JP7390486B2 - 画像処理方法、形状検査方法、画像処理システム及び形状検査システム - Google Patents

画像処理方法、形状検査方法、画像処理システム及び形状検査システム Download PDF

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JP7390486B2
JP7390486B2 JP2022531135A JP2022531135A JP7390486B2 JP 7390486 B2 JP7390486 B2 JP 7390486B2 JP 2022531135 A JP2022531135 A JP 2022531135A JP 2022531135 A JP2022531135 A JP 2022531135A JP 7390486 B2 JP7390486 B2 JP 7390486B2
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image
data
photographed image
learning
statistics
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JPWO2021255819A5 (https=
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将記 大内
昌義 石川
康隆 豊田
博之 新藤
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Hitachi High Tech Corp
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G06V10/443—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/758—Involving statistics of pixels or of feature values, e.g. histogram matching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/761—Proximity, similarity or dissimilarity measures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
    • G06V10/772—Determining representative reference patterns, e.g. averaging or distorting patterns; Generating dictionaries
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/401—Imaging image processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/418—Imaging electron microscope
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/646—Specific applications or type of materials flaws, defects
    • G01N2223/6462—Specific applications or type of materials flaws, defects microdefects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G06V10/443—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
    • G06V10/449—Biologically inspired filters, e.g. difference of Gaussians [DoG] or Gabor filters
    • G06V10/451—Biologically inspired filters, e.g. difference of Gaussians [DoG] or Gabor filters with interaction between the filter responses, e.g. cortical complex cells
    • G06V10/454—Integrating the filters into a hierarchical structure, e.g. convolutional neural networks [CNN]

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Evolutionary Computation (AREA)
  • Computing Systems (AREA)
  • Medical Informatics (AREA)
  • Artificial Intelligence (AREA)
  • Databases & Information Systems (AREA)
  • Quality & Reliability (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Data Mining & Analysis (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2022531135A 2020-06-16 2020-06-16 画像処理方法、形状検査方法、画像処理システム及び形状検査システム Active JP7390486B2 (ja)

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WO2023127081A1 (ja) * 2021-12-28 2023-07-06 株式会社日立ハイテク 画像検査装置、画像処理方法
CN115242982B (zh) * 2022-07-28 2023-09-22 业成科技（成都）有限公司 镜头调焦方法及其系统
JP2024108492A (ja) * 2023-01-31 2024-08-13 東京エレクトロン株式会社 堆積判定方法及び基板処理装置
WO2024261931A1 (ja) 2023-06-21 2024-12-26 株式会社日立ハイテク 画像検査装置及び画像処理方法
WO2026047363A1 (en) * 2024-08-30 2026-03-05 Applied Materials Inc Self-operating substrate measurement

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US20170148226A1 (en) 2015-11-19 2017-05-25 Kla-Tencor Corporation Generating simulated images from design information
US20170191948A1 (en) 2016-01-04 2017-07-06 Kla-Tencor Corporation Optical Die to Database Inspection
JP2018028636A (ja) 2016-08-19 2018-02-22 株式会社ニューフレアテクノロジー マスク検査方法
US20180293721A1 (en) 2017-04-07 2018-10-11 Kla-Tencor Corporation Contour based defect detection

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JP2006302952A (ja) * 2005-04-15 2006-11-02 Toshiba Corp パターン計測システムおよび半導体装置の製造方法
US9185291B1 (en) * 2013-06-13 2015-11-10 Corephotonics Ltd. Dual aperture zoom digital camera
US9785752B1 (en) * 2014-02-25 2017-10-10 Flagship Biosciences, Inc. Method for stratifying and selecting candidates for receiving a specific therapeutic approach
CN104881868B (zh) * 2015-05-14 2017-07-07 中国科学院遥感与数字地球研究所 植物群落空间结构提取方法
US10163061B2 (en) * 2015-06-18 2018-12-25 International Business Machines Corporation Quality-directed adaptive analytic retraining
US10671881B2 (en) * 2017-04-11 2020-06-02 Microsoft Technology Licensing, Llc Image processing system with discriminative control
JP7144244B2 (ja) 2018-08-31 2022-09-29 株式会社日立ハイテク パターン検査システム

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Publication number Priority date Publication date Assignee Title
US20170148226A1 (en) 2015-11-19 2017-05-25 Kla-Tencor Corporation Generating simulated images from design information
US20170191948A1 (en) 2016-01-04 2017-07-06 Kla-Tencor Corporation Optical Die to Database Inspection
JP2018028636A (ja) 2016-08-19 2018-02-22 株式会社ニューフレアテクノロジー マスク検査方法
US20180293721A1 (en) 2017-04-07 2018-10-11 Kla-Tencor Corporation Contour based defect detection

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KR102780234B1 (ko) 2025-03-14
US20230222764A1 (en) 2023-07-13
WO2021255819A1 (ja) 2021-12-23
KR20230004819A (ko) 2023-01-06
CN115698690A (zh) 2023-02-03
TWI777612B (zh) 2022-09-11
TW202201347A (zh) 2022-01-01
JPWO2021255819A1 (https=) 2021-12-23

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