JP7392876B2 - 銀含有ペーストおよび接合体 - Google Patents

銀含有ペーストおよび接合体 Download PDF

Info

Publication number
JP7392876B2
JP7392876B2 JP2022565314A JP2022565314A JP7392876B2 JP 7392876 B2 JP7392876 B2 JP 7392876B2 JP 2022565314 A JP2022565314 A JP 2022565314A JP 2022565314 A JP2022565314 A JP 2022565314A JP 7392876 B2 JP7392876 B2 JP 7392876B2
Authority
JP
Japan
Prior art keywords
silver
particles
mass
resin
containing paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022565314A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022113923A5 (fr
JPWO2022113923A1 (fr
Inventor
直輝 渡部
真 高本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of JPWO2022113923A1 publication Critical patent/JPWO2022113923A1/ja
Publication of JPWO2022113923A5 publication Critical patent/JPWO2022113923A5/ja
Application granted granted Critical
Publication of JP7392876B2 publication Critical patent/JP7392876B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
JP2022565314A 2020-11-25 2021-11-22 銀含有ペーストおよび接合体 Active JP7392876B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020195062 2020-11-25
JP2020195062 2020-11-25
PCT/JP2021/042727 WO2022113923A1 (fr) 2020-11-25 2021-11-22 Pâte contenant de l'argent et corps assemblé

Publications (3)

Publication Number Publication Date
JPWO2022113923A1 JPWO2022113923A1 (fr) 2022-06-02
JPWO2022113923A5 JPWO2022113923A5 (fr) 2023-03-08
JP7392876B2 true JP7392876B2 (ja) 2023-12-06

Family

ID=81754614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022565314A Active JP7392876B2 (ja) 2020-11-25 2021-11-22 銀含有ペーストおよび接合体

Country Status (5)

Country Link
JP (1) JP7392876B2 (fr)
KR (1) KR20230108331A (fr)
CN (1) CN116547357A (fr)
TW (1) TW202227561A (fr)
WO (1) WO2022113923A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017073393A1 (fr) 2015-10-29 2017-05-04 三菱マテリアル株式会社 Composition de résine, corps lié et dispositif à semi-conducteurs
JP2017171844A (ja) 2016-03-25 2017-09-28 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法
WO2020189445A1 (fr) 2019-03-20 2020-09-24 住友ベークライト株式会社 Composition thermoconductrice et dispositif semi-conducteur

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000239616A (ja) 1999-02-24 2000-09-05 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP5567636B2 (ja) 2012-10-05 2014-08-06 京セラケミカル株式会社 半導体接着用熱硬化型樹脂組成物及び半導体装置
JP2014225350A (ja) 2013-05-15 2014-12-04 日立化成株式会社 銀ペースト組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017073393A1 (fr) 2015-10-29 2017-05-04 三菱マテリアル株式会社 Composition de résine, corps lié et dispositif à semi-conducteurs
JP2017171844A (ja) 2016-03-25 2017-09-28 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法
WO2020189445A1 (fr) 2019-03-20 2020-09-24 住友ベークライト株式会社 Composition thermoconductrice et dispositif semi-conducteur

Also Published As

Publication number Publication date
KR20230108331A (ko) 2023-07-18
TW202227561A (zh) 2022-07-16
CN116547357A (zh) 2023-08-04
WO2022113923A1 (fr) 2022-06-02
JPWO2022113923A1 (fr) 2022-06-02

Similar Documents

Publication Publication Date Title
JP2022069401A (ja) ペースト状組成物、高熱伝導性材料、および半導体装置
JP2012236873A (ja) 樹脂ペースト組成物及び半導体装置
JP2022018051A (ja) ペースト状樹脂組成物、高熱伝導性材料、および半導体装置
TWI828881B (zh) 導熱性組成物及半導體裝置
JP7264211B2 (ja) 熱伝導性組成物および半導体装置
JP7392876B2 (ja) 銀含有ペーストおよび接合体
JP2023022054A (ja) 導電性ペーストおよび半導体装置
JP7279802B2 (ja) 高熱伝導性材料用ペースト状樹脂組成物、高熱伝導性材料、および半導体装置
WO2023132051A1 (fr) Composition de résine de type pâte, matériau à conductivité thermique élevée et dispositif à semi-conducteur
WO2022202505A1 (fr) Composition de résine électriquement conductrice, matériau ayant une conductivité thermique élevée, et dispositif semi-conducteur
WO2023276690A1 (fr) Composition de résine conductrice, matériau ayant une conductivité thermique élevée et dispositif à semi-conducteur
JP7371792B2 (ja) 導電性ペーストおよび半導体装置
WO2024143135A1 (fr) Pâte conductrice, produit durci et dispositif à semi-conducteur
JP2023018445A (ja) 導電性ペースト、高熱伝導性材料および半導体装置
TW202328380A (zh) 糊狀樹脂組成物、高導熱性材料及半導體裝置
JP2023016331A (ja) 導電性ペーストおよび半導体装置
JP2022049009A (ja) ペースト状重合性組成物、高熱伝導性材料
JP2024011945A (ja) 導電性ペースト、硬化物および半導体装置
JP2024011926A (ja) 導電性ペースト、硬化物および半導体装置
JP2023007485A (ja) 導電性ペーストおよび半導体装置
TW202313897A (zh) 導電性糊、硬化物及半導體裝置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221227

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221227

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20221227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230411

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230607

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230809

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231024

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231106

R151 Written notification of patent or utility model registration

Ref document number: 7392876

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151