JPWO2021255819A1 - - Google Patents
Info
- Publication number
- JPWO2021255819A1 JPWO2021255819A1 JP2022531135A JP2022531135A JPWO2021255819A1 JP WO2021255819 A1 JPWO2021255819 A1 JP WO2021255819A1 JP 2022531135 A JP2022531135 A JP 2022531135A JP 2022531135 A JP2022531135 A JP 2022531135A JP WO2021255819 A1 JPWO2021255819 A1 JP WO2021255819A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
- G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
- G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
- G06V10/443—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
- G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
- G06V10/758—Involving statistics of pixels or of feature values, e.g. histogram matching
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
- G06V10/761—Proximity, similarity or dissimilarity measures
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
- G06V10/772—Determining representative reference patterns, e.g. averaging or distorting patterns; Generating dictionaries
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/401—Imaging image processing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/418—Imaging electron microscope
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
- G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/646—Specific applications or type of materials flaws, defects
- G01N2223/6462—Specific applications or type of materials flaws, defects microdefects
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10056—Microscopic image
- G06T2207/10061—Microscopic image from scanning electron microscope
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
- G06V10/443—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
- G06V10/449—Biologically inspired filters, e.g. difference of Gaussians [DoG] or Gabor filters
- G06V10/451—Biologically inspired filters, e.g. difference of Gaussians [DoG] or Gabor filters with interaction between the filter responses, e.g. cortical complex cells
- G06V10/454—Integrating the filters into a hierarchical structure, e.g. convolutional neural networks [CNN]
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Software Systems (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Multimedia (AREA)
- Evolutionary Computation (AREA)
- Computing Systems (AREA)
- Medical Informatics (AREA)
- Artificial Intelligence (AREA)
- Databases & Information Systems (AREA)
- Quality & Reliability (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Data Mining & Analysis (AREA)
- Image Analysis (AREA)
- Image Processing (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/023554 WO2021255819A1 (ja) | 2020-06-16 | 2020-06-16 | 画像処理方法、形状検査方法、画像処理システム及び形状検査システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021255819A1 true JPWO2021255819A1 (https=) | 2021-12-23 |
| JPWO2021255819A5 JPWO2021255819A5 (https=) | 2023-02-14 |
| JP7390486B2 JP7390486B2 (ja) | 2023-12-01 |
Family
ID=79268639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022531135A Active JP7390486B2 (ja) | 2020-06-16 | 2020-06-16 | 画像処理方法、形状検査方法、画像処理システム及び形状検査システム |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230222764A1 (https=) |
| JP (1) | JP7390486B2 (https=) |
| KR (1) | KR102780234B1 (https=) |
| TW (1) | TWI777612B (https=) |
| WO (1) | WO2021255819A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023127081A1 (ja) * | 2021-12-28 | 2023-07-06 | 株式会社日立ハイテク | 画像検査装置、画像処理方法 |
| CN115242982B (zh) * | 2022-07-28 | 2023-09-22 | 业成科技（成都）有限公司 | 镜头调焦方法及其系统 |
| JP2024108492A (ja) * | 2023-01-31 | 2024-08-13 | 東京エレクトロン株式会社 | 堆積判定方法及び基板処理装置 |
| WO2024261931A1 (ja) | 2023-06-21 | 2024-12-26 | 株式会社日立ハイテク | 画像検査装置及び画像処理方法 |
| WO2026047363A1 (en) * | 2024-08-30 | 2026-03-05 | Applied Materials Inc | Self-operating substrate measurement |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170148226A1 (en) * | 2015-11-19 | 2017-05-25 | Kla-Tencor Corporation | Generating simulated images from design information |
| US20170191948A1 (en) * | 2016-01-04 | 2017-07-06 | Kla-Tencor Corporation | Optical Die to Database Inspection |
| JP2018028636A (ja) * | 2016-08-19 | 2018-02-22 | 株式会社ニューフレアテクノロジー | マスク検査方法 |
| US20180293721A1 (en) * | 2017-04-07 | 2018-10-11 | Kla-Tencor Corporation | Contour based defect detection |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006302952A (ja) * | 2005-04-15 | 2006-11-02 | Toshiba Corp | パターン計測システムおよび半導体装置の製造方法 |
| US9185291B1 (en) * | 2013-06-13 | 2015-11-10 | Corephotonics Ltd. | Dual aperture zoom digital camera |
| US9785752B1 (en) * | 2014-02-25 | 2017-10-10 | Flagship Biosciences, Inc. | Method for stratifying and selecting candidates for receiving a specific therapeutic approach |
| CN104881868B (zh) * | 2015-05-14 | 2017-07-07 | 中国科学院遥感与数字地球研究所 | 植物群落空间结构提取方法 |
| US10163061B2 (en) * | 2015-06-18 | 2018-12-25 | International Business Machines Corporation | Quality-directed adaptive analytic retraining |
| US10671881B2 (en) * | 2017-04-11 | 2020-06-02 | Microsoft Technology Licensing, Llc | Image processing system with discriminative control |
| JP7144244B2 (ja) | 2018-08-31 | 2022-09-29 | 株式会社日立ハイテク | パターン検査システム |
-
2020
- 2020-06-16 US US18/009,890 patent/US20230222764A1/en active Pending
- 2020-06-16 WO PCT/JP2020/023554 patent/WO2021255819A1/ja not_active Ceased
- 2020-06-16 JP JP2022531135A patent/JP7390486B2/ja active Active
- 2020-06-16 KR KR1020227041722A patent/KR102780234B1/ko active Active
-
2021
- 2021-06-11 TW TW110121442A patent/TWI777612B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170148226A1 (en) * | 2015-11-19 | 2017-05-25 | Kla-Tencor Corporation | Generating simulated images from design information |
| US20170191948A1 (en) * | 2016-01-04 | 2017-07-06 | Kla-Tencor Corporation | Optical Die to Database Inspection |
| JP2018028636A (ja) * | 2016-08-19 | 2018-02-22 | 株式会社ニューフレアテクノロジー | マスク検査方法 |
| US20180293721A1 (en) * | 2017-04-07 | 2018-10-11 | Kla-Tencor Corporation | Contour based defect detection |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102780234B1 (ko) | 2025-03-14 |
| US20230222764A1 (en) | 2023-07-13 |
| JP7390486B2 (ja) | 2023-12-01 |
| WO2021255819A1 (ja) | 2021-12-23 |
| KR20230004819A (ko) | 2023-01-06 |
| CN115698690A (zh) | 2023-02-03 |
| TWI777612B (zh) | 2022-09-11 |
| TW202201347A (zh) | 2022-01-01 |
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