JPWO2021255819A1 - - Google Patents

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Publication number
JPWO2021255819A1
JPWO2021255819A1 JP2022531135A JP2022531135A JPWO2021255819A1 JP WO2021255819 A1 JPWO2021255819 A1 JP WO2021255819A1 JP 2022531135 A JP2022531135 A JP 2022531135A JP 2022531135 A JP2022531135 A JP 2022531135A JP WO2021255819 A1 JPWO2021255819 A1 JP WO2021255819A1
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JP
Japan
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JP2022531135A
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Japanese (ja)
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JP7390486B2 (ja
JPWO2021255819A5 (https=
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G06V10/443—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/758—Involving statistics of pixels or of feature values, e.g. histogram matching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/761—Proximity, similarity or dissimilarity measures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
    • G06V10/772—Determining representative reference patterns, e.g. averaging or distorting patterns; Generating dictionaries
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/401—Imaging image processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/418—Imaging electron microscope
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/646—Specific applications or type of materials flaws, defects
    • G01N2223/6462—Specific applications or type of materials flaws, defects microdefects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G06V10/443—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
    • G06V10/449—Biologically inspired filters, e.g. difference of Gaussians [DoG] or Gabor filters
    • G06V10/451—Biologically inspired filters, e.g. difference of Gaussians [DoG] or Gabor filters with interaction between the filter responses, e.g. cortical complex cells
    • G06V10/454—Integrating the filters into a hierarchical structure, e.g. convolutional neural networks [CNN]

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Multimedia (AREA)
  • Computing Systems (AREA)
  • Medical Informatics (AREA)
  • Databases & Information Systems (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Data Mining & Analysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2022531135A 2020-06-16 2020-06-16 画像処理方法、形状検査方法、画像処理システム及び形状検査システム Active JP7390486B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/023554 WO2021255819A1 (ja) 2020-06-16 2020-06-16 画像処理方法、形状検査方法、画像処理システム及び形状検査システム

Publications (3)

Publication Number Publication Date
JPWO2021255819A1 true JPWO2021255819A1 (https=) 2021-12-23
JPWO2021255819A5 JPWO2021255819A5 (https=) 2023-02-14
JP7390486B2 JP7390486B2 (ja) 2023-12-01

Family

ID=79268639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022531135A Active JP7390486B2 (ja) 2020-06-16 2020-06-16 画像処理方法、形状検査方法、画像処理システム及び形状検査システム

Country Status (6)

Country Link
US (1) US20230222764A1 (https=)
JP (1) JP7390486B2 (https=)
KR (1) KR102780234B1 (https=)
CN (1) CN115698690A (https=)
TW (1) TWI777612B (https=)
WO (1) WO2021255819A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023127081A1 (ja) * 2021-12-28 2023-07-06 株式会社日立ハイテク 画像検査装置、画像処理方法
CN115242982B (zh) * 2022-07-28 2023-09-22 业成科技（成都）有限公司 镜头调焦方法及其系统
JP2024108492A (ja) * 2023-01-31 2024-08-13 東京エレクトロン株式会社 堆積判定方法及び基板処理装置
KR20250143803A (ko) 2023-06-21 2025-10-02 주식회사 히타치하이테크 화상 검사 장치 및 화상 처리 방법
WO2026047363A1 (en) * 2024-08-30 2026-03-05 Applied Materials Inc Self-operating substrate measurement

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US20170148226A1 (en) * 2015-11-19 2017-05-25 Kla-Tencor Corporation Generating simulated images from design information
US20170191948A1 (en) * 2016-01-04 2017-07-06 Kla-Tencor Corporation Optical Die to Database Inspection
JP2018028636A (ja) * 2016-08-19 2018-02-22 株式会社ニューフレアテクノロジー マスク検査方法
US20180293721A1 (en) * 2017-04-07 2018-10-11 Kla-Tencor Corporation Contour based defect detection

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JP2006302952A (ja) * 2005-04-15 2006-11-02 Toshiba Corp パターン計測システムおよび半導体装置の製造方法
JP5239686B2 (ja) * 2008-09-25 2013-07-17 横河電機株式会社 プロセス推定システムおよびプロセス推定方法
JP5439106B2 (ja) * 2009-09-30 2014-03-12 株式会社日立ハイテクノロジーズ 走査荷電粒子顕微鏡を用いたパターン形状評価装置およびその方法
JP5874398B2 (ja) * 2012-01-05 2016-03-02 オムロン株式会社 画像検査装置の検査領域設定方法
JP6004956B2 (ja) * 2013-01-29 2016-10-12 株式会社日立ハイテクノロジーズ パターン評価装置、及び、パターン評価装置を備えた外観検査装置
CN105308947B (zh) * 2013-06-13 2018-10-02 核心光电有限公司 双孔径变焦数字摄影机
JP6207893B2 (ja) * 2013-06-25 2017-10-04 株式会社日立ハイテクノロジーズ 試料観察装置用のテンプレート作成装置
US9785752B1 (en) * 2014-02-25 2017-10-10 Flagship Biosciences, Inc. Method for stratifying and selecting candidates for receiving a specific therapeutic approach
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JP6912890B2 (ja) * 2017-01-13 2021-08-04 キヤノン株式会社 情報処理装置、情報処理方法、システム
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Publication number Priority date Publication date Assignee Title
US20170148226A1 (en) * 2015-11-19 2017-05-25 Kla-Tencor Corporation Generating simulated images from design information
US20170191948A1 (en) * 2016-01-04 2017-07-06 Kla-Tencor Corporation Optical Die to Database Inspection
JP2018028636A (ja) * 2016-08-19 2018-02-22 株式会社ニューフレアテクノロジー マスク検査方法
US20180293721A1 (en) * 2017-04-07 2018-10-11 Kla-Tencor Corporation Contour based defect detection

Also Published As

Publication number Publication date
JP7390486B2 (ja) 2023-12-01
KR20230004819A (ko) 2023-01-06
WO2021255819A1 (ja) 2021-12-23
CN115698690A (zh) 2023-02-03
TWI777612B (zh) 2022-09-11
KR102780234B1 (ko) 2025-03-14
US20230222764A1 (en) 2023-07-13
TW202201347A (zh) 2022-01-01

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