad) corresponding to the terminal of the second LED driver 326. It is a region where the distance from the region of the first light emitting surface 302 located on the back side of the region and the region of the first light emitting surface 302 is within 1 mm. Small chip components are located in the area of the first light emitting surface 302 located on the back side of the area where the second LED driver 326 is mounted and the area where the pad corresponding to the terminal of the second LED driver 326 is provided on the second light emitting surface 303. Since the configuration is not mounted, the influence of the thermal stress that can act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the small chip component is reduced. Since the small chip component is arranged so as to avoid the corresponding area 354 on the back side of the driver, the connection point between the small chip component and the light emitting board 301 is damaged due to the influence of the thermal stress due to the heat generated by the second LED driver 326. In addition to being able to prevent it, it is possible to prevent the small chip component itself from being damaged.

As shown in FIG. 27, the chip resistor 343 on the second light emitting surface 303 of the light emitting substrate 301 is arranged in the region including the LED back side corresponding region 355 on the first light emitting surface 302. The LED back side corresponding region 355 is a region of the second light emitting surface 303 located on the back side of the region where the LED chips 310 and 311 (FIG. 26) are mounted on the first light emitting surface 302 (FIG. 26) and the second light emitting surface. The region of 303 is a region within 1 mm from the outer edge. By arranging the chip resistor 343 in the area including the LED back side corresponding area 355 on the second light emitting surface 303, the LED chip 322 can be arranged in the vicinity of the LED back side corresponding area 355. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331-335) on the first light emitting surface 302 of the light emitting board 301 are arranged so as to avoid the corresponding areas 361 to 371 on the back side of the LED. There is. The LED back side corresponding regions 361-371 are the region of the first light emitting surface 302 located on the back side of the region where the LED chips 315 to 325 (FIG. 27) are mounted on the second light emitting surface 303 (FIG. 27) and the first light emitting surface. The region of the light emitting surface 302 from the outer edge is a region within 1 mm. The LED chip 315-325 has a configuration in which the small chip component is not mounted in the region of the first light emitting surface 302 located on the back side of the region in which the LED chip 315-325 is mounted in the second light emitting surface 303. The influence of the thermal stress that may act on the light emitting substrate 301 due to the heat generation on the small chip component is reduced. Since the small chip parts are arranged so as to avoid the corresponding areas 361 to 371 on the back side of the LED, the connection point between the small chip parts and the light emitting board 301 is damaged due to the influence of the thermal stress due to the heat generation of the LED chips 315 to 325. It is possible to prevent the small chip parts themselves from being damaged.

As shown in FIG. 26, the LED chip 310 is mounted near the center of the first light emitting surface 302 of the light emitting substrate 301. The dimension in the longitudinal direction along the plane orthogonal to the thickness direction of the LED chip 310 is larger than 0.9 mm, and the LED chip 310 is not a small chip component. As shown in FIG. 26, the LED chip 310 is mounted on the first light emitting surface 302 in a region including the LED backside corresponding region 368. The LED chip 310 covers an area of the first light emitting surface 302 located on the back side of the area on which the LED chip 322 (FIG. 27) is mounted on the second light emitting surface 303 (FIG. 27) in the LED back side corresponding area 368. It is implemented in the area that contains it. A part of an electronic component (LED chip 310) that is not a small chip component is mounted on the first light emitting surface 302 of the light emitting substrate 301, and an LED chip 322 (FIG. 27) is mounted on the second light emitting surface 303 (FIG. 27). By mounting on the region including the region of the first light emitting surface 302 located on the back side of the region, a wide area of the region on which electronic components other than the small chip components can be mounted is secured on the first light emitting surface 302. ..

A part of the electronic component (LED chip 310) that is not a small chip component is located on the second light emitting surface 303 (FIG. 27) on the back side of the area where the LED chip 322 (FIG. 27) is mounted. In the light emitting substrate 301 mounted in the region including the region of the above, the small chip components are arranged so as to avoid the corresponding regions 361 to 371 on the back side of the LED. This reduces the possibility that the connection point between the small chip component and the light emitting substrate 301 and the small chip component itself will be damaged under the influence of thermal stress.

As shown in FIG. 27, the chip resistor 341 on the second light emitting surface 303 of the light emitting substrate 301 is arranged in the region including the connector peripheral region 372. The connector peripheral area 372 is an area less than 5 mm from the outer edge of the connector 327. In the second light emitting surface 303, the LED chips 315 to 325 are arranged on the light emitting substrate 301 as compared with the case where the chip resistor 341 is arranged in the area including the connector peripheral area 372 so as to avoid the connector peripheral area 372. Can be widely dispersed, and the light emitting area of the second light emitting surface 303 can be widened. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331-335) on the first light emitting surface 302 of the light emitting board 301 are arranged so as to avoid the corresponding region 373 on the back side of the connector. The connector back side corresponding region 373 is from the outer edge of the region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted in the second light emitting surface 303 (FIG. 27) and the region of the first light emitting surface 302. This is an area where the distance is less than 5 mm. Since the small chip component is not mounted in the region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted in the second light emitting surface 303, light is emitted when the harness is attached to or detached from the connector 327. The influence of the stress that can act on the substrate 301 on the small chip component is reduced. Since the small chip component is arranged so as to avoid the corresponding area 373 on the back side of the connector, the stress that may act on the connection point between the small chip component and the light emitting board 301 when attaching / detaching the harness (not shown) to / from the connector 327 is reduced. At the same time, the stress acting on the small chip component itself can be reduced. Therefore, it is possible to prevent the connection portion between the small chip component and the light emitting board 301 from being damaged when the harness is attached to and detached from the connector 327, and it is possible to prevent the small chip component itself from being damaged.

As shown in FIG. 27, the chip resistor 336 in the second light emitting surface 303 of the light emitting substrate 301 is arranged in the region including the substrate outer edge region 374 on the second light emitting surface 303 side. The substrate outer edge region 374 on the second light emitting surface 303 side is a region of the second light emitting surface 303 that is less than 10 mm from the outer edge of the light emitting substrate 301. In the second light emitting surface 303, by arranging the chip resistor 336 in the region including the substrate outer edge region 374, the LED chips 315 to 325 are arranged on the light emitting substrate 301 as compared with the case where the chip resistor 336 is arranged avoiding the substrate outer edge region 374. Can be widely dispersed. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331-335) on the first light emitting surface 302 of the light emitting board 301 avoid the substrate outer edge region 375 on the first light emitting surface 302 side. Are arranged. The substrate outer edge region 375 on the first light emitting surface 302 side is a region of the first light emitting surface 302 less than 10 mm from the outer edge of the light emitting substrate 301. By arranging the small chip components on the first light emitting surface 302 while avoiding the outer edge region 375 of the substrate, the small chip components may be caused by the operator's hand touching the small chip components when handling the light emitting substrate 301. It is possible to prevent the connection point between the light emitting board 301 and the light emitting board 301 from being damaged, and it is possible to prevent the small chip component itself from being damaged. Further, when the light emitting board 301 including the plurality of light emitting boards 301 is divided and the light emitting board 301 is taken out, it is possible to reduce the stress that may act on the connection point between the small chip component and the light emitting board 301 when the collective board is divided. At the same time, the stress acting on the small chip component itself can be reduced. Therefore, it is possible to prevent the connection portion between the small chip component and the light emitting board 301 from being damaged when the assembly board is divided, and it is possible to prevent the small chip component itself from being damaged.

As shown in FIGS. 26 and 27, the light emitting substrate 301 is penetrated through the light emitting substrate 301 in the thickness direction so that the light emitting substrate 301 can be screwed to the substrate case body (not shown). , 301b are formed. As shown in FIG. 27, the chip resistor 346 in the second light emitting surface 303 of the light emitting substrate 301 is arranged in the region including the fixed through hole peripheral region 376. The fixed through hole peripheral region 376 is a region less than 5 mm from the outer edge of the fixed through hole 301b. In the second light emitting surface 303, the LED is placed on the light emitting substrate 301 as compared with the case where the chip resistor 346 is arranged in the region including the fixed through hole peripheral region 376 so as to avoid the fixed through hole peripheral region 376. Chips 315-325 can be widely dispersed. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331-335) on the first light emitting surface 302 of the light emitting substrate 301 are arranged so as to avoid the fixed through hole peripheral regions 377 and 378. ing. The fixed through hole peripheral regions 377 and 378 are regions of the first light emitting surface 302 that are less than 5 mm from the outer edges of the fixed through holes 301a and 301b. By arranging the small chip components on the first light emitting surface 302 while avoiding the areas around the fixed through holes 377 and 378, the small chip components and the light emitting substrate are used when the light emitting substrate 301 is fixed to the substrate case body (not shown). The stress that can act on the connection point with the 301 can be reduced, and the stress that acts on the small chip component itself can be reduced. Therefore, when the light emitting board 301 is fixed to the substrate case body, it is possible to prevent the connection portion between the small chip component and the light emitting board 301 from being damaged, and it is possible to prevent the small chip component itself from being damaged.

As shown in FIG. 27, the dimensions of the LED chips 317 and 324 in the longitudinal direction along the plane orthogonal to the thickness direction are larger than 0.9 mm, and the LED chips 317 and 324 are not small chip components. Further, the dimension in the longitudinal direction along the plane orthogonal to the thickness direction of the chip resistors 338 and 345 is larger than 0.9 mm, and the chip resistors 338 and 345 are not small chip components. In the light emitting board 301, the LED chips 317 and 324 are parallel to the short axis direction SDA whose longitudinal direction along the plane orthogonal to the thickness direction of the LED chips 317 and 324 is orthogonal to the long axis direction LDA of the light emitting board 301. It is mounted on the light emitting board 301 in this manner. Further, the chip resistors 338, 345 have a longitudinal direction along a plane orthogonal to the thickness direction of the chip resistors 338, 345 parallel to the short axis direction SDA orthogonal to the long axis LDA of the light emitting substrate 301. It is mounted on the light emitting board 301 in an embodiment. On the other hand, as shown in FIG. 26, in the light emitting substrate 301, the small chip components (bypass capacitor 328 and small chip resistors 331-335) have a longitudinal direction along a plane orthogonal to the thickness direction of the small chip component. It is mounted on the light emitting board 301 in a manner parallel to the LDA in the long axis direction of the light emitting board 301. As a result, when the light emitting board 301 is distorted as compared with the case where the small chip component is mounted on the light emitting board 301 in such a manner that the longitudinal direction of the small chip component is parallel to the short axis direction SDA orthogonal to the long axis direction LDA. In addition, the maximum value of stress that can act on the connection point between the small chip component and the light emitting substrate 301 is reduced, and the maximum value of stress that can act on the small chip component itself is reduced.

The mechanical strength of the connection point between the small chip component and the light emitting board 301 is lower than the mechanical strength of the connection point between the electronic component and the light emitting board 301, which is larger than the small chip component. Further, the mechanical strength of the small chip component itself is lower than the mechanical strength of the electronic component itself, which is larger than that of the small chip component. In a configuration in which some of the electronic components larger than the small chip component are mounted on the light emitting board 301 in such a manner that the longitudinal direction of the electronic component is not parallel to the long axis LDA of the light emitting board 301, the small chip component is the small size. The chip component is mounted on the light emitting board 301 in such a manner that the longitudinal direction of the chip component is parallel to the long axis direction LDA of the light emitting board 301. As a result, the connection point between the small chip component and the light emitting board 301 and the small chip component itself are protected.

According to the present embodiment described in detail above, the following excellent effects are obtained.

In the configuration in which the chip resistor 340 is arranged in the region including the driver back side corresponding region 353 on the second light emitting surface 303 of the light emitting board 301, the small chip components (bypass capacitor 328 and the small chip resistor 331) on the first light emitting surface 302 are arranged. ~ 335) is arranged so as to avoid the corresponding area 354 on the back side of the driver. The driver back side corresponding area 354 is the first light emitting surface 302 located on the back side of the area where the second LED driver 326 is mounted and the area where the pad corresponding to the terminal of the second LED driver 326 is provided on the second light emitting surface 303. Is a region where the distance from the region of No. 1 and the region of the first light emitting surface 302 is within 1 mm. Small chip components are located in the area of the first light emitting surface 302 located on the back side of the area where the second LED driver 326 is mounted and the area where the pad corresponding to the terminal of the second LED driver 326 is provided on the second light emitting surface 303. Since the configuration is not mounted, the influence of the thermal stress that can act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the small chip component is reduced. Since the small chip component is arranged so as to avoid the corresponding area 354 on the back side of the driver, the connection point between the small chip component and the light emitting board 301 is damaged due to the influence of the thermal stress due to the heat generated by the second LED driver 326. In addition to being able to prevent it, it is possible to prevent the small chip component itself from being damaged.

In the configuration in which the chip resistor 343 on the second light emitting surface 303 of the light emitting board 301 is arranged in the area including the LED back side corresponding area 355, the small chip component on the first light emitting surface 302 of the light emitting board 301 is the LED back side corresponding area. It is arranged avoiding 361-371. The LED backside corresponding regions 361-371 are from the outer edge of the region of the first light emitting surface 302 located on the back side of the region where the LED chips 315 to 325 are mounted on the second light emitting surface 303 and the region of the first light emitting surface 302. Is a region where the distance is within 1 mm. The LED chip 315-325 has a configuration in which the small chip component is not mounted in the region of the first light emitting surface 302 located on the back side of the region in which the LED chip 315-325 is mounted in the second light emitting surface 303. The influence of the thermal stress that may act on the light emitting substrate 301 due to the heat generation on the small chip component is reduced. Since the small chip parts are arranged so as to avoid the corresponding areas 361 to 371 on the back side of the LED, the connection point between the small chip parts and the light emitting board 301 is damaged due to the influence of the thermal stress due to the heat generation of the LED chips 315 to 325. It is possible to prevent the small chip parts themselves from being damaged.

A part of the electronic component (LED chip 310) that is not a small chip component is located on the second light emitting surface 303 (FIG. 27) on the back side of the area where the LED chip 322 (FIG. 27) is mounted. In the light emitting substrate 301 mounted in the region including the region of the above, the small chip components are arranged so as to avoid the corresponding regions 361 to 371 on the back side of the LED. This reduces the possibility that the connection point between the small chip component and the light emitting substrate 301 and the small chip component itself will be damaged under the influence of thermal stress.

In the configuration in which the chip resistor 341 on the second light emitting surface 303 of the light emitting board 301 is arranged in the region including the connector peripheral region 372, the small chip component on the first light emitting surface 302 of the light emitting board 301 is the corresponding area 373 on the back side of the connector. It is arranged avoiding. The connector back side corresponding region 373 is a region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted on the second light emitting surface 303, and the distance from the outer edge of the region of the first light emitting surface 302 is less than 5 mm. Area of. Since the small chip component is not mounted in the region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted in the second light emitting surface 303, light is emitted when the harness is attached to or detached from the connector 327. The influence of the stress that can act on the substrate 301 on the small chip component is reduced. Since the small chip component is arranged so as to avoid the corresponding area 373 on the back side of the connector, the stress that may act on the connection point between the small chip component and the light emitting board 301 when attaching / detaching the harness (not shown) to / from the connector 327 is reduced. At the same time, the stress acting on the small chip component itself can be reduced. Therefore, it is possible to prevent the connection portion between the small chip component and the light emitting board 301 from being damaged when the harness is attached to and detached from the connector 327, and it is possible to prevent the small chip component itself from being damaged.

In the configuration in which the chip resistor 336 on the second light emitting surface 303 of the light emitting board 301 is arranged in the region including the substrate outer edge region 374, the small chip component on the first light emitting surface 302 of the light emitting board 301 is the first light emitting surface 302. It is arranged so as to avoid the substrate outer edge region 375 on the side. As a result, it is possible to prevent the connection point between the small chip component and the light emitting board 301 from being damaged due to the operator's hand touching the small chip component when handling the light emitting board 301, and the small chip component itself. Can be prevented from being damaged. Further, when the light emitting board 301 including the plurality of light emitting boards 301 is divided and the light emitting board 301 is taken out, it is possible to reduce the stress that may act on the connection point between the small chip component and the light emitting board 301 when the collective board is divided. At the same time, the stress acting on the small chip component itself can be reduced. Therefore, it is possible to prevent the connection portion between the small chip component and the light emitting board 301 from being damaged when the assembly board is divided, and it is possible to prevent the small chip component itself from being damaged.

In the configuration in which the chip resistor 346 on the second light emitting surface 303 of the light emitting board 301 is arranged in the region including the fixed through hole peripheral region 376, the small chip component on the first light emitting surface 302 of the light emitting board 301 has a fixed through hole. It is arranged so as to avoid the peripheral areas 377 and 378. As a result, when the light emitting board 301 is fixed to the substrate case body, the stress that can act on the connection point between the small chip component and the light emitting board 301 can be reduced, and the stress that acts on the small chip component itself is reduced. can do. Therefore, when the light emitting board 301 is fixed to the substrate case body, it is possible to prevent the connection portion between the small chip component and the light emitting board 301 from being damaged, and it is possible to prevent the small chip component itself from being damaged.

Some of the electronic components larger than the small chip components are mounted on the light emitting board 301 in such a manner that the longitudinal direction of the electronic components is not parallel to the long axis LDA of the light emitting board 301, and the small chip components (bypass capacitors). The 328 and the small chip resistors 331 to 335) are mounted on the light emitting board 301 in such a manner that the longitudinal direction along the plane orthogonal to the thickness direction of the small chip component is parallel to the long axis LDA of the light emitting board 301. ing. As a result, when the light emitting board 301 is distorted as compared with the case where the small chip component is mounted on the light emitting board 301 in such a manner that the longitudinal direction of the small chip component is parallel to the short axis direction SDA orthogonal to the long axis direction LDA. In addition, the maximum value of stress that can act on the connection point between the small chip component and the light emitting substrate 301 is reduced, and the maximum value of stress that can act on the small chip component itself is reduced.

In the first light emitting surface 302 of the light emitting board 301, the driver backside corresponding area 354 in which the small chip components (bypass capacitor 328 and the small chip resistors 331 to 335) are not mounted is the second light emitting surface 303 (FIG. 27). The area of the first light emitting surface 302 located behind the area where the 2LED driver 326 (FIG. 27) is mounted and the area where the pad corresponding to the terminal of the second LED driver 326 is provided, and the area of the first light emitting surface 302. The distance from the region is not limited to the region within 1 mm. The driver back side corresponding area 354 is the first light emitting surface 302 located on the back side of the area where the second LED driver 326 is mounted and the area where the pad corresponding to the terminal of the second LED driver 326 is provided on the second light emitting surface 303. The region may be a region in which the distance from the region of No. 1 and the region of the first light emitting surface 302 is within 2 mm. As a result, the influence of the thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the small chip component can be further reduced. Therefore, it is possible to reduce the possibility that the connection point between the small chip component and the light emitting board 301 is damaged due to the influence of the thermal stress due to the heat generated by the second LED driver 326, and the possibility that the small chip component itself is damaged. Can be reduced. Further, the driver back side corresponding area 354 is located on the back side of the area where the second LED driver 326 is mounted on the second light emitting surface 303 and the area where the pad corresponding to the terminal of the second LED driver 326 is provided. The distance from the region of the surface 302 and the region of the first light emitting surface 302 may be a region of 0.5 mm or less. As a result, the area where the small chip component can be mounted on the first light emitting surface 302 of the light emitting board 301 while reducing the influence of the thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the small chip component. A large area can be secured.

The LED backside corresponding area 361-371 on which the small chip components (bypass capacitor 328 and the small chip resistor 331-335) are not mounted on the first light emitting surface 302 of the light emitting board 301 is the LED on the second light emitting surface 303 (FIG. 27). The area of the first light emitting surface 302 located behind the area where the chips 315 to 325 (FIG. 27) are mounted and the area where the distance from the outer edge of the area of the first light emitting surface 302 is within 1 mm is limited. There is no. The LED backside corresponding regions 361-371 are formed from the outer edge of the region of the first light emitting surface 302 located on the back side of the region where the LED chips 315 to 325 are mounted on the second light emitting surface 303 and the region of the first light emitting surface 302. The distance may be a region of 2 mm or less. This makes it possible to further reduce the influence of the thermal stress that may act on the light emitting substrate 301 due to the heat generated by the LED chips 315 to 325 on the small chip components. Therefore, it is possible to reduce the possibility that the connection portion between the small chip component and the light emitting substrate 301 is damaged due to the influence of the thermal stress due to the heat generation of the LED chips 315 to 325, and the small chip component itself may be damaged. The sex can be reduced. Further, the LED back side corresponding regions 361 to 371 are the regions of the first light emitting surface 302 and the regions of the first light emitting surface 302 located on the back side of the region where the LED chips 315 to 325 are mounted on the second light emitting surface 303. The area may be within 0.5 mm from the outer edge. As a result, the small chip component can be mounted on the first light emitting surface 302 of the light emitting substrate 301 while reducing the influence of the thermal stress that may act on the light emitting substrate 301 due to the heat generated by the LED chips 315 to 325 on the small chip component. A large area can be secured.

In the connector backside corresponding area 373 in which small chip components (bypass capacitor 328 and small chip resistors 331-335) are not mounted on the first light emitting surface 302 of the light emitting board 301, the connector 327 is mounted on the second light emitting surface 303 (FIG. 27). The region of the first light emitting surface 302 located on the back side of the region and the region where the distance from the outer edge of the region of the first light emitting surface 302 is less than 5 mm is not limited. The distance from the outer edge of the region corresponding to the back side of the connector 373 of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted on the second light emitting surface 303 and the region of the first light emitting surface 302 is less than 7 mm. It may be the area of. As a result, it is possible to reduce the stress that can act on the connection point between the small chip component and the light emitting substrate 301 when the harness is attached to and detached from the connector 327, and it is possible to reduce the stress that acts on the small chip component itself. Therefore, it is possible to reduce the possibility that the connection portion between the small chip component and the light emitting board 301 is damaged when the harness is attached to and detached from the connector 327, and it is possible to reduce the possibility that the small chip component itself is damaged. Further, the distance from the outer edge of the region corresponding to the back side of the connector 373 is the region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted on the second light emitting surface 303 and the region of the first light emitting surface 302. The area may be less than 4 mm. As a result, the small chip component can be attached to the first light emitting surface 302 of the light emitting board 301 while reducing the stress acting on the connection point between the small chip component and the light emitting board 301 and the small chip component itself when the harness is attached to and detached from the connector 327. A wide area that can be mounted can be secured.

The fixed through-hole peripheral regions 377 and 378 on which the small chip components (bypass capacitor 328 and small chip resistors 331-335) are not mounted on the first light emitting surface 302 of the light emitting board 301 are fixed through holes 301a on the first light emitting surface 302. , 301b is not limited to a region less than 5 mm from the outer edge. The area around the fixed through hole 377,378 may be a region less than 7 mm from the outer edge of the fixed through hole 301a, 301b on the first light emitting surface 302. As a result, when the light emitting board 301 is fixed to the substrate case body (not shown), the stress that can be applied to the connection point between the small chip component and the light emitting board 301 can be reduced, and the stress can be applied to the small chip component itself. The stress to be applied can be reduced. Therefore, when the light emitting board 301 is fixed to the board case body, the possibility that the connection point between the small chip component and the light emitting board 301 is damaged can be reduced, and the possibility that the small chip component itself is damaged is reduced. can do. Further, the area around the fixed through hole 377,378 may be a region less than 4 mm from the outer edge of the fixed through hole 301a, 301b on the first light emitting surface 302. As a result, when the light emitting board 301 is fixed to the substrate case (not shown), the stress acting on the connection point between the small chip component and the light emitting board 301 and the small chip component itself is reduced, and the light emitting board 301 is the first. It is possible to secure a large area of a region on the light emitting surface 302 on which a small chip component can be mounted.

The substrate outer edge region 375 on the first light emitting surface 302 side on which the small chip components (bypass capacitor 328 and small chip resistors 331-335) are not mounted on the first light emitting surface 302 of the light emitting board 301 emits light on the first light emitting surface 302. It is not limited to a region less than 10 mm from the outer edge of the substrate 301. The substrate outer edge region 375 on the first light emitting surface 302 side may be a region less than 12 mm from the outer edge of the light emitting substrate 301 on the first light emitting surface 302. As a result, it is possible to reduce the possibility that the connection point between the small chip component and the light emitting board 301 will be damaged due to the operator's hand touching the small chip component when handling the light emitting board 301. , The possibility that the small chip component itself is damaged can be reduced. Further, when the light emitting board 301 including the plurality of light emitting boards 301 is divided and the light emitting board 301 is taken out, it is possible to reduce the stress that may act on the connection point between the small chip component and the light emitting board 301 when the collective board is divided. At the same time, the stress acting on the small chip component itself can be reduced. Further, the substrate outer edge region 375 on the first light emitting surface 302 side may be a region less than 8 mm from the outer edge of the light emitting substrate 301 on the first light emitting surface 302. As a result, the small chip component can be mounted on the first light emitting surface 302 of the light emitting board 301 while reducing the possibility that the connection point between the small chip component and the light emitting board 301 is damaged and the possibility that the small chip component itself is damaged. A wide area can be secured.

<Fourth Embodiment>
In the present embodiment, a bypass capacitor for absorbing noise components contained in the drive power supply of the second LED driver 326 mounted on the second light emitting surface 303 side of the light emitting board 301 is mounted on the first light emitting surface 302 side. It is different from the above-mentioned third embodiment in that it is done. Hereinafter, a configuration different from the third embodiment will be described. The description of the same configuration as that of the third embodiment is basically omitted.

FIG. 28A is a plan view of the first light emitting surface 302 of the light emitting substrate 301 in this embodiment. As shown in FIG. 28 (a), on the first light emitting surface 302 side of the light emitting substrate 301, the second LED driver 326 mounted on the second light emitting surface 303 side (FIG. 29 (a)) (FIG. 29 (a)). )) A bypass capacitor 381 for absorbing the noise component contained in the drive power supply is mounted. FIG. 28B is a plan view of the first light emitting surface 302 of the light emitting substrate 301 in which the peripheral region 388 of the bypass capacitor 381 is enlarged and shown.

Similar to the bypass capacitor 85 in the first embodiment, the bypass capacitor 381 is a substantially rectangular parallelepiped as shown in FIG. 28 (b), and has a pair of metal first electrodes 381a and a pair of metal first electrodes 381a at both ends in the longitudinal direction. A second electrode 381b is provided. Similar to the bypass capacitor 85 in the first embodiment, the bypass capacitor 381 has a longitudinal direction along a plane orthogonal to the thickness direction of the bypass capacitor 381 (hereinafter, also referred to as “longitudinal direction of the bypass capacitor 381”). It is a small chip component having a size of 0.1 mm or more and 0.9 mm or less. The bypass capacitor 381 has a dimension in the longitudinal direction along a plane orthogonal to the thickness direction of approximately 0.6 mm, and is also referred to as a lateral direction along a plane orthogonal to the thickness direction (hereinafter, also referred to as a “minor direction”). ) And the thickness direction are approximately 0.3 mm, which is a small chip component. Since the dimension of the bypass capacitor 381 in the longitudinal direction is 0.7 mm or less, the area occupied by the bypass capacitor 381 in the light emitting substrate 301 can be further reduced. When the dimension of the bypass capacitor 381 in the longitudinal direction is 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 381 and the light emitting board 301 is increased and the mechanical strength of the bypass capacitor 381 itself is increased, and the connection point is damaged. It is possible to reduce the possibility that the bypass capacitor 381 itself is damaged. Further, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting omission of the bypass capacitor 381. The longitudinal dimension of the bypass capacitor 381 may be smaller than 0.6 mm (for example, 0.4 mm), and the lateral dimension of the bypass capacitor 381 may be smaller than 0.3 mm. (For example, a configuration having a thickness of 0.2 mm) may be used, or a configuration having a dimension in the thickness direction smaller than 0.3 mm (for example, a configuration having a thickness of 0.2 mm) may be used.

On the first light emitting surface 302 of the light emitting substrate 301, a first pad 382a (or a first pad) made of metal (specifically, copper) corresponding to the first electrode 381a in the bypass capacitor 381 and a second electrode 381b are used. A corresponding metal (specifically, copper) second pad 382b (or second pad) is provided. The first pad 382a and the second pad 382b are a pair. The first electrode 381a is electrically connected to the first pad 382a, and the second electrode 381b is electrically connected to the second pad 382b.

FIG. 29A is a plan view of the second light emitting surface 303 of the light emitting substrate 301. As already described in the third embodiment, the second LED driver 326 includes a power supply terminal 348 and a GND terminal 349. FIG. 29B is a plan view of the second light emitting surface 303 of the light emitting substrate 301 in which the peripheral region 389 of the power supply terminal 348 and the GND terminal 349 is enlarged and shown. As shown in FIGS. 28B and 29B, the light emitting substrate 301 includes a first pad 382a (FIG. 28B) corresponding to the first electrode 381a of the bypass capacitor 381 and a second LED driver 326. A first through hole 383 that electrically connects to the GND terminal 349 (FIG. 29 (b)) is provided, and a second pad 382 b (FIG. 28 (b)) corresponding to the second electrode 381 b of the bypass capacitor 381 is provided. ) And the power supply terminal 348 of the second LED driver 326 (FIG. 29 (b)) are provided with a second through hole 384 for electrically connecting. These through holes 383 and 384 are formed by penetrating the light emitting substrate 301 in the thickness direction, and the inner circumferences of these through holes 383 and 384 are plated with a metal such as copper.

As shown in FIG. 28B, the first pad 382a and the GND via hole 385 (ground via hole or ground via hole) provided in the light emitting substrate 301 are electrically connected to the first light emitting surface 302 of the light emitting board 301. The first wiring pattern 386a is provided, and the second wiring pattern 386b for electrically connecting the first pad 382a and the first through hole 383 is provided. The first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 is electrically connected to the GND plane layer (not shown) via the first wiring pattern 386a and the GND via hole 385, and the second wiring pattern. It is electrically connected to the GND terminal 349 (FIG. 29 (b)) of the second LED driver 326 via the 386b and the first through hole 383.

The first light emitting surface 302 of the light emitting board 301 is provided with a third wiring pattern 386c for electrically connecting the second pad 382b and the power supply via hole 387 provided in the light emitting board 301, and the second pad 382b. A fourth wiring pattern 386d for electrically connecting the second through hole 384 and the second through hole 384 is provided. The second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 is electrically connected to the power supply plane layer (not shown) via the third wiring pattern 386c and the power supply via hole 387, and is also connected to the fourth wiring pattern. It is electrically connected to the power supply terminal 348 (FIG. 29 (b)) of the second LED driver 326 via the 386d and the second through hole 384.

Since the bypass capacitor 381 is arranged between the power supply terminal 348 of the second LED driver 326 and the power supply plane layer (not shown), it is included in the drive power supply supplied from the voice emission control device 81 to the second LED driver 326. It is possible to reduce the influence of the noise component on the second LED driver 326. The bypass capacitor 381 (FIG. 28 (b)) is a power source so that no other IC or other electronic component exists between the bypass capacitor 381 and the power supply terminal 348 (FIG. 29 (b)) of the second LED driver 326. It is arranged close to the terminal 348. As a result, it is possible to increase the possibility that the noise component contained in the drive power supply supplied to the power supply terminal 348 of the second LED driver 326 is absorbed by the bypass capacitor 381, and the second LED driver 326 has the noise component of the noise component. It is possible to reduce the possibility of malfunction due to the influence. Further, by absorbing the noise component generated from the second LED driver 326 into the bypass capacitor 381, it is possible to prevent the noise component from malfunctioning an electronic component such as another IC.

In the light emitting board 301, the small chip components including the bypass capacitor 381 are integrated on the first light emitting surface 302 side (FIG. 28 (a)) and mounted on the second light emitting surface 303 side (FIG. 29 (a)). It has not been. Therefore, by handling the light emitting board 301 so that the stress acting on the first light emitting surface 302 side of the light emitting board 301 is smaller than the stress acting on the second light emitting surface 303 side, the small chip component and the light emitting board 301 can be combined. It is possible to reduce the possibility of damage to the connection portion of the small chip component itself and reduce the possibility of damage to the small chip component itself. For example, when the light emitting board 301 including the plurality of light emitting boards 301 is divided and the light emitting board 301 is taken out, the collective board is made smaller by dividing the collective board so that the first light emitting surface 302 side has a valley shape (concave). It is possible to prevent tensile stress from acting on the connection point between the chip component and the light emitting substrate 301. As a result, it is possible to prevent the connection portion between the small chip component and the light emitting board 301 from being damaged, and it is possible to prevent the small chip component itself from being damaged.

As shown in FIGS. 29 (a) and 29 (b), in the second light emitting surface 303 of the light emitting substrate 301, the first through hole 383 and the second through hole 384 are approximately 0.8 mm away from the outer edge of the second LED driver 326. It is provided at the above position. Further, as shown in FIGS. 28 (a) and 28 (b), the bypass capacitor 381 has a first through hole 383 and a second through in the direction away from the second LED driver 326 (FIGS. 28 (a) and 28 (b)). It is mounted at a position approximately 0.8 mm away from the hole 384.

As shown in FIG. 28A, the bypass capacitor 381 is arranged so as to avoid the corresponding region 391 on the back side of the driver. The driver back side corresponding area 391 is provided with an area on the second light emitting surface 303 (FIG. 29) on which the second LED driver 326 (FIG. 29) is mounted and a pad (or pad) corresponding to the terminal of the second LED driver 326. It is a region where the distance from the region of the first light emitting surface 302 located on the back side of the region and the region of the first light emitting surface 302 is within 1 mm. The bypass capacitor 381 is located in the area of the first light emitting surface 302 located on the back side of the area where the second LED driver 326 is mounted and the area where the pad corresponding to the terminal of the second LED driver 326 is provided on the second light emitting surface 303. Since the configuration is not mounted, the influence of the thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the bypass capacitor 381 is reduced. Since the bypass capacitor 381 is arranged so as to avoid the corresponding area 391 on the back side of the driver, the connection point between the bypass capacitor 381 and the light emitting board 301 is damaged under the influence of the thermal stress due to the heat generation of the second LED driver 326. In addition to being able to prevent it, it is possible to prevent the bypass capacitor 381 itself from being damaged.

As shown in FIG. 28B, in the first light emitting surface 302 of the light emitting substrate 301, the first wiring for electrically connecting the first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 and the GND via hole 385. The pattern 386a is a linear wiring pattern drawn from the left end of the first pad 382a to the left. Further, the third wiring pattern 386c for electrically connecting the second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 and the power supply via hole 387 is a straight line drawn from the left end of the second pad 382b to the left. It is a wiring pattern.

Of the four sides of the first pad 382a, the direction (left direction) in which the side from which the first wiring pattern 386a is pulled out when viewed from the center of the first pad 382a is the direction (left direction) of the four sides of the second pad 382b. It is the same direction as the direction (left direction) in which the side from which the third wiring pattern 386c is pulled out exists when viewed from the center of the second pad 382b. Therefore, it is possible to prevent a difference in temperature distribution in the pair of first pads 382a and second pads 382b at the initial heating stage of the reflow step. The drawing direction of the first wiring pattern 386a from the first pad 382a is the same as the drawing direction (left direction) of the third wiring pattern 386c from the second pad 382b. Therefore, it is possible to reduce the difference in temperature distribution that may occur in the pair of first pads 382a and second pads 382b in the initial stage of heating.

The first wiring pattern 386a and the third wiring pattern 386c are drawn out in a direction orthogonal to the longitudinal direction of the bypass capacitor 381 or a direction substantially orthogonal to the longitudinal direction. Therefore, when the light emitting board 301 is distorted, the maximum value of the stress that can act on the connection point between the bypass capacitor 381 and the light emitting board 301 can be reduced, and the stress that can act on the bypass capacitor 381 itself can be reduced. The maximum value can be reduced. Further, the first wiring pattern 386a and the third wiring pattern 386c extend linearly in the longitudinal direction of the bypass capacitor 381. Therefore, it is possible to reduce the possibility that the connection portion between the bypass capacitor 381 and the light emitting board 301 is damaged due to the influence of the distortion that may occur in the light emitting substrate 301, and it is possible to reduce the possibility that the bypass capacitor 381 itself is damaged.

In the first light emitting surface 302 of the light emitting substrate 301, the second wiring pattern 386b for electrically connecting the first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 and the first through hole 383 is the first pad 382a. It is a linear wiring pattern drawn to the right from the right end of. Further, the fourth wiring pattern 386d for electrically connecting the second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 and the second through hole 384 is pulled out to the right from the right end of the second pad 382b. It is a linear wiring pattern.

Of the four sides of the first pad 382a, the direction (right direction) in which the side from which the second wiring pattern 386b is drawn out when viewed from the center of the first pad 382a is the direction (right direction) among the four sides of the second pad 382b. When viewed from the center of the second pad 382b, the direction is the same as the direction (right direction) in which the side from which the fourth wiring pattern 386d is drawn exists. Therefore, it is possible to prevent a difference in temperature distribution in the pair of first pads 382a and second pads 382b at the initial heating stage of the reflow step. The drawing direction (right direction) of the second wiring pattern 386b from the first pad 382a is the same as the drawing direction (right direction) of the fourth wiring pattern 386d from the second pad 382b. Therefore, it is possible to reduce the difference in temperature distribution that may occur in the pair of first pads 382a and second pads 382b in the initial stage of heating.

The second wiring pattern 386b and the fourth wiring pattern 386d are drawn out in a direction orthogonal to the longitudinal direction of the bypass capacitor 381 or a direction substantially orthogonal to the longitudinal direction. Therefore, when the light emitting board 301 is distorted, the maximum value of the stress that can act on the connection point between the bypass capacitor 381 and the light emitting board 301 can be reduced, and the stress that can act on the bypass capacitor 381 itself can be reduced. The maximum value can be reduced. Further, the second wiring pattern 386b and the fourth wiring pattern 386d extend linearly in the longitudinal direction of the bypass capacitor 381. Therefore, it is possible to reduce the possibility that the connection portion between the bypass capacitor 381 and the light emitting board 301 is damaged due to the influence of the distortion that may occur in the light emitting substrate 301, and it is possible to reduce the possibility that the bypass capacitor 381 itself is damaged.

According to the present embodiment described in detail above, the following excellent effects are obtained.

The bypass capacitor 381 for absorbing the noise component contained in the drive power supply of the second LED driver 326 mounted on the second light emitting surface 303 side of the light emitting board 301 is a plate on the opposite side to the second light emitting surface 303. It is mounted on the first light emitting surface 302 side, which is a surface. The bypass capacitor 381 is a small chip component. The second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 is electrically connected to the power supply plane layer via the third wiring pattern 386c and the power supply via hole 387, and the fourth wiring pattern 386d and the second. It is electrically connected to the power supply terminal 348 of the second LED driver 326 via the through hole 384. Since the bypass capacitor 381 is arranged between the power supply terminal 348 of the second LED driver 326 and the power supply plane layer, the noise component included in the drive power supply supplied from the voice emission control device 81 to the second LED driver 326. The influence on the second LED driver 326 can be reduced.

The bypass capacitor 381 is arranged close to the power supply terminal 348 so that there are no other electronic components such as ICs between the bypass capacitor 381 and the power supply terminal 348 of the second LED driver 326. As a result, it is possible to increase the possibility that the noise component contained in the drive power supply supplied to the power supply terminal 348 of the second LED driver 326 is absorbed by the bypass capacitor 381, and the second LED driver 326 has the noise component of the noise component. It is possible to reduce the possibility of malfunction due to the influence. Further, by absorbing the noise component generated from the second LED driver 326 into the bypass capacitor 381, it is possible to prevent the noise component from malfunctioning an electronic component such as another IC.

The first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 is electrically connected to the GND terminal 349 of the second LED driver 326 via the first through hole 383, and the second electrode 381b of the bypass capacitor 381 is connected. The second pad 382b corresponding to the above is electrically connected to the power supply terminal 348 of the second LED driver 326 via the second through hole 384. Therefore, the bypass capacitor 381 for absorbing the noise component contained in the drive power supply of the second LED driver 326 mounted on the second light emitting surface 303 side is mounted on the plate surface opposite to the second light emitting surface 303. It can be arranged on the side of a certain first light emitting surface 302. In a configuration in which the bypass capacitor 381 is a small chip component, by arranging the bypass capacitor 381 on the first light emitting surface 302 side, the small chip component can be concentrated on the first light emitting surface 302 side in the light emitting board 301. Therefore, by handling the light emitting board 301 so that the stress acting on the first light emitting surface 302 side of the light emitting board 301 is smaller than the stress acting on the second light emitting surface 303 side, the small chip component and the light emitting board 301 can be combined. It is possible to reduce the possibility of damage to the connection portion of the small chip component itself and reduce the possibility of damage to the small chip component itself. For example, when the light emitting board 301 including the plurality of light emitting boards 301 is divided and the light emitting board 301 is taken out, the collective board is made smaller by dividing the collective board so that the first light emitting surface 302 side has a valley shape (concave). It is possible to prevent tensile stress from acting on the connection point between the chip component and the light emitting substrate 301. As a result, it is possible to prevent the connection portion between the small chip component and the light emitting board 301 from being damaged, and it is possible to prevent the small chip component itself from being damaged.

The bypass capacitor 381 is arranged so as to avoid the corresponding area 391 on the back side of the driver. The driver back side corresponding area 391 is a first light emitting surface 302 located on the back side of the area where the second LED driver 326 is mounted and the area where the pad corresponding to the terminal of the second LED driver 326 is provided on the second light emitting surface 303. Is a region where the distance from the region of No. 1 and the region of the first light emitting surface 302 is within 1 mm. The bypass capacitor 381 is located in the area of the first light emitting surface 302 located on the back side of the area where the second LED driver 326 is mounted and the area where the pad corresponding to the terminal of the second LED driver 326 is provided on the second light emitting surface 303. Since the configuration is not mounted, the influence of the thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the bypass capacitor 381 is reduced. Since the bypass capacitor 381 is arranged so as to avoid the corresponding area 391 on the back side of the driver, the connection point between the bypass capacitor 381 and the light emitting board 301 is damaged under the influence of the thermal stress due to the heat generation of the second LED driver 326. In addition to being able to prevent it, it is possible to prevent the bypass capacitor 381 itself from being damaged.

Of the four sides of the first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381, the direction in which the side from which the first wiring pattern 386a is drawn out when viewed from the center of the first pad 382a is the bypass capacitor 381. Of the four sides of the second pad 382b corresponding to the second electrode 381b, the direction is the same as the direction in which the side from which the third wiring pattern 386c is pulled out is present when viewed from the center of the second pad 382b. Therefore, it is possible to prevent a difference in temperature distribution in the pair of first pads 382a and second pads 382b at the initial heating stage of the reflow step. The drawing direction of the first wiring pattern 386a from the first pad 382a is the same as the drawing direction of the third wiring pattern 386c from the second pad 382b. Therefore, it is possible to reduce the difference in temperature distribution in the pair of first pads 382a and second pads 382b at the initial stage of heating.

The first wiring pattern 386a and the third wiring pattern 386c are drawn out in a direction orthogonal to the longitudinal direction of the bypass capacitor 381 or a direction substantially orthogonal to the longitudinal direction. Therefore, when the light emitting board 301 is distorted, the maximum value of the stress that can act on the connection point between the bypass capacitor 381 and the light emitting board 301 can be reduced, and the stress that can act on the bypass capacitor 381 itself can be reduced. The maximum value can be reduced. Further, the first wiring pattern 386a and the third wiring pattern 386c extend linearly in the longitudinal direction of the bypass capacitor 381. Therefore, it is possible to reduce the possibility that the connection portion between the bypass capacitor 381 and the light emitting board 301 is damaged due to the influence of the distortion that may occur in the light emitting substrate 301, and it is possible to reduce the possibility that the bypass capacitor 381 itself is damaged.

Of the four sides of the first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381, the direction in which the side from which the second wiring pattern 386b is pulled out from the center of the first pad 382a exists is the bypass capacitor 381. Of the four sides of the second pad 382b corresponding to the second electrode 381b, the direction is the same as the direction in which the side from which the fourth wiring pattern 386d is pulled out exists when viewed from the center of the second pad 382b. Therefore, it is possible to prevent a difference in temperature distribution in the pair of first pads 382a and second pads 382b at the initial heating stage of the reflow step. The drawing direction of the second wiring pattern 386b from the first pad 382a is the same as the drawing direction of the fourth wiring pattern 386d from the second pad 382b. Therefore, it is possible to reduce the difference in temperature distribution in the pair of first pads 382a and second pads 382b at the initial stage of heating.

The second wiring pattern 386b and the fourth wiring pattern 386d are drawn out in a direction orthogonal to the longitudinal direction of the bypass capacitor 381 or a direction substantially orthogonal to the longitudinal direction. Therefore, when the light emitting board 301 is distorted, the maximum value of the stress that can act on the connection point between the bypass capacitor 381 and the light emitting board 301 can be reduced, and the stress that can act on the bypass capacitor 381 itself can be reduced. The maximum value can be reduced. Further, the second wiring pattern 386b and the fourth wiring pattern 386d extend linearly in the longitudinal direction of the bypass capacitor 381. Therefore, it is possible to reduce the possibility that the connection portion between the bypass capacitor 381 and the light emitting board 301 is damaged due to the influence of the distortion that may occur in the light emitting substrate 301, and it is possible to reduce the possibility that the bypass capacitor 381 itself is damaged.

In the first light emitting surface 302 of the light emitting board 301, the driver back side corresponding area 391 on which the bypass capacitor 381 is not mounted is an area in which the second LED driver 326 (FIG. 29) is mounted on the second light emitting surface 303 (FIG. 29). And the area of the first light emitting surface 302 located behind the area where the pad corresponding to the terminal of the second LED driver 326 is provided, and the area where the distance from the area of the first light emitting surface 302 is within 1 mm is limited. There is no such thing. The first light emitting surface 302 located on the back side of the driver back side corresponding area 391 on the second light emitting surface 303 on the back side of the area where the second LED driver 326 is mounted and the area where the pad corresponding to the terminal of the second LED driver 326 is provided. The region may be a region in which the distance from the region of No. 1 and the region of the first light emitting surface 302 is within 2 mm. As a result, the influence of the thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the small chip component can be further reduced. Therefore, it is possible to reduce the possibility that the connection point between the bypass capacitor 381 and the light emitting board 301 is damaged due to the influence of the thermal stress due to the heat generated by the second LED driver 326, and the possibility that the bypass capacitor 381 itself is damaged. Can be reduced. Further, the driver back side corresponding area 391 is located on the back side of the area where the second LED driver 326 is mounted on the second light emitting surface 303 and the area where the pad corresponding to the terminal of the second LED driver 326 is provided. The distance from the region of the surface 302 and the region of the first light emitting surface 302 may be a region of 0.5 mm or less. As a result, the area where the small chip component can be mounted on the first light emitting surface 302 of the light emitting board 301 while reducing the influence of the thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the small chip component. A large area can be secured.

<Other embodiments>
It should be noted that the description is not limited to the above-described embodiment, and various modifications and improvements can be made without departing from the spirit of the present invention. For example, it may be changed as follows. Incidentally, the following configuration of another embodiment may be applied individually or in combination to the configuration of the above embodiment.

(1) In the first embodiment, all the electronic components including the connectors 111 and 112 and the small chip components are integrated on the mounting surface which is the plate surface on one side of the first decorative substrate 56, and the mounting thereof is performed. The small chip components may be arranged so as to avoid the peripheral areas of the connectors 111 and 112 on the surface. Specifically, the first connector 111, the second connector 112, and small chip components (bypass capacitors 85, 97 and small chip resistors 87, 101, 143) are mounted on the mounting surface, which is one side of the first decorative substrate 56. All electronic components including ~ 149) are integrated. In the first decorative substrate 56, no electronic component is mounted on the back side plate surface which is the plate surface on the opposite side of the mounting surface. In the first decorative substrate 56, the small chip component is not mounted in the region around the first connector where the distance from the outer edge of the first connector 111 is less than a predetermined distance (specifically, less than 5 mm). The region around the first connector is a region in which tensile stress is likely to be applied when the harness is attached to the first connector 111, and is a region in which compressive stress is likely to be applied when the harness is removed from the first connector. Further, the small chip component is not mounted in the region around the second connector where the distance from the second connector 112 is less than a predetermined distance (specifically, less than 5 mm). The region around the second connector is a region in which tensile stress is likely to be applied when the harness is attached to the second connector 112, and is a region in which compressive stress is likely to be applied when the harness is removed from the second connector 112. If the small chip component is mounted in the peripheral area of the connector, the connection point between the small chip component and the first decorative board 56 may be damaged when the harness is attached to or detached from the connectors 111 and 112, and the said. The small chip component itself may be damaged. On the other hand, since the small chip parts are arranged so as to avoid the area around the connector, damage to the connection point between the small chip parts and the first decorative board 56 is prevented when the harness is attached to and detached from the connectors 111 and 112. At the same time, damage to the small chip component itself is prevented.

As described above, in the configuration in which all the electronic components are integrated on the mounting surface of the first decorative substrate 56, the small chip components are arranged on the mounting surface so as to avoid the peripheral regions of the connectors 111 and 112. As a result, it is possible to prevent damage to the connection portion between the small chip component and the first decorative board 56 when the harness is attached to and detached from the connectors 111 and 112, and it is possible to prevent damage to the small chip component itself. ..

(2) In the first embodiment, the wiring patterns 172a to 172d drawn out from the pair of pads 171a and 171b may be drawn out in different directions. Specifically, the first wiring pattern is drawn from substantially the center in the vertical direction to the diagonally upward right direction at the right end of the first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85, and corresponds to the second electrode. The third wiring pattern is pulled out from the substantially center in the vertical direction at the right end of the second pad 171b in the diagonally downward direction to the right. Even if the first wiring pattern and the third wiring pattern drawn from the pads 171a and 171b have different drawing directions, they are viewed from the center of the first pad 171a among the four sides of the first pad 171a. The direction in which the side from which the first wiring pattern is drawn out exists, and the direction in which the side from which the third wiring pattern is drawn out from the center of the second pad 171b among the four sides of the second pad 171b exists. By adopting a configuration common to the above, it is possible to reduce the possibility of a difference in the temperature distribution in the pads 171a and 171b at the initial stage of heating in the reflow process.

(3) In the first embodiment, a part of the wiring patterns 172a to 172d drawn out from the pads 171a and 171b may extend in a direction not orthogonal to the longitudinal direction of the bypass capacitor 85. Specifically, similarly to the first embodiment, the first wiring pattern 172a is pulled out to the right from the right end of the first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85, and the second. The wiring pattern 172b is pulled out from the left end of the first pad 171a to the left. Further, similarly to the first embodiment, the fourth wiring pattern 172d is pulled out from the left end of the second pad 171b corresponding to the second electrode 85b of the bypass capacitor 85 to the left. The third wiring pattern in this configuration is drawn out from the right end of the second pad 171b in the diagonally downward direction to the right. As described above, even if a part of the wiring patterns 172a to 172d drawn out from the pads 171a and 171b extends in a direction not orthogonal to the longitudinal direction of the bypass capacitor 85, they are pulled out from the pads 171a and 171b. Compared to the configuration in which the existing wiring pattern extends in the longitudinal direction of the bypass capacitor 85, the stress that can act on the connection point between the bypass capacitor 85 and the first decorative board 56 when the first decorative board 56 is distorted. The maximum value of the stress can be reduced, and the maximum value of the stress that can act on the bypass capacitor 85 itself can be reduced.

(4) In the first embodiment, the first decorative substrate 56 is provided with a GND solid pattern (ground solid pattern or ground solid pattern) in place of the GND plane layer 93, and a power source is provided in place of the power supply plane layer 94. It may be configured to have a solid pattern. Specifically, the first decorative substrate is a two-layer substrate having a first mounting surface and a second mounting surface. A GND solid pattern and a power supply solid pattern, which have a larger area than the wiring patterns 172a to 172d, are formed on the second mounting surface of the first decorative substrate. The first wiring pattern 172a drawn from the first pad 171a of the bypass capacitor 85 is electrically connected to the GND solid pattern via a through hole provided in the first decorative substrate, and is also electrically connected to the GND solid pattern from the first pad 171a. The drawn out second wiring pattern 172b is electrically connected to the GND terminal 154 of the LED driver 126. Further, the third wiring pattern 172c drawn from the second pad 171b of the bypass capacitor 85 is electrically connected to the power supply solid pattern via a through hole provided in the first decorative substrate, and the second pad is also connected. The fourth wiring pattern 172d drawn from 171b is electrically connected to the power supply terminal 151 of the LED driver 126. The first wiring pattern 172a connected to the GND solid pattern, which has a larger area than the first pad 171a, has a temperature rise in the initial heating stage as compared with the second wiring pattern 172b not connected to the GND solid pattern. Is delayed. Further, the third wiring pattern 172c connected to the power supply solid pattern having a larger area than the second pad 171b is in the initial stage of heating as compared with the fourth wiring pattern 172d not connected to the power supply solid pattern. The temperature rise is delayed. Also in this configuration, in a configuration in which the same number (specifically, two) of wiring patterns 172a to 172d are drawn from the first pad 171a and the second pad 171b, the first of the four sides of the first pad 171a is said to be the first. The direction in which the side from which the first wiring pattern 172a is pulled out exists when viewed from the center of the 1 pad 171a is such that the third wiring pattern 172c is viewed from the center of the second pad 171b among the four sides of the second pad 171b. The direction in which the pulled out side exists is the same as the direction in which it exists. Further, the direction in which the side from which the second wiring pattern 172b is drawn out when viewed from the center of the first pad 171a among the four sides of the first pad 171a exists is the second of the four sides of the second pad 171b. Seen from the center of the pad 171b, the direction in which the side from which the fourth wiring pattern 172d is drawn exists is the same. As a result, it is possible to reduce the difference in temperature distribution in the pair of pads 171a and 171b at the initial stage of heating in the reflow step, and it is possible to prevent the bypass capacitor 85 from rotating and the occurrence of chip standing.

(5) In the third embodiment, the noise component included in the second LED driver 326 for controlling the light emission of the LED chips 315 to 325 of the second light emitting surface 303 and the drive power supply of the second LED driver 326. A noise absorbing capacitor for absorbing the noise may be mounted on the first light emitting surface 302. The noise absorbing capacitor in this configuration is a small chip component like the bypass capacitor 85 in the first embodiment. By mounting the noise absorbing capacitor on the first light emitting surface 302, it is possible to consolidate all the small chip parts mounted on the light emitting board 301 on the first light emitting surface 302 side while making the noise absorbing capacitor a small chip component. can. Therefore, by handling the light emitting board 301 so that the stress acting on the first light emitting surface 302 side of the light emitting board 301 is smaller than the stress acting on the second light emitting surface 303 side, the small chip component and the light emitting board 301 can be combined. It is possible to reduce the possibility of damage to the connection portion of the small chip component itself and reduce the possibility of damage to the small chip component itself. For example, when the light emitting board 301 including the plurality of light emitting boards 301 is divided and the light emitting board 301 is taken out, the collective board is made smaller by dividing the collective board so that the first light emitting surface 302 side has a valley shape (concave). It is possible to prevent tensile stress from acting on the connection point between the chip component and the light emitting substrate 301. As a result, it is possible to prevent the connection portion between the small chip component and the light emitting board 301 from being damaged, and it is possible to prevent the small chip component itself from being damaged.

(6) In the third embodiment and the fourth embodiment, the light emitting board 301 is sandwiched between the board case from the front side and the back side instead of the structure in which the light emitting board 301 is screwed to the board case. May be. The board case includes a front side case body and a back side case body. The front side case body is provided with a front side fixing protrusion by standing upright on the back side, and the back side case body is provided with a back side fixing protrusion portion standing upright on the front side. The light emitting substrate 301 is fixed to the substrate case by being sandwiched between the front side fixed protrusion portion and the back side fixed protrusion portion. In the light emitting substrate 301, the small chip components are arranged at a distance of 5 mm or more from the holding portion by the front side fixed protrusion portion and the back side fixed protrusion portion. As a result, it is possible to prevent the connection point between the small chip component and the light emitting board 301 from being damaged due to the influence of the distortion of the light emitting board 301 that may occur in the vicinity of the sandwiched portion, and it is possible to prevent the small chip component itself from being damaged. ..

(7) In each of the above embodiments, the direction in which the side of the four sides of the first pad (or the first pad) from which the wiring pattern is drawn out when viewed from the center of the first pad exists, and the second pad ( Or, if the direction in which the side from which the wiring pattern is pulled out exists is the same as the four sides of the second pad) when viewed from the center of the second pad, the wiring pattern is pulled out in the first pad. The wiring pattern may be pulled out from the side where the wiring pattern is pulled out from the side where the wiring pattern is pulled out from the second pad, and the wiring pattern may be pulled out from the side where the wiring pattern is pulled out. For example, in the first embodiment, the right side of the rectangular first pad 176a electrically connected to the first electrode 87a of the small chip resistor 87 is located to the right of the center in the vertical direction. The first wiring pattern 181a is pulled out to the right side of the rectangular second pad 176b electrically connected to the second electrode 87b. The wiring pattern 181b may be pulled out. Even in such a configuration, of the four sides of the first pad 176a, the direction (right direction) in which the side from which the first wiring pattern 181a is pulled out when viewed from the center of the first pad 176a exists, and the second pad. Of the four sides of 176b, the direction in which the side from which the second wiring pattern 181b is pulled out is present (right direction) when viewed from the center of the second pad 176b is the same direction, so that the initial heating stage of the reflow step is performed. It is possible to reduce the possibility that a difference occurs in the temperature distributions of the first pad 176a and the second pad 176b in the above.

(8) In each of the above embodiments, the first pad (or the first pad) electrically connected to the first electrode of the small chip component and the second pad (or the second pad) electrically connected to the second electrode. The shape of the pad) is not limited to a rectangle, and may be a polygon such as a hexagon or an octagon. For example, in a configuration in which the shapes of the first pad and the second pad are hexagonal, the direction in which the side from which the first wiring pattern is drawn out from the center of the first pad among the six sides of the first pad exists. Is set to the same direction as the direction in which the side from which the second wiring pattern is pulled out exists when viewed from the center of the second pad among the six sides of the second pad. It is possible to reduce the possibility that the temperature distribution in the 1st pad and the 2nd pad will be different.

(9) In each of the above embodiments, small chip components (bypass capacitors 85, 97 in the first embodiment, small chip resistors 87, 101, bypass capacitors 291 in the second embodiment, bypass in the fourth embodiment). The capacitor 381) is replaced with a configuration in which electrodes in a narrow sense (first electrodes 85a, 87a, 97a, 101a, 291a, 381a and second electrodes 85b, 87b, 97b, 101b, 291b, 381b) are provided. A terminal may be provided on the chip component. As already described in the first embodiment, the "terminal" is a linear shape provided on an electronic component (including a small chip component) for electrically connecting to a corresponding pad (or pad). Along with being a metal part, an "electrode" is, in a narrow sense, a metal part provided on an electronic component (including a small chip component) for electrical surface connection with a corresponding pad (or pad). Yes, it does not include the above "terminals".

Specifically, a line extending from one end in the longitudinal direction along a plane orthogonal to the thickness direction of the bypass capacitor 85,97,291,381 to one side in the longitudinal direction on the bypass capacitor 85,97,291,381. A linear first terminal is provided, and a linear shape extends from the other end of the bypass capacitor 85 opposite to the one end in the longitudinal direction to the other side opposite to the one end in the longitudinal direction. The configuration may be such that a second terminal is provided. Further, the small chip resistors 87 and 101 are provided with a linear first terminal extending from one end in the longitudinal direction along a plane orthogonal to the thickness direction of the small chip resistors 87 and 101 to one side in the longitudinal direction. In addition, a linear second terminal extending from the other end of the small chip resistor 87 opposite to the one end in the longitudinal direction to the other side opposite to the one side in the longitudinal direction is provided. It may be configured as such.

(10) In each of the above embodiments, the LED driver 126, 314, 326 may be provided with an electrode in a narrow sense instead of the configuration in which the LED driver 126, 314, 326 is provided with a terminal. As already described in the first embodiment, the "terminal" is a linear shape provided on an electronic component (including a small chip component) for electrically connecting to a corresponding pad (or pad). Along with being a metal part, an "electrode" is, in a narrow sense, a metal part provided on an electronic component (including a small chip component) for electrical surface connection with a corresponding pad (or pad). Yes, it does not include the above "terminals". Specifically, in the substantially rectangular parallelepiped housing of the LED drivers 126, 314, 326, electrodes in a narrow sense are provided at locations facing the pads (or pads), and the pads and the electrodes are electrically connected by soldering. It may be configured to be connected to.

(11) In the first embodiment, the slit 255-258 is provided at a position corresponding to the region where the bypass capacitor 85 is mounted on the assembly board 231. However, the present invention is not limited to this. Instead, a second dividing groove (a dividing groove having a thin bottom) that is deeper than the normal first dividing groove may be formed at the relevant portion. The first dividing groove and the second dividing groove are formed linearly. The plate thickness at the bottom of the second dividing groove is smaller than the plate thickness at the bottom of the first dividing groove, and the mechanical strength of the second dividing groove is lower than the mechanical strength of the first dividing groove. Therefore, when the assembly substrate 231 is valley-divided with the first dividing groove and the second dividing groove existing on a straight line as the base points, the stress acting on the periphery of the second dividing groove acts on the periphery of the first dividing groove. Less than the stress to be applied. By providing the second dividing groove in the portion corresponding to the region where the bypass capacitor 85 is mounted in the assembly board 231, the bypass capacitor 85 and the first decorative board 56 are combined when the assembly board 231 is divided. The stress that can act on the connection point can be reduced, and the stress that can act on the bypass capacitor 85 itself can be reduced.

(12) In the first embodiment, the dividing groove 223 to 247 is formed only on the first plate surface 268 side of the assembly substrate 231. However, the present invention is not limited to this, and the dividing groove 232 is not limited to this. ~ 247 may be provided on both the first plate surface 268 side and the second plate surface 269 side. One dividing groove 223 to 247 is formed on each of the first plate surface 268 side and the second plate surface 269 side of the assembly substrate 231, and the forming positions thereof are the first plate surface 268 side and the second plate surface. It is almost the same on the 269 side. In this configuration, the discarded substrates 261 to 267 are provided with a mountain side surface display by silk printing so that a plate surface having a mountain shape (convex) can be confirmed when the collective substrate 231 is divided into valleys. The mountain side display is provided on the second plate surface 269 side. The operator sets the assembly board 231 on the dividing jig 281 with the side on which the mountain side display is printed facing upward so that the first plate surface 268 has a valley shape (concave). Can be divided into valleys. The mountain side surface display is printed only on the discarded substrate, and is not printed on the first decorative substrate 56 taken out from the collective substrate 231. In this way, by adopting the configuration in which the mountain side surface display is printed on the discarded boards 261 to 267, it is possible to prevent the collective board 231 from being accidentally split into mountains.

(13) In the first embodiment, the assembly substrate 231 has a configuration in which dividing grooves 223 to 235, 240, 241,246, 247 are formed at the boundary between the first decorative substrate 56 and the discarded substrates 261,263,266. However, the present invention is not limited to this, and the portion where the first decorative substrate 56 and the discarded substrate 261,263,266 are connected to the boundary between the first decorative substrate 56 and the discarded substrate 261,263,266. Perforations may be formed in which portions that are not connected to each other are alternately present. The mechanical strength at the perforations of the assembly substrate 231 is lower than the mechanical strength in the peripheral region of the perforations. By providing a perforation at the boundary between the first decorative substrate 56 and the discarded substrates 261,263,266, the stress that may act on the connection point between the small chip component and the first decorative substrate 56 when the assembly substrate 231 is divided is reduced. At the same time, it is possible to reduce the stress that may act on the small chip component itself.

(14) In the above first embodiment, a plurality of first decorative substrates 56 are set on the collective substrate 231. However, the present invention is not limited to this, and a plurality of types of substrates are set on the collective substrate 231. It may be configured as such. This makes it possible to take out a plurality of types of substrates from one collective substrate 231.

(15) In the first embodiment, a push position display indicating a place where a force should be applied to split the assembly substrate 231 may be silk-printed on the assembly substrate 231. The operator can divide the assembly board 231 by fixing the assembly board 231 to the division jig 281 and then pushing the portion on which the push position display is printed downward with a finger. By specifying the place where the force should be applied to split the assembly board 231 by the push position display, the stress that can be applied to the connection point between the small chip component and the first decorative board 56 when the assembly board 231 is divided is minimized. It can be suppressed to the limit, and the stress that can be applied to the small chip component itself can be minimized.

(16) In the first embodiment and the second embodiment, small chip components (bypass capacitor 85 and small chip resistor 87) are mounted on decorative substrates 56 and 57 for executing light emission effect. However, the present invention is not limited to this, and for example, a configuration in which a small chip component is mounted on a motor control board for executing a vibration effect that vibrates the pachinko machine 10 may be used. Further, the main control board 61 included in the main control device 60, the voice emission control board included in the voice emission control device 81, the payout control board included in the payout control device 77, and the power supply / emission control device 78 are provided. The small chip component may be mounted on at least one of the power supply / emission control boards and the display control board provided in the display control device 82.

(17) Display control based on the command transmitted from the main control device 60 instead of the configuration in which the display control device 82 is controlled by the voice emission control device 81 based on the command transmitted from the main control device 60. The device 82 may be configured to control the voice emission control device 81. Further, instead of the configuration in which the voice emission control device 81 and the display control device 82 are separately provided, a configuration in which both control devices are provided as one control device may be used, and the function of one of the two control devices may be provided. May be integrated in the main control device 60, and both functions of both control devices may be integrated in the main control device 60. Further, the content of the command transmitted from the main control device 60 to the voice emission control device 81 and the content of the command transmitted from the voice emission control device 81 to the display control device 82 are also arbitrary.

(18) Other types of pachinko machines different from the above embodiments, for example, a pachinko machine in which an electric accessory is opened a predetermined number of times when a game ball enters a specific area of a special device, or a game ball in a specific area of a special device. The present invention can also be applied to a pachinko machine, which is a big hit when a right is entered, a pachinko machine equipped with other accessories, an arrange ball machine, a game machine such as a sparrow ball, and the like.

In addition, a non-bullet type gaming machine, for example, a plurality of reels having a plurality of types of symbols attached in the circumferential direction is provided, the reels are started to rotate by inserting medals and operating the start lever, and the stop switch is operated. Or, after the reel has stopped after a predetermined time has elapsed, if a specific symbol or a combination of specific symbols is established on the effective line that can be seen from the display window, a privilege such as paying out a medal is given to the player. The present invention can also be applied to slot machines.

In addition, the main body of the gaming machine, which is supported to be openable and closable on the outer frame, is equipped with a storage unit and a take-in device, and the start lever is operated after a predetermined number of game balls stored in the storage unit are taken in by the take-in device. The present invention can also be applied to a gaming machine in which a pachinko machine and a slot machine are fused to start rotation of a reel.

<About the invention group extracted from each of the above embodiments>
Hereinafter, the characteristics of the invention group extracted from each of the above-described embodiments will be described while showing the effects and the like as necessary. In the following, for the sake of easy understanding, the corresponding configurations in each of the above embodiments are appropriately shown in parentheses or the like, but the present invention is not limited to the specific configurations shown in the parentheses or the like.

<Characteristic A group>
Features A1. Predetermined electronic components (bypass capacitors 85, 97 in the first embodiment, small chip resistors 87, 101, bypass capacitors 291 in the second embodiment, bypass capacitors 381 in the fourth embodiment) are mounted. In a gaming machine provided with a substrate (first decorative substrate 56 in the first embodiment, second decorative substrate 57, light emitting substrate 301 in the fourth embodiment).
The predetermined electronic component includes a first predetermined electrode (first electrode 85a, 87a, 291a, 381a) and a second predetermined electrode (second electrode 85b, 87b, 291b, 381b) as a pair of electrodes.
The predetermined substrate is
A first predetermined connection portion (first pad 171a, 176a, 293a, 382a) to which the first predetermined electrode is electrically connected, and
The first predetermined wiring pattern (first wiring pattern 172a, 181a, 294a, 386a, second wiring pattern 172b, 294b, 386b) drawn from the first predetermined connection portion.
A second predetermined connection portion (second pad 171b, 176b, 293b, 382b) to which the second predetermined electrode is electrically connected and a second predetermined connection portion (second pad 171b, 176b, 293b, 382b).
The second predetermined wiring pattern (second wiring pattern 181b, third wiring pattern 172c, 294c, 386c, fourth wiring pattern 172d, 294d, 386d) drawn from the second predetermined connection portion.
Equipped with
The direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is pulled out is present when viewed from the center of the first predetermined connection portion is the second direction when viewed from the center of the second predetermined connection portion. A gaming machine characterized in that the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn is in the same direction as the existing direction.

According to the feature A1, the direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is pulled out when viewed from the center of the first predetermined connection portion exists is as seen from the center of the second predetermined connection portion. The direction is the same as the direction in which the side of the second predetermined connection portion from which the second predetermined wiring pattern is drawn exists. Therefore, the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion in the initial heating stage of the reflow step can be made uniform, and the temperature distribution is applied on the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the mode in which the solder paste is melted. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component is placed on one connection portion (first predetermined connection portion or second predetermined connection portion). It is possible to prevent so-called chip standing that rises only with one electrode (first predetermined electrode or second predetermined electrode). Therefore, it is possible to secure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. ..

Feature A2. The feature A1 is characterized in that the drawing direction of the first predetermined wiring pattern from the first predetermined connecting portion is the same as the drawing direction of the second predetermined wiring pattern from the second predetermined connecting portion. The described gaming machine.

According to the feature A2, it is possible to reduce the possibility that the temperature distribution in the first predetermined connection portion and the second predetermined connection portion is different in the initial heating stage of the reflow step.

Feature A3. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the first predetermined wiring pattern.
The second predetermined connection portion is characterized in that it is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern. The gaming machine according to the feature A1 or A2.

According to the feature A3, a predetermined wiring pattern electrically connected to a metal region (first metal region or second metal region) having a large area in a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). The side where the lead-out portion of (the first predetermined wiring pattern or the second predetermined wiring pattern) exists tends to be delayed in temperature rise in the initial heating stage of the reflow process, but in the initial heating stage when viewed from the center of the first predetermined connection portion. The direction in which the side where the temperature rise is likely to be delayed is the same as the direction in which the side where the temperature rise is likely to be delayed exists in the initial stage of heating when viewed from the center of the second predetermined connection portion. As a result, the temperature distributions in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating can be made uniform.

Feature A4. The wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern.
The gaming machine according to any one of features A1 to A3, wherein the wiring pattern drawn out from the second predetermined connection portion is only the second predetermined wiring pattern.

According to the feature A4, it is possible to reduce the possibility that a difference occurs in the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating.

Feature A5. The predetermined substrate is
A third predetermined wiring pattern (second wiring pattern 172b, 294b, 386b) drawn from the first predetermined connection portion and
The fourth predetermined wiring pattern (fourth wiring pattern 172d, 294d, 386d) drawn from the second predetermined connection portion and
Equipped with
The direction in which the side of the first predetermined connection portion from which the third predetermined wiring pattern is drawn from the center of the first predetermined connection portion exists is the fourth direction as seen from the center of the second predetermined connection portion. The gaming machine according to any one of features A1 to A3, wherein the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn is in the same direction as the existing direction.

According to the feature A5, the direction in which the side of the first predetermined connection portion having the configuration of the above feature A1 and the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out when viewed from the center of the first predetermined connection portion exists is the second. In a configuration in which the direction in which the side of the second predetermined connection portion from which the second predetermined wiring pattern is drawn is the same as the direction in which the side of the second predetermined connection portion is drawn from the center of the predetermined connection portion, the second predetermined connection portion is viewed from the center. 3 The direction in which the side of the first predetermined connection portion from which the predetermined wiring pattern is drawn exists is the direction of the second predetermined connection portion from which the fourth predetermined wiring pattern is drawn from the center of the second predetermined connection portion. It is the same direction as the side where the side exists. Therefore, the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion in the initial heating stage of the reflow step can be made uniform, and the temperature distribution is applied on the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the mode in which the solder paste is melted. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component is placed on one connection portion (first predetermined connection portion or second predetermined connection portion). It is possible to prevent the so-called chip standing that rises only by the electrode (first predetermined electrode or second predetermined electrode) of the above. Therefore, it is possible to secure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. ..

Feature A6. The feature A5 is characterized in that the drawing direction of the third predetermined wiring pattern from the first predetermined connection portion is the same as the drawing direction of the fourth predetermined wiring pattern from the second predetermined connection portion. The described gaming machine.

According to the feature A6, it is possible to reduce the possibility that the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion is different in the initial heating stage of the reflow step.

Feature A7. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the first predetermined wiring pattern.
The third predetermined wiring pattern is not electrically connected to a metal region having a larger area than the first predetermined connection portion.
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern.
The gaming machine according to feature A5 or A6, wherein the fourth predetermined wiring pattern is not electrically connected to a metal region having a larger area than the second predetermined connection portion.

According to the feature A7, a predetermined wiring pattern electrically connected to a metal region (first metal region or second metal region) having a large area in a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). The side where the lead-out portion of (the first predetermined wiring pattern or the second predetermined wiring pattern) exists tends to be delayed in temperature rise in the initial heating stage of the reflow process, but in the initial heating stage when viewed from the center of the first predetermined connection portion. The direction in which the side where the temperature rise tends to be delayed exists is the same as the direction in which the side where the temperature rise tends to be delayed exists in the initial stage of heating when viewed from the center of the second predetermined connection portion. Further, the direction in which the side where the third predetermined wiring pattern that is not electrically connected to the metal region having a large area from the first predetermined connection portion when viewed from the center of the first predetermined connection portion exists is present. , Same as the direction in which the side where the fourth predetermined wiring pattern that is not electrically connected to the metal region having a large area from the second predetermined connection portion when viewed from the center of the second predetermined connection portion is drawn out exists. The direction of. Therefore, the temperature distributions in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating can be made uniform.

Feature A8. The second predetermined in a connection target (a pad electrically connected to the eighth output terminal 162 of the LED driver 126) that is electrically connected to the second predetermined connection portion using the second predetermined wiring pattern. The location where the wiring pattern is connected is the direction of a predetermined axis including the drawing direction of the second predetermined wiring pattern from the second predetermined connection portion (second direction in FIGS. 8A and 8C). When viewed in DR2), the second predetermined connection portion is used as a reference and exists in the direction opposite to the drawing direction of the second predetermined wiring pattern from the second predetermined connection portion.
The second predetermined wiring pattern is drawn from the second predetermined connection portion in the same direction as the drawing direction of the first predetermined wiring pattern from the first predetermined connection portion, and then in the direction of the predetermined one axis. The gaming machine according to any one of features A1 to A7, wherein the gaming machine is routed in the opposite direction with respect to the second predetermined connection portion when viewed.

According to the feature A8, when the second predetermined wiring pattern is viewed in the direction of the predetermined one axis, the direction opposite to the drawing direction of the second predetermined wiring pattern from the second predetermined connection portion with respect to the second predetermined connection portion. The second predetermined wiring pattern is drawn out from the second predetermined connection portion in the same direction as the drawing direction of the first predetermined wiring pattern from the first predetermined connection portion even in the configuration in which the second predetermined wiring pattern is connected to the connection target at the location existing in. ing. As a result, it is possible to reduce the possibility that the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion will be different in the initial heating stage of the reflow step.

Feature A9. The predetermined electronic component has a configuration in which the dimension in the first direction orthogonal to the thickness direction of the predetermined electronic component is larger than the dimension in the second direction orthogonal to the thickness direction of the predetermined electronic component.
At least one of the drawing direction of the first predetermined wiring pattern from the first predetermined connection portion and the drawing direction of the second predetermined wiring pattern from the second predetermined connection portion is a direction orthogonal to the first direction or abbreviated. The gaming machine according to any one of features A1 to A8, characterized in that the directions are orthogonal to each other.

According to the feature A9, when the predetermined electronic component is distorted, the maximum value of the stress that can be applied to the connection point between the predetermined electronic component and the predetermined board can be reduced, and the stress that can be applied to the predetermined electronic component itself can be reduced. The maximum value of can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged, and it is possible to prevent the predetermined electronic component itself from being damaged.

Feature A10. The first predetermined connection portion, the second predetermined connection portion, the first predetermined wiring pattern, and the second predetermined wiring pattern are a predetermined mounting surface (the first decorative substrate 56) which is a plate surface on one side of the predetermined board. It is provided on the first mounting surface 84), and is provided on the first mounting surface 84).
The gaming machine according to feature A9, wherein at least one of the first predetermined wiring pattern and the second predetermined wiring pattern is a wiring pattern extending linearly on the predetermined mounting surface.

According to the feature A10, at least one of the first predetermined wiring pattern and the second predetermined wiring pattern extends linearly on the predetermined mounting surface. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged, and it is possible to prevent the predetermined electronic component itself from being damaged.

Feature A11. The predetermined substrate is a non-penetrating predetermined via hole (via holes 174, 175) extending from the predetermined mounting surface in the thickness direction of the predetermined substrate, or a predetermined through hole (first through hole 383) penetrating the predetermined substrate in the thickness direction. , 2nd through hole 384)
At least one of the first predetermined wiring pattern and the second predetermined wiring pattern electrically connects the first predetermined connection portion or the second predetermined connection portion and the predetermined via hole or the predetermined through hole on the predetermined mounting surface. The gaming machine according to feature A10, which is characterized by having a linear wiring pattern connected to the machine.

According to the feature A11, when a predetermined via hole or a predetermined through hole is provided on a predetermined board and at least one of the first predetermined wiring pattern and the second predetermined wiring pattern is a linear wiring pattern, the predetermined board is distorted. In the above, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced.

Feature A12. The predetermined substrate is
A third predetermined wiring pattern (second wiring pattern 172b, 294b, 386b) drawn from the first predetermined connection portion and
The fourth predetermined wiring pattern (fourth wiring pattern 172d, 294d, 386d) drawn from the second predetermined connection portion and
Equipped with
The predetermined electronic component has a configuration in which the dimension in the first direction orthogonal to the thickness direction of the predetermined electronic component is larger than the dimension in the second direction orthogonal to the thickness direction of the predetermined electronic component.
The drawing direction of the first predetermined wiring pattern from the first predetermined connection portion, the drawing direction of the second predetermined wiring pattern from the second predetermined connection portion, and the drawing direction of the third predetermined wiring pattern from the first predetermined connection portion. The drawing direction of the fourth predetermined wiring pattern and the drawing direction of the fourth predetermined wiring pattern from the second predetermined connection portion are any of the features A1 to A11 characterized in that they are orthogonal to the first direction or substantially orthogonal to the first direction. The gaming machine according to 1.

According to the feature A12, in a configuration in which the dimension of the predetermined electronic component in the first direction is larger than the dimension of the second direction, the direction of drawing out the first predetermined wiring pattern from the first predetermined connection portion and the second predetermined wiring pattern are the first. 2 The drawing direction from the predetermined connection portion, the drawing direction of the third predetermined wiring pattern from the first predetermined connection portion, and the drawing direction of the fourth predetermined wiring pattern from the second predetermined connection portion are directions orthogonal to the first direction or. The directions are approximately orthogonal to each other. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced.

Feature A13. The predetermined electronic component is a capacitor (bypass capacitor 85, 97 in the first embodiment, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) or a resistor (in the first embodiment). The gaming machine according to any one of features A1 to A12, which is a small chip resistor 87,101).

According to the feature A13, the direction in which the side of the first predetermined connection portion having the configuration of the above feature A1 and the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out when viewed from the center of the first predetermined connection portion exists is the second direction. The direction is the same as the direction in which the side of the second predetermined connection portion from which the second predetermined wiring pattern is drawn out is present when viewed from the center of the predetermined connection portion. Therefore, the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion in the initial heating stage of the reflow step can be made uniform, and the temperature distribution is applied on the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the mode in which the solder paste is melted. As a result, it is possible to prevent the capacitor or the resistor from rotating about the normal direction of the predetermined board as the rotation axis, and the capacitor or the resistor is on one connection portion (first predetermined connection portion or second predetermined connection portion). It is possible to prevent the so-called chip standing that rises with only one electrode (first predetermined electrode or second predetermined electrode). Therefore, it is possible to secure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. ..

Feature A14. Predetermined electronic components (bypass capacitors 85, 97 in the first embodiment, small chip resistors 87, 101, bypass capacitors 291 in the second embodiment, bypass capacitors 381 in the fourth embodiment) are mounted. In a gaming machine provided with a substrate (first decorative substrate 56 in the first embodiment, second decorative substrate 57, light emitting substrate 301 in the fourth embodiment).
The predetermined electronic component includes a first predetermined electrode (first electrode 85a, 87a, 291a, 381a) and a second predetermined electrode (second electrode 85b, 87b, 291b, 381b) as a pair of electrodes.
The predetermined substrate is
A first predetermined connection portion (first pad 171a, 176a, 293a, 382a) to which the first predetermined electrode is electrically connected, and
The first predetermined wiring pattern (first wiring pattern 172a, 181a, 294a, 386a, second wiring pattern 172b, 294b, 386b) drawn from the first predetermined connection portion.
A second predetermined connection portion (second pad 171b, 176b, 293b, 382b) to which the second predetermined electrode is electrically connected and a second predetermined connection portion (second pad 171b, 176b, 293b, 382b).
The second predetermined wiring pattern (second wiring pattern 181b, third wiring pattern 172c, 294c, 386c, fourth wiring pattern 172d, 294d, 386d) drawn from the second predetermined connection portion.
Equipped with
A gaming machine characterized in that the drawing direction of the first predetermined wiring pattern from the first predetermined connecting portion is the same as the drawing direction of the second predetermined wiring pattern from the second predetermined connecting portion.

According to the feature A14, since the drawing direction of the first predetermined wiring pattern from the first predetermined connection portion is the same as the drawing direction of the second predetermined wiring pattern from the second predetermined connection portion, the heating of the reflow step is performed. In the initial stage, it is possible to reduce the possibility that the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion is different, and the coating is applied on the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the mode in which the solder paste is melted. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component is placed on one connection portion (first predetermined connection portion or second predetermined connection portion). It is possible to prevent so-called chip standing that rises only with one electrode (first predetermined electrode or second predetermined electrode). Therefore, it is possible to secure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. ..

It should be noted that any of the features A1 to A14, the features B1 to B12, the features C1 to C12, the features D1 to D12, the features E1 to E6, the features F1 to F15, the features G1, and the features H1 with respect to the configuration of the features A1 to A14. Or one or more configurations may be applied. This makes it possible to produce a synergistic effect due to the combined configuration.

<Characteristic B group>
Feature B1. Predetermined electronic components (bypass capacitors 85, 97 in the first embodiment, small chip resistors 87, 101, bypass capacitors 291 in the second embodiment, bypass capacitors 381 in the fourth embodiment) are mounted. In a gaming machine provided with a substrate (first decorative substrate 56 in the first embodiment, second decorative substrate 57, light emitting substrate 301 in the fourth embodiment).
The predetermined electronic component has a configuration in which the dimension in the first direction orthogonal to the thickness direction of the predetermined electronic component is larger than the dimension in the second direction orthogonal to the thickness direction of the predetermined electronic component.
The predetermined substrate is
Predetermined connection portions (first pads 171a, 176a, 293a, 382a) to which the electrodes of the predetermined electronic component (first electrodes 85a, 87a, 291a, 381a, second electrodes 85b, 87b, 291b, 381b) are electrically connected. , 2nd pads 171b, 176b, 293b, 382b) and
Predetermined wiring patterns (first wiring pattern 172a, 181a, 294a, 386a, second wiring pattern 172b, 294b, 386b, second wiring pattern 181b, third wiring pattern 172c, 294c, 386c) drawn from the predetermined connection portion. , 4th wiring pattern 172d, 294d, 386d) and
Equipped with
A gaming machine characterized in that the drawing direction of the predetermined wiring pattern from the predetermined connection portion is a direction orthogonal to the first direction or a direction substantially orthogonal to the first direction.

According to the feature B1, the drawing direction of the predetermined wiring pattern from the predetermined connection portion is a direction orthogonal to the first direction or a direction substantially orthogonal to the first direction. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged. Further, by reducing the maximum value of the stress that can act on the predetermined electronic component itself, it is possible to prevent the predetermined electronic component itself from being damaged.

Feature B2. The predetermined connection portion and the predetermined wiring pattern are provided on a predetermined mounting surface (first mounting surface 84 of the first decorative substrate 56) which is a plate surface on one side of the predetermined board.
The gaming machine according to feature B1, wherein the predetermined wiring pattern is a wiring pattern extending linearly on the predetermined mounting surface.

According to the feature B2, the predetermined wiring pattern extends linearly on the predetermined mounting surface. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged, and it is possible to prevent the predetermined electronic component itself from being damaged.

Feature B3. The predetermined substrate is a non-penetrating predetermined via hole (via holes 174, 175) extending from the predetermined mounting surface in the thickness direction of the predetermined substrate, or a predetermined through hole (first through hole 383) penetrating the predetermined substrate in the thickness direction. , 2nd through hole 384)
The gaming machine according to feature B2, wherein the predetermined wiring pattern is a linear wiring pattern that electrically connects the predetermined connection portion and the predetermined via hole or the predetermined through hole on the predetermined mounting surface. ..

According to the feature B3, when a predetermined via hole or a predetermined through hole is provided on a predetermined board and the predetermined wiring pattern is a linear wiring pattern, the predetermined electronic component and the predetermined board are connected to each other when the predetermined board is distorted. The maximum value of the stress that can act on the location can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced.

Feature B4. The predetermined electronic component includes a first predetermined electrode (first electrode 85a, 87a, 291a, 381a) and a second predetermined electrode (second electrode 85b, 87b, 291b, 381b).
The predetermined substrate is
The first predetermined connection portion (first pad 171a, 176a, 293a, 382a), which is the predetermined connection portion to which the first predetermined electrode is electrically connected, and
The first predetermined wiring pattern (first wiring pattern 172a, 181a, 294a, 386a, second wiring pattern 172b, 294b, 386b), which is the predetermined wiring pattern electrically connected to the first predetermined connection portion,
The second predetermined connection portion (second pad 171b, 176b, 293b, 382b), which is the predetermined connection portion to which the second predetermined electrode is electrically connected, and
The second predetermined wiring pattern (second wiring pattern 181b, third wiring pattern 172c, 294c, 386c, fourth wiring pattern 172d, 294d, which is the predetermined wiring pattern electrically connected to the second predetermined connection portion, 386d) and
Equipped with
The drawing direction of the first predetermined wiring pattern from the first predetermined connection portion and the drawing direction of the second predetermined wiring pattern from the second predetermined connection portion are directions orthogonal to the first direction or substantially orthogonal to the first direction. The gaming machine according to any one of features B1 to B3.

According to the feature B4, the drawing direction of the first predetermined wiring pattern from the first predetermined connection portion and the drawing direction of the second predetermined wiring pattern from the second predetermined connection portion are orthogonal to the first direction or substantially orthogonal to each other. The direction. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged. Further, by reducing the maximum value of the stress that can act on the predetermined electronic component itself, it is possible to prevent the predetermined electronic component itself from being damaged.

Feature B5. The direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is pulled out is present when viewed from the center of the first predetermined connection portion is the second direction when viewed from the center of the second predetermined connection portion. The gaming machine according to feature B4, wherein the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn is in the same direction as the existing direction.

According to the feature B5, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion in the initial heating stage of the reflow process can be made uniform, and the temperature distribution is applied on the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the mode in which the solder paste is melted. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component is placed on one connection portion (first predetermined connection portion or second predetermined connection portion). It is possible to prevent so-called chip standing that rises only with one electrode (first predetermined electrode or second predetermined electrode). Therefore, it is possible to secure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. ..

Feature B6. The gaming machine according to feature B4 or B5, wherein the predetermined electronic component includes the first predetermined electrode and the second predetermined electrode as a pair of electrodes.

According to the feature B6, the configuration of the feature B4 is provided, and the direction in which the lead-out position of the first predetermined wiring pattern from the first predetermined connection portion exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion. Since the drawing position from the second predetermined connection portion of the second predetermined wiring pattern is in the same direction as the direction in which the second predetermined connection pattern exists, the pair of first predetermined connection portions and the second predetermined connection portion in the initial heating stage of the reflow process. The temperature distribution in the connection portion can be made uniform, and the mode in which the solder paste applied on the pair of the first predetermined connection portion and the second predetermined connection portion is melted can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component is placed on one connection portion (first predetermined connection portion or second predetermined connection portion). It is possible to prevent so-called chip standing that rises only with one electrode (first predetermined electrode or second predetermined electrode). Therefore, it is possible to secure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. ..

Feature B7. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the first predetermined wiring pattern.
The second predetermined connection portion is characterized in that it is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern. The gaming machine according to any one of B4 to B6.

According to the feature B7, a predetermined wiring pattern electrically connected to a metal region (first metal region or second metal region) having a large area in a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). The side where the lead-out portion of (the first predetermined wiring pattern or the second predetermined wiring pattern) exists tends to be delayed in temperature rise in the initial heating stage of the reflow process, but in the initial heating stage when viewed from the center of the first predetermined connection portion. The direction in which the side where the temperature rise is likely to be delayed is the same as the direction in which the side where the temperature rise is likely to be delayed exists in the initial stage of heating when viewed from the center of the second predetermined connection portion. As a result, the temperature distributions in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating can be made uniform.

Feature B8. The wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern.
The gaming machine according to any one of features B4 to B7, wherein the wiring pattern drawn out from the second predetermined connection portion is only the second predetermined wiring pattern.

According to the feature B8, the configuration of the feature B4 is provided, and the lead-out direction of the first predetermined wiring pattern from the first predetermined connection portion and the lead-out direction of the second predetermined wiring pattern from the second predetermined connection portion are in the first direction. In a configuration that is orthogonal or substantially orthogonal, the wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern, and the wiring pattern drawn out from the second predetermined connection portion is the first. 2 Only a predetermined wiring pattern. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced.

Feature B9. The predetermined substrate is
A third predetermined wiring pattern (second wiring pattern 172b, 294b, 386b) drawn from the first predetermined connection portion and
The fourth predetermined wiring pattern (fourth wiring pattern 172d, 294d, 386d) drawn from the second predetermined connection portion and
Equipped with
The drawing direction of the third predetermined wiring pattern from the first predetermined connection portion and the drawing direction of the fourth predetermined wiring pattern from the second predetermined connection portion are directions orthogonal to the first direction or substantially orthogonal to the first direction. The gaming machine according to any one of features B4 to B7.

According to the feature B9, the first predetermined wiring pattern, the second predetermined wiring pattern, the third predetermined wiring pattern, and the fourth predetermined wiring pattern extend in a direction orthogonal to the first direction or a direction substantially orthogonal to the first direction. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged, and it is possible to prevent the predetermined electronic component itself from being damaged.

Feature B10. The direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is pulled out exists when viewed from the center of the first predetermined connection portion is the direction in which the second predetermined connection portion is viewed from the center of the second predetermined connection portion. The direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn exists.
The direction in which the side of the first predetermined connection portion from which the third predetermined wiring pattern is drawn from the center of the first predetermined connection portion exists is the fourth direction as seen from the center of the second predetermined connection portion. The gaming machine according to feature B9, wherein the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn is in the same direction as the existing direction.

According to the feature B10, the configuration of the feature B4 is provided, and the direction in which the lead-out position of the first predetermined wiring pattern from the first predetermined connection portion is present when viewed from the center of the first predetermined connection portion is the second predetermined connection portion. In a configuration in which the drawing position of the second predetermined wiring pattern from the second predetermined connection portion is in the same direction as seen from the center of the first predetermined connection portion, the third predetermined wiring pattern is viewed from the center of the first predetermined connection portion. 1 The direction in which the withdrawal position from the predetermined connection portion exists is the same as the direction in which the withdrawal position from the second predetermined connection portion of the fourth predetermined wiring pattern exists when viewed from the center of the second predetermined connection portion. Therefore, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion in the initial heating stage of the reflow step can be made uniform, and the solder applied on the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the mode in which the paste melts. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and at the same time, so-called chip standing occurs in which the predetermined electronic component stands up on one predetermined connection portion with only one predetermined electrode. Can be prevented. Therefore, it is possible to secure an electrical connection area between the predetermined electrode and the predetermined connection portion.

Feature B11. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the first predetermined wiring pattern.
The third predetermined wiring pattern is not connected to a metal region having a larger area than the first predetermined connection portion.
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern.
The gaming machine according to feature B9 or B10, wherein the fourth predetermined wiring pattern is not connected to a metal region having a larger area than the second predetermined connection portion.

According to the feature B11, only the first predetermined wiring pattern among the first predetermined wiring pattern and the third predetermined wiring pattern drawn out from the first predetermined connection portion is connected to the metal region having a larger area than the first predetermined connection portion. Of the second predetermined wiring pattern and the fourth predetermined wiring pattern drawn out from the second predetermined connection portion, only the second predetermined wiring pattern is connected to the metal region having a larger area than the second predetermined connection portion. ing. Therefore, it is possible to reduce the possibility that a difference occurs between the mode in which the temperature of the first predetermined wiring pattern rises and the mode in which the temperature of the second predetermined wiring pattern rises in the initial heating stage of the reflow step. Further, the third wiring pattern drawn from the first predetermined connection portion and the fourth predetermined wiring pattern drawn from the second predetermined connection portion are not electrically connected to the metal region having a large area. Therefore, it is possible to reduce the possibility that a difference occurs between the mode in which the temperature of the third predetermined wiring pattern rises and the mode in which the temperature of the fourth predetermined wiring pattern rises in the initial heating stage of the reflow step. This makes it possible to prevent a difference between the temperature distribution in the first predetermined connection portion and the temperature distribution in the second predetermined connection portion.

Feature B12. The predetermined electronic component is a capacitor (bypass capacitor 85, 97 in the first embodiment, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) or a resistor (in the first embodiment). The gaming machine according to any one of features B1 to B11, which is a small chip resistor 87,101).

According to the feature B12, the configuration of the feature B1 is provided, and the drawing direction of the predetermined wiring pattern from the predetermined connection portion is a direction orthogonal to the first direction or a direction substantially orthogonal to the first direction. Therefore, when the predetermined board is distorted, the maximum value of the stress that can act on the connection point between the capacitor or the resistor and the predetermined board can be reduced, and the stress that can act on the capacitor or the resistor itself can be reduced. The maximum value can be reduced. By reducing the maximum value of the stress that can act on the connection point between the capacitor or the resistor and the predetermined board, it is possible to prevent the connection point between the capacitor or the resistor and the predetermined board from being damaged. Further, by reducing the maximum value of the stress that can act on the capacitor or the resistor itself, it is possible to prevent the capacitor or the resistor itself from being damaged.

It should be noted that any of the features A1 to A14, the features B1 to B12, the features C1 to C12, the features D1 to D12, the features E1 to E6, the features F1 to F15, the features G1, and the features H1 with respect to the configuration of the features B1 to B12. Or one or more configurations may be applied. This makes it possible to produce a synergistic effect due to the combined configuration.

<Characteristic C group>
Features C1. The first predetermined electronic component (capacitors 111, 112 in the first embodiment, the second LED driver 326 in the third embodiment, the connector 327, the LED chip 315-325) and the second predetermined electronic component smaller than the first predetermined electronic component. A predetermined board (first decorative board 56) on which electronic components (bypass capacitor 85 in the first embodiment, small chip resistor 87, bypass capacitor 328 in the third embodiment, small chip resistors 331-335) are mounted. , In a gaming machine equipped with a light emitting board 301)
The first predetermined electronic component is mounted on the first predetermined plate surface (second mounting surface 95, second light emitting surface 303), which is a plate surface on one side of the predetermined substrate.
The second predetermined electronic component is mounted on a second predetermined plate surface (first mounting surface 84, first light emitting surface 302) opposite to the first predetermined plate surface of the predetermined substrate.
A gaming machine characterized in that the second predetermined electronic component is not mounted in a region on the second predetermined plate surface on the back side of a region on the first predetermined plate surface on which the first predetermined electronic component is mounted. ..

According to the feature C1, since the second predetermined electronic component is not mounted in the area on the back side of the region on the second predetermined plate surface on which the first predetermined electronic component is mounted, the back side thereof. When a stress that distorts a predetermined substrate acts on a region, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged due to the influence of the stress, and the second predetermined electronic component itself is damaged. Can be prevented from doing so.

Feature C2. On the second predetermined plate surface, a region where the distance from the region on the back side of the region on the first predetermined plate surface on which the first predetermined electronic component is mounted is less than a predetermined distance (connector back side corresponding areas 203, 204, driver back side corresponding). The gaming machine according to feature C1, wherein the second predetermined electronic component is not mounted in the area 354, the LED back side corresponding area 361-371).

According to the feature C2, in the second predetermined plate surface, the second predetermined electronic component is also provided in the region where the distance from the region on the back side of the region on the first predetermined plate surface on which the first predetermined electronic component is mounted is less than the predetermined distance. Since it is not mounted, when a stress that distorts a predetermined substrate acts on a region where the distance from the backside region is less than a predetermined distance, the second predetermined electronic component and the predetermined substrate are affected by the stress. It is possible to prevent the connection point with and from being damaged, and it is possible to prevent the second predetermined electronic component itself from being damaged.

Feature C3. A specific electronic component (LED chip 310) larger than the second predetermined electronic component is mounted on the second predetermined plate surface side of the predetermined substrate.
In the second predetermined plate surface, the specific electron is placed in a region (LED back side corresponding region 368) in which the distance from the region on the back side of the region on the first predetermined plate surface on which the first predetermined electronic component is mounted is less than the predetermined distance. The gaming machine according to feature C2, which is characterized in that parts are mounted.

According to the feature C3, the configuration of the feature C2 is provided, and the distance from the region on the back side of the region on the first predetermined plate surface on which the first predetermined electronic component is mounted is less than the predetermined distance on the second predetermined plate surface. In a configuration in which the second predetermined electronic component is not mounted, the specific electronic component is mounted in a region where the distance from the back side region is less than the predetermined distance. As a result, it is possible to secure a wide area on the second predetermined plate surface where a specific electronic component larger than the second predetermined electronic component can be arranged.

Feature C4. A specific electronic component (LED chip 310) larger than the second predetermined electronic component is mounted on the second predetermined plate surface side of the predetermined substrate.
The features C1 to C3 characterized in that the specific electronic component is mounted in a region on the second predetermined plate surface on the back side of a region on the first predetermined plate surface on which the first predetermined electronic component is mounted. The gaming machine according to any one.

According to the feature C4, the configuration of the feature C1 is provided, and the second predetermined electronic component is mounted in the area behind the region where the first predetermined electronic component is mounted on the first predetermined plate surface on the second predetermined plate surface. In the non-configuration, the specific electronic component is mounted in the area on the back side. As a result, it is possible to secure a wide area on the second predetermined plate surface where a specific electronic component larger than the second predetermined electronic component can be arranged.

Feature C5. The predetermined substrate is
A specific connection portion (a pad connected to the power supply terminal 348 of the second LED driver 326, a pad connected to the GND terminal 349) connected to the electrodes of the first predetermined electronic component, and
Predetermined connection portions (first pad 382a, second pad 382b) connected to the electrodes (electrodes 381a, 381b of the bypass capacitor 381) of the second predetermined electronic component, and
A predetermined wiring pattern (second wiring pattern 386b, fourth wiring pattern 386d) that electrically connects the predetermined connection portion and the specific connection portion, and
Equipped with
The predetermined wiring pattern is electrically connected to the predetermined connection portion on the second predetermined plate surface outside the region on the back side of the region on which the first predetermined electronic component is mounted on the first predetermined plate surface. ,
The second predetermined electronic component is mounted in a region on the second predetermined plate surface on the back side of the region on the first predetermined plate surface on which the first predetermined electronic component is mounted (mounting area of the second LED driver 326). The gaming machine according to any one of features C1 to C4, which is characterized in that it is not.

According to the feature C5, the predetermined wiring pattern is extended to the outside of the region behind the region where the first predetermined electronic component is mounted on the first predetermined plate surface on the second predetermined plate surface and electrically connected to the predetermined connection portion. By doing so, it is possible to prevent the second predetermined electronic component from being arranged in the area on the back side.

Feature C6. The second predetermined electronic component is not mounted in the predetermined outer edge region (the region less than 10 mm from the outer edge of the first decorative substrate 56) in which the distance from the outer edge of the predetermined substrate is less than the predetermined distance. The gaming machine according to any one of C1 to C5.

According to the feature C6, in the predetermined substrate, the second predetermined electronic component is arranged so as to avoid the predetermined outer edge region. For this reason, when the predetermined board is handled, the operator's hand accidentally touches the second predetermined electronic component, and the connection point between the second predetermined electronic component and the predetermined board or the second predetermined electronic component itself is damaged. The possibility can be reduced. Further, in the method of manufacturing a predetermined board in which a plurality of predetermined boards are divided and a plurality of predetermined boards are taken out, the second predetermined electronic component and the predetermined board are connected when the collective board is divided. The stress that can act on the location can be reduced, and the stress that can act on the second predetermined electronic component itself can be reduced. As a result, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged when the assembly board is divided, and it is possible to prevent the second predetermined electronic component itself from being damaged.

Feature C7. The gaming machine according to feature C6, wherein the first predetermined electronic component is mounted on the predetermined outer edge region.

According to the feature C7, in a configuration having the configuration of the above feature C6 and in which the second predetermined electronic component is not mounted in the predetermined outer edge region, the predetermined outer edge is mounted by mounting the first predetermined electronic component in the predetermined outer edge region. Compared with a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the region, it is possible to secure a large area of the region in which the first predetermined electronic component can be mounted on the predetermined substrate.

Feature C8. The predetermined substrate is provided with a substrate fixing portion (fixing through hole 56d to 56g) for fixing the predetermined substrate.
Any of the features C1 to C7 characterized in that the second predetermined electronic component is not mounted in the fixed portion peripheral region (through hole peripheral regions 211a to 211d) in which the distance from the substrate fixing portion is less than a specific distance. The gaming machine according to 1.

According to the feature C8, since the second predetermined electronic component is arranged so as to avoid the area around the fixed portion, it may act on the connection point between the second predetermined electronic component and the predetermined board when the predetermined substrate is fixed. The stress can be reduced, and the stress that can act on the second predetermined electronic component itself can be reduced.

Feature C9. The gaming machine according to feature C8, wherein the first predetermined electronic component is mounted in a region around the fixed portion.

According to the feature C9, in a configuration having the configuration of the above feature C8 and in which the second predetermined electronic component is not mounted in the fixed portion peripheral region, the first predetermined electronic component is mounted in the fixed portion peripheral region. Compared with a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the area around the fixed portion, it is possible to secure a large area of the region where the first predetermined electronic component can be mounted on the predetermined board. can.

Feature C10. In the predetermined outer edge region (region less than 10 mm from the outer edge of the first decorative substrate 56) where the distance from the outer edge of the predetermined substrate is less than the predetermined distance on the first predetermined plate surface of the predetermined substrate, the second The specified electronic components are not mounted,
The gaming machine according to feature C8 or C9, wherein the substrate fixing portion is provided in the predetermined outer edge region.

According to the feature C10, by arranging the fixing portion in the predetermined outer edge region where the second predetermined electronic component cannot be arranged, it is possible to secure a wide area of the region where the second predetermined electronic component can be mounted on the predetermined substrate. Further, in the method of manufacturing a predetermined board in which a plurality of predetermined boards are divided and a plurality of predetermined boards are taken out, the second predetermined electronic component and the predetermined board are connected when the collective board is divided. The stress that can act on the location can be reduced, and the stress that can act on the second predetermined electronic component itself can be reduced. As a result, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged when the assembly board is divided, and it is possible to prevent the second predetermined electronic component itself from being damaged. Since the fixing portion is provided on the outer edge portion, it is possible to reduce the area of the region where the second predetermined electronic component cannot be mounted on the predetermined substrate.

Feature C11. The first predetermined electronic component is any one of features C1 to C10, characterized in that the first predetermined electronic component is a connector (connector 111, 112, 327), an IC (second LED driver 326), or an LED chip (LED chip 315-325). The gaming machine described in.

According to the feature C11, when the first predetermined electronic component is a connector, it is possible to reduce the tensile stress that may act on the connection point between the second predetermined electronic component and the predetermined board when the harness is attached to the connector. It is possible to reduce the compressive stress that may act on the connection point between the second predetermined electronic component and the predetermined board when the harness is removed from the connector. As a result, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged when the harness is attached to and detached from the connector, and it is possible to prevent the second predetermined electronic component itself from being damaged. Further, when the first predetermined electronic component is an IC, the IC is arranged so as to avoid the predetermined backside region. Therefore, when the IC generates heat and a thermal stress acts on the predetermined substrate, the stress is applied. It is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged due to the influence, and it is possible to prevent the second predetermined electronic component itself from being damaged. Furthermore, when the first predetermined electronic component includes the LED chip, the LED chip is arranged so as to avoid the predetermined backside region, so that the LED chip generates heat and a thermal stress acts on the predetermined substrate. In this case, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged due to the influence of the stress, and it is possible to prevent the second predetermined electronic component itself from being damaged.

Feature C12. The second predetermined electronic component is a capacitor (bypass capacitor 85, 97 in the first embodiment, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) or a resistor (first embodiment). The gaming machine according to any one of features C1 to C11, which is a small chip resistor 87,101) in the embodiment.

According to the feature C12, the capacitor or the resistor is mounted in the region behind the region in which the first predetermined electronic component is mounted on the first predetermined plate surface on the second predetermined plate surface, which has the configuration of the above feature C1. Since the configuration is not provided, when a stress that distorts the predetermined board acts on the region on the back side, it is possible to prevent the connection point between the capacitor or the resistor and the predetermined board from being damaged by the influence of the stress. , Capacitors or resistors themselves can be prevented from being damaged.

It should be noted that any of the features A1 to A14, the features B1 to B12, the features C1 to C12, the features D1 to D12, the features E1 to E6, the features F1 to F15, the features G1, and the features H1 with respect to the configuration of the features C1 to C12. Or one or more configurations may be applied. This makes it possible to produce a synergistic effect due to the combined configuration.

<Characteristic D group>
Feature D1. In a gaming machine provided with a predetermined substrate (first decorative substrate 56, second decorative substrate 57, light emitting substrate 301),
On the predetermined substrate, a first predetermined electronic component (capacitors 111 and 112 in the first embodiment, a second LED driver 326 in the third embodiment, a connector 327, an LED chip 315-325) and the first predetermined electronic component are provided. A plurality of second predetermined electronic components smaller than the components (bypass capacitor 85 in the first embodiment, small chip resistor 87, bypass capacitor 328 in the third embodiment, small chip resistors 331-335) are mounted. Has been
The plurality of second predetermined electronic components are mounted on the first plate surface (first mounting surface 84, first light emitting surface 302), which is one plate surface of the predetermined substrate, and the second predetermined electronic component is mounted on the predetermined substrate. A gaming machine characterized in that it is not mounted on the second plate surface (second mounting surface 95, second light emitting surface 303) side, which is the plate surface opposite to the first plate surface.

According to the feature D1, the second predetermined electronic component is integrated on the first plate surface side of the predetermined substrate, and is not mounted on the second plate surface side. Therefore, by handling the predetermined substrate so that the stress acting on the first plate surface side of the predetermined substrate becomes the minimum stress, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined substrate from being damaged. At the same time, it is possible to prevent the second predetermined electronic component itself from being damaged. For example, in a method for manufacturing a predetermined board in which a plurality of predetermined boards are connected to each other and a plurality of predetermined boards are taken out, the first plate surface on which the second predetermined electronic component is mounted has a valley shape (concave). By breaking the collective substrate so as to be, it is possible to prevent the tensile stress from acting on the connection point between the second predetermined electronic component and the predetermined substrate, and the tensile stress acts on the second predetermined electronic component itself. It can be prevented. In addition, the stress that can act on the connection point between the second predetermined electronic component and the predetermined substrate can be reduced, and the stress that can act on the second predetermined electronic component itself can be reduced. As a result, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged when the assembly board is divided, and it is possible to prevent the second predetermined electronic component itself from being damaged.

Feature D2. A plurality of the first predetermined electronic components are mounted on the predetermined board.
Among the plurality of first predetermined electronic components, some of the first predetermined electronic components are mounted on the second plate surface side.
The gaming machine according to feature D1, wherein some of the other first predetermined electronic components among the plurality of first predetermined electronic components are mounted on the first plate surface side.

According to the feature D2, in a configuration in which the first predetermined electronic component is mounted on both the first plate surface side and the second plate surface side of the predetermined substrate, the configuration of the feature D1 is provided, and a plurality of second predetermined electrons are provided. The components are integrated on the first plate surface side of the predetermined board, and are not mounted on the second plate surface side. Even if the first predetermined electronic component is mounted on both the first plate surface side and the second plate surface side of the predetermined board, the second predetermined electronic component is integrated on the first plate surface side of the predetermined board. Therefore, by handling the predetermined board so that the stress acting on the first plate surface side of the predetermined board becomes the minimum stress, the connection point between the second predetermined electronic component and the predetermined board is damaged. This can be prevented and the second predetermined electronic component itself can be prevented from being damaged. Further, by adopting a configuration in which the first predetermined electronic component is mounted on both the first plate surface side and the second plate surface side of the predetermined board, the degree of freedom in arranging the first predetermined electronic component on the predetermined board is increased. be able to.

Feature D3. Features D1 or D2 characterized in that the second predetermined electronic component is not mounted in the region on the first plate surface on the back side of the region on the second plate surface on which the first predetermined electronic component is mounted. The gaming machine described in.

According to the feature D3, when a stress that distorts a predetermined substrate acts on a region on the first plate surface on the back side of a region on the second plate surface on which the first predetermined electronic component is mounted, the stress is affected. It is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged, and it is possible to prevent the second predetermined electronic component itself from being damaged.

Feature D4. The predetermined substrate is
A specific connection portion (a pad connected to the power supply terminal 348 of the second LED driver 326, a pad connected to the GND terminal 349) electrically connected to the electrodes of the first predetermined electronic component, and
Predetermined connection portions (first pad 382a, second pad 382b) electrically connected to the electrodes (electrodes 381a, 381b of the bypass capacitor 381) of the second predetermined electronic component, and
Equipped with
The gaming machine according to any one of features D1 to D3, wherein the predetermined connection portion and the specific connection portion are electrically connected.

According to the feature D4, the second predetermined electronic component electrically connected to the first predetermined electronic component mounted on the second plate surface side is placed on the first plate surface side opposite to the second plate surface. By arranging the components on the first plate surface side, the second predetermined electronic component can be integrated, and the second predetermined electronic component can be not mounted on the second plate surface side.

Feature D5. The predetermined substrate is
A specific connection portion (a pad connected to the power supply terminal 348 of the second LED driver 326, a pad connected to the GND terminal 349) connected to the electrodes of the first predetermined electronic component, and
Predetermined connection portions (first pad 382a, second pad 382b) connected to the electrodes (electrodes 381a, 381b of the bypass capacitor 381) of the second predetermined electronic component, and
A predetermined wiring pattern (second wiring pattern 386b, fourth wiring pattern 386d) that electrically connects the predetermined connection portion and the specific connection portion, and
Equipped with
The predetermined wiring pattern is electrically connected to the predetermined connection portion on the first plate surface outside the region on the back side of the region on which the first predetermined electronic component is mounted on the second plate surface.
The second predetermined electronic component is not mounted in the area on the first plate surface on the back side of the region on the second plate surface on which the first predetermined electronic component is mounted (mounting area of the second LED driver 326). The gaming machine according to any one of features D1 to D4.

According to the feature D5, the predetermined wiring pattern is extended to the outside of the region on the back side of the region on the first plate surface where the first predetermined electronic component is mounted and electrically connected to the predetermined connection portion. Therefore, it is possible to prevent the second predetermined electronic component from being arranged in the area on the back side.

Feature D6. The second predetermined electronic component is a capacitor (bypass capacitor 85, 97 in the first embodiment, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) or a resistor (first embodiment). The gaming machine according to any one of features D1 to D5, which is a small chip resistor 87,101) in the embodiment.

According to the feature D6, the capacitor or the resistor has the configuration of the feature D1 and is integrated on the first plate surface side of the predetermined substrate, and is not mounted on the second plate surface side. Therefore, by handling the predetermined board so that the stress acting on the first plate surface side of the predetermined board becomes the minimum stress, it is possible to prevent the connection point between the capacitor or the resistor and the predetermined board from being damaged. , The capacitor or the resistor itself can be prevented from being damaged. For example, in a method of manufacturing a predetermined board in which a plurality of predetermined boards are connected to each other and a plurality of predetermined boards are taken out, the first plate surface on which a capacitor or a resistor is mounted has a valley shape (concave). By breaking the assembly board so as to be, it is possible to prevent the tensile stress from acting on the connection point between the capacitor or the resistor and the predetermined board, and also to prevent the tensile stress from acting on the capacitor or the resistor itself. can do. Further, the stress that can act on the connection point between the capacitor or the resistor and the predetermined substrate can be reduced, and the stress that can act on the capacitor or the resistor itself can be reduced. As a result, it is possible to prevent the connection point between the capacitor or the resistor and the predetermined board from being damaged when the assembly board is divided, and it is possible to prevent the capacitor or the resistor itself from being damaged.

Feature D7. The second predetermined electronic component is not mounted in the predetermined outer edge region (the region less than 10 mm from the outer edge of the first decorative substrate 56) in which the distance from the outer edge of the predetermined substrate is less than the predetermined distance. The gaming machine according to any one of D1 to D6.

According to the feature D7, on the predetermined substrate, the second predetermined electronic component is arranged so as to avoid the predetermined outer edge region. For this reason, when the predetermined board is handled, the operator's hand accidentally touches the second predetermined electronic component, and the connection point between the second predetermined electronic component and the predetermined board or the second predetermined electronic component itself is damaged. The possibility can be reduced. Further, in the method of manufacturing a predetermined board in which a plurality of predetermined boards are divided and a plurality of predetermined boards are taken out, the second predetermined electronic component and the predetermined board are connected when the collective board is divided. The stress that can act on the location can be reduced, and the stress that can act on the second predetermined electronic component itself can be reduced. As a result, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged when the assembly board is divided, and it is possible to prevent the second predetermined electronic component itself from being damaged.

Feature D8. The gaming machine according to feature D7, wherein the first predetermined electronic component is mounted on the predetermined outer edge region.

According to the feature D8, in a configuration having the configuration of the above feature D7 and in which the second predetermined electronic component is not mounted in the predetermined outer edge region, the predetermined outer edge is mounted by mounting the first predetermined electronic component in the predetermined outer edge region. Compared with a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the region, it is possible to secure a large area of the region in which the first predetermined electronic component can be mounted on the predetermined substrate.

Feature D9. The predetermined substrate is provided with a substrate fixing portion (fixing through hole 56d to 56g) for fixing the predetermined substrate.
The second predetermined electronic component is characterized in that the second predetermined electronic component is arranged so as to avoid the fixed portion peripheral region (through hole peripheral regions 211a to 211d) in which the distance from the substrate fixing portion is less than a specific distance. The gaming machine according to any one.

According to the feature D9, since the second predetermined electronic component is arranged so as to avoid the area around the fixed portion, it may act on the connection point between the second predetermined electronic component and the predetermined board when the predetermined substrate is fixed. The stress can be reduced, and the stress that can act on the second predetermined electronic component itself can be reduced.

Feature D10. The gaming machine according to feature D9, wherein the first predetermined electronic component is mounted in a region around the fixed portion.

According to the feature D10, in a configuration having the configuration of the above feature D9 and in which the second predetermined electronic component is not mounted in the fixed portion peripheral region, the first predetermined electronic component is mounted in the fixed portion peripheral region. Compared with a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the area around the fixed portion, it is possible to secure a large area of the region where the first predetermined electronic component can be mounted on the predetermined board. can.

Feature D11. In the predetermined outer edge region (region less than 10 mm from the outer edge of the first decorative substrate 56) where the distance from the outer edge of the predetermined substrate is less than the predetermined distance on the first plate surface of the predetermined substrate, the second predetermined No electronic components are mounted
The gaming machine according to feature D9 or D10, wherein the substrate fixing portion is provided in the predetermined outer edge region.

According to the feature D11, by arranging the fixing portion in the predetermined outer edge region where the second predetermined electronic component cannot be arranged, it is possible to secure a wide area of the region where the second predetermined electronic component can be mounted on the predetermined substrate. Further, in the method of manufacturing a predetermined board in which a plurality of predetermined boards are divided and a plurality of predetermined boards are taken out, the second predetermined electronic component and the predetermined board are connected when the collective board is divided. The stress that can act on the location can be reduced, and the stress that can act on the second predetermined electronic component itself can be reduced. As a result, it is possible to prevent the connection point between the second predetermined electronic component and the predetermined board from being damaged when the assembly board is divided, and it is possible to prevent the second predetermined electronic component itself from being damaged. Since the fixing portion is provided on the outer edge portion, it is possible to reduce the area of the region where the second predetermined electronic component cannot be mounted on the predetermined substrate.

Feature D12. A specific capacitor (bypass capacitor 352 in the third embodiment) is mounted as the first predetermined electronic component on the second plate surface side of the predetermined board, and the first plate surface side of the predetermined substrate. 2. A configuration in which a predetermined capacitor (bypass capacitor 328 in the third embodiment) is mounted as a predetermined electronic component, and a specific resistor (third) as the first predetermined electronic component on the second plate surface side of the predetermined substrate. The chip resistors 336 to 346 in the third embodiment are mounted, and a predetermined resistor (small chip resistor 331 in the third embodiment) is mounted on the first plate surface side of the predetermined substrate as the second predetermined electronic component. The gaming machine according to any one of features D1 to D11, characterized in that it has at least one of the configurations to which ~ 335) is mounted.

According to the feature D12, in the configuration in which the specific capacitor which is the first predetermined electronic component and the predetermined capacitor which is the second predetermined electronic component are mounted on the predetermined board, the predetermined capacitor is arranged on the first plate surface side. The second predetermined electronic component can be integrated on the first plate surface side, and the second predetermined electronic component can be not mounted on the second plate surface side. Further, in a configuration in which a specific resistor which is a first predetermined electronic component and a predetermined resistor which is a second predetermined electronic component are mounted on a predetermined board, the predetermined resistor is arranged on the first plate surface side. The second predetermined electronic component can be integrated on the first plate surface side, and the second predetermined electronic component can be not mounted on the second plate surface side.

It should be noted that, with respect to the configuration of the features D1 to D12, any one of the features A1 to A14, the features B1 to B12, the features C1 to C12, the features D1 to D12, the features E1 to E6, the features F1 to F15, the features G1, and the features H1. Or one or more configurations may be applied. This makes it possible to produce a synergistic effect due to the combined configuration.

<Characteristic E group>
Features E1. In a gaming machine provided with a predetermined substrate (first decorative substrate 56),
The predetermined electronic component (LED driver 126, LED chip 142) and a second predetermined electronic component (bypass capacitor 85, small chip resistor 87) smaller than the first predetermined electronic component are mounted on the predetermined board. Implemented and
A plurality of connection portions (first pad 178a, second pad) to which a plurality of electrodes (terminals 151-162, first electrode 142a, second electrode 142b) of the first predetermined electronic component are electrically connected on the predetermined substrate. A resist is provided between 178b).
A plurality of connection portions (first pad 171a, first pad 176a) to which a plurality of electrodes (first electrodes 85a, 87a, second electrodes 85b, 87b) of the second predetermined electronic component are electrically connected on the predetermined substrate. , 2nd pad 171b, 2nd pad 176b), the resist is not provided.
An outer shape display (outer shape silk 213, 215) for partitioning the region is provided around the region on which the first predetermined electronic component is mounted on the predetermined substrate.
A gaming machine characterized in that an outer shape display for partitioning the region is not provided around a region on which the second predetermined electronic component is mounted on the predetermined substrate.

According to the feature E1, in the visual confirmation after mounting the first predetermined electronic component and the second predetermined electronic component, the outer shape display provided around the first predetermined electronic component is used to obtain the first predetermined electronic component. It is possible to confirm whether or not a mounting omission has occurred, and it is also possible to confirm whether or not a misalignment of the first predetermined electronic component has occurred. By configuring the configuration so that the outer shape display is not provided around the second predetermined electronic component, it is possible to prevent a gap from being generated between the predetermined substrate and the metal mask in the area where the second predetermined electronic component is mounted. .. This makes it possible to prevent the solder paste from wrapping around between the connecting portions to which the resist is not applied and causing the two connecting portions to come into electrical contact with each other.

Feature E2. In the predetermined board, outside the region where the second predetermined electronic component is mounted, a component identification display (identification silk) indicating that the electronic component mounted in the region is the second predetermined electronic component. 217, 218) The gaming machine according to feature E1, characterized in that it is provided.

According to the feature E2, it is possible to visually confirm that the electronic component mounted on the predetermined board is the second predetermined electronic component based on the component identification display. Further, in a configuration having the configuration of the above feature E1 and not providing an outer shape display for partitioning the region around the region on which the second predetermined electronic component is mounted on the predetermined substrate, the second component identification display is used. It is possible to confirm whether or not a predetermined electronic component is mounted.

Feature E3. Outside the region where the first predetermined electronic component is mounted on the predetermined board, a first component identification display (for identification) indicating that the electronic component mounted in the region is the first predetermined electronic component. Silk 214,216) is provided,
A second component identification display (for identification) indicating that the electronic component mounted on the predetermined board is the second predetermined electronic component outside the region on which the second predetermined electronic component is mounted. Silk 217,218) is provided,
The gaming machine according to feature E1 or E2, wherein the character size of the second component identification display is the same as the character size of the first component identification display.

According to the feature E3, it is possible to visually confirm that the electronic component mounted on the predetermined board is the first predetermined electronic component based on the first component identification display, and the second component identification display can be used. Based on this, it is possible to visually confirm that the electronic component mounted on the predetermined board is the second predetermined electronic component. Further, in a configuration having the configuration of the above feature E1 and not providing an outer shape display for partitioning the region around the region on which the second predetermined electronic component is mounted on the predetermined substrate, the second component identification display is used. It is possible to confirm whether or not a predetermined electronic component is mounted.

The second predetermined electronic component has the configuration of the above feature E1 and is smaller than the first predetermined electronic component, but the character size of the second component identification display is the same as the character size of the first component identification display. Therefore, it is possible to easily visually confirm that the electronic component mounted on the predetermined board is the second predetermined electronic component.

Feature E4. A predetermined control component (LED driver 126 in the first embodiment, second LED driver 326 in the fourth embodiment) is mounted on the predetermined board.
The predetermined substrate is
Predetermined connection portions (second pads 171b, 382b) electrically connected to the electrodes of the second predetermined electronic component (second electrode 85b of the bypass capacitor 85, second electrode 381b of the bypass capacitor 381), and
A specific connection portion (a pad electrically connected to the power supply terminal 151, a pad electrically connected to the power supply terminal 348) electrically connected to a predetermined terminal (power supply terminal 151, 348) of the predetermined control component. )When,
Equipped with
The predetermined connection portion and the specific connection portion are electrically connected to each other.
The gaming machine according to any one of features E1 to E3, wherein no control component (IC) other than the predetermined control component is arranged between the predetermined terminal and the second predetermined electronic component. ..

According to the feature E4, it is possible to prevent other control components from malfunctioning due to the influence of the noise component at the predetermined terminal of the predetermined control component.

Feature E5. The gaming machine according to feature E4, wherein no electronic component other than the predetermined control component is arranged between the predetermined terminal and the second predetermined electronic component.

According to the feature E5, it is possible to prevent other electronic components from malfunctioning due to the influence of the noise component at the predetermined terminal of the predetermined control component.

Feature E6. The second predetermined electronic component is a capacitor (bypass capacitor 85, 97 in the first embodiment, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) or a resistor (first embodiment). The gaming machine according to any one of features E1 to E5, which is a small chip resistor 87,101) in the embodiment.

According to the feature E6, the configuration of the feature E1 is provided, and it is possible to prevent a gap from being generated between the predetermined substrate and the metal mask in the region where the capacitor or the resistor is mounted. This makes it possible to prevent the solder paste from wrapping around between the connecting portions to which the resist is not applied and causing the two connecting portions to come into electrical contact with each other.

It should be noted that, with respect to the configuration of the features E1 to E6, any one of the features A1 to A14, the features B1 to B12, the features C1 to C12, the features D1 to D12, the features E1 to E6, the features F1 to F15, the features G1, and the features H1. Or one or more configurations may be applied. This makes it possible to produce a synergistic effect due to the combined configuration.

<Characteristic F group>
Features F1. Predetermined boards (first decorative board 56, second) on which predetermined electronic components (bypass capacitors 85, 97 in the first embodiment, small chip resistors 87, 101, bypass capacitors 381 in the fourth embodiment) are mounted. In a gaming machine provided with a decorative substrate 57 and a light emitting substrate 301),
The predetermined electronic component has a dimension in the first direction (longitudinal direction of bypass capacitors 85, 97, 381, longitudinal direction of small chip resistors 87, 101) orthogonal to the thickness direction of the predetermined electronic component. The configuration is larger than the dimensions of the second direction (the short side of the bypass capacitors 85, 97, 381 and the short side of the small chip resistors 87, 101) orthogonal to the thickness direction of the component.
The predetermined substrate has dimensions in a predetermined direction (first direction DR1, major axis direction LD, LDA) along the plate surface of the predetermined substrate in the direction along the plate surface of the predetermined substrate and is in the predetermined direction. The configuration is larger than the dimensions of the specific directions (second direction DR2, minor axis direction SD, SDA) that are orthogonal to each other.
The gaming machine is characterized in that the predetermined electronic component is mounted on the predetermined board so that the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined board.

According to the feature F1, since the predetermined electronic component is mounted on the predetermined board so that the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined board, the first direction of the predetermined electronic component is Compared to a configuration in which a predetermined electronic component is mounted on a predetermined board in a manner not parallel to the predetermined direction of the predetermined board, it may act on a connection point between the predetermined electronic component and the predetermined board when the predetermined board is distorted. The stress can be reduced, and the stress that can act on the predetermined electronic component itself can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged. Further, by reducing the stress that can act on the predetermined electronic component itself when the predetermined substrate is distorted, it is possible to prevent the predetermined electronic component itself from being damaged.

Feature F2. The predetermined board includes specific electronic components (LED chips 317, 324, chip resistors 338, 345) that are larger than the predetermined electronic components.
The specific electronic component has a specific first direction (longitudinal direction of LED chips 317,324, longitudinal direction of chip resistors 338,345) orthogonal to the thickness direction of the specific electronic component. The configuration is larger than the dimensions of the specific second direction (the short direction of the LED chips 317 and 324 and the short direction of the chip resistors 338 and 345) orthogonal to the thickness direction.
The gaming machine according to feature F1, wherein the specific electronic component is mounted on the predetermined board in such a manner that the specific first direction of the specific electronic component is not parallel to the predetermined direction of the predetermined board. ..

According to the feature F2, in a configuration in which the specific electronic component is mounted on the predetermined board in such a manner that the specific first direction of the specific electronic component is not parallel to the predetermined direction of the predetermined board, the feature F1 is provided and predetermined. The electronic component is mounted on the predetermined board so that the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined board. Therefore, in a configuration in which the stress that can act on the connection point between the predetermined electronic component and the predetermined board and the stress that can act on the predetermined electronic component itself when the predetermined substrate is distorted are reduced, the specific electronic component on the predetermined substrate is used. It is possible to increase the degree of freedom of implementation of.

Feature F3. The gaming machine according to feature F1 or F2, wherein the outer shape of the predetermined substrate is not rectangular or substantially rectangular.

According to the feature F3, in a configuration in which the outer shape of the predetermined substrate is not rectangular or substantially rectangular, the configuration of the feature F1 is provided, and the predetermined electronic component has a predetermined electronic component in which the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined board. It is mounted on a predetermined board so as to be. Therefore, as compared with the configuration in which the first direction of the predetermined electronic component is orthogonal to the predetermined direction of the predetermined substrate, the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate when the predetermined substrate is distorted. Can be reduced, and the stress that can act on the predetermined electronic component itself can be reduced.

Features F4. The predetermined electronic component is a capacitor (bypass capacitor 85, 97 in the first embodiment, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) or a resistor (in the first embodiment). The gaming machine according to any one of features F1 to F3, which is a small chip resistor 87,101).

According to the feature F4, the configuration of the feature F1 is provided, and the capacitor or the resistor is mounted on the predetermined board in such a manner that the first direction of the capacitor or the resistor is not parallel to the predetermined direction of the predetermined board. Therefore, when the predetermined board is distorted, the stress that can act on the connection point between the capacitor or the resistor and the predetermined board can be reduced, and the stress that can act on the capacitor or the resistor itself can be reduced. .. By reducing the stress that can act on the connection point between the capacitor or the resistor and the predetermined board when the predetermined board is distorted, it is possible to prevent the connection point between the capacitor or the resistor and the predetermined board from being damaged. Further, by reducing the stress that can act on the capacitor or the resistor itself when the predetermined substrate is distorted, it is possible to prevent the capacitor or the resistor itself from being damaged.

Feature F5. The predetermined substrate is
Predetermined connection portions (first pads 171a, 176a, 293a, 382a) to which the electrodes of the predetermined electronic component (first electrodes 85a, 87a, 291a, 381a, second electrodes 85b, 87b, 291b, 381b) are electrically connected. , 2nd pads 171b, 176b, 293b, 382b) and
Predetermined wiring patterns (first wiring pattern 172a, 181a, 294a, 386a, second wiring pattern 172b, 294b, 386b, second wiring pattern 181b, third wiring pattern 172c, 294c, 386c) drawn from the predetermined connection portion. , 4th wiring pattern 172d, 294d, 386d) and
Equipped with
The gaming machine according to any one of features F1 to F4, wherein the predetermined wiring pattern is drawn out from the predetermined connection portion in a direction orthogonal to the first direction or a direction substantially orthogonal to the first direction.

According to the feature F5, the predetermined wiring pattern extends in a direction orthogonal to the first direction or a direction substantially orthogonal to the first direction. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged, and it is possible to prevent the predetermined electronic component itself from being damaged.

Feature F6. The predetermined connection portion and the predetermined wiring pattern are provided on a predetermined mounting surface (first mounting surface 84 of the first decorative substrate 56) which is a plate surface on one side of the predetermined board.
The gaming machine according to feature F5, wherein the predetermined wiring pattern is a wiring pattern extending linearly on the predetermined mounting surface.

According to the feature F6, the predetermined wiring pattern extends linearly on the predetermined mounting surface. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged, and it is possible to prevent the predetermined electronic component itself from being damaged.

Feature F7. The predetermined substrate is a non-penetrating predetermined via hole (via holes 174, 175) extending from the predetermined mounting surface in the thickness direction of the predetermined substrate or a predetermined through hole (first through hole 383) penetrating the predetermined substrate in the thickness direction. , 2nd through hole 384)
The gaming machine according to feature F6, wherein the predetermined wiring pattern is a linear wiring pattern that electrically connects the predetermined connection portion and the predetermined via hole or the predetermined through hole on the predetermined mounting surface. ..

According to the feature F7, when a predetermined via hole or a predetermined through hole is provided on a predetermined board and the predetermined wiring pattern is a linear wiring pattern, the predetermined electronic component and the predetermined board are connected to each other when the predetermined board is distorted. The maximum value of the stress that can act on the location can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced.

Feature F8. The predetermined electronic component includes a first predetermined electrode (first electrode 85a, 87a, 291a, 381a) and a second predetermined electrode (second electrode 85b, 87b, 291b, 381b).
The predetermined substrate is
A first predetermined connection portion (first pad 171a, 176a, 293a, 382a) to which the first predetermined electrode is electrically connected, and
The first predetermined wiring pattern (first wiring pattern 172a, 181a, 294a, 386a, second wiring pattern 172b, 294b, 386b) electrically connected to the first predetermined connection portion.
A second predetermined connection portion (second pad 171b, 176b, 293b, 382b) to which the second predetermined electrode is electrically connected and a second predetermined connection portion (second pad 171b, 176b, 293b, 382b).
The second predetermined wiring pattern (second wiring pattern 181b, third wiring pattern 172c, 294c, 386c, fourth wiring pattern 172d, 294d, 386d) electrically connected to the second predetermined connection portion.
Equipped with
The drawing direction of the first predetermined wiring pattern from the first predetermined connection portion and the drawing direction of the second predetermined wiring pattern from the second predetermined connection portion are directions orthogonal to the first direction of the predetermined electronic component. The gaming machine according to any one of features F1 to F7, characterized in that the directions are substantially orthogonal to each other.

According to the feature F8, the drawing direction of the first predetermined wiring pattern from the first predetermined connection portion and the drawing direction of the second predetermined wiring pattern from the second predetermined connection portion are orthogonal to the first direction or substantially orthogonal to each other. The direction. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged, and it is possible to prevent the predetermined electronic component itself from being damaged.

Features F9. The direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is pulled out is present when viewed from the center of the first predetermined connection portion is the second direction when viewed from the center of the second predetermined connection portion. The gaming machine according to feature F8, wherein the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn is in the same direction as the existing direction.

According to the feature F9, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion in the initial heating stage of the reflow process can be made uniform, and the temperature distribution is applied on the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the mode in which the solder paste is melted. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component is placed on one connection portion (first predetermined connection portion or second predetermined connection portion). It is possible to prevent so-called chip standing that rises only with one electrode (first predetermined electrode or second predetermined electrode). Therefore, it is possible to secure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. ..

Feature F10. The gaming machine according to feature F8 or F9, wherein the predetermined electronic component includes the first predetermined electrode and the second predetermined electrode as a pair of electrodes.

According to the feature F10, the configuration of the feature F8 is provided, and the direction in which the lead-out position of the first predetermined wiring pattern from the first predetermined connection portion exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion. Since the drawing position from the second predetermined connection portion of the second predetermined wiring pattern is in the same direction as the direction in which the second predetermined connection pattern is present, the pair of first predetermined connection portions and the second predetermined connection portion in the initial heating stage of the reflow process. The temperature distribution in the connection portion can be made uniform, and the mode in which the solder paste applied on the pair of the first predetermined connection portion and the second predetermined connection portion is melted can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component is placed on one connection portion (first predetermined connection portion or second predetermined connection portion). It is possible to prevent so-called chip standing that rises only with one electrode (first predetermined electrode or second predetermined electrode). Therefore, it is possible to secure an electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure an electrical connection area between the second predetermined electrode and the second predetermined connection portion. ..

Features F11. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the first predetermined wiring pattern.
The second predetermined connection portion is characterized in that it is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern. The gaming machine according to any one of F8 to F10.

According to the feature F11, a predetermined wiring pattern electrically connected to a metal region (first metal region or second metal region) having a large area in a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). The side where the lead-out portion of (the first predetermined wiring pattern or the second predetermined wiring pattern) exists tends to be delayed in temperature rise in the initial heating stage of the reflow process, but in the initial heating stage when viewed from the center of the first predetermined connection portion. The direction in which the side where the temperature rise tends to be delayed exists is the same as the direction in which the side where the temperature rise tends to be delayed exists in the initial stage of heating when viewed from the center of the second predetermined connection portion. As a result, the temperature distributions in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating can be made uniform.

Feature F12. The wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern.
The gaming machine according to any one of features F8 to F11, wherein the wiring pattern drawn out from the second predetermined connection portion is only the second predetermined wiring pattern.

According to the feature F12, the configuration of the feature F8 is provided, and the lead-out direction of the first predetermined wiring pattern from the first predetermined connection portion and the lead-out direction of the second predetermined wiring pattern from the second predetermined connection portion are in the first direction. In a configuration that is orthogonal or substantially orthogonal, the wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern, and the wiring pattern drawn out from the second predetermined connection portion is Only the second predetermined wiring pattern. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced.

Feature F13. The predetermined substrate is
A third predetermined wiring pattern (second wiring pattern 172b, 294b, 386b) drawn from the first predetermined connection portion and
The fourth predetermined wiring pattern (fourth wiring pattern 172d, 294d, 386d) drawn from the second predetermined connection portion and
Equipped with
The drawing direction of the third predetermined wiring pattern from the first predetermined connection portion and the drawing direction of the fourth predetermined wiring pattern from the second predetermined connection portion are directions orthogonal to the first direction of the predetermined electronic component. The gaming machine according to any one of features F8 to F11, characterized in that the directions are substantially orthogonal to each other.

According to the feature F13, the first predetermined wiring pattern, the second predetermined wiring pattern, the third predetermined wiring pattern, and the fourth predetermined wiring pattern extend in a direction orthogonal to the first direction or a direction substantially orthogonal to the first direction. Therefore, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connection point between the predetermined electronic component and the predetermined substrate can be reduced, and the maximum value of the stress that can act on the predetermined electronic component itself can be reduced. Can be reduced. As a result, it is possible to prevent the connection point between the predetermined electronic component and the predetermined board from being damaged, and it is possible to prevent the predetermined electronic component itself from being damaged.

Feature F14. The direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is pulled out exists when viewed from the center of the first predetermined connection portion is the direction in which the second predetermined connection portion is viewed from the center of the second predetermined connection portion. The direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn exists.
The direction in which the side of the first predetermined connection portion from which the third predetermined wiring pattern is drawn from the center of the first predetermined connection portion exists is the fourth direction as seen from the center of the second predetermined connection portion. The gaming machine according to feature F13, wherein the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn is in the same direction as the existing direction.

According to the feature F14, the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion in the initial heating stage of the reflow process can be made uniform, and above the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the mode in which the solder paste applied to is melted. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and at the same time, so-called chip standing occurs in which the predetermined electronic component stands up on one predetermined connection portion with only one predetermined electrode. Can be prevented. Therefore, it is possible to secure an electrical connection area between the predetermined electrode and the predetermined connection portion.

Feature F15. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion via the predetermined wiring pattern.
The third predetermined wiring pattern is not electrically connected to a metal region having a larger area than the first predetermined connection portion.
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the predetermined wiring pattern.
The gaming machine according to feature F13 or F14, wherein the fourth predetermined wiring pattern is not electrically connected to a metal region having a larger area than the second predetermined connection portion.

According to the feature F15, a predetermined wiring pattern electrically connected to a metal region (first metal region or second metal region) having a large area in a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). The side where the lead-out portion of (the first predetermined wiring pattern or the second predetermined wiring pattern) exists tends to be delayed in temperature rise in the initial heating stage of the reflow process, but in the initial heating stage when viewed from the center of the first predetermined connection portion. The direction in which the side where the temperature rise tends to be delayed exists is the same as the direction in which the side where the temperature rise tends to be delayed exists in the initial stage of heating when viewed from the center of the second predetermined connection portion. Further, the direction in which the side where the third predetermined wiring pattern that is not electrically connected to the metal region having a large area from the first predetermined connection portion when viewed from the center of the first predetermined connection portion exists is present. , Same as the direction in which the side where the fourth predetermined wiring pattern that is not electrically connected to the metal region having a large area from the second predetermined connection portion when viewed from the center of the second predetermined connection portion is drawn out exists. The direction of. Therefore, the temperature distributions in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating can be made uniform.

It should be noted that, with respect to the configuration of the features F1 to F15, any one of the features A1 to A14, the features B1 to B12, the features C1 to C12, the features D1 to D12, the features E1 to E6, the features F1 to F15, the features G1, and the features H1. Or one or more configurations may be applied. This makes it possible to produce a synergistic effect due to the combined configuration.

<Characteristic G group>
Features G1. Predetermined control components (LED driver 126 in the first embodiment, second LED driver 326 in the fourth embodiment) and predetermined capacitors (bypass capacitor 85 in the first embodiment, bypass capacitor 381 in the fourth embodiment) In a gaming machine provided with a predetermined board (first decorative board 56, light emitting board 301) mounted.
The predetermined board has a power supply wiring pattern (third wiring pattern 172c, 386c, fourth wiring pattern 172d,) for supplying a driving power source for the predetermined control component to a predetermined terminal (power supply terminal 151, 348) of the predetermined control component. 386d) is provided,
The predetermined capacitor is electrically connected to the power supply wiring pattern and ground (GND plane layer 93).
A gaming machine characterized in that no control component (IC) other than the predetermined control component is arranged between the predetermined terminal and the predetermined capacitor.

Features G1. By absorbing the noise component of the drive power supply supplied to the predetermined terminal of the predetermined control component into the predetermined capacitor, it is possible to prevent the predetermined control component from malfunctioning due to the influence of the noise component. Further, by absorbing the noise component generated from the predetermined control component into the predetermined capacitor, it is possible to prevent other electronic components from malfunctioning due to the influence of the noise component.

It should be noted that, with respect to the configuration of the feature G1, any one of the features A1 to A14, the features B1 to B12, the features C1 to C12, the features D1 to D12, the features E1 to E6, the features F1 to F15, the features G1, and the features H1. Alternatively, a plurality of configurations may be applied. This makes it possible to produce a synergistic effect due to the combined configuration.

<Characteristic H group>
Features H1. In a gaming machine provided with a predetermined substrate (first decorative substrate 56),
The predetermined board has a first predetermined electronic component (LED driver 126, LED chip 142 in the first embodiment) and a second predetermined electronic component smaller than the first predetermined electronic component (bypass in the first embodiment). A capacitor 85, a small chip resistor 87), and are mounted.
An outer shape display (outer shape silk 213, 215) for partitioning the region is provided around the region on which the first predetermined electronic component is mounted on the predetermined substrate.
A gaming machine characterized in that an outer shape display for partitioning the region is not provided around a region on which the second predetermined electronic component is mounted on the predetermined substrate.

According to the feature H1, in the visual confirmation after mounting the first predetermined electronic component and the second predetermined electronic component, the first predetermined electronic component is used by utilizing the external shape display provided around the first predetermined electronic component. It is possible to confirm whether or not the mounting omission has occurred, and it is also possible to confirm whether or not the misalignment of the first predetermined electronic component has occurred. The second predetermined electronic component has a smaller configuration than the first predetermined electronic component, and by not providing an external shape display around the second predetermined electronic component, a mounting omission of the predetermined electronic component actually occurs in the visual confirmation. However, it is possible to prevent the operator from erroneously recognizing that a predetermined electronic component is mounted by looking only at the outline display.

It should be noted that, with respect to the configuration of the feature H1, any one of the features A1 to A14, the features B1 to B12, the features C1 to C12, the features D1 to D12, the features E1 to E6, the features F1 to F15, the features G1, and the features H1. Alternatively, a plurality of configurations may be applied. This makes it possible to produce a synergistic effect due to the combined configuration.

According to the inventions relating to the feature A group, the feature B group, the feature C group, the feature D group, the feature E group, the feature F group, the feature G group, and the feature H group, the following problems are solved. It is possible to solve it.

Pachinko machines, slot machines, and the like are known as a type of gaming machine. In these gaming machines, it is known that a lottery is performed based on the fact that a predetermined lottery condition is satisfied, and a privilege is given to a player according to the result of the lottery. In addition, it is common to have an effect for making the player predict or recognize the result of the lottery. These gaming machines include a substrate on which electronic components for advancing the game and electronic components for executing the effect are mounted.

Specifically, for pachinko machines, for example, a lottery is performed based on the fact that a game ball enters a ball entry portion provided in a game area, and a variable display of a pattern is performed on the display surface of a display device, and the lottery is performed. When the winning result is obtained, the combination of specific patterns and the like is finally stopped and displayed on the display surface, and it is known that the player shifts to a special gaming state that is advantageous to the player. Then, when the state shifts to the special gaming state, for example, the opening and closing of the ball entry device provided in the game area is started, and the game ball is paid out based on the entry into the ball entry device. ing.

Here, in a gaming machine such as the above example, it is necessary to mount electronic components on a substrate, and there is still room for improvement in this respect.

The following shows the basic configuration of a gaming machine to which each of the above features can be applied or is applied to each feature.

Pachinko gaming machine: An operating means operated by a player, a game ball launching means for launching a game ball based on the operation of the operating means, a ball passage for guiding the launched game ball to a predetermined game area, and a game. A gaming machine that includes each gaming component arranged in an area and grants a privilege to a player when a gaming ball passes through a predetermined passing portion of each gaming component.

Rotating machine such as a slot machine: Equipped with a picture display device that variably displays a plurality of pictures, the variable display of the plurality of pictures is started due to the operation of the start operation means, and is caused by the operation of the stop operation means. A gaming machine in which the variable display of the plurality of symbols is stopped after a lapse of a predetermined time, and a privilege is given to the player according to the symbols after the stop.

10 ... Pachinko machine, 56 ... 1st decorative board, 56d-56g ... Fixed through hole, 57 ... 2nd decorative board, 84 ... 1st mounting surface, 85 ... Bypass capacitor, 85a ... 1st electrode, 85b ... 2nd electrode , 87 ... Small chip resistor, 87a ... 1st electrode, 87b ... 2nd electrode, 93 ... GND plane layer, 94 ... Power plane layer, 95 ... 2nd mounting surface, 97 ... Bypass capacitor, 101 ... Small chip resistor , 111, 112 ... Connector, 126 ... LED driver, 142 ... LED chip, 142a ... 1st electrode, 142b ... 2nd electrode, 151 ... Power supply terminal, 152, 153 ... Terminal, 154 ... GND terminal, 155-162 ... Terminal , 171a ... 1st pad, 171b ... 2nd pad, 172a ... 1st wiring pattern, 172b ... 2nd wiring pattern, 172c ... 3rd wiring pattern, 172d ... 4th wiring pattern, 174,175 ... Via hole, 176a ... 1 pad, 176b ... 2nd pad, 178a ... 1st pad, 178b ... 2nd pad, 181a ... 1st wiring pattern, 181b ... 2nd wiring pattern, 203, 204 ... Connector back side corresponding area, 211a to 211d ... Through hole Peripheral area, 213 ... outer silk, 214 ... identification silk, 215 ... outer silk, 216 to 218 ... identification silk, 291 ... bypass capacitor, 291a ... first electrode, 291b ... second electrode, 293a ... first pad, 293b ... 2nd pad, 294a ... 1st wiring pattern, 294b ... 2nd wiring pattern, 294c ... 3rd wiring pattern, 294d ... 4th wiring pattern, 301 ... light emitting board, 302 ... 1st light emitting surface, 303 ... second Light emitting surface, 310 ... LED chip, 315-325 ... LED chip, 326 ... second LED driver, 327 ... connector, 328 ... bypass capacitor, 331-335 ... small chip resistor, 336-346 ... chip resistor, 348 ... power supply Terminal, 349 ... GND terminal, 352 ... Bypass capacitor, 353, 354 ... Driver backside compatible area, 355,361,371 ... LED backside compatible area, 381 ... Bypass capacitor, 381a ... First electrode, 381b ... Second electrode, 382a ... 1st pad, 382b ... 2nd pad, 383 ... 1st through hole, 384 ... 2nd through hole, 386a ... 1st wiring pattern, 386b ... 2nd wiring pattern, 386c ... 3rd wiring pattern, 386d ... 4th Wiring pattern, DR1 ... 1st direction, DR2 ... 2nd direction, LD, LDA ... long axis direction, SD, SDA ... Short axis direction.

Claims (10)

In a gaming machine provided with a predetermined board on which a first predetermined electronic component and a second predetermined electronic component smaller than the first predetermined electronic component are mounted.
The first predetermined electronic component is mounted on the first predetermined plate surface side, which is the plate surface on one side of the predetermined substrate.
The second predetermined electronic component is mounted on the second predetermined plate surface side opposite to the first predetermined plate surface of the predetermined substrate.
A gaming machine characterized in that the second predetermined electronic component is not mounted in a region on the second predetermined plate surface on the back side of a region on the first predetermined plate surface on which the first predetermined electronic component is mounted. .. The second predetermined electronic component is also mounted on the second predetermined plate surface in a region where the distance from the region on the back side of the region on the first predetermined plate surface on which the first predetermined electronic component is mounted is less than the predetermined distance. The gaming machine according to claim 1, wherein the gaming machine is not provided. A specific electronic component larger than the second predetermined electronic component is mounted on the second predetermined plate surface side of the predetermined substrate.
The specific electronic component is mounted in a region of the second predetermined plate surface where the distance from the region on the back side of the region on the first predetermined plate surface on which the first predetermined electronic component is mounted is less than a predetermined distance. 2. The gaming machine according to claim 2. A specific electronic component larger than the second predetermined electronic component is mounted on the second predetermined plate surface side of the predetermined substrate.
Claims 1 to 3 characterized in that the specific electronic component is mounted in a region on the second predetermined plate surface on the back side of a region on the first predetermined plate surface on which the first predetermined electronic component is mounted. The gaming machine according to any one of. The predetermined substrate is
A specific connection portion connected to the electrode of the first predetermined electronic component and
A predetermined connection portion connected to the electrode of the second predetermined electronic component and
A predetermined wiring pattern for electrically connecting the predetermined connection portion and the specific connection portion,
Equipped with
The predetermined wiring pattern is electrically connected to the predetermined connection portion on the second predetermined plate surface outside the region on the back side of the region on which the first predetermined electronic component is mounted on the first predetermined plate surface. ,
The second predetermined plate surface is characterized in that the second predetermined electronic component is not mounted in the region on the back side of the region on the first predetermined plate surface on which the first predetermined electronic component is mounted. The gaming machine according to any one of 1 to 4. The game according to any one of claims 1 to 5, wherein the second predetermined electronic component is not mounted in the predetermined outer edge region where the distance from the outer edge of the predetermined substrate is less than the predetermined distance. Machine. The gaming machine according to claim 6, wherein the first predetermined electronic component is mounted on the predetermined outer edge region. The predetermined substrate is provided with a substrate fixing portion for fixing the predetermined substrate.
The gaming machine according to any one of claims 1 to 7, wherein the second predetermined electronic component is not mounted in a region around the fixed portion where the distance from the substrate fixing portion is less than a specific distance. The gaming machine according to claim 8, wherein the first predetermined electronic component is mounted in a region around the fixed portion. On the first predetermined plate surface of the predetermined substrate, the second predetermined electronic component is not mounted in the predetermined outer edge region where the distance from the outer edge of the predetermined substrate is less than the predetermined distance.
The gaming machine according to claim 8 or 9, wherein the substrate fixing portion is provided in the predetermined outer edge region.

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